Liquid cooling device for solving heat dissipation of double electronic devices by automatically adjusting single liquid cooling temperature

By designing a liquid cooling device that automatically adjusts the single liquid cooling temperature, the diversion, mixing and reflux mechanism of the cold liquid is used to solve the problem of heat dissipation of electronic equipment in summer and winter, and the effect of effective heat dissipation in different seasons is achieved.

CN120050909APending Publication Date: 2025-05-27NANJING RES INST OF ELECTRONICS TECH
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Patent Information

Application Number
CN202510254656.4
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-03-05
Publication Date
2025-05-27

AI Technical Summary

Technical Problem

The prior art is difficult to effectively solve the heat dissipation problem of electronic equipment in summer and winter at the same time, especially in winter, when the air-cooling system cannot work properly, resulting in insufficient heat dissipation of electronic equipment.

Method used

A liquid cooling device with automatic adjustment of single liquid cooling temperature is designed. Through components such as liquid cooling unit, liquid supply main pipe, return pipe, merging pipe and flow control valve, the cooling liquid is automatically adjusted to adapt to the heat dissipation needs in summer and winter.

Benefits of technology

A liquid cooling device that can effectively dissipate heat in summer and winter is realized, ensuring that electronic equipment operates stably in temperature environments in different seasons, and avoiding equipment failures and performance degradation caused by insufficient heat dissipation.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention discloses a liquid cooling device for solving heat dissipation of double electronic devices through single liquid cooling temperature automatic adjustment, and relates to the technical field of heat dissipation of electronic devices. According to the liquid cooling device for solving heat dissipation of the double electronic devices through single liquid cooling temperature automatic adjustment, the cold liquid is subjected to primary mixing and cooling with part of high-temperature cold liquid subjected to heat exchange through the electronic devices in a cold liquid shunting mode through the first shunting pipe, and then the cold liquid subjected to primary mixing and cooling is subjected to shunting treatment; part of the cold liquid subjected to primary mixing and cooling and part of the high-temperature cold liquid subjected to heat exchange are subjected to secondary mixing and cooling, and meanwhile, the cold liquid and part of the cold liquid subjected to mixing and cooling are subjected to tertiary mixing and cooling in a cold liquid flow dividing mode through a second flow dividing pipe; and finally, the cold liquid subjected to secondary mixing and cooling and the cold liquid subjected to tertiary mixing and cooling are combined and conveyed back to the liquid cooling unit, heat dissipation of the electronic equipment is completed, meanwhile, a comfortable temperature environment is constructed in a cold liquid mixing mode, and the heat dissipation contradiction of the electronic equipment caused by summer and winter is effectively avoided.
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Description

Technical Field

[0001] The present invention relates to the technical field of heat dissipation of electronic devices, and specifically to a liquid cooling device that uses single liquid cooling with automatic temperature adjustment to solve the heat dissipation of dual electronic devices. Background Art

[0002] During the operation of electronic devices, a large amount of heat is generated. If this heat cannot be dissipated in time, it will cause the internal temperature of the device to rise, which will in turn affect the stable operation of the device. Moreover, a high-temperature environment may cause the performance of electronic components to decline or even lead to failures. Therefore, heat dissipation is the key to ensuring the normal operation of electronic devices. The heat dissipation of conventional electronic devices is often water cooling and / or air cooling.

[0003] For air cooling of air conditioners, it can be used normally in hot summer. However, in winter, considering the comfort of personnel, air cooling is no longer applicable. Moreover, in winter, air conditioners face problems such as the compressor being unable to start due to low temperature and reduced refrigeration, and cannot effectively meet the heat dissipation requirements of electronic devices. For this reason, a liquid cooling device that uses single liquid cooling with automatic temperature adjustment to solve the heat dissipation of dual electronic devices is specifically proposed. While providing a comfortable environment for personnel, it is suitable for heat dissipation of electronic devices in summer and can also ensure effective heat dissipation of electronic devices in winter. Summary of the Invention

[0004] Aiming at the deficiencies of the prior art, the present invention provides a liquid cooling device that uses single liquid cooling with automatic temperature adjustment to solve the heat dissipation of dual electronic devices, and solves the problems raised in the above background art.

[0005] To achieve the above objectives, the present invention is realized through the following technical solutions: A liquid cooling device that uses single liquid cooling with automatic temperature adjustment to solve the heat dissipation of dual electronic devices, including a liquid cooling unit and electronic devices. The output end of the liquid cooling unit is connected to the liquid cooling input end of the electronic devices through a main supply pipe. The liquid cooling output end of the electronic devices is connected to a first return pipe. One end of the first return pipe is connected to a second return pipe and a third return pipe through a first three-way valve. One end of the third return pipe is connected to a first confluence pipe through a second three-way valve. One end of the first confluence pipe is connected to a main return pipe through a third three-way valve, and one end of the main return pipe is connected to the input end of the liquid cooling unit.

[0006] The present invention is further configured as: The surfaces of the second return pipe and the third return pipe are sequentially provided with a first flow control valve and a second flow control valve.

[0007] The present invention is further configured as: The surface of the main supply pipe is sequentially connected to a first shunt pipe and a second shunt pipe. One end of the first shunt pipe and one end of the second return pipe are jointly connected to a second confluence pipe through a fourth three-way valve. One end of the second confluence pipe is connected to a mixing conduit and a third shunt pipe respectively through a fifth three-way valve.

[0008] The present invention is further configured such that one end of the mixing conduit is communicated with one end of a third return pipe through a second three-way valve.

[0009] The present invention is further configured such that third flow control valves, fourth flow control valves, fifth flow control valves, and sixth flow control valves are sequentially arranged on the surfaces of the first shunt pipe, the second shunt pipe, the mixing conduit, and the third shunt pipe.

[0010] The present invention is further configured such that a seventh flow control valve and an eighth flow control valve are arranged on the surface of the main liquid supply pipe. The seventh flow control valve is arranged between the first shunt pipe and the second shunt pipe, and the eighth flow control valve is arranged between the second shunt pipe and the electronic device.

[0011] The present invention is further configured such that one end of the second shunt pipe and one end of the third shunt pipe are commonly communicated with a third confluence pipe through a sixth three-way valve.

[0012] The present invention is further configured such that one end of the third confluence pipe is communicated with the first confluence pipe and the main liquid return pipe respectively through a third three-way valve.

[0013] The present invention provides a liquid cooling device for automatically adjusting the temperature of a single liquid cooling to solve the heat dissipation of dual electronic devices, having the following beneficial effects: The present invention cools the primary mixture by mixing the cold liquid shunted by the first shunt pipe with a part of the high-temperature cold liquid after heat exchange with the electronic device. Then, the cold liquid after the primary mixture cooling is shunted, and a part of the cold liquid after the primary mixture cooling is mixed with a part of the high-temperature cold liquid after heat exchange for secondary mixture cooling. At the same time, the cold liquid is shunted by the second shunt pipe, and the cold liquid is mixed with a part of the cold liquid after the mixture cooling for tertiary mixture cooling. Finally, the cold liquid after the secondary mixture cooling and the cold liquid after the tertiary mixture cooling are combined and transported back to the liquid cooling unit. While completing the heat dissipation of the electronic device, a comfortable temperature environment is constructed in the way of cold liquid mixing, effectively avoiding the heat dissipation contradiction of the electronic device brought about in summer and winter. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 is a schematic diagram of the heat dissipation principle of the present invention; Figure 2 is a schematic diagram of the working principle in summer in an embodiment of the present invention; Figure 3 is a schematic diagram of the working principle in winter in an embodiment of the present invention.

[0015] In the figure: 1. Liquid cooling unit; 2. Electronic device; 3. Main liquid supply pipe; 4. First return pipe; 5. Second return pipe; 6. Third return pipe; 7. First confluence pipe; 8. Main liquid return pipe; 9. First flow control valve; 10. Second flow control valve; 11. First shunt pipe; 12. Second shunt pipe; 13. Second confluence pipe; 14. Mixing duct; 15. Third shunt pipe; 16. Third flow control valve; 17. Fourth flow control valve; 18. Fifth flow control valve; 19. Sixth flow control valve; 20. Seventh flow control valve; 21. Eighth flow control valve; 22. Third confluence pipe. Specific embodiments

[0016] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.

[0017] Please refer to Figures 1-3 , the embodiments of the present invention provide the following technical solutions: Embodiment 1 A liquid cooling device for automatically regulating the temperature of a single liquid cooling to solve the heat dissipation of dual electronic devices, including a liquid cooling unit 1 and an electronic device 2. The output end of the liquid cooling unit 1 is communicated with the liquid cooling input end of the electronic device 2 through a main supply pipe 3. A first return pipe 4 is communicated with the liquid cooling output end of the electronic device 2. One end of the first return pipe 4 is communicated with a second return pipe 5 and a third return pipe 6 through a first three-way valve. In order to ensure the uniformity of the subsequent cold liquid mixing temperature, a first flow control valve 9 and a second flow control valve 10 are sequentially arranged on the surfaces of the second return pipe 5 and the third return pipe 6 for controlling the flow rate of the cold liquid flowing through the second return pipe 5 and the third return pipe 6. One end of the third return pipe 6 is communicated with a first confluence pipe 7 and a mixing conduit 14 through a second three-way valve. One end of the first confluence pipe 7 is communicated with a main return pipe 8 through a third three-way valve, and one end of the main return pipe 8 is communicated with the input end of the liquid cooling unit 1. A first shunt pipe 11 and a second shunt pipe 12 are sequentially communicated with the surface of the main supply pipe 3. One end of the first shunt pipe 11 and one end of the second return pipe 5 are jointly communicated with a second confluence pipe 13 through a fourth three-way valve. One end of the second confluence pipe 13 and one end of the mixing conduit 14 are jointly communicated with a third shunt pipe 15 through a fifth three-way valve. In order to ensure the uniformity of the subsequent cold liquid mixing temperature, a third flow control valve 16, a fourth flow control valve 17, a fifth flow control valve 18 and a sixth flow control valve 19 are sequentially arranged on the surfaces of the first shunt pipe 11, the second shunt pipe 12, the mixing conduit 14 and the third shunt pipe 15 for controlling the flow rate of the cold liquid flowing through the first shunt pipe 11, the second shunt pipe 12, the mixing conduit 14 and the third shunt pipe 15. One end of the second shunt pipe 12 and one end of the third shunt pipe 15 are jointly communicated with a third confluence pipe 22 through a sixth three-way valve. One end of the third confluence pipe 22 is communicated with the first confluence pipe 7 and the main return pipe 8 respectively through a third three-way valve. Similarly, a seventh flow control valve 20 and an eighth flow control valve 21 are arranged on the surface of the main supply pipe 3 for controlling the flow rate of the cold liquid flowing through the first shunt pipe 11, the second shunt pipe 12 and the main supply pipe 3. The seventh flow control valve 20 is arranged between the first shunt pipe 11 and the second shunt pipe 12, and the eighth flow control valve 21 is arranged between the second shunt pipe 12 and the electronic device 2.

[0018] Embodiment 2 In summer, the temperature of the electronic device is relatively high. As shown in the attachment Figure 2 The liquid cooling unit 1 outputs cold liquid at 15°. At this time, the fourth flow control valve 17 controls a shunt of 25%, the seventh flow control valve 20 controls a shunt of 75%, the third flow control valve 16 controls a shunt of 25%, and the eighth flow control valve 21 controls a shunt of 50%. After the cold liquid flowing into the electronic device 2 exchanges heat with the electronic device 2, 30° cold liquid is obtained in the first return pipe 4; Control both the first flow control valve 9 and the second flow control valve 10 to divert 50%. At this time, the cold liquid flowing into the second return pipe 5 and the third return pipe 6 is both 30°; The cold liquid in the second return pipe 5 and the first diversion pipe 11 merges in the second confluence pipe 13 to obtain cold liquid at 22.5°. Control both the fifth flow control valve 18 and the sixth flow control valve 19 to divert 50%. At this time, the cold liquid flowing into the mixing conduit 14 and the third diversion pipe 15 is both 22.5°; The cold liquid in the mixing conduit 14 and the cold liquid in the third return pipe 6 are introduced into the first confluence pipe 7 together to obtain cold liquid at 26.25°; The cold liquid in the third diversion pipe 15 and the second diversion pipe 12 are introduced into the third confluence pipe 22 together to obtain cold liquid at 18.75°; The cold liquid in the first confluence pipe 7 and the third confluence pipe 22 are introduced into the main return pipe 8 together to obtain cold liquid at 22.5°, and then sent back to the liquid cooling unit 1.

[0019] In this embodiment, by adjusting the flow rate of the flow control valves, while ensuring the accuracy of the mixed cold liquid temperature prediction, a comfortable temperature environment can also be constructed through the second confluence pipe 13, the mixing conduit 14, the third diversion pipe 15, the first confluence pipe 7, the third confluence pipe 22 and the main return pipe 8.

[0020] Embodiment Three In winter, the temperature of the electronic device is lower than that in summer. As shown in the appendix Figure 3 The liquid cooling unit 1 outputs cold liquid at 15°. At this time, the fourth flow control valve 17 controls a diversion of 25%, the seventh flow control valve 20 controls a diversion of 75%, the third flow control valve 16 controls a diversion of 25%, and the eighth flow control valve 21 controls a diversion of 50%. After the cold liquid flowing into the electronic device 2 exchanges heat with the electronic device 2, cold liquid at 27.5° is obtained in the first return pipe 4; Control both the first flow control valve 9 and the second flow control valve 10 to divert 50%. At this time, the cold liquid flowing into the second return pipe 5 and the third return pipe 6 is both 27.5°; The cold liquid in the second return pipe 5 and the first diversion pipe 11 merges in the second confluence pipe 13 to obtain cold liquid at 21.25°. Control both the fifth flow control valve 18 and the sixth flow control valve 19 to divert 50%. At this time, the cold liquid flowing into the mixing conduit 14 and the third diversion pipe 15 is both 22.5°; The cold liquid in the mixing conduit 14 and the cold liquid in the third return pipe 6 are introduced into the first confluence pipe 7 together to obtain cold liquid at 24.375°; The cold liquid in the third diversion pipe 15 and the second diversion pipe 12 are introduced into the third confluence pipe 22 together to obtain cold liquid at 18.125°; The cold liquid in the first confluence pipe 7 and the third confluence pipe 22 is introduced into the main return liquid pipe 8 together to obtain cold liquid at 21.25° and send it back to the liquid cooling unit 1.

[0021] In this embodiment, by adjusting the flow rate of the flow control valve, while ensuring the accuracy of the prediction of the temperature of the mixed cold liquid, a comfortable temperature environment can also be constructed through the second confluence pipe 13, the mixing conduit 14, the third shunt pipe 15, the first confluence pipe 7, the third confluence pipe 22, and the main return liquid pipe 8.

[0022] In summary, on the basis of effectively dissipating heat from the electronic device 2, the present invention can achieve the rapid mixing of cold liquids by controlling the flow rate of the flow control valve, so as to ensure the relative uniformity and controllability of the temperature. On the premise of a short flow path, a comfortable temperature environment is created, effectively avoiding the comfort contradiction caused by heat dissipation in summer and winter of the electronic device 2. Moreover, through the convenient regulation of the flow control valve, the temperature of the cold liquid output by the liquid cooling unit 1 and the temperature within the temperature range of the cold liquid after heat exchange with the electronic device 2 can be conveniently regulated as needed, and it has good scalability.

[0023] It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or further includes elements inherent to such process, method, article or device.

[0024] Although the embodiments of the present invention have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A liquid cooling device for automatically adjusting the temperature of a single liquid cooling device to solve the heat dissipation of dual electronic equipment, comprising a liquid cooling unit (1) and an electronic device (2), characterized in that: The output end of the liquid cooling unit (1) is connected to the liquid cooling input end of the electronic device (2) through a liquid supply pipe (3); the liquid cooling output end of the electronic device (2) is connected to a first return pipe (4); one end of the first return pipe (4) is connected to a second return pipe (5) and a third return pipe (6) through a first three-way valve; one end of the third return pipe (6) is connected to a first converging pipe (7) through a second three-way valve; one end of the first converging pipe (7) is connected to a liquid return pipe (8) through a third three-way valve; and one end of the liquid return pipe (8) is connected to the input end of the liquid cooling unit (1).

2. According to claim 1, a liquid cooling device with automatic temperature adjustment for solving the heat dissipation of dual electronic equipment is characterized by: A first flow control valve (9) and a second flow control valve (10) are provided on the surfaces of the second return pipe (5) and the third return pipe (6) in sequence.

3. According to claim 2, a liquid cooling device with automatic temperature adjustment for solving the heat dissipation of dual electronic equipment is characterized in that: The surface of the liquid supply main pipe (3) is connected in sequence with a first diverter pipe (11) and a second diverter pipe (12); one end of the first diverter pipe (11) and one end of the second return pipe (5) are connected to a second converging pipe (13) via a fourth three-way valve; one end of the second converging pipe (13) is connected to a mixing conduit (14) and a third diverter pipe (15) via a fifth three-way valve.

4. According to claim 3, a liquid cooling device with automatic temperature adjustment for solving the heat dissipation of dual electronic equipment is characterized in that: One end of the mixing conduit (14) is connected to one end of the third reflux pipe (6) via a second three-way valve.

5. According to claim 4, a liquid cooling device with automatic temperature adjustment for solving the heat dissipation of dual electronic equipment is characterized in that: A third flow control valve (16), a fourth flow control valve (17), a fifth flow control valve (18) and a sixth flow control valve (19) are sequentially arranged on the surfaces of the first flow diversion pipe (11), the second flow diversion pipe (12), the mixing conduit (14) and the third flow diversion pipe (15).

6. According to claim 5, a liquid cooling device with automatic temperature adjustment for solving the heat dissipation of dual electronic equipment is characterized in that: A seventh flow control valve (20) and an eighth flow control valve (21) are arranged on the surface of the liquid supply main pipe (3); the seventh flow control valve (20) is arranged between the first shunt pipe (11) and the second shunt pipe (12); and the eighth flow control valve (21) is arranged between the second shunt pipe (12) and the electronic device (2).

7. According to claim 6, a liquid cooling device with automatic temperature adjustment for solving the heat dissipation of dual electronic equipment is characterized in that: One end of the second flow branching pipe (12) and one end of the third flow branching pipe (15) are connected to a third converging pipe (22) via a sixth three-way valve.

8. The liquid cooling device for automatically adjusting the temperature of a single liquid cooling device to solve the heat dissipation of dual electronic equipment according to claim 7, characterized in that: One end of the third converging pipe (22) is respectively connected to the first converging pipe (7) and the liquid return main pipe (8) via a third three-way valve.