Automatic error compensation system and implementation method thereof

Abstract

The invention relates to the technical field of electric digital data processing, and discloses an automatic error compensation system and an implementation method thereof.The implementation method comprises the steps that the mold deformation amount of a mold packaging technology in the current stage is analyzed through mold temperature, mold pressure and cooling time, and the residual deformation amount of the mold packaging technology in the previous stage is analyzed through mold thermal stress; whether a packaging error exists in the mold packaging process or not is judged through the mold deformation amount and the residual deformation amount; extracting a total packaging error of the mold packaging process, and querying an error compensation device of the mold packaging process; identifying a current error parameter of the error compensation device, constructing a collaborative optimization model between the total packaging error and an error compensation amount of the current error parameter, and performing parameter collaborative optimization on the error compensation amount in the collaborative optimization model to obtain a collaborative optimization amount; and performing device parameter compensation on the error compensation device according to the current error parameter and the collaborative optimization quantity. According to the invention, the consideration of parameter compensation inside the device during mold shaping can be increased.

Description

Technical Field

[0001] The present invention relates to an automatic error compensation system and an implementation method thereof, belonging to the technical field of electronic digital data processing. Background Art

[0002] Automatic error compensation refers to the process of detecting whether there is deformation of the material encapsulated in the mold when filling the molten material into the mold for encapsulation, and compensating for the error of the material deformation.

[0003] Existing error compensation mainly focuses on the error of the dimensions on the surface of the mold material. For example, the application case with the publication number CN119472501A involves an error analysis and intelligent compensation method for mold fitting parts, including the following processes: S100: Obtain the detection results of each detection point from the component detection report; S200: Map the detection results of different fittings to the same reference coordinate system; S300: Analyze the machining deviation distribution of the detection points on the mating surface of the fitting; S400: Develop a machining compensation strategy according to the machining deviation distribution. This solution mainly detects the machining deviations existing in the mold fittings and compensates for the detected machining deviations, without involving the deviation compensation of the internal parameters of the device during the machining process. For example, if the measured machining deviation of the mold fitting is 1 mm, then 1 mm is used as the compensation amount, and the compensation amount that should be adjusted inside the device involved in the machining is not given. Therefore, the existing technology lacks consideration for the parameter compensation inside the device during mold shaping. Summary of the Invention

[0004] The present invention provides an automatic error compensation system and an implementation method thereof, and its main purpose is to increase the consideration for the parameter compensation inside the device during mold shaping.

[0005] To achieve the above object, an automatic error compensation system provided by the present invention is characterized in that the system includes: a parameter detection module, an error judgment module, a device query module, a parameter optimization module, and an error compensation module;

[0006] The parameter detection module is used to obtain an error source detection tool for the mold encapsulation process, and use the error source detection tool to detect the mold temperature, mold thermal stress, mold pressure, and cooling time in the mold encapsulation process, wherein the error source detection tool includes an infrared thermal imager, a thermal stress sensor, a pressure sensor, and a timer;

[0007] The error judgment module is used to analyze the mold deformation amount in the current stage of the mold encapsulation process by using the mold temperature, the mold pressure, and the cooling time, analyze the residual deformation amount in the previous stage of the mold encapsulation process by using the mold thermal stress, and judge whether there is an encapsulation error in the mold encapsulation process through the mold deformation amount and the residual deformation amount;

[0008] A device query module, configured to extract the total packaging error of the mold packaging process and query the error compensation device for the mold packaging process when there is a packaging error in the mold packaging process, wherein the error compensation device includes a temperature compensation device, a thermal stress compensation device, a pressure compensation device, and a time compensation device;

[0009] A parameter optimization module, configured to identify the current error parameters of the error compensation device, construct a collaborative optimization model between the total packaging error and the error compensation amount of the current error parameters, and perform parameter collaborative optimization on the error compensation amount in the collaborative optimization model to obtain a collaborative optimization amount;

[0010] An error compensation module, configured to perform device parameter compensation on the error compensation device according to the current error parameters and the collaborative optimization amount, so as to complete the packaging error compensation of the mold packaging process and obtain an error compensation result.

[0011] Optionally, the detecting the mold temperature, mold thermal stress, mold pressure, and cooling time in the mold packaging process by using the error source detection tool includes:

[0012] Obtaining an infrared thermal imager, a thermal stress sensor, a pressure sensor, and a timer in the error source detection tool;

[0013] Using the infrared thermal imager to scan the surface temperature of the mold in the mold packaging process to obtain a temperature distribution map, and using the temperature distribution map as the mold temperature;

[0014] Using the thermal stress sensor to measure the mold thermal stress in the mold packaging process;

[0015] Real-time monitoring of the pressure change in the mold packaging process through the pressure sensor to obtain the mold pressure;

[0016] Measuring the cooling time in the mold packaging process through the timer.

[0017] Optionally, the analyzing the mold deformation amount of the mold packaging process in the current stage by using the mold temperature, the mold pressure, and the cooling time includes:

[0018] Based on the mold pressure, calculating the pressure deformation amount of the mold packaging process in the current stage by using the following formula:

[0019]

[0020] Wherein, represents the pressure deformation amount, represents the mold pressure, represents the elastic modulus of the mold material related to temperature, represents the Poisson's ratio of the mold material related to temperature, represents the time variable, represents the holding pressure duration;

[0021] Based on the mold temperature and the cooling time, calculate the thermal deformation amount of the mold encapsulation process at the current stage using the following formula:

[0022]

[0023] where, represents the thermal deformation amount, represents the temperature-dependent coefficient of thermal expansion, represents the cooling time, represents the coordinate point on the surface of the mold material during cooling as , at the time of instantaneous temperature, represents the time variable;

[0024] Take the sum between the pressure deformation amount and the thermal deformation amount as the mold deformation amount.

[0025] Optionally, the use of the mold thermal stress to analyze the residual deformation amount of the mold encapsulation process in the previous stage includes:

[0026] Obtain the mold thermal strain at the start of the current stage;

[0027] According to the mold thermal stress and the mold thermal strain, calculate the residual deformation amount of the mold encapsulation process in the previous stage using the following formula:

[0028]

[0029] where, represents the residual deformation amount, represents the mold thermal stress at the end of the previous stage, represents the mold thermal strain at the start of the current stage, represents the stress relaxation coefficient of the mold, represents the mold volume at the end of the previous stage.

[0030] Optionally, the determination of whether there is an encapsulation error in the mold encapsulation process by the mold deformation amount and the residual deformation amount includes:

[0031] Obtain the pressure deformation amount and the thermal deformation amount corresponding to the mold deformation amount;

[0032] Determine whether there is a target deformation amount exceeding the error threshold among the pressure deformation amount, the thermal deformation amount, and the residual deformation amount;

[0033] When there is a target deformation amount exceeding the error threshold among the pressure deformation amount, the thermal deformation amount, and the residual deformation amount, it is determined that there is a packaging error in the mold packaging process;

[0034] When there is no target deformation amount exceeding the error threshold among the pressure deformation amount, the thermal deformation amount, and the residual deformation amount, it is determined that there is no packaging error in the mold packaging process.

[0035] Optionally, constructing the collaborative optimization model between the total packaging error and the error compensation amount of the current error parameter includes:

[0036] Constructing an objective function between the total packaging error and the error compensation amount of the current error parameter;

[0037] Setting the constraint conditions of the objective function;

[0038] Using the objective function and the constraint conditions to determine the collaborative optimization model.

[0039] Optionally, constructing the objective function between the total packaging error and the error compensation amount of the current error parameter includes:

[0040] Constructing an equivalent error model between the total packaging error and the error compensation amount;

[0041] According to the equivalent error model, constructing an objective function between the total packaging error and the error compensation amount of the current error parameter.

[0042] Optionally, performing parameter collaborative optimization on the error compensation amount in the collaborative optimization model to obtain a collaborative optimization amount includes:

[0043] According to the constraint conditions in the collaborative optimization model, using the preset quadratic programming method to solve the objective function in the collaborative optimization model to obtain a solution control sequence;

[0044] Taking the solution control sequence as the collaborative optimization amount.

[0045] Optionally, compensating the device parameters of the error compensation device according to the current error parameter and the collaborative optimization amount includes:

[0046] Determining the target adjustment parameter of the current error parameter through the collaborative optimization amount;

[0047] Adjust the current error parameter of the error compensation device to the target adjustment parameter to complete the process of compensating the device parameters of the error compensation device.

[0048] To achieve the above object, the present invention further provides an automatic error compensation method, characterized in that the method includes:

[0049] Obtain an error source detection tool for the die encapsulation process, and use the error source detection tool to detect the die temperature, die thermal stress, die pressure, and cooling time in the die encapsulation process, wherein the error source detection tool includes an infrared thermal imager, a thermal stress sensor, a pressure sensor, and a timer;

[0050] Analyze the die deformation amount in the current stage of the die encapsulation process using the die temperature, the die pressure, and the cooling time, analyze the residual deformation amount in the previous stage of the die encapsulation process using the die thermal stress, and determine whether there is an encapsulation error in the die encapsulation process based on the die deformation amount and the residual deformation amount;

[0051] When there is an encapsulation error in the die encapsulation process, extract the total encapsulation error of the die encapsulation process, and query the error compensation device for the die encapsulation process, wherein the error compensation device includes a temperature compensation device, a thermal stress compensation device, a pressure compensation device, and a time compensation device;

[0052] Identify the current error parameter of the error compensation device, construct a collaborative optimization model between the total encapsulation error and the error compensation amount of the current error parameter, and perform parameter collaborative optimization on the error compensation amount in the collaborative optimization model to obtain a collaborative optimization amount;

[0053] Perform device parameter compensation on the error compensation device according to the current error parameter and the collaborative optimization amount to complete the encapsulation error compensation of the die encapsulation process and obtain an error compensation result.

[0054] Compared with the problems described in the background art, in the embodiments of the present invention, a die temperature, a die thermal stress, a die pressure, and a cooling time in the die encapsulation process are detected by using the error source detection tool to detect parameters affecting material deformation during the encapsulation process. Further, in the embodiments of the present invention, the residual deformation amount in the previous stage of the die encapsulation process is analyzed by using the die thermal stress to analyze the thermal strain of the thermal stress caused by the previous stage on the current stage. Further, in the embodiments of the present invention, whether there is an encapsulation error in the die encapsulation process is judged by the die deformation amount and the residual deformation amount to identify the error source. Further, in the embodiments of the present invention, a collaborative optimization model between the total encapsulation error and the error compensation amount of the current error parameter is constructed to convert the error compensation amount into the parameter compensation amounts of each error compensation device, and then the parameters of the error compensation device are error-compensated. Further, in the embodiments of the present invention, parameter collaborative optimization is performed on the error compensation amount in the collaborative optimization model to solve for the unknown quantity in the objective function, and then determine the measure that each device should adjust. Therefore, the error automatic compensation system and its implementation method provided by the embodiments of the present invention can increase the consideration of parameter compensation inside the device during die shaping. BRIEF DESCRIPTION OF THE DRAWINGS

[0055] Figure 1 It is a schematic diagram of modules of an error automatic compensation system provided by an embodiment of the present invention;

[0056] Figure 2 It is a schematic flowchart of implementing the error automatic compensation method provided by an embodiment of the present invention.

[0057] The realization, functional features, and advantages of the present invention will be further described in conjunction with the embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0058] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are some, but not all, of the embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0059] In addition, the step timings in the following method embodiments are only examples and are not strictly limited.

[0060] In fact, the server device deployed by the error automatic compensation system may consist of one or more devices. The above error automatic compensation system can be implemented as: a service instance, a virtual machine, or a hardware device. For example, the error automatic compensation system can be implemented as a service instance deployed on one or more devices in a cloud node. Simply put, the error automatic compensation system can be understood as a piece of software deployed on a cloud node, which is used to provide error automatic compensation services for each client. Alternatively, the error automatic compensation system can also be implemented as a virtual machine deployed on one or more devices in a cloud node. An application software for managing each client is installed in the virtual machine. Or, the error automatic compensation system can also be implemented as a server composed of many identical or different types of hardware devices, and one or more hardware devices are set to provide error automatic compensation services for each client.

[0061] In terms of implementation form, the error automatic compensation system and the client adapt to each other. That is, if the error automatic compensation system is an application installed on a cloud service platform, then the client is a client that establishes a communication connection with this application; or if the error automatic compensation system is implemented as a website, then the client is implemented as a web page; or if the error automatic compensation system is implemented as a cloud service platform, then the client is implemented as a small program in an instant messaging application.

[0062] Refer to Figure 1 As shown, it is a schematic diagram of the modules of the error automatic compensation system provided by an embodiment of the present invention. In this embodiment, the error automatic compensation system includes:

[0063] An error automatic compensation system 100 of the present invention can be installed in an electronic device. According to the functions achieved, the error automatic compensation system may include a parameter detection module 101, an error judgment module 102, a device query module 103, a parameter optimization module 104, and an error compensation module 105. The modules of the present invention can also be referred to as units, which refer to a series of computer program segments that can be executed by a processor of an electronic device and can complete fixed functions, and are stored in the memory of the electronic device.

[0064] In the embodiment of the present invention, the functions of each module / unit are as follows:

[0065] The parameter detection module 101 is used to obtain an error source detection tool for the mold encapsulation process, and use the error source detection tool to detect the mold temperature, mold thermal stress, mold pressure, and cooling time in the mold encapsulation process, wherein the error source detection tool includes an infrared thermal imager, a thermal stress sensor, a pressure sensor, and a timer.

[0066] In an embodiment of the present invention, the thermal stress sensor refers to a sensor for detecting the residual thermal stress in a material in the previous process stage, such as an X-ray diffractometer, and the pressure sensor refers to a sensor for detecting the change in the external pressure applied to the material in the current process stage.

[0067] Further, in an embodiment of the present invention, the error source detection tool is used to detect the mold temperature, mold thermal stress, mold pressure, and cooling time in the mold encapsulation process to detect the parameters affecting the deformation of the material during the encapsulation process.

[0068] Among them, the mold temperature refers to the temperature field distribution on the surface of the mold when the mold is in the furnace during the current stage of injection molding of the mold. Injection molding refers to the process of filling molten plastic into the mold cavity so that the plastic after cooling and hardening becomes the shape of the mold cavity. It should be noted that the current stage refers to the stage of injecting the molten plastic of the current Batch B into the mold cavity, maintaining the pressure from the holding pressure to the mold filling port to prevent the molten plastic from flowing back, putting the mold containing the molten plastic into the temperature control furnace, taking the mold out of the high-temperature furnace and cooling and hardening. The previous stage refers to the stage of injecting the molten plastic of the previous Batch A before Batch B into the mold cavity until cooling and hardening. That is to say, after the molten plastic of Batch A is molded in the mold cavity, when the molten plastic of Batch B is molded next, the molten plastic of Batch B will be affected by the residual thermal stress of the molten plastic of Batch A remaining in the mold cavity. This residual thermal stress is caused by the residual temperature. Then the mold thermal stress refers to the residual thermal stress in the previous stage, the mold pressure refers to the holding pressure to prevent the molten plastic from flowing back when the molten plastic is filled into the mold cavity, and the cooling time refers to the time from maintaining the pressure from the holding pressure to the mold filling port until the partial molten plastic at the mold filling port hardens and then ending the holding pressure to wait for the molten plastic to harden.

[0069] In an embodiment of the present invention, the use of the error source detection tool to detect the mold temperature, mold thermal stress, mold pressure, and cooling time in the mold encapsulation process includes: obtaining the infrared thermal imager, thermal stress sensor, pressure sensor, and timer in the error source detection tool; using the infrared thermal imager to scan the surface temperature of the mold in the mold encapsulation process to obtain a temperature distribution map, and using the temperature distribution map as the mold temperature; using the thermal stress sensor to measure the mold thermal stress in the mold encapsulation process; monitoring the pressure change in the mold encapsulation process in real time through the pressure sensor to obtain the mold pressure; and measuring the cooling time in the mold encapsulation process through the timer.

[0070] The error judgment module 102 is configured to analyze the die deformation amount of the die encapsulation process at the current stage by using the die temperature, the die pressure, and the cooling time, analyze the residual deformation amount of the die encapsulation process in the previous stage by using the die thermal stress, and judge whether there is an encapsulation error in the die encapsulation process based on the die deformation amount and the residual deformation amount.

[0071] In an embodiment of the present invention, the die deformation amount of the die encapsulation process at the current stage is analyzed by using the die temperature, the die pressure, and the cooling time, so as to analyze the influence of temperature, pressure, and cooling time on the material deformation within the current stage.

[0072] In an embodiment of the present invention, the analysis of the die deformation amount of the die encapsulation process at the current stage by using the die temperature, the die pressure, and the cooling time includes: based on the die pressure, calculating the pressure deformation amount of the die encapsulation process at the current stage by using the following formula:

[0073]

[0074] where represents the pressure deformation amount, represents the die pressure, represents the elastic modulus of the die material related to temperature, represents the Poisson's ratio of the die material related to temperature, represents the time variable, represents the holding pressure duration;

[0075] Based on the die temperature and the cooling time, calculating the thermal deformation amount of the die encapsulation process at the current stage by using the following formula:

[0076]

[0077] where represents the thermal deformation amount, represents the temperature-dependent coefficient of thermal expansion, represents the cooling time, represents the instantaneous temperature of the coordinate point on the surface of the die material during the cooling process at and time is represents the time variable;

[0078] The sum of the pressure deformation amount and the thermal deformation amount is used as the die deformation amount.

[0079] Wherein, the die material refers to the molten plastic filled into the die.

[0080] Further, in the embodiment of the present invention, the residual deformation amount of the mold encapsulation process in the previous stage is analyzed by using the mold thermal stress to analyze the thermal strain of the thermal stress caused by the previous stage on the current stage.

[0081] In an embodiment of the present invention, the analyzing the residual deformation amount of the mold encapsulation process in the previous stage by using the mold thermal stress includes: obtaining the mold thermal strain at the start of the current stage; calculating the residual deformation amount of the mold encapsulation process in the previous stage according to the mold thermal stress and the mold thermal strain by using the following formula:

[0082]

[0083] Wherein, represents the residual deformation amount, represents the mold thermal stress at the end of the previous stage, represents the mold thermal strain at the start of the current stage, represents the stress relaxation coefficient of the mold, represents the mold volume at the end of the previous stage.

[0084] Wherein, the mold thermal strain refers to the thermal strain at the initial stage when the molten plastic is just filled into the mold.

[0085] Further, in the embodiment of the present invention, whether there is an encapsulation error in the mold encapsulation process is judged by the mold deformation amount and the residual deformation amount to identify the error source.

[0086] In an embodiment of the present invention, the judging whether there is an encapsulation error in the mold encapsulation process by the mold deformation amount and the residual deformation amount includes: obtaining the pressure deformation amount and the thermal deformation amount corresponding to the mold deformation amount; judging whether there is a target deformation amount exceeding the error threshold among the pressure deformation amount, the thermal deformation amount and the residual deformation amount; when there is a target deformation amount exceeding the error threshold among the pressure deformation amount, the thermal deformation amount and the residual deformation amount, determining that there is an encapsulation error in the mold encapsulation process; when there is no target deformation amount exceeding the error threshold among the pressure deformation amount, the thermal deformation amount and the residual deformation amount, determining that there is no encapsulation error in the mold encapsulation process.

[0087] Wherein, the error threshold refers to the threshold set according to different application scenarios, including the threshold of the pressure deformation amount, the threshold of the thermal deformation amount and the threshold of the residual deformation amount, and the target deformation amount refers to all the deformation amounts exceeding the error threshold among the pressure deformation amount, the thermal deformation amount and the residual deformation amount.

[0088] The device query module 103 is configured to extract the total encapsulation error of the mold encapsulation process and query the error compensation device of the mold encapsulation process when there is an encapsulation error in the mold encapsulation process. The error compensation device includes a temperature compensation device, a thermal stress compensation device, a pressure compensation device, and a time compensation device.

[0089] In an embodiment of the present invention, the total encapsulation error refers to the sum of all target deformation amounts. Here, it is default that the target deformation amounts include the pressure deformation amount, the thermal deformation amount, and the residual deformation amount. When constructing a collaborative optimization model later, the pressure deformation amount, the thermal deformation amount, and the residual deformation amount are all taken into account, that is, it is considered that the mold temperature, the mold pressure, the cooling time, and the mold thermal stress are all error sources. If it is judged in the actual scenario that not all of the pressure deformation amount, the thermal deformation amount, and the residual deformation amount are target deformation amounts, then some relevant contents of the mold temperature, the mold pressure, the cooling time, and the mold thermal stress can be removed from the collaborative optimization model.

[0090] Further, in an embodiment of the present invention, the temperature compensation device refers to a device for controlling the temperature of the mold, and the thermal stress compensation device refers to a device that converts thermal stress into a temperature change and then controls the temperature of the mold based on the temperature change. The algorithm for converting thermal stress into a temperature change is: , where represents the thermal stress compensation amount, represents the elastic modulus, represents the coefficient of thermal expansion, represents the temperature compensation amount. The pressure compensation device refers to a device for controlling the magnitude of the holding pressure, and the time compensation device refers to a device for controlling the cooling time. For example, when a certain time length is reached, the cooling and hardening of the material in the mold is stopped.

[0091] The parameter optimization module 104 is configured to identify the current error parameters of the error compensation device, construct a collaborative optimization model between the total encapsulation error and the error compensation amount of the current error parameters, and perform parameter collaborative optimization on the error compensation amount in the collaborative optimization model to obtain a collaborative optimization amount.

[0092] In an embodiment of the present invention, the current error parameters refer to the temperature value, the pressure value, the cooling time, and the thermal stress value currently controlled by the error compensation device.

[0093] Further, in an embodiment of the present invention, by constructing a collaborative optimization model between the total encapsulation error and the error compensation amount of the current error parameters, the error compensation amount is converted into the parameter compensation amounts of each error compensation device, and then the parameters of the error compensation device are error-compensated.

[0094] In one embodiment of the present invention, constructing the collaborative optimization model between the total packaging error and the error compensation amount of the current error parameter includes: constructing an objective function between the total packaging error and the error compensation amount of the current error parameter; setting the constraint conditions of the objective function in the following manner:

[0095]

[0096] Wherein, represents the constraint condition, represents the temperature range that the temperature compensation device can set, represents the initial mold temperature, represents the initial mold thermal stress, represents the initial mold pressure, represents the initial cooling time, represents the thermal stress range that the thermal stress compensation device can set, represents the pressure range that the pressure compensation device can set, represents the cooling time range that the time compensation device can set, represents the temperature compensation amount in the error compensation amount, represents the thermal stress compensation amount in the error compensation amount, represents the pressure compensation amount in the error compensation amount, represents the cooling time compensation amount in the error compensation amount;

[0097] Determine the collaborative optimization model using the objective function and the constraint conditions.

[0098] Wherein, the collaborative optimization model is composed of the objective function and the constraint conditions.

[0099] In another embodiment of the present invention, constructing the objective function between the total packaging error and the error compensation amount of the current error parameter includes: constructing an equivalent error model between the total packaging error and the error compensation amount using the following formula:

[0100]

[0101] Wherein, represents the equivalent error model, represents the current total packaging error, represents the temperature compensation amount in the error compensation amount, represents the thermal stress compensation amount in the error compensation amount, represents the pressure compensation amount in the error compensation amount, represents the cooling time compensation amount in the error compensation amount, represents the error constant, Indicates the amount of material deformation caused by a unit temperature change, Indicates the amount of material deformation caused by a unit thermal stress, Indicates the amount of material deformation caused by a unit pressure change, Indicates the amount of material deformation caused by a unit cooling time;

[0102] According to the equivalent error model, the objective function between the total package error and the error compensation amount of the current error parameter is constructed by using the following formula:

[0103]

[0104]

[0105] Wherein, Indicates the objective function, Indicates the next moment Of the total package error, Indicates the state transition matrix, Indicates the control matrix, Indicates the process noise, Indicates the planning period, Indicates the control input adjustment amount, Indicates the weight matrix, Indicates the time index within the planning period, Indicates the Package error at the k-th moment, Indicates the Control input adjustment amount at the k-th moment.

[0106] Wherein, the planning period refers to the duration of the next parameter that the error compensation device needs to output. For example, the duration is 10 seconds. The first error compensation amount is adjusted at the 1st second, and the 10th error compensation amount is adjusted at the 10th second. It should be noted that the Corresponding k-th moment does not represent Simultaneous execution, but the adjustment steps of the value parameters are the same. For example All correspond to the time from 1 second to 5 seconds, and are adjusted in 5 seconds for Adjustment, Is also the same as Similarly, since temperature control and cooling time are only carried out after the residual thermal stress and pressure holding steps are completed, therefore, temperature control and cooling time control are also carried out after the moments of residual thermal stress control and pressure holding control. For example, residual thermal stress control and pressure holding control are carried out at 2 pm, while temperature control and cooling time control are carried out at 2:06 pm, and residual thermal stress control and pressure holding control are carried out from 2 pm to 2:05 pm.

[0107] Further, in the embodiment of the present invention, parameter co-optimization of the error compensation amount is performed in the collaborative optimization model to solve the unknown quantity in the objective function and then determine the measure that each device should adjust.

[0108] In one embodiment of the present invention, performing parameter co-optimization of the error compensation amount in the collaborative optimization model to obtain a co-optimized amount includes: solving the objective function in the collaborative optimization model using a preset quadratic programming method according to the constraint conditions in the collaborative optimization model to obtain a solution control sequence; and using the solution control sequence as the co-optimized amount.

[0109] Among them, the quadratic programming method refers to a special type of problem, which has applications in many aspects, such as portfolio, solving constrained least squares problems, application of sequential quadratic programming in nonlinear optimization problems, etc. The quadratic programming method includes: expanding the objective function into , where represents the Hessian matrix composed of non- parameters in the objective function, represents the gradient vector matrix composed of non- parameters in the objective function, where . Therefore, after expanding the objective function into the conventional quadratic programming method format of , the QP problem solver OSQP can be used to solve to obtain the optimal solution.

[0110] The error compensation module 105 is configured to perform device parameter compensation on the error compensation device according to the current error parameter and the co-optimized amount, so as to complete the encapsulation error compensation of the mold encapsulation process and obtain an error compensation result.

[0111] In one embodiment of the present invention, performing device parameter compensation on the error compensation device according to the current error parameter and the co-optimized amount includes: determining a target adjustment parameter of the current error parameter through the co-optimized amount; and adjusting the current error parameter of the error compensation device to the target adjustment parameter to complete the process of performing device parameter compensation on the error compensation device.

[0112] Wherein, the target adjustment parameter refers to the sum of the current error parameter and the collaborative optimization quantity. For example, adding the current temperature parameter and the temperature compensation quantity to obtain the target adjustment parameter of the temperature. It should be noted that there is more than one type of collaborative optimization quantity. For example, when the aforementioned planning period is 10 seconds, if there are 10 collaborative optimization quantities in 10 seconds, after adding the first collaborative optimization quantity to the current error parameter, the second collaborative optimization quantity needs to be added continuously until the last collaborative optimization quantity, that is, adding one collaborative optimization quantity per second.

[0113] It should be noted that the process of compensating the device parameters of the error compensation device according to the current error parameter and the collaborative optimization quantity refers to reworking the material with packaging errors to the initial stage of injection molding, that is, the stage of filling the material into the mold, and re-performing the injection molding process.

[0114] Compared with the problems described in the background art, in the embodiment of the present invention, the error source detection tool is used to detect the mold temperature, mold thermal stress, mold pressure and cooling time in the mold packaging process to detect the parameters affecting the deformation of the material during the packaging process. Further, in the embodiment of the present invention, the mold thermal stress is used to analyze the residual deformation amount in the previous stage of the mold packaging process to analyze the thermal strain of the thermal stress caused by the previous stage on the current stage. Further, in the embodiment of the present invention, whether there is a packaging error in the mold packaging process is judged by the mold deformation amount and the residual deformation amount to identify the error source. Further, in the embodiment of the present invention, a collaborative optimization model between the total packaging error and the error compensation amount of the current error parameter is constructed to convert the error compensation amount into the parameter compensation amount of each error compensation device, and then the parameters of the error compensation device are compensated for errors. Further, in the embodiment of the present invention, parameter collaborative optimization is performed on the error compensation amount in the collaborative optimization model to solve the unknown quantity in the objective function, and then determine the adjustment measure that each device should make. Therefore, the error automatic compensation system and its implementation method provided by the embodiment of the present invention can increase the consideration of parameter compensation inside the device during mold shaping.

[0115] As Figure 2 shown, it is a schematic flowchart of the implementation of the error automatic compensation method provided by an embodiment of the present invention. In this embodiment, the error automatic compensation method includes:

[0116] Obtain an error source detection tool for the mold packaging process, and use the error source detection tool to detect the mold temperature, mold thermal stress, mold pressure and cooling time in the mold packaging process. Wherein, the error source detection tool includes an infrared thermal imager, a thermal stress sensor, a pressure sensor and a timer;

[0117] Analyze the die deformation amount of the die encapsulation process at the current stage using the die temperature, the die pressure, and the cooling time, and analyze the residual deformation amount of the die encapsulation process in the previous stage using the die thermal stress. Determine whether there is an encapsulation error in the die encapsulation process based on the die deformation amount and the residual deformation amount;

[0118] When there is an encapsulation error in the die encapsulation process, extract the total encapsulation error of the die encapsulation process, and query the error compensation device for the die encapsulation process. Among them, the error compensation device includes a temperature compensation device, a thermal stress compensation device, a pressure compensation device, and a time compensation device;

[0119] Identify the current error parameters of the error compensation device, construct a collaborative optimization model between the total encapsulation error and the error compensation amount of the current error parameters, and perform parameter collaborative optimization on the error compensation amount in the collaborative optimization model to obtain a collaborative optimization amount;

[0120] According to the current error parameters and the collaborative optimization amount, perform device parameter compensation on the error compensation device to complete the encapsulation error compensation of the die encapsulation process and obtain an error compensation result.

[0121] In several embodiments provided by the present invention, it should be understood that the provided systems and methods can be implemented in other ways. For example, the system embodiments described above are merely illustrative. For example, the division of the modules is only a logical function division, and there can be other division methods in actual implementation.

[0122] In addition, each functional module in various embodiments of the present invention can be integrated into a processing unit, or each unit can exist physically alone, or two or more units can be integrated into one unit. The above integrated unit can be implemented in the form of hardware, or in the form of a combination of hardware and software functional modules.

[0123] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not limiting. Although the present invention has been described in detail with reference to the preferred embodiments, those of ordinary skill in the art should understand that the technical solutions of the present invention can be modified or equivalently replaced without departing from the spirit and scope of the technical solutions of the present invention.

Claims

1. An automatic error compensation system, characterized in that: The system includes: a parameter detection module, an error judgment module, a device query module, a parameter optimization module, and an error compensation module; A parameter detection module, used to obtain an error source detection tool for a mold packaging process, and use the error source detection tool to detect mold temperature, mold thermal stress, mold pressure and cooling time in the mold packaging process, wherein the error source detection tool includes an infrared thermal imager, a thermal stress sensor, a pressure sensor and a timer; an error judgment module, used to analyze the mold deformation of the mold packaging process at the current stage by using the mold temperature, the mold pressure and the cooling time, analyze the residual deformation of the mold packaging process at the front-end stage by using the mold thermal stress, and judge whether there is a packaging error in the mold packaging process by using the mold deformation and the residual deformation; A device query module, used for extracting the total packaging error of the mold packaging process when there is a packaging error in the mold packaging process, and querying the error compensation device of the mold packaging process, wherein the error compensation device includes a temperature compensation device, a thermal stress compensation device, a pressure compensation device and a time compensation device; a parameter optimization module, used for identifying a current error parameter of the error compensation device, constructing a collaborative optimization model between the total packaging error and the error compensation amount of the current error parameter, and performing parameter collaborative optimization on the error compensation amount in the collaborative optimization model to obtain a collaborative optimization amount; The error compensation module is used to perform device parameter compensation on the error compensation device according to the current error parameter and the collaborative optimization amount, so as to complete the packaging error compensation of the mold packaging process and obtain an error compensation result.

2. The automatic error compensation system according to claim 1, characterized in that: The method of using the error source detection tool to detect the mold temperature, mold thermal stress, mold pressure and cooling time in the mold packaging process includes: Obtaining an infrared thermal imager, a thermal stress sensor, a pressure sensor and a timer in the error source detection tool; Use the infrared thermal imager to scan the mold surface temperature in the mold packaging process to obtain a temperature distribution map, and use the temperature distribution map as the mold temperature; Using the thermal stress sensor to measure the mold thermal stress in the mold packaging process; The pressure sensor is used to monitor the pressure change in the mold packaging process in real time to obtain the mold pressure; The cooling time in the mold packaging process is measured by the timer.

3. The automatic error compensation system according to claim 1, characterized in that: The analyzing the mold deformation amount of the mold packaging process at the current stage by using the mold temperature, the mold pressure and the cooling time includes: Based on the mold pressure, the pressure deformation of the mold packaging process at the current stage is calculated using the following formula: in, Indicates the pressure deformation, Indicates mold pressure, represents the temperature-dependent elastic modulus of the mold material, Poisson's ratio representing the temperature dependence of the mold material, represents the time variable, Indicates the holding time; Based on the mold temperature and the cooling time, the thermal deformation of the mold packaging process at the current stage is calculated using the following formula: in, Indicates the thermal deformation, represents the temperature-dependent thermal expansion coefficient, Indicates the cooling time. Indicates that the coordinate points on the surface of the mold material during the cooling process are , time is The instantaneous temperature, represents the moment variable; The sum of the pressure deformation amount and the thermal deformation amount is taken as the mold deformation amount.

4. The automatic error compensation system according to claim 1, characterized in that: The method of analyzing the residual deformation of the mold packaging process in the front-end stage by using the mold thermal stress includes: Get the mold thermal strain at the beginning of the current stage; According to the mold thermal stress and the mold thermal strain, the residual deformation of the mold packaging process in the front-end stage is calculated using the following formula: in, represents the residual deformation, Represents the thermal stress of the mold at the end of the front-end stage, represents the thermal strain of the mold at the beginning of the current stage, represents the stress relaxation coefficient of the mold, Indicates the mold volume at the end of the front-end stage.

5. The automatic error compensation system according to claim 1, characterized in that: The determining whether there is a packaging error in the mold packaging process according to the mold deformation amount and the residual deformation amount includes: Obtaining pressure deformation and thermal deformation corresponding to the mold deformation; Determine whether there is a target deformation amount exceeding an error threshold among the pressure deformation amount, the thermal deformation amount, and the residual deformation amount; When there is a target deformation amount exceeding an error threshold value among the pressure deformation amount, the thermal deformation amount, and the residual deformation amount, it is determined that there is a packaging error in the mold packaging process; When there is no target deformation amount exceeding the error threshold value among the pressure deformation amount, the thermal deformation amount, and the residual deformation amount, it is determined that there is no packaging error in the mold packaging process.

6. The automatic error compensation system according to claim 1, characterized in that: The constructing of a collaborative optimization model between the total packaging error and the error compensation amount of the current error parameter includes: Constructing an objective function between the total packaging error and the error compensation amount of the current error parameter; Setting constraints of the objective function; The collaborative optimization model is determined using the objective function and the constraint conditions.

7. The automatic error compensation system according to claim 6, characterized in that: The constructing of an objective function between the total packaging error and the error compensation amount of the current error parameter includes: Constructing an equivalent error model between the total packaging error and the error compensation amount; According to the equivalent error model, an objective function between the total packaging error and the error compensation amount of the current error parameter is constructed.

8. The automatic error compensation system according to claim 1, characterized in that: The step of performing parameter collaborative optimization on the error compensation amount in the collaborative optimization model to obtain a collaborative optimization amount includes: According to the constraints in the collaborative optimization model, a preset quadratic programming method is used to solve the objective function in the collaborative optimization model to obtain a solution control sequence; The solution control sequence is used as a collaborative optimization quantity.

9. The automatic error compensation system according to claim 1, characterized in that: The performing device parameter compensation on the error compensation device according to the current error parameter and the collaborative optimization amount includes: Determining a target adjustment parameter of the current error parameter by using the collaborative optimization amount; The current error parameter of the error compensation device is adjusted to the target adjustment parameter to complete the process of performing device parameter compensation on the error compensation device.

10. An automatic error compensation method, characterized in that: The method comprises: Obtain an error source detection tool for a mold packaging process, and use the error source detection tool to detect mold temperature, mold thermal stress, mold pressure, and cooling time in the mold packaging process, wherein the error source detection tool includes an infrared thermal imager, a thermal stress sensor, a pressure sensor, and a timer; The mold temperature, the mold pressure and the cooling time are used to analyze the mold deformation of the mold packaging process at the current stage, the mold thermal stress is used to analyze the residual deformation of the mold packaging process at the front-end stage, and whether there is a packaging error in the mold packaging process is determined by the mold deformation and the residual deformation; When there is a packaging error in the mold packaging process, extracting the total packaging error of the mold packaging process, and querying the error compensation device of the mold packaging process, wherein the error compensation device includes a temperature compensation device, a thermal stress compensation device, a pressure compensation device and a time compensation device; Identifying a current error parameter of the error compensation device, constructing a collaborative optimization model between the total packaging error and the error compensation amount of the current error parameter, and performing parameter collaborative optimization on the error compensation amount in the collaborative optimization model to obtain a collaborative optimization amount; According to the current error parameter and the collaborative optimization amount, the error compensation device is compensated for device parameters to complete the packaging error compensation of the mold packaging process and obtain an error compensation result.

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