Electronic package and fabrication method thereof

Abstract

An electronic package and a method of fabricating the same, including disposing a package module on a first surface of a carrier structure, and covering the package module with a shielding layer so that the shielding layer is formed on a partial region of a side surface of the carrier structure but not on another partial region of the side surface, therefore, the second surface of the bearing structure can be used as an antenna transmitting surface and / or an antenna receiving surface so as to prevent the shielding layer from interfering with receiving and transmitting of the bearing structure.

Description

Technical Field

[0001] The present invention relates to a semiconductor device, and more particularly to an electronic package applicable to communication products and a manufacturing method thereof. Background Art

[0002] Nowadays, wireless communication technology has been widely applied to various consumer electronic products (such as mobile phones, tablet computers, etc.) to facilitate the reception or transmission of various wireless signals. At the same time, to meet the portability and Internet access convenience of consumer electronic products, the manufacturing and design of wireless communication modules are developed towards the requirements of being light, thin, short, and small. Among them, the patch antenna is widely used in the wireless communication modules of electronic products due to its characteristics of small size, light weight, and easy manufacturing.

[0003] Figure 1 FIG. is a cross-sectional schematic view of a conventional wireless communication module. As Figure 1 shown, the wireless communication module 1 includes: a packaging substrate 10, a plurality of electronic components 11 disposed on the packaging substrate 10, an antenna structure 15, a shielding layer 14, and a packaging colloid 12. The electronic components 11 are disposed on the packaging substrate 10 and electrically connected to the packaging substrate 10. The antenna structure 15 is electrically connected to the electronic components 11. The package 12 covers the electronic components 11. The shielding layer 14 covers the packaging substrate 10 and the packaging colloid 12 to prevent electromagnetic interference (EMI).

[0004] However, in the existing wireless communication module 1, since the metal shielding layer 14 covers the side surface 10c of the packaging substrate 10, the shielding layer 14 shields the antenna structure 15, resulting in the ineffective operation of the antenna function of the antenna structure 15.

[0005] Therefore, how to overcome the problems of the above-mentioned prior art has actually become an urgent issue to be solved currently. Summary of the Invention

[0006] In view of the above-mentioned various deficiencies of the prior art, the present invention provides an electronic package, including: a carrier structure having opposite first and second surfaces and a side surface adjacent to the first and second surfaces, and the side surface is provided with a recess; a packaging module disposed on the first surface of the carrier structure; and a shielding layer disposed on the first surface of the carrier structure to cover the packaging module, wherein the shielding layer is also formed on a part of the area of the side surface of the carrier structure and not formed in the recess.

[0007] The present invention also provides a method for manufacturing an electronic package, including: disposing at least one encapsulation module on a carrier structure, wherein the carrier structure has opposite first and second surfaces and a side surface adjacent to the first and second surfaces, and the encapsulation module is disposed on the first surface of the carrier structure; forming a shielding layer on the first surface and the side surface of the carrier structure to cover the encapsulation module with the shielding layer; and forming a recess on the side surface of the carrier structure to remove a part of the shielding layer on the side surface of the carrier structure corresponding to the recess, so that the shielding layer is formed on a part of the side surface and not formed on the recess.

[0008] In the foregoing electronic package and its manufacturing method, a wiring layer is formed on the insulating material of the carrier structure to electrically connect the wiring layer to the encapsulation module.

[0009] In the foregoing electronic package and its manufacturing method, at least one electronic connector is disposed on the carrier structure. Further, it may include covering the electronic connector with a protective cover, then forming the shielding layer on the protective cover, and then removing the protective cover to remove the shielding layer on the protective cover together, so that the shielding layer is not formed on the electronic connector.

[0010] In the foregoing electronic package and its manufacturing method, the recess is adjacent to the second surface and the side surface, so that the appearance at the edge of the carrier structure is in a notch shape.

[0011] In the foregoing electronic package and its manufacturing method, the carrier structure is an antenna substrate. For example, the carrier structure has an antenna portion, and there is no shielding layer on the corresponding side surface.

[0012] In the foregoing electronic package and its manufacturing method, the shielding layer is not formed on the second surface of the carrier structure.

[0013] In the foregoing electronic package and its manufacturing method, the encapsulation module includes at least one electronic component electrically connected to the carrier structure and a coating layer covering the electronic component, so that the shielding layer is formed on the coating layer. For example, the encapsulation module further includes a circuit structure for carrying the electronic component, so that the circuit structure is disposed on the first surface of the carrier structure through a plurality of conductive components.

[0014] As can be seen from the above, in the electronic package and its manufacturing method of the present invention, mainly through the design that the shielding layer is formed on a part of the side surface of the carrier structure and not formed on another part of the side surface (i.e., the recess), the second surface of the carrier structure can be used as an antenna transmitting surface and / or an antenna receiving surface to avoid the shielding layer interfering with the reception and transmission of the carrier structure (or the antenna portion). Therefore, compared with the prior art, the electronic package of the present invention can effectively operate the antenna function, and thus can improve the antenna gain. Brief Description of the Drawings

[0015] Figure 1 Cross-sectional schematic diagram of an existing wireless communication module.

[0016] Figures 2A to 2D Cross-sectional schematic diagram of the manufacturing method of the electronic package of the present invention.

[0017] Figure 2C-1 is Figure 2C Cross-sectional schematic diagram of another method of

[0018] Figure 3 is Figure 2D Cross-sectional schematic diagram of another embodiment of

[0019] Description of main component symbols

[0020] 1 Wireless communication module

[0021] 10 Encapsulation substrate

[0022] 10c, 20c Sides

[0023] 11, 21 Electronic components

[0024] 12 Encapsulation colloid

[0025] 14, 24 Shielding layer

[0026] 15 Antenna structure

[0027] 2, 3 Electronic packages

[0028] 2a Encapsulation module

[0029] 20 Carrier structure

[0030] 20a First surface

[0031] 20b Second surface

[0032] 200 Insulating material

[0033] 201 Wiring layer

[0034] 22 Coating layer

[0035] 220 Groove

[0036] 23 Electronic connector

[0037] 240 Recess

[0038] 25 Antenna part

[0039] 250 Antenna layer

[0040] 26 Circuit structure

[0041] 260 Dielectric material

[0042] 261 Circuit layer

[0043] 27 Conductive element

[0044] 28 Protective cover Detailed implementation mode

[0045] The following illustrates the implementation mode of the present invention through specific specific examples. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification.

[0046] It should be noted that the structures, ratios, sizes, etc. shown in the attached drawings of this specification are only used to cooperate with the content disclosed in the specification for the understanding and reading of those skilled in the art, and are not used to limit the limiting conditions under which the present invention can be implemented. Therefore, they do not have technical substantial significance. Any modification of the structure, change of the proportional relationship or adjustment of the size, without affecting the effects that the present invention can produce and the purposes that can be achieved, should still fall within the scope covered by the technical content disclosed in the present invention. At the same time, the terms such as "upper", "first", "second", "one", etc. cited in this specification are only for the convenience of clear narration, and are not used to limit the scope under which the present invention can be implemented. The change or adjustment of their relative relationship should also be regarded as the scope under which the present invention can be implemented without substantial change of the technical content.

[0047] Figures 2A to 2D The figure is a schematic cross-sectional view of the manufacturing method of the electronic package 2 of the present invention.

[0048] As Figure 2A shown, a packaging module 2a is disposed on a carrier structure 20, and at least one electronic connector 23 is disposed on the carrier structure 20.

[0049] In this embodiment, as Figure 3 shown, the packaging module 2a may include at least one electronic component 21 electrically connected to the carrier structure 20 and a coating layer 22 covering the electronic component 21.

[0050] The carrier structure 20 is, for example, a packaging substrate with a core layer and a circuit structure or a circuit structure without a core layer, which has opposite first surface 20a and second surface 20b and a side surface 20c adjacent to the first surface 20a and the second surface 20b, so that the packaging module 2a is disposed on the first surface 20a of the carrier structure 20.

[0051] In this embodiment, as Figure 3As shown, a wiring layer 201 is formed on the insulating material 200 of the carrier structure 20, in accordance with the specifications of a fan out type redistribution layer (RDL). For example, the material forming the wiring layer 201 is copper, and the insulating material 200 is a dielectric material such as Polybenzoxazole (PBO), Polyimide (PI), Prepreg (PP), or a solder resist material such as green paint or ink.

[0052] The electronic component 21 is disposed on the first surface 20a of the carrier structure 20, and the electronic component 21 is an active component, a passive component, or a combination of both. Among them, the active component is, for example, a radio frequency semiconductor wafer, and the passive component is, for example, a resistor, a capacitor, and an inductor.

[0053] In this embodiment, the electronic component 21 can be electrically connected to the wiring layer 201 of the carrier structure 20 by a flip chip method, a wire bonding method, directly contacting the wiring layer 201 of the carrier structure 20, or other appropriate methods, without particular limitation.

[0054] The coating layer 22 is disposed on the first surface 20a of the carrier structure 20 to cover the electronic component 21.

[0055] In this embodiment, the coating layer 22 is an insulating material, such as polyimide (PI), dry film, an encapsulation colloid such as epoxy resin, or a molding compound, but is not limited to the above.

[0056] Furthermore, through a planarization process, the surface of at least one electronic component 21 is exposed on the surface of the coating layer 22 to make the surface of the coating layer 22 flush with the surface of the electronic component 21. For example, the planarization process removes part of the material of the electronic component 21 and part of the material of the coating layer 22 by grinding.

[0057] In addition, the encapsulation module 2a can also be configured with a circuit structure 26 for carrying the electronic component 21 as required, so that the circuit structure 26 is disposed on the first surface 20a of the carrier structure 20 through a plurality of conductive elements 27, and the coating layer 22 also covers the conductive elements 27. For example, the circuit structure 26 forms a circuit layer 261 on a dielectric material 260, such as in the specification of a fan out type redistribution layer (RDL). For example, the material for forming the circuit layer 261 is copper, and the dielectric material 260 is such as Polybenzoxazole (PBO), Polyimide (PI), Prepreg (PP), green paint, ink or others.

[0058] In addition, the electronic component 21 can be electrically connected to the circuit layer 260 of the circuit structure 26 by means of flip chip, wire bonding or other means, and the circuit layer 260 of the circuit structure 26 is electrically connected to the wiring layer 201 of the carrier structure 20 through the conductive elements 27.

[0059] As Figure 2B shown, at least one groove 220 is formed on the first surface 20a of the carrier structure 20.

[0060] In this embodiment, a semi-cutting method can be used to cut along the side surface 20c of the carrier structure 20 to form a stepped groove 220 on the first surface 20a of the carrier structure 20.

[0061] As Figure 2C shown, a shielding layer 24 is formed on the groove 220, the first surface 20a of the carrier structure 20, the encapsulation module 2a and the electronic connector 23.

[0062] In this embodiment, the shielding layer 24 is not formed on the second surface 20b of the carrier structure 20.

[0063] Furthermore, a shielding layer 24 such as a metal layer can be fabricated by means of sputtering, evaporation, electroplating, chemical plating or film laminating, etc., but is not limited to the above methods.

[0064] In addition, as Figure 2C-1 shown, the electronic connector 23 can be covered with a protective cover 28 first, and then the shielding layer 24 is formed on the protective cover 28 to facilitate the subsequent removal of the shielding layer 24 provided on the connector 23.

[0065] As Figure 2DAs shown, the shielding layer 24 on the electronic connector 23 is removed, and a recess 240 is formed on the side surface 20c of the carrier structure 20 to remove a part of the shielding layer 24 on the carrier structure 20 corresponding to the recess 240, so that a part of the side surface 20c of the carrier structure 20 has the shielding layer 24, while another part of the area (i.e., the surface of the recess 240) does not have the shielding layer 24.

[0066] In this embodiment, a semi-cutting method can be used to cut along the junction of the side surface 20c and the second surface 20b of the carrier structure 20 to form a stepped recess 240 at the junction of the second surface 20b and the side surface 20c of the carrier structure 20, so that the appearance of the edge of the carrier structure 20 is in a notch shape, such as an inverted L shape when viewed from the side at the edge.

[0067] Furthermore, if following Figure 2C-1 the shown process, by removing the protective cover 28, the shielding layer 24 on the protective cover 28 is removed together to expose the electronic connector 23, and the shielding layer 24 is not formed on the electronic connector 23.

[0068] In addition, as Figure 3 shown, the carrier structure 20 can be an antenna substrate, and an antenna portion 25 having an antenna layer 250 is formed inside it, so that the second surface 20b of the carrier structure 20 serves as the transmitting surface and / or receiving surface of the antenna portion 25, that is, the antenna portion 25 corresponds to the space of the carrier structure 25 surrounded by the recess 240, so that the side surface 20c corresponding to the transmitting end of the second surface 20b of the carrier structure 20 (i.e., the wall surface of the recess 240) has no shielding mechanism, while the side surface 20c corresponding to the signal transmission line (the contact of the wiring layer 201 on the first surface 20a) is provided with a shielding mechanism (shielding layer 24).

[0069] Therefore, the manufacturing method of the present invention mainly forms the shielding layer 24 only on a part of the area on the side surface 20c of the carrier structure 20, and does not form on another part of the area. Therefore, compared with the prior art, the electronic package 2, 3 of the present invention can use the second surface 20b of the carrier structure 20 as the antenna transmitting surface and / or antenna receiving surface to avoid the shielding layer 24 interfering with the reception and transmission of the carrier structure 20 (antenna portion 25), so that the electronic package 2, 3 of the present invention can effectively operate the antenna function, and thus can improve the antenna gain.

[0070] The present invention also provides an electronic package 2, 3, including: a carrier structure 20, at least one encapsulation module 2a, and a shielding layer 24.

[0071] The described carrier structure 20 has opposite first and second surfaces 20a and 20b and side surfaces 20c adjacent to the first and second surfaces 20a and 20b, and the side surfaces 20c are provided with recesses 240.

[0072] The described encapsulation module 2a is disposed on the first surface 20a of the carrier structure 20.

[0073] The shielding layer 24 is disposed on the first surface 20a of the carrier structure 20 to cover the encapsulation module 2a. Among them, the shielding layer 24 is also formed on a part of the area of the side surface 20c of the carrier structure 20 and is not formed on another part of the area of the side surface 20c (that is, the recess 240 is not provided with the shielding layer 24).

[0074] In an embodiment, a wiring layer 201 is formed on the insulating material 200 of the carrier structure 20 to electrically connect the wiring layer 201 to the encapsulation module 2a.

[0075] In an embodiment, at least one electronic connector 23 is disposed on the carrier structure 20. For example, the shielding layer 24 is not formed on the electronic connector 23.

[0076] In an embodiment, the recess 240 is adjacent to the second surface 20b and the side surface 20c, so that the appearance at the edge of the carrier structure 20 is in the shape of a notch.

[0077] In an embodiment, the carrier structure 20 is an antenna substrate. For example, the carrier structure 20 has an antenna portion 25 corresponding to the position of the recess 240, and the shielding layer 24 is not provided on the side surface 20c corresponding to the antenna portion 25.

[0078] In an embodiment, the shielding layer 24 is not formed on the second surface 20b of the carrier structure 20.

[0079] In an embodiment, the encapsulation module 2a includes at least one electronic component 21 electrically connected to the carrier structure 20 and a coating layer 22 covering the electronic component 21, so that the shielding layer 24 is formed on the coating layer 22. For example, the encapsulation module 2a further includes a circuit structure 26 carrying the electronic component 21, so that the circuit structure 26 is disposed on the first surface 20a of the carrier structure 20 through a plurality of conductive elements 27.

[0080] In summary, for the electronic package and its manufacturing method of the present invention, the shielding layer is formed only on a part of the side surface of the carrier structure, and not on another part of the area (the area provided with the recess), so that the second surface of the carrier structure (corresponding to the position of the recess) of the electronic package of the present invention can be used as the antenna transmitting surface and / or the antenna receiving surface, so as to avoid the shielding layer interfering with the reception and transmission of the carrier structure (or the antenna part). Therefore, the electronic package of the present invention can effectively operate the antenna function, and thus can improve the antenna gain.

[0081] The above embodiments are only used to illustrate the principles and effects of the present invention by way of example, and are not used to limit the present invention. Any person skilled in the art can modify the above embodiments without departing from the inventive concept and scope of the present invention. Therefore, the scope of the protection of the rights of the present invention shall be as listed in the claims.

Claims

1. An electronic package, which comprises: a carrier structure having opposite first and second surfaces and side surfaces adjacent to the first and second surfaces, and a recess is provided on the side surfaces; a packaging module disposed on the first surface of the carrier structure; and a shielding layer disposed on the first surface of the carrier structure to cover the packaging module, wherein the shielding layer is also formed on a part of the side surface of the carrier structure and not formed in the recess.

2. The electronic package according to claim 1, wherein a wiring layer is formed on the insulating material of the carrier structure to electrically connect the wiring layer to the packaging module.

3. The electronic package according to claim 1, wherein at least one electronic connector is disposed on the carrier structure.

4. The electronic package according to claim 3, wherein the shielding layer is not formed on the electronic connector.

5. The electronic package according to claim 1, wherein the recess is adjacent to the second surface and the side surface, so that the appearance at the edge of the carrier structure is in a notch shape.

6. The electronic package according to claim 1, wherein the carrier structure is an antenna substrate.

7. The electronic package according to claim 6, wherein the carrier structure has an antenna portion, and the shielding layer is not provided on the corresponding side surface.

8. The electronic package according to claim 1, wherein the shielding layer is not formed on the second surface of the carrier structure.

9. The electronic package according to claim 1, wherein the packaging module includes at least one electronic component electrically connected to the carrier structure and a coating layer covering the electronic component, so that the shielding layer is formed on the coating layer.

10. The electronic package according to claim 9, wherein the packaging module further includes a circuit structure for carrying the electronic component, so that the circuit structure is disposed on the first surface of the carrier structure through a plurality of conductive elements.

11. A manufacturing method of an electronic package, comprising: disposing at least one packaging module on a carrier structure, wherein the carrier structure has opposite first and second surfaces and side surfaces adjacent to the first and second surfaces, and the packaging module is disposed on the first surface of the carrier structure; forming a shielding layer on the first surface and the side surface of the carrier structure to cover the packaging module; and forming a recess on the side surface of the carrier structure to remove a part of the shielding layer on the side surface of the carrier structure corresponding to the recess, so that the shielding layer is formed on a part of the side surface and not formed in the recess.

12. The manufacturing method of the electronic package according to claim 11, wherein a wiring layer is formed on the insulating material of the carrier structure to electrically connect the wiring layer to the packaging module.

13. The manufacturing method of the electronic package according to claim 11, wherein at least one electronic connector is disposed on the carrier structure.

14. The manufacturing method of the electronic package according to claim 13 further includes covering the electronic connector with a protective cover, then forming the shielding layer on the protective cover, and then removing the protective cover to remove the shielding layer on the protective cover together, so that the shielding layer is not formed on the electronic connector.

15. The manufacturing method of the electronic package according to claim 11, Among them, the concave portion is adjacent to the second surface and the side surface, so that the appearance at the edge of the carrier structure is in the shape of a notch.

16. The method for manufacturing an electronic package according to claim 11, wherein, the carrier structure is an antenna substrate.

17. The method for manufacturing an electronic package according to claim 16, wherein, the carrier structure has an antenna portion, and there is no shielding layer on the corresponding side surface.

18. The method for manufacturing an electronic package according to claim 11, wherein, the shielding layer is not formed on the second surface of the carrier structure.

19. The method for manufacturing an electronic package according to claim 11, wherein, the packaging module includes at least one electronic component electrically connected to the carrier structure and a coating layer covering the electronic component, so that the shielding layer is formed on the coating layer.

20. The method for manufacturing an electronic package according to claim 19, wherein, the packaging module further includes a circuit structure for carrying the electronic component, so that the circuit structure is disposed on the first surface of the carrier structure through a plurality of conductive elements.

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