Mounting apparatus, mounting method, and method for manufacturing semiconductor device

Abstract

The invention provides a mounting apparatus, a mounting method, and a method of manufacturing a semiconductor device, which can shorten the time of precision adjustment of a mounting position before production start. The mounting device includes: a head table having a plurality of heads; a drive unit that moves the head table; a stage that holds the substrate to which the workpiece is supplied by the head; and a control device that controls the drive unit using the correction table. The control device is configured such that the position of the workpiece to be supplied on the substrate is uniquely associated with the relationship between the plurality of heads, and the position of the workpiece to be supplied on the substrate is corrected on the basis of a correction table for a first substrate used in previous production, a layout of the first substrate, and a layout of a second substrate used this time. A correction table for the second substrate used in this production is calculated.

Description

Technical Field

[0001] The present disclosure relates to a mounting device, for example, which can be applied to a flip chip mounter. Background Art

[0002] An apparatus for mounting an electronic component such as a semiconductor chip generally mounts the electronic component on a substrate using a suction nozzle such as a collet provided on a mounting head (for example, Japanese Unexamined Patent Application Publication No. 2022-46979).

[0003] Prior Art Documents

[0004] Patent Documents

[0005] Patent Document 1: Japanese Unexamined Patent Application Publication No. 2022-46979 Summary of the Invention

[0006] An object of the present disclosure is to provide a technique capable of shortening the time for adjusting the accuracy of the mounting position before the start of production. Other objects and novel aspects will be apparent from the description of this specification and the drawings.

[0007] A summary of the representative contents in the present disclosure is briefly described below.

[0008] That is, the mounting device includes: a head table having a plurality of heads; a driving unit that moves the head table; a platform that holds a substrate to which a workpiece is supplied by the heads; and a control device that controls the driving unit using a correction table. The control device is configured such that the relationship between the position of the workpiece supplied on the substrate and the plurality of heads is uniquely associated, and calculates a correction table for the second substrate used in the current production based on the correction table for the first substrate used in the previous production, the layout of the first substrate, and the layout of the second substrate used in the current production.

[0009] Advantages of the Invention

[0010] According to the present disclosure, it is possible to shorten the time for adjusting the accuracy of the mounting position before the start of production. Brief Description of the Drawings

[0011] Figure 1 is a schematic plan view showing a flip chip mounter in an embodiment.

[0012] Figure 2 is for explaining Figure 1 the operations of the pick-up flip head and the transfer head when viewed from the direction of arrow A in

[0013] Figure 3 is for explaining Figure 1 the operation of the mounting head when viewed from the direction of arrow B in

[0014] Figure 4 is a block diagram showing a schematic configuration of a control system of the flip chip mounter shown Figure 1 in the figure.

[0015] Figure 5 is a flowchart showing a manufacturing method of manufacturing a semiconductor device using Figure 1 the flip chip mounter shown in the figure.

[0016] Figure 6 is a flowchart for explaining accuracy adjustment of a mounting position at the time of starting up the apparatus in the embodiment.

[0017] Figure 7 is a top view showing an example of a jig plate.

[0018] Figure 8 is an identification image diagram for identifying a jig plate using a mounting camera.

[0019] Figure 9 is a diagram showing an example of a head offset amount.

[0020] Figure 10 is a diagram showing an example of a mounting offset amount.

[0021] Figure 11 is a diagram showing an example of a mounting layout of a substrate.

[0022] Figure 12 is a diagram showing an example of a precision measurement result.

[0023] Figure 13 is a diagram showing in tabular form Figure 12 the example of the precision measurement result shown in the figure.

[0024] Figure 14 is a diagram showing an example of a head offset amount of each mounting head.

[0025] Figure 15 is a diagram showing an example of a mounting offset amount of each mounting point.

[0026] Figure 16 is a diagram showing Figure 6 an example of a precision adjustment process of the method shown in the figure.

[0027] Figure 17 is a flowchart for explaining accuracy adjustment of a mounting position at the time of product type change in the embodiment.

[0028] Figure 18 is a diagram showing an outline of a method for calculating a mounting offset amount of a new process based on an adjusted process.

[0029] Figure 19It is a diagram showing a calculation example for calculating the mounting offset of Product B based on the mounting coordinates of Product A, the mounting offset of Product A, and the mounting coordinates of Product B.

[0030] Figure 20 It is a substrate layout diagram for explaining single-line mounting.

[0031] Figure 21 It is a diagram showing an example of the misalignment amount of each head and the head as a whole.

[0032] Figure 22 It is a diagram showing a change example of the head offset.

[0033] Figure 23 It is a diagram showing Figure 17 an example of the accuracy adjustment process of the method shown.

[0034] Among them, the reference numerals are explained as follows:

[0035] 45a Mounting head table (head table)

[0036] 43a Y beam (drive unit)

[0037] L1 - L4 Heads

[0038] 46 Mounting stage

[0039] 80 Control unit (control device) Detailed implementation mode

[0040] Hereinafter, the implementation mode will be described with reference to the drawings. However, in the following description, the same reference numerals may be given to the same components, and repeated explanations may be omitted. It should be noted that, for the sake of clarity, the width, thickness, shape, etc. of each part of the drawings may be schematically shown, but this is only an example and does not limit the interpretation of the present invention.

[0041] Using Figures 1 to 3 to explain a flip chip mounter as a form of the mounting device. Figure 1 It is a schematic top view showing the flip chip mounter in the implementation mode. Figure 2 It is for explaining Figure 1 the operations of the pick - up and flip head and the transfer head when viewed from the direction of arrow A in Figure 3 It is for explaining Figure 1 the operation of the mounting head when viewed from the direction of arrow B in

[0042] The flip chip mounter 1 generally includes a wafer supply unit 10, pick-up units 20a, 20b, transfer table units 30a, 30b, mounting units 40a, 40b, a transfer unit 50, a substrate supply unit 60, a substrate discharge unit 70, and a control unit 80. The Y2-Y1 direction (Y direction) is the front-rear direction of the flip chip mounter 1, the X2-X1 direction (X direction) is the left-right direction, and the Z1-Z2 direction (Z direction) is the up-down direction. The wafer supply unit 10 is arranged on the front side of the flip chip mounter 1, and the mounting units 40a, 40b are arranged on the rear side.

[0043] It should be noted that the pick-up unit 20b, the transfer table unit 30b, and the mounting unit 40b are respectively arranged symmetrically with respect to the line passing through the bare chip D to be picked up and extending in the Y direction and mirror-symmetrical to the pick-up unit 20a, the transfer table unit 30a, and the mounting unit 40a, and are similarly configured and operate similarly. The "b" in the reference numerals of the respective components of the pick-up unit 20b, the transfer table unit 30b, and the mounting unit 40b corresponds to the "a" in the reference numerals of the respective components of the pick-up unit 20a, the transfer table unit 30a, and the mounting unit 40a.

[0044] When it is not necessary to distinguish between the pick-up units 20a, 20b, it is referred to as the pick-up unit 20. When it is not necessary to distinguish between the transfer table units 30a, 30b, it is referred to as the transfer table unit 30. When it is not necessary to distinguish between the mounting units 40a, 40b, it is referred to as the mounting unit 40.

[0045] The wafer supply unit 10 includes a wafer cassette elevator 11, a wafer holding table 12, and a peeling unit 13.

[0046] A wafer cassette containing the wafer ring WR is input from the outside of the flip chip mounter 1 into the wafer cassette elevator 11. The wafer ring WR is taken out from the wafer cassette elevator 11 and supplied to the wafer holding table 12, or taken out from the wafer holding table 12 and discharged to the wafer cassette elevator 11. Here, the wafer ring WR is a jig for fixing the dicing tape DT with the wafer W pasted thereon and can be mounted on the wafer holding table 12. The wafer W is divided into a plurality of bare chips D. The wafer W is, for example, a semiconductor wafer, a glass wafer, and the bare chip D as a workpiece is a semiconductor chip, a glass chip, or a MEMS (Micro Electro Mechanical Systems).

[0047] The wafer holding table 12 moves in the X direction and the Y direction through an XY stage and a driving unit (not shown), and moves the bare chip D to be picked up to the position of the peeling unit 13. The wafer holding table 12 rotates the wafer ring WR in the XY plane through a driving unit (not shown). The peeling unit 13 moves in the Z1-Z2 direction through a driving unit (not shown). The peeling unit 13 peels the bare chip D from the dicing tape DT.

[0048] The pick-up unit 20a is located on the substrate supply unit 60 side (X2 direction side) with respect to the bare chip D to be picked up. The pick-up unit 20a includes a pick-up flip head (PFH) 21a, a drive unit 23a, a transfer head (TRH) 25a, and a drive unit 27a. The pick-up flip head 21a has a collet 22a that adsorbs and holds the bare chip D at the front end. The drive unit 23a moves the flip head 21a up and down, rotates it, flips it, and moves it in the X direction. The transfer head 25a has a collet 26a that adsorbs and holds the bare chip D at the front end. The drive unit 27a moves the transfer head 25a up and down and in the X direction. A wafer identification camera 24 is provided directly above the picked-up bare chip D, and this wafer identification camera 24 is shared by the pick-up unit 20a and the pick-up unit 20b.

[0049] With such a configuration, as Figure 2 shown, the pick-up flip head 21a picks up the bare chip D based on the imaging data of the wafer identification camera 24, rotates the pick-up flip head 21a by 180 degrees, then flips the bare chip D so that its bottom surface faces downward, and positions the bare chip D in a posture to be handed over to the transfer head 25a. The transfer head 25a receives the flipped bare chip D from the pick-up flip head 21a and places it on the transfer table unit 30a.

[0050] The transfer table unit 30a includes transfer tables (TRS) 31a1, 31a2 for temporarily placing the bare chip D, an elevation camera 34a, and an elevation correction mark 35a. The transfer tables 31a1, 31a2 can be moved in the Y direction by a drive unit (not shown).

[0051] The mounting unit 40a is located on the substrate supply unit 60 side with respect to the bare chip D to be picked up. The mounting unit 40a includes a mounting head (BDH) 41a, a Y beam 43a of the gantry workbench, a mounting camera 44a, and a mounting head workbench 45a.

[0052] The mounting head 41a includes heads L1, L2, L3, L4 that respectively have collets 42a (C1, C2, C3, C4) for adsorbing and holding four bare chips D at the front end. The heads L1, L2, L3, L4 can be moved respectively in the X direction, the Y direction, and the rotational direction in the XY plane.

[0053] The Y beam 43a extends in the Y direction so as to straddle the mounting table 46, and its two ends are respectively movably supported in the X direction by a pair of X beams (not shown) of the gantry workbench. The Y beam 43a moves the mounting head workbench 45a in the Y direction. The pair of X beams move the Y beam 43a in the X direction. The mounting head workbench 45a moves the mounting head 41a in the Z direction.

[0054] The mounting camera 44a is provided on the mounting head workbench 45a. The mounting camera 44a captures the position recognition mark (not shown) of the substrate S to identify the mounting position. The substrate S is, for example, a wiring substrate, a panel, or the like.

[0055] With such a configuration, the mounting head 41a picks up the bare chip D from the transfer tables 31a1 and 31a2, and the elevation camera 34a and the mounting camera 44a capture the position where the bare chip D is held by the mounting head 41a. Based on the captured data, the mounting positioning correction position is calculated, and the mounting head 41a is moved to mount the bare chip D on the substrate S. When the bare chip D is mounted on the substrate S, the substrate S is adsorbed and fixed to the substrate S.

[0056] The transfer unit 50 includes transfer rails 51 and 52 for moving the substrate S in the X direction. The transfer rails 51 and 52 are arranged in parallel. With such a configuration, the substrate S is carried out from the substrate supply unit 60 and moved along the transfer rails 51 and 52 to the mounting stage 46 (mounting position), then moved to the post-mounting substrate carry-out unit 70, and the substrate S is transferred to the substrate carry-out unit 70. During the process of mounting the bare chip D on the substrate S, the substrate supply unit 60 carries out a new substrate S and stands by on the transfer rails 51 and 52. The substrate S is carried into the substrate supply unit 60 from the outside of the flip chip mounter 1, and the substrate S carrying the bare chip D is carried out from the substrate carry-out unit 70 to the outside of the flip chip mounter 1.

[0057] Next, the control unit 80 will be used Figure 4 for explanation. Figure 4 It shows Figure 1 a block diagram showing the schematic configuration of the control system of the flip chip mounter shown.

[0058] The control system 8 includes a control unit (control device) 80, a drive unit 86, a signal unit 87, an optical system 88, etc. The control unit 80 mainly has a control / operation device 81 composed of a CPU (Central Processing Unit), a storage device 82, an input / output device 83, a bus 84, and a power supply unit 85. The storage device 82 has a main storage device 82a and an auxiliary storage device 82b. The main storage device 82a is composed of a RAM (Random Access Memory) storing processing programs and the like. The auxiliary storage device 82b is composed of an HDD (Hard Disk Drive), an SSD (Solid State Drive), etc. storing control data, image data, etc. required for control.

[0059] The input / output device 83 includes a monitor 83a for displaying device status and information, a touch panel 83b for inputting the operator's instructions, a mouse 83c for operating the monitor 83a, and an image acquisition device 83d for acquiring image data from the optical system 88. The input / output device 83 also includes a motor control device 83e and an I / O signal control device 83f. The motor control device 83e controls the drive unit 86. The drive unit 86 includes drive units 23a, 23b, 27a, 27b for the pickup units 20a, 20b, and drive units for the Y beams 43a, 43b and the mounting head worktables 45a, 45b. The I / O signal control device 83f obtains signals from the signal unit 87 or controls the signal unit 87. The signal unit 87 includes switches, knobs, etc. for controlling the brightness of various sensors, lighting devices, etc. The optical system 88 includes a wafer identification camera 24, elevation identification cameras 34a, 34b, and mounting cameras 44a, 44b. The control / arithmetic device 81 obtains required data via the bus 84, performs arithmetic operations, controls the mounting heads 41a, 41b, etc., and sends information to the monitor 83a, etc.

[0060] Use Figure 5 Describe a part of the manufacturing process of semiconductor devices (manufacturing method and mounting method of semiconductor devices) using the flip chip mounter 1. Figure 5 It is a flowchart showing the manufacturing method of semiconductor devices Figure 1 using the flip chip mounter shown below. In the following description, the operations of each part constituting the flip chip mounter 1 are controlled by the control unit 80.

[0061] The description will be made around the pickup unit 20a, the transfer table unit 30a, and the mounting unit 40a side, but the pickup unit 20b, the transfer table unit 30b, and the mounting unit 40b side are the same. It should be noted that the pickup unit 20b, the transfer table unit 30b, and the mounting unit 40b operate in parallel within a range where they do not interfere with the pickup unit 20a, the transfer table unit 30a, and the mounting unit 40a.

[0062] [Process S1: Wafer loading process]

[0063] A wafer cassette (not shown) containing a wafer ring WR is loaded into the wafer cassette elevator 11. A dicing tape DT is mounted on the wafer ring WR, and a bare chip D divided from the wafer W is pasted on the dicing tape DT. The wafer supply unit 10 takes out the wafer ring WR from the wafer cassette filled with the wafer ring WR and loads it into the wafer holding table 12. The wafer W is, for example, a semiconductor wafer, and the bare chip D as the workpiece is a semiconductor chip.

[0064] [Process S2: Substrate loading process]

[0065] The transfer jig holding the substrate S is inserted into the substrate supply unit 60. The substrate supply unit 60 takes out the substrate S from the transfer jig. The taken-out substrate S is carried into the mounting unit 40 via the transfer unit 50.

[0066] [Process S3: Pick-up process]

[0067] After process S1, the wafer holding stage 12 moves so as to be able to pick up a desired bare chip D from the dicing tape DT. The wafer identification camera 24 takes a picture of the bare chip D. Based on the image data obtained by the photographing, the positioning and surface inspection of the bare chip D are performed. By performing image processing on the image data, the deviation amounts (in the X, Y, and θ directions) of the bare chip D on the wafer holding stage 12 with respect to the bare chip position reference point of the flip chip mounter are calculated and positioning is performed. It should be noted that the bare chip position reference point holds a specified position of the wafer holding stage 12 in advance as the initial setting of the device. The surface inspection of the bare chip D is performed by performing image processing on the image data.

[0068] The peeling unit 13 moves upward so that the upper surface of the peeling unit 13 comes into contact with the back surface of the dicing tape DT. Then, the peeling unit 13 adsorbs the dicing tape DT. The pick-up and flip head 21a descends while evacuating the collet 22a and lands on the bare chip D to be peeled, and adsorbs the bare chip D. The pick-up and flip head 21a ascends and peels the bare chip D from the dicing tape DT. Thus, the bare chip D is picked up by the pick-up and flip head 21a.

[0069] The pick-up and flip head 21a moves upward and in the direction of the transfer head 25a. The pick-up and flip head 21a rotates 180 degrees so that the surface of the bare chip D faces downward, in other words, the back surface of the bare chip D faces upward, and the bare chip D is set in the posture for handing over to the transfer head 25a. The collet 26a of the transfer head 25a picks up the bare chip D from the collet 22a of the pick-up and flip head 21a. Thus, the handover of the bare chip D is performed. The pick-up and flip head 21a flips so that the adsorption surface of the collet 22a faces downward.

[0070] The transfer head 25a moves to the transfer stage 31a1. The transfer head 25a places the bare chip D held by the collet 26a on the transfer stage 31a1. At this time, the surface of the bare chip D faces downward. The transfer head 25a moves to the handover position of the bare chip D. The transfer stage 31a1 moves to the handover position of the mounting head 41a.

[0071] [Process S4: Mounting process]

[0072] The transfer unit 50 conveys the substrate S to the mounting stage 46.

[0073] The mounting camera 44a photographs the bare chip D held on the transfer table 31a1, and the collet 42a of the mounting head 41a picks up a plurality (four in the embodiment) of bare chips D from the transfer table 31a1. Thus, the handover of the bare chip D is performed.

[0074] The mounting head 41a moves from the transfer table 31a1 to the substrate S. At this time, the mounting camera 44a photographs the elevation correction mark 35a while moving, and the elevation camera 34a photographs the four moving bare chips D. The Y beam 43a moves in the X direction and the mounting head 41a moves in the Y direction. Based on the image data obtained by photographing, the positioning and surface inspection of the bare chip D are performed. By performing image processing on the image data, the deviation amounts (in the X, Y, and θ directions) of the bare chip D on the transfer table 31a1 with respect to the bare chip position reference point of the flip chip mounter are calculated, and positioning is performed. It should be noted that the bare chip position reference point previously holds a specified position of the transfer table 31a1 as the initial setting of the device. By performing image processing on the image data, the surface inspection of the bare chip D is performed.

[0075] The mounting camera 44a photographs the substrate S placed on the mounting table 46. Based on the image data obtained by photographing, the positioning and surface inspection of the substrate S are performed. By performing image processing on the image data, the deviation amounts (in the X, Y, and θ directions) of the substrate S with respect to the substrate position reference point of the flip chip mounter 1 are calculated. It should be noted that the substrate position reference point previously holds a specified position of the mounting section 40 as the initial setting of the device. By performing image processing on the image data, the surface inspection of the substrate S is performed.

[0076] Based on the data of the elevation correction mark 35a photographed by the mounting camera 44a, the image data of the bare chip D photographed by the elevation camera 34a, and the image data of the substrate S photographed by the mounting camera 44a, the mounting head 41a sequentially places the four bare chips D held by the collets C1, C2, C3, and C4 on the substrate S. At this time, the surface of the bare chip D faces downward.

[0077] The mounting camera 44a photographs the bare chip D mounted on the substrate S. Based on the image data obtained by photographing, inspections such as whether the bare chip D is mounted at the desired position (relative position inspection of the bare chip D and the substrate S) are performed. In addition, surface inspection is performed based on the image data obtained by photographing.

[0078] The mounting head 41a moves to the handover position for handover with the transfer table 31a2. The transfer table 31a1 moves to the handover position for handover with the transfer head 25a.

[0079] It should be noted that the above description is an example using the transfer table 31a1, and the same applies when using the transfer table 31a2.

[0080] [Process S5: Substrate unloading process]

[0081] The substrate S with the bare chip D mounted (installed) is conveyed to the substrate unloading unit 70. The substrate unloading unit 70 stores the substrate S in the conveying jig. The conveying jig storing the substrate S is unloaded from the chip mounter 1.

[0082] Taking the mounting section 40a as an example, the accuracy adjustment of the mounting position before production start is described. The accuracy adjustment of the mounting position before production start is performed at the time of device startup and at the time of product type change.

[0083] First, use Figure 6 to describe the accuracy adjustment of the mounting position at the time of startup of the flip chip mounter 1. Figure 6 It is a flowchart showing the accuracy adjustment of the mounting position at the time of device startup in the embodiment.

[0084] [Step S21: Correction of mechanical coordinate system error]

[0085] Measure the error from the mechanical coordinate system using the jig plate with grid marks and create a correction table. Use Figure 7 and Figure 8 to describe the error from the mechanical coordinate system. Figure 7 It is a top view showing an example of the jig plate. Figure 8 It is an identification image diagram of the jig plate based on the mounting camera.

[0086] In the flip chip mounter 1, the mounting head 41a after picking up the bare chip D from the transfer table 31a1 is moved to the substrate S to be mounted and mounted (installed, attached). The flip chip mounter 1 is equipped with a mounting camera 44a. By using this mounting camera 44a to photograph the substrate S, the position of the substrate S is detected, and alignment (positioning) at the time of mounting the bare chip D is performed based on the position detection result. That is, the alignment at the time of mounting is performed based on the optical coordinate system of the mounting camera 44a.

[0087] However, the position of the optical system coordinates of the mounting camera 44a is not limited to the position shown in the control data, and there is a displacement due to various factors. And this displacement is caused by the mechanism error (error from the mechanical coordinate system) of the above-mentioned gantry worktable that moves the mounting camera 44a. This mechanism error is not necessarily the same, and an inherent displacement amount is shown at each position in the mounting area (mounting table 46) where the substrate S is positioned. Therefore, at the time of startup of the flip chip mounter 1, it is necessary to measure the above-mentioned displacement amount for each position in the mounting area and create a correction table.

[0088] Therefore, the creation of a correction table for correcting these misalignments is performed by detecting the amount of misalignment between the optical coordinate system of the mounting camera 44a on the control data and the actual optical coordinate system of the mounting camera 44a. When creating this correction table, the measurement jig plate P is used. The jig plate P is created with shape dimensions according to a reference value to avoid positioning errors, such as Figure 7 as shown, the reference marks M are arranged in a grid pattern on the surface at a specified position / specified accuracy.

[0089] First, in the flip chip mounter 1, in the same manner as when mounting the bare chip D on the substrate S, the jig plate P is positioned and set relative to the mounting table 46.

[0090] Next, by identifying the reference marks etc. located at the corners (corners) of the jig plate P, the amount of mounting deviation of the jig plate P itself in the mounting table 46 is calculated, and the positions of the respective reference marks M are specified using the XY coordinates on the device.

[0091] Next, the gantry table is driven to move the mounting camera 44a to the jig plate P positioned at a specified position, and the reference marks M are sequentially photographed to identify the positions of the reference marks M. At this time, the movement of the mounting camera 44a is controlled so that the origin of the optical coordinate system on the control data coincides with the center of the reference mark M. However, in the position recognition result based on the mounting camera 44a, due to the mechanical error of the gantry table, the origin 0 does not necessarily coincide with the center of the reference mark M. Figure 8 The figure shows an image of the case where position recognition is performed on the reference mark Mn of the jig plate P. Among them, regarding the reference mark Mn (the center coordinates (Xn, Yn) in the mechanical coordinate system), the misalignments Δxn and Δyn with respect to the origin 0 of the optical coordinate system are detected by position recognition.

[0092] That is, when mounting the bare chip D near the coordinates (Xn, Yn) in the mechanical coordinate system, corrections of Δxn and Δyn must be further applied to the position of the substrate S recognized by the mounting camera 44a. Therefore, at the start-up after the completion of the assembly of the flip chip mounter 1, by previously obtaining the misalignment amounts (Δxn, Δyn) for all the reference marks M, position correction amount data for correcting the misalignment inherent in the X-Y coordinate system of the gantry table can be obtained.

[0093] Next, use Figure 9 and Figure 10 to explain the misalignment caused by reasons other than the mechanism error. Figure 9 The figure shows an example of the head offset amount. Figure 10 The figure shows an example of the mounting offset amount.

[0094] A method of using the jig plate P is used to detect the misalignment amount of the mounting camera 44a in the mounting stage 46. In addition to this misalignment, there is a misalignment of the mounting head 41a (a deviation in the positional relationship between the mounting head 41a and the mounting camera 44a). In this specification, this misalignment is referred to as head misalignment, and the correction value obtained by reversing the sign of the head misalignment amount is referred to as the head offset (HeadOffset: HO). For example, Figure 9 An example is shown in which the head L1 is displaced by Δx in the X1 direction and by Δy in the Y1 direction. It should be noted that there is also a rotational deviation of the mounting head 41a in the XY plane.

[0095] Moreover, there is a misalignment in the mounting position of the bare chip D by the collet 42a (a deviation in the positional relationship between the collet 42a and the mounting head 41a). In this specification, this misalignment is referred to as mounting misalignment, and the correction value obtained by reversing the sign of the mounting misalignment amount is referred to as the bond offset (BondOffset: BO). For example, Figure 10 An example is shown in which the collet C1 of the head L1 is displaced in the Y2 direction.

[0096] As Figure 10 shown, a plurality of heads L1 to L4 having collets C1 to C4 mounted at the front ends of the shafts are mounted independently and vertically movably on the mounting head 41a. For example, the axial centers of the shafts of these heads L1 to L4 may be eccentric with respect to the optical axis of the mounting camera 44a. Therefore, the greater the difference in height between the mounting camera 44a (mounting head) and the upper surface height of the substrate S, the different are the coordinates (without eccentricity) after moving to the target position based on the mounting camera 44a and the coordinates of the front end positions of the collets C1 to C4 when the heads L1 to L4 are lowered after moving to the same position based on the heads L1 to L4 (with eccentricity).

[0097] As a result, if only the correction based on the result of recognizing the fiducial mark M only by the above-mentioned mounting camera 44a is performed, accurate misalignment correction may not be possible when mounting the bare chip D.

[0098] Next, use Figures 11 to 15 to explain the creation of the correction table. Figure 11 is a diagram showing an example of the mounting layout of the substrate.

[0099] [Step S22: Precision measurement based on full-point mounting]

[0100] (Step S22a: Associating the mounting positions on the substrate with the heads)

[0101] The mounted points are uniquely associated with the heads L1 to L4 used respectively in the mounting. In other words, the mounted points operate in such a way that they are mounted only using a specific head. Thereby, the positioning position and repeatability of the mechanical accuracy are improved.

[0102] For example, as Figure 11 shown, the substrate S has four mounting areas BA1 to BA4. The mounting area BA1 is X = 1 to 62 and Y = 1 to 51. The mounting area BA2 is X = 1 to 62 and Y = 52 to 102. The mounting area BA3 is X = 63 to 124 and Y = 1 to 51. The mounting area BA4 is X = 63 to 124 and Y = 52 to 102.

[0103] The mounting points of the two mounting areas BA1 and BA2 on the X1 side are mounted by the heads R1 to R4 of the mounting head 41b. The mounting points of the two mounting areas BA3 and BA4 on the X2 side are mounted by the heads L1 to L4. Each mounting area BA1 to BA4 is divided into eight areas in the Y direction, and the heads L1 to L4 for mounting are assigned to each area.

[0104] For example, the eight divided areas of the mounting area BA3 are sequentially assigned to the area mounted by the head L1, the area mounted by the head L2, the area mounted by the head L3, the area mounted by the head L4, the area mounted by the head L1, the area mounted by the head L2, the area mounted by the head L3, and the area mounted by the head L4 from the Y1 side. The mounting area BA3 is assigned the areas mounted by the heads L1 to L4 in the same way as the mounting area BA4. The mounting areas BA1 and BA2 are assigned the areas mounted by the heads R1 to R4 in the same way as the mounting areas BA3 and BA4.

[0105] (Step S22b: Positioning of the production substrate)

[0106] The production substrate S is carried into the chip mounter 1, and the position and size of the carried-in substrate S are measured and corrected by the mounting camera 44a.

[0107] First, the carried-in substrate S is positioned and set on the mounting table 46.

[0108] Next, by recognizing the reference marks MS etc. located at the corners (corners) of the substrate S, the mounting deviation amount of the substrate S itself in the mounting table 46 is calculated, and the position of the substrate S is specified using the XY coordinates on the device. In addition, by recognizing the positions of the edges etc. of the substrate S, the size of the substrate S is measured. In Figure 11 this case, five reference marks MS are provided in each of the four mounting areas (at the four corners and the center).

[0109] (Step S22c: Full-point mounting)

[0110] The head offset amount and the mounting offset amount are set to "0", and the bare chips D are mounted at each mounting point on the substrate S.

[0111] (Step S22d: Measuring the mounting position accuracy)

[0112] The substrate S and the mounted bare chip D are photographed by the mounting camera 44a. Based on the image data obtained by the photographing, the mounting position accuracy is measured using a reference on the substrate S (for example, the reference mark MS), the error (misalignment amount) is investigated, and stored in the storage device.

[0113] Use Figure 12 And Figure 13 To illustrate an example of the error obtained by measuring the mounting position accuracy. Figure 12 Is a diagram showing an example of the accuracy measurement result, and is a diagram obtained by plotting all the errors at each mounting point. Figure 12 The center of the cross in Figure 13 Shows the average of the misalignment amounts at all the mounting points. Figure 12 Is a diagram showing the example of the accuracy measurement result shown

[0114] In Figure 13 "Total" is the error of all the mounting points mounted by the mounting heads 41a and 41b. "L" is the error of all the mounting points mounted by the mounting head 41a (for example, Figure 11 Half of the mounting points on the X2 side shown Figure 11 ), and includes the heads L1 to L4. "R" is the error of all the mounting points mounted by the mounting head 41b (for example,

[0115] Half of the mounting points on the X1 side shown Figure 12 ), and includes the heads R1 to R4. "Xdiff" is the misalignment amount in the X direction, "Ydiff" is the misalignment amount in the Y direction, and "Tdiff" is the misalignment amount in the rotation direction. "average" is the average value, "max" is the maximum value, and "min" is the minimum value. "R" is "max" - "min". "USL" is the upper limit value of the allowable range, and "LSL" is the lower limit value of the allowable range. "Cp" and "CpK" are the process capabilities. "3sigma" is three times the value of the standard deviation (3σ). "stdev" is the standard deviation.

[0116] [Step S23: Accuracy determination]

[0117] If the mounting accuracy is OK (the error is within the allowable range), the process ends. It is necessary to perform full-point mounting 2 to 3 times until the accuracy is achieved. If the mounting accuracy is NG (the error exceeds the allowable range), the process proceeds to step S24.

[0118] [Step S24: Calculate HO and BO]

[0119] Use Figure 14 to illustrate the head offset (HO). Figure 14 This is a diagram showing an example of the head offset of each mounting head, showing the average deviation of each head.

[0120] For each of the heads L1 - L4, R1 - R4, calculate the average of the measured errors (misalignment amounts) of each mounting point, and calculate the average deviation (average error). Create a table (table of head offsets) for correcting the average deviation of each of the heads L1 - L4, R1 - R4 shown Figure 14 and store it in the storage device. It should be noted that the head offset is obtained by reversing the sign of each of the values shown Figure 14 shown. Figure 14 This shows the average value of the misalignment of each of the heads L1 - L4, R1 - R4. "X" is the misalignment in the X direction, "Y" is the misalignment in the Y direction, and "T" is the misalignment in the rotation direction. For example, the offset in the X direction of head L1 is "7.3", the offset in the Y direction is "1.0", and the offset in the rotation direction is "-0.005".

[0121] Use Figure 15 to illustrate the board offset (BO). Figure 15 This is a diagram showing an example of the board offset of each mounting point.

[0122] Subtract the average error of each of the heads L1 - L4, R1 - R4 from the measured error of each mounting point to calculate the error of each mounting point. Reverse the sign of the calculated error to calculate the board offset, and create Figure 15 the correction table shown. Store the correction table in the storage device. Figure 15 In "#X", "X" is the position in the X direction of the mounting point on the substrate S, "Y" is the position in the Y direction of the mounting point on the substrate S, "OffsetX" is the board offset in the X direction of the mounting point on the substrate S, "OffsetY" is the board offset in the Y direction of the mounting point on the substrate S, and "OffsetT" is the board offset in the rotation direction of the mounting point on the substrate S. For example, in the first row, the board offset in the X direction for the mounting point (X, Y) = (3, 1) is "-2.6", the board offset in the Y direction is "-2", and the board offset in the rotation direction is "0".

[0123] [Step S25: Precision Measurement Based on Full-Point Mounting]

[0124] (S25a: Positioning of the Substrate for Production)

[0125] Similar to step S22b, position the substrate.

[0126] (S25b: Full-Point Mounting)

[0127] Mount the bare chips D at each mounting point on the substrate S under the conditions (head offset and mounting offset) reflected in step S24.

[0128] (S25c: Mounting Position Precision Measurement)

[0129] Similar to step S22d, measure the mounting position precision.

[0130] Use Figure 16 to illustrate an example of precision adjustment based on Figure 6 the method shown. Figure 16 is a diagram showing an example of the process of precision adjustment based on Figure 6 the method shown.

[0131] A (A-1, A-2, A-3) and B (B-1, B-2, B-3) show the errors in precision adjustment for substrates with the same layout but different devices. The mounting points are 11632 respectively. A-1 and B-1 are diagrams obtained by plotting all the errors of each mounting point when the head offset and mounting offset are set to "0" and full-point mounting is performed ( Figure 6 the first full-point mounting in the process shown). A-2 and B-2 are diagrams obtained by plotting all the errors of each mounting point in Figure 6 the second full-point mounting in the process shown. A-3 and B-3 are diagrams obtained by plotting all the errors of each mounting point in Figure 6 the third full-point mounting in the process shown. In the example shown in Figure 16 the mounting precision falls within the specified range through three full-point mountings. It should be noted that in B-1, the deviation of the head offset of the heads L1 to L4, R1 to R4 is large.

[0132] Next, use Figure 17 to illustrate the precision adjustment of the mounting position during product type change. Figure 17 is a flowchart showing the precision adjustment of the mounting position during product type change in the embodiment.

[0133] When the product type changes, the number of bare chips mounted on the substrate and the pitch (mounting layout) are different. Therefore, it is necessary to create and register the head offset and mounting offset separately. In other words, when creating and registering the process of the new product type, it is necessary to perform Figure 6Steps after step S22 of the shown process.

[0134] However, multiple full-point mountings are required, and time from precision adjustment to production start is needed. Additionally, in multiple full-point mountings, a large number of bare chips are consumed.

[0135] For example, Figure 11 The size of the substrate S (referred to as substrate S of variety A (T_A)) shown is about 600 mm × 600 mm. The substrate S of variety A has four mounting areas with 62 in the X direction and 51 in the Y direction (number of bare chips placed: 62 × 51 × 4 = 12,648). For example, the substrate S of variety B (T_B) has four areas with 58 in the X direction and 54 in the Y direction (number of bare chips placed: 58 × 54 × 4 = 12,528). The substrate S of variety C (T_B) has four areas with, for example, 56 in the X direction and 55 in the Y direction (number of bare chips placed: 56 × 55 × 4 = 12,320). The substrate S of variety B and the substrate S of variety C have the same substrate size as the substrate S of variety A, and the number of bare chips mounted and the pitch are different from those of the substrate S of variety A respectively.

[0136] Therefore, in the embodiment, a correction table at the time of production type change (e.g., a correction table for variety B) is created based on the correction table obtained during previous production (e.g., a correction table for variety A).

[0137] [Step S31: Calculation of BO]

[0138] Figure 18 It is a diagram showing an outline of a method for calculating the mounting offset of a new process based on an adjusted process.

[0139] Based on the correction value for confirming the accuracy with other processes during previous production (e.g., the mounting offset calculated by the method shown in Figure 6 ), the mounting offset value of the process for the new variety used in this production is calculated. In other words, based on the created and adjusted process (hereinafter referred to as the adjusted process), the mounting offset of the new process is calculated with reference to the mounting layout of the newly created process (hereinafter referred to as the new process).

[0140] For example, as shown in Figure 18 , based on the mounting layout (Bond Layout) of the substrate S of variety A (T_A), the mounting offset (Bond Offset) of the substrate S of variety A, and the mounting layout of the substrate S of variety B (T_B), the mounting offset of the substrate of variety B is calculated. Here, the other process is the mounting layout and mounting offset of the substrate S of variety A. The mounting offset of the substrate S of variety A is obtained by Figure 6The mounting offset calculated by the method shown (e.g., Figure 15 the mounting offset shown) confirmed the accuracy. In addition, the new process is the mounting layout and mounting offset of the substrate S of type B. In addition, the mounting layout is the coordinates of each mounting point (mounting coordinates).

[0141] More specifically, based on the mounting coordinate data and correction table of the substrate of the adjusted process and the mounting coordinate data of the substrate of the new process, the correction value (mounting offset) of the new process is calculated and a correction table is created.

[0142] Use Figure 19 to illustrate the calculation method of the mounting offset of the new process. Figure 19 is a diagram illustrating an example of calculating the mounting offset of type B based on the mounting coordinates of type A, the mounting offset of type A, and the mounting coordinates of type B.

[0143] Calculate which position of the grid formed by the mounting coordinates of the adjusted process the mounting coordinates of the new process are included in, and based on the correction values of the four points of this grid, calculate the correction value of the mounting coordinates of the new process by interpolation calculation.

[0144] In Figure 19 , the mounting layouts of the substrate S of type A and the substrate S of type B are shown overlapping. The numbers inside are the grid numbers of the substrate S of type A, and the numbers outside are the grid numbers of the substrate S of type B. From the positions of the grid numbers (1 to 10) in the X direction, it can be seen that the pitch of the mounting points of the substrate S of type A in the X direction is smaller than the pitch of the mounting points of the substrate S of type B. From the positions of the grid numbers (1 to 6) in the Y direction, it can be seen that the pitch of the mounting points of the substrate S of type A in the Y direction is smaller than the pitch of the mounting points of the substrate S of type B. The grid point Gp(X7, Y5) of the substrate S of type B is located among the four grid points G1(X8, Y5), G2(X8, Y4), G3(X7, Y5), G4(X7, Y4) of the substrate S of type A.

[0145] Let the mounting coordinates of the grid points G1(X8, Y5), G2(X8, Y4), G3(X7, Y5), G4(X7, Y4) of the substrate of type A be (x1, y1), (x2, y2), (x3, y3), (x4, y4), and let the mounting offsets in the X direction at the grid points G1(X8, Y5), G2(X8, Y4), G3(X7, Y5), G4(X7, Y4) be u1 to u4, and the mounting offsets in the Y direction be v1 to v4.

[0146] If the mounting coordinates and mounting offsets at the grid points G1 to G4 are set as G1(x1, y1, u1, v1), G2(x2, y2, u2, v2), G3(x3, y3, u3, v3), and G4(x4, y4, u4, v4), then

[0147] G1(x1, y1, u1, v1)

[0148] =(25698.6, 265958.1, -0.6, 1.8)

[0149] G2(x2, y2, u2, v2)

[0150] =(256978.6, 271477.1, 0.0, 1.5)

[0151] G3(x3, y3, u3, v3)

[0152] =(261527.7, 271477.1, -1.2, -2.8)

[0153] G4(x4, y4, u4, v4)

[0154] =(261527.7, 265958.1, -1.1, -2.4).

[0155] Here, the mounting coordinates of the grid point Gp(X7, Y5) of the substrate S of type B are set as (xp, yp), the mounting offset in the X direction at the grid point Gp is set as up, and the mounting offset in the Y direction is set as vp. If the mounting coordinates and mounting offsets at the grid point Gp are set as Gp(xp, yp, up, vp) and up = Xo, vp = Yo, then Gp(xp, yp, up, vp)

[0156] =(259856.8, 267504.5, Xo, Yo).

[0157] Interpolate and calculate (Xo, Yo), then

[0158] (Xo, Yo)=(-0.80, -0.72).

[0159] Perform the above calculations at all the mounting points of type B, calculate the mounting offsets. Then, create a correction table and store it in the storage device.

[0160] [Step S32: Precision measurement based on single-line mounting]

[0161] Use Figure 20 to illustrate single-line mounting. Figure 20 is a substrate layout diagram for illustrating single-line mounting.

[0162] (Step S32a: Positioning of the production substrate)

[0163] First, position the production substrate in the same manner as in step S22b.

[0164] (Step S32b: Mounting in one line)

[0165] Next, using the mounting offset calculated in step 31 and the adjusted head offset, as Figure 20 shown, mount the bare chips D at each mounting point in one column LL in the Y direction on the X2 side of the substrate S using the heads L1 to L4, and mount the bare chips D at each mounting point in one column RL in the Y direction on the X1 side of the substrate S using the heads R1 to R4.

[0166] (Step S32c: Measurement of mounting position accuracy)

[0167] Measure the mounting position accuracy in the same manner as in step S22d, investigate the error (misalignment amount), and store it in the storage device.

[0168] [Step S33: Accuracy determination]

[0169] If the mounting accuracy is OK (the error is within the allowable range), end. It is necessary to perform one to two times of mounting in one line until the accuracy is achieved. If the mounting accuracy is NG (the error exceeds the allowable range), proceed to step S34.

[0170] [Step S34: Calculation of HO]

[0171] Use Figure 21 and Figure 22 to illustrate the calculation and reflection of the head offset. Figure 21 is a diagram showing an example of the misalignment amount for each head and the entire head. Figure 21 The "L1" to "L4" and "R1" to "R4" in Figure 22 show the misalignment amounts of the heads L1 to L4 and R1 to R4, and "TOTAL" shows the misalignment amount of the entire head. Figure 22 is a diagram showing a modified example of the head offset.

[0172] As Figure 21 shown, average the errors (misalignment amounts) at each measured mounting point for each of the heads L1 to L4 and R1 to R4 to calculate the average deviation amount (average error). Here, Figure 21 the numbers at the center of the cross shown in

[0173] Next, using the head offset amounts that can be corrected for the heads L1 to L4 and R1 to R4 respectively, correct the average deviation amounts of the respective heads L1 to L4 and R1 to R4 so that the overall average value is consistent.

[0174] In the case of, for example, Figure 21 the result shown, the changed head offset amount is calculated by subtracting the average deviation amount (average value) of each of the heads L1 to L4 and R1 to R4 from the head offset amount before the change of each of the heads L1 to L4 and R1 to R4. For example, as Figure 22 shown, the head offset amount in the X direction before the change of head L1 is "6.5", and the head offset amount in the Y direction is "8.4". In addition, as Figure 21 shown, the average deviation amount in the X direction of head L1 is "0.2", and the average deviation amount in the Y direction is "1.1". Thus, the changed head offset amount in the X direction is "6.5 - 0.2 = 6.3", and the head offset amount in the Y direction is "8.4 - 1.1 = 7.3".

[0175] Perform the above calculation for each of the heads L1 to L4 and R1 to R4, calculate the respective head offset amounts, and store the updated head offset amounts in the storage device.

[0176] [Step S35: Precision measurement based on full-point mounting]

[0177] Similar to step S25, perform substrate positioning, full-point mounting, and mounting position precision measurement.

[0178] It should be noted that in the Figure 17 shown process, only the measurement result is fed back to the head offset amount. If necessary, the measurement result can also be fed back to the mounting offset amount.

[0179] Figure 23 is a diagram showing an example of the precision adjustment process based on the Figure 17 shown method. The positions of C (C-1, C-2, C-3) are the same as those of A (A-1, A-2, A-3) of Figure 16 , but the substrate types are different. The devices of D (D-1, D-2, D-3) are the same as those of B (B-1, B-2, B-3) of Figure 16 , but the substrate types are different. C (C-1, C-2, C-3) and D (D-1, D-2, D-3) are precision adjustments for substrates with the same layout. In addition, the number of mounting points for one line on the left and right (2 lines) of C-1, C-2 and D-1, D-2 respectively is 202. C-3 and D-3 are full-point mountings, and the number of mounting points is 11,800.

[0180] C-1 and D-1 are diagrams that plot all the errors at each placement point when performing one-line placement left and right (the first one-line placement in the process shown in Figure 17 ) using the placement offset calculated in step S31. C-2 and D-2 are diagrams that plot all the errors at each placement point of the second one-line placement in the process shown in Figure 17 . C-3 and D-3 are diagrams that plot all the errors at each placement point of the full-point placement in the process shown in Figure 17 . In the example shown in Figure 17 , the placement accuracy falls within the specified range through the second one-line placement.

[0181] In the embodiment, in a new substrate, it is also possible to create a high-precision correction table (with the same level of precision as the method of repeatedly performing full-point placement) by consuming a small number of sample bare chips.

[0182] The invention implemented by the inventors of the present application has been specifically described above based on the embodiment and examples, but the present invention is not limited to the above embodiment and examples, and various modifications can of course be made.

[0183] For example, an example is described in which a flipping mechanism is provided in the pick-up flipping head in the example, and the transfer head receives the bare chip from the pick-up flipping head and places it on the transfer table, and then the transfer table is used for flipping / non-flipping, but it is not limited thereto, and it may also be a method of performing flipping / non-flipping using the transfer table without providing a flipping mechanism in the pick-up head.

[0184] An example in which there are four placement heads is described in the embodiment, but it is not limited thereto, and there may also be one or more placement heads.

[0185] In the embodiment, an example is described in which the placement camera is provided on the same placement workbench as the placement head, but it may also be provided on a workbench different from the placement workbench, or the placement camera may be fixed and the substrate may be moved.

[0186] In the embodiment, an example is described in which the measurement of the placement position accuracy uses a placement camera, but it may also be a measuring device other than a camera.

[0187] An example in which there are two Y beams is described in the embodiment, but there may also be one.

[0188] In the embodiment, the placement head is used as an example for description, but it can also be applied to a multi-head device, such as a multi-head coating device.

Claims

1. A mounting device, characterized in that: include: a head table having a plurality of heads; a driving unit that moves the head table; a stage that holds a substrate to which the workpiece is fed by the head; as well as a control device that controls the drive unit using a correction table, The control device is configured as follows: The position of the fed workpiece on the substrate is uniquely associated with the plurality of heads, Based on the correction table for the first substrate used in previous production, the layout of the first substrate, and the layout of the second substrate used this time, a correction table for the second substrate used in this production is calculated.

2. The mounting device according to claim 1, characterized in that: The correction table is the total placement offset of the head offset of each head and the position of the workpiece to be supplied, the position of the workpiece to be supplied is the placement point, The head offset is a correction value for correcting the misalignment of the head. The placement offset is a correction value for correcting the misalignment between the position of the supplied workpiece and the placement point.

3. The mounting device according to claim 2, characterized in that: The control device is configured to calculate a correction table for the second substrate based on the correction table for the first substrate, data on mounting coordinates as coordinates of the mounting points on the first substrate, and data on mounting coordinates as coordinates of the mounting points on the second substrate.

4. The mounting device according to claim 3, characterized in that: The control device is configured as follows: Calculate at which position of the grid formed by the mounting coordinates of the first substrate the mounting coordinates of the second substrate are included, Based on the correction values ​​of the four points of the grid, the correction values ​​of the mounting coordinates of the second substrate are calculated by interpolation calculation. A correction table for the second substrate is created based on the calculated correction values.

5. The mounting device according to claim 2, characterized in that: The control device is configured as follows: Based on the correction table, the workpiece is mounted on each mounting point of one column on a substrate having the same layout as the second substrate. The placement position accuracy at each placement point is measured.

6. The mounting device according to claim 5, characterized in that: The control device is configured as follows: The average of the misalignment amounts at each mounting point measured by each head is calculated to calculate the average deviation amount. The head offset is corrected for each of the heads based on the average deviation.

7. The mounting device according to claim 2, characterized in that: The control device is configured as follows: The head offset and the placement offset are set to 0, and the workpiece is placed on all the placement points in a substrate having the same layout as the first substrate. The placement position accuracy is measured for each of the placement points.

8. The mounting device according to claim 7, characterized in that: The control device is configured as follows: The errors at the mounting points measured by each head are averaged to calculate the average error. Based on the average error, calculating the head offset for each of the heads, The error at each of the placement points is calculated by subtracting the average error of each of the heads from the measured error at each of the placement points. The placement offset of each of the placement points is calculated based on the calculated error.

9. An installation method, characterized in that: The process includes the following: Loading a third substrate having the same layout as the second substrate into the mounting device according to claim 1; and The workpiece is mounted on the third substrate.

10. A method for manufacturing a semiconductor device, characterized in that: The process includes the following: Loading a third substrate having the same layout as the second substrate into the mounting device according to claim 1; and A bare chip is mounted on the third substrate.

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