Substrate processing equipment for manufacturing integrated circuit board

Abstract

The invention discloses substrate processing equipment for integrated circuit board manufacturing, which comprises a placing table, the outer side of the placing table is fixedly connected with a control table, the top of the placing table is fixedly provided with a mold mechanism, the bottom of a transverse plate is fixedly provided with a control mechanism, and the top of the outer side of a supporting column is fixedly connected with a hydraulic mechanism. A vacuum mechanism is fixedly mounted at the top of the placement plate, a vibration mechanism is arranged on the inner side of the placement plate, efficient vacuum water removal and bubble prevention functions are achieved by means of the vacuum mechanism, and parts such as an air guide pipe, an air guide frame and a driving rod of the vacuum mechanism work cooperatively; the double-hole control piece is matched with the control valve to open the vacuum valve, air in the containing box is pumped out, water vapor is brought out, the appropriate humidity is maintained, residual bubbles are further discharged in an assisting mode along with machining propelling and the vacuum state, the bubble problem caused by water residues is effectively prevented, and the compactness and stability of the internal structure of the base plate are guaranteed.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board manufacturing equipment, and specifically to a substrate processing equipment for integrated circuit board manufacturing. Background Art

[0002] The circuit board substrate processing equipment is a key hardware facility for producing high-quality circuit board substrates. The circuit board substrate is the basic material for carrying electronic components and circuit connections, and its quality directly affects the performance and reliability of the circuit board. Among them, the laminator is a device used to press multiple layers of circuit board substrate materials (such as inner layer circuit boards, prepregs, and outer layer copper foils, etc.) together by heating and pressing to form a multi-layer circuit board.

[0003] The existing laminators have the following problems when in use. First, during the working process of the laminator, since the resin in the prepreg contains a certain amount of moisture, the moisture turns into water vapor during the heating process. If the moisture generated in the laminator cannot be discharged in time, it will also cause bubbles to be generated. Second, if the temperature and pressure of the laminator are not coordinated well, such as high temperature and low pressure, in addition to causing bubbles to be generated, it may also cause the resin of the prepreg to cure quickly and not have time to flow and fill, thereby affecting the interlayer bonding force and resulting in delamination between the substrates due to insufficient compaction.

[0004] Therefore, a substrate processing equipment for integrated circuit board manufacturing is proposed. Summary of the Invention

[0005] The purpose of the present invention is to provide a substrate processing equipment for integrated circuit board manufacturing to solve the problem of poor coordination between temperature and pressure proposed in the above background art.

[0006] To achieve the above purpose, the present invention provides the following technical solution: A substrate processing equipment for integrated circuit board manufacturing, including a placement table, the outside of the placement table is fixedly connected with a control console, and a mold mechanism for placing and processing a substrate body is fixedly installed on the top of the placement table; A support column is fixedly installed on the top of the placement table, a cross plate is fixedly installed inside the support column, a control mechanism is fixedly installed at the bottom of the cross plate, the control mechanism includes a temperature sensing plate fixedly connected to the bottom of the cross plate, a placement plate is fixedly connected to the bottom of the temperature sensing plate, control slots are opened inside both the temperature sensing plate and the placement plate, a bimetallic strip is fixedly installed inside the control slot, a first push rod is fixedly installed on one side of the bimetallic strip, a second push rod is fixedly installed on the other side of the bimetallic strip, and a double-hole control piece is fixedly connected to the outside of the first push rod; A hydraulic mechanism for providing hydraulic pressure is fixedly connected to the top of the outer side of the support column, and the hydraulic mechanism includes a hydraulic press fixedly connected to the top of the support column. A mounting box is fixedly connected to the top of the placement plate, and a pilot valve is arranged inside the mounting box. A driving gear is fixedly connected to the rotating end of the pilot valve, and the driving gear is rotatably connected to the placement plate. A main hydraulic valve is fixedly connected to the driving end of the pilot valve; A vacuum mechanism is fixedly installed on the top of the placement plate, and the vacuum mechanism includes a connecting rod fixedly connected to the bottom of the horizontal plate, an air guide tube is fixedly connected to the bottom of the connecting rod, an air guide frame is fixedly connected to the outside of the air guide tube, an air guide groove is provided inside the air guide frame, the air guide tube is communicated with the air guide frame, a driving rod is rotatably connected to the inner wall of the air guide groove through a connecting rod, an air guide fan blade is fixedly installed on the outside of the driving rod, a control valve is fixedly connected to the top of the placement plate, and the double-hole control sheet is slidably penetrated and arranged on the inner side of the control valve; A vibration mechanism is provided on the inner side of the placement plate, and the vibration mechanism includes a vibration groove opened on the inner side of the placement plate, a vibration spring is fixedly connected to the top of the vibration groove, a vibration plate is fixedly installed on the top of the vibration spring, a toggle block is fixedly connected to the outer side of the driving rod, and a pressing block is fixedly connected to the top of the vibration plate.

[0007] Preferably: a track for cooperating with the mold mechanism for movement is fixedly installed on the top of the console, and a limit plate for limiting the mold mechanism is also fixedly connected to the top of the console. The mold mechanism includes a mounting plate slidably connected to the outside of the slide rail, and a connecting plate is fixedly connected to the top of the mounting plate. A placement box for placing the substrate body is fixedly installed on the top of the connecting plate.

[0008] Preferably, an infrared heater is arranged inside the placement box, an electric push rod is fixedly connected to the top of the placement table, and an output shaft of the electric push rod is fixedly connected to the mounting plate.

[0009] Preferably: the second push rod and the first push rod are both slidably arranged inside the temperature sensing plate, a limiting groove is provided on the outer side of the temperature sensing plate, limiting blocks are fixedly installed on the outer sides of the second push rod and the first push rod, the limiting blocks are slidably connected to the inside of the limiting groove, and a correction spring is fixedly connected between the limiting block and the limiting groove.

[0010] Preferably: the through hole of the double-hole control plate is connected to the control valve, the air guide pipe is connected to the control valve, a vacuum valve is fixedly connected to the top of the placement plate, the air inlet end of the vacuum valve is connected to the placement box through a pipe, the air outlet end of the vacuum valve is connected to the outside through a pipe, and a filter cartridge for filtering impurities in the air is fixedly installed on the outside of the air guide frame.

[0011] Preferably, the vibration plate is slidably arranged inside the vibration groove, a striking needle is fixedly installed on the bottom of the vibration plate, and the outer ends of the dial block and the pressing block are both provided with rounded corners.

[0012] Preferably, the oil inlet of the hydraulic press is connected to the main hydraulic valve through a connecting pipe, and the main hydraulic valve is connected to an external oil pump and an oil storage tank through a pipeline.

[0013] Preferably, a buffer sheet is fixedly connected to the bottom of the placement plate, and a through hole is formed on the buffer sheet.

[0014] Preferably, the output end of the hydraulic press is fixedly connected to the temperature sensing plate via a transverse plate, and limiting rods are provided between both sides of the transverse plate and the inner side of the support column.

[0015] Compared with the prior art, the present invention has the following beneficial effects: 1. In the present invention, effective coordination of temperature and pressure is achieved through the control mechanism and the hydraulic mechanism. The bimetallic strip in the control mechanism can sense temperature changes, and its thermal expansion pushes the push rod, thereby adjusting the pilot valve and the main hydraulic valve. The hydraulic mechanism provides corresponding hydraulic pressure according to this change. During the processing, as the infrared heater heats up, the bimetallic strip causes the main hydraulic valve to open wider, causing the substrate body to heat up and the pressure to increase synchronously, thereby avoiding problems such as bubbles or poor resin curing due to temperature and pressure imbalance, ensuring the yield of the substrate, and improving the quality and efficiency of substrate processing for integrated circuit board manufacturing.

[0016] 2. In the present invention, efficient vacuum dehydration and bubble prevention functions are achieved with the help of a vacuum mechanism. The air guide pipe, air guide frame, drive rod and other components of the vacuum mechanism work together. When heating is performed to evaporate the moisture in the interlayer resin of the substrate body, the double-hole control plate and the control valve cooperate to open the vacuum valve, draw out the air in the placement box and bring out water vapor to maintain appropriate humidity. As the processing proceeds, the vacuum state further helps to discharge residual bubbles, effectively preventing the bubble problem caused by residual moisture and ensuring the tightness and stability of the internal structure of the substrate.

[0017] 3. In the present invention, the uniform distribution of the resin on the substrate body is promoted by relying on the vibration mechanism. In the vibration mechanism, the air guide blades rotate to drive the paddle block to squeeze the pressing block, so that the vibration plate generates continuous vibration force through the vibration spring, which is transmitted to the substrate body through the placement plate and the buffer plate. During processing, continuous vibration helps to expel bubbles and make the resin evenly distributed in the substrate interlayer. At the same time, the buffer plate avoids damage to the substrate caused by vibration. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is the overall structural view of the present invention.

[0019] Figure 2Schematic diagram of the state of taking out the substrate body of the present invention.

[0020] Figure 3 Schematic diagram of the working state of the present invention.

[0021] Figure 4 Schematic diagram of the connection structure of the hydraulic mechanism, control mechanism and vacuum mechanism of the present invention.

[0022] Figure 5 Explosion schematic diagram of the hydraulic mechanism of the present invention.

[0023] Figure 6 Cross-sectional schematic diagram of the vacuum mechanism of the present invention.

[0024] Figure 7 Cross-sectional schematic diagram of the control mechanism of the present invention.

[0025] Figure 8 Schematic diagram of the connection structure of the buffer sheet and the placement plate of the present invention.

[0026] Figure 9 Cross-sectional structure schematic diagram of the vibration mechanism of the present invention.

[0027] Figure 10 Cross-sectional view of the placement plate of the present invention.

[0028] Figure 11 For the present invention Figure 6 Enlarged view of area A in

[0029] Figure 12 For the present invention Figure 10 Enlarged view of area B in

[0030] In the figure: 1. Placement table; 2. Control console; 3. Molding mechanism; 31. Connection plate; 32. Placement box; 33. Electric push rod; 34. Installation plate; 4. Support column; 5. Hydraulic mechanism; 51. Hydraulic press; 52. Connecting pipe; 53. Installation box; 54. Pilot valve; 55. Main hydraulic valve; 56. Driving gear; 6. Control mechanism; 61. Placement plate; 62. Temperature sensing plate; 63. Control groove; 64. Bimetallic strip; 65. First push rod; 66. Second push rod; 67. Double-hole control piece; 68. Calibration spring; 7. Vacuum mechanism; 71. Connecting rod; 72. Air guide pipe; 73. Control valve; 74. Air guide frame; 75. Vacuum valve; 76. Filter cylinder; 77. Air guide groove; 78. Driving rod; 79. Air guide fan blade; 8. Vibration mechanism; 81. Pushing block; 82. Pressing block; 83. Vibration groove; 84. Vibration spring; 85. Vibration piece; 9. Substrate body; 10. Buffer piece. Specific implementation manner

[0031] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0032] Please refer to Figures 1 to 12 , the present invention provides a technical solution for a substrate processing device for manufacturing an integrated circuit board: A substrate processing device for manufacturing an integrated circuit board includes a placement table 1, a control console 2 is fixedly connected to the outside of the placement table 1, and a mold mechanism 3 for placing and processing the substrate body 9 is fixedly installed on the top of the placement table 1; A support column 4 is fixedly installed on the top of the placement table 1, a cross plate is fixedly installed inside the support column 4, a control mechanism 6 is fixedly installed at the bottom of the cross plate, the control mechanism 6 includes a temperature sensing plate 62 fixedly connected to the bottom of the cross plate, a placement plate 61 is fixedly connected to the bottom of the temperature sensing plate 62, control grooves 63 are opened inside the temperature sensing plate 62 and the placement plate 61, a bimetallic strip 64 is fixedly installed inside the control groove 63, a first push rod 65 is fixedly installed on one side of the bimetallic strip 64, a second push rod 66 is fixedly installed on the other side of the bimetallic strip 64, and a double-hole control piece 67 is fixedly connected to the outside of the first push rod 65; A hydraulic mechanism 5 for providing hydraulic pressure is fixedly connected to the top of the outside of the support column 4. The hydraulic mechanism 5 includes a hydraulic press 51 fixedly connected to the top of the support column 4, an installation box 53 is fixedly connected to the top of the placement plate 61, a pilot valve 54 is arranged inside the installation box 53, a driving gear 56 is fixedly connected to the rotating end of the pilot valve 54, the driving gear 56 is rotatably connected to the placement plate 61, and a main hydraulic valve 55 is fixedly connected to the driving end of the pilot valve 54; A vacuum mechanism 7 is fixedly installed on the top of the placement plate 61. The vacuum mechanism 7 includes a connecting rod 71 fixedly connected to the bottom of the cross plate, a guide air pipe 72 is fixedly connected to the bottom of the connecting rod 71, a guide air frame 74 is fixedly connected to the outside of the guide air pipe 72, a guide air groove 77 is opened inside the guide air frame 74, the guide air pipe 72 is communicated with the guide air frame 74, a driving rod 78 is rotatably connected to the inner wall of the guide air groove 77 through a connecting rod, a guide air fan blade 79 is fixedly installed on the outside of the driving rod 78, a control valve 73 is fixedly connected to the top of the placement plate 61, and the double-hole control piece 67 slidably penetrates through the inside of the control valve 73; A vibration mechanism 8 is provided on the inner side of the placement plate 61. The vibration mechanism 8 includes a vibration groove 83 provided on the inner side of the placement plate 61. A vibration spring 84 is fixedly connected to the top of the vibration groove 83. A vibration sheet 85 is fixedly installed on the top of the vibration spring 84. A toggle block 81 is fixedly connected to the outer side of the driving rod 78. A pressing block 82 is fixedly connected to the top of the vibration sheet 85. A buffer sheet 10 is fixedly connected to the bottom of the placement plate 61 , and a through hole is opened on the buffer sheet 10 . The output end of the hydraulic press 51 is fixedly connected to the temperature sensing plate 62 through a transverse plate, and limit rods are provided between the two sides of the transverse plate and the inner side of the support column 4 .

[0033] As an embodiment of the present invention, Figures 1 - 3 As shown, a track for cooperating with the mold mechanism 3 for movement is fixedly installed on the top of the console 2. A limit plate for limiting the mold mechanism 3 is also fixedly connected to the top of the console 2. The mold mechanism 3 includes a mounting plate 34 slidably connected to the outside of the slide rail. A connecting plate 31 is fixedly connected to the top of the mounting plate 34. A placement box 32 for placing the substrate body 9 is fixedly installed on the top of the connecting plate 31. An infrared heater is arranged inside the placement box 32. An electric push rod 33 is fixedly connected to the top of the placement table 1. The output shaft of the electric push rod 33 is fixedly connected to the mounting plate 34.

[0034] During operation, first place the substrate body 9 into the placement box 32, then start the electric push rod 33 to move the mounting plate 34, the connecting plate 31 and the placement box 32 to the limit plate, so that the placement box 32 is at the bottom of the placement plate 61, and then control the hydraulic press 51 to move downward to push the placement plate 61 and the buffer sheet 10 until the buffer sheet 10 fits the substrate body 9.

[0035] As an embodiment of the present invention, Figures 1 to 11 As shown, the second push rod 66 and the first push rod 65 are both slidably arranged inside the temperature sensing plate 62, and a limiting groove is provided on the outer side of the temperature sensing plate 62. Limiting blocks are fixedly installed on the outer sides of the second push rod 66 and the first push rod 65. The limiting blocks are slidably connected inside the limiting grooves, and a correction spring 68 is fixedly connected between the limiting blocks and the limiting grooves. The through hole of the double-hole control plate 67 is connected to the control valve 73, and the air guide pipe 72 is connected to the control valve 73. A vacuum valve 75 is fixedly connected to the top of the placement plate 61, and the air inlet end of the vacuum valve 75 is connected to the placement box 32 through a pipeline, and the air outlet end of the vacuum valve 75 is connected to the outside through a pipeline. A filter cartridge 76 for filtering impurities in the air is fixedly installed on the outer side of the air guide frame 74.

[0036] During operation, the infrared heater in the placement box 32 is turned on to heat the substrate body 9, and the heat is transferred to the bimetallic strip 64 through the buffer sheet 10 to make it expand. The first through hole on the double-hole control sheet 67 is connected to the control valve 73, and the vacuum valve 75 is opened to extract the air in the placement box 32. At the same time, the external gas enters the box through the filter tube 76, etc., and the heating causes the moisture in the interlayer resin of the substrate body 9 to evaporate. The vacuum valve 75 brings out water vapor to ensure the humidity in the box and avoid the generation of bubbles. Under continuous heating, the bimetallic strip 64 expands and pushes the double-hole control sheet 67 to move outward, so that the first through hole is not connected to the control valve 73, and the vacuum valve 75 draws the placement box 32 into a vacuum to help discharge residual bubbles. After the processing is completed and the substrate body 9 is taken out, the temperature is restored, the bimetallic strip 64 is reset to drive the first push rod 65 and the second push rod 66 to reset, and its outer limit block drives the correction spring 68 to move. The correction spring 68 helps the bimetallic strip 64 to better reset and prevent deformation.

[0037] As an embodiment of the present invention, Figure 9 , Figure 10 and Figure 12 As shown, the vibration plate 85 is slidably arranged inside the vibration groove 83, a striking needle is fixedly installed at the bottom of the vibration plate 85, and the outer ends of the dial block 81 and the pressing block 82 are both provided with rounded corners.

[0038] During operation, the gas in the air guide groove 77 drives the air guide blades 79 to rotate, and the driving rod 78 causes the toggle block 81 to rotate, intermittently squeezing the pressing block 82 downward, driving the vibration plate 85 to intermittently move downward, and its force is converted into continuous vibration force through the vibration spring 84, and the striking needle at the bottom of the vibration plate 85 continuously strikes the placement plate 61, and the vibration is transmitted to the substrate body 9 through the buffer sheet 10, realizing continuous vibration, which helps to discharge bubbles and make the resin uniform. The buffer sheet 10 can prevent the substrate body 9 from being damaged by vibration.

[0039] As an embodiment of the present invention, Figures 2 - 5 As shown, the oil inlet of the hydraulic press 51 is connected to the main hydraulic valve 55 through a connecting pipe 52, and the main hydraulic valve 55 is connected to an external oil pump and an oil storage tank through a pipeline (the pilot valve 54 is a control element commonly used in hydraulic control systems, usually used to control the action of the main hydraulic valve 55).

[0040] During operation, on the other side, the bimetallic strip 64 pushes the second push rod 66 with a toothed groove and engaged with the driving gear 56 to move outwards, driving the driving gear 56 to rotate, increasing the opening degree of the pilot valve 54, and then the opening degree of the associated main hydraulic valve 55 increases as the infrared heater heats up. The temperature of the substrate body 9 rises while the pressure synchronously increases, ensuring the yield rate. The buffer sheet 10 is evenly laminated, and the structures of the placement plate 61 and the placement box 32 prevent overpressure. When the temperature reaches the normal range, the bimetallic strip 64 pushes the second through hole of the double-hole control sheet 67 to communicate with the control valve 73, and the external gas enters the placement box 32 through relevant components to restore the air pressure, facilitating the separation of the placement plate 61 from the placement box 32. The gas also accelerates the cooling of the substrate body 9 and the discharge of resin waste gas, and drives the guide air fan blade 79 to rotate, and through the driving rod 78, etc., continuous vibration of the substrate body 9 is achieved.

[0041] Working principle: During operation, first place the substrate body 9 to be processed in the placement box 32, and then start the electric push rod 33. The electric push rod 33 drives the mounting plate 34, the connecting plate 31 and the placement box 32 to move until reaching the limit plate. At this time, the placement box 32 is exactly located at the bottom of the placement plate 61. Then control the hydraulic press 51 to move downwards. After the hydraulic press 51 moves downwards, it will push the placement plate 61 and the buffer sheet 10 downwards until the buffer sheet 10 contacts and fits with the substrate body 9. Subsequently, turn on the infrared heater inside the placement box 32 to heat the substrate body 9. At the same time, the heating temperature will also be transmitted to the bimetallic strip 64 through the buffer sheet 10. The bimetallic strip 64 will expand when heated. During this process, the first through hole on the double-hole control sheet 67 and the control valve 73 are opened, and the vacuum valve 75 is opened. The vacuum valve 75 will extract the air inside the placement box 32 through the pipeline. At the same time, the external gas will enter the placement box 32 through the filter cartridge 76, the air guide frame 74, the air guide pipe 72, the control valve 73 and the air guide groove 77. When the infrared heater heats the substrate body 9, the moisture inside the resin in the sandwich of the substrate body 9 will be heated and evaporated. Therefore, when the vacuum valve 75 is working, it will take out the water vapor in the placement box 32, thus ensuring the humidity inside the placement box 32 and avoiding bubbles in the sandwich of the substrate body 9 due to excessive humidity inside the placement box 32 when the infrared heater heats the substrate body 9. At the same time, the gas passing through the air guide groove 77 will drive the air guide blades 79 to rotate. After the air guide blades 79 rotate, they will also drive the toggle block 81 to rotate through the driving rod 78. After the toggle block 81 rotates, it will intermittently squeeze the pressing block 82 to move downward. After the pressing block 82 moves downward, it will synchronously drive the vibration plate 85 to move downward intermittently. The force of the intermittent downward movement of the vibration plate 85 will be converted into a continuous vibration force through the vibration spring 84, and the continuous striking vibration of the placement plate 61 will be achieved through the striking needle at the bottom of the vibration plate 85. The vibration of the placement plate 61 will be transmitted to the substrate body 9 through the buffer sheet 10, thereby achieving continuous vibration of the substrate body 9, which will help to discharge the bubbles in the substrate body 9 and make the resin in the interlayer of the substrate body 9 uniform. At the same time, the buffering of the buffer sheet 10 can also avoid damage to the substrate body 9 caused by excessive vibration. As the infrared heater continues to heat, the bimetallic strip 64 expands more and more. When the bimetallic strip 64 expands, the bimetallic strip 64 on one side will push the double-hole control strip 67 outward. After the double-hole control strip 67 moves outward, the first through hole on the bimetallic strip 64 will gradually no longer be connected to the control valve 73. At this time, the vacuum valve 75 will work to draw the inside of the placement box 32 into a vacuum state. When the inside of the placement box 32 forms a vacuum state, it will help to discharge the bubbles remaining in the interlayer of the substrate body 9. At the same time, the bimetallic strip 64 on the other side will push the second push rod 66 to move outwards. The second push rod 66 is provided with a tooth groove, and the tooth groove on the second push rod 66 meshes with the driving gear 56. Therefore, when the second push rod 66 moves outwards, it will drive the driving gear 56 to rotate. After the driving gear 56 rotates, it will synchronously drive the pilot valve 54 to open more. The degree of opening of the pilot valve 54 will be synchronously related to the opening and closing degree of the main hydraulic valve 55. Therefore, as the temperature of the infrared heater increases, the degree of opening of the main hydraulic valve 55 will also increase, so that the pressure of the substrate body 9 will increase synchronously while the temperature is rising, thereby ensuring the yield of the substrate body 9. At the same time, the surface of the substrate body 9 can be evenly laminated through the buffer sheet 10. The problem of overpressure on the substrate body 9 due to excessive pressure can also be effectively avoided through the structure of the placement plate 61 and the placement box 32. When the temperature rises to the normal working range, the bimetallic strip 64 will push the second through hole on the double-hole control plate 67 to gradually connect with the control valve 73. At this time, the external gas will gradually pass through the filter cartridge 76, the air guide frame 74, the air guide pipe 72, the control valve 73 and the air guide groove 77 into the placement box 32, so that the placement box 32 gradually restores the normal air pressure, thereby facilitating the separation of the placement plate 61 from the placement box 32. At the same time, after the gas passes through the placement box 32, it will also accelerate the cooling speed of the substrate body 9 and the waste gas generated by the resin when the substrate body 9 is heated. At this time, the gas will still drive the air guide blades 79 to rotate. After the air guide blades 79 rotate, they will drive the toggle block 81 to rotate through the drive rod 78 to achieve intermittent squeezing of the pressing block 82, and finally achieve continuous vibration of the substrate body 9. After the processing is completed, the substrate body 9 is taken out, and the temperature inside the placement box 32 also returns to normal. At this time, the bimetallic strip 64 resets, thereby driving the first push rod 65 and the second push rod 66 to reset synchronously. During the movement of the first push rod 65 and the second push rod 66, the calibration spring 68 is driven to move by the limit blocks on their outer sides. The calibration spring 68 is a spring with very little elasticity, mainly used to apply a continuous and small pressure to the bimetallic strip 64 after the bimetallic strip 64 resets, which helps the bimetallic strip 64 to reset better and is not prone to deformation.

[0042] Although the embodiments of the present invention have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A substrate processing device for manufacturing integrated circuit boards, comprising a placement table (1), characterized in that: The outer side of the placement table (1) is fixedly connected to a control console (2), and the top of the placement table (1) is fixedly installed with a mold mechanism (3) for placing and processing a substrate body (9); A support column (4) is fixedly mounted on the top of the placement table (1), a horizontal plate is fixedly mounted on the inner side of the support column (4), a control mechanism (6) is fixedly mounted on the bottom of the horizontal plate, the control mechanism (6) comprises a temperature sensing plate (62) fixedly connected to the bottom of the horizontal plate, a placement plate (61) is fixedly connected to the bottom of the temperature sensing plate (62), a control groove (63) is provided on the inner sides of the temperature sensing plate (62) and the placement plate (61), a bimetallic strip (64) is fixedly mounted inside the control groove (63), a first push rod (65) is fixedly mounted on one side of the bimetallic strip (64), a second push rod (66) is fixedly mounted on the other side of the bimetallic strip (64), and a double-hole control plate (67) is fixedly connected to the outer side of the first push rod (65); A hydraulic mechanism (5) for providing hydraulic pressure is fixedly connected to the top of the outer side of the support column (4), the hydraulic mechanism (5) comprising a hydraulic press (51) fixedly connected to the top of the support column (4), a mounting box (53) is fixedly connected to the top of the placement plate (61), a pilot valve (54) is arranged inside the mounting box (53), a driving gear (56) is fixedly connected to the rotating end of the pilot valve (54), the driving gear (56) is rotatably connected to the placement plate (61), and a main hydraulic valve (55) is fixedly connected to the driving end of the pilot valve (54); A vacuum mechanism (7) is fixedly mounted on the top of the placement plate (61), the vacuum mechanism (7) comprising a connecting rod (71) fixedly connected to the bottom of the horizontal plate, an air guide tube (72) is fixedly connected to the bottom of the connecting rod (71), an air guide frame (74) is fixedly connected to the outside of the air guide tube (72), an air guide groove (77) is provided inside the air guide frame (74), the air guide tube (72) is in communication with the air guide frame (74), a driving rod (78) is rotatably connected to the inner wall of the air guide groove (77) via a connecting rod, an air guide blade (79) is fixedly mounted on the outside of the driving rod (78), a control valve (73) is fixedly connected to the top of the placement plate (61), and the double-hole control plate (67) is slidably penetrated and arranged on the inner side of the control valve (73); A vibration mechanism (8) is provided on the inner side of the placement plate (61), and the vibration mechanism (8) comprises a vibration groove (83) opened on the inner side of the placement plate (61), a vibration spring (84) is fixedly connected to the top of the vibration groove (83), a vibration plate (85) is fixedly installed on the top of the vibration spring (84), a toggle block (81) is fixedly connected to the outer side of the driving rod (78), and a pressing block (82) is fixedly connected to the top of the vibration plate (85).

2. The substrate processing equipment for integrated circuit board manufacturing according to claim 1, characterized in that: A track for cooperating with the mold mechanism (3) for movement is fixedly mounted on the top of the control console (2), and a limit plate for limiting the mold mechanism (3) is also fixedly connected to the top of the control console (2). The mold mechanism (3) comprises a mounting plate (34) slidably connected to the outside of the slide rail, a connecting plate (31) is fixedly connected to the top of the mounting plate (34), and a placement box (32) for placing the substrate body (9) is fixedly mounted on the top of the connecting plate (31).

3. The substrate processing equipment for manufacturing integrated circuit boards according to claim 2, characterized in that: An infrared heater is arranged inside the placement box (32), an electric push rod (33) is fixedly connected to the top of the placement table (1), and an output shaft of the electric push rod (33) is fixedly connected to the mounting plate (34).

4. The substrate processing equipment for integrated circuit board manufacturing according to claim 1, characterized in that: The second push rod (66) and the first push rod (65) are both slidably arranged inside the temperature sensing plate (62), a limiting groove is provided on the outer side of the temperature sensing plate (62), and limiting blocks are fixedly installed on the outer sides of the second push rod (66) and the first push rod (65), the limiting blocks are slidably connected to the inside of the limiting groove, and a correction spring (68) is fixedly connected between the limiting block and the limiting groove.

5. The substrate processing equipment for integrated circuit board manufacturing according to claim 2, characterized in that: The through hole of the double-hole control plate (67) is in communication with the control valve (73), the air guide pipe (72) is in communication with the control valve (73), a vacuum valve (75) is fixedly connected to the top of the placement plate (61), an air inlet end of the vacuum valve (75) is in communication with the placement box (32) via a pipeline, an air outlet end of the vacuum valve (75) is in communication with the outside via a pipeline, and a filter cartridge (76) for filtering impurities in the air is fixedly mounted on the outside of the air guide frame (74).

6. The substrate processing equipment for integrated circuit board manufacturing according to claim 1, characterized in that: The vibration plate (85) is slidably arranged inside the vibration groove (83), a striking needle is fixedly mounted on the bottom of the vibration plate (85), and the outer ends of the shifting block (81) and the pressing block (82) are both provided with rounded corners.

7. The substrate processing equipment for integrated circuit board manufacturing according to claim 1, characterized in that: The oil inlet of the hydraulic machine (51) is connected to the main hydraulic valve (55) through a connecting pipe (52), and the main hydraulic valve (55) is connected to an external oil pump and an oil storage tank through a pipeline.

8. The substrate processing equipment for manufacturing integrated circuit boards according to claim 1, characterized in that: A buffer sheet (10) is fixedly connected to the bottom of the placement plate (61), and a through hole is provided on the buffer sheet (10).

9. The substrate processing equipment for manufacturing integrated circuit boards according to claim 1, characterized in that: The output end of the hydraulic press (51) is fixedly connected to the temperature sensing plate (62) via a transverse plate, and limiting rods are provided between both sides of the transverse plate and the inner side of the support column (4).

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