Grinding and polishing method and system and grinding and polishing equipment

Abstract

The invention discloses a grinding and polishing method and system and grinding and polishing equipment. The grinding and polishing method comprises the steps that an indexing table rotates in the first direction, and a workbench with a workpiece fixed to the top face is sequentially rotated to a first grinding mechanism, a second grinding mechanism and a polishing mechanism for grinding; after polishing is completed, the top face of the workpiece is cleaned and dried; the indexing table rotates in the second direction to drive the workpiece to rotate towards the second grinding mechanism, and the workbench rotates; when it is determined that the workpiece moves and passes through the roughness detection assembly, a signal of the roughness detection assembly is obtained, and whether the surface roughness of the workpiece meets the requirement or not is determined; when it is determined that the workpiece moves and passes through a thickness measuring assembly at the second grinding mechanism, a signal of the thickness measuring assembly is obtained, and whether the total thickness change of the workpiece meets the requirement or not is determined; and after the workbench moves back to the second grinding mechanism, the workbench moves to the up-down position of the workpiece in the first direction. According to the invention, on-line detection of the surface roughness and total thickness change of the workpiece can be realized.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor device processing, in particular to a grinding and polishing method, system and equipment. Background Art

[0002] A thinning machine is a special equipment used for wafer processing.

[0003] The patent document with the publication number US10154794A1 discloses a usable thinning machine.

[0004] This thinning machine has four worktables and is provided with two grinding mechanisms and one polishing mechanism to simultaneously process wafers on three worktables.

[0005] In this thinning machine, after the wafer is polished at the polishing mechanism and cleaned, it is loaded back into the cassette, and the cassette needs to be transported to the downstream inspection station for detecting the total thickness change and surface roughness of the workpieces in the cassette, etc.

[0006] In this way, when performing wafer inspection, the wafer needs to be taken out of the cassette again. Since the wafer thickness is already very thin, the additional transfer process greatly increases the risk of wafer damage. Summary of the Invention

[0007] The purpose of the present invention is to solve the above problems existing in the prior art, and provide a grinding and polishing method, system and equipment.

[0008] The purpose of the present invention is achieved through the following technical solutions: A grinding and polishing method, comprising the following steps: Rotate the indexing table in the first direction to sequentially rotate the worktable with the workpiece fixed on the top surface to the first grinding mechanism, the second grinding mechanism and the polishing mechanism for grinding; After grinding at the polishing mechanism, clean and dry the top surface of the workpiece on the worktable at the polishing mechanism through a cleaning mechanism; Rotate the indexing table in the second direction to drive the worktable to move towards the second grinding mechanism, and make the worktable rotate itself, the second direction being opposite to the first direction; During the process that the roughness detection component beside the polishing mechanism can detect the workpiece on the worktable, obtain the signal of the roughness detection component and determine whether the surface roughness of the workpiece on the worktable meets the requirements; During the process that the thickness measurement component at the second grinding mechanism can detect the workpiece on the worktable, obtain the signal of the thickness measurement component, and determine whether the total thickness change of the workpiece on the worktable meets the requirements; After the workbench moves back to the second grinding mechanism, rotate the indexing table in the first direction to move the workbench to the position above and below the workpiece for loading and unloading.

[0009] Preferably, the thickness measuring component at the second grinding mechanism is located on the side of the second grinding mechanism close to the polishing mechanism.

[0010] Preferably, the roughness detection component is located on the side of the polishing mechanism close to the second grinding mechanism.

[0011] Preferably, the axis of the detection head of the roughness detection component passes through the circle where the center of the tabletop of a set of workbenches is located, and the axis of the detection head of the thickness measuring component at the second grinding mechanism passes through the circle where the center of the tabletop of a set of workbenches is located.

[0012] Preferably, the rotation speed of the indexing table rotating in the first direction is greater than the rotation speed of the indexing table rotating in the second direction.

[0013] Preferably, the rotation speed of the indexing table driving the workbench to move from the second grinding mechanism to the position above and below the workpiece is greater than the rotation speed of the indexing table driving the workbench to move from the position above and below the workpiece to the first grinding mechanism, the second grinding mechanism and the polishing mechanism in sequence.

[0014] Preferably, the polishing mechanism and the second grinding mechanism are arranged on opposite sides of the indexing table; a centering mechanism is arranged beside the indexing table on the side of the polishing mechanism. The first connection line perpendicular to the axis of the wafer stage of the centering mechanism and the axis of the workbench at the position above and below the workpiece extends along direction one, and direction one is perpendicular to direction two. Direction two is the extension direction of the second connection line connecting the centers of the tabletops of the two workbenches at the first grinding mechanism and the second grinding mechanism. The workpiece at the centering mechanism is moved to the workbench at the position above and below the workpiece through the suspended loading mechanism, and the workpiece on the workbench at the position above and below the workpiece is transferred to the cleaning device by the unloading mechanism. The cleaning device is located on the side of the centering mechanism deviating from the polishing mechanism.

[0015] Preferably, a tool setting mechanism is arranged beside the first grinding mechanism and / or the second grinding mechanism and / or the polishing mechanism.

[0016] A grinding and polishing system, comprising: A grinding unit for controlling the indexing table to rotate in the first direction to sequentially rotate the workbench with the workpiece fixed on the top surface to the first grinding mechanism, the second grinding mechanism and the polishing mechanism for grinding; A cleaning unit for controlling the cleaning mechanism to clean and dry the top surface of the workpiece on the workbench at the polishing mechanism after grinding is completed at the polishing mechanism; A reverse driving unit, used for controlling the indexing table to rotate in a second direction to drive the worktable to rotate toward the second grinding mechanism and to make the worktable rotate on its own, wherein the second direction is opposite to the first direction; A roughness detection unit, used for obtaining a signal of the roughness detection component and determining whether the surface roughness of the workpiece on the worktable meets the requirements when the roughness detection component beside the polishing mechanism can detect the workpiece on the worktable; a total thickness change detection unit, used for obtaining a signal of the thickness measuring component when the thickness measuring component at the second grinding mechanism can detect the workpiece on the workbench, and determining whether the total thickness change of the workpiece on the workbench meets the requirements; The loading and unloading position unit is used to control the indexing table to rotate in the first direction to drive the workbench to move to the upper and lower positions of the workpiece for loading and unloading after the workbench moves back to the second grinding mechanism.

[0017] A grinding and polishing device comprises a memory and a processor, wherein the memory stores a program executable by the processor, and when the program is executed, any of the above-mentioned grinding and polishing methods is implemented.

[0018] The advantages of the technical solution of the present invention are mainly reflected in: The present invention arranges a roughness detection component beside the polishing mechanism, and after polishing, the indexing table drives the worktable to rotate in the opposite direction, and the worktable rotates on its own, so that the surface roughness of the workpiece on the worktable can be measured when the workpiece passes through the roughness detection component, and the workpiece on the worktable is rotated to the thickness measuring component at the second grinding mechanism to perform total thickness change detection, which can effectively realize online detection, save the process of loading the ground and polished workpiece into a material box and then conveying it to the downstream for detection, avoids the risk of wafer detection damage, and at the same time, relatively less polishing time can be used to clean and dry the polished workpiece, effectively remove the dirt on the top surface of the workpiece, thereby ensuring the accuracy of subsequent detection. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 is a top view of the grinding and polishing device of the present invention; Figure 2 is a flow chart of the grinding and polishing method of the present invention; Figure 3 It is a schematic diagram of a workpiece of the present invention being concentrically fixed on a workbench above and below the workpiece and starting to rotate toward a first grinding mechanism; Figure 4 It is a schematic diagram of the worktable with the workpiece fixed thereon rotating to the first grinding mechanism in the present invention; Figure 5 It is a schematic diagram of the worktable with the workpiece fixed thereon rotating to the second grinding mechanism in the present invention; Figure 6 This is a schematic diagram of the workbench with the workpiece fixed rotating to the polishing mechanism in the present invention; Figure 7 This is a schematic diagram of the indexing table rotating in the second direction to move the workbench with the workpiece fixed towards the second grinding mechanism in the present invention; Figure 8 This is a schematic diagram of the workbench with the workpiece fixed rotating back to the second grinding mechanism in the present invention; Figure 9 This is a schematic diagram of the workbench with the workpiece fixed rotating along the first direction to the up - down position of the workpiece in the present invention; Figure 10 This is a schematic diagram of the tool - setting mechanism in the present invention; Figure 11 This is the front view of the tool - setting detection component in the present invention; Figure 12 This is the partial exploded perspective view of the tool - setting detection component in the present invention; Figure 13 This is the cross - sectional view of the grinding wheel receiving component in the present invention; Figure 14 This is the end view of the tool - setting detection component in the present invention; Figure 15 This is the schematic principle diagram of tool - setting between the grinding wheel and the workbench by the tool - setting detection component in the present invention. Detailed implementation mode

[0020] The objectives, advantages and features of the present invention will be illustrated and explained through the non - restrictive description of the following preferred embodiments. These embodiments are only typical examples of applying the technical solutions of the present invention. Any technical solutions formed by equivalent replacement or equivalent transformation fall within the scope of protection required by the present invention.

[0021] In the description of the solution, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "front", "rear", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of description and simplification of the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be understood as a limitation to the present invention. In addition, the terms "first", "second", "third" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0022] Embodiment 1 The grinding and polishing method disclosed by the present invention will be elaborated below with reference to the drawings. The grinding and polishing method is based on a grinding and polishing device, as shown in the attached Figure 1As shown in the figure, the grinding and polishing equipment can be the structure disclosed in the prior art cited in the background art, that is, it includes a indexing table 100, 4 worktables 200 evenly arranged on the indexing table 100 in a circumferential manner, a first grinding mechanism 300, a second grinding mechanism 400 and a polishing mechanism 500 distributed along the circumferential direction of the indexing table 100. When the workpiece on one worktable 200 is being processed at the first grinding mechanism 300, the workpiece on another worktable 200 is being processed at the second grinding mechanism 400, the workpiece on yet another worktable 200 is being processed at the polishing mechanism 500, and the last worktable 200 is located at the upper and lower positions of the workpiece for loading and unloading.

[0023] What is different from the prior art is that as shown in the attached Figure 1 figure, a surface roughness detection component 600 is arranged beside the polishing mechanism 500 of the present invention for detecting the surface roughness of the workpiece on the worktable 200. The surface roughness detection component 600 preferably adopts a white light interference scanner, and its specific structure and detection principle are known technologies and will not be elaborated here. The white light interference scanner can be suspended in the grinding and polishing equipment through a suspension member, and moreover, the white light interference scanner can also be connected to a height adjustment mechanism for driving its up and down movement. The height adjustment mechanism is, for example, a servo module or an electric cylinder, etc.

[0024] As shown in the attached Figure 1 figure, the surface roughness detection component 600 is located on the side of the polishing mechanism 500 close to the second grinding mechanism 400. Its specific installation position can be determined according to needs. For example, the surface roughness detection component 600 is located between the polishing mechanism 500 and the second grinding mechanism, and the axis of the detection head of the surface roughness detection component 600 passes through the circle O1 where the center of the tabletop of a group of the worktables 200 is located. In this way, the surface roughness detection component 600 can cover as many areas of the workpiece as possible, thereby ensuring the reliability of surface roughness detection to the greatest extent.

[0025] The thickness measurement component 700 at the second grinding mechanism 400 uses a known non-contact thickness measurement device for thickness measurement. For example, a distance measuring sensor can be used for thickness measurement, which is not limited here. The thickness measurement component 700 at the second grinding mechanism 400 is located on the side of the second grinding mechanism 400 close to the polishing mechanism 500 and the axis of its detection head passes through the circle O1 where the center of the tabletop of a group of the worktables 200 is located. In this way, the thickness measurement component 700 can also cover as many areas of the workpiece as possible, thereby ensuring the reliability of total thickness change detection to the greatest extent.

[0026] As shown in the attached Figure 1As shown in the figure, a cleaning mechanism 800 is provided beside the polishing mechanism 500 for cleaning and drying the top surface of the workpiece on the workbench at the polishing mechanism 500. The cleaning mechanism 800 includes, for example, at least one nozzle or spray block that sprays cleaning liquid towards the workpiece on the tabletop of the workbench 200 at the polishing mechanism 500. The spray block is provided with a row of spray holes so that the coverage width of the sprayed liquid and / or gas can reach the radius of the workpiece as much as possible, thereby better cleaning the rotating workpiece. Moreover, the nozzle or spray block is not only connected to the liquid supply system but can also be connected to the gas supply system simultaneously. Thus, after flushing, the workpiece can be dried by blowing air. Of course, independent air-jet nozzles or spray blocks can also be provided to dry the workpiece, which is not limited here.

[0027] Meanwhile, the grinding and polishing equipment may include three cartridge placement positions. An unqualified part cartridge is provided at one cartridge placement position 900 for recycling workpieces that fail in total thickness change detection or surface roughness. The other two cartridge placement positions are for placing cartridges containing workpieces to be processed and for recycling qualified workpieces.

[0028] Correspondingly, as shown in the appendix Figure 2 The grinding and polishing method includes the following steps: After concentrically placing a workpiece N on the workbench 200 located above and below the workpiece, the workbench 200 fixes the workpiece, as shown in the appendix Figure 3 shown.

[0029] Control the indexing table to rotate along the first direction D1, driving the workbench 200 to rotate successively to the first grinding mechanism 300, the second grinding mechanism 400, and the polishing mechanism 500 for grinding; that is, the indexing table 100 first rotates 90° along the first direction. At this time, as shown in the appendix Figure 4 shown, the workbench 200 fixed with the workpiece rotates to the first grinding mechanism 300, and the first grinding mechanism 300 grinds the workpiece for a period of time. After finishing grinding at the first grinding mechanism 300, the indexing table 100 rotates 90° along the first direction again. At this time, as shown in the appendix Figure 5 shown, the workbench 200 rotates to the second grinding mechanism 400 for grinding. After finishing grinding at the second grinding mechanism 400, the indexing table 100 rotates 90° along the first direction again. As shown in the appendix Figure 6 shown, the workbench 200 rotates to the polishing mechanism 500 for polishing, and the polishing mechanism polishes the workpiece on the workbench 200 by dry polishing.

[0030] After grinding is completed at the polishing mechanism 500, the top surface of the workpiece on the workbench 200 is cleaned and dried by the cleaning mechanism 800; that is, while the workbench 200 is kept rotating, water is sprayed onto the top surface of the workpiece on the workbench 200 through a nozzle or a spray block. After spraying water for a period of time, air is blown onto the top surface of the workpiece to dry the workpiece, and hot air can be sprayed onto the workpiece to accelerate the drying of the workpiece.

[0031] After drying is completed, as shown in the attached Figure 6 figure, the indexing table 100 is controlled to rotate in the second direction D2 to drive the workbench 200 to rotate towards the second grinding mechanism 400. When the indexing table 100 rotates in the second direction, the workbench 200 is made to rotate. The second direction is opposite to the first direction; the rotation speed of the indexing table 100 in the second direction is less than the rotation speed of the indexing table 100 in the first direction. For example, the rotation speed of the indexing table 100 in the first direction is 90° / second, and the rotation speed of the indexing table 100 in the second direction is 15° / second, which is not limited here; at the same time, the rotation speed of the workbench 200 can be set as needed, for example, between 1 - 5 revolutions per second. This can effectively ensure that the roughness detection component 600 can detect more areas of the top surface of the workpiece, thereby improving the detection coverage.

[0032] When the indexing table rotates in the second direction, as shown in the attached Figure 7 figure, if it is determined that the roughness detection component 600 can detect the workpiece on the workbench, the signal of the roughness detection component 600 can be started to be acquired. For example, a proximity sensor can be set beside the roughness detection component 600 to detect the workpiece on the workbench. The proximity sensors can be arranged side by side on the side of the detection head of the roughness detection component 600 away from the axis of the indexing table. When the proximity sensor detects the workpiece, it can be determined that the workpiece starts to move into the detection range of the roughness detection component 600. At this time, the signal of the roughness detection component 600 can be started to be acquired. Of course, it can also be determined in advance at what angle the indexing table rotates in the second direction at the polishing mechanism so that the roughness detection component 600 can detect the workpiece on the workbench. For example, when the indexing table rotates 30° - 80° in the second direction, the workpiece will move through the measurement range of the roughness detection component 600. At this time, the angle range of the indexing table rotating in the second direction is stored. Subsequently, when it is determined that the angle of the indexing table rotating in the second direction is within the above angle range, the signal of the roughness detection component 600 is continuously acquired.

[0033] Alternatively, the roughness detection component 600 itself is located above the workbench at the polishing mechanism. When the workbench is at the polishing mechanism, the workpiece on it is within the detection range of the roughness detection component 600. Therefore, when the workbench moves to the polishing mechanism and is cleaned and dried, the signal of the roughness detection component can be obtained.

[0034] When the roughness detection component 600 starts to detect the workpiece on the workbench rotating towards the second grinding mechanism, continuously obtain the signal of the roughness detection component 600 and determine whether the surface roughness of the workpiece on the workbench 200 meets the requirements based on this, that is, determine whether the surface roughness exceeds the threshold. If it exceeds, it means the surface roughness does not meet the requirements; otherwise, it means the surface roughness meets the requirements. And when it is determined that the roughness detection component 600 cannot detect the workpiece, stop obtaining the signal of the roughness detection component 600.

[0035] When the indexing table rotates in the second direction, the workpiece on the workbench will rotate past the thickness measurement component 700 at the second grinding mechanism 400. During the process of the workpiece on the workbench 200 moving past the thickness measurement component, obtain the signal of the thickness measurement component 700 and determine whether the total thickness change of the workpiece on the workbench 200 meets the requirements. Specifically, it can be determined whether the workpiece has moved to the thickness measurement component 700 by comparing the thickness measured by the thickness measurement component 700 with the thickness of the workpiece to be achieved, that is, when the thickness measured by the thickness measurement component 700 is the same as the thickness to be achieved or the difference is within the threshold range, it can be determined that the workpiece starts to pass the thickness measurement component. Alternatively, the thickness measurement component uses a distance measurement sensor for thickness measurement. At this time, it can be determined whether the workpiece has passed the thickness measurement component based on the distance measured by the thickness measurement component. When the area with the workpiece on the workbench passes the thickness measurement component, the thickness measurement component measures the distance to the top surface of the workpiece. When the tabletop of the workbench or the indexing table passes the thickness measurement component, the thickness measurement component measures the distance to the workbench or the indexing table. Of course, it is also possible to determine in advance the angular range of the indexing table rotating in the second direction during which the workpiece passes the thickness measurement component, so that when it is determined that the rotation angle of the indexing table is within the pre-determined angular range, the signal of the thickness measurement component is obtained.

[0036] When the workpiece starts to be detected by the thickness measurement component, the signal of the thickness measurement component can be obtained in real time. And when the thickness measurement component 700 cannot detect the workpiece, it can be determined whether the difference between the maximum value and the minimum value in the data measured by the thickness measurement component during the period when the thickness measurement component 700 can detect the workpiece exceeds the threshold to determine whether the total thickness change meets the requirements. If the difference exceeds the threshold, it indicates that the total thickness change does not meet the requirements; otherwise, it can be determined that the total thickness change meets the requirements.

[0037] As shown in the appendix Figure 8 and the appendixFigure 9 As shown, after the workbench 200 moves back to the second grinding mechanism 400, the indexing table 100 is rotated in the first direction to move the workbench 200 to the workpiece loading and unloading position for loading and unloading. Further, after the workbench 200 moves back to the second grinding mechanism, the workbench 200 can continue to rotate several times by itself, and then stop rotating and move to the workpiece loading and unloading position in the first direction for loading and unloading.

[0038] Embodiment 2 Different from the above Embodiment 1, in this embodiment, as shown in the attached Figure 1 figure, the polishing mechanism 500 and the second grinding mechanism 400 are arranged on opposite sides of the indexing table 100. That is, the first grinding mechanism 300 and the second grinding mechanism 400 are located on one side of the indexing table 100, the polishing mechanism 500 is arranged on the opposite side of the indexing table 100, and the polishing mechanism is arranged opposite to the second grinding mechanism 400.

[0039] As shown in the attached Figure 1 figure, a centering mechanism A00 is arranged beside the indexing table 100 on the side of the polishing mechanism 500. The centering mechanism A00 includes a wafer stage A10 and a set of centering rods that contract or expand towards the axis of the wafer stage A10. Its specific structure is known technology and will not be elaborated here. The axis of the wafer stage A10 of the centering mechanism A00 and the first connection line B00 of the axis of the workbench 200 at the workpiece loading and unloading position extend along the direction one F1. The direction one is perpendicular to the direction two F2, and the direction two F2 is the extension direction of the second connection line C00 connecting the table centers of the two workbenches 200 located at the first grinding mechanism 300 and the second grinding mechanism 400.

[0040] A loading mechanism D00 is also arranged in the grinding and polishing equipment. The loading mechanism D00 is suspended above the centering mechanism A00 and the indexing table 100. It includes a translation component D10, a lifting component D20 driven by the translation component D10 to move in the direction one, and a suction cup component D30 driven by the lifting component D20 to move up and down. The translation component D10 is, for example, a linear module. The lifting component D20 can also be a linear module or a structure composed of a motor and a lead screw. The specific structure of the suction cup component D30 is known technology and will not be elaborated here. The axis of the suction cup D31 of the suction cup component D30 is perpendicular to and intersects the first connection line B00. The loading mechanism D00 is used to transfer the workpiece centered at the centering mechanism A00 to the workbench 200 at the workpiece loading and unloading position.

[0041] Meanwhile, a cleaning device E00 is provided outside one side of the centering mechanism A00 deviating from the polishing mechanism 500. The cleaning device E00 is used to clean the top surface of the workpiece. Its specific structure is a known technology and will not be elaborated here. Meanwhile, a blanking mechanism F00 is also provided outside one side of the centering mechanism A00 deviating from the polishing mechanism 500. The blanking mechanism F00 is located between the cleaning device E00 and the indexing table. The blanking mechanism F00 is used to transfer the workpiece that has been ground and detected on the workbench 200 at the upper and lower positions of the workpiece to the cleaning device E00 for cleaning. The specific structure of the blanking mechanism F00 is a known technology and will not be elaborated here.

[0042] Furthermore, the grinding and polishing equipment further includes a loading and unloading robot G00. The loading and unloading robot G00 is located beside the centering mechanism A00 and on the side of the polishing mechanism 500 away from the second grinding mechanism 400. The loading and unloading robot G00 is used to transfer the workpiece in the cartridge to the centering mechanism A00 and transfer the workpiece that has been cleaned at the cleaning device E00 to the cartridge. The specific structure of the loading and unloading robot G00 is a known technology and will not be elaborated here. After cleaning, the workpiece is loaded into the cartridge by the loading and unloading robot G00. When loading into the cartridge, it can be determined which cartridge the workpiece is to be loaded into according to the change in the total thickness of the workpiece and whether the surface roughness meets the requirements. For example, when at least one of the change in the total thickness of the workpiece and the surface roughness does not meet the requirements, the workpiece is loaded into the non-conforming part cartridge; otherwise, the workpiece is loaded into the cartridge where the workpiece originally was.

[0043] As shown in the Figure 1 accompanying drawings, tool setting mechanisms H00 can be respectively provided beside the first grinding mechanism 300, the second grinding mechanism 400 and the polishing mechanism.

[0044] As shown in the Figure 10 accompanying drawings, the tool setting mechanism includes a base frame H01. The base frame H01 includes a column H02. A chassis is provided at the bottom of the column H02. The chassis is provided on a rotating mechanism H03 that drives it to rotate around the axis of the column H02. The rotating mechanism H03 is preferably a rotating cylinder. Of course, it can also be other feasible structures, such as a turntable, and a pneumatic motor can be used to drive it.

[0045] The top of the column H02 is connected to one end of the horizontal plate H04. A tool setting and detecting component H05 is arranged at the other end of the horizontal plate H04. The rotating mechanism H03 drives the tool setting and detecting component H05 to move between a waiting position and a tool setting position. When in the waiting position, the tool setting and detecting component H05 is located in a protective cover H06 outside the workbench 200. The protective cover H06 can be a rectangular cover with a door that can be automatically opened and closed on one side. Meanwhile, a cleaning nozzle H07 for cleaning a receiving tray H26 of the tool setting and detecting component H05 located therein is arranged at the top of the protective cover H06.

[0046] As shown in the Figure 11 accompanying drawings, the tool setting and detecting component H05 includes a guiding frame H08. The guiding frame H08 includes a fixing block H09 connected to the horizontal plate H04. A horizontally extending first card slot H10 is arranged on one side of the fixing block H09 facing the horizontal plate H04. One end of the horizontal plate H04 away from the column H02 is inserted into the first card slot H10 and the two are fixed by screwing. A horizontally extending second card slot is arranged on the side of the fixing block H09 facing away from the horizontal plate H04. A horizontal limiting plate H11 is arranged at the second card slot. The limiting plate H11 and the fixing block H09 are also fixed by screwing.

[0047] As shown in the Figure 11 accompanying drawings, the limiting plate H11 abuts against a moving block H13 of an elastic up-and-down mechanism H12, and the moving block H13 can move up and down relative to the limiting plate H11. Specifically, the end of the limiting plate H11 is embedded at a groove H14 inside the moving block H13, and the limiting plate H11 is connected to a connecting shaft H16 inside the moving block H13 through an elastic connecting piece H15. The elastic connecting piece H15 is preferably a tension spring. Of course, it can also be other devices with elastic deformation ability, such as an elastic band, etc. And, a group of the tension springs is arranged on both sides of the limiting plate H11, and each group has three tension springs. The upper ends of the tension springs are hung at hanging holes arranged at the ends of a flat plate H17 at the top of the limiting plate H11. Ring grooves corresponding to the hooks at the lower ends of each tension spring are arranged on the connecting shaft H16.

[0048] As shown in the Figure 12As shown, to ensure the integrity of the movable block H13 and the fixed block H09, the movable block H13 is connected to the fixed block H09 through at least one elastic sheet H18. The elastic sheet H18 can be, for example, a metal sheet or a plastic sheet. Preferably, an elastic sheet H18 is fixed between the top of the movable block H13 and the top of the fixed block H09, and another elastic sheet H18 is fixed between the bottom of the movable block H13 and the bottom of the fixed block H09. The movable block H13 is connected to the elastic sheet H18 through a first fastening plate H19 screwed to its top and bottom, and the fixed block H09 is connected to the elastic sheet H18 through a second fastening plate H20 screwed to its top and bottom.

[0049] As shown in the attached Figure 12 As shown, to improve the rigidity of the two elastic sheets H18, each elastic sheet H18 is clamped between two reinforcing plates H21. The two reinforcing plates H21 are located between the movable block H13 and the fixed block H09. Specifically, each elastic sheet H18 is screwed to the two reinforcing plates H21 above and below it to form a whole. The two ends of the reinforcing plate H21 are close to the movable block H13 and the fixed block H09, and a small gap is maintained.

[0050] As shown in the attached Figure 11 As shown, a front convex portion H22 is formed at one end of the limiting plate H11 facing the movable block H13. The front convex portion H22 is embedded at the groove H14. The elastic connecting piece H15 makes the lower groove wall of the groove H14 fit with the bottom surface of the front convex portion H22. At the same time, the reinforcing plate H21 is kept in an inclined state, and the side of the reinforcing plate H21 close to the movable block H13 is higher than the opposite side. The inclination angle of the reinforcing plate H21 does not exceed 5°.

[0051] As shown in the attached Figure 11 As shown, a grinding wheel receiving assembly H23 and a contact detection device H24 are arranged on the movable block H13 in a vertical distribution.

[0052] As shown in the attached Figure 13 and the attached Figure 14 As shown, the grinding wheel receiving assembly H23 is arranged on the side of the movable block H13 facing away from the fixed block H09. It includes a mounting block H25 fixed at the fixed block H09. The mounting block H25 is L-shaped and close to the top of the fixed block H09. A receiving disk H26 protruding above the movable block is arranged on the mounting block H25. To better keep the receiving disk H26 in a horizontal state, three support members distributed in a triangle are arranged on the mounting block H25. The receiving disk H26 is abutted against the three support members and kept in a horizontal state through an elastic member H28 applying a downward pulling force to it, that is, the axis of the receiving disk H26 extends in the vertical direction.

[0053] Specifically, a connecting column H39 is coaxially arranged at the bottom of the receiving tray H26. The connecting column H39 is inserted into a counterbore H29 on the mounting block H25. The aperture of the upper hole section of the counterbore H29 is smaller than that of the lower hole section. A abutting plate H30 is sleeved on the connecting column H39 and is located below the mounting block H25. The diameter of the abutting plate H30 is larger than the aperture of the lower hole section of the counterbore H29. The abutting plate H30 is threadedly connected to the connecting column H39 and is limited on the connecting column H39 by a limit nut H31 located below the abutting plate H30. An elastic member H28 is arranged at the large hole section of the counterbore H29. The elastic member H28 is preferably a spring, and of course, it can also be a leaf spring, etc. The spring is sleeved on the outer periphery of the connecting column H39. One end of the spring is connected to the step surface of the counterbore H29, and the other end is connected to the abutting plate H30. The spring is kept in a compressed state under normal conditions. Thus, the spring applies a downward pressure to the abutting plate H30, so that the receiving tray H26 is kept in abutment with the three support members.

[0054] The three support members can be three columns or platforms. More preferably, the three support members are three spheres. One sphere is embedded in a first limiting groove H32 at the bottom of the receiving tray H26. The groove surface of the first limiting groove H32 is a conical surface or a spherical surface. Another sphere is embedded in a radial groove H33 at the bottom of the receiving tray H26 and extending along the radial direction of the receiving tray H26. The last sphere abuts against the bottom surface of the receiving tray H26.

[0055] For convenience of description, three spheres are defined as the first sphere H34, the second sphere H35 and the third sphere H36. The first sphere H34 is directly embedded in the second limiting groove H37 provided on the top surface of the mounting block H25. The groove surface of the second limiting groove H37 is a conical surface or a spherical surface. The first sphere H34 is also embedded at the first limiting groove H32 at the bottom of the receiving disc H26. The diameter of the first sphere H34 is larger than the diameters of the second sphere H35 and the third sphere H36, and a gap is maintained between the receiving disc H26 and the mounting block H25. The second sphere H35 is arranged at the top of the height-adjusting column H38. The height-adjusting column H38 is threadedly connected to the screw hole on the mounting block H25, and the second sphere H35 is embedded at the radial groove H33. The radial groove H33 can be a V-shaped groove or an arc-shaped groove. The third sphere H36 is also arranged at the top of a height-adjusting column H38. The height-adjusting column H38 is threadedly connected to the mounting block H25, and the third sphere H36 abuts against the bottom surface of the mounting block H25. Embedding the first sphere H34 in the second limiting groove H37 on the mounting block H25 can effectively simplify the installation structure of the first sphere H34. At the same time, arranging the second sphere H35 in the radial groove H33 can effectively cooperate with the first sphere H34 embedded at the bottom of the receiving disc H26 to limit the rotation and translation of the receiving disc H26 relative to the three supporting members. At the same time, the heights of the second sphere H35 and the third sphere H36 can be conveniently adjusted, and the horizontal state of the receiving disc H26 can be effectively ensured by adjusting the heights of the second sphere H35 and the third sphere H36, that is, ensuring that the axis of the receiving disc H26 extends along the vertical direction. At the same time, the connecting column can be locked with the mounting block through a nut to ensure the height stability of the second sphere H35 and the third sphere H36.

[0056] The contact detection device H24 can adopt different devices according to needs. For example, the contact detection device H24 can be a known pressure sensor, and the axis of the probe H40 extends along the vertical direction and faces downwards; or, the contact detection device H24 is a known normally open contact sensor or a normally closed contact sensor, and its probe also faces downwards. And, the axis of the receiving disc H26 is coaxial with the axis of the probe.

[0057] When the tool setting mechanism H00 described above is used for tool setting, the process is as follows: Place the tool setting detection assembly H05 at the tool setting position. At the tool setting position, the receiving disc H26 of the tool setting detection assembly H05 is located below the grinding wheel J00 and within the projection range of the grinding wheel on the horizontal plane. The probe H40 of the contact detection device H24 of the tool setting detection assembly H05 is located above the workbench 200 with a gap and within the range of the tabletop of the workbench 200. The distance between the probe and the workbench 200 is less than the moving stroke of the movable block H13. As shown in the appendixFigure 15 as shown

[0058] The main shaft where the grinding wheel is located is driven by a lifting mechanism to move downward. At this time, the grinding wheel can move downward at a relatively fast speed. During the downward movement, the signal of the contact detection device H24 is obtained in real time. During the downward movement of the grinding wheel, the grinding wheel presses on the receiving plate H26. At this time, as the grinding wheel continues to move downward, the elastic thin plate H18 can deform, so that the movable block H13 can move downward relative to the guide frame H08. As the movable block H13 moves downward, the probe of the contact detection device H24 on the movable block H13 moves downward to contact the top surface of the workbench 200 and generates a trigger signal, as shown in the appendix Figure 15 as shown. When the contact detection device H24 is a pressure sensor, the trigger signal is the signal when the pressure sensor starts to generate pressure; when the contact detection device H24 is a normally open contact sensor, the trigger signal is the signal when the normally open contact sensor is closed. Since the movable block H13 has a certain elasticity and the probe of the contact detection device H24 has a certain buffering ability, it can effectively avoid the problems caused by the hard contact between the grinding wheel and the receiving plate H26 and between the workbench 200 and the tool setting detection component H05 when the grinding wheel moves downward at a relatively fast speed

[0059] When it is determined according to the signal of the pressure sensor that the contact detection device H24 contacts the top surface of the workbench 200, the downward movement height H1 corresponding to the downward movement of the grinding wheel from the origin height to the current position is determined, as shown in the appendix Figure 15 as shown; at the same time, the grinding wheel can be stopped from moving downward, or the grinding wheel can be moved upward in the reverse direction

[0060] According to the downward movement height H1 and the distance H2 between the top surface of the receiving plate H26 and the lower end of the probe of the contact detection device H24, the distance that the grinding wheel needs to move downward from the origin height when the grinding wheel starts to contact the workbench 200 is determined. That is, the sum of the downward movement height H1 and the distance H2 between the top surface of the receiving plate H26 and the lower end of the probe of the contact sensor is the distance that the grinding wheel needs to move downward from the origin height when the grinding wheel starts to contact the workbench 200

[0061] After the tool setting is completed, the tool setting detection component H05 is moved to the outside of the workbench by the rotating mechanism, and then grinding can be carried out

[0062] Embodiment 3 This embodiment discloses a grinding and polishing system, including: A grinding unit for controlling the index table to rotate in the first direction to sequentially rotate the workbench with a workpiece fixed on its top surface to a first grinding mechanism, a second grinding mechanism and a polishing mechanism for grinding A cleaning unit, configured to control a cleaning mechanism to clean and dry the top surface of a workpiece on the workbench at the polishing mechanism after grinding is completed at the polishing mechanism; A reverse driving unit, configured to control the indexing table to rotate in a second direction to drive the workbench to rotate towards the second grinding mechanism and cause the workbench to rotate itself, where the second direction is opposite to the first direction; A roughness detection unit, configured to obtain a signal from the roughness detection component and determine whether the surface roughness of the workpiece on the workbench meets the requirements during the process that the roughness detection component beside the polishing mechanism can detect the workpiece on the workbench; A total thickness change detection unit, configured to obtain a signal from the thickness measurement component and determine whether the total thickness change of the workpiece on the workbench meets the requirements during the process that the thickness measurement component at the second grinding mechanism can detect the workpiece on the workbench; A returning to the loading / unloading position unit, configured to control the indexing table to rotate in the first direction to drive the workbench to move to the workpiece loading / unloading position for loading and unloading after the workbench moves back to the second grinding mechanism;

[0063] Embodiment 4 This embodiment discloses a grinding and polishing device, including a memory and a processor. A program executable by the processor is stored in the memory. When the program is executed, the grinding and polishing method described in any one of the above is implemented.

[0064] There are still various implementation manners of the present invention. All technical solutions formed by using equivalent transformations or equivalent substitutions fall within the protection scope of the present invention.

Claims

1. A grinding and polishing method, characterized in that: The steps include: The indexing table is rotated in a first direction to rotate the worktable with the workpiece fixed on the top surface to the first grinding mechanism, the second grinding mechanism and the polishing mechanism in sequence for grinding; After the grinding is completed at the polishing mechanism, the top surface of the workpiece on the workbench at the polishing mechanism is cleaned and dried by the cleaning mechanism; The indexing table is rotated in a second direction to drive the worktable to move toward the second grinding mechanism and the worktable is rotated, wherein the second direction is opposite to the first direction; When the roughness detection component beside the polishing mechanism can detect the workpiece on the workbench, a signal of the roughness detection component is obtained and it is determined whether the surface roughness of the workpiece on the workbench meets the requirements; When the thickness measuring component at the second grinding mechanism is able to detect the workpiece on the workbench, a signal of the thickness measuring component is obtained, and it is determined whether the total thickness change of the workpiece on the workbench meets the requirements; After the workbench moves back to the second grinding mechanism, the indexing table is rotated along the first direction to move the workbench to the upper and lower positions of the workpieces for loading and unloading.

2. The grinding and polishing method according to claim 1, characterized in that: The thickness measuring component at the No. 2 grinding mechanism is located at a side of the No. 2 grinding mechanism close to the polishing mechanism.

3. The grinding and polishing method according to claim 1, characterized in that: The roughness detection component is located on a side of the polishing mechanism close to the second grinding mechanism.

4. The grinding and polishing method according to claim 1, characterized in that: The axis of the detection head of the roughness detection component passes through a circle where the center of the table surface of a group of the worktables is located, and the axis of the detection head of the thickness measuring component at the second grinding mechanism passes through a circle where the center of the table surface of a group of the worktables is located.

5. The grinding and polishing method according to claim 1, characterized in that: The speed at which the indexing table rotates along the first direction is greater than the speed at which the indexing table rotates along the second direction.

6. The grinding and polishing method according to claim 5, characterized in that: The rotation speed of the indexing table when driving the worktable to move from the second grinding mechanism to the upper and lower positions of the workpiece is greater than the rotation speed of the indexing table when driving the worktable to move from the upper and lower positions of the workpiece to the first grinding mechanism, the second grinding mechanism and the polishing mechanism in sequence.

7. The grinding and polishing method according to any one of claims 1 to 6, characterized in that: The polishing mechanism and the second grinding mechanism are arranged on two opposite sides of the dividing table; a centering mechanism located on the side of the polishing mechanism is arranged next to the dividing table, and a first line perpendicularly connecting the axis of the wafer stage of the centering mechanism and the axis of the workbench located above and below the workpiece extends along direction one, and direction one is perpendicular to direction two, and direction two is the extension direction of the second line connecting the centers of the table surfaces of the two workbenches located at the first grinding mechanism and the second grinding mechanism. The workpiece at the centering mechanism is moved to the workbench located above and below the workpiece by a suspended loading mechanism, and the workpiece on the workbench located above and below the workpiece is transferred to a cleaning device by a unloading mechanism, and the cleaning device is located on the side of the centering mechanism deviating from the polishing mechanism.

8. The grinding and polishing method according to any one of claims 1 to 6, characterized in that: A tool setting mechanism is arranged next to the No. 1 grinding mechanism and / or the No. 2 grinding mechanism and / or the polishing mechanism.

9. Grinding and polishing system, characterized in that: include: The grinding unit is used to control the indexing table to rotate along the first direction so as to rotate the worktable with the workpiece fixed on the top surface to the first grinding mechanism, the second grinding mechanism and the polishing mechanism in sequence for grinding; A cleaning unit, used to control the cleaning mechanism to clean and dry the top surface of the workpiece on the workbench at the polishing mechanism after the grinding is completed at the polishing mechanism; A reverse driving unit, used for controlling the indexing table to rotate in a second direction to drive the worktable to rotate toward the second grinding mechanism and to make the worktable rotate on its own, wherein the second direction is opposite to the first direction; A roughness detection unit, used for obtaining a signal of the roughness detection component and determining whether the surface roughness of the workpiece on the worktable meets the requirements when the roughness detection component beside the polishing mechanism can detect the workpiece on the worktable; a total thickness change detection unit, used for obtaining a signal of the thickness measuring component when the thickness measuring component at the second grinding mechanism can detect the workpiece on the workbench, and determining whether the total thickness change of the workpiece on the workbench meets the requirements; The loading and unloading position unit is used to control the indexing table to rotate in the first direction to drive the workbench to move to the upper and lower positions of the workpiece for loading and unloading after the workbench moves back to the second grinding mechanism.

10. A grinding and polishing device, comprising a memory and a processor, wherein the memory stores a program executable by the processor, characterized in that: When the program is executed, the grinding and polishing method according to any one of claims 1 to 8 is implemented.

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