Hub type dicing blade and preparation method thereof

Abstract

The invention relates to a hub type dicing blade and a preparation method thereof.The hub type dicing blade comprises a base body and a composite coating, a cooling channel is formed in the base body, two liquid inlet holes are correspondingly formed in the inner side of the base body, a plurality of liquid outlet holes are formed in the outer side of the base body in the circumferential direction, the liquid inlet holes and the liquid outlet holes communicate with the cooling channel, an inclined face is formed on the surface of one side of the base body, and the composite coating is arranged on the outer side of the base body. A plane is arranged on the side, away from the inclined face, of the base body, and the composite coating is arranged on the plane. The preparation method comprises the following steps: S1, preparing a mounting body blank and a cutter body blank; s2, the mounting body blank and the cutter body blank are machined; s3, welding the mounting body blank and the cutter body blank to obtain a scribing cutter blank; s4, a liquid outlet hole and a mounting groove are machined in the scribing cutter blank, and a base body is obtained; s5, pre-plating the base body; s6, electroplating the substrate; and S7, the base body is subjected to grinding, edging, alkali etching and chemical polishing. According to the invention, the high-ductility material is prevented from adhering to the cutting edge abrasive material, and the risks of back collapse, back crack and side collapse of the wafer are effectively reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of dicing blades, and particularly to a hub-type dicing blade and a preparation method thereof. Background Art

[0002] In the manufacturing process of semiconductor chips, dicing blades are used to precisely, efficiently, and with high quality cut semiconductor wafers to achieve chip singulation. The quality after dicing (such as chipping on both sides of the cut) plays a decisive role in the quality of the chips. Therefore, dicing blades are one of the important consumables in the chip manufacturing process. To meet the market consumption demand, various chip structures are becoming more and more complex, and chip streets are becoming narrower and narrower, resulting in higher requirements for dicing blades used for precision cutting of wafers. The chipping on both sides of the cut is required to be at an extremely high level. Research and development of a high-quality and efficient cutting tool and cutting process is one of the urgent needs to support the rapid development of China's integrated circuit manufacturing industry.

[0003] The thickness of existing chip wafers is usually between 50 - 100 μm. Such wafers are extremely prone to chipping. Therefore, a DAF film (die attach film) is usually attached to the back of such wafers to reduce the probability of chipping. However, the DAF film will generate highly ductile debris during the dicing process, causing the cutting edge of the dicing blade to become dull, and it is extremely easy to cause back chipping, back cracking, side chipping, etc., making it difficult to process the dicing of ultra-thin wafers.

[0004] The invention patent with the publication number CN114871954B provides a special dicing blade for ultra-thin IC wafers. By designing the particle size of diamond micropowder and the nickel-based binder formula, and precisely controlling the diamond concentration, the thickness accuracy of the dicing blade, and the cutting edge length, it is expected to improve the stiffness of the cutting edge of the dicing blade, ensure good self-sharpening of the cutting edge, and to a certain extent prevent back cracking caused by the adhesion of highly ductile materials such as DAF to the tip abrasive. However, during the cutting process, since the cutting seam is close to the thickness of the dicing blade, the cooling water channel at the end face is extremely small, and the amount of cooling water entering is limited; for the high-speed rotating dicing blade, an air flow barrier will be formed on its own solid surface, causing part of the cooling water to be atomized, affecting the full cooling of the cooling water entering the cutting area (the contact area between the circumferential surface of the dicing blade and the workpiece). Excessive frictional heat load will also lead to a decrease in the self-sharpening of the dicing blade, the dicing blade becoming dull, and increasing the risk of back chipping, back cracking, and side chipping of the wafer. Summary of the Invention

[0005] Based on this, it is necessary to provide a hub-type dicing blade and a preparation method thereof for the problems that in the existing hub-type dicing blade, an air flow barrier is formed on the surface of its own entity during high-speed rotation, causing part of the cooling water to be atomized, affecting the full cooling of the cooling water entering the cutting area (the contact area between the circumferential surface of the dicing blade and the workpiece), resulting in a reduction in the self-sharpening property of the dicing blade, passivation of the dicing blade, and an increased risk of wafer back breakage, back cracking, and side breakage.

[0006] A hub-type dicing blade includes a substrate and a composite coating plated on the surface of the substrate. A cooling channel is arranged inside the substrate. Two liquid inlet holes are correspondingly arranged on the inner side of the substrate. A plurality of liquid outlet holes are arranged circumferentially on the outer side of the substrate. Both the liquid inlet holes and the liquid outlet holes are communicated with the cooling channel. The cross-section of the substrate gradually expands outward along the direction of the substrate towards the composite coating, so that an inclined surface is formed on one side surface of the substrate. A flat surface is arranged on the side of the substrate away from the inclined surface. The composite coating is arranged on the flat surface, and the part of the composite coating extending beyond the substrate is the cutting edge.

[0007] As a preferred scheme, the ratio of the diameter of the liquid inlet hole to the diameter of the liquid outlet hole is 2-3:1.

[0008] As a preferred scheme, the substrate includes a mounting body and a tool body connecting the mounting body. An upper cooling groove and an upper liquid inlet groove are arranged on the mounting body. A lower cooling groove and a lower liquid inlet groove are arranged on the tool body. The cooling channel is arranged between the upper cooling groove and the lower cooling groove. The liquid inlet hole is arranged between the upper liquid inlet groove and the lower liquid inlet groove.

[0009] As a preferred scheme, the inclined surface is arranged on one side surface of the tool body, and the flat surface is arranged on the side of the tool body away from the inclined surface.

[0010] As a preferred scheme, a mounting groove for connecting with a dicing machine is axially arranged on the substrate, and the mounting groove penetrates through the substrate.

[0011] As a preferred scheme, the composite coating is composed of an electroplated nickel binder and diamond abrasives.

[0012] As a preferred scheme, the diamond abrasives are 5000-mesh diamond micro-powder.

[0013] As a preferred scheme, the length of the cutting edge is 380-510μm.

[0014] As a preferred scheme, the thickness of the composite coating is 14-18μm.

[0015] As a preferred scheme, the aspect ratio of the length to the thickness of the cutting edge is (21-36):1.

[0016] As a preferred solution, the material of the substrate is aluminum alloy.

[0017] A method for preparing a hub-shaped dicing blade as described above includes the following steps:

[0018] S1. Cut the aluminum alloy rod, and then through rough machining and finish machining, prepare the mounting body blank and the tool body blank.

[0019] S2. Use a numerical control machine tool to machine an upper cooling groove and an upper liquid inlet groove on the mounting body blank, and machine a lower cooling groove and a lower liquid inlet groove on the tool body blank.

[0020] S3. Weld the mounting body blank and the tool body blank obtained in step S2 by a laser welding machine to obtain a dicing blade blank.

[0021] S4. Use a numerical control machine tool to machine a liquid outlet hole and a mounting groove on the dicing blade blank to obtain the substrate.

[0022] S5. Place the substrate obtained in step S4 in a pre-plating solution for pre-plating to generate a pre-plated layer on the plane of the substrate.

[0023] S6. Place the substrate obtained in step S5 in an electroplating solution for electroplating to generate a composite plated layer on the plane of the substrate.

[0024] S7. Grind, edge, alkaline etch, and chemically polish the substrate obtained in step S6 to obtain the hub-shaped dicing blade.

[0025] As a preferred solution, before S5, the substrate needs to be pretreated.

[0026] As a preferred solution, before pretreating the substrate, the substrate needs to be assembled with a fixture, and the areas of the substrate that do not need electroplating are covered with gaskets.

[0027] As a preferred solution, the pretreatment method includes degreasing and pickling activation.

[0028] As a preferred solution, the operating steps of degreasing include placing an alkaline solution in the cleaning chamber of an ultrasonic cleaning machine, and putting the substrate obtained in S4 into the alkaline solution for cleaning for 10 - 20 minutes.

[0029] As a preferred solution, the alkaline solution is composed of sodium hydroxide, sodium carbonate, and calcium hydroxide mixed in a weight ratio of 2 - 5: 20 - 30: 30 - 50.

[0030] As a preferred solution, the operation steps of pickling and activation include taking out the substrate obtained through the degreasing step, washing it with clear water 3 - 5 times, then washing it with distilled water 1 - 3 times, then putting the substrate into the pickling solution and stirring for pickling for 20 - 30 s, and then putting it into the activation solution and stirring for activation for 5 - 8 min.

[0031] As a preferred solution, the pickling and activation solution is prepared by mixing sulfuric acid (with a concentration of more than 90%), potassium fluoride, and plasma water in a weight ratio of 80 - 120:0.2 - 0.6:80 - 120.

[0032] As a preferred solution, the activation solution consists of AgNO 3 solution (with a concentration of 20 g / L) and NH 3 ·H 2 O solution (with a concentration of 200 g / L) in a volume ratio of 1:0.3.

[0033] As a preferred solution, the specific steps of pre - plating the substrate obtained in step S4 in the pre - plating solution in S5 are

[0034] Put the pre - plating solution into a container, heat it to 50 - 60 °C, then put the substrate after degreasing and pickling - activation into the pre - plating solution, stir for 20 - 30 min and then take it out, wash it 4 - 6 times with clear water, and then dry it and remove the surface burrs.

[0035] As a preferred solution, the pre - plating solution includes nickel sulfate, sodium hypophosphite, sodium acetate, hydrofluoric acid (40% V / V), and thiourea, where the mass ratio of nickel sulfate, sodium hypophosphite, and sodium acetate is 13 - 18:11 - 16:10 - 15.

[0036] As a preferred solution, the content of hydrofluoric acid (40% V / V) is 10 - 15 ml / L.

[0037] As a preferred solution, the content of thiourea is 0.3 - 0.9 mg / L.

[0038] As a preferred solution, the specific operation steps of electroplating the substrate obtained in step S5 in the electroplating solution in S6 are

[0039] Take the substrate obtained in step S5 as the cathode, put it into the electroplating tank loaded with the electroplating solution, use a nickel plate as the anode, and electroplate for 80 - 120 min under the conditions of a temperature of 40 - 60 °C and a current density of 1.6 - 3.5 A / dm 2 ².

[0040] As a preferred solution, the electroplating solution includes nickel sulfamate, nickel chloride, boric acid, and diamond abrasive, and the diamond abrasive is 5000 - mesh diamond micro - powder.

[0041] As a preferred solution, the total concentration of nickel sulfamate and nickel chloride is 300 - 400 g / L.

[0042] As a preferred solution, the mass ratio of nickel chloride to nickel sulfamate is 1:2 - 5.

[0043] As a preferred solution, the concentration of boric acid is 25 - 50 g / L.

[0044] As a preferred solution, the pH value of the electroplating solution is 3.5 - 4.5.

[0045] As a preferred solution, the content of diamond micropowder is 1.3 - 1.8 g / L.

[0046] The beneficial effects of the present invention are as follows: There are cooling channels arranged in the base body, two liquid inlet holes are correspondingly arranged on the inner side of the base body, and a plurality of liquid outlet holes are arranged circumferentially on the outer side of the base body. In this way, during the wafer cutting process, the coolant enters the cooling channels through the liquid inlet holes via the spindle of the dicing machine, then flows out through the liquid outlet holes and flows along the inclined surface to the cutting edge. On the one hand, it can cool the hub - type dicing blade to prevent the hub - type dicing blade from reducing its self - sharpening ability due to excessive frictional heat load. On the other hand, the cooling water can flow along the inclined surface to the cutting edge to wash the cutting edge and prevent the high - ductility material from adhering to the abrasive on the cutting edge, thereby effectively reducing the risks of wafer back - chipping, back - cracking and side - chipping. Description of the Drawings

[0047] Figure 1 It is a structural diagram of a hub - type dicing blade in an embodiment of the present invention;

[0048] Figure 2 It is an internal structural diagram of a hub - type dicing blade in an embodiment of the present invention;

[0049] Figure 3 It is a schematic diagram of the force on a water droplet when the liquid outlet hole rotates to the lowest point in the present invention;

[0050] Figure 4 It is a decomposition diagram of gravity and centrifugal force on the water droplet when the liquid outlet hole rotates to the lowest point in the present invention;

[0051] Figure 5 It is a bottom view of the installation body embryo processed with an upper cooling groove and an upper liquid inlet groove in the present invention;

[0052] Figure 6 It is a top view of the tool body embryo processed with a lower cooling groove and a lower liquid inlet groove in the present invention;

[0053] Figure 7Installation structure diagram of the hub-shaped dicing blade and the dicing machine with internal shaft water-cooling and cleaning prepared in Embodiments 1-3 of the present invention;

[0054] Figure 8 Installation structure diagram of the dicing blade and the dicing machine with internal shaft water-cooling and cleaning prepared in Comparative Examples 1-2 of the present invention.

[0055] The meanings of the reference numerals in the drawings are as follows:

[0056] 100 - Hub-shaped dicing blade;

[0057] 10 - Substrate, 11 - Cooling channel, 12 - Liquid inlet hole, 13 - Liquid outlet hole, 14 - Inclined surface, 15 - Installation groove;

[0058] 20 - Composite coating;

[0059] 30 - Installation body blank, 31 - Upper cooling groove, 32 - Upper liquid inlet groove;

[0060] 40 - Blade body blank, 41 - Lower cooling groove, 42 - Lower liquid inlet groove;

[0061] 200 - Water droplet;

[0062] 300 - Dicing machine with internal shaft water-cooling and cleaning.

[0063] 400 - Dicing blade. Detailed Description of the Invention

[0064] The endpoints and any values disclosed in this document are not limited to the exact range or value. These ranges or values should be understood to include values close to these ranges or values. For numerical ranges, the endpoint values of each range, between the endpoint values of each range and individual point values, and between individual point values can be combined with each other to obtain one or more new numerical ranges, and these numerical ranges should be regarded as specifically disclosed in this document.

[0065] The following provides a detailed description of the specific embodiments of the present invention. It should be understood that the specific embodiments described herein are only for the purpose of illustration and explanation of the present invention, and are not used to limit the present invention.

[0066] Please refer to Figure 1 and Figure 2, a hub-type dicing blade 100, comprising a substrate 10 and a composite coating 20 plated on the surface of the substrate 10. A cooling channel 11 is provided inside the substrate 10. Two liquid inlet holes 12 are correspondingly provided on the inner side of the substrate 10. A plurality of liquid outlet holes 13 are circumferentially provided on the outer side of the substrate 10. Both the liquid inlet holes 12 and the liquid outlet holes 13 are communicated with the cooling channel 11. The cross-section of the substrate 10 gradually expands outward along the direction of the substrate 10 towards the composite coating 20. Thus, an inclined surface 14 is formed on one surface of the substrate 10. A flat surface is provided on the side of the substrate 10 away from the inclined surface 14. The composite coating 20 is provided on the flat surface. The part of the composite coating 20 extending beyond the substrate 10 is the cutting edge.

[0067] As a preferred solution, the ratio of the diameter of the liquid inlet hole 12 to the diameter of the liquid outlet hole 13 is 2 - 3:1.

[0068] The cutting point of the hub-type dicing blade 100 is generally directly below. When the liquid outlet hole 13 rotates to the lowest point, the centrifugal force F, gravitational force g, and surface tension Y acting on the water droplet 200 are as Figure 3 shown. Since the gravitational force g can be decomposed into a gravitational component g1 perpendicular to the inclined surface 14 and a gravitational component g2 parallel to the inclined surface 14, and the centrifugal force can also be decomposed into a centrifugal component F1 perpendicular to the inclined surface 14 and a centrifugal component F2 parallel to the inclined surface 14. After decomposition, as Figure 4 shown. When the gravitational component g2 and the centrifugal component F2 cancel each other out, the water droplet 200 can slide down along the inclined surface 14. The water droplet 200 in high-speed rotation is affected by the centrifugal force F, gravitational force g, and surface tension Y. According to the centrifugal force formula F = a * m (where F is the centrifugal force, a is the centripetal acceleration, and m is the mass of the water droplet 200), it can be known that when the rotational speed is constant (i.e., the value of the centripetal acceleration is constant), the magnitude of the centrifugal force F is proportional to the mass of the water droplet 200. And the magnitude of the gravitational force g is also proportional to the mass of the water droplet 200. The size of the liquid outlet hole 13 can control the mass of the water droplet 200. After multiple tests, the inventor found that when the ratio of the diameter of the liquid inlet hole 12 to the diameter of the liquid outlet hole 13 is 2 - 3:1, the mass of the water droplet 200 can meet the above conditions. This can ensure that the cooling water can flow out from the liquid outlet hole 13 and flow along the inclined surface 14 of the substrate 10 to the cutting edge. On the one hand, it can realize the cooling of the hub-type dicing blade 100 and prevent the hub-type dicing blade 100 from reducing its self-sharpening due to excessive frictional heat load. On the other hand, the cooling water can flow along the inclined surface 14 to the cutting edge to wash the cutting edge and prevent the abrasive adhesion of high-ductility materials to the cutting edge, thereby effectively reducing the risks of wafer back-break, back-crack, and side-break.

[0069] As a preferred solution, the substrate 10 includes a mounting body and a tool body connected to the mounting body. An upper cooling groove 31 and an upper liquid inlet groove 32 are provided on the mounting body. A lower cooling groove 41 and a lower liquid inlet groove 42 are provided on the tool body. The cooling channel 11 is provided between the upper cooling groove 31 and the lower cooling groove 41. The liquid inlet hole 12 is provided between the upper liquid inlet groove 32 and the lower liquid inlet groove 42.

[0070] As a preferred solution, the inclined surface 14 is provided on one side surface of the tool body, and the flat surface is provided on the side of the tool body away from the inclined surface 14.

[0071] As a preferred solution, a mounting groove 15 for connecting to a dicing machine is axially provided in the substrate 10, and the mounting groove 15 penetrates the substrate 10.

[0072] As a preferred solution, the composite coating 20 is composed of an electroplated nickel binder and diamond abrasives.

[0073] As a preferred solution, the diamond abrasive is 5000-mesh diamond micropowder.

[0074] As a preferred solution, the volume ratio of the diamond abrasive in the composite coating 20 is 12-15%. If the content of the diamond abrasive in the composite coating 20 is too high, the distance between two abrasives is smaller, and the chip pocket formed in the front area of the abrasive is smaller, which easily leads to difficult chip discharge and affects the processing quality and efficiency. If the content of the diamond abrasive in the composite coating 20 is too low, the cutting efficiency will be reduced, affecting the durability of the hub-type dicing blade 100. Through a large number of experiments, the inventor found that when the volume ratio of the diamond abrasive in the composite coating 20 is 12-15%, it can not only maintain high cutting efficiency and good durability of the hub-type dicing blade, but also make the chip pocket in the front area of the abrasive form sufficiently and maintain back-break stability.

[0075] As a preferred solution, the blade length is 380-510μm.

[0076] As a preferred solution, the thickness of the composite coating 20 is 14-18μm, which can not only ensure the strength of the blade, but also ensure that the cutting groove width of the hub-type dicing blade 100 is between 0.015-0.02mm.

[0077] As a preferred solution, the aspect ratio of the blade is (21-36):1.

[0078] As a preferred solution, the material of the substrate 10 is all aluminum alloy.

[0079] A preparation method of the hub-type dicing blade 100 as described above includes the following steps:

[0080] S1. Cut the aluminum alloy rod, and then through rough machining and finish machining, prepare the mounting body blank 30 and the tool body blank 40;

[0081] S2. Use a numerically controlled machine tool to machine an upper cooling groove 31 and an upper liquid inlet groove 32 on the mounting body blank 30, and machine a lower cooling groove 41 and a lower liquid inlet groove 42 on the tool body blank 40, as Figure 5 and Figure 6 shown;

[0082] S3. Use a laser welding machine to weld the mounting body blank 30 and the tool body blank 40 obtained in step S2 together to obtain a dicing blade blank;

[0083] S4. Use a numerically controlled machine tool to machine a liquid outlet hole 13 and a mounting groove 15 on the dicing blade blank to obtain the substrate 10;

[0084] S5. Place the substrate 10 obtained in step S4 in a pre-plating solution for pre-plating to form a pre-plated layer on the plane of the substrate 10;

[0085] S6. Place the substrate 10 obtained in step S5 in an electroplating solution for electroplating to form a composite coating 20 on the plane of the substrate 10;

[0086] S7. Grind, edge, alkali-etch, and chemically polish the substrate 10 obtained in step S6 to obtain a hub-type dicing blade 100.

[0087] The hub-type dicing blade 100 manufactured by the above method has high precision, and can effectively ensure that the ratio of the diameter of the liquid inlet hole 12 to the diameter of the liquid outlet hole 13 is 2 - 3:1. Ensure that during the processing, after the cooling water enters from the dicing blade spindle, passes through the liquid inlet hole 12 and the cooling channel 11, it can flow out from the liquid outlet hole 13, and can flow along the inclined surface 14 of the substrate 10 to the cutting edge. On the one hand, it can realize the cooling of the hub-type dicing blade 100, prevent the hub-type dicing blade 100 from reducing its self-sharpening ability due to excessive frictional heat load. On the other hand, the cooling water can flow along the inclined surface 14 to the cutting edge to wash the cutting edge, preventing the adhesion of abrasive materials with high ductility to the cutting edge, thereby effectively reducing the risk of wafer back breakage, back cracking, and side cracking; on the other hand, the cutting groove width of the manufactured hub-type dicing blade 100 is between 0.015 - 0.02 mm, its cutting efficiency is high, it has good durability, and can also make the chip pocket in the front area of the abrasive material form sufficiently to maintain the stability of back breakage.

[0088] As a preferred solution, before S5, the substrate 10 needs to be pretreated.

[0089] As a preferred solution, before pretreating the substrate 10, the substrate 10 needs to be assembled with a fixture, and the areas of the substrate 10 that do not need electroplating are covered with gaskets.

[0090] As a preferred embodiment, the pretreatment method includes degreasing and pickling activation.

[0091] As a preferred embodiment, the operation steps of degreasing include placing an alkaline solution in the cleaning chamber of an ultrasonic cleaner, and putting the substrate 10 after S4 into the alkaline solution for cleaning for 10 - 20 minutes.

[0092] As a preferred embodiment, the alkaline solution is formed by mixing sodium hydroxide, sodium carbonate and calcium hydroxide in a weight ratio of 2 - 5: 20 - 30: 30 - 50.

[0093] As a preferred embodiment, the operation steps of pickling activation include taking out the substrate 10 obtained after the degreasing step, washing it with clean water 3 - 5 times, then washing it with distilled water 1 - 3 times, then putting the substrate 10 into the pickling solution for stirring pickling for 20 - 30 seconds, and then putting it into the activation solution for stirring activation for 5 - 8 minutes.

[0094] As a preferred embodiment, the pickling activation solution is formed by mixing sulfuric acid (with a concentration of more than 90%), potassium fluoride and plasma water in a weight ratio of 80 - 120: 0.2 - 0.6: 80 - 120.

[0095] As a preferred embodiment, the activation solution is composed of AgNO 3 solution (with a concentration of 20 g / L) and NH 3 ·H 2 O solution (with a concentration of 200 g / L) mixed in a volume ratio of 1: 0.3.

[0096] As a preferred embodiment, the specific steps of pre - plating the substrate 10 after step S4 in S5 in the pre - plating solution are

[0097] Put the pre - plating solution into a container, heat it to 50 - 60 °C, then put the substrate 10 after degreasing and pickling activation into the pre - plating solution, stir for 20 - 30 minutes and then take it out, wash it with clean water 4 - 6 times, and then dry it and remove the surface burrs.

[0098] After degreasing and pickling activation, the substrate 10 can more easily form a uniform pre - plating layer during pre - plating, providing a solid foundation for subsequent electroplating. The setting of the pre - plating layer can make the connection between the composite electroplating layer and the substrate 10 more firm, effectively improving the durability of the hub - type dicing blade 100 and increasing the service life of the hub - type dicing blade 100. Removing the surface burrs after completing the pre - plating layer can improve the flatness of the pre - plating layer.

[0099] As a preferred solution, the pre-plating solution includes nickel sulfate, sodium hypophosphite, sodium acetate, hydrofluoric acid (40% V / V), and thiourea, wherein the mass ratio of nickel sulfate, sodium hypophosphite, and sodium acetate is 13-18:11-16:10-15.

[0100] As a preferred solution, the content of hydrofluoric acid (40% V / V) is 10-15 ml / L.

[0101] As a preferred solution, the content of thiourea is 0.3-0.9 mg / L.

[0102] As a preferred solution, the specific operation steps for electroplating the substrate 10 that has undergone step S5 in the electroplating solution in S6 are

[0103] Using the substrate 10 that has undergone step S5 as the cathode, placing it in an electroplating tank loaded with the electroplating solution, using a nickel plate as the anode, at a temperature of 40-60 °C and a current density of 1.6-3.5 A / dm 2 for electroplating for 80-120 min.

[0104] As a preferred solution, the electroplating solution includes nickel sulfamate, nickel chloride, boric acid, and diamond abrasive, and the diamond abrasive is 5000-mesh diamond micropowder.

[0105] As a preferred solution, the total concentration of nickel sulfamate and nickel chloride is 300-400 g / L.

[0106] As a preferred solution, the mass ratio of nickel chloride to nickel sulfamate is 1:2-5. When nickel sulfamate is used as the main electroplating salt, it can reduce the internal stress of the composite coating 20. However, if the content of nickel sulfamate is too high, the internal stress of the hub-type dicing blade 100 will be too low, reducing the mechanical properties of the hub-type dicing blade 100. The inventor found through a large number of experiments that only when the mass ratio of nickel chloride to nickel sulfamate is 1:2-5 can the internal stress of the composite coating 20 be within a suitable range (it would be best if corresponding data could be provided). Thus, during the cutting process, the mechanical stress on the wafer is smaller, which can effectively reduce the damage to the wafer, improve the integrity and yield rate of the wafer, and reduce the risk of chipping.

[0107] As a preferred solution, the concentration of boric acid is 25-50 g / L.

[0108] As a preferred solution, the pH value of the electroplating solution is 3.5-4.5.

[0109] As a preferred solution, the content of the diamond micropowder is 1.3 - 1.8 g / L. Through a large number of experiments, the inventor found that when the content of the diamond micropowder is 1.3 - 1.8 g / L, the volume proportion of the diamond abrasive in the composite coating 20 reaches within the range of 12 - 15%.

[0110] The following are specific embodiments

[0111] Example 1

[0112] Preparation of the hub-type dicing blade A1

[0113] S1. Cut the aluminum alloy rod, and then through rough machining and finish machining, prepare the mounting body blank 30 and the tool body blank 40;

[0114] S2. By means of a numerical control machine tool, process the upper cooling groove 31 and the upper liquid inlet groove 32 on the mounting body blank 30, and process the lower cooling groove 41 and the lower liquid inlet groove 42 on the tool body blank 40;

[0115] S3. Weld the mounting body blank 30 and the tool body blank 40 obtained in step S2 by means of a laser welding machine to obtain the dicing blade blank;

[0116] S4. By means of a numerical control machine tool, process the liquid outlet hole 13 and the mounting groove 15 on the dicing blade blank to obtain the substrate 10;

[0117] S5. Assemble the substrate 10 with a fixture, and shield the areas on the substrate 10 that do not need electroplating with gaskets.

[0118] Degreasing: Place the alkaline solution in the cleaning chamber of an ultrasonic cleaning machine, and put the substrate 10 into the alkaline solution for cleaning for 10 min; wherein, the alkaline solution is composed of sodium hydroxide, sodium carbonate and calcium hydroxide mixed in a weight ratio of 5:30:50.

[0119] Pickling and activation: Take out the substrate 10 obtained in the degreasing step, wash it with clean water 3 - 5 times, then wash it with distilled water 1 - 3 times, then put the substrate 10 into the pickling solution for stirring pickling for 20 s, and then put it into the activation solution for stirring activation for 5 min. Among them, the pickling and activation solution is composed of sulfuric acid (concentration above 90%), potassium fluoride and plasma water mixed in a weight ratio of 120:0.6:120. The activation solution is composed of AgNO 3 solution (concentration 20 g / L) and NH 3 ·H 2 O solution (concentration 200 g / L) mixed in a volume ratio of 1:0.3.

[0120] Pre - plating: Put the pre - plating solution into a container, heat it to 50 °C, then put the substrate 10 which has been degreased and pickled and activated into the pre - plating solution, stir for 20 minutes and then take it out, wash it with clear water 4 - 6 times, and then air - dry and remove the surface burrs. The pre - plating solution includes nickel sulfate, sodium hypophosphite, sodium acetate, hydrofluoric acid (40% V / V) and thiourea. The mass ratio of nickel sulfate, sodium hypophosphite and sodium acetate is 18:16:15. The content of hydrofluoric acid (40% V / V) is 15 ml / L. The content of thiourea is 0.9 mg / L.

[0121] S6. Place the substrate 10 after step S5 in the electroplating solution for electroplating to form a composite coating 20 on the plane of the substrate 10;

[0122] Take the substrate 10 after step S5 as the cathode, put it into an electroplating tank loaded with the electroplating solution, use a nickel plate as the anode, and electroplate for 120 minutes at a temperature of 60 °C and a current density of 1.6 A / dm 2 .

[0123] The electroplating solution includes nickel sulfamate, nickel chloride, boric acid and diamond abrasive. The diamond abrasive is 5000 - mesh diamond micropowder. The total concentration of nickel sulfamate and nickel chloride is 400 g / L. The mass ratio of nickel chloride to nickel sulfamate is 1:5. The concentration of boric acid is 50 g / L. The pH value of the electroplating solution is 3.5. The content of diamond micropowder is 1.8 g / L.

[0124] S7. Grind, edge - open, alkali - etch and chemically polish the substrate 10 obtained in step S6 to obtain the hub - type scribing knife A1.

[0125] The hub - type scribing knife A1 includes a substrate 10 and a composite coating 20 plated on the surface of the substrate 10. A cooling channel 11 is arranged inside the substrate 10. Two liquid inlet holes 12 are correspondingly arranged on the inner side of the substrate 10. A plurality of liquid outlet holes 13 are arranged circumferentially on the outer side of the substrate 10. Both the liquid inlet holes 12 and the liquid outlet holes 13 are communicated with the cooling channel 11. The composite coating 20 is arranged on the plane. The part of the composite coating 20 extending beyond the substrate 10 is the blade. The ratio of the diameter of the liquid inlet hole 12 to the diameter of the liquid outlet hole 13 is 2 - 3:1. The blade length is 380 - 510 μm. The thickness of the composite coating 20 is 14 - 18 μm. The length - to - thickness ratio of the blade is (21 - 36):1. The material of the substrate 10 is aluminum alloy. The composite coating 20 is composed of an electroplated nickel binder and diamond abrasive. The diamond abrasive is 5000 - mesh diamond micropowder. The volume ratio of the diamond abrasive in the composite coating 20 is 15%.

[0126] Example 2

[0127] Preparation of Hub-type Scribing Tool A2

[0128] S1. Cut the aluminum alloy rod, and then through rough machining and finish machining, prepare the mounting body blank 30 and the tool body blank 40;

[0129] S2. By means of a numerical control machine tool, machine the upper cooling groove 31 and the upper liquid inlet groove 32 on the mounting body blank 30, and machine the lower cooling groove 41 and the lower liquid inlet groove 42 on the tool body blank 40;

[0130] S3. Weld the mounting body blank 30 and the tool body blank 40 obtained in step S2 by means of a laser welding machine to obtain a scribing tool blank;

[0131] S4. By means of a numerical control machine tool, machine the liquid outlet hole 13 and the mounting groove 15 on the scribing tool blank to obtain the base body 10;

[0132] S5. Assemble the base body 10 with a fixture, and shield the areas on the base body 10 that do not need electroplating with gaskets.

[0133] Degreasing: Place the alkaline solution in the cleaning chamber of an ultrasonic cleaning machine, and place the base body 10 in the alkaline solution for cleaning for 20 min; wherein, the alkaline solution is composed of sodium hydroxide, sodium carbonate and calcium hydroxide mixed in a weight ratio of 2:20:30.

[0134] Pickling and Activation: Take out the base body 10 obtained in the degreasing step, wash it with clean water 3 - 5 times, then wash it with distilled water 1 - 3 times, then place the base body 10 in the pickling solution for stirring pickling for 30 s, and then place it in the activation solution for stirring activation for 8 min. Among them, the pickling and activation solution is composed of sulfuric acid (concentration above 90%), potassium fluoride and plasma water mixed in a weight ratio of 80:0.2:80. The activation solution is composed of AgNO 3 solution (concentration of 20 g / L) and NH 3 ·H 2 O solution (concentration of 200 g / L) mixed in a volume ratio of 1:0.3.

[0135] Pre-plating: Place the pre-plating solution in a container, heat it to 60 °C, then place the base body 10 after degreasing and pickling and activation in the pre-plating solution for stirring for 20 min and then take it out, wash it 4 - 6 times with clean water, and then dry it and remove the surface burrs. The pre-plating solution includes nickel sulfate, sodium hypophosphite, sodium acetate, hydrofluoric acid (40% V / V) and thiourea, wherein the mass ratio of nickel sulfate, sodium hypophosphite and sodium acetate is 13:11:10. The content of hydrofluoric acid (40% V / V) is 10 ml / L. The content of thiourea is 0.3 mg / L.

[0136] S6. Place the substrate 10 after step S5 into the electroplating solution for electroplating to form a composite coating 20 on the plane of the substrate 10;

[0137] Use the substrate 10 after step S5 as the cathode and place it into an electroplating tank filled with the electroplating solution. Use a nickel plate as the anode and electroplate for 80 min at a temperature of 60 °C and a current density of 3.5 A / dm 2 .

[0138] The electroplating solution includes nickel sulfamate, nickel chloride, boric acid, and diamond abrasive. The diamond abrasive is diamond micropowder of 5000 mesh. The total concentration of nickel sulfamate and nickel chloride is 300 g / L. The mass ratio of nickel chloride to nickel sulfamate is 1:2. The concentration of boric acid is 25 g / L. The pH value of the electroplating solution is 4.5. The content of diamond micropowder is 1.3 g / L.

[0139] S7. Grind, edge, alkali-etch, and chemically polish the substrate 10 obtained in step S6 to obtain a hub-shaped dicing blade A2.

[0140] The hub-shaped dicing blade A2 includes a substrate 10 and a composite coating 20 plated on the surface of the substrate 10. A cooling channel 11 is provided inside the substrate 10. Two liquid inlet holes 12 are correspondingly provided on the inner side of the substrate 10. A plurality of liquid outlet holes 13 are circumferentially provided on the outer side of the substrate 10. Both the liquid inlet holes 12 and the liquid outlet holes 13 are communicated with the cooling channel 11. The composite coating 20 is provided on the plane. The part of the composite coating 20 extending beyond the substrate 10 is the blade edge. The ratio of the diameter of the liquid inlet hole 12 to the diameter of the liquid outlet hole 13 is 2 - 3:1. The length of the blade edge is 380 - 510 μm. The thickness of the composite coating 20 is 14 - 18 μm. The length-to-thickness ratio of the blade edge is (21 - 36):1. The material of the substrate 10 is aluminum alloy. The composite coating 20 is composed of an electroplated nickel binder and diamond abrasive. The diamond abrasive is diamond micropowder of 5000 mesh. The volume proportion of the diamond abrasive in the composite coating 20 is 12%.

[0141] Example 3

[0142] Preparation of hub-shaped dicing blade A3

[0143] S1. Cut an aluminum alloy rod, and then through rough machining and finish machining, prepare an installation body blank 30 and a tool body blank 40;

[0144] S2. Use a numerical control machine tool to machine an upper cooling groove 31 and an upper liquid inlet groove 32 on the installation body blank 30, and machine a lower cooling groove 41 and a lower liquid inlet groove 42 on the tool body blank 40;

[0145] S3. Weld the installation blank 30 and the tool blank 40 obtained in step S2 by a laser welding machine to obtain a dicing blade blank.

[0146] S4. Process a liquid outlet hole 13 and an installation groove 15 on the dicing blade blank by a numerical control machine tool to obtain the substrate 10.

[0147] S5. Assemble the substrate 10 with a fixture, and shield the areas on the substrate 10 that do not need electroplating with gaskets.

[0148] Degreasing: Place the alkaline solution in the cleaning chamber of an ultrasonic cleaning machine, and put the substrate 10 into the alkaline solution for cleaning for 15 min; wherein, the alkaline solution is composed of sodium hydroxide, sodium carbonate and calcium hydroxide mixed in a weight ratio of 3:25:40.

[0149] Pickling and activation: Take out the substrate 10 obtained in the degreasing step, wash it with clean water 3 - 5 times, then wash it with distilled water 1 - 3 times, then put the substrate 10 into the pickling solution for stirring pickling for 25 s, and then put it into the activation solution for stirring activation for 7 min. Among them, the pickling and activation solution is composed of sulfuric acid (concentration above 90%), potassium fluoride and plasma water mixed in a weight ratio of 100:0.4:100. The activation solution is composed of AgNO 3 solution (concentration 20 g / L) and NH 3 ·H 2 O solution (concentration 200 g / L) mixed in a volume ratio of 1:0.3.

[0150] Pre - plating: Put the pre - plating solution into a container, heat it to 55 °C, then put the substrate 10 after degreasing and pickling and activation into the pre - plating solution for stirring for 25 min and then take it out, wash it with clean water 4 - 6 times, then dry it and remove the surface burrs. The pre - plating solution includes nickel sulfate, sodium hypophosphite, sodium acetate, hydrofluoric acid (40% V / V) and thiourea, wherein the mass ratio of nickel sulfate, sodium hypophosphite and sodium acetate is 16:14:13. The content of hydrofluoric acid (40% V / V) is 13 ml / L. The content of thiourea is 0.6 mg / L.

[0151] S6. Place the substrate 10 obtained in step S5 into the electroplating solution for electroplating, and generate a composite coating 20 on the plane of the substrate 10.

[0152] Take the substrate 10 obtained in step S5 as the cathode, put it into an electroplating bath loaded with the electroplating solution, use a nickel plate as the anode, and electroplate for 100 min under the conditions of a temperature of 50 °C and a current density of 2.3 A / dm 2 .

[0153] The electroplating solution includes nickel sulfamate, nickel chloride, boric acid, and diamond abrasive. The diamond abrasive is diamond micropowder of 5000 mesh. The total concentration of nickel sulfamate and nickel chloride is 350 g / L. The mass ratio of nickel chloride to nickel sulfamate is 1:3. The concentration of boric acid is 25 g / L. The pH value of the electroplating solution is 4.5. The content of diamond micropowder is 1.3 g / L.

[0154] S7. Grind, edge, alkali-etch, and chemically polish the substrate 10 obtained in step S6 to obtain a hub-shaped dicing blade A3.

[0155] The hub-shaped dicing blade A3 includes a substrate 10 and a composite coating 20 plated on the surface of the substrate 10. A cooling channel 11 is provided inside the substrate 10. Two liquid inlet holes 12 are correspondingly provided on the inner side of the substrate 10. A plurality of liquid outlet holes 13 are circumferentially provided on the outer side of the substrate 10. Both the liquid inlet holes 12 and the liquid outlet holes 13 are communicated with the cooling channel 11. The composite coating 20 is provided on the plane, and the part of the composite coating 20 extending beyond the substrate 10 is the blade edge. The ratio of the diameter of the liquid inlet hole 12 to the diameter of the liquid outlet hole 13 is 2 - 3:1. The length of the blade edge is 380 - 510 μm. The thickness of the composite coating 20 is 14 - 18 μm. The length-to-thickness ratio of the blade edge is (21 - 36):1. The material of the substrate 10 is aluminum alloy. The composite coating 20 is composed of an electroplated nickel binder and diamond abrasive. The diamond abrasive is diamond micropowder of 5000 mesh. The volume proportion of the diamond abrasive in the composite coating 20 is 13%.

[0156] Comparative Example 1

[0157] Preparation of dicing blade D1

[0158] S1. Cut an aluminum alloy rod, and then through rough machining and finish machining, prepare a dicing blade body.

[0159] S2. Assemble the dicing blade body with a fixture, and shield the area of the dicing blade body that does not need electroplating with a gasket.

[0160] Degreasing: Place an alkaline solution in the cleaning chamber of an ultrasonic cleaner, and place the dicing blade body in the alkaline solution for cleaning for 15 min. Among them, the alkaline solution is prepared by mixing sodium hydroxide, sodium carbonate, and calcium hydroxide in a weight ratio of 3:25:40.

[0161] Pickling and activation: Take out the scribing tool body obtained from the degreasing step, wash it with clean water 3 - 5 times, then wash it with distilled water 1 - 3 times, and then put the substrate 10 into the pickling solution and stir for pickling for 25 s, and then put it into the activation solution and stir for activation for 7 min. Among them, the pickling and activation solution is composed of sulfuric acid (concentration above 90%), potassium fluoride and deionized water mixed in a weight ratio of 100:0.4:100. The activation solution consists of AgNO 3 solution (concentration 20 g / L) and NH 3 ·H 2 O solution (concentration 200 g / L) mixed in a volume ratio of 1:0.3.

[0162] Pre - plating: Put the pre - plating solution into a container, heat it to 55 °C, then put the scribing tool body after degreasing and pickling and activation into the pre - plating solution, stir for 25 min and then take it out, wash it with clean water 4 - 6 times, and then dry it and remove the surface burrs. The pre - plating solution includes nickel sulfate, sodium hypophosphite, sodium acetate, hydrofluoric acid (40% V / V) and thiourea, where the mass ratio of nickel sulfate, sodium hypophosphite and sodium acetate is 16:14:13. The content of hydrofluoric acid (40% V / V) is 13 ml / L. The content of thiourea is 0.6 mg / L.

[0163] S3. Place the scribing tool body after step S2 into the electroplating solution for electroplating to form a coating on the plane of the scribing tool body;

[0164] Take the scribing tool body after step S2 as the cathode, put it into the electroplating tank filled with the electroplating solution, use a nickel plate as the anode, and electroplate for 100 min under the conditions of a temperature of 50 °C and a current density of 2.3 A / dm 2 .

[0165] The electroplating solution includes nickel sulfamate, nickel chloride, boric acid and diamond abrasive, and the diamond abrasive is 5000 - mesh diamond micropowder. The total concentration of nickel sulfamate and nickel chloride is 350 g / L. The mass ratio of nickel chloride to nickel sulfamate is 1:3. The concentration of boric acid is 25 g / L. The pH value of the electroplating solution is 4.5. The content of diamond micropowder is 1.3 g / L.

[0166] S4. Grind, edge - open, alkali - etch and chemically polish the scribing tool body obtained after step S3 to obtain the scribing tool D1.

[0167] The dicing blade D1 includes a main blade body and a coating plated on the surface of the main blade body. The part of the coating extending beyond the main blade body is the blade edge. The length of the blade edge is 380 - 510 μm. The thickness of the coating is 14 - 18 μm. The aspect ratio of the length to the thickness of the blade edge is (21 - 36):1. The material of the main blade body is aluminum alloy. The coating is composed of an electroplated nickel binder and diamond abrasives. The diamond abrasives are 5000 - mesh diamond micropowder. The volume proportion of the diamond abrasives in the coating is 13%.

[0168] Comparative Example 2

[0169] Preparation of the dicing blade D2

[0170] S1. Cut the aluminum alloy rod, and then through rough machining and finish machining, prepare the dicing blade body.

[0171] S2. Assemble the dicing blade body with a fixture, and shield the areas that do not need electroplating on the dicing blade body with gaskets.

[0172] Degreasing: Place the alkaline solution in the cleaning chamber of the ultrasonic cleaning machine, and put the dicing blade body into the alkaline solution for cleaning for 15 min; wherein, the alkaline solution is a mixture of sodium hydroxide, sodium carbonate and calcium hydroxide in a weight ratio of 3:25:40.

[0173] Pickling and activation: Take out the dicing blade body obtained from the degreasing step, wash it with clean water 3 - 5 times, then wash it with distilled water 1 - 3 times, then put the substrate 10 into the pickling solution for stirring pickling for 25 s, and then put it into the activation solution for stirring activation for 7 min. Among them, the pickling and activation solution is a mixture of sulfuric acid (concentration above 90%), potassium fluoride and plasma water in a weight ratio of 100:0.4:100. The activation solution is composed of AgNO 3 solution (concentration 20 g / L) and NH 3 ·H 2 O solution (concentration 200 g / L) in a volume ratio of 1:0.3.

[0174] S3. Place the dicing blade body obtained from step S2 in the electroplating solution for electroplating to form a coating on the plane of the dicing blade body.

[0175] Take the dicing blade body obtained from step S2 as the cathode, put it into the electroplating bath loaded with the electroplating solution, use a nickel plate as the anode, and electroplate for 100 min at a temperature of 50 °C and a current density of 2.3 A / dm 2 .

[0176] The electroplating solution includes nickel sulfamate, nickel chloride, boric acid, and diamond abrasive. The diamond abrasive is diamond micropowder with a particle size of 5000 mesh. The total concentration of nickel sulfamate and nickel chloride is 350 g / L. The mass ratio of nickel chloride to nickel sulfamate is 1:3. The concentration of boric acid is 25 g / L. The pH value of the electroplating solution is 4.5. The content of diamond micropowder is 1.3 g / L.

[0177] S4. Grind, edge, alkali-etch, and chemically polish the dicing blade body obtained in step S3 to obtain a dicing blade D2.

[0178] The dicing blade D2 includes a main blade body and a coating plated on the surface of the main blade body. The part of the coating extending beyond the main blade body is the cutting edge. The length of the cutting edge is 380 - 510 μm. The thickness of the coating is 14 - 18 μm. The length-to-thickness ratio of the cutting edge is (21 - 36):1. The material of the main blade body is aluminum alloy. The coating is composed of an electroplated nickel binder and diamond abrasive. The diamond abrasive is diamond micropowder with a particle size of 5000 mesh. The volume proportion of the diamond abrasive in the coating is 13%.

[0179] Test Example

[0180] The hub-type dicing blades 100 prepared in Examples 1 - 3 were respectively installed on a dicing machine 300 with internal shaft water cooling and cleaning (as Figure 7 shown) to cut the wafers shown in Table 1. A DAF film with a thickness of 40 μm was attached to the bottom of the wafers;

[0181] The dicing blades 400 prepared in Comparative Examples 1 - 2 were respectively installed on a dicing machine 300 with internal shaft water cooling and cleaning (as Figure 8 shown, and no cooling water passed through the main shaft during cutting) to cut the wafers shown in Table 1. A DAF film with a thickness of 40 μm was attached to the bottom of the wafers.

[0182] Record the cutting conditions and cutting results in Table 1.

[0183] Table 1 Summary of cutting results of dicing blades in Examples 1 - 3 and Comparative Examples 1 - 2

[0184]

[0185]

[0186] As can be seen from Table 1, the hub-type dicing blades 100 prepared in Examples 1-3 have excellent side chipping and back chipping effects in the cutting test, and the chipping sizes are all within 10 μm. The side chipping and back chipping effects of Comparative Example 1 are worse than those of Examples 1-3. The reason for this phenomenon is that there is no coolant in Comparative Example 1 to cool the dicing blade and flush the cutting edge, and it is easily affected by the FDA film fragments during the cutting process, reducing the self-sharpening of the dicing blade. The side chipping and back chipping effects of Comparative Example 2 are worse than those of Comparative Example 1. The reason for this phenomenon is that the dicing blade in Comparative Example 2 was not pre-plated before electroplating, resulting in an insecure connection between the coating and the main blade body. During the cutting process, the coating peeled off or deformed locally, causing a change in the shape of the cutting edge of the dicing blade. In summary, the hub-type dicing blade 100 of the present invention has a good cutting effect and can effectively reduce the risks of wafer back chipping, back cracking and side chipping.

[0187] The technical features of the above-described embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope described in this specification.

[0188] The above-described embodiments only represent several implementation manners of the present invention, and the description thereof is relatively specific and detailed, but it should not be construed as a limitation on the scope of the invention patent. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present invention, several deformations and improvements can still be made, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the invention patent should be subject to the appended claims.

Claims

1. A hub-type dicing knife, characterized in that: The invention comprises a substrate and a composite coating plated on the surface of the substrate, wherein a cooling channel is arranged in the substrate, two liquid inlet holes are correspondingly arranged on the inner side of the substrate, and a plurality of liquid outlet holes are circumferentially arranged on the outer side of the substrate, wherein the liquid inlet holes and the liquid outlet holes are both connected with the cooling channel, and the cross section of the substrate gradually expands outward along the direction of the substrate toward the composite coating, thereby forming an inclined surface on one side surface of the substrate, and a plane is arranged on the side of the substrate away from the inclined surface, and the composite coating is arranged on the plane, and the part of the composite coating extending out of the substrate is a blade.

2. The hub-type dicing knife according to claim 1, characterized in that: The ratio of the diameter of the liquid inlet hole to the diameter of the liquid outlet hole is 2-3:

1.

3. The hub-type dicing knife according to claim 1, characterized in that: The base includes a mounting body and a tool body connected to the mounting body, the mounting body is provided with an upper cooling groove and an upper liquid inlet groove, the tool body is provided with a lower cooling groove and a lower liquid inlet groove, the cooling channel is provided between the upper cooling groove and the lower cooling groove, and the liquid inlet hole is provided between the upper liquid inlet groove and the lower liquid inlet groove.

4. The hub-type dicing knife according to claim 3, characterized in that: The inclined surface is arranged on one side surface of the knife body, and the plane is arranged on a side of the knife body away from the inclined surface.

5. The hub-type dicing knife according to claim 4, characterized in that: The base body is provided with a mounting groove for connecting with a dicing machine in the axial direction, and the mounting groove passes through the base body.

6. The hub-type dicing knife according to claim 1, characterized in that: The composite plating layer is composed of an electroplated nickel binder and diamond abrasives.

7. A method for preparing a hub-type dicing knife as claimed in any one of claims 1 to 6, characterized in that: The following steps are involved: S1. Cut the aluminum alloy rod into pieces, and then perform rough machining and fine machining to prepare the mounting body blank and the cutter body blank; S2. Processing an upper cooling groove and an upper liquid inlet groove on the mounting body blank, and processing a lower cooling groove and a lower liquid inlet groove on the cutter body blank by a CNC machine tool; S3, welding the installation body blank and the blade body blank obtained in step S2 by a laser welding machine to obtain a dicing blade blank; S4, machining a liquid outlet hole and a mounting groove on a dicing blade blank by a CNC machine tool to obtain a substrate; S5, placing the substrate after step S4 in a pre-plating solution for pre-plating, and forming a pre-plating layer on the plane of the substrate; S6, placing the substrate obtained in step S5 in an electroplating solution for electroplating to form a composite coating on the plane of the substrate; S7, grinding, sharpening, alkaline etching, and chemical polishing are performed on the substrate obtained in step S6 to obtain a hub-type dicing knife.

8. The method for preparing a hub-type dicing knife according to claim 7, characterized in that: Before S5, the substrate needs to be pretreated, and the pretreatment method includes degreasing and pickling activation.

9. The method for preparing a hub-type dicing knife according to claim 7, characterized in that: The pre-plating solution comprises nickel sulfate, sodium hypophosphite, sodium acetate, hydrofluoric acid and thiourea.

10. The method for preparing a hub-type dicing knife according to claim 7, characterized in that: The electroplating solution comprises nickel sulfamate, nickel chloride, boric acid and diamond abrasive, and the diamond abrasive is 5000 mesh diamond micro powder.

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