Conductor crimping structure for connection terminal

By designing a two-layer structure crimp sheet with a void and a pressing portion, the conductor composed of a single line is tightened, and the problem of poor tightening of the conductor in the prior art is solved, high-reliability mechanical and electrical connection is achieved, and oxide and sulfide film are removed.

CN120049216APending Publication Date: 2025-05-27UNION MACHINERY CO LTD +1
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Patent Information

Application Number
CN202411636763.5
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Priority Date
2024-03-13
Filing Date
2024-11-15
Publication Date
2025-05-27

AI Technical Summary

Technical Problem

The prior art is difficult to effectively fasten and fix extremely thin conductors composed of single lines, resulting in mechanical and electrical problems, and oxides and sulfides are difficult to remove.

Method used

Using a crimping piece with two-layer structure, the conductor composed of a single line is tightened through the design of the void and pressing portion, ensuring mechanical fixing force and electrical conductivity, and destroying the oxide and sulfide film through multi-point contact.

Benefits of technology

Effective tightening and fixing of single-wire conductors is achieved, mechanical and electrical reliability is improved, and oxide and sulfide films are effectively removed.

✦ Generated by Eureka AI based on patent content.

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Abstract

And the conductor of the single wire is firmly crimped and fixed through the conductor crimping part, so that the reliability of electrical connection is ensured. In the conductor crimping part (3), a first crimping piece (3e) and a second crimping piece (3f) of a two-layer structure of an inner layer plate (3b) and an outer layer plate (3a) are erected in a U shape in advance. In addition, gap portions (3c, 3d) are formed between the outer layer plate (3a) and the inner layer plate (3b) at the folded-back portions of the first crimping pieces (3e) and the second crimping pieces (3f). A conductor (6) composed of a single wire is disposed between a first crimping piece (3e) and a second crimping piece (3f), and an outer layer plate (3a) and an inner layer plate (3b), particularly the first crimping piece (3e) and the second crimping piece (3f), are crushed by a pressing upper die (Pu) and a pressing lower die (Pd) of a conductor crimping device, thereby fastening and fixing the conductor (6) from the periphery. Non-pressing portions (3n, 3o, 3p) are provided between the conductor (6) and the inner layer plate (3b) between the pressing portions (3k, 3l, 3m), and the pressing portions (3k, 3l, 3m) are in contact with the conductor (6) while applying a pressing force toward the center of the conductor (6) from below and pressing forces in both directions toward the center of the conductor (6) from obliquely above during the fastening.
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Description

Technical Field

[0001] The present invention relates to a conductor crimping structure for a small connection terminal. The small connection terminal is, for example, installed in a connector housing and is fitted with a connection terminal of an object-side connector. Background Art

[0002] With the miniaturization, light weight, and integration of electrical components, smaller connection terminals are constantly required for use in circuit connections. Therefore, in response to the conductors of wires that have become thinner, a crimping connection terminal is disclosed in, for example, the patent document of Japanese Patent Application Laid-Open No. 2020-71920.

[0003] In the crimping connection terminal of the patent document, the crimping piece is made into a two-layer structure, and a gap portion is formed between the two-layer crimping pieces. For a thin conductor composed of a stranded wire of multiple stranded core wires, an excessive tightening force is not applied to cause excessive deformation or the like, but is fixed by a tightening force having an appropriate resilience to maintain this gap portion. Thus, the thin conductor can be reliably crimped and connected.

[0004] In the past, since the conductor crimped to the crimping connection terminal was almost a stranded wire of multiple stranded core wires, the conductor itself had a certain degree of flexibility and plasticity. Therefore, as long as the crimping connection terminal provided with a gap portion in the above patent document is used and the conductor composed of a stranded wire is crimped by a tightening force having an appropriate resilience, even if the conductor is a thin wire, it will not be deformed unnaturally, and the electrical characteristics such as conductivity and the mechanical characteristics such as drawing will not be deteriorated. Summary of the Invention

[0005] [Problems to be Solved by the Invention]

[0006] However, in recent years, mainly from the economic point of view, a single metal wire such as a copper alloy is tried as a conductor for a signal wire connected to a connection terminal, and an extremely thin wire with a diameter of about 0.25 mm to 0.6 mm is made.

[0007] When connecting such a thin conductor composed of a single wire by a conventional terminal crimping piece, generally, the cross section becomes a crimping structure as Figure 12 shown. However, different from the conductor composed of a stranded wire, the single-wire conductor a lacks flexibility and plasticity and is similar to a rigid body. Therefore, in particular, for the thin conductor a, even if it is fixed by the crimping piece b, the crimping piece b does not necessarily tighten the periphery of the conductor a with an equal tightening force, and sufficient mechanical fixing force and conductivity are not necessarily obtained.

[0008] Moreover, when using a thin-diameter conductor composed of a single wire, even if a crimp connection terminal having a void portion as in the above-mentioned patent document is used, it is often impossible to crimp the conductor well, thus easily causing mechanical problems and electrical problems. On the other hand, for a general conductor composed of stranded wires, oxides and sulfides that are generated on the surface of the conductor and become electrical obstacles are easily removed by being broken during crimping. However, in a thin-diameter conductor composed of a single wire, there is a problem that it is extremely difficult to remove these oxides and sulfides.

[0009] An object of the present invention is to solve the above problems and provide a conductor crimping structure for a connection terminal, which can firmly fasten a conductor composed of a single wire and thus achieve good fixing force and conductivity.

[0010] [Means for Solving the Problems]

[0011] A conductor crimping structure for a connection terminal, wherein the connection terminal uses a crimp connection terminal having a pair of crimping pieces to fasten and fix a circular-section conductor composed of a single metal wire through the crimping pieces. The crimping pieces are formed by punching a conductive metal plate and bending it to form a conductor crimping portion and then standing up in a U-shape from the bottom of the conductor crimping portion. Each of the crimping pieces has a two-layer structure composed of an outer layer plate and an inner layer plate, and the inner layer plate is laminated on the outer layer plate by folding back inward from a folding-back portion at the upper end of the outer layer plate. Void portions are respectively provided inside the folding-back portions between the outer layer plate and the inner layer plate, and the folding-back portions are located above, below, left, and right with respect to the bottom. Between the inner layer plate and the conductor, there are provided: three pressing portions formed by deforming the inner layer plate by pressing forces in three directions concentrated from the bottom and a pair of the void portions toward the center of the conductor; and three non-pressing portions formed between the three pressing portions.

[0012] [Effects of the Invention]

[0013] According to the conductor crimping structure for a connection terminal of the present invention, the void portions provided in the crimping pieces of the two-layer structure are used to fasten the conductor composed of a single wire, and three pressing portions are provided, and the pressing portions concentrate a locally strong pressing force on the conductor. Moreover, non-pressing portions formed by voids or non-pressing portions that do not apply a pressing force to the conductor even when in contact are provided between the three crimping pieces adjacent to the pressing portions and the conductor. Thus, the conductor can be fixed by firm fastening, thereby obtaining mechanical reliability and electrical reliability. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 is a perspective view of the crimp connection terminal used.

[0015] Figure 2 is a top view of the punched conductive metal plate.

[0016] Figure 3 It is a perspective view of the conductor crimping portion in one step of the bending step.

[0017] Figure 4 It is a cross-sectional view taken horizontally of the state where the crimping piece at the front of the crimping is erected in a U shape.

[0018] Figure 5 It is a cross-sectional view taken horizontally of the state where the crimping piece at the rear of the crimping is erected in a U shape.

[0019] Figure 6 It is an explanatory view of the state where the conductor is disposed within the first crimping piece and the second crimping piece at the front of the crimping.

[0020] Figure 7 It is a cross-sectional structural view of the first crimping step at the front of the crimping.

[0021] Figure 8 It is a cross-sectional structural view of the second crimping step at the front of the crimping.

[0022] Figure 9 It is a cross-sectional structural view of the third crimping step at the front of the crimping.

[0023] Figure 10 It is a cross-sectional structural view of the fourth crimping step at the front of the crimping.

[0024] Figure 11 It is a perspective view of the crimping connection terminal in the state where the conductor and the insulating coating portion are crimped and fixed.

[0025] Figure 12 It is a cross-sectional view of the crimping and fixing structure of the conventional single-wire conductor. Detailed implementation mode

[0026] Figure 1 It is a perspective view of the crimping connection terminal 1 of the embodiment used for the conductor crimping structure of the connection terminal of the present invention. This crimping connection terminal 1 is formed, for example, of a thin brass plate with a thickness of 0.1 mm. A single conductive metal plate is punched and bent to form a connection portion, a crimping portion, etc. The conductive metal plate has copper plating, tin plating, etc. previously applied to both surfaces.

[0027] On the front side of the crimp connection terminal 1, a connection part 2, which is a male insertion part for example, is formed, and the connection part 2 is connected to the connection terminal of the mating connector; and, a conductor crimp part 3 and a covering crimp part 4 are arranged in sequence on the rear side along the length direction. In addition, the conductor crimp part 3 is divided into a front crimp part 3X and a rear crimp part 3Y from the front. Although a stabilizer or a locking part etc. are attached to the actual crimp connection terminal 1, illustration of these well-known mechanisms is omitted; the stabilizer is used to stabilize the posture in the accommodated connector housing, and the locking part is used to prevent the connector housing from falling off in the front-rear direction.

[0028] Figure 2 It is a top view of the state of the conductive metal plate before being punched and formed into the crimp connection terminal 1. The connection part 2, the conductor crimp part 3, and the covering crimp part 4 are planarized and divided as components. In addition, Figure 2 in [it], the entire length of the connection part 2 is omitted.

[0029] Behind the covering crimp part 4, there is provided: a transfer piece 5a for connecting the crimp connection terminals 1 in the punched state to each other. The covering crimp part 4 at the rear end of each crimp connection terminal 1 is connected to the transfer piece 5a via a connecting piece 5b. In addition, a guiding hole 5c is provided in the transfer piece 5a, which is used to intermittently convey the conductive metal plate during the subsequent forming steps of the crimp connection terminal 1.

[0030] The thus punched conductive metal plate is conveyed in the length direction of the conductive metal plate through the transfer piece 5a after chamfering or surface treatment according to necessity for example. In each forming step performed by a forming press, the connection part 2, the conductor crimp part 3, and the covering crimp part 4 are bent in sequence and formed into Figure 1 the crimp connection terminal 1 shown. Then, after this forming, the connecting piece 5b is cut off, thereby separating into individual crimp connection terminals 1.

[0031] As Figure 1 , Figure 2 shown, in the connection part 2, a rod-shaped male insertion end with the following two-layer structure is made: the folding pieces 2b, 2c of the upper plate made of the conductive metal plate are folded upward along the dotted line from both sides of the bottom plate 2a of the lower plate made of the conductive metal plate, and the ends of the folding pieces 2b, 2c are butted against each other. In addition, there are also cases where: the connection part 2 is made into other male shapes, or the connection part 2 is made into a female receiving connection part.

[0032] Figure 2As shown, the front crimping part 3X and the rear crimping part 3Y of the conductor crimping part 3 are respectively composed of an outer layer board 3a and two inner layer boards 3b. The outer layer board 3a is arranged in the center, and the two inner layer boards 3b extend from both sides of this outer layer board 3a in the width direction and have different lengths in the width direction. The two dotted lines in the length direction of the conductor crimping part 3 indicate the positions where the inner layer board 3b is folded back inward from the outer layer board 3a in the bending step described later.

[0033] Figure 3 It is a perspective view of the conductor crimping part 3 in one step of the bending step. In the front crimping part 3X and the rear crimping part 3Y, the following two-layer structure is formed: the inner layer board 3b is folded back inward in an arc shape from the upper end part of the outer layer board 3a at the folding-back part and laminated. Then, the inner layer board 3b on one side of the front crimping part 3X extends longer, and the width of the inner layer board 3b on the other side is set to be longer in the rear crimping part 3Y. Moreover, between the outer layer board 3a and the inner layer board 3b at the folding-back parts of the front crimping part 3X and the rear crimping part 3Y, void parts 3c, 3d are respectively formed along the length direction, and the cross section is, for example, a water droplet shape, a balloon shape, a circular shape, an elliptical shape, etc. In addition, the void part 3c of the front crimping part 3X communicates with the void part 3d of the rear crimping part 3Y, and the void part 3d of the front crimping part 3X communicates with the void part 3c of the rear crimping part 3Y.

[0034] In the next bending step, as Figure 4 and Figure 5 shown, in the front crimping part 3X and the rear crimping part 3Y, the outer layer boards 3a and the inner layer boards 3b on both sides are respectively made into a first crimping piece 3e and a second crimping piece 3f and erected in a U shape obliquely upward. The inner layer board 3b on the side of the first crimping piece 3e of the front crimping part 3X faces downward from the folding-back part of the upper end part of the outer layer board 3a, and the edge part 3g covers the bottom part formed by the outer layer board 3a, and extends upward along the outer layer board 3a until approximately the middle position of the erected part of the second crimping piece 3f.

[0035] On the other hand, the inner layer board 3b on the side of the second crimping piece 3f faces downward from the folding-back part of the upper end part of the outer layer board 3a, and the edge part 3h extends shorter until approximately the middle position of the erected part of the second crimping piece 3f. Then, a gap 3i is formed between the edge parts 3g, 3h of the inner layer board 3b along the upper part of the outer layer board 3a.

[0036] The rear crimping part 3Y is bent in the same way as the front crimping part 3X, but is made symmetric about the left and right with the front crimping part 3X. The reason for making the front crimping part 3X and the rear crimping part 3Y symmetric about the left and right is as follows. That is, if the length of the conductor crimping part 3 is increased, it is used to prevent the crimping force on the conductor from being easily uneven left and right in the crimping step described later, so that the crimping connection terminal 1 twists and the crimping force is applied equally left and right.

[0037] When crimping and connecting the conductor of a single wire through the conductor crimping portion 3, first, as Figure 6 shown, the conductor 6 in a state where the insulating coating portion has been stripped is processed using a conductor crimping device; the conductor 6 is composed of a metal wire, and the metal wire is, for example, a copper alloy with a diameter of, for example, 0.32 mm. The conductor 6 is inserted between the first crimping piece 3e and the second crimping piece 3f of the front crimping portion 3X of the conductor crimping portion 3 and placed on the bottom 3j of the inner layer board 3b. In addition, the same conductor 6 is also simultaneously and similarly crimped in the rear crimping portion 3Y, but only the subsequent crimping steps for the front crimping portion 3X will be described.

[0038] In the crimping step of the conductor 6 performed by the conductor crimping device, between Figure 7 the upper punching die Pu acting from above as shown and the lower punching die Pd acting from below, the first crimping piece 3e and the second crimping piece 3f on which the conductor 6 is placed are arranged. Then, the upper punching die Pu is lowered and the lower punching die Pd is raised relatively. In addition, the upper punching die Pu and the lower punching die Pd act without distinguishing between the front crimping portion 3X and the rear crimping portion 3Y.

[0039] As Figure 7 shown, in the first crimping step performed by the upper punching die Pu and the lower punching die Pd, the first crimping piece 3e and the second crimping piece 3f are deformed in a manner that wraps around the conductor 6 according to the shapes of the upper punching die Pu and the lower punching die Pd. During this crimping process, the first crimping piece 3e and the second crimping piece 3f are tightened, thereby reducing the gap 3i between the edge portions 3g and 3h of the inner layer board 3b and also reducing the void portions 3c and 3d. Moreover, the side surface of the outer layer board 3a is erected by the upper punching die Pu, and the bottom of the outer layer board 3a and the bottom 3j of the inner layer board 3b are deformed from a U shape to a flat shape along the lower punching die Pd.

[0040] Moreover, as Figure 8 shown, in the second crimping step of the operation of the upper punching die Pu and the lower punching die Pd, a stronger tightening force is applied to the first crimping piece 3e and the second crimping piece 3f, thereby deforming the first crimping piece 3e and the second crimping piece 3f in a manner that more tightly wraps around the conductor 6. At this time, a pressing force is applied to the conductor 6 from three directions mainly indicated by arrows, that is, a pressing force on the conductor 6 from the direction of the bottom 3j toward the center of the conductor 6 and pressing forces on the conductor 6 from two directions of the upper left and upper right diagonals toward the center of the conductor 6. Then, the angles of these three directions of the pressing forces are made at approximately 120-degree intervals.

[0041] As Figure 9As shown, it is further fastened through the third crimping step, thereby increasing the thickness of the outer layer board 3a and the inner layer board 3b in the first crimping piece 3e and the second crimping piece 3f and further reducing the size of the gap portions 3c and 3d. Through this fastening process, the pressing force exerted by the upper stamping die Pu and the lower stamping die Pd is particularly locally concentrated from the above three directions. At three places where this pressing force is concentrated, there are provided pressing portions 3k, 3l, and 3m for the inner layer board 3b to contact the conductor 6; and non-pressing portions 3n, 3o, and 3p are provided at three places of the conductor 6 along between the pressing portions 3k, 3l, and 3m. These non-pressing portions 3n, 3o, and 3p do not exert a pressing force on the conductor 6 from the inner layer board 3b, and a gap is formed between the inner layer board 3b and the conductor 6 in this portion.

[0042] That is to say, the pressing force for fixing the conductor 6 to the outer peripheral surface of the conductor 6 is concentrated at three places, thereby breaking and removing the film composed of oxides and sulfides in this part of the conductor 6 in the pressing portions 3k, 3l, and 3m, so as to improve the reliability of the electrical connection with the inner layer board 3b.

[0043] Before the pressing portions 3k, 3l, and 3m and the non-pressing portions 3n, 3o, and 3p are formed between the inner layer board 3b and the conductor 6 through the pressing by the upper stamping die Pu and the lower stamping die Pd, the following phenomena generally occur.

[0044] The outer layer board 3a is deformed by the pressing force exerted by the upper stamping die Pu and the lower stamping die Pd. If it exceeds the yield point, plastic deformation occurs. Therefore, even if the pressing by the upper stamping die Pu and the lower stamping die Pd is released, the outer layer board 3a will not return to its original shape. In contrast, the inner layer board 3b receives the pressing force exerted by the upper stamping die Pu and the lower stamping die Pd through the outer layer board 3a. In the part of the inner layer board 3b extending along the outer layer board 3a, it is plastically deformed into the shape along the outer layer board 3a.

[0045] In addition, in the part of the inner layer board 3b extending along the gap portions 3c and 3d, the pressing force applied to the inner layer board 3b through the outer layer board 3a is used to reduce the gap 3i between the edge portions 3g and 3h of the inner layer board 3b and then used to reduce the gap portions 3c and 3d after consumption. Therefore, even if the pressing force applied to the outer layer board 3a exceeds the yield point of the outer layer board 3a, the pressing force applied to the inner layer board 3b will not immediately exceed the yield point of the inner layer board 3b. Therefore, by utilizing the difference in the application method of the pressing force existing between the outer layer board 3a and the inner layer board 3b in this way, all plastic deformations of the inner layer board 3b are not caused in the deformation generated in the inner layer board 3b, and a part with elastic deformation can be left.

[0046] Therefore, after the pressing on the upper stamping die Pu and the lower stamping die Pd is released, an elastic restoring force is generated in the inner layer plate 3b. This elastic restoring force is used to expand the gap portions 3c and 3d, which have shrunk due to elastic deformation, back to their original size. This elastic restoring force is used to push back the portions of the inner layer plate 3b extending along the gap portions 3c and 3d in a direction away from the outer layer plate 3a, that is, in an inward direction. At this time, the inner layer plate 3b to be pushed back in the inward direction contacts and presses the conductor 6, and the inner layer plate 3b contacts the conductor 6 with an applied pressure, causing the conductor 6 to be crimped between the inner layer plates 3b.

[0047] Then, this embodiment combines the first crimping piece 3e and the second crimping piece 3f that can be fastened in this way with the conductor 6 composed of a single wire, thereby obtaining the following functions and effects.

[0048] In the case where the conductor is a stranded wire formed by stranding multiple core wires, since there are gaps between the core wires, when the conductor is pressed by the inner layer plate 3b, the core wires move in such a way as to fill the gaps between them. As a result, the overall shape of the conductor changes into a shape along the space surrounded by the inner layer plate 3b. Therefore, since the pressing force from the inner layer plate 3b is used to move the core wires, the pressing force received by each core wire from the inner layer plate 3b is smaller than in the case where the conductor is composed of a single wire. Accordingly, the degree of damage to the film such as oxides covering the surfaces of the core wires is also smaller.

[0049] In contrast, in the case where the conductor 6 is a single wire, since there is no movement of each core wire as in the case where the conductor is a stranded wire formed by stranding multiple core wires, the pressing force from the inner layer plate 3b is concentrated and continuously applied to three places on the conductor 6. As a result, although the contact area between the conductor 6 and the inner layer plate 3b becomes smaller, the three pressing portions 3k, 3l, and 3m where the conductor 6 contacts the inner layer plate 3b can contact with a relatively large applied pressure, thereby obtaining sufficient mechanical properties and electrical properties, and even being able to break and remove the film composed of oxides and the like.

[0050] The above functions and effects cannot be predicted from the case of using a stranded wire as the conductor, but are newly discovered in the present invention using the single-wire conductor 6. That is, in the case of using a stranded wire as the conductor, the contact is made with the circumferential surface in the cross-section; in contrast, in the case of using a single wire as the conductor, the contact is made at multiple points, so the concepts of the two are different.

[0051] As Figure 10As shown, in the fourth step, in addition to the gap portions 3c and 3d, three non-pressing portions 3n, 3o, and 3p are provided between the upper and lower sides of the conductor 6 and the inner layer board 3b, and the conductor 6 is fastened by the outer layer board 3a and the inner layer board 3b. A conductor crimping structure for a connection terminal with smaller gap portions 3c, 3d and non-pressing portions 3n, 3o, and 3p is obtained. With this structure, the conductor 6 is firmly fastened while maintaining elasticity, thereby ensuring electrical reliability and mechanical reliability.

[0052] In addition, in the covering crimping portion 4, by means of a covering crimping device interlocked with the above-described conductor crimping device, the outer sides of the insulating covering portion 7 are fastened by a pair of covering crimping pieces 4a and 4b of the covering crimping portion 4, whereby the side portions 4c and 4d are crimped in a manner of biting into the insulating covering portion 7. Thus, the insulating covering portion 7 is fixed by the covering crimping portion 4, and thus the pulling force acting on the electric wire can be resisted.

[0053] In addition, Figure 10 when the conductor 6 is fastened and crimped and fixed by the pressing portions 3k, 3l, and 3m, non-pressing portions 3n, 3o, and 3p with gaps are formed. However, even when the inner layer board 3b is brought into contact with the conductor 6, the non-pressing portions 3o and 3p among the non-pressing portions 3n, 3o, and 3p can be set in a non-pressing state.

[0054] That is to say, it is also possible to bring the inner layer board 3b into contact with the conductor 6 so as not to generate a gap for the non-pressing portions 3o and 3p and only generate a gap for the non-pressing portion 3n. The non-pressing portion 3n is formed between the left obliquely downward direction of the pressing force from the gap portion 3c and the right obliquely downward direction of the pressing force from the gap portion 3d. The non-pressing portion 3o is formed between the upward direction of the pressing force from the bottom portion 3j and the left obliquely downward direction of the pressing force from the gap portion 3c. The non-pressing portion 3p is formed between the upward direction of the pressing force from the bottom portion 3j and the right obliquely downward direction of the pressing force from the gap portion 3d. It is even possible to bring the inner layer board 3b into contact with the conductor 6 in a non-pressing state so as not to generate a gap for all of the non-pressing portions 3n, 3o, and 3p.

[0055] Figure 11 Shows a state in which the conductor 6 is crimped and connected by the front crimping portion 3X and the rear crimping portion 3Y of the conductor crimping portion 3, and the insulating covering portion 7 is crimped and fixed by the covering crimping pieces 4a and 4b in the covering crimping portion 4.

[0056] In addition, in the embodiment, the conductor crimping portion 3 is provided with a front crimping portion 3X and a rear crimping portion 3Y separately before and after, but it is also possible to form the entire conductor crimping portion 3 into the shape of only one of the front crimping portion 3X and the rear crimping portion 3Y without such separation. In addition, the length of the inner layer board 3b can be made equal on the left and right.

[0057] Moreover, in the embodiment, the void portions 3c and 3d are formed in the crimp connection terminal 1 in advance. However, during the conductor crimping step, the void portions 3c and 3d can also be formed between the outer layer plate 3a and the inner layer plate 3b by the shape of the upper stamping die Pu.

[0058] In the figure:

[0059] 1: Crimp connection terminal

[0060] 2: Connection portion

[0061] 2a: Bottom plate

[0062] 2b, 2c: Folded-back pieces

[0063] 3: Conductor crimping portion

[0064] 3a: Outer layer plate

[0065] 3b: Inner layer plate

[0066] 3c, 3d: Void portions

[0067] 3e: First crimping piece

[0068] 3f: Second crimping piece

[0069] 3g, 3h: Edge portions

[0070] 3i: Gap

[0071] 3j: Bottom

[0072] 3k, 3l, 3m: Pressing portions

[0073] 3n, 3o, 3p: Non-pressing portions

[0074] 3X: Front crimping portion

[0075] 3Y: Rear crimping portion

[0076] 4: Coated crimping portion

[0077] 4a, 4b: Coated crimping pieces

[0078] 4c, 4d: Side portions

[0079] 5: Conductive metal plate

[0080] 5a: Transfer piece

[0081] 5b: Connecting piece

[0082] 5c: Guide hole

[0083] 6, a: Conductor

[0084] 7: Insulating coating portion

[0085] b: Crimping piece

[0086] Pd: Lower stamping die

[0087] Pu: Upper stamping die

Claims

1. A conductor crimping structure for a connection terminal, wherein the connection terminal uses a crimping connection terminal having a pair of crimping pieces, and a conductor with a circular cross section composed of a single metal wire is fastened and fixed by the crimping pieces, wherein the crimping pieces are formed by punching and bending a conductive metal plate, and the conductor crimping portion is formed by rising up in a U shape from the bottom of the conductor crimping portion, characterized in that ; Each of the crimping sheets is a two-layer structure consisting of an outer layer plate and an inner layer plate, wherein the inner layer plate is folded inward from a folded portion at an upper end of the outer layer plate and is stacked on the outer layer plate; The gaps are respectively arranged inside the folded portion between the outer plate and the inner plate, and the folded portion is located at the top, bottom, left and right relative to the bottom; Between the inner layer plate and the conductor there is: Three pressing portions are formed by applying pressing forces from the bottom and the pair of gaps toward the center of the conductor to deform the inner layer plate; and Three non-pressing portions are formed between the three pressing portions.

2. The conductor crimping structure of the connection terminal according to claim 1, characterized in that: When the conductor is contact-fastened and crimp-fixed by the three pressing portions with the biasing forces from the three directions, gaps are generated between the conductor at the three non-pressing portions and the inner layer board.

3. The conductor crimping structure of the connection terminal according to claim 1, characterized in that: In at least two of the three non-pressing portions formed on both oblique sides of the bottom, the inner layer board contacts the conductor in a non-pressing state.

4. The conductor crimping structure of the connection terminal according to claim 1, characterized in that: The pressing forces in the three directions are applied to the conductor from directions spaced approximately 120 degrees apart.

5. The conductor crimping structure of the connection terminal according to claim 1, characterized in that: The gap portion provided between the outer layer plate and the inner layer plate is formed in advance in the crimp connection terminal.

Citation Information

Patent Citations

  • Crimp connection terminal

    JP2020071920A