Lamination molding system and lamination molding method

Abstract

The invention provides a lamination forming system and a lamination forming method, which can well perform lamination forming of a lamination forming product. A lamination molding system (1) is provided with a vacuum lamination device (12) and press devices (13, 14). The present invention is provided with: a vacuum lamination device (12) that performs lamination molding in a chamber (C) in a vacuum state; and at least two continuous first press devices (13) and second press devices (14) that are provided in a subsequent process of the vacuum lamination device (12) and that have position control elements, said first press devices (13) and second press devices (14) each having a servo motor (315) as a drive source, and said second press devices (14) each having a servo motor (415) as a drive source.

Description

[0001] This application is a divisional application; the application number of its parent application is "2021114679554", the application date is December 3, 2021, and the invention title is "Laminating Forming System and Laminating Forming Method". Technical Field

[0002] The present invention relates to a laminating forming system including a vacuum laminating device and a stamping device, and a laminating forming method using the vacuum laminating device and the stamping device. Background Art

[0003] As a laminating forming system including a vacuum laminating device and a stamping device, there are structures with one stamping device and structures with two stamping devices in the subsequent process of the vacuum laminating device. The content described in Patent Document 1 is known as a structure with one stamping device in the subsequent process of the vacuum laminating device. The flattening stamping device arranged in the subsequent process of the vacuum laminating device in Patent Document 1 is equipped with a limit switch and detects the clamping of the intermediate laminated product. In addition, the content described in Patent Documents 2 and 3 is known as a structure with two stamping devices arranged in the subsequent process of the vacuum laminating device. In particular, Patent Document 3 describes that at least one of a pair of metal plates can advance and retreat relative to the other by the operation of a servo motor in the second plane stamping mechanism 3. And it is described that: the rotation speed of the servo motor 53 is controlled by a servo amplifier (not shown) based on an instruction signal from a programmable logic controller (PLC) and the feedback distance information between the pressure blocks 46 and 47.

[0004] Prior Art Documents

[0005] Patent Document 1: Japanese Patent Application Laid-Open No. 2005-66967

[0006] Patent Document 2: Japanese Patent Application Laid-Open No. 2002-120100

[0007] Patent Document 3: Japanese Patent Application Laid-Open No. 2020-28980

[0008] However, regarding the above Patent Document 3, there are cases where the following problems occur because only the second plane stamping mechanism 3 pushes the laminated formed product based on the distance information. That is, in the first plane stamping mechanism, since the laminated formed product is only pushed with a predetermined pressure, there will be uneven thickness in the laminated formed product conveyed from the first plane stamping mechanism to the second plane stamping mechanism. Therefore, in some of the laminated formed products, even if the second plane stamping mechanism pushes at a desired distance, there will still be uneven thickness left in the final formed product, and as a result of pushing in a way that barely reaches the desired distance, a pressure above the imaginary pressure will occur, resulting in problems such as melting of the laminated (resin) film and flowing out to the side of the laminated formed product.

[0009] In addition, when a hydraulic cylinder controlled by a general pressure control valve is used in the first planar stamping mechanism, there is a problem of poor pressure control responsiveness in the stamping process. Other problems and new features will be clear from the description of this specification and the drawings. Summary of the Invention

[0010] In a lamination forming system including a vacuum lamination device and a stamping device, the vacuum lamination device that performs lamination forming in a vacuum chamber and at least two consecutive stamping devices provided in a subsequent process of the vacuum lamination device each include a position control element.

[0011] The effects of the present invention are as follows.

[0012] According to the above-described embodiment, for example, when applied to a lamination forming system or the like, a lamination forming system capable of favorably performing lamination forming of a lamination formed product can be provided. Brief Description of the Drawings

[0013] Figure 1 It is a schematic explanatory view of a lamination forming system according to a first embodiment.

[0014] Figure 2 It is a block diagram showing control of a first stamping device and a second stamping device according to a first embodiment.

[0015] Figure 3 It is an explanatory view showing pressure forming of a first stamping process performed by the first stamping device according to a first embodiment.

[0016] Figure 4 It is an explanatory view showing pressure forming of a second stamping process performed by the second stamping device according to a first embodiment.

[0017] Figure 5 It is a schematic explanatory view of a lamination forming system according to a second embodiment.

[0018] Figure 6 It is a schematic explanatory view of a lamination forming system according to a third embodiment.

[0019] In the figure: 1, 2, 3 - Laminating forming systems; 12, 22, 32 - Vacuum laminating devices; 13, 23, 33 - First stamping devices; 14, 24, 34 - Second stamping devices; 17 - Control device; 212, 312, 412, 2312, 2412 - Upper plates; 213, 314, 414, 2314, 2414 - Lower plates; 322, 323, 422, 423, 2322, 2323 - Pressing blocks; 315, 415, 3411, 3511 - Servo motors; 317, 417 - Servo amplifiers; 320, 420 - Load sensors; 321, 421, 2318, 2418 - Linear scales; A4 - Primary laminated formed product; A5 - Secondary laminated formed product; A6 - Laminated formed product. Detailed implementation mode

[0020] Regarding the laminating forming system 1 of the first implementation mode of the present invention, a part is shown in a sectional view for Figure 1 describing the vacuum laminating device 12, the first stamping device 13 and the second stamping device 14. Two stamping devices 13 and 14, namely the first stamping device 13 and the second stamping device 14, are continuously arranged in the subsequent process of the vacuum laminating device 12 in the laminating forming system 1. In addition, the laminating forming system 1 is provided with a carrier film conveying device 15 in the previous process of the vacuum laminating device 12, and a carrier film winding device 16 in the subsequent process of the second stamping device 14. Moreover, the laminating forming system 1 is provided with a control device 17. The above control device 17 is connected to the vacuum laminating device 12, the first stamping device 13, the second stamping device 14, the carrier film conveying device 15 and the carrier film winding device 16 to control the entire laminating forming system 1.

[0021] First, the carrier film conveying device 15 will be described in order from the previous process. The carrier film conveying device 15, which also serves as a conveying device and a tensioning device for the substrate A1 and the laminated film A2, includes a lower unwinding roller 511 and a driven roller 512. The lower carrier film F1 unwound from the unwinding roller 511 changes its direction to a horizontal state at the part of the driven roller 512. A placement table portion 513 for placing the substrate A1 and the laminated film A2, which are the formed materials conveyed in an overlapping manner from the previous process, is provided at the part where the lower carrier film F1 becomes horizontal. In addition, the carrier film conveying device 15 includes an upper unwinding roller 513 and a driven roller 515, and the upper carrier film F2 unwound from the unwinding roller 514 overlaps the laminated formed product A3 composed of the substrate A1 and the laminated film A2 at the part of the driven roller 515. The substrate A1 and the laminated film A2 are conveyed while being clamped by these carrier films F1 and F2. And, by performing laminated forming via the carrier films F1 and F2 in the vacuum laminating device 12, the first stamping device 13, and the second stamping device 14, it is possible to prevent the laminated film A2 from melting and adhering to the device part. In addition, the use of the carrier films F1 and F2 also has the advantage of exerting a certain buffering effect particularly when pressurizing the primary laminated formed product A4 and the secondary laminated formed product A5 in the first stamping device 13 and the second stamping device 14.

[0022] Next, the vacuum laminating device 12 arranged in the subsequent process of the carrier film conveying device 15 will be described. The vacuum laminating device 12 is a device that laminates and forms the laminated formed product A3 composed of the substrate A1 and the laminated film A2 into a primary laminated formed product A4 by pressing with a pressing body such as a diaphragm 211 in a chamber C in a vacuum state. The vacuum laminating device 12 is provided with a lower plate 213 that can be lifted and lowered by a lifting mechanism 214 relative to a fixed upper plate 212, and a chamber C can be formed inside when the lower plate 213 including the outer frame rises and abuts against the upper plate 212. The lifting mechanism 214 is composed of a hydraulic cylinder, but a motor or a cylinder can be used in the lifting mechanism 214 of the vacuum laminating device 12. When a motor is used instead of a hydraulic mechanism in the lifting mechanism 214 of the vacuum laminating device 12, the entire lamination forming system 1 is electrified correspondingly with the driving sources of the first stamping device 13 and the second stamping device 14 being motors, and the cleanliness when arranging the lamination forming system 1 in a clean room is improved. The chamber C is connected to a vacuum pump (not shown), and can suck the atmosphere in the internal space to form a vacuum state chamber C. And, in the present invention, the vacuum state means a state that has been decompressed to a predetermined value.

[0023] A hot plate 215 heated by a heater (not shown) is installed on the lower surface at the center of the upper plate 212, and an elastic thin plate 216 such as a heat-resistant rubber film (not shown) is installed on the surface of the hot plate 215. On the other hand, a hot plate 217 heated by a heater (not shown) is also installed on the upper surface at the center of the lower plate 213. In addition, a diaphragm 211 formed of a heat-resistant rubber film as a pressing body is installed on a portion around the hot plate 217 of the lower plate 213 so as to cover the upper surface of the hot plate 217. And, by supplying pressurized air to the back side of the diaphragm 211 by a compressor (not shown), the diaphragm 211 expands in the chamber C and presses the substrate A1 and the laminated film A2 between the diaphragm 211 and the hot plate 217. And, the diaphragm 211 of the vacuum laminating device 12 may be a structure that is installed on the upper plate 212 and presses the laminated formed body A3 composed of the substrate A1 and the laminated film A2 from the upper plate 212 side. In addition, the vacuum laminating device 12 may be a structure in which rubbers are pasted on the flat pressing surfaces of the upper and lower pressing blocks respectively, and either one of the pressing blocks advances toward the other pressing block to press the laminated formed body A3. In the case of a stamping device in which rubber plates are pasted on the flat pressing surfaces of the upper and lower pressing blocks respectively, the pressing mechanism may be a structure using a servo motor or the like or a structure using a hydraulic cylinder. When the stamping device performs pressing by a hydraulic cylinder, in addition to only performing pressure control, it may also be a control that performs both position control and pressure control, or a control that only performs position control. In addition, when a motor such as a servo motor is used in the stamping device, in addition to only performing pressure control, it may also perform both position control and pressure control, or only position control. When a motor such as a servo motor is used in the stamping device for position control, in addition to the rotary encoder installed on the servo motor, a position sensor separately provided on the stamping device may also be used for position control. In addition, the vacuum laminating device may be a drum-type laminator that performs laminating and forming between drums provided above and below in a chamber in a vacuum state.

[0024] Next, the first stamping device 13 disposed in series in the subsequent process of the above-described vacuum lamination device 12 will be described. The first stamping device 13 is a device that re-presses the primary laminated formed product A4 formed by laminating the laminated member A1 and the laminated film A2 having uneven portions formed by pressure forming in the vacuum lamination device 12 and having an uneven state remaining on the laminated film A2 side, and presses and forms it into a flatter secondary laminated formed product A5. The first stamping device 13 includes a substantially rectangular chassis 311 disposed below, and four tie rods 313 respectively vertically disposed between the vicinity of the four corners of a substantially rectangular fixed disk, i.e., the upper disk 312, located above the chassis 311. Further, a substantially rectangular movable disk 314 of the first stamping device 13 is vertically movable between the chassis 311 and the upper disk 312. In addition, the first stamping device 13 has a structure using a motor such as a servo motor 315 as a drive source, and the servo motor 315 of the pressing mechanism is mounted on the chassis 311.

[0025] The servo motor 315 is provided with a rotary encoder 316, and is connected to a servo amplifier 317, and the servo amplifier 317 is connected to the control device 17. A ball screw 318 is connected to the drive shaft of the servo motor 315, or the drive shaft itself is a ball screw. On the other hand, a ball screw nut 319 of the ball screw mechanism is fixed to the lower surface of the lower disk 314, and the ball screw 318 is inserted through the ball screw nut 319. Further, a load sensor 320 is mounted between the lower disk 314 and the ball screw nut 319. The portion where the load sensor 320 is mounted is not limited as long as it is a portion that bears the pressing force of the stamping process. As an example, it may be the mounting portion of the servo motor 315.

[0026] According to the above structure, the first stamping device 13 moves the lower platen 314 up and down relative to the upper platen 312 by the operation of the servo motor 315. Moreover, the ball screw mechanism of the first stamping device 13 can be a structure in which a belt is installed between the drive shaft of the servo motor 315 and the pulley of the ball screw 318, and the driving force is transmitted through the belt. Also, the ball screw mechanism of the first stamping device 13 can be a structure in which the ball screw nut 319 is rotatably mounted on the chassis 311 and the ball screw 318 moves up and down. In addition, by covering a part of the ball screw 318 with a cover, the diffusion of the grease can be prevented, which helps to improve the cleanliness in the clean room. Moreover, the first stamping device 13 can be a device using a force multiplying mechanism such as a link mechanism, a crank mechanism, a wedge mechanism, or a structure similar thereto. In addition, in the above example, the first stamping device 13 performs pressure forming by one servo motor 315, but a device that performs pressure forming using two or more servo motors 315 or two or more ball screw mechanisms is not excluded. Also, a linear motor capable of closed-loop control can be used instead of the servo motor. And the first stamping device 13 can be a device that moves the upper platen 312 up and down relative to the lower platen 314 using any one of the above mechanisms.

[0027] A linear scale 321 as a position sensor is installed between the side surface of the upper platen 312 and the side surface of the lower platen 314. The linear scale 321 has a scale 321a installed on any one of the platens, and a slider 321b as a measuring part installed on the other platen. The position (distance) of the lower platen 314 relative to the upper platen 312 can also be detected by the rotary encoder 316 of the servo motor 315. However, there is a slight gap between the ball screw 318 and the ball screw nut 319, and thermal expansion occurs in the tie rod 313 and the ball screw 318. Therefore, it is often desired to directly measure the position (distance) of the lower platen 314 relative to the upper platen 312 by the linear scale 321. As an example, the resolution of a position sensor such as the linear scale 321 is preferably a model with a resolution of 0.002 mm or less, more preferably a resolution of 0.001 mm or less and a minimum resolution unit of 0.0001 mm, 0.000025 mm, etc. that can be put into practical use.

[0028] The linear scale 321 installed in the first stamping device 13 can be just one, but one can be installed on each of the two side surfaces of the upper plate 312 and the lower plate 314 with respect to the traveling direction of the carrier films F1 and F2, for a total of 2, or two on each side surface for a total of 4. Moreover, when a total of 4 position sensors are installed on both side surfaces, the parallelism of the lower plate 314 with respect to the upper plate 312 can be detected. Alternatively, the positions where the position sensors are set can be the positions connecting the pressing blocks 322 and 323, and the positions connecting the chassis 311 and the lower plate 314. Furthermore, the first stamping device 13 generally has a safety switch that can detect the positions of limit switches or proximity switches (not shown) for the purpose that the position of the following plate 314 does not exceed the downward critical point, upward critical point, etc. in mechanical design.

[0029] Pressing blocks 322 and 323 are respectively installed on the opposing surfaces of the upper plate 312 and the lower plate 314 of the first stamping device 13 with a heat insulation plate (not shown) therebetween. Temperature control mechanisms such as cartridge heaters are provided on the pressing blocks 322 and 323. Since the structures of the pressing surfaces 327 of the pressing blocks 322 and 323 are the same, the pressing surface 327 of one pressing block 322 will be described. A buffer material 325 such as rubber, resin film, or fiber thin plate is installed on the surface of the pressing block 323. As an example, the thickness of the above buffer material 325 is 0.05 mm to 3.00 mm. And, on the surface of the above buffer material 325, a metal plate 326 made of an elastically deformable stainless steel or the like with a plate thickness of 0.2 mm to 3.00 mm is installed as an example. And, the surface on the opposite side of the surface of the above metal plate 326 that contacts the buffer material 325 is the pressing surface 327.

[0030] Moreover, the component constituting the pressing surface of the first stamping device 13 can be an elastomeric thin plate with heat resistance such as a fluororubber thin plate. In this case, the hardness (Shore A hardness) of the elastomeric thin plate is not limited to this, and as an example, a hardness of 30 to 80, and more preferably 40 to 70 can be used. In addition, the first stamping device 13 does not have a chamber that can be in a vacuum state, but can be structured to have a chamber that can be in a vacuum state and perform pressure forming in the vacuum chamber.

[0031] Next, refer to Figure 2 A control block diagram related to the pressure forming of the first stamping device 13 will be described. The first stamping device 13 is a device with a position control element. In the control device 17, a force command signal output unit 701 and a position command signal output unit 702 are provided. The force command signal output unit 701 and the position command signal output unit 702 are connected to a sequence control unit 703 as an upper-level control unit, and various forming conditions and the like are transmitted from the sequence control unit 703. In addition, the sequence control unit 703 is connected to a setting input display unit 704 and a storage unit 705.

[0032] In addition, the load sensor 320 of the first stamping device 13 is connected to the adder 706 of the control device 17. Moreover, the command signal output from the force command signal output unit 701 and the signal output from the load sensor 320 are compared and added in the adder 706. Further, the linear scale 321 is connected to the adder 707 of the control device 17. And, the command signal output from the position command signal output unit 702 and the signal output from the linear scale 321 are compared and added in the adder 707. Moreover, the signal output from at least one of the above-mentioned adders 706 and 707 is sent to the servo amplifier 317 through the force-position comparison switching unit 708 and the command signal generation unit 709. In addition, the rotary encoder 316 of the servo motor 315 is connected to the servo amplifier 317. And, the signal output from the command signal generation unit 709 and the signal output from the rotary encoder 316 are added. And, Figure 2 The control block diagram is a conceptual diagram. In fact, all functions, etc. can also be provided on the side of the first stamping device 13, and it is not limited to Figure 2 the structure.

[0033] Next, the second stamping device 14 configured in series connection in the subsequent process of the first stamping device 13 will be described. The second stamping device 14 is a device that re-presses the secondary laminated formed product A5 laminated and formed in the first stamping device 13 to form a completely flat laminated formed product A6 by pressure. The structure of the pressing mechanism and the like of the second stamping device 14 of the laminated forming system 1 of the first embodiment is substantially the same as that of the first stamping device 13.

[0034] The second stamping device 14 includes a substantially rectangular chassis 411 provided below, and four tie rods 413 vertically provided respectively between the vicinity of the four corners of an upper plate 412 as a fixed plate, which is substantially rectangular and located above the chassis 411. And, the second stamping device 14 can move the lower plate 414 as a rectangular movable plate up and down between the chassis 411 and the upper plate 412. In addition, the second stamping device 14 has a structure with a motor as the drive source, and a servo motor 415 of the pressing mechanism is installed on the chassis 411. In the first embodiment, the servo motor 415 of the second stamping device 14 can use the same model as the servo motor 315 of the first stamping device 13 in terms of rated output and the like. However, the first stamping device 13 can use a servo motor 315 with a large output. On the contrary, the second stamping device 14 can also use a servo motor 415 with a large output.

[0035] The servo motor 415 is equipped with a rotary encoder 416 and is connected to a servo amplifier 417, and the servo amplifier 417 is connected to the control device 17. A ball screw 418 is connected to the drive shaft of the servo motor 415, or the drive shaft itself is a ball screw. On the other hand, a ball screw nut 419 of the ball screw mechanism is fixed to the lower surface of the lower platen 414, and the ball screw 418 is inserted through the ball screw nut 419. Moreover, a load sensor 420 is installed between the lower platen 414 and the ball screw nut 419. Therefore, the second stamping device 14 raises and lowers the lower platen 414 by the operation of the servo motor 415. Also, the pressing mechanism of the second stamping device 14 can be changed to various styles in the same manner as the first stamping device 13. Assuming that only control including position control elements is performed in the second stamping device 14, there may be a case where the load sensor 420 is not installed. In addition, a linear scale 421 as a position sensor is installed between the side surface of the upper platen 412 and the side surface of the lower platen 414 in the second stamping device 14 in the same manner as the first stamping device 13. The performance of the linear scale 421 is the same as that of the first stamping device 13. However, in the case where it is desired to more accurately detect only the plate thickness of the final laminated molded product A6, a component with a higher resolution than the linear scale 321 of the first stamping device 13 can be used as the linear scale 421 of the second stamping device 14. When using the linear scale 321 as the position sensor, the type such as a magnetic induction type, an optical type, or a capacitance type does not need to be selected, and an ultrasonic sensor or the like can be selected.

[0036] Pressing blocks 422 and 423 are respectively installed on the opposing surfaces of the upper platen 412 and the lower platen 414 of the second stamping device 14. A temperature control mechanism such as a cartridge heater is provided in the pressing blocks 422 and 423. Since the structures of the pressing surfaces 427 of the pressing blocks 422 and 423 are the same, the pressing surface 427 of one pressing block 423 will be described. A cushioning material 425 such as rubber, resin film, or fiber board is installed on the surface of the pressing block 423. The thickness of the cushioning material 425 is, for example, from 0.02 mm to 2.00 mm.

[0037] The buffering effect of the buffering material 425 of the second stamping device 14 is the same as, preferably smaller than, that of the buffering material 325 of the first stamping device 13. Therefore, when the buffering materials 425 are of the same material, it is preferable that the buffering materials 425 of the second stamping device 14 have the same thickness or the thickness is thinner in many cases. In addition, when the buffering material 325 of the first stamping device 13 and the buffering material of the second stamping device 14 have the same thickness, it is preferable that the buffering materials 425 of the second stamping device 14 are of the same material or have a higher hardness in many cases. And, as an example, a metal plate 426 made of an elastically deformable material such as stainless steel with a plate thickness of 0.2 mm to 3.00 mm is installed on the surface of the above buffering material 325. And, the surface on the opposite side of the surface of the above metal plate 426 that contacts the buffering material 425 is the pressing surface 427. Regarding the control block diagram of the second stamping device 14, since it is substantially the same as the control block diagram of the first stamping device 13, the above description is cited.

[0038] Next, the carrier film winding device 16 provided in the subsequent process of the second stamping device 14 will be described. The carrier film winding device 16 is a device that also serves as a conveying device and a tensioning device for the carrier films F1 and F2. The carrier film winding device 16 includes a lower unwinding roller 611 and a driven roller 612, and the carrier film F1 is unwound and taken up by the above winding roller 611. In addition, the carrier film winding device 16 includes an upper winding roller 613 and a driven roller 614. The upper carrier film F2 is peeled off from the laminated molded product A6 at a part of the above driven roller 614, and the upper carrier film F2 is wound around the above upper winding roller 613. And, a take-out table portion 615 for the laminated molded product A6 is provided at a part where only the lower carrier film F1 is conveyed in a horizontal state. And, as a conveying device for the carrier films F1 and F2, a transfer device (so-called clamping type conveying device) that holds both sides of the carrier films F1 and F2 and stretches them to the subsequent process can be provided.

[0039] Next, a method for laminating the workpiece A1 and the laminating film A2 using the laminating forming system 1 of the first embodiment will be described. In the laminating forming system 1 during continuous forming, laminating forming can be performed simultaneously and in batches through the sequential control of the control device 17 in the diaphragm type vacuum laminating device 12, the first stamping device 13, and the second stamping device 14. However, here, the forming sequence of the laminated product A3 of the substrate A1 and the laminating film A2, which is the workpiece to be laminated in a batch quantity, will be described.

[0040] The stacked component A1 placed on the placement table portion 513 of the carrier film conveying device 15 is a circuit board for an uneven structure composed of convex portions having copper foil portions adhered to the surface of the substrate and concave portions without copper foil portions. The thickness of the copper foil (relative to the height of the substrate portion) is not limited to this, and is about several μm to several tens of μm, and is basically 0.1 mm or less. Layered films A2 are respectively stacked above and below the circuit board A1 to form a laminated formed product A3 for structure forming. And, Figure 1 Although one laminated formed product A3 is described, it may be a structure in which a plurality of laminated formed products A3 are placed on the placement table portion 513 at the same time for laminated forming.

[0041] And, the above-mentioned laminated formed product A3 placed on the placement table portion 513 moves together with the upper and lower carrier films F1, F2 as the winding drums 611, 613 are rotationally driven, and is conveyed and positioned into the chamber C of the vacuum laminating device 12 in an open state. Next, the vacuum laminating device 12 closes the chamber C and decompresses it by a vacuum pump (not shown) to form a vacuum state (decompression state) in the chamber C. And, pressurized air is sent to the back side of the diaphragm 211 to cause the diaphragm 211 to expand into the chamber C, and the laminated formed product A3 composed of the substrate A1 and the laminated film A2 is pressurized between the elastomeric thin plate 216 and the hot plate 215 installed on the upper plate 212 side. The pressing force generated by the diaphragm 211 at this time (the pressure applied per unit area to the laminated formed product A3) is, for example, 0.3 MPa to 1.5 MPa, and the substrate A1 and the laminated film A2 are connected in such a manner that the laminated film A2 is buried in the concave portions of the substrate A1 to form a single-layer laminated formed product A4 by laminated forming. However, the surface of the laminated film A2 of the single-layer laminated formed product A4 formed by laminated forming through the vacuum laminating device 12 still remains uneven, imitating the shape of the uneven portions of the substrate A1. In addition, at this time, when the inorganic material content rate of the laminated film used is high (for example, a laminated film with SiO 2 being 35 to 75% by weight), it is easier to leave unevenness due to the low fluidity of the molten resin.

[0042] If a single-layer laminated formed product A4 composed of the stacked component A1 and the laminated film A2 having uneven portions and pasting the two is formed by laminated forming in the vacuum laminating device 12, the chamber C is opened. And, the above-mentioned single-layer laminated formed component A4 is transported between the upper plate 312 and the lower plate 314 of the first punching device 13 in the subsequent process by the conveyance of the carrier films F1, F2 by the carrier film winding device 16, and stops at a predetermined pressing position.

[0043] Next, the servo motor 315 of the first stamping device 13 operates, and the lower platen 314 and the pressing block 323 rise to start the first stamping process. In the first stamping process, pressure control including position control elements is performed. Initially, the lower platen 314 and the pressing block 323 are moved and controlled at high speed by the servo motor 315 before reaching the speed switching position P1 shortly before the pressing surface 327 abuts against the lower carrier film F1, or before the position shortly before the upper carrier film F2 abuts against the pressing surface 327 on the side of the upper platen 412. However, if the above position is detected by the rotary encoder 16, the linear scale 321, or limit switches, proximity switches, etc., it is moved and controlled at low speed by the servo motor 315, and the situation of suddenly applying an overload can be reduced when the primary laminated product A4 is clamped between the pressing surfaces 427, 427. The situation where the primary laminated product A4 is clamped by the pressing surfaces 427, 427 can be grasped by detecting the torque of the servo motor 315 or can be inferred by reaching the preset position P2.

[0044] If the primary laminated product A4 is clamped by the pressing surfaces 427, 427, it transfers to the first pressing process PR1 in the first stamping process. In the first pressing process PR1, the value of the load sensor 320 is detected to perform feedback control by force control. The value of the force command signal is output from the force command signal output unit 701, and is added after being compared with the value of the force signal detected by the load sensor 320. And, since the first pressing process PR1 is only force control, the force-position comparison switching unit 708 passes through as it is, and is sent as a command value for speed control of the servo amplifier 317 in the command signal generation unit 709.

[0045] And, in the servo amplifier 317, the rotation speed and current value of the servo motor 315 are generated and sent to the servo motor 315. And, as described above, the control of the servo motor 315 is performed by force control, but the force can be converted into the pressure (surface pressure) applied to the unit area of the primary laminated product A4 and expressed. In the laminated forming method of the present embodiment, the above surface pressure is preferably 0.3 MPa to 1.5 MPa as an example, and in particular, it is preferably the case where the surface pressure is lower than that of the vacuum lamination device 12 in many cases. And, in the first pressing process PR1, the lower platen 314 and the pressing block 323 further rise to reach the preset position P3 (the same distance between the pressing surfaces 327, 327) and are detected by the linear scale 321, or, if a predetermined time has elapsed, then transfer to the second processing process PR2 in the first stamping process. Or, transfer to the second pressing process PR2 based on the detection value of at least one of the linear scale 321 or the rotary encoder 316.

[0046] In the second pressurizing process PR2, pressurization control for optimizing the position control element is performed. The value of the linear scale 321 is detected and feedback control for position control (or speed control) is performed toward the target position P4. The value of the command signal is output from the position command signal output unit 702, compared with the value of the position signal detected by the linear scale 321, and an addition calculation is performed. In addition, the value of the load cell 320 is always detected and sent to the force-position comparison switching unit 708 through the adder 706. And, as an example, a two-level threshold is set in the detected value of the load cell 320. When the detected value of the load cell 320 exceeds the initial threshold, a subtraction calculation is performed in the command value of the position control. In addition, when the detected value of the load cell 320 exceeds the final threshold, the command value of the command signal of the position control is used as the command value subtracted from the previous command value, or the output of the position signal command value is temporarily stopped or stopped before the second stamping process PR2 is completed.

[0047] In the second pressurizing process PR2, a command value for speed control is also sent to the servo amplifier 317 and current value control is mainly performed. Speed control using the rotary encoder 316 is performed between the servo amplifier 417 and the servo motor 415. Thus, in the second stamping process, the position of the lower platen 314 can be accurately controlled based on the value detected by the linear scale 321. And, it is controlled (including servo lock and servo off) in such a way that if the position of the lower platen 314 becomes the target position P4, the servo motor 415 maintains the current position, and the secondary laminated product A5 with the correct plate thickness T1 is pressure-formed. However, when a large position deviation occurs during position control and pressure abnormality occurs in the primary laminated product A4 being pressurized, since the command value of the position is changed to the retraction side and pressurization is aborted according to the above force detection, it is possible to prevent the occurrence of defective products such as thickness reduction due to overpressure and lateral outflow of the molten resin. And, in the above second pressurizing process PR2, it is also possible that even in the case where the position cannot finally reach the target position (command position) (the case where it cannot be pressed), as long as it is within the allowable plate thickness range.

[0048] And, if the second pressurizing process PR2 is control using the position control element, force-priority control can be performed. As an example, in the force control in which the value of the load cell 320 is detected in the same way as in the first stamping process, the feedback control of the position control can also be added at a certain ratio. Or the speed control element can be added as a pre-feedback control signal. The command value of the force signal output from the force command signal output unit 701 can also be changed corresponding to the position detected by the linear scale 321.

[0049] Moreover, each pressurizing process of the first stamping process is not limited to the above, and can also be a process with many pressurizing processes. In addition, even if the press forming using the position control element in each process is a method of using the speed control element for a part or all, it is included in the position control element in the broad sense. And the position control element including speed control can be an element that controls any one of the control of the current value, the control of the voltage value, and the torque value to control the servo motor 315. In addition, as a device corresponding to the second aspect of the present invention, the first stamping device 13 using the servo motor 315 as the drive source can be a device that only performs force control in all pressurizing processes. Even in such a case, the force control performed by the first stamping device 13 using the servo motor 315 can perform high-precision pressurization control on the primary laminated formed product compared to the pressure control of the stamping device using a hydraulic cylinder controlled by an existing general pressure control valve, and the thickness unevenness can also be reduced.

[0050] In addition, at this time, the temperatures of the pressing blocks 322 and 323 of the first stamping device 13 vary depending on the materials of the substrate A1 and the laminated film A2. Therefore, it is not limited to this, and it is preferably controlled to 80°C to 200°C, and more preferably controlled to 90°C to 150°C.

[0051] Moreover, if the second pressurizing process PR2 of the first stamping device 13 ends after a predetermined time and the secondary laminated formed product A5 is laminated and formed, the lower platen 314 descends. At this time, since the surface of the formed secondary laminated formed product A5 is press-formed by the pressing blocks 322 and 323 having an elastic metal plate 326 via a buffer material 325 on the pressing surface 327 of the first stamping device 13, the unevenness remaining on the surface of the primary laminated formed product A4 can be processed more flatly. And through the conveyance and winding of the carrier films F1 and F2 by the next unwind roller 511 and the driven roller 512 of the carrier film winding device 16, the unwind roller 414 and the driven roller 515, the winding rollers 611 and 613, the above-mentioned secondary laminated formed product A5 is conveyed between the upper platen 412 and the lower platen 414 of the second stamping device 14 in the subsequent process of the first stamping device 13 and stops at a predetermined pressurizing position.

[0052] Next, the servo motor 415 of the second stamping device 14 operates. Similar to the control of the first stamping device 13, the lower platen 414 and the pressing block 423 rise at high speed, switch to low speed at the speed switching position P11, and soon, at the contact point P12, the secondary laminated molded product A5 is clamped by the pressing surfaces 427, 427. Pressing forming including position control elements can also be performed in the second stamping device 14. In the first processing step PR11 of the second stamping device 14, control similar to that of the second processing step PR2 of the first stamping device 13 can be performed. That is, position control can be performed to detect the position of the linear scale 421 or the like and operate the servo motor 415, but restrictions are imposed on the above position command control signal (current value, etc.) in cases such as when the value of the load sensor 320 is detected and exceeds the threshold. And if it is detected that the lower platen 414 or the pressing block 423 reaches the predetermined switching position P13 or it is detected that a predetermined time has elapsed, the first pressing step PR11 ends and the process transfers to the second pressing step PR12.

[0053] In the second pressurization step PR12 of the second stamping process, only position control (or speed control) is performed to detect the position of the linear scale 421 or the like and to operate the servo motor 415. However, since the difference in the plate thickness between the secondary laminated molded product A5 press-formed by the second stamping device 14 and the plate thickness of the laminated molded product A6 as the final product is extremely small, there will be no situation where even if it is only position control, the position deviation is too large and a command signal for driving the servo motor 315 with an unexpectedly large force is sent. In addition, since the distance from the switching position P13 from the first pressurization step PR11 to the second pressurization step PR12 to the final pressurization end target position P14 becomes extremely small, there will be almost no situation where even if it is only position control, the position deviation is too large and a command signal for driving the servo motor 315 with an unexpectedly large force is sent. Therefore, the laminated molded product A6 as the final product can achieve extremely precise thickness accuracy and can prevent the outflow of the molten resin to the side of the laminated molded product A6. However, the second stamping process PR12 can also set restrictions such as the torque limit of the servo motor 415. And, it is controlled (including servo lock and servo off) in such a way that if the position of the lower platen 314 reaches the final pressurization end target position P14, the servo motor 415 maintains the current position, and the laminated molded product A6 with the correct plate thickness T2 is press-formed. When the first stamping device reaches the final pressurization end target position and the pressurization is completed, the position information of the lower platen detected by the position sensor such as the linear scale 421 is stored in the storage unit of the control device 17. In addition, in the above-described embodiment, since the position sensor is installed between the upper platen and the lower platen, the distance between the upper platen and the lower platen can be measured and stored. However, in the case where a position sensor such as a linear scale is installed between the upper pressing block and the lower pressing block, the distance between the pressing blocks is measured and stored. In addition, the distance between the fixed member such as the base side and the lower platen that moves up and down can be detected by the position sensor. These distances between the upper platen and the lower platen, between the upper pressing block and the lower pressing block, and between the fixed member such as the base side and the lower platen correspond to the plate thickness of the secondary laminated product A5.

[0054] The temperatures of the pressing blocks 422 and 423 of the second stamping device 14 during the second press-forming vary depending on the materials of the substrate A1 and the laminated film A2, and thus are not limited thereto. Preferably, the temperature is controlled to be between 80°C and 200°C, more preferably between 90°C and 150°C. It is possible and preferably the same as the temperatures of the pressing blocks 322 and 323 of the first stamping device 13, or lower than the temperatures of the pressing blocks 422 and 423 of the second stamping device 14.

[0055] If a predetermined time elapses after the second stamping device 14 reaches the final pressurization end target position P14, the lower platen 314 descends. At this time, the plate thickness T2 of the laminated molded product A6 formed becomes the correct thickness by performing second pressurization molding using position control. Also, it can be machined more flatly only when there are irregularities on the surface of the secondary laminated molded product A5. Further, by the conveyance of the next carrier films F1 and F2 by the carrier film winding device 16, the final laminated molded product A6 is transported to the take-out table portion 615 of the subsequent process of the second stamping device 14 and is transported to the next process by a device (not shown).

[0056] Moreover, the first stamping process and the second stamping process performed by the second stamping device 14 only need to include at least a position control element as in the second stamping process PR2 of the first stamping device 13. It can be a process that only performs position control (or speed control) from the start, or a process that detects force for control. In addition, regarding the position control of the second stamping device 14, the final pressurization end target position of the second stamping device can be determined based on the distance between the upper platen and the lower platen of the stamping device at the end of pressurization performed by the first stamping device, or the distance between the pressure blocks, etc. (the plate thickness of the intermediate laminated product A5). Thus, by performing position control on the second stamping device based on the plate thickness of the intermediate laminated product A5, it is possible to directly determine which thickness will make the plate thickness of the laminated molded product A6 as the final product thinner than the plate thickness of the secondary laminated molded product A5 that has completed pressurization molding by the first stamping device, and it is possible to prevent insufficient pressing or excessive pressing in the second stamping device.

[0057] In addition, the laminated molding system 1 of the first embodiment is superior in the following aspects compared with a laminated molding system of a single stamping device having a force control (or pressure control) and a position control element provided in the subsequent process of the vacuum lamination device. That is, by performing pressurization molding of the position control element separately with the continuous first stamping device 13 and the second stamping device 14, it is possible to process into a desired plate thickness in two stages. Therefore, compared with a laminated molding system that forms and processes into a desired plate thickness using a single stamping device, since pressurization molding can be performed without performing ineffective processing, it is possible to prevent the outflow of the molten resin to the side of the laminated molded product. Also, in the laminated molding of the substrate, the time required for pressurization molding by the stamping device is often longer than the time required for laminated molding by the vacuum lamination device 1. However, by having two continuous stamping devices, the time required for pressurization molding by the stamping device can be divided between the respective stamping devices 13 and 14. Therefore, it is possible to shorten the cycle time of laminated molding per batch.

[0058] In addition, the second stamping device 14 is a device corresponding to Solution 2 of the present invention, and it is also possible to perform only the force control of the servo motor 415 in all the pressing processes. Even in this case, the force control performed by the second stamping device 14 using the servo motor 415 can perform high-precision pressing control with respect to the secondary laminated product A5 compared to the pressure control of the existing stamping device using a hydraulic cylinder controlled by a general pressure control valve, and the thickness unevenness is also reduced.

[0059] Next, the laminated forming system 2 of the second embodiment will be described Figure 5 centering on the differences. The laminated forming system 2 of the second embodiment is common in terms of being provided in the subsequent process of the above-described vacuum laminating device 22 and including at least two continuously-operated stamping devices having position control elements, the method of transporting the laminated formed product, etc. In addition, the structures of the chassis 2311, the upper plate 2312, the tie rod 2313, and the lower plate 2314 of the first stamping device 23 and the second stamping device 24, and the structures of the pressing blocks 2322 and 2323 are also common. The difference between the first stamping device 13 and the second stamping device 14 of the first embodiment, and the first stamping device 23 and the second stamping device 24 of the second embodiment lies in the pressing mechanism.

[0060] In the first stamping device 23, a pressing cylinder 2315 that operates by hydraulic pressure is provided as a pressing mechanism in the chassis 2311, and the slider 2316 of the pressing cylinder 2315 is fixed to the back surface of the lower plate 2314. Further, the pressing cylinder 2315 is connected to a hydraulic device 2317 including a valve capable of closed-loop control such as a servo valve (not shown). In addition, the pressing cylinder 2315 can detect the pressure of the hydraulic oil through a pressure sensor. Further, the hydraulic device 2317 including the above-described pressure sensor is connected to the control device 17. In addition, the same linear scale 2318 is installed between the upper plate 2312 and the lower plate 2314 of the first stamping device 23. Figure 1 And the linear scale 2318 is connected to the control device 17 and can detect the distance between the upper plate 2312 and the lower plate 2314.

[0061] In addition, the structure of the second stamping device 24 is the same as that of the first stamping device 23. In the chassis 2411, a pressing cylinder 2415 that operates hydraulically is provided as a pressing mechanism. The slider 2416 of the pressing cylinder 2415 is fixed to the back surface of the lower platen 2414. Further, the pressing cylinder 2415 is connected to a hydraulic device 2417 including a valve that can be closed-loop controlled, such as a servo valve (not shown). In addition, the pressing cylinder 2415 can detect the operating pressure through a pressure sensor. Moreover, the hydraulic device 2417 including the above pressure sensor is connected to the control device 17. In addition, a linear scale 2418 identical to that of the first stamping device 23 is installed between the upper platen 2412 and the lower platen 2414 of the second stamping device 24. And the linear scale 2418 is connected to the control device 17 and can detect the distance between the upper platen 2412 and the lower platen 2414.

[0062] The primary laminated formed product A4 laminated and formed in the vacuum lamination device 22 is conveyed to the first stamping device 23 in the same manner as in the lamination forming system 1 of the first embodiment and laminated and formed into a secondary laminated formed product A5, and is conveyed to the second stamping device 24 and laminated and formed into a laminated formed product A6. Since the lamination forming methods in the first stamping device 23 and the second stamping device 24 in the lamination forming system 2 of the second embodiment are the same as those in the lamination forming system 1 of the first embodiment in most parts, the description of the above first embodiment is cited. If there are differences, in the first embodiment, the values of the load sensor 320, etc. are detected and force control is performed on the servo motor 315, while in the second embodiment, the difference lies in that the value of the pressure sensor is detected and pressure control of the pressing cylinder 2415 is performed. That is, in the case of using a servo valve, pressure closed-loop control using the value of the pressure sensor through the servo valve and position (or speed) closed-loop control using the linear scale 2418 can be performed.

[0063] In addition, as a method of mixing the lamination forming system 1 of the first embodiment and the lamination forming system 2 of the second embodiment, the present invention can use the first stamping device as a stamping device with a pressing cylinder using hydraulic pressure or the like and having a position control element, and the second stamping device as a stamping device with a motor such as a servo motor and having a position control element. Moreover, conversely, the first stamping device can be used as a stamping device with a motor such as a servo motor, and the second stamping device can be used as a pressing cylinder with a fluid such as hydraulic pressure.

[0064] Next, refer to the lamination forming system 3 of the third embodiment Figure 6The description is centered around the differences. The third embodiment is a method of a stamping device having a final process, and a stamping device that performs pressure control including at least a position control element respectively in a stamping device consecutive to the previous process of the stamping device of the above final process. Specifically, the first stamping device 33 in the subsequent process shortly after the vacuum lamination device 32 is configured is a stamping device that only performs pressure control using a pressure cylinder 3311 such as a hydraulic pressure. The first stamping device 33 may have a structure in which rubber is adhered to the flat pressure surface of the processing block. Also, the second stamping device 34 and the third stamping device 35 are stamping devices that use motors such as servo motors 3411 and 3511 and have a position control element. Therefore, for the "consecutive stamping processes in the subsequent process of the vacuum lamination device" of the present invention, it is sufficient that each stamping process performed by the stamping device is consecutive as the Nth stamping process and the (N + 1)th stamping process. Therefore, the stamping device in the process consecutive to immediately after the vacuum lamination device 32 also includes a case where pressure control including at least a position control element is not performed. In addition, for the "consecutive stamping processes", processes other than the stamping process may be inserted between the stamping processes.

[0065] Also, the pressure surface of the third stamping device 35 is provided with the same buffer material and elastic metal plate as the first stamping device 33 and the second stamping device 34. In addition, the third stamping device 35 may make the thickness of the buffer material thinner than that of the buffer material of the second stamping device 34, make the hardness of the buffer material higher than that of the second stamping device 34, and reduce the buffering effect compared to the second stamping device 34. In addition, the third stamping device 35 may have a structure in which the buffer material is not provided and is mounted on a metal pressure plate or the above metal plate and the metal thin plate becomes the pressure surface. In addition, the third stamping device 35 may also be controlled such that as a cooling stamping for particularly cooling the laminated molded product, the temperature of the pressure plate of the third stamping device 35 is lower than the temperature of the pressure plate of the second stamping device 34.

[0066] Also, when the third stamping device 35 is a cooling stamping and it is sufficient that the pressure surfaces slightly abut against the laminated molded product A6, there may be a case where the third stamping device 35 does not require a position control element. At this time, at least control using a position control element is performed for the first stamping process performed only by the first stamping device 33 shortly after the vacuum lamination device 32 and the second stamping process performed by the second stamping device 34 configured consecutively to the first stamping device 33.

[0067] The present invention will not be listed one by one and is not limited to the above-described first and second embodiments. Modes in which those skilled in the art make changes based on the gist of the present invention and modes in which the respective descriptions of the first to third embodiments are combined are also applicable. The laminated formed articles laminated in the lamination forming systems 1, 2, and 3 may be semiconductor wafers, other plate-like bodies in addition to circuit boards, but are not limited thereto. In addition, the surface of the laminated material such as a laminated film may be either one side or both sides of the substrate or wafer. It may also be an LED substrate or the like. According to the present invention, even when the height of the chips (protrusions) on the substrate is 0.1 mm or more and the thickness of the laminated resin film is 0.15 mm or more, good lamination forming can often be performed.

Claims

1. A laminated forming system includes a vacuum lamination device and a stamping device. The laminated forming system is characterized by comprising: A vacuum lamination device for performing laminated forming in a chamber under a vacuum state; and A first stamping device and a second stamping device which are arranged in the subsequent process of the above-mentioned vacuum lamination device and use a servo motor as a driving source. On the above-mentioned first stamping device and second stamping device, in addition to the rotary encoder provided in the servo motor, a position sensor is further provided for connecting any one of between the upper platen and the lower platen, between the lower platen and the bottom platen, and between the pressing blocks respectively installed on the above-mentioned upper platen and lower platen, and detecting the distance between the two.

2. The laminated forming system according to claim 1, Characterized in that A load sensor for force control is provided on the above-mentioned first stamping device.

3. A laminated forming method uses a vacuum lamination device and a stamping device. The laminated forming method is characterized by Comprising a vacuum lamination device for performing laminated forming in a chamber under a vacuum state, and a first stamping device and a second stamping device which are arranged in the subsequent process of the above-mentioned vacuum lamination device and use a servo motor as a driving source. A load sensor for force control is provided on the above-mentioned first stamping device. At least pressure control including force control is performed in the above-mentioned first stamping device.

4. The laminated forming method according to claim 3, Characterized in that On the above-mentioned first stamping device and second stamping device, in addition to the rotary encoder provided in the servo motor, a position sensor is further provided for connecting any one of between the upper platen and the lower platen, between the lower platen and the bottom platen, and between the pressing blocks respectively installed on the above-mentioned upper platen and lower platen, and detecting the distance between the two. In the above-mentioned first stamping device and second stamping device, the above-mentioned distance is measured by the above-mentioned position sensor and controlled.

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