A packaging device for semiconductor chip production

Abstract

The application discloses a packaging device for semiconductor chip production, which comprises a test table, an airflow guiding mechanism and a pushing mechanism, a mounting groove is formed in the top of the test table, a packaging mold base is fixedly installed at the top of the mounting groove through bolts, and a moving mechanism is arranged on one side of the top of the test table; the silica gel air suction soft cone heads are uniformly arranged, so that the air pressure adsorption force is dispersed through the plurality of silica gel air suction soft cone heads, the concentrated adsorption force on the fragile chip materials is reduced, the local stress concentration is avoided, the chip materials are indirectly protected, and the flexibility of the silica gel air suction soft cone heads is combined to generate certain deformation, so that the stability of adsorption is ensured, the flexible round corners cannot cause damage to the chip materials, the protection effect of the packaging operation is increased, a plurality of chip materials can be adapted, and the relative stability and safety of the structure are increased.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor chip production and packaging equipment, and in particular to a packaging device for semiconductor chip production. Background Art

[0002] Semiconductor packaging refers to the process of converting tested wafers into individual chips according to product model and functional requirements. The packaging process involves dicing wafers from the front-end wafer process into small dies. These dies are then glued onto the corresponding islands on the substrate (lead frame). Ultra-fine metal (gold, tin, copper, and aluminum) wires or conductive resin are then used to connect the die's bonding pads to the corresponding leads on the substrate, forming the required circuit. The individual dies are then encapsulated and protected in a plastic casing. A series of operations are performed after encapsulation, and the finished product is tested. The final steps typically include incoming inspection, testing, and packaging, before being shipped.

[0003] Semiconductor chip production packaging is the process of encapsulating manufactured semiconductor chips in a protective shell to provide physical protection, electrical connection and thermal management functions. During this process, the substrate needs to be moved and packaged to allow sampling inspection of the process flow, and the chip and packaging material need to be moved and spliced. Since the chip material is relatively fragile, certain accidental damage will occur during the equipment transfer and handling process, which reduces the yield rate to a certain extent. In addition, due to the mismatch in the thermal expansion coefficients of the chip and the substrate, during the mounting and heating process, the material contacts the high-temperature point, while the temperature of the rest of the material is low and the temperature distribution is uneven, which will cause more thermal stress accumulation, which may cause the chip or substrate to deform and crack, affecting the packaging reliability. Based on this, a packaging device for semiconductor chip production is proposed. Summary of the Invention

[0004] The object of the present invention is to provide a packaging device for semiconductor chip production to solve the problems raised in the above background technology.

[0005] To achieve the above-mentioned objectives, the present invention provides the following technical solution: a packaging device for semiconductor chip production, comprising a test bench, an airflow guide mechanism and a pushing mechanism, wherein a mounting groove is provided on the top of the test bench, a packaging mold seat is fixedly installed on the top of the mounting groove by bolts, and a moving mechanism is provided on one side of the top of the test bench.

[0006] The moving mechanism includes two support seats, the two support seats are fixedly installed on the top of the test bench, ball screws are installed on the opposite sides of the two support seats through bearings, one end of the ball screw is connected to a servo motor, two slide rails are fixedly installed on the opposite sides of the two support seats, the outer side of the ball screw is connected to the moving seat through a threaded transmission, a mechanical arm mechanism is fixedly installed on the top of the moving seat, and a lifting mechanism is fixedly installed on the movable end of the mechanical arm mechanism.

[0007] The lifting mechanism includes an outer sleeve, an inner sleeve column is movably connected to the inner side of the outer sleeve, an electrically controlled telescopic rod 2 is fixedly installed on the top of the inner cavity of the outer sleeve, an installation cavity is opened inside the inner sleeve column, a movable piston mechanism is installed on the top of the inner cavity of the installation cavity, the movable piston mechanism includes an electrically controlled telescopic rod 5, a sealing piston is fixedly installed on the output end of the electrically controlled telescopic rod 5, a rotation support mechanism is provided on the outer side of the inner sleeve column, a suction mechanism is passed through the inner side of the rotation support mechanism, and an active rotation mechanism is installed on the top of the rotation support mechanism.

[0008] The suction mechanism includes a connecting branch pipe, a mounting ring is fixedly installed on the top of the connecting branch pipe, a rotating seal is movably installed on the inner side of the mounting ring, a sealing cone ring is movably installed on the top of the mounting ring, the bottom of the connecting branch pipe is connected to an air suction shell, a rubber elastic diaphragm is fixedly installed on the inner wall of the air suction shell, and the bottom of the air suction shell is connected to a plurality of silicone air suction soft cone heads.

[0009] The airflow guiding mechanism includes a two-way equivalent air outlet fan, a mounting bracket and a connecting hose. One end of the two-way equivalent air outlet fan is connected to the inner side of the connecting hose. The two-way equivalent air outlet fan is fixedly installed on the top of the mounting bracket. The mounting bracket is fixedly installed on the top of the test bench. The end of the connecting hose away from the two-way equivalent air outlet fan is connected to the airflow processing mechanism.

[0010] Preferably, the servo motor is fixedly mounted on the top of the test bench, the bottoms of the two slide rails are fixedly mounted on the top of the test bench, and the movable seat is slidably sleeved on the outer sides of the slide rails.

[0011] Preferably, the robotic arm mechanism includes a support column, a bearing support seat is movably sleeved on the outer side of the bottom end of the support column, the bearing support seat is fixedly mounted on the top of the moving seat, a driven transmission gear is fixedly sleeved on the outer side of the support column, an active transmission gear is meshed on the outer side of the driven transmission gear, the bottom of the active transmission gear is connected to a servo motor 2, the servo motor 2 is fixedly mounted on the top of the moving seat, the top end of the support column is rotatably hinged with a cross bar, the outer side of the cross bar is rotatably hinged with an electrically-controlled telescopic column 1, and the end of the electrically-controlled telescopic column 1 away from the cross bar is rotatably hinged on the outer side of the support column.

[0012] Preferably, the outer sleeve is fixedly mounted on the outside of the cross bar, the output end of the second electrically controlled telescopic rod is fixedly mounted on the top of the inner sleeve column, a pressure equalizing air hole is opened on one side of the top of the outer sleeve, and a plurality of guide air ducts are opened on the top of the inner sleeve column.

[0013] Preferably, the electrically controlled telescopic rod five is fixedly mounted on the top of the inner cavity of the mounting cavity, the movable sleeve of the sealing piston is connected to the inner side of the mounting cavity, the pressure equalizing air hole is connected to the interior of the outer sleeve, the top end of the guide air duct is connected to the interior of the outer sleeve, and the bottom end of the guide air duct is connected to the interior of the mounting cavity.

[0014] Preferably, the rotating support mechanism includes a rotating shell, the inner side of the rotating shell is sleeved with a support bearing, the inner side of the support bearing is sleeved with a support ring plate, the inner side of the support ring plate is fixedly sleeved on the outer side of the inner sleeve column, the top of the support ring plate is movably installed with a support block, the inner side of the support block is provided with a plurality of ball grooves, the inner sides of the ball grooves are rollingly installed with rolling balls, the ball grooves and rolling balls are evenly distributed on the inner side of the support block in a circular shape, and the bottoms of the support block, ball grooves and rolling balls are in sliding contact with the top of the support ring plate.

[0015] Preferably, the connecting branch pipe is fixedly sleeved on the inner side of the rotating shell, the top end of the connecting branch pipe is rotatably inserted into the inner side of the mounting cavity, the mounting ring is movably sleeved on the inner side of the mounting cavity, the sealing cone ring is fixedly mounted on the inner side of the mounting cavity, the bottom of the rotating seal is in rotational sealing contact with the top of the connecting branch pipe, the silicone air-intake soft cone head is evenly distributed on the circumference of the bottom of the air-intake shell, the silicone air-intake soft cone head is conical, and the outer edge of the bottom is provided with rounded corners.

[0016] Preferably, the active rotation mechanism includes a driven gear ring disk, a driving gear disk and a servo motor three, the driven gear ring disk is fixedly mounted on the top of the rotating shell, the outer side of the driving gear disk is meshed and transmission-connected with the inner side of the driven gear ring disk, the output end of the servo motor three is transmission-connected with the top of the driving gear disk, the outer side of the servo motor three is fixedly sleeved with a fixed ring frame, and the inner side of the fixed ring frame away from one end of the servo motor three is fixedly sleeved on the outer side of the inner sleeve column.

[0017] Preferably, the pushing mechanism includes a fixed plate, one side of the fixed plate is fixedly installed with an electric-controlled telescopic rod three, the output end of the electric-controlled telescopic rod three is fixedly installed with a push-pull frame, the top of the push-pull frame away from one end of the electric-controlled telescopic rod three is fixedly installed with a support ring frame, the push-pull frame is slidably installed on the top of the test bench, the inner side of the top of the support ring frame is fixedly installed with a support circular plate, the airflow handling mechanism is fixedly installed on the top of the support circular plate, the inner side of the push-pull frame is movably provided with a preheating mechanism, the preheating mechanism includes an annular shell, the inner side of the annular shell is provided with a plurality of air outlet holes, the air outlet holes are evenly distributed on the inner side of the annular shell in a circular shape, the bottom of the annular shell is fixedly installed with a support ring seat, the bottom of the support ring seat is in sliding contact with the top of the test bench, and the inner side of the annular shell is fixedly installed with an electric heating wire.

[0018] Preferably, the airflow handling mechanism includes a semi-ring seat, and several groups of concave limit frames are fixedly installed on the inner side of the semi-ring seat, and a pull-out sealing frame is slidably installed on the inner side of the concave limit frame. A smoke filter is fixedly installed on the inner side of the pull-out sealing frame, and the pull-out sealing frame movably passes through the semi-ring seat and extends to the top of the semi-ring seat. The end of the mounting frame away from the two-way equivalent air outlet fan is connected to the interior of the semi-ring seat, and the concave limit frames are symmetrically and evenly distributed inside the semi-ring seat with the mounting frame as the mounting frame. Two electrically controlled telescopic rods four are fixedly installed on the bottom of the supporting circular plate, and the tops of the two electrically controlled telescopic rods four are fixedly installed on the top of the annular shell. The semi-ring seat is C-shaped, and both ends of the C-shape of the semi-ring seat are connected to an air outlet hose, and the end of the air outlet hose away from the semi-ring seat is connected to the top of the annular shell.

[0019] Compared with the prior art, the beneficial effects of the present invention are as follows: 1. When the device is in use, the material to be packaged is placed next to the test bench, and then after the equipment is started, the servo motor first rotates to drive the ball screw to rotate, and applies a spiral transmission force to the moving seat, and the moving seat moves under the sliding limit of the slide rail, and then drives the mechanical arm mechanism to move through the moving seat, and adjusts the range of the lifting mechanism to the inside of the material placement container outside the test bench. At this time, the electric control telescopic rod second extends and drives the inner sleeve column to move downward, prompting the rotating support mechanism and the suction mechanism to move downward, and the silicone at the bottom of the suction mechanism is sucked in. When the soft cone head contacts the chip material, the electric telescopic rod 5 retracts, driving the sealing piston to move upward, forming a negative pressure inside the installation cavity and the connecting branch pipe, and causing the rubber elastic diaphragm to deform and convex upward. Then the air pressure is transmitted to the bottom of the rubber elastic diaphragm of the air intake shell, causing the soft cone head of the silicone air intake soft cone head to contact the chip material and form an adsorption force on the chip. Then the electric telescopic rod 2 moves upward, and the moving mechanism and the mechanical arm mechanism are reset, placing the chip material on the inner side of the packaging mold seat, making it convenient for operators to pick up and place packaging inspections. The overall structure is stable and convenient for picking up and placing materials at multiple angles.

[0020] 2. The silicone suction soft cones are evenly arranged to disperse the air pressure adsorption force through multiple silicone suction soft cones, reducing the concentrated adsorption force on fragile chip materials, avoiding local stress concentration, and indirectly protecting the chip materials. In addition, the flexible cone shape of the silicone suction soft cone produces a certain deformation, ensuring the stability of adsorption. The flexible rounded corners will not damage the chip materials, thereby increasing the protection of the packaging operation, and can adapt to a variety of chip materials, increasing the relative stability and safety of the structure.

[0021] 3. When the two-way equivalent air outlet fan is started, the airflow enters the interior of the semi-annular seat through the connecting hose and enters the interior of the annular shell through the guide of the air outlet hose. The airflow is heated by the action of the electric heating wire and then discharged through the air outlet. The airflow is divided into two parts through the connecting hose to the air outlet hose and then to the air outlet, and the two parts are divided into circumferential guides, thereby achieving uniform discharge of the airflow. When the two-way equivalent air outlet fan blows in the opposite direction, the airflow enters through the air outlet. At this time, the chip package is pin-welded, generating a certain amount of smoke. The airflow brings the smoke out and enters the air outlet hose through the air outlet and the guide of the annular shell, and enters the interior of the semi-annular seat through the guide of the air outlet hose. Finally, it is filtered through the smoke filter, thereby filtering the smoke and avoiding the smoke affecting the operator and the visual system, ensuring the stability of welding, the overall ease of use, improving the yield rate and improving the product testing efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a schematic diagram of the front three-dimensional appearance structure of the present invention.

[0023] Figure 2 It is a schematic diagram of the rear-view stereoscopic appearance structure of the present invention.

[0024] Figure 3 It is a schematic diagram of the partially cutaway front view of the three-dimensional appearance structure of the present invention.

[0025] Figure 4 It is a schematic diagram of a partial cross-sectional structure of the present invention from the right side.

[0026] Figure 5 For the present invention Figure 1 Enlarged structural diagram at point A in the middle.

[0027] Figure 6 For the present invention Figure 3 Enlarged structural diagram at point B in the middle.

[0028] Figure 7 For the present invention Figure 3 Enlarged structural diagram at point C in the middle.

[0029] Figure 8 For the present invention Figure 4 Enlarged structural diagram at point D in the middle.

[0030] Figure 9 For the present invention Figure 4 Enlarged structural diagram at E in the middle.

[0031] Figure 10 For the present invention Figure 4 Enlarged structural diagram at F in the middle.

[0032] In the figure: 1. Test bench; 101. Mounting slot; 102. Encapsulation mold base; 2. Moving mechanism; 201. Ball screw; 202. Slide rail; 203. Support base; 204. Servo motor 1; 205. Moving base; 3. Robotic arm mechanism; 301. Servo motor 2; 302. Driving transmission gear; 303. Driven transmission gear; 304. Support column; 305. Crossbar; 306. Electric telescopic column 1; 307. Bearing support base; 4. Lifting mechanism; 401, outer sleeve; 402, inner sleeve column; 403, mounting cavity; 404, air guide duct; 405, pressure equalizing vent; 406, second electrically controlled telescopic rod; 5, air flow guide mechanism; 501, bidirectional equivalent air blower; 502, mounting bracket; 503, connecting hose; 6, pushing mechanism; 601, fixing plate; 602, third electrically controlled telescopic rod; 603, push-pull bracket; 604, support ring bracket; 605, supporting circular plate; 7, preheating mechanism; 701, annular shell; 702, air outlet; 703, support ring seat; 704, heating wire; 8, airflow handling mechanism; 801, semi-ring seat; 802, air outlet hose; 803, four electrically controlled telescopic rods; 804, pull-out sealing frame; 805, smoke filter; 806, concave limit frame; 9, rotation support mechanism; 901, rotating housing; 902, support block; 903, ball groove; 904, ball bearing; 905, support bearing; 906, support ring plate; 10, suction mechanism; 1001. Intake shell; 1002. Silicone soft intake cone head; 1003. Rubber elastic diaphragm; 1004. Connecting branch pipe; 1005. Rotating seal; 1006. Mounting ring; 1007. Sealing cone ring; 11. Active rotation mechanism; 1101. Driven gear ring disk; 1102. Active gear disk; 1103. Servo motor three; 1104. Fixed ring frame; 12. Moving piston mechanism; 1201. Electric telescopic rod five; 1202. Sealing piston. DETAILED DESCRIPTION

[0033] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0034] See alsoFigures 1-10 The present invention provides a technical solution: a packaging device for semiconductor chip production, including a test table 1, an airflow guide mechanism 5 and a pushing mechanism 6. A mounting groove 101 is opened on the top of the test table 1, and a packaging mold base 102 is fixed to the top of the mounting groove 101 by bolts. A moving mechanism 2 is provided on one side of the top of the test table 1.

[0035] The moving mechanism 2 includes two support seats 203, which are fixedly installed on the top of the test bench 1. Ball screws 201 are installed on the opposite sides of the two support seats 203 through bearings. One end of the ball screw 201 is connected to a servo motor 204. Two slide rails 202 are fixedly installed on the opposite sides of the two support seats 203. The outer side of the ball screw 201 is connected to a moving seat 205 through a threaded transmission. A robotic arm mechanism 3 is fixedly installed on the top of the moving seat 205, and a lifting mechanism 4 is fixedly installed on the movable end of the robotic arm mechanism 3.

[0036] The lifting mechanism 4 includes an outer sleeve 401, the inner side of the outer sleeve 401 is movably connected to the inner sleeve column 402, the top of the inner cavity of the outer sleeve 401 is fixedly installed with an electrically controlled telescopic rod 2 406, the interior of the inner sleeve column 402 is provided with an installation cavity 403, the top of the inner cavity of the installation cavity 403 is installed with a movable piston mechanism 12, the movable piston mechanism 12 includes an electrically controlled telescopic rod 5 1201, the output end of the electrically controlled telescopic rod 5 1201 is fixedly installed with a sealing piston 1202, the outer side of the inner sleeve column 402 is provided with a rotating support mechanism 9, the inner side of the rotating support mechanism 9 is penetrated by a suction mechanism 10, and the top of the rotating support mechanism 9 is installed with an active rotating mechanism 11.

[0037] The suction mechanism 10 includes a connecting branch pipe 1004, a mounting ring 1006 is fixedly installed on the top of the connecting branch pipe 1004, a rotating seal 1005 is movably installed on the inner side of the mounting ring 1006, a sealing cone ring 1007 is movably installed on the top of the mounting ring 1006, the bottom of the connecting branch pipe 1004 is connected to the air suction shell 1001, a rubber elastic diaphragm 1003 is fixedly installed on the inner wall of the air suction shell 1001, and the bottom of the air suction shell 1001 is connected to a number of silicone air suction soft cone heads 1002.

[0038] The airflow guiding mechanism 5 includes a bidirectional equivalent air outlet fan 501, a mounting bracket 502 and a connecting hose 503. One end of the bidirectional equivalent air outlet fan 501 is connected to the inner side of the connecting hose 503. The bidirectional equivalent air outlet fan 501 is fixedly installed on the top of the mounting bracket 502. The mounting bracket 502 is fixedly installed on the top of the test bench 1. The end of the connecting hose 503 away from the bidirectional equivalent air outlet fan 501 is connected to the airflow processing mechanism 8.

[0039] The working principle of the above technical solution is as follows: when in use, the material to be packaged is placed next to the test bench 1, and then after the equipment is started, the servo motor 204 rotates first to drive the ball screw 201 to rotate, and applies a spiral transmission force to the moving seat 205, and the moving seat 205 moves under the sliding limit of the slide rail 202, and then drives the mechanical arm mechanism 3 to move through the moving seat 205, and adjusts the range of the lifting mechanism 4 to the inside of the material placement container outside the test bench 1. At this time, the electric telescopic rod 2 406 extends and drives the inner sleeve column 402 to move downward, prompting the rotating support mechanism 9 and the suction mechanism 10 to move downward, and the silicone suction soft cone head 1002 at the bottom of the suction mechanism 10 contacts the chip. Material, at this time the electric-controlled telescopic rod five 1201 retracts, driving the sealing piston 1202 to move upward, and forming a negative pressure inside the installation cavity 403 and the connecting branch pipe 1004, and causing the rubber elastic diaphragm 1003 to deform and bulge upward, and then the air pressure is transmitted at the bottom of the rubber elastic diaphragm 1003 of the suction shell 1001, causing the soft cone head of the silicone suction soft cone head 1002 to be in contact with the chip material, and forming an adsorption force on the chip, and then the electric-controlled telescopic rod two 406 moves upward, the moving mechanism 2 and the robotic arm mechanism 3 reset, and the chip material is placed on the inner side of the packaging mold seat 102, which is convenient for the operator to take and place the packaging test. The overall structure is stable to use and is convenient for taking and placing materials at multiple angles.

[0040] In another embodiment, Figures 1-4 As shown, the servo motor 204 is fixedly mounted on the top of the test bench 1 , the bottoms of the two slide rails 202 are fixedly mounted on the top of the test bench 1 , and the moving seat 205 is slidably sleeved on the outer sides of the slide rails 202 .

[0041] After the servo motor 204 is fixed, it is convenient to drive the ball screw 201 to rotate, thereby ensuring the stable coordinated movement of the mechanism, and facilitating the stable movement of the moving seat 205, thereby ensuring the operation of the mechanism.

[0042] In another embodiment, Figures 1-4 As shown, the robotic arm mechanism 3 includes a support column 304, and the outer side of the bottom end of the support column 304 is movably sleeved with a bearing support seat 307, and the bearing support seat 307 is fixedly installed on the top of the moving seat 205. The outer side of the support column 304 is fixedly sleeved with a driven transmission gear 303, and the outer side of the driven transmission gear 303 is engaged with a driving transmission gear 302. The bottom of the driving transmission gear 302 is transmission-connected with a servo motor 2 301, and the servo motor 2 301 is fixedly installed on the top of the moving seat 205. The top end of the support column 304 is rotatably hinged with a cross bar 305, and the outer side of the cross bar 305 is rotatably hinged with an electric-controlled telescopic column 1 306, and the end of the electric-controlled telescopic column 1 306 away from the cross bar 305 is rotatably hinged on the outer side of the support column 304.

[0043] The robotic arm mechanism 3 moves along with the moving mechanism 2. At this time, the servo motor 2 301 starts to rotate to drive the active transmission gear 302 to rotate, and the active transmission gear 302 drives the driven transmission gear 303 to rotate, and drives the support column 304 to rotate. The support column 304 rotates under the support of the bearing support seat 307, and drives the lifting mechanism 4 to leave the moving range of the test bench 1, which is convenient for driving and adjusting the rotation angle of the lifting mechanism 4, thereby cooperating with the moving mechanism 2 to drive the lifting mechanism 4 to move, which is convenient for coordinated operation.

[0044] In another embodiment, Figures 1-10 As shown, the outer sleeve 401 is fixedly mounted on the outside of the cross bar 305, the output end of the electric telescopic rod 2 406 is fixedly mounted on the top of the inner sleeve column 402, a pressure equalizing air hole 405 is opened on one side of the top of the outer sleeve 401, and a plurality of guide air channels 404 are opened on the top of the inner sleeve column 402.

[0045] The outer sleeve 401 cooperates with the movement of the cross bar 305, and the extension and retraction of the electric-controlled telescopic rod 2 406 facilitates the up and down movement of the inner sleeve column 402. When the electric-controlled telescopic rod 2 406 and the electric-controlled telescopic rod 5 1201 are extended and retracted, the pressure-equalizing air hole 405 and the guide air channel 404 connect the air pressure inside the inner sleeve column 402 and the outer sleeve 401, thereby reducing the effect of the air pressure, increasing the relative stability of the structure, avoiding the influence of the operating effect due to the sealing, and ensuring the relative stability of the structure.

[0046] In another embodiment, Figures 5-10 As shown, the electric-controlled telescopic rod 1201 is fixedly installed on the top of the inner cavity of the installation cavity 403, the sealing piston 1202 is movably sleeved on the inner side of the installation cavity 403, the pressure equalizing air hole 405 is connected to the interior of the outer sleeve 401, the top end of the guide air channel 404 is connected to the interior of the outer sleeve 401, and the bottom end of the guide air channel 404 is connected to the interior of the installation cavity 403.

[0047] After the electric-controlled telescopic rod 1201 is extended, it drives the sealing piston 1202 to move, thereby forming an air pressure diversion inside the installation cavity 403, which is convenient for changing the air pressure and facilitating adsorption. When the sealing piston 1202 moves, the internal and external air pressures are connected through the pressure-equalizing air hole 405 and the guide air channel 404, thereby stabilizing the structural operation and avoiding the situation of poor air pressure diversion.

[0048] In another embodiment, Figures 1-8As shown, the rotating support mechanism 9 includes a rotating shell 901, a supporting bearing 905 is sleeved on the inner side of the rotating shell 901, and a supporting ring plate 906 is sleeved on the inner side of the support bearing 905. The inner side of the support ring plate 906 is fixedly sleeved on the outer side of the inner sleeve column 402, and a support block 902 is movably installed on the top of the support ring plate 906. A plurality of ball grooves 903 are opened on the inner side of the support block 902, and rolling balls 904 are rollingly installed on the inner side of the ball grooves 903. The ball grooves 903 and the rolling balls 904 are evenly distributed on the inner side of the support block 902 in a circular shape, and the bottoms of the support block 902, the ball grooves 903 and the rolling balls 904 are all in sliding contact with the top of the support ring plate 906.

[0049] When the inner sleeve column 402 moves in a telescopic manner, it will drive the support ring plate 906 to move, and then drive the rotation support mechanism 9 to move partly. The rolling ball 904 rolls inside the ball groove 903, thereby cooperating with the support block 902 to form a rotation support for the top of the support ring plate 906, so as to maintain a relatively stable rotation support effect, cooperate with the active rotation mechanism 11 to move, and maintain the relative stability of the structure.

[0050] In another embodiment, Figures 4-10 As shown, the connecting branch pipe 1004 is fixedly sleeved on the inner side of the rotating shell 901, the top end of the connecting branch pipe 1004 is rotatably inserted into the inner side of the mounting cavity 403, the mounting ring 1006 is movably sleeved on the inner side of the mounting cavity 403, the sealing cone ring 1007 is fixedly mounted on the inner side of the mounting cavity 403, the bottom of the rotating seal 1005 is in rotational sealing contact with the top of the connecting branch pipe 1004, and the silicone air-inhalation soft cone head 1002 is evenly distributed on the circumference of the bottom of the air-inhalation shell 1001. The silicone air-inhalation soft cone head 1002 is conical, and the outer edge of the bottom is provided with a rounded corner.

[0051] The rotating seal 1005, the mounting ring 1006 and the sealing cone ring 1007 are used to achieve the effect of rotating sealing of the connecting branch pipe 1004 and the inner wall of the mounting cavity 403, so as to maintain a relatively stable effect, maintain a flexible extrusion rotating seal, thereby stabilizing the airtightness and maintaining the air pressure operation effect. The silicone air-absorbing soft cone head 1002 is evenly arranged to promote the dispersion of the air pressure adsorption force through multiple silicone air-absorbing soft cone heads 1002, thereby reducing the concentrated adsorption force on fragile chip materials, avoiding the concentration of local stress, and indirectly protecting the chip materials. In addition, the flexible cone shape of the silicone air-absorbing soft cone head 1002 produces a certain deformation, which ensures the stability of adsorption, and the flexible fillet will not damage the chip material, thereby increasing the protection of the packaging operation, and can adapt to a variety of chip materials, increasing the relative stability and safety of the structure.

[0052] In another embodiment, Figures 1-8As shown, the active rotating mechanism 11 includes a driven gear ring disk 1101, a driving gear disk 1102 and a servo motor three 1103. The driven gear ring disk 1101 is fixedly mounted on the top of the rotating shell 901. The outer side of the driving gear disk 1102 is meshed and transmission-connected with the inner side of the driven gear ring disk 1101. The output end of the servo motor three 1103 is transmission-connected with the top of the driving gear disk 1102. The outer side of the servo motor three 1103 is fixedly sleeved with a fixed ring frame 1104. The inner side of the fixed ring frame 1104, which is away from the end of the servo motor three 1103, is fixedly sleeved on the outer side of the inner sleeve column 402.

[0053] When the servo motor three 1103 rotates, it drives the active gear plate 1102 to rotate, thereby driving the driven gear ring plate 1101 to move, and then exerting a rotational force on the rotating shell 901. The rotating shell 901 maintains a stable position and rotates under the support of the supporting ring plate 906 and the rolling ball 904, prompting the connecting branch pipe 1004 fixed on the inner side of the rotating shell 901 to rotate synchronously, and then drives the chip material adsorbed on the bottom of the silicone suction soft cone head 1002 to rotate, thereby facilitating the adjustment of the direction of the chip material and the adjustment of the position of the chip material after rotation, so that it is placed on the inner side of the packaging mold seat 102, which is convenient for stabilizing the operating effect.

[0054] In another embodiment, Figures 1-7 As shown, the pushing mechanism 6 includes a fixed plate 601, one side of the fixed plate 601 is fixedly mounted with an electric control telescopic rod 3 602, the output end of the electric control telescopic rod 3 602 is fixedly mounted with a push-pull frame 603, the top of the push-pull frame 603 away from the end of the electric control telescopic rod 3 602 is fixedly mounted with a support ring frame 604, the push-pull frame 603 is slidably mounted on the top of the test bench 1, the inner side of the top of the support ring frame 604 is fixedly mounted with a support circular plate 605, and the airflow processing mechanism 8 is fixedly mounted A preheating mechanism 7 is movably provided on the top of the supporting circular plate 605 and the inner side of the push-pull frame 603. The preheating mechanism 7 includes an annular shell 701. A plurality of air outlet holes 702 are provided on the inner side of the annular shell 701. The air outlet holes 702 are evenly distributed in a circular pattern on the inner side of the annular shell 701. A supporting ring seat 703 is fixedly installed on the bottom of the annular shell 701. The bottom of the supporting ring seat 703 is in sliding contact with the top of the test bench 1. A heating wire 704 is fixedly installed on the inner side of the annular shell 701.

[0055] When the electric telescopic rod 3 602 is started, it pushes the push-pull frame 603 to move and then drives the airflow processing mechanism 8 to move, thereby driving the preheating mechanism 7 to move through the airflow processing mechanism 8 and then adjusting the rotation position of the preheating mechanism 7, thereby maintaining the moving position of the structure, and facilitating the change of the position of the preheating mechanism 7, and the annular shell 701 plays a role in balancing the airflow and exporting and inhaling it through the air outlet 702, and heating the blown airflow through the electric heating wire 704, circumferentially heating the packaging mold seat 102 and the chip material and the packaged material that have not been put down from the silicone suction soft cone head 1002, thereby achieving preheating, reducing the thermal stress problem caused by excessive temperature difference during the packaging process, indirectly improving a certain yield rate, and facilitating the spatial preheating of the closed inner side of the annular shell 701 and the support ring seat 703, which is convenient for cooperating with the packaging operation.

[0056] In another embodiment, Figures 1-7 As shown, the airflow processing mechanism 8 includes a semi-annular seat 801, and a plurality of concave limit frames 806 are fixedly installed on the inner side of the semi-annular seat 801. A pull-out sealing frame 804 is slidably installed on the inner side of the concave limit frame 806. A smoke filter 805 is fixedly installed on the inner side of the pull-out sealing frame 804. The pull-out sealing frame 804 is movable through the semi-annular seat 801 and extends to the top of the semi-annular seat 801. The end of the mounting frame 502 away from the two-way equivalent air outlet fan 501 is connected to the semi-annular seat 801. 1, the concave limit frame 806 is symmetrically distributed inside the semi-annular seat 801 with the mounting frame 502 as the base, and two electrically controlled telescopic rods 803 are fixedly installed at the bottom of the supporting circular plate 605. The tops of the two electrically controlled telescopic rods 803 are fixedly installed on the top of the annular shell 701. The semi-annular seat 801 is C-shaped, and both ends of the C-shaped semi-annular seat 801 are connected to an air outlet hose 802. The end of the air outlet hose 802 away from the semi-annular seat 801 is connected to the top of the annular shell 701.

[0057] When the bidirectional equivalent air outlet fan 501 is started, the airflow enters the inside of the semi-ring seat 801 through the connecting hose 503 and enters the inside of the ring-shaped shell 701 through the air outlet hose 802, is heated by the action of the electric heating wire 704, and is guided out through the air outlet hole 702, thereby achieving the uniform discharge of the airflow. When the bidirectional equivalent air outlet fan 501 blows air in the reverse direction, the airflow enters through the air outlet hole 702, at this time, the pin soldering of the chip packaging is carried out, a certain amount of smoke is generated, the airflow carries out the smoke, enters the air outlet hose 802 through the air outlet hole 702 and the guiding of the ring-shaped shell 701, enters the inside of the semi-ring seat 801 through the guiding of the air outlet hose 802, and finally is filtered through the smoke filter screen 805, thereby achieving the filtering of the smoke, avoiding the influence of the smoke on the operator and the visual system, ensuring the stability of the soldering, the overall use is convenient, and the yield is improved, and the product testing efficiency is improved.

[0058] Although embodiments of the present application have been shown and described, it is to be understood that various modifications, substitutions, replacements and changes can be made to these embodiments without departing from the principles and spirit of the present application, and the scope of the present application is defined by the appended claims and their equivalents.

Claims

1. A packaging device for semiconductor chip production, comprising a test bench (1), an airflow guide mechanism (5) and a pushing mechanism (6), characterized in that: The top of the test bench (1) is provided with a mounting groove (101), the top of the mounting groove (101) is fixed with a packaging mold seat (102) by bolts, and one side of the top of the test bench (1) is provided with a moving mechanism (2); The moving mechanism (2) comprises two support seats (203), the two support seats (203) are fixedly mounted on the top of the test bench (1), ball screws (201) are movably installed on the opposite sides of the two support seats (203) through bearings, one end of the ball screw (201) is transmission-connected to a servo motor (204), two slide rails (202) are fixedly mounted on the opposite sides of the two support seats (203), the outer side of the ball screw (201) is transmission-connected to a moving seat (205), a mechanical arm mechanism (3) is fixedly mounted on the top of the moving seat (205), and a lifting mechanism (4) is fixedly mounted on the movable end of the mechanical arm mechanism (3); The lifting mechanism (4) comprises an outer sleeve (401), an inner sleeve column (402) is movably sleeved on the inner side of the outer sleeve (401), an electrically controlled telescopic rod 2 (406) is fixedly installed on the top of the inner cavity of the outer sleeve (401), an installation cavity (403) is provided inside the inner sleeve column (402), a movable piston mechanism (12) is installed on the top of the inner cavity of the installation cavity (403), the movable piston mechanism (12) comprises an electrically controlled telescopic rod 5 (1201), a sealing piston (1202) is fixedly installed on the output end of the electrically controlled telescopic rod 5 (1201), a rotating support mechanism (9) is provided on the outer side of the inner sleeve column (402), a suction mechanism (10) is passed through the inner side of the rotating support mechanism (9), and an active rotating mechanism (11) is installed on the top of the rotating support mechanism (9); The suction mechanism (10) comprises a connecting branch pipe (1004), a mounting ring (1006) is fixedly mounted on the top of the connecting branch pipe (1004), a rotating seal (1005) is movably mounted on the inner side of the mounting ring (1006), a sealing cone ring (1007) is movably mounted on the top of the mounting ring (1006), the bottom of the connecting branch pipe (1004) is connected to an air suction shell (1001), a rubber elastic diaphragm (1003) is fixedly mounted on the inner wall of the air suction shell (1001), and the bottom of the air suction shell (1001) is connected to a plurality of silicone air suction soft cone heads (1002); The airflow guiding mechanism (5) comprises a bidirectional equivalent air outlet fan (501), a mounting frame (502) and a connecting hose (503); one end of the bidirectional equivalent air outlet fan (501) is connected to the inner side of the connecting hose (503); the bidirectional equivalent air outlet fan (501) is fixedly mounted on the top of the mounting frame (502); the mounting frame (502) is fixedly mounted on the top of the test bench (1); and one end of the connecting hose (503) away from the bidirectional equivalent air outlet fan (501) is connected to the airflow processing mechanism (8).

2. The semiconductor chip production packaging device according to claim 1, wherein: The servo motor 1 (204) is fixedly mounted on the top of the test bench (1), the bottoms of the two slide rails (202) are fixedly mounted on the top of the test bench (1), and the movable seat (205) is slidably sleeved on the outer sides of the slide rails (202).

3. The semiconductor chip production packaging device according to claim 1, wherein: The mechanical arm mechanism (3) includes a support column (304), the outer side of the bottom end of the support column (304) is movably sleeved with a bearing support (307), the bearing support (307) is fixedly installed on the top of the moving seat (205), the outer side of the support column (304) is fixedly sleeved with a driven transmission gear (303), the outer side of the driven transmission gear (303) is meshed with an active transmission gear (302), the bottom of the active transmission gear (302) is transmission-connected with a servo motor 2 (301), the servo motor 2 (301) is fixedly installed on the top of the moving seat (205), the top end of the support column (304) is rotatably hinged with a cross bar (305), the outer side of the cross bar (305) is rotatably hinged with an electric-controlled telescopic column 1 (306), and the end of the electric-controlled telescopic column 1 (306) away from the cross bar (305) is rotatably hinged on the outer side of the support column (304).

4. The semiconductor chip production packaging device according to claim 3, characterized in that: The outer sleeve (401) is fixedly mounted on the outside of the cross bar (305), the output end of the second electrically controlled telescopic rod (406) is fixedly mounted on the top of the inner sleeve (402), a pressure equalizing air hole (405) is provided on one side of the top of the outer sleeve (401), and a plurality of guide air channels (404) are provided on the top of the inner sleeve (402).

5. The semiconductor chip production packaging device according to claim 4, characterized in that: The electrically controlled telescopic rod five (1201) is fixedly mounted on the top of the inner cavity of the mounting cavity (403), the sealing piston (1202) is movably sleeved on the inner side of the mounting cavity (403), the pressure equalizing air hole (405) is connected to the interior of the outer sleeve (401), the top end of the guide air channel (404) is connected to the interior of the outer sleeve (401), and the bottom end of the guide air channel (404) is connected to the interior of the mounting cavity (403).

6. The semiconductor chip production packaging device according to claim 1, wherein: The rotation support mechanism (9) comprises a rotation shell (901), the inner side of the rotation shell (901) is sleeved with a support bearing (905), the inner side of the support bearing (905) is sleeved with a support ring plate (906), the inner side of the support ring plate (906) is fixedly sleeved on the outer side of the inner sleeve column (402), the top of the support ring plate (906) is movably mounted with a support block (902), the inner side of the support block (902) is provided with a plurality of ball grooves (903), the inner sides of the ball grooves (903) are all rollingly mounted with rolling balls (904), the ball grooves (903) and the rolling balls (904) are all uniformly distributed on the inner side of the support block (902) in a circular shape, and the bottoms of the support block (902), the ball grooves (903) and the rolling balls (904) are all in sliding contact with the top of the support ring plate (906).

7. The semiconductor chip packaging device according to claim 6, wherein: The connecting branch pipe (1004) is fixedly sleeved on the inner side of the rotating shell (901), the top end of the connecting branch pipe (1004) is rotatably inserted into the inner side of the installation cavity (403), the installation ring (1006) is movably sleeved on the inner side of the installation cavity (403), the sealing cone ring (1007) is fixedly installed on the inner side of the installation cavity (403), the bottom of the rotating seal (1005) is in rotational sealing contact with the top of the connecting branch pipe (1004), the silicone air-inhalation soft cone head (1002) is evenly distributed on the circumference of the bottom of the air-inhalation shell (1001), the silicone air-inhalation soft cone head (1002) is conical, and the outer edge of the bottom is provided with a rounded corner.

8. A semiconductor chip production packaging device according to claim 6 or 7, characterized in that: The active rotating mechanism (11) comprises a driven gear ring disc (1101), a driving gear disc (1102) and a servo motor three (1103), wherein the driven gear ring disc (1101) is fixedly mounted on the top of the rotating shell (901), the outer side of the driving gear disc (1102) is meshed and transmission-connected with the inner side of the driven gear ring disc (1101), the output end of the servo motor three (1103) is transmission-connected with the top of the driving gear disc (1102), the outer side of the servo motor three (1103) is fixedly sleeved with a fixed ring frame (1104), and the inner side of the fixed ring frame (1104) away from one end of the servo motor three (1103) is fixedly sleeved on the outer side of the inner sleeve column (402).

9. The semiconductor chip production packaging device according to claim 1, wherein: The pushing mechanism (6) includes a fixed plate (601), one side of the fixed plate (601) is fixedly mounted with an electric-controlled telescopic rod three (602), the output end of the electric-controlled telescopic rod three (602) is fixedly mounted with a push-pull frame (603), the top of the push-pull frame (603) away from one end of the electric-controlled telescopic rod three (602) is fixedly mounted with a support ring frame (604), the push-pull frame (603) is slidably mounted on the top of the test bench (1), the inner side of the top of the support ring frame (604) is fixedly mounted with a support circular plate (605), and the airflow processing mechanism (8) is fixedly mounted on the support ring frame (604). A preheating mechanism (7) is movably provided on the inner side of the push-pull frame (603) at the top of the circular plate (605). The preheating mechanism (7) comprises an annular shell (701). A plurality of air outlet holes (702) are provided on the inner side of the annular shell (701). The air outlet holes (702) are evenly distributed on the inner side of the annular shell (701) in a circular shape. A support ring seat (703) is fixedly installed on the bottom of the annular shell (701). The bottom of the support ring seat (703) is in sliding contact with the top of the test bench (1). A heating wire (704) is fixedly installed on the inner side of the annular shell (701).

10. The semiconductor chip production packaging device according to claim 9, characterized in that: The airflow handling mechanism (8) comprises a semi-annular seat (801), a plurality of groups of concave limiting frames (806) are fixedly installed on the inner side of the semi-annular seat (801), a pull-out sealing frame (804) is slidably installed on the inner side of the concave limiting frame (806), a smoke filter (805) is fixedly installed on the inner side of the pull-out sealing frame (804), the pull-out sealing frame (804) movably passes through the semi-annular seat (801) and extends to the top of the semi-annular seat (801), and one end of the mounting frame (502) away from the bidirectional equivalent air outlet fan (501) is connected to the semi-annular seat (801). The concave limit frame (806) is symmetrically distributed inside the semi-annular seat (801) with the mounting frame (502), and two electric-controlled telescopic rods (803) are fixedly installed on the bottom of the supporting circular plate (605). The tops of the two electric-controlled telescopic rods (803) are fixedly installed on the top of the annular shell (701). The semi-annular seat (801) is C-shaped, and both ends of the C-shaped semi-annular seat (801) are connected to an air outlet hose (802). The end of the air outlet hose (802) away from the semi-annular seat (801) is connected to the top of the annular shell (701).

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