Laser processing system and processing method

Abstract

The invention provides a laser processing system, a processing method and a control system, and the system comprises a laser device which is used for emitting laser to process a to-be-processed workpiece; the servo motor is used for driving the laser to move; the encoder module is used for monitoring the servo motor to obtain the real-time speed and the operation time of the servo motor and calculating the real-time position of the laser according to the real-time speed and the operation time; the motion controller is used for setting a moving path, and the motion controller controls the servo motor to operate according to the moving path, the real-time speed and the real-time position so that the laser can move along the moving path; and the laser controller is used for setting a plurality of processing positions on the moving path, comparing the real-time position with the processing positions, and controlling the laser to emit laser when the real-time position is located at the processing position. According to the invention, the processing precision and the response speed of the laser processing equipment under the conditions of complex paths and variable-speed processing can be obviously improved, and errors in the laser processing process are reduced.

Description

Technical Field

[0001] The present invention relates to the field of laser processing, and particularly to a laser processing system and a processing method. Background Art

[0002] In the traditional field of laser processing, during the laser processing of rounded corners and curves, usually the cutting speed of the laser is faster in the straight-line segment part, and it moves slowly to cut in the rounded corner part. For the triggering condition of laser processing, if laser pulses are emitted at a fixed frequency, unnecessary overburn will occur due to high pulse overlap in the rounded corner part, resulting in aging. Additionally, it depends on time control or manual control rather than precise position signals for control, which will lead to problems of insufficient accuracy in laser processing scenarios with high-speed movement or complex paths. Therefore, there are areas for improvement. Summary of the Invention

[0003] In view of the above-mentioned disadvantages of the prior art, the purpose of the present invention is to provide a laser processing system and a processing method for improving the problem of overburn in the rounded corner part during laser processing in the prior art.

[0004] To achieve the above object and other related objects, the present invention provides a laser processing system, including:

[0005] A laser for emitting laser to process a workpiece to be processed;

[0006] A servo motor for driving the laser to move;

[0007] An encoder module for monitoring the servo motor to obtain the real-time speed and running time of the servo motor, and calculating the real-time position of the laser according to the real-time speed and the running time;

[0008] A motion controller for setting a moving path, and the motion controller controls the operation of the servo motor according to the moving path, the real-time speed, and the real-time position, so that the laser moves along the moving path;

[0009] A laser controller for setting a plurality of processing positions on the moving path, comparing the real-time position with the processing positions, and controlling the laser to emit laser when the real-time position is located at the processing position.

[0010] In an embodiment of the present invention, the laser controller is used to set a plurality of buffer positions on the moving path, each buffer position is located before the corresponding processing position, and when the real-time position is located at one of the buffer positions, the laser controller controls the laser to emit laser after a delay duration;

[0011] Wherein, in the extending direction of the moving path, the distance between the buffering position and its corresponding processing position is the delay distance, and the delay distance is obtained by integrating the real-time speed and the delay duration.

[0012] In an embodiment of the present invention, when the moving path is a straight line segment, the servo motor drives the laser to move at a constant speed.

[0013] In an embodiment of the present invention, when the moving path includes alternating straight line segments and curve segments, at the junction of the straight line segment and the curve segment of the laser, the servo motor drives the laser to decelerate and move on the straight line segment;

[0014] At the junction of the curve segment and the straight line segment of the laser, the servo motor drives the laser to accelerate and move on the curve segment.

[0015] In an embodiment of the present invention, the laser controller is used to record the moving path between two adjacent processing positions as an interval path in the extending direction of the moving path, and the distances of all the interval paths are the same.

[0016] In an embodiment of the present invention, the laser controller is used to count the angle between the straight lines where every two adjacent interval paths are located, which is denoted as the interval angle;

[0017] The motion controller is used to control the servo motor to accelerate when the interval angle between adjacent interval distances becomes larger on the moving path; to control the servo motor to decelerate when the interval angle between adjacent interval distances becomes smaller; and to control the servo motor to move at a constant speed when the interval angles between adjacent interval distances are the same.

[0018] In an embodiment of the present invention, the motion controller adjusts the acceleration of the servo motor based on the change rate of the interval angle so that the laser moves along the moving path.

[0019] In an embodiment of the present invention, the laser processing system further includes a computer, and the moving path, the processing position, and the real-time position are displayed on the display screen of the computer.

[0020] In an embodiment of the present invention, there are at least two servo motors. One servo motor drives the laser to move along a first path, and the other servo motor drives the laser to move along a second path. The first path and the second path form the moving path.

[0021] The present invention also provides a laser processing method, including:

[0022] Drive the laser to move through a servo motor;

[0023] Monitor the servo motor to obtain the real-time speed and running time of the servo motor, and calculate the real-time position of the laser according to the real-time speed and the running time;

[0024] Set a moving path, and control the servo motor to continue running according to the moving path, the real-time speed, and the real-time position, so that the laser moves along the moving path;

[0025] Set multiple processing positions on the moving path, compare the real-time position with the processing positions, and control the laser to emit laser when the real-time position is at the processing position.

[0026] As described above, a laser processing system and a processing method of the present invention can significantly improve the processing accuracy and response speed of laser processing equipment under complex paths and variable-speed processing conditions, and reduce errors in the laser processing process. Description of the Drawings

[0027] Figure 1 It is a schematic diagram of overburning in the rounded corner part of laser processing existing in the prior art.

[0028] Figure 2 It is a schematic diagram of laser processing in the rounded corner part provided by an embodiment of the present invention.

[0029] Figure 3 It is a structural block diagram of a laser processing system provided by an embodiment of the present invention.

[0030] Figure 4 It is a schematic diagram of driving a laser to move by a servo motor provided by an embodiment of the present invention.

[0031] Figure 5 It is a schematic diagram of the moving path and the interval distance of the laser provided by an embodiment of the present invention.

[0032] Figure 6 It is a schematic diagram of the pulse time and the pulse generation period of the laser provided by an embodiment of the present invention.

[0033] Figure 7 It is a schematic diagram of the steps of a laser processing method provided by an embodiment of the present invention.

[0034] Reference Signs

[0035] 10. First straight segment; 20. Curve segment; 30. Second straight segment; 101. Processing position;

[0036] 110. Computer; 120. Motion controller; 130. Encoder module; 140. Servo motor; 150. Laser controller; 160. Laser

[0037] 210. First guide rail; 220. First servo motor; 230. Second guide rail; 240. Second servo motor; 250. Workpiece to be machined. Detailed implementation mode

[0038] The following uses specific specific examples to illustrate the implementation mode of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific implementation modes. Various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention. It should be noted that, without conflict, the following embodiments and the features in the embodiments can be combined with each other.

[0039] It should be noted that the drawings provided in the following embodiments only illustrate the basic concept of the present invention in a schematic manner. Therefore, only the components related to the present invention are shown in the drawings, rather than being drawn according to the number, shape, and size of the components in actual implementation. The type, quantity, and ratio of each component in actual implementation can be arbitrarily changed, and the component layout type may also be more complex.

[0040] In the following description, a large number of details are explored to provide a more thorough explanation of the embodiments of the present invention. However, it is obvious to those skilled in the art that the embodiments of the present invention can be implemented without these specific details. In other embodiments, well-known structures and devices are shown in the form of block diagrams rather than in detail to avoid making the embodiments of the present invention difficult to understand.

[0041] Please refer to Figure 1 , during the laser processing of rounded corners and curves in the prior art, when laser pulses are emitted at a fixed frequency, unnecessary overburn will occur due to high pulse overlap at the rounded corner part, resulting in aging phenomena. Please refer to Figures 2 to 7 , the present invention proposes a laser processing system and a processing method, which can significantly improve the processing accuracy and response speed of laser processing equipment under complex paths and variable-speed processing conditions, reduce errors during laser processing, and are applicable to application scenarios such as precision laser cutting, microfabrication, and surface engraving that require precise positioning and control. In addition, the present invention has strong adaptability and can be applied to a variety of laser devices and multi-axis numerical control systems, with broad market potential and application prospects.

[0042] Please refer to Figure 2 , Figure 3, in an embodiment of the present invention, the laser processing system may include a computer 110, a motion controller 120, an encoder module 130, a servo motor 140, a laser controller 150, and a laser 160.

[0043] Among them, the laser 160 can be used to emit laser to process the workpiece 250 to be processed, such as laser cutting. The servo motor 140 is used to drive the laser 160 to move, which can be a straight-line segment movement or a curved-line segment movement. The encoder module 130 is used to monitor the servo motor 140. During the operation of the servo motor 140, the encoder module 130 can obtain the real-time speed and running time of the servo motor 140, and calculate the real-time position of the laser 160 based on the real-time speed and running time.

[0044] Specifically, the encoder module 130 usually includes a grating disk and a photoelectric receiver. When the motor shaft of the servo motor 140 rotates, the grating disk rotates synchronously, causing the light beam to be periodically blocked and allowed to pass through, which generates a series of pulses. Each pulse represents a certain angular displacement. By calculating the number of these pulses, the angle or distance rotated by the servo motor 140 can be determined, and by measuring the number of pulses per unit time, the speed can be calculated.

[0045] Among them, the motion controller 120 is used to set the movement path. The motion controller 120 controls the operation of the servo motor 140 according to the movement path, real-time speed, and real-time position, so that the laser 160 moves along the movement path. The movement path set by the motion controller 120 is the processing path of the laser 160. The movement path can be a straight-line segment, a curved-line segment, or a combination of a straight-line segment and a curved-line segment.

[0046] Specifically, the motion controller 120 is a device dedicated to controlling the precise movement of mechanical components or systems. They are widely used in fields such as automated production lines, robotics, and precision instrument manufacturing. The main functions of the motion controller 120 include, but are not limited to, position control, speed control, and acceleration control, etc., to ensure that the servo motor 140 can operate accurately according to the predetermined movement path or mode.

[0047] The laser controller 150 is used to set the processing position 101 on the movement path, compare the real-time position with the processing position 101, and control the laser 160 to emit laser when the real-time position is at the processing position 101.

[0048] Specifically, the laser controller 150 is mainly used to control the working parameters of the laser, such as power, frequency, pulse width, etc., to meet different processing or experimental requirements. With the wide application of laser technology in fields such as microfabrication, medical treatment, and scientific research, the role of the laser controller 150 becomes more and more important.

[0049] Combined with Figure 1 and Figure 2 for analysis, in this embodiment, it is only necessary for the laser controller 150 to set an appropriate processing position 101 on the moving path. When the real-time position of the laser is the same as the processing position 101, the laser controller 150 controls the laser 160 to perform processing on the workpiece 250 to be processed.

[0050] As Figure 2 shown, since the processing position 101 on the moving path is set in advance by the laser controller 150, the processing positions 101 of the straight line segments and curve segments on the moving path can be reasonably planned in advance, so as to avoid unnecessary overburning at the rounded corners of the workpiece 250 to be processed due to high pulse overlap.

[0051] Please refer to Figure 2 and Figure 3 , in an embodiment of the present invention, the laser controller 150 is used to control the laser 160 to emit laser when the real-time position is the same as the processing position 101.

[0052] Alternatively, the laser controller 150 is used to set a plurality of buffer positions on the moving path, each buffer position is located before the corresponding processing position 101, and when the real-time position is at one of the buffer positions, the laser controller 150 controls the laser 160 to emit laser after a delay duration.

[0053] Wherein, in the extending direction of the moving path, the distance between the buffer position and its corresponding processing position 101 is the delay distance, and the delay distance is obtained by integrating the real-time speed and the delay duration.

[0054] Specifically, when the real-time position is the same as the processing position 101, the laser controller 150 can control the laser 160 to directly emit laser to process the workpiece 250 to be processed.

[0055] Of course, considering that while the laser beam emitted by the laser 160 irradiates the surface of the workpiece 250 to be processed, the servo motor 140 also drives the laser 160 to move. Therefore, it can be considered that the laser controller 150 controls the laser 160 in advance and makes the laser 160 emit laser after a delay time to process the workpiece 250 to be processed. In order to ensure that the laser emitted by the laser 160 processes the processing position 101, the real-time speed is integrated over a period of time. When the integration result of the real-time speed over this period of time is the delay distance, it indicates that this period of time is the delay time.

[0056] Please refer to Figure 2 and Figure 3 , in an embodiment of the present invention, when the moving path is a straight line segment, the servo motor 140 drives the laser 160 to move at a constant speed.

[0057] When the moving path includes alternating straight segments and curved segments, at the junction of the straight segment and the curved segment of the laser 160, the servo motor 140 drives the laser 160 to move at a reduced speed in the straight segment. At the junction of the curved segment and the straight segment of the laser 160, the servo motor 140 drives the laser 160 to move at an accelerated speed in the straight segment.

[0058] Specifically, for the rounded corners or complex regions of the workpiece 250 to be processed, in order to ensure smooth edges and no burrs, and to guarantee the machining accuracy and surface quality of the workpiece 250, in the curved segment of the moving path, the servo motor 140 can drive the laser 160 to perform laser machining on the workpiece 250 at a slower moving speed. In the straight segment of the moving path, the servo motor 140 can drive the laser 160 to perform laser machining on the workpiece 250 at a faster moving speed.

[0059] For example, for high-precision parts such as mobile phone components, electronic products, and medical devices, the requirements for cutting edges and hole diameters are very strict, and even micron-level errors will affect the performance of the product. In this embodiment, by driving the laser 160 to perform laser machining on the workpiece 250 at a slower moving speed in the curved segment of the moving path, it can ensure that the laser beam is accurately triggered at each machining position 101, making the cutting edge smoother and burr-free.

[0060] Please refer to Figure 2 、 Figure 3 and Figure 4 In an embodiment of the present invention, there are at least two servo motors 140. One servo motor 140 drives the laser 160 to move along a first path, and the other servo motor 140 drives the laser 160 to move along a second path.

[0061] Specifically, as Figure 4 shown, for machining a large-area workpiece with a high-precision tightly focused beam, the workpiece must move under the focused beam on the X, Y displacement table system. For example, the first servo motor 220 can drive the second guide rail 230 to move on the first guide rail 210, and the second servo motor 240 can drive the laser 160 (not shown in the figure) to move on the second guide rail 230, and the laser 160 can perform laser machining on the bottom workpiece 250.

[0062] Please refer to Figure 2 、 Figure 3 and Figure 5 In an embodiment of the present invention, the laser controller 150 is used to record the moving path between two adjacent machining positions 101 as an interval path in the extending direction of the moving path, and the distances of all interval paths are the same.

[0063] To ensure the processing result of the workpiece 250 to be processed, on the movement path, the movement path between two adjacent processing positions 101 is set as an interval path, and the distances of the interval paths corresponding to different processing positions 101 are the same. Thus, the pulse energy of the laser beam can act on the workpiece 250 evenly, ensuring the processing accuracy and quality of the workpiece 250.

[0064] Please refer to Figure 2 、 Figure 3 and Figure 5 , in an embodiment of the present invention, the laser controller 150 is used to count the angle between every two adjacent interval paths, denoted as the interval angle.

[0065] Specifically, when two adjacent interval paths are located on a straight line segment, the angle between the straight lines where the two adjacent interval paths are located is denoted as the interval angle. When two adjacent interval paths are located on a curve segment, the angle between the tangents where the two adjacent interval paths are located is denoted as the interval angle.

[0066] The motion controller 150 is used to control the servo motor 140 to accelerate when the interval angle between adjacent interval distances becomes larger on the movement path; control the servo motor 140 to decelerate when the interval angle between adjacent interval distances becomes smaller; and control the servo motor 140 to run at a constant speed when the interval angles between adjacent interval distances are the same.

[0067] As Figure 2 、 Figure 5 shown, from the above description, it can be seen that on the curve segment of the movement path, the servo motor 140 can drive the laser 160 to perform laser processing on the workpiece 250 at a slower movement speed, ensuring that the edge of the workpiece 250 is smooth and free of burrs. For the motion controller 120, for the movement path planned by the laser controller 150, it is necessary to accurately analyze the path conditions corresponding to different interval distances, so as to drive the laser 160 to move faster on the straight line segment part of the movement path and drive the laser 160 to move slower on the curve segment part of the movement path.

[0068] Specifically, when the interval angles between adjacent interval distances are the same, it indicates that the adjacent interval distances are in the straight line segment part or the circular arc segment part. At this time, the motion controller 120 can control the servo motor 140 to run at a constant speed.

[0069] When the interval angle between adjacent interval distances becomes larger, it indicates that the adjacent interval distances are from the curve segment to the straight line segment, or from the curve segment with a larger radian to the curve segment with a smaller radian. At this time, the motion controller 120 can control the servo motor 140 to accelerate.

[0070] When the included angle of adjacent interval distances becomes larger, it indicates that the adjacent interval distance enters the curved segment from the straight segment, or enters the curved segment with a larger radian from the curved segment with a smaller radian. At this time, the motion controller 120 can control the servo motor 140 to operate at a reduced speed.

[0071] Please refer to Figure 2 、 Figure 3 and Figure 5 In an embodiment of the present invention, the motion controller 120 adjusts the acceleration of the servo motor 140 based on the change rate of the included angle so that the laser moves along the moving path.

[0072] Specifically, when the change rate of the included angle is larger, it indicates that the change in the bending degree of the moving path is more obvious. For example, when entering the curved segment from the straight segment, or entering the straight segment from the curved segment, the motion controller 120 needs to control the servo motor 140 to accelerate faster or decelerate faster.

[0073] When the change rate of the included angle is smaller, it indicates that the change in the bending degree of the moving path is less obvious. For example, the interval distance corresponding to the included angle is always on the straight segment, or the interval distance corresponding to the included angle is on the arc of a circle. The motion controller 120 needs to control the servo motor 140 to maintain the current operating speed as much as possible.

[0074] Please refer to Figure 6 In an embodiment of the present invention, from the above analysis, it can be seen that on the curved segment of the moving path, the servo motor 140 can drive the laser 160 to move at a slower speed, and on the straight segment of the moving path, the servo motor 140 can drive the laser 160 to move at a faster speed. Therefore, the pulse time of the laser 160 can be adjusted appropriately. The laser controller 150 can control the laser 160 by means of PWM (Pulse Width Modulation).

[0075] In addition, in the cutting of multi-layer composite materials in the automotive or shipbuilding industries, there are situations where the material thickness suddenly increases or decreases. The laser power can be reduced at the thin material and increased at the thick material to ensure stable cutting depth. Dynamically adjusting the laser power during the cutting process can be achieved by adjusting the laser power corresponding to the laser 160, or by adjusting the pulse time of the laser emitted by the laser 160.

[0076] The computer 110 can provide a display interface, and the display interface can display the preset moving path, the real-time position of the laser 160, and the preset processing position 101 on the moving path.

[0077] Please refer to Figure 7, in an embodiment of the present invention, a laser processing method may include the following steps.

[0078] Step S10: Drive the laser to move through a servo motor.

[0079] Step S20: Monitor the servo motor to obtain the real-time speed and running time of the servo motor, and calculate the real-time position of the laser according to the real-time speed and running time.

[0080] Step S30: Set a moving path, and control the operation of the servo motor according to the moving path, real-time speed, and real-time position, so that the laser moves along the moving path.

[0081] Step S40: Set multiple processing positions on the moving path, compare the real-time position with the processing positions, and control the laser to emit laser when the real-time position is located at the processing position.

[0082] As Figure 2 shown, as long as the laser controller 150 sets appropriate processing positions 101 on the moving path, when the real-time position of the laser is the same as the processing position 101, the laser controller 150 controls the laser 160 to perform processing to process the workpiece to be processed 250.

[0083] Since the processing positions 101 on the moving path are preset by the laser controller 150, the processing positions 101 of the straight line segments and curve segments on the moving path can be reasonably planned in advance, so as to avoid unnecessary overburning due to high pulse overlap at the rounded corners of the workpiece to be processed 250.

[0084] In summary, a laser processing system and a processing method disclosed by the present invention can significantly improve the processing accuracy and response speed of laser processing equipment under complex paths and variable-speed processing conditions, reduce errors in the laser processing process, and are applicable to application scenarios such as precision laser cutting, microfabrication, and surface engraving that require precise positioning and control. Therefore, the present invention effectively overcomes various disadvantages in the prior art and has high industrial utilization value.

[0085] The above embodiments are only illustrative of the principles and effects of the present invention, and are not used to limit the present invention. Any person familiar with this technology can modify or change the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or changes made by those with ordinary knowledge in the technical field without departing from the spirit and technical idea disclosed by the present invention should still be covered by the claims of the present invention.

Claims

1. A laser processing system, characterized in that: include: A laser, used for emitting laser to process the workpiece; A servo motor, used for driving the laser to move; An encoder module, used for monitoring the servo motor to obtain the real-time speed and running time of the servo motor, and calculating the real-time position of the laser according to the real-time speed and the running time; A motion controller, used for controlling the operation of the servo motor according to a preset moving path, the real-time speed, and the real-time position, so that the laser moves along the moving path; The laser controller compares the real-time position with a plurality of processing positions preset on the moving path, and controls the laser to emit laser when the real-time position is located at the processing position.

2. The laser processing system according to claim 1, characterized in that: The laser controller is used to control the laser to emit laser after a delay time when the real-time position is located at one of the buffer positions; wherein a plurality of buffer positions are pre-set on the moving path, and each of the buffer positions is located before a corresponding processing position; Wherein, in the extension direction of the moving path, the distance between the buffer position and the corresponding processing position is the delay distance, and the delay distance is obtained by integrating the real-time speed and the delay time.

3. The laser processing system according to claim 1, characterized in that: When the moving path is a straight line segment, the servo motor drives the laser to keep moving at a constant speed.

4. The laser processing system according to claim 1, characterized in that: When the moving path includes alternating straight segments and curved segments, at the junction of the straight segment and the curved segment, the servo motor drives the laser to move at a reduced speed in the straight segment; At the junction of the curved segment and the straight segment of the laser, the servo motor drives the laser to move at an accelerated speed in the straight segment.

5. The laser processing system according to claim 1, characterized in that: The laser controller is used to record the moving path between two adjacent processing positions as an interval path in the extension direction of the moving path, and the distances of all the interval paths are the same.

6. The laser processing system according to claim 5, characterized in that: The laser controller is used to count the angle between every two adjacent interval paths, which is recorded as the interval angle; The motion controller is used to control the servo motor to accelerate when the interval angle between adjacent intervals becomes larger on the moving path; control the servo motor to decelerate when the interval angle between adjacent intervals becomes smaller; and control the servo motor to run at a constant speed when the interval angles between adjacent intervals are the same.

7. The laser processing system according to claim 6, characterized in that: The motion controller adjusts the acceleration of the servo motor based on the rate of change of the interval angle so that the laser moves along the moving path.

8. The laser processing system according to claim 1, characterized in that: The laser processing system also includes a display screen, on which the moving path, the processing position, and the real-time position are displayed.

9. The laser processing system according to claim 1, characterized in that: There are at least two servo motors, one of which drives the laser to move along a first path, and the other of which drives the laser to move along a second path. The first path and the second path form the moving path.

10. A laser processing method, characterized in that: include: The laser is driven to move by a servo motor; Monitoring the servo motor to obtain the real-time speed and running time of the servo motor, and calculating the real-time position of the laser according to the real-time speed and the running time; According to the preset moving path, the real-time speed, and the real-time position, controlling the servo motor to continue to operate so that the laser moves along the moving path; The real-time position is compared with a plurality of processing positions preset on the moving path, and when the real-time position is located at the processing position, the laser is controlled to emit laser.

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