PCBA (printed circuit board assembly) repair equipment

Abstract

The invention provides PCBA board repairing equipment, and relates to the technical field of repairing equipment, the PCBA board repairing equipment comprises a bottom plate, a portal frame, a horizontal transplanting mechanism, a second camera shooting assembly, a tin dispensing assembly, a tin scraping assembly, a removing and mounting assembly and a melting and welding assembly, the horizontal transplanting mechanism is arranged on the bottom plate, and comprises a Y-direction moving module, a first X-direction moving module and a placing plate; a carrier platform is arranged on the placing plate, the tin supplementing assembly, the qualified component placing table, the first camera shooting assembly, the second camera shooting assembly, the tin dispensing assembly, the tin scraping assembly, the removing and mounting assembly and the melting and welding assembly are sequentially arranged on the portal frame in the X direction, the second camera shooting assembly recognizes bad components, a suction nozzle of the removing and mounting assembly removes the bad components, and the welding assembly is arranged on the portal frame. The tin scraping assembly scrapes remaining solder paste, the tin dispensing assembly supplements the solder paste, a laser of the melting welding assembly heats and dissolves the solder paste and welds qualified components, whole-process automation of repair is achieved, and the repair efficiency is high.

Description

Technical Field

[0001] The present invention relates to the technical field of rework equipment, and in particular to a PCBA board rework equipment. Background Art

[0002] As electronic equipment continues to develop towards miniaturization and lightweight, PCBA boards are packaged with denser and smaller electronic components, such as resistors, inductors or capacitors, etc. During the manufacturing process, when the components have abnormal output lines, they need to be reworked. The existing rework method is to manually operate a hot air blower to heat the components for rework. The hot air has a large heating area and will have adverse effects on the peripheral devices of the components to be reworked, making it impossible to achieve precise rework. In addition, manual operation is time-consuming and labor-intensive, and the rework efficiency is low. Summary of the invention

[0003] The object of the present invention is to provide a PCBA board rework device, which can realize a fully automated process from removal to welding and replacement operations for components with high density on the PCBA board.

[0004] To achieve the above purpose, the technical solution of the embodiment of the present invention is as follows: A PCBA board rework equipment, comprising: Base plate; A gantry frame is arranged above the bottom plate; A horizontal transfer mechanism is arranged on the bottom plate, the horizontal transfer mechanism comprises a Y-direction moving module, a first X-direction moving module arranged on the Y-direction moving module, and a placement plate arranged on the first X-direction moving module, the placement plate is provided with a carrier platform, a tinning assembly, a qualified component placement table and a first camera assembly, a carrier is installed on the carrier platform, and a PCBA board to be repaired is placed in the carrier; A second camera assembly is provided on the gantry and is used to identify defective components to be repaired on the PCBA board; The tinning assembly, the tin scraping assembly, the rejection and mounting assembly, and the melting and welding assembly are all arranged on the gantry, and the second camera assembly, the tinning assembly, the tin scraping assembly, the rejection and mounting assembly, and the melting and welding assembly are arranged in sequence along the X direction on the gantry; A distance sensor, the distance sensor is arranged on the gantry, and the distance sensor is used to obtain the distance information between the distance sensor and the PCBA board to be repaired; The tin filling component is used to store solder paste, the melting soldering component is used to heat and dissolve the solder paste under the identified defective components, the rejection and placement component is used to absorb and remove the defective components, the tin scraping component is used to scrape the residual solder paste on the soldering position of the PCBA board after the defective components are removed, and the tinning component is used to take out the solder paste from the tin filling component and add it to the soldering position after the defective components are removed. The rejection and mounting component is also used to absorb qualified components from the qualified component placement table and mount them on the welding position after the defective components are removed. The first camera component is used to photograph the qualified components from the bottom of the qualified components before they are mounted, and confirm the mounting position of the qualified components to the welding position after the defective components are removed. The melting and welding component is also used to heat and weld the mounted qualified components.

[0005] Furthermore, The second camera assembly includes a first Z-direction moving module and a second camera disposed on the first Z-direction moving module, the second camera being used to shoot the PCBA board moved below it under the drive of the first Z-direction moving module, and identify defective components to be repaired on the PCBA board, the melting and welding assembly includes a second X-direction moving module disposed on the gantry, a fifth Z-direction moving module disposed on the second X-direction moving module, and a laser disposed on the fifth Z-direction moving module, the laser being used to heat and dissolve the solder paste under the identified defective components under the drive of the second X-direction moving module and the fifth Z-direction moving module, the rejection and placement assembly includes a fourth Z-direction moving module and a suction nozzle disposed on the fourth Z-direction moving module, the suction nozzle being used to remove the solder paste under the fourth Z-direction moving module, and the suction nozzle being used to remove the solder paste under the fourth Z-direction moving module. The module is driven to suck up the defective components and remove them. The tin scraping assembly includes a third Z-direction moving module and a tin scraping piece arranged on the third Z-direction moving module. The tin scraping piece is used to scrape the residual solder paste on the welding position of the PCBA board after the defective components are removed under the drive of the third Z-direction moving module. The tinning assembly includes a second Z-direction moving module and a tinning piece arranged on the second Z-direction moving module. The tinning piece takes out the solder paste from the tin replenishing assembly and replenishes it to the welding position after the defective components are removed under the drive of the second Z-direction moving module. The suction nozzle is also used to suck up qualified components from the qualified component placement table and mount them on the welding position after the defective components are removed under the drive of the fourth Z-direction moving module. The laser is also used to heat and weld the mounted qualified components.

[0006] Furthermore, The suction nozzle is arranged along the Z direction, and the laser beam direction of the laser is set at an angle of 35 degrees with the suction nozzle.

[0007] Furthermore, The carrier platform is also provided with a positioning component for installing and positioning the carrier, and the positioning component includes a support plate, an X-axis stop bar, a Y-axis stop bar and a tightening block, the X-axis stop bar, the Y-axis stop bar and the tightening block are all arranged on the support plate, the support plate is used to support the carrier, and the tightening block is provided with a tightening screw, and the tightening screw is used to tighten the carrier so that the adjacent two side edges of the carrier are tightly attached to the X-axis stop bar and the Y-axis stop bar.

[0008] Furthermore, The carrier platform also includes a driving motor, the driving shaft of the driving motor is arranged along the Z direction, the supporting plate is arranged on the driving shaft of the driving motor, and the driving motor is used to drive the supporting plate to rotate.

[0009] Furthermore, The carrier includes a base and a cover plate. Two mounting grooves are arranged in the base. The mounting grooves are used to place the PCBA board to be repaired, and the installation depth of the mounting grooves is 0.1 mm lower than the thickness of the PCBA board to be repaired. Two air-avoiding holes corresponding to the two mounting grooves are arranged on the cover plate. The contour of the orthographic projection of the air-avoiding hole on the mounting groove is located in the mounting groove, and the distance between the contour of the orthographic projection and the groove wall of the mounting groove is 2 mm. The base is also provided with two locating pins, and the cover plate is provided with locating holes corresponding to the two locating pins one by one.

[0010] Furthermore, The qualified component placement platform is provided with a plurality of partition bars, and two adjacent partition bars are divided into placement channels for placing qualified components, and the cross section of the placement channel is arranged in an inverted T shape.

[0011] Furthermore, The tin filling assembly includes a mounting plate, a rotating motor arranged on the mounting plate, a rotating disk arranged on the driving shaft of the rotating motor, and a scraping block arranged on the mounting plate, the rotating disk is provided with an annular groove for accommodating solder paste, the scraping block extends into the annular groove, and a scraping paste arc groove is provided in the scraping block, the center of the scraping paste arc groove coincides with the center of the rotating disk, and the slot size of the scraping paste arc groove gradually decreases along the rotation direction of the rotating disk.

[0012] Furthermore, The mounting plate is also provided with a defective box for collecting replaced defective components.

[0013] Furthermore, The mounting plate is also provided with a sponge box for accommodating a wet sponge.

[0014] Compared with the prior art, the embodiments of the present invention have at least the following technical effects: The horizontal transfer mechanism of the PCBA board rework equipment of the embodiment of the present invention is arranged on the bottom plate, and the horizontal transfer mechanism carries a carrier platform, a tinning assembly, a qualified component placement table and a first camera assembly. The second camera assembly, a tinning assembly, a tinning scraping assembly, a removal and mounting assembly and a melting and welding assembly are arranged in sequence on the gantry along the X direction. The horizontal transfer mechanism moves the PCBA board to be reworked on the carrier platform to a designated position, and then the second camera assembly takes a picture of the PCBA board to accurately identify the position of the defective components. Subsequently, the laser heats and melts the solder paste under the defective components. After the defective components are removed, the nozzle sucks them up and removes them. After the tin scraper scrapes the remaining solder paste on the welding position, the tin dotted component takes the solder paste from the tin replenishment component and adds it to the welding position. The nozzle then sucks up qualified components from the qualified component placement table. The camera in the first camera component shoots the bottom of the qualified components to confirm the mounting position of the qualified components. The nozzle then mounts the qualified components on the welding position where the defective components are removed. Finally, the laser heats and welds the mounted components. Based on the relative position setting of each mechanism, the mechanism moves in sequence, the actions are continuous and non-conflicting, and the full automation of the rework process is realized with high rework efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a structural schematic diagram of an embodiment; Figure 2 This is a schematic structural diagram of a horizontal transplanting mechanism in one embodiment; Figure 3 This is a schematic diagram of the structure of a tin-filling assembly in one embodiment; Figure 4 A schematic diagram of the structure of a qualified component placement station in one embodiment; Figure 5 is a schematic structural diagram of a carrier platform in one embodiment; Figure 6 It is a schematic diagram of the structure when the second camera assembly, the tinning assembly, the tinning scraping assembly, the removal and mounting assembly and the melting and welding assembly are arranged on the gantry in one embodiment.

[0016] Description of Figure Numbers: 10. Bottom plate; 20. Gantry; 30. Horizontal transfer mechanism; 31. Y-axis moving module; 32. First X-axis moving module; 33. Placement plate; 34. Carrier platform; 340. Positioning assembly; 3400. Support plate; 3401. X-axis stop bar; 3402. Y-axis stop bar; 3403. Tightening block; 3404. Driving motor; 341. Carrier; 3410. Base; 3411. Mounting groove; 3412. Cover plate; 3413. Avoidance hole; 35. Tin supplement assembly; 350. Mounting plate; 351. Rotating motor; 352. Rotating disk; 3520. Annular groove; 353. Scraping block; 3530. Scraping paste arc groove; 354. Defective product box; 355. Sponge box; 36. Qualified component placement table; 360. Separation bar; 361. Placement channel; 37. First camera assembly; 40. Second camera assembly; 41. First Z-direction moving module; 42. Second camera element; 50. Tinning assembly; 51. Second Z-axis moving module; 52. Tinning parts; 60. Tin scraping assembly; 61. Third Z-direction moving module; 62. Tin scraping piece; 70. Removing mounted components; 71. Fourth Z-axis moving module; 72. Suction nozzle; 80. Melting and welding components; 81. Fifth Z-axis moving module; 82. Laser; 90. Distance sensor. DETAILED DESCRIPTION

[0017] The technical solution of the present invention is further elaborated in detail below in conjunction with the drawings and specific embodiments of the specification. Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by technicians in the technical field of the present invention. The terms used in the specification of the present invention herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention. In the following description, the expression "some embodiments" is related to a subset of all possible embodiments, but it should be understood that "some embodiments" can be the same subset or different subsets of all possible embodiments, and can be combined with each other without conflict.

[0018] It should also be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "inside", "outside", "left", "right" and similar expressions used herein are for illustrative purposes only and are not intended to be the only implementation method.

[0019] like Figure 1-6As shown, in one embodiment of the present invention, a PCBA board rework equipment includes a base plate 10, a gantry 20, a horizontal transfer mechanism 30, a second camera assembly 40, a tinning assembly 50, a tin scraping assembly 60, a removal and mounting assembly 70 and a melting and welding assembly 80, the gantry 20 is arranged above the base plate 10, the horizontal transfer mechanism 30 is arranged on the base plate 10, the horizontal transfer mechanism 30 includes a Y-direction moving module 31, a first X-direction moving module 32 arranged on the Y-direction moving module 31, and a placement plate 33 arranged on the first X-direction moving module 32, the placement plate 33 is provided with a carrier platform 34, a tinning assembly 35, a qualified component placement table 36 and a first camera assembly 37, and the carrier platform 34 is installed There is a carrier 341, in which a PCBA board to be repaired is placed, and the qualified component placement table 36 is placed with qualified components to be mounted. The second camera assembly 40 is arranged on the gantry 20, and the second camera assembly 40 includes a first Z-direction moving module 41 and a second camera 42 arranged on the first Z-direction moving module 41. The second camera 42 is driven by the first Z-direction moving module 41 to shoot the PCBA board moved thereunder, so as to identify and locate the defective components to be repaired on the PCBA board. The tinning assembly 50 is arranged on the gantry 20, and the tinning assembly 50 includes a second Z-direction moving module 51 and a tinning member 52 arranged on the second Z-direction moving module 51. The tin scraping assembly 60 is arranged on the gantry 20, and the tin scraping assembly 60 includes a third Z-direction moving module 61 and a tin scraping member 62 arranged on the third Z-direction moving module 61. The rejection and placement assembly 70 is arranged on the gantry 20, and the rejection and placement assembly 70 includes a fourth Z-direction moving module 71 and a suction nozzle 72 arranged on the fourth Z-direction moving module 71. The melting and welding assembly 80 is arranged on the gantry 20, and the melting and welding assembly 80 includes a second X-direction moving module (not shown) arranged on the gantry, a fifth Z-direction moving module 81 arranged on the second X-direction moving module, and a laser 82 arranged on the fifth Z-direction moving module 81. The second camera assembly 40 and the tin spot assembly 5 0, the tin scraping component 60, the rejection and placement component 70 and the melting and welding component 80 are arranged in sequence on the gantry 20 along the X direction, the tin filling component 35 stores solder paste, the laser 82 heats and dissolves the solder paste under the identified defective components under the drive of the second X-direction moving module and the fifth Z-direction moving module 81, the suction nozzle 72 is used to absorb and remove the defective components under the drive of the fourth Z-direction moving module 71, the tin scraping member 62 scrapes the residual solder paste on the welding position of the PCBA board after the defective components are removed under the drive of the third Z-direction moving module 61, the tin point member 52 takes out the solder paste from the tin filling component 35 under the drive of the second Z-direction moving module 51 and replenishes it to the welding position after the defective components are removed,Driven by the fourth Z-direction moving module 71, the suction nozzle 72 sucks qualified components from the qualified component placement table 36 and mounts them on the welding position after the defective components are removed. The camera in the first camera assembly 37 shoots the qualified components from the bottom of the qualified components before they are mounted, confirms the mounting position of the qualified components mounted on the welding position after the defective components are removed, and the laser 82 heats and welds the mounted qualified components. The horizontal transfer mechanism 30, the second camera assembly 40, the tinning assembly 50, the tinning scraping assembly 60, the removal mounting assembly 70 and the melting welding assembly 80 move in the three directions of XYZ to adapt and cooperate to complete the rework.

[0020] In the above technical solution, the second camera assembly 40 can accurately photograph the PCBA board moved below it through the first Z-direction moving module 41. By using image recognition technology, the defective components to be repaired on the PCBA board can be quickly and accurately located. This high-precision recognition capability avoids the errors that may occur in manual positioning, ensures that subsequent repair operations can accurately act on the target position, and improves the accuracy and reliability of repair. The camera of the first camera assembly 37 shoots from the bottom of the qualified components before they are mounted, and can accurately confirm the mounting position of the qualified components. This dual camera positioning mechanism greatly improves the mounting accuracy of components and reduces problems such as mounting failure or poor welding caused by position deviation. Each component is arranged on the gantry 20 in sequence along the X direction. This layout makes it unnecessary for the PCBA board to be frequently moved to different equipment or workstations during the rework process, which greatly reduces the handling time and waiting time during the rework process. From the identification and removal of defective components, to the cleaning and tinning of the welding position, to the mounting and welding of qualified components, the entire rework process is continuous and non-conflicting, which significantly improves the rework efficiency. Each component is equipped with an independent Z-direction moving module, which can quickly and accurately reach the specified height for operation. For example, the laser 82, driven by the fifth Z-direction moving module 81, can quickly heat and dissolve the solder paste under the defective components, and the suction nozzle 72, driven by the fourth Z-direction moving module 71, can quickly absorb and remove the defective components. This efficient motion control enables each rework step to be completed quickly, improving the overall rework speed. This equipment realizes the automation of the whole process of rework, from the movement of PCBA board, the identification and removal of defective components, the cleaning and tinning of welding position, to the mounting and welding of qualified components, all operations are completed automatically by the equipment without human intervention, which not only reduces the error and uncertainty caused by manual operation, but also avoids the fluctuation of production efficiency caused by human factors, and can ensure the stability and consistency of rework quality. The automated rework equipment can run 24 hours a day, greatly improving the utilization rate and production efficiency of the equipment. Compared with the traditional manual rework method, the equipment can complete more rework tasks in the same time, effectively reducing production costs and improving the production efficiency of the enterprise. The scraping component 60 can effectively scrape the residual solder paste on the welding position of the PCBA board after the defective components are removed, avoiding the influence of residual solder paste on subsequent mounting and welding, and ensuring the cleanliness and flatness of the welding position. The tinning component 50 takes out an appropriate amount of solder paste from the tinning component 35 and adds it to the welding position, ensuring sufficient and uniform distribution of solder paste on the welding position. The laser 82 heats and welds the mounted qualified components. This heating method can accurately control the welding temperature and time, so that the solder paste melts and solidifies under the best conditions, thereby ensuring the quality of the welding points.Laser heating also has the advantages of concentrated heat and little impact on surrounding components, avoiding the thermal damage problem that may occur in traditional heating methods, and further improving the welding quality. The device uses a camera component to identify and locate PCBA boards and components, and can adapt to PCBA boards and components of different sizes and shapes. No matter how the size of the PCBA board changes, as long as it is within the processing range of the equipment, the equipment can accurately identify and locate it through the camera component, and then complete the rework operation according to the preset program. The tin replenishment component 35 stores solder paste, and the tin point component 50 can accurately take out an appropriate amount of solder paste for replenishment according to the needs of different welding positions. This flexible tin replenishment method enables the equipment to adapt to various different welding needs, improving the versatility and adaptability of the equipment. The PCBA board rework equipment also includes a distance sensor 90, which is arranged on the gantry 20, and the distance sensor 90 is used to obtain the distance information between the distance sensor 90 and the PCBA board to be reworked. The distance sensor 90 is arranged on the gantry 20, and is used to obtain the distance information between the distance sensor 90 and the PCBA board to be reworked in real time. This design can ensure that tools such as the nozzle 72 and the laser 82 are always kept at the optimal height during operation, avoiding poor contact or damage to the PCBA board due to height errors. Through precise height control, the equipment can achieve more stable and reliable rework operations. The real-time monitoring function of the distance sensor 90 enables the equipment to automatically adjust the height of tools such as the nozzle 72 and the laser 82 according to the actual height of the PCBA board. This automated height adjustment function not only improves the accuracy of the operation, but also reduces the need for manual intervention, further improving the automation and operating efficiency of the equipment.

[0021] like Figure 1-6As shown, in one embodiment of the present invention, the carrier platform 34 is also provided with a positioning assembly 340 for installing and positioning the carrier 341, and the positioning assembly 340 includes a support plate 3400, an X-axis stop bar 3401, a Y-axis stop bar 3402 and a tightening block 3403, and the X-axis stop bar 3401, the Y-axis stop bar 3402 and the tightening block 3403 are all arranged on the support plate 3400, and the support plate 3400 is used to support the carrier 341, and the tightening block 3403 is provided with a tightening screw, and after the tightening screw tightens the carrier 341, the adjacent two side edges of the carrier 341 are tightly attached to the X-axis stop bar 3401 and the Y-axis stop bar 3402. Through the cooperation of the X-direction stop bar 3401, the Y-direction stop bar 3402 and the tightening block 3403, the carrier 341 can be accurately positioned and fixed on the pallet 3400. The X-direction stop bar 3401 and the Y-direction stop bar 3402 respectively limit the movement of the carrier 341 in the X-direction and the Y-direction, ensuring the accurate position of the carrier 341 in the horizontal direction. This positioning method can effectively avoid the rework error caused by the position offset of the carrier 341 during the rework process, thereby improving the precision and quality of the rework. The tightening screws in the tightening block 3403 can tighten the carrier 341, so that the adjacent two sides of the carrier 341 are tightly attached to the X-direction stop bar 3401 and the Y-direction stop bar 3402. This fastening method can significantly enhance the stability of the carrier 341 during the rework process, prevent the carrier 341 from loosening or shifting due to vibration or other external forces during the operation of the equipment, thereby ensuring the smooth progress of the rework operation. The design of the positioning assembly 340 makes the installation and removal process of the carrier 341 more convenient. The support plate 3400 is used to support the carrier 341, and the operation of the tightening screw is simple and quick. The carrier 341 can be fixed or released by tightening or loosening. This design greatly reduces the time required for the installation and removal of the carrier 341, improves the operating efficiency of the equipment, and can significantly improve the production efficiency, especially when the carrier 341 needs to be frequently replaced. This positioning assembly 340 is suitable for carriers 341 of different sizes and shapes. As long as the size of the carrier 341 is within the bearing range of the support plate 3400, the stable positioning of the carrier 341 can be achieved by adjusting the position of the X-axis bar 3401 and the Y-axis bar 3402 and the tightening degree of the tightening screw. This good adaptability enables the equipment to meet diverse production needs without the need to frequently replace the positioning device due to changes in the carrier 341, further improving the versatility and flexibility of the equipment. The tightening method of the tightening screw can provide a stable clamping force and is not easy to loosen during the operation of the equipment. This stable fastening effect helps to extend the service life of the equipment, reduce equipment failures caused by loose or displaced components, and improve the long-term operating stability and reliability of the equipment.

[0022] like Figure 1-6As shown, in one embodiment of the present invention, the carrier platform 34 also includes a driving motor 3404, the driving shaft of the driving motor 3404 is arranged along the Z direction, the pallet 3400 is arranged on the driving shaft of the driving motor 3404, and the driving motor 3404 is used to drive the pallet 3400 to rotate. The driving shaft of the driving motor 3404 is arranged along the Z direction, and the pallet 3400 is installed thereon. Through the rotation of the driving motor 3404, the carrier 341 and the PCBA board thereon can be flexibly rotated. This design enables the PCBA board to be quickly adjusted to any desired angle, so as to better cooperate with the various components of the rework equipment for operation. For example, when the second camera assembly 40 is photographing and identifying defective components on the PCBA board, the drive motor 3404 can quickly adjust the PCBA board to the best shooting angle to improve the accuracy and efficiency of identification. When the placement assembly 70 is removed to suck and remove defective components, the rotation function can ensure that the suction nozzle 72 can accurately align with the defective components, reducing operational errors caused by angle deviation. During the placement of qualified components, the drive motor 3404 can adjust the PCBA board to an angle that fully matches the placement position of qualified components, thereby ensuring the accuracy and reliability of placement. In addition, this rotation function can also reduce the time and labor costs required for manually adjusting the angle of the PCBA board, further improving the automation and overall efficiency of the rework process. Through the precise control of the drive motor 3404, the equipment can achieve more flexible, efficient and accurate rework operations, significantly improving the quality of rework and production efficiency.

[0023] like Figure 1-6As shown, in one embodiment of the present invention, the carrier 341 includes a base 3410 and a cover plate 3412, and two mounting grooves 3411 are arranged in the base 3410, and the mounting grooves 3411 are used to place the PCBA board to be repaired, and the installation depth of the mounting grooves 3411 is 0.1mm lower than the thickness of the PCBA board to be repaired, and the cover plate 3412 is provided with two air avoidance holes 3413 corresponding to the two mounting grooves 3411, and the contour of the orthographic projection of the air avoidance holes 3413 on the mounting groove 3411 is located in the mounting groove 3411, and the distance between the contour of the orthographic projection and the groove wall of the mounting groove 3411 is 2mm, and the base 3410 is also provided with two positioning pins, and the cover plate 3412 is provided with positioning holes corresponding to the two positioning pins one by one. The two mounting grooves 3411 in the base 3410 can accommodate two PCBA boards to be repaired at the same time, which significantly improves the production efficiency of the equipment, so that two PCBA boards can be processed at the same time in one repair operation. The installation depth of the mounting groove 3411 is 0.1mm lower than the thickness of the PCBA board, and the PCBA board can protrude from the mounting groove 3411. In addition, a magnet is arranged between the base 3410 and the cover plate 3412. Through the above scheme, it is ensured that the PCBA board can be firmly placed in the mounting groove 3411, and the air avoidance hole 3413 on the cover plate 3412 corresponds to the mounting groove 3411, and the positive projection contour of the air avoidance hole 3413 is located in the mounting groove 3411, and the spacing from the groove wall is 2mm. It not only provides sufficient space for the rework operation, but also ensures that the cover plate 3412 can tightly cover and press the PCBA board with the help of magnetic attraction to prevent external contamination or damage during the rework process. The design of the air-avoiding hole 3413 also allows the tools of the rework equipment (such as the suction nozzle 72, the tinning piece 52, etc.) to accurately contact the specific position of the PCBA board without being interfered by the cover plate 3412, thereby improving the flexibility and accuracy of the rework operation.

[0024] like Figure 1-6 As shown, in one embodiment of the present invention, the qualified component placement platform 36 is provided with a plurality of partition bars 360, and the space between two adjacent partition bars 360 is divided into a placement channel 361 for placing qualified components, and the cross section of the placement channel 361 is arranged in an inverted T shape. The design of the inverted T-shaped cross section allows the placement channel 361 to have sufficient space in the vertical direction, which is convenient for placing and removing components, and can be closely arranged in the horizontal direction, thereby improving the space utilization rate of the placement platform.

[0025] like Figure 1-6As shown, in one embodiment of the present invention, the tin-filling assembly 35 comprises a mounting plate 350, a rotating motor 351 disposed on the mounting plate 350, a rotating disk 352 disposed on the driving shaft of the rotating motor 351, and a scraping block 353 disposed on the mounting plate 350, wherein the rotating disk 352 is provided with an annular groove 3520 for accommodating solder paste, the scraping block 353 extends into the annular groove 3520, and a scraping paste arc groove 3530 is provided in the scraping block 353, the center of the scraping paste arc groove 3530 coincides with the center of the rotating disk 352, and the slot size of the scraping paste arc groove 3530 gradually decreases along the rotation direction of the rotating disk 352. The tin-filling assembly 35 drives the rotating disk 352 to rotate by the rotating motor 351, and uses the scraping paste arc groove 3530 in the scraping block 353 to evenly scrape the solder paste in the annular groove 3520. It can ensure that the solder paste is accurately distributed during the rotation process and always maintain a flat surface. The center of the scraper arc groove 3530 coincides with the center of the rotating disk 352, and the size of the groove decreases along the rotation direction. This structure allows the solder paste to be gradually compacted and flattened during the rotation process, thereby providing a uniform and stable solder paste supply during soldering.

[0026] like Figure 1-6 As shown, in one embodiment of the present invention, a defective product box 354 for collecting replaced defective components is also provided on the mounting plate 350. The provision of the defective product box 354 enables the rework equipment to simultaneously complete the rejection and collection of defective products without the need for an additional collection device, thereby simplifying the structure of the production line and reducing the complexity of the equipment.

[0027] like Figure 1-6 As shown, in one embodiment of the present invention, a sponge box 355 for accommodating a wet sponge is further provided on the mounting plate 350. By wiping the tinning member 52 on the wet sponge, the tinning member 52 is kept clean, and the accuracy of the tinning amount of the tinning member is further ensured.

[0028] like Figure 1-6 As shown, in one embodiment of the present invention, the suction nozzle 72 is arranged along the Z direction, and the angle A between the laser beam direction of the laser 82 and the suction nozzle 72 is 35 degrees. The 35-degree angle enables the laser beam to evenly heat the solder paste around the welding point, avoiding welding defects caused by uneven heating. It can ensure that the solder paste at the welding point melts and solidifies at the optimal temperature, thereby improving the welding quality and reliability. By setting the angle of 35 degrees, the laser 82 and the suction nozzle 72 can operate independently in the same working area without affecting each other. It not only improves the space utilization of the equipment, but also enhances the flexibility of operation, making the rework process more efficient.

[0029] The above are only specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art can easily think of changes or substitutions within the technical scope disclosed by the present invention, which should be included in the protection scope of the present invention. The protection scope of the present invention should be based on the protection scope of the claims.

Claims

1. A PCBA board repair equipment, characterized in that: include: Base plate; A gantry frame is arranged above the bottom plate; A horizontal transfer mechanism is arranged on the bottom plate, the horizontal transfer mechanism comprises a Y-direction moving module, a first X-direction moving module arranged on the Y-direction moving module, and a placement plate arranged on the first X-direction moving module, the placement plate is provided with a carrier platform, a tinning assembly, a qualified component placement table and a first camera assembly, a carrier is installed on the carrier platform, and a PCBA board to be repaired is placed in the carrier; A second camera assembly is provided on the gantry and is used to identify defective components to be repaired on the PCBA board; The tinning assembly, the tin scraping assembly, the rejection and mounting assembly, and the melting and welding assembly are all arranged on the gantry, and the second camera assembly, the tinning assembly, the tin scraping assembly, the rejection and mounting assembly, and the melting and welding assembly are arranged in sequence along the X direction on the gantry; A distance sensor is provided on the gantry and is used to obtain distance information between the distance sensor and the PCBA board to be repaired; The tin replenishment component is used to store solder paste, the melting and welding component is used to heat and dissolve the solder paste under the identified defective components, the rejection and mounting component is used to absorb and remove the defective components, the tin scraping component is used to scrape the residual solder paste on the welding position of the PCBA board after the defective components are removed, the tin dot component is used to take out the solder paste from the tin replenishment component and replenish it to the welding position after the defective components are removed, the rejection and mounting component is also used to absorb qualified components from the qualified component placement table and mount them on the welding position after the defective components are removed, the first camera component is used to shoot the qualified components from the bottom of the qualified components before they are mounted, and confirm the mounting position of the qualified components to the welding position after the defective components are removed, and the melting and welding component is also used to heat and weld the mounted qualified components.

2. The PCBA board repair equipment according to claim 1, characterized in that: The second camera assembly includes a first Z-direction moving module and a second camera disposed on the first Z-direction moving module, the second camera being used to shoot the PCBA board moved below it under the drive of the first Z-direction moving module, and identify defective components to be repaired on the PCBA board, the melting and welding assembly includes a second X-direction moving module disposed on the gantry, a fifth Z-direction moving module disposed on the second X-direction moving module, and a laser disposed on the fifth Z-direction moving module, the laser being used to heat and dissolve the solder paste under the identified defective components under the drive of the second X-direction moving module and the fifth Z-direction moving module, the rejection and placement assembly includes a fourth Z-direction moving module and a suction nozzle disposed on the fourth Z-direction moving module, the suction nozzle being used to remove the solder paste under the fourth Z-direction moving module, and the suction nozzle being used to remove the solder paste under the fourth Z-direction moving module. The module is driven to suck up the defective components and remove them. The tin scraping assembly includes a third Z-direction moving module and a tin scraping piece arranged on the third Z-direction moving module. The tin scraping piece is used to scrape the residual solder paste on the welding position of the PCBA board after the defective components are removed under the drive of the third Z-direction moving module. The tinning assembly includes a second Z-direction moving module and a tinning piece arranged on the second Z-direction moving module. The tinning piece takes out the solder paste from the tin replenishing assembly and replenishes it to the welding position after the defective components are removed under the drive of the second Z-direction moving module. The suction nozzle is also used to suck up qualified components from the qualified component placement table and mount them on the welding position after the defective components are removed under the drive of the fourth Z-direction moving module. The laser is also used to heat and weld the mounted qualified components.

3. The PCBA board repair equipment according to claim 2, characterized in that: The suction nozzle is arranged along the Z direction, and the laser beam direction of the laser is set at an angle of 35 degrees with the suction nozzle.

4. The PCBA board rework equipment according to claim 1, characterized in that: The carrier platform is also provided with a positioning component for installing and positioning the carrier, and the positioning component includes a support plate, an X-axis stop bar, a Y-axis stop bar and a tightening block, the X-axis stop bar, the Y-axis stop bar and the tightening block are all arranged on the support plate, the support plate is used to support the carrier, and the tightening block is provided with a tightening screw, and the tightening screw is used to tighten the carrier so that the adjacent two side edges of the carrier are tightly attached to the X-axis stop bar and the Y-axis stop bar.

5. The PCBA board rework equipment according to claim 4, characterized in that: The carrier platform also includes a driving motor, the driving shaft of the driving motor is arranged along the Z direction, the supporting plate is arranged on the driving shaft of the driving motor, and the driving motor is used to drive the supporting plate to rotate.

6. The PCBA board rework equipment according to claim 1, characterized in that: The carrier includes a base and a cover plate. Two mounting grooves are arranged in the base. The mounting grooves are used to place the PCBA board to be repaired, and the installation depth of the mounting grooves is 0.1 mm lower than the thickness of the PCBA board to be repaired. Two air-avoiding holes corresponding to the two mounting grooves are arranged on the cover plate. The contour of the orthographic projection of the air-avoiding hole on the mounting groove is located in the mounting groove, and the distance between the contour of the orthographic projection and the groove wall of the mounting groove is 2 mm. The base is also provided with two locating pins, and the cover plate is provided with locating holes corresponding to the two locating pins one by one.

7. The PCBA board rework equipment according to claim 1, characterized in that: The qualified component placement platform is provided with a plurality of partition bars, and two adjacent partition bars are divided into placement channels for placing qualified components, and the cross section of the placement channel is arranged in an inverted T shape.

8. The PCBA board repair equipment according to claim 1, characterized in that: The tin filling assembly includes a mounting plate, a rotating motor arranged on the mounting plate, a rotating disk arranged on the driving shaft of the rotating motor, and a scraping block arranged on the mounting plate, the rotating disk is provided with an annular groove for accommodating solder paste, the scraping block extends into the annular groove, and a scraping paste arc groove is provided in the scraping block, the center of the scraping paste arc groove coincides with the center of the rotating disk, and the slot size of the scraping paste arc groove gradually decreases along the rotation direction of the rotating disk.

9. The PCBA board repair equipment according to claim 8, characterized in that: The mounting plate is also provided with a defective box for collecting replaced defective components.

10. The PCBA board repair equipment according to claim 8, characterized in that: The mounting plate is also provided with a sponge box for accommodating a wet sponge.

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