Integrated cutting and drilling device and method
Through integrated laser processing in the form of galvanomic scanning and Bessel focus head, combined with a shared motion platform and laser light source, the existing equipment's low efficiency in transparent material processing and difficulty in micro-hole processing is solved, and efficient cutting and drilling effects are achieved.
Patent Information
- Application Number
- CN202510309143.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-17
- Publication Date
- 2025-05-30
AI Technical Summary
When handling transparent materials, existing laser processing equipment has problems such as low processing efficiency and difficulty in processing micro-holes and opposite-sex holes. Especially when the expansion coefficient of the material is low, the cutting efficiency and lobes are not good.
Design an integrated cutting and drilling device, combining the laser processing advantages of galvanomic scanning form and Bessel focus head form, and realize the coordinated work of the galvanomic and Bessel cutting head by sharing a set of motion platform and laser light source.
The processing capacity and processing efficiency of the equipment are improved, and the cutting and drilling of transparent materials can be efficiently performed, especially when the expansion coefficient of the material is low, which significantly improves the cutting efficiency and reduces the lobe situation.
Smart Images
Figure CN120055591A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of laser processing, and particularly relates to an integrated cutting and drilling device and method. Background Art
[0002] Laser processing refers to using the thermal effect generated by a laser beam projected onto the material surface to complete the processing process, including laser cutting, laser drilling, laser marking, laser welding, and microprocessing, etc. The laser beam is used to perform various processes on the material, such as cutting, punching, welding, heat treatment, etc. Lasers can be adapted to the processing and manufacturing of various materials, and play an irreplaceable role especially in the processing and manufacturing of some materials with special precision and requirements, special occasions, and special materials. In addition, in the field of laser processing of non-metallic transparent materials, such as the processing of various non-metallic materials such as glass, ceramics, sapphire, semiconductor silicon wafers, etc., unique advantages are also highlighted. The common forms of laser processing equipment for transparent materials are galvanometer scanning and Bessel cutting, and the principles are as follows: Laser drilling is to focus the light beam into pulsed energy and use a single pulse to remove the material point by point. During processing, through galvanometer control, the laser focus quickly scans and moves on the material along a pre-designed path to achieve material removal. The processing thread is from bottom to top in a spiral. The laser passes through the transparent material and focuses on the lower surface of the material, and the material is removed layer by layer from the bottom until the laser drills through the material.
[0003] When using a Bessel focusing head for processing, a high peak power and high peak power density laser are generated through a Bessel beam, which is focused inside the transparent material, instantaneously vaporizes the material in this area to generate a vaporization zone, and quickly spreads to the upper and lower surfaces to form a crack hole. The cutting section is composed of countless small hole points, and cutting is achieved through external stress fracture.
[0004] For various product forms derived from special industrial applications, each has its own unique advantages, and at the same time, corresponding disadvantages inevitably exist. For example, equipment in the form of galvanometer scanning can process micro-holes, irregular holes, etc., but due to this processing form of layer-by-layer material removal, it inevitably has the characteristic of low processing efficiency; for equipment in the form of a Bessel focusing head, the cutting efficiency of transparent materials is greatly improved, but there are also disadvantages such as being not convenient for processing micro-holes, irregular holes, etc., and when the expansion coefficient of the material is relatively low, it is not easy to crack the chips. Summary of the Invention
[0005] The purpose of the present invention is to provide an integrated cutting and drilling device and method, and this device helps to improve the processing ability and processing efficiency of the equipment.
[0006] The technical solution of the present invention lies in: an integrated cutting and drilling device, including a machine base, on which a Y-axis moving table for installing a workpiece table is provided, an X-axis moving table is arranged above the Y-axis moving table, a Z-axis moving table is arranged on the X-axis moving table, and a laser source and an optical path selection system are arranged on the Z-axis moving table. On the Z-axis moving table, a paraxial vision and a Bessel cutting head and a scanning galvanometer system respectively used in cooperation with the optical path selection system are arranged in sequence from left to right below the optical path selection system.
[0007] Further, the workpiece table is a pneumatic adsorption platform and is used for fixedly adsorbing the workpiece to be processed.
[0008] Further, the laser source is an infrared picosecond laser.
[0009] Further, the optical path selection system includes a guide rail driven by a motor to move horizontally, a first 45° reflector is obliquely installed on the guide rail, a second 45° reflector is obliquely installed on the Z-axis moving table above the scanning galvanometer system, and the first 45° reflector and the second 45° reflector are at the same height.
[0010] Further, the optical path selection system includes a half-wave plate, a polarizer is installed above the Bessel cutting head, and a third 45° reflector at the same height as the polarizer is installed above the scanning galvanometer system.
[0011] Further, the paraxial vision is used for visually positioning the mark point and determining the position to be processed; the scanning galvanometer system is used for controlling the light output position of the laser beam in the two-dimensional plane according to the position to be processed.
[0012] An integrated cutting and drilling method, using an integrated cutting and drilling device, includes the following steps: S1: Adjust the optical path selection system, control the light source to emit to the scanning galvanometer system on the right, select the galvanometer processing station in the PC-side processing software; use the scanning galvanometer system to process a 2*2mm cross mark; move the X-axis moving table and the Y-axis moving table to the paraxial vision perspective to complete the visual offset correction of the galvanometer processing center. S2: Adjust the optical path selection system, control the light source to emit to the Bessel cutting head, select the Bessel processing station in the PC-side processing software; use the Bessel cutting head to process a 2*2mm cross mark; move the X-axis moving table and the Y-axis moving table to the paraxial vision perspective to complete the visual offset correction of the Bessel cutting head processing center. S3: Through steps S1 and S2, complete the calibration of the galvanometer processing center and the Bessel cutting processing center, and realize the calibration of the common coordinate system. S4: Adjust the optical path selection system, control the light source to emit to the scanning galvanometer system, and select the galvanometer processing station to perform the drilling process. S5: Adjust the optical path selection system, control the light source to emit to the Bessel cutting head, and select the Bessel processing station to perform the cutting process; S6: Obtain the processed target workpiece after dicing.
[0013] An integrated cutting and drilling method uses an integrated cutting and drilling device, including the following steps: S1: Adjust the half-wave plate forward to a specific angle, make the light source pass through the polarizer and reach the scanning galvanometer system through the third 45° mirror, and select the galvanometer processing station in the PC-side processing software; Use the scanning galvanometer system to process a 2*2mm cross mark; Move the X-axis moving table and Y-axis moving table to the paraxial vision angle to complete the vision offset correction of the galvanometer processing center; S2: Adjust the half-wave plate backward to a specific angle, the polarizer realizes the reflection effect, the light source is reflected by the polarizer to the Bessel cutting head, and select the Bessel processing station in the PC-side processing software; Use the Bessel cutting head to process a 2*2mm cross mark; Move the X-axis and Y-axis platforms to the paraxial vision angle to complete the vision offset correction of the Bessel cutting head processing center; S3: Through steps S1 and S2, complete the calibration of the galvanometer processing center and the Bessel cutting processing center, and realize the calibration of the common coordinate system; S4: Adjust the optical path selection system, control the light source to emit to the scanning galvanometer system, and select the galvanometer processing station to perform the drilling process; S5: Adjust the optical path selection system, control the light source to emit to the Bessel cutting head, and select the Bessel processing station to perform the cutting process; S6: Obtain the processed target workpiece after dicing.
[0014] Compared with the prior art, the present invention has the following advantages: This device integrates the laser processing advantages of the galvanometer scanning form and the Bessel focusing head form, which helps to improve the processing ability and processing efficiency of the equipment. At the same time, because the equipment shares a set of motion platforms and laser light sources, the equipment has better economic performance and application value. Description of the Drawings
[0015] Figure 1 is the structural schematic diagram of the present invention; Figure 2 is the implementation form schematic diagram of the optical path selection system in Embodiment 1 of the present invention; Figure 3 is the implementation form schematic diagram of the optical path selection system in Embodiment 2 of the present invention; Figure 4 is the processing drawing in the embodiment of the present invention; Figure 5 is the flowchart of laser cutting and drilling of the present invention; In the figure: 1. X-axis; 2. Y-axis; 3. Z-axis; 4. Workpiece table; 5. Laser source; 6. Optical path selection system; 61. Guide rail; 62. First 45° mirror; 63. Second 45° mirror; 64. Half-wave plate; 65. Polarizer; 66. Third 45° mirror; 7. Paraxial vision; 8. Bessel cutting head; 9. Scanning galvanometer system. Specific embodiments
[0016] To make the above features and advantages of the present invention more understandable, specific embodiments are given below in conjunction with the accompanying drawings and described in detail as follows, but the present invention is not limited thereto.
[0017] Example 1 Refer to Figure 1 、 Figure 2 、 Figure 4 、 Figure 5 An integrated cutting and drilling device includes a machine base. A Y-axis moving table 2 for installing a workpiece table is provided on the machine base. An X-axis moving table 1 is provided above the Y-axis moving table. A Z-axis moving table 3 is provided on the X-axis moving table. A laser source 5 and an optical path selection system 6 are provided on the Z-axis moving table. A paraxial vision 7, a Bessel cutting head 8 and a scanning galvanometer system 9 respectively cooperating with the optical path selection system are sequentially arranged on the Z-axis moving table from left to right below the optical path selection system.
[0018] In this embodiment, the X-axis moving table and the Y-axis moving table are used for multi-station processing positioning. The Z-axis moving table is used to control the movement of the laser focus in the Z-axis direction.
[0019] In this embodiment, the workpiece table is a pneumatic adsorption platform and is used for fixedly adsorbing the workpiece to be processed.
[0020] In this embodiment, the laser source is an infrared picosecond laser, which helps to balance the general performance and economic performance of the equipment.
[0021] In this embodiment, as Figure 2 shown, the optical path selection system includes a guide rail 61 driven to move horizontally by a motor. A first 45° mirror 62 is obliquely installed on the guide rail, such as an electric slide table driven by a motor. The first 45° mirror is installed on the slide of the electric slide table. A second 45° mirror 63 is obliquely installed on the Z-axis moving table above the scanning galvanometer system. The first 45° mirror and the second 45° mirror are at the same horizontal height and have the same inclination direction. When the motor controls the guide rail to move to the right position, the system is in the galvanometer processing station at this time. When the motor moves to the left position, the system is in the Bessel processing station at this time.
[0022] In this embodiment, the Bessel cutting head can be applied to the cutting of brittle materials such as glass, ceramics, and sapphire.
[0023] In this embodiment, the off-axis vision determines the position to be processed by visually positioning the mark point.
[0024] In this embodiment, the scanning galvanometer system controls the light output position of the laser beam in the two-dimensional plane according to the position to be processed, so as to be used for drilling the workpiece.
[0025] Working principle: The optical path selection system controls the light source to emit to the right position (scanning galvanometer system). The system selects the galvanometer processing station. The X-axis moving table and Y-axis moving table perform fixed-point movement to determine the center position of the drill hole. The Z-axis moving table controls the movement of the laser focus in the Z-axis direction by moving up and down. The laser source emits a laser beam, which passes through the scanning galvanometer system to adjust the light output position of the laser beam in the two-dimensional plane, so as to set the drill hole diameter and complete laser drilling. The optical path selection system controls the light source to emit to the left position (Bessel cutting head). The system selects the Bessel processing station. The Z-axis moving table controls the movement of the laser focus in the Z-axis direction by moving up and down. The X-axis moving table and Y-axis moving table are used for controlling the laser cutting trajectory. The laser source emits a laser beam, which passes through the Bessel cutting head to complete laser cutting.
[0026] An integrated cutting and drilling method using the above integrated cutting and drilling device, taking the workpiece thickness h = 1 mm, length and width 40 * 40 mm K9 optical glass as an example, to complete the 10 * 10 array processing of cutting with a margin of 3.5 * 3.5 mm and drilling with a radius R = 1.2 mm. A picosecond laser with a wavelength of 1064 nm is selected as the laser source. The processing drawing is as Figure 4 shown, and the processing flow is as Figure 5 shown; it includes the following steps: S1: Control the first 45° mirror to move to the right station through the motor. The laser source generates light, and the light is reflected by the first 45° mirror and the second 45° mirror to the scanning galvanometer system; select the galvanometer processing station in the PC-side processing software, and use the scanning galvanometer system to process a 2 * 2 mm cross mark; move the X-axis moving table and Y-axis moving table to the off-axis vision perspective to complete the vision offset correction of the galvanometer processing center. S2: Control the first 45° mirror to move to the left station through the motor. The laser source generates light, and the light is emitted to the Bessel cutting head; select the Bessel processing station in the PC-side processing software, and use the Bessel cutting head to process a 2 * 2 mm cross mark; move the X-axis moving table and Y-axis moving table to the off-axis vision perspective to complete the vision offset correction of the Bessel cutting head processing center. S3: Through steps S1 and S2, complete the calibration of the galvanometer processing center and the Bessel cutting processing center, and realize the calibration of the common coordinate system. S4: Adjust the optical path selection system, control the light source to emit to the scanning galvanometer system, select the galvanometer processing station to perform the 10*10 array center drilling process; S5: Adjust the optical path selection system, control the light source to emit to the Bessel cutting head, select the Bessel processing station to perform the 3.5*3.5mm edge cutting process; S6: Obtain the processed target workpiece after die separation.
[0027] Example Two Refer to Figure 1 、 Figure 3 、 Figure 4 、 Figure 5 The difference between an integrated cutting and drilling device in this embodiment and that in Example One lies in the different optical path selection systems.
[0028] Specifically, as Figure 3 shown, the optical path selection system includes a half-wave plate 64. A polarizer 65 is installed on the upper side of the Bessel cutting head, and a third 45° reflector 66 at the same height as the polarizer is installed on the upper side of the scanning galvanometer system. Through the combination of the half-wave plate and the polarizer, the polarization state of the laser can be changed, thereby adjusting the ratio of transmitted and reflected light. By adjusting the half-wave plate forward to a specific angle, the laser beam passes through the polarizer and reaches the galvanometer processing station through the third 45° reflector; by adjusting the half-wave plate backward to a specific angle, the polarizer can achieve a reflection effect, and at this time the system is the Bessel processing station.
[0029] An integrated cutting and drilling method using the above integrated cutting and drilling device, taking a K9 optical glass with a workpiece thickness h =1mm, length and width of 40*40mm as an example, to complete the 10*10 array processing of 3.5*3.5mm edge cutting and a drill hole with a radius R = 1.2mm. A picosecond laser with a wavelength of 1064nm is selected as the light source. The processing drawing is as Figure 4 shown, and the processing flow is as Figure 5 shown; it includes the following steps: S1: Adjust the half-wave plate forward to a specific angle. The light source emitted by the laser source passes through the polarizer and reaches the scanning galvanometer system through the third 45° reflector. Select the galvanometer processing station in the PC-side processing software; use the scanning galvanometer system to process a 2*2mm cross mark; move the X-axis moving table and the Y-axis moving table to the paraxial vision perspective to complete the vision offset correction of the galvanometer processing center; S2: Adjust the half-wave plate backward to a specific angle. The polarizer achieves a reflection effect. The light source emitted by the laser source is reflected by the polarizer to the Bessel cutting head. Select the Bessel processing station in the PC-side processing software; use the Bessel cutting head to process a 2*2mm cross mark; move the X-axis and Y-axis platforms to the paraxial vision perspective to complete the vision offset correction of the Bessel cutting head processing center; S3: Through steps S1 and S2, the calibration of the galvanometer processing center and the Bessel cutting processing center is completed, and the common coordinate system calibration is achieved; S4: Adjust the optical path selection system, control the light source to emit to the scanning galvanometer system, and select the galvanometer processing station to perform the 10*10 array center drilling process; S5: Adjust the optical path selection system, control the light source to emit to the Bessel cutting head, and select the Bessel processing station to perform the 3.5*3.5 mm margin cutting process; S6: After die separation, the processed target workpiece is obtained.
[0030] The above are only the preferred embodiments of the present invention. For those of ordinary skill in the art, according to the teachings of the present invention, designing different forms of integrated cutting and drilling devices and methods does not require creative labor. Without departing from the principles and spirit of the present invention, all equal changes, modifications, substitutions, and variations made within the scope of the patent application of the present invention shall fall within the scope of the present invention.
Claims
1. An integrated cutting and drilling device, comprising a machine base, characterized in that: The machine base is provided with a Y-axis moving table for mounting a workpiece table, an X-axis moving table is provided above the Y-axis moving table, a Z-axis moving table is provided on the X-axis moving table, a laser source and an optical path selection system are provided on the Z-axis moving table, and a paraxial vision system and a Bessel cutting head and a scanning galvanometer system respectively used to cooperate with the optical path selection system are provided on the Z-axis moving table from left to right at the lower side of the optical path selection system.
2. An integrated cutting and drilling device according to claim 1, characterized in that: The workpiece platform is a pneumatic adsorption platform and is used for fixed adsorption of processed workpieces.
3. The integrated cutting and drilling device according to claim 1, characterized in that: The laser source is an infrared picosecond laser.
4. An integrated cutting and drilling device according to claim 1, 2 or 3, characterized in that: The optical path selection system includes a guide rail driven by a motor to move laterally, a first 45° reflector is obliquely installed on the guide rail, a second 45° reflector is obliquely installed on the Z-axis moving platform on the upper side of the scanning galvanometer system, and the first 45° reflector and the second 45° reflector are located at the same height.
5. An integrated cutting and drilling device according to claim 1, 2 or 3, characterized in that: The optical path selection system includes a half-wave plate, a polarizing plate is installed on the upper side of the Bessel cutting head, and a third 45° reflecting mirror is installed on the upper side of the scanning galvanometer system at the same height as the polarizing plate.
6. The integrated cutting and drilling device according to claim 1, characterized in that: The paraxial vision is used to visually locate the mark point and determine the position to be processed; the scanning galvanometer system is used to control the light-emitting position of the laser beam in the two-dimensional plane according to the position to be processed.
7. An integrated cutting and drilling method, using the integrated cutting and drilling device according to claim 4, characterized in that: The following steps are involved: S1: Adjust the optical path selection system, control the light source to be emitted to the scanning galvanometer system on the right, select the galvanometer processing station in the PC processing software; use the scanning galvanometer system to process the 2*2mm cross mark; move the X-axis moving stage and the Y-axis moving stage to the paraxial visual angle, and complete the visual offset correction of the galvanometer processing center; S2: Adjust the optical path selection system, control the light source to be emitted to the Bessel cutting head, select the Bessel processing station in the PC processing software; use the Bessel cutting head to process the 2*2mm cross mark; move the X-axis moving stage and the Y-axis moving stage to the paraxial visual angle, and complete the visual offset correction of the Bessel cutting head processing center; S3: Through steps S1 and S2, the calibration of the galvanometer machining center and the Bessel cutting machining center is completed to achieve the calibration of the common coordinate system; S4: Adjust the optical path selection system, control the light source to be emitted to the scanning galvanometer system, and select the galvanometer processing station to perform the drilling process; S5: Adjust the optical path selection system, control the light source to be emitted to the Bessel cutting head, and select the Bessel processing station to perform the cutting process; S6: After splitting, the target workpiece is obtained.
8. An integrated cutting and drilling method, using the integrated cutting and drilling device according to claim 5, characterized in that: The following steps are involved: S1: Forward adjust the half-wave plate to a specific angle, so that the light source passes through the polarizer and the third 45° reflector to the scanning galvanometer system, and select the galvanometer processing station in the PC processing software; use the scanning galvanometer system to process the 2*2mm cross mark; move the X-axis moving stage and the Y-axis moving stage to the paraxial visual angle to complete the visual offset correction of the galvanometer processing center; S2: Reversely adjust the half-wave plate to a specific angle, the polarizer achieves a reflection effect, the light source is reflected by the polarizer to the Bessel cutting head, and the Bessel processing station is selected in the PC processing software; use the Bessel cutting head to process the 2*2mm cross mark; move the X-axis and Y-axis platforms to the paraxial visual angle of view to complete the visual offset correction of the Bessel cutting head processing center; S3: Through steps S1 and S2, the calibration of the galvanometer machining center and the Bessel cutting machining center is completed to achieve the calibration of the common coordinate system; S4: Adjust the optical path selection system, control the light source to be emitted to the scanning galvanometer system, and select the galvanometer processing station to perform the drilling process; S5: Adjust the optical path selection system, control the light source to be emitted to the Bessel cutting head, and select the Bessel processing station to perform the cutting process; S6: After splitting, the target workpiece is obtained.