Liquid cooling heat dissipation structure of energy storage connector

Abstract

The invention relates to a heat dissipation structure of an energy storage connector, which comprises a plurality of grooves, and the grooves are uniformly arranged on the surface of a conductor component to form a heat conduction structure similar to human skin so as to realize heat dissipation of the conductor component. According to the invention, heat can be effectively dissipated, the problems of corrosion and insulation can be avoided, and the manufacturing and maintenance cost is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of energy storage devices, and particularly to a liquid cooling heat dissipation structure for an energy storage connector. Background Art

[0002] With the rapid development of new energy technologies, the energy transmission rate and efficiency have become the focus of attention in various fields. Especially in the application of high-current and high-power devices, how to effectively manage and reduce the heat generated during device operation has become a key factor in ensuring stable device performance and extending service life.

[0003] Currently, for the heat dissipation problem of high-heat-generating components such as energy storage connectors, the mainstream solutions mainly focus on material optimization. This includes selecting metal materials with higher electrical conductivity and using more efficient heat-conducting materials to improve the heat conduction efficiency. However, due to the upper limit of the metal's electrical conductivity and various limitations encountered in practical applications, such as the physical and chemical stability of materials, cost, etc., these traditional methods cannot fully meet the heat dissipation performance requirements of high-power devices. Summary of the Invention

[0004] Therefore, the technical problem to be solved by the present invention is to overcome the deficiencies in the prior art and provide a heat dissipation structure for an energy storage connector that can effectively dissipate heat, avoid corrosion and insulation problems, and at the same time reduce manufacturing and maintenance costs.

[0005] To solve the above technical problem, the present invention provides a heat dissipation structure for an energy storage connector, with a number of grooves uniformly arranged on the surface of the conductor component, forming a heat conduction structure similar to human skin to dissipate heat from the conductor component.

[0006] In an embodiment of the present invention, a heat conduction pipeline is laid in the groove, and a coolant is injected into the heat conduction pipeline to form an active heat dissipation pipeline.

[0007] In an embodiment of the present invention, the heat conduction pipeline is a polytetrafluoroethylene capillary tube. Using the capillary-based active heat dissipation pipeline design, micron-level runoff is achieved, increasing the heat exchange area and thus improving the heat dissipation efficiency.

[0008] In an embodiment of the present invention, an external active heat dissipation structure is further included for delivering the coolant to the heat conduction pipeline.

[0009] In one embodiment of the present invention, the external active heat dissipation structure includes a micro pump, a cooling mechanism, and a liquid cooling pipeline. The heat generated by the conductor component during operation is transferred to the coolant through the heat conduction pipeline. After the coolant absorbs the heat, its temperature rises, and then it is transported to the cooling mechanism by the micro pump through the liquid cooling pipeline. In the cooling mechanism, the coolant releases the heat to the surrounding environment and its temperature drops; after the coolant cools down, it is sent back to the heat conduction pipeline by the micro pump through the liquid cooling pipeline again to continue absorbing heat, forming a closed-loop heat dissipation cycle.

[0010] The design of the micro pump is outside the connector, reducing the redundancy of the connector design and optimizing the space utilization.

[0011] In one embodiment of the present invention, the trench is filled with a reinforcing body to form a heat dissipation fin structure.

[0012] In one embodiment of the present invention, the surface of the heat dissipation fin structure is coated with a metal coating, and the base material of the metal coating is copper or magnesium.

[0013] In one embodiment of the present invention, the reinforcing body is one or more of carbon fiber, silicon carbide particles, and silicon particles.

[0014] In one embodiment of the present invention, the trench is formed on the surface of the conductor component by etching or photolithography.

[0015] In one embodiment of the present invention, the size of the trench reaches the micron level.

[0016] The above technical solution of the present invention has the following beneficial effects compared with the prior art: For the heat dissipation structure of an energy storage connector of the present invention, the trench is placed outside the conduction component, which can achieve efficient heat dissipation in a limited space, is suitable for miniaturized and high power density application scenarios, and avoids the complexity of adding a heat conduction coating to the conduction component part or introducing a liquid cooling system into the conductive structure, reducing the production cost. At the same time, it avoids the direct contact between the conduction component and the coolant, reduces electrochemical corrosion and insulation problems, extends the service life of the connector, and improves the reliability and safety of the system. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to make the content of the present invention easier to be clearly understood, the following further details the present invention according to the specific embodiments of the present invention and in combination with the attached drawings.

[0018] Figure 1 It is a schematic structural diagram of the heat dissipation structure of the energy storage connector in the first preferred embodiment of the present invention; Figure 2 It is a schematic structural diagram of the heat dissipation structure of the energy storage connector in the second preferred embodiment of the present invention; Explanation of the reference numerals in the specification: 1. Conductor component; 2. Groove; 3. Heat dissipation fin structure. DETAILED DESCRIPTION

[0019] The present invention is further described below in conjunction with the accompanying drawings and specific embodiments so that those skilled in the art can better understand the present invention and implement it, but the embodiments are not intended to limit the present invention. Embodiment 1

[0020] Reference Figure 1 As shown, the present invention provides a heat dissipation structure of an energy storage connector, comprising: a plurality of grooves 2, wherein the grooves 2 are evenly arranged on the surface of the conductor component 1 to form a heat-conducting structure similar to human skin, thereby achieving heat dissipation on the surface of the conductor component 1.

[0021] A heat-conducting pipeline is laid in the groove 2, and a coolant is injected into the heat-conducting pipeline to form an active heat-dissipating pipeline. The active heat-dissipating pipeline is placed outside the wire or conductive component structure, which is conducive to reducing manufacturing costs and does not require the addition of insulation and other parts.

[0022] Furthermore, the heat conduction pipeline is a polytetrafluoroethylene capillary. After the polytetrafluoroethylene capillary is embedded in the guide groove 2, the surface of the conductor component 1 has a heat conduction structure similar to human skin, and its heat dissipation effect can be effectively improved compared with traditional natural heat dissipation and structural heat dissipation. At the same time, the active heat dissipation pipeline design based on the capillary is used to achieve micron-level runoff, increase the heat exchange area, and thus improve the heat dissipation efficiency.

[0023] This embodiment also includes an external active heat dissipation structure for conveying cooling liquid to the heat conduction pipeline.

[0024] Preferably, the external active heat dissipation structure includes a micro pump, a cooling mechanism and a liquid cooling pipeline. The heat generated by the conductor component during operation is transferred to the coolant through the heat conduction pipeline. After the coolant absorbs the heat, the temperature rises, and then it is transported to the cooling mechanism by the micro pump through the liquid cooling pipeline. In the cooling mechanism, the coolant releases the heat to the surrounding environment, and the temperature decreases. After the coolant cools down, it is sent back to the heat conduction pipeline by the micro pump through the liquid cooling pipeline to continue absorbing heat, forming a closed-loop heat dissipation cycle. The micro pump is designed outside the connector, which reduces the complexity of the connector design and optimizes space utilization.

[0025] Furthermore, the groove 2 is formed on the surface of the conductor component by etching and photolithography. The methods of etching and photolithography can meet the requirements of high precision and complex design, and can accurately manufacture micron-level liquid cooling grooves on the surface of the conductor component, which is crucial for improving the heat dissipation efficiency of the small energy storage connector. This high-precision manufacturing process enables the liquid cooling groove to closely fit the surface of the conductor component 1, realizing efficient heat conduction and liquid flow, thereby optimizing the performance of the entire liquid cooling heat dissipation system.

[0026] Furthermore, the size of the groove 2 reaches the micron level. The micron-level grooves increase the surface area of heat exchange, enabling heat to be transferred from the surface of the conductor component to the coolant more quickly and evenly, thereby improving the heat exchange efficiency. The groove 2 with a micron-level size can accommodate more cooling channels in a limited space, which is particularly important for miniaturized and high-power density devices. Embodiment 2

[0027] As Figure 2 shown, the present invention provides a heat dissipation structure for an energy storage connector, including: a plurality of grooves 2, which are evenly arranged on the surface of the conductor component 1 to dissipate heat from the surface of the conductor component 1.

[0028] Among them, the groove 2 is filled with a reinforcing body to form a heat dissipation fin structure 3. When designing the heat dissipation fin structure 3, by increasing the processing density of the groove 2, under the same heat dissipation area on the surface of the conductor component 2, the heat exchange efficiency and heat dissipation performance are improved. The reinforcing body can help disperse thermal stress, reduce material fatigue and cracks caused by temperature changes, and can improve the structural strength of the groove 2, making it more resistant to pressure and mechanical shock.

[0029] Preferably, the reinforcing body needs to be evenly distributed in the groove 2 to ensure the same heat exchange efficiency on the entire surface of the conductor component 1, and the coefficient of thermal expansion of the reinforcing body should match the material of the conductor component 1 to avoid stress caused by uneven thermal expansion.

[0030] In this embodiment, the surface of the heat dissipation fin structure 3 is coated with a metal coating, and the base material of the metal coating is copper or magnesium. On the heat dissipation fin structure 3, copper and magnesium adhere to the surface, which can improve the heat dissipation efficiency and structural performance.

[0031] In this embodiment, the reinforcing body is one or more of carbon fiber, silicon carbide particles, and silicon particles. Carbon fiber is a high-strength and high-modulus fiber material, which is carbonized from organic fibers (such as polyacrylonitrile or pitch) at high temperature. It can improve the strength and rigidity of the structure while reducing weight. Carbon fiber plays a role in thermal management due to its high thermal conductivity and low density characteristics. Silicon carbide particles (SiC) are a kind of ceramic material with high thermal conductivity and high temperature stability; silicon is a semiconductor component material, and silicon particles have high thermal conductivity.

[0032] In addition, the trench 2 can also be filled with a phase change material to achieve heat dissipation of the conductor component 1. The phase change material melts when heated and absorbs heat.

[0033] Obviously, the above embodiments are merely examples given for clear illustration and are not limitations on the implementation manners. For those of ordinary skill in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to exhaustively list all the implementation manners here. And the obvious changes or modifications derived therefrom still fall within the protection scope of the present invention.

Claims

1. A heat dissipation structure of an energy storage connector, characterized in that: include: A plurality of grooves are evenly arranged on the surface of the conductor component to form a heat-conducting structure similar to human skin, thereby achieving heat dissipation of the conductor component.

2. The heat dissipation structure of the energy storage connector according to claim 1, characterized in that: A heat-conducting pipeline is laid in the groove, and a coolant is injected into the heat-conducting pipeline to form an active heat-dissipating pipeline.

3. The heat dissipation structure of the energy storage connector according to claim 2, characterized in that: The heat conduction pipeline is a polytetrafluoroethylene capillary tube.

4. The heat dissipation structure of the energy storage connector according to claim 3, characterized in that: It also includes an external active heat dissipation structure for conveying cooling liquid to the heat conduction pipeline.

5. The heat dissipation structure of the energy storage connector according to claim 4, characterized in that: The external active heat dissipation structure includes a micro pump, a cooling mechanism and a liquid cooling pipeline. The heat generated by the conductor component during operation is transferred to the coolant through the heat conduction pipeline. After the coolant absorbs the heat, the temperature rises, and then it is transported to the cooling mechanism by the micro pump through the liquid cooling pipeline. In the cooling mechanism, the coolant releases the heat to the surrounding environment and the temperature decreases. After the coolant is cooled, it is again transported back to the heat conduction pipeline by the micro pump through the liquid cooling pipeline to continue absorbing heat, forming a closed-loop heat dissipation cycle.

6. The heat dissipation structure of the energy storage connector according to claim 1, characterized in that: The groove is filled with a reinforcement body to form a heat dissipation fin structure.

7. The heat dissipation structure of an energy storage connector according to claim 1, characterized in that: The surface of the heat dissipation fin structure is covered with a metal coating, and the base material of the metal coating is copper or magnesium.

8. The heat dissipation structure of the energy storage connector according to claim 6, characterized in that: The reinforcement is one or more of carbon fibers, silicon carbide particles, and silicon particles.

9. The heat dissipation structure of an energy storage connector according to claim 1, characterized in that: The groove is formed on the surface of the conductor component by etching and photolithography.

10. The heat dissipation structure of an energy storage connector according to claim 1, characterized in that: The size of the grooves reaches micrometer level.

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