Layout method suitable for precise temperature control of in-satellite equipment

By designing independent heat dissipation plates and thermal insulation covers on the star cabin plates, and using heating plates and thermistors to achieve active temperature control, the problem of special single-machine low temperature and high temperature stability requirements in the in-star equipment layout is solved, and the high stability temperature control effect is achieved.

CN120057310APending Publication Date: 2025-05-30CHINA ACADEMY OF SPACE TECHNOLOGY
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Patent Information

Application Number
CN202510393661.3
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-03-31
Publication Date
2025-05-30

AI Technical Summary

Technical Problem

The prior art is difficult to meet the low temperature and high temperature stability requirements of special stand-alone machines in the in-star equipment layout, especially in terms of heat dissipation area and active temperature control power.

Method used

By determining the equipment opening on the star cabin plate, calculating the heat dissipation area according to the equipment temperature control requirements, designing independent heat dissipation plates and thermal insulation covers, using heating plates and thermistors to achieve active temperature control, and combining passive temperature control means to ensure that the equipment meets the high stability temperature requirements under a small heat dissipation area and low active temperature control power.

Benefits of technology

It achieves the low temperature and high temperature stability requirements of special stand-alone machines under a small heat dissipation area and low active temperature control power, and avoids the impact on the layout design of other equipment in the star.

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Abstract

A layout method suitable for precise temperature control of in-satellite equipment belongs to the technical field of spacecraft design, and comprises the following steps: S1, determining an equipment opening in a satellite cabin plate according to the size of the equipment; s2, calculating the heat dissipation area required by the equipment according to the temperature control requirement of the equipment, and further determining the size of a heat dissipation plate of the equipment; one side, facing the cryogenic space, of the equipment mounting plate is pasted with an OSR sheet or sprayed with white paint, the other side is pasted with a heating sheet and a thermistor, the heating sheet is used for heating, and the thermistor is used for temperature monitoring; and S3, heat insulation measures are taken for the equipment. The requirements for low temperature and high temperature stability of a special single machine are met through the small heat dissipation area and the active temperature control power.
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Description

Technical Field

[0001] The present invention relates to a layout method for precisely controlling the temperature of in-satellite equipment, belonging to the technical field of spacecraft design. Background Art

[0002] Most of the electronic equipment on satellites is arranged inside the satellite. The shielding of the cabin panel provides a better irradiation and electromagnetic environment for the single-unit equipment. Electronic equipment (especially high-heat-dissipation electronic equipment) is usually installed on the inner surface of the heat dissipation cabin panel. The outer surface of the heat dissipation cabin panel is sprayed with white paint or pasted with OSR sheets to dissipate the heat of the electronic equipment through space radiation.

[0003] Generally, on-board instrument equipment is considered according to normal temperature requirements. Since general electronic or mechanical equipment is usually developed using components designed on the ground, this is the easiest and cheapest way. Normal temperature is a general temperature range, and the requirements for different objects are different. For example, the working temperature range of general electronic equipment is generally considered to be -15 to +50°C. Also, because the working ranges of on-board equipment are mostly the same, when arranging equipment on the satellite, heat pipes are usually installed on the cabin panel below the equipment, so that the heat dissipation of the equipment can utilize more heat dissipation surfaces, and the temperature of the cabin panel is also kept as balanced as possible, thereby maximizing the utilization of the heat dissipation area.

[0004] However, some instrument equipment on the satellite requires a constant temperature environment. For example, some CCD cameras require a working temperature of 18 ± 3°C; for crystal temperature requirements such as rubidium clocks, the constant temperature accuracy reaches the order of ±0.01°C, which is the internal constant temperature requirement and is generally regulated by the equipment itself. Another is the temperature stability requirement. For example, the environmental temperature range of rubidium clocks is relatively wide, from -5 to 10°C, and the temperature is required to be stable within ±1°C / 24h.

[0005] For electronic equipment such as rubidium clocks, it needs to be arranged inside the cabin. However, since the temperature requirements of such special single units are inconsistent with the temperature environment requirements of other in-cabin equipment, if the traditional layout design method is used for the layout of such single units, the temperature requirements of such single units cannot be met. If all the in-cabin single units are designed uniformly according to the requirements of special single units, due to the need to ensure low temperature, a very large heat dissipation area is required; at the same time, since the in-cabin equipment will change the working mode according to ground needs, it is difficult to maintain a stable temperature environment, thus unable to meet the high temperature stability requirements of special single units. Therefore, a layout method for precisely controlling the temperature of in-satellite equipment is needed. Summary of the Invention

[0006] The technical problem to be solved by the present invention is: overcoming the deficiencies of the prior art, providing a layout method for precisely controlling the temperature of in-satellite equipment, which can meet the requirements of low temperature and high temperature stability of special single units with a smaller heat dissipation area and active temperature control power.

[0007] The object of the present invention is achieved by the following technical solutions:

[0008] A layout method for precisely controlling the temperature of in-satellite equipment, comprising:

[0009] S1. Determine the equipment opening on the satellite body panel according to the size of the equipment;

[0010] S2. Calculate the heat dissipation area required by the equipment according to the equipment temperature control requirements, and then determine the size of the equipment heat dissipation plate; One side of the equipment heat dissipation plate facing the cryogenic space is pasted with an OSR sheet or sprayed with white paint, and the other side is pasted with a heating sheet and a thermistor. The heating sheet is used for heating, and the thermistor is used for temperature monitoring;

[0011] S3. Take heat insulation measures for the equipment.

[0012] The present invention has the following beneficial effects compared with the prior art:

[0013] (1) The present invention conducts independent thermal control design for equipment with special temperature control requirements, and meets the requirements of high stability of the temperature of special single machines at the cost of a smaller heat dissipation area and active temperature control power.

[0014] (2) The present invention embeds and installs the equipment inside the satellite body, uses the shielding protection of the panel to provide a better irradiation and ionization environment for the equipment, and at the same time conducts heat insulation design with the internal thermal design of the satellite, without affecting the conventional thermal design inside the satellite.

[0015] (3) The equipment layout of the present invention is close to the edge of the panel, and the extended area extending to the panel is fully utilized as the heat dissipation surface, avoiding the heat dissipation surface of the satellite body panel being blocked by the independent heat dissipation plate of the equipment, thereby affecting the layout design of other equipment inside the satellite. Description of the Drawings

[0016] Figure 1 It is a schematic diagram of the layout for precisely controlling the temperature of in-satellite equipment.

[0017] Figure 2 It is an exploded schematic diagram of the layout for precisely controlling the temperature of in-satellite equipment. Detailed Embodiments

[0018] To make the object, technical solutions and advantages of the present invention clearer, the embodiments of the present invention will be further described in detail below with reference to the drawings.

[0019] A layout method for precisely controlling the temperature of in-satellite equipment. The main idea of the technical solution of the present invention is: to create an independent thermal control environment for the equipment through an independent heat dissipation plate + thermal control heat insulation cover, and use the independent heat dissipation plate and the heater and thermistor pasted on the heat dissipation plate for passive and active temperature control means of the equipment to achieve the high stability temperature control requirements of the equipment. Specifically, it includes:

[0020] S1. Determine the equipment opening on the starship cabin panel: According to the size of the equipment, determine a matching opening at a position near the edge of the cabin panel. The size of the cabin panel opening should be larger than the equipment size, and a safety margin of more than 10 mm should be reserved.

[0021] S2. Determine the independent equipment heat dissipation plate:

[0022] S21. According to the temperature control requirements of the equipment, calculate the heat dissipation area required by the equipment, and then determine the size of the equipment heat dissipation plate; Since the installation position of the equipment is at the edge of the starship cabin panel, the size of the heat dissipation plate is designed to ensure a safety margin from the external components of the star and be compatible with the fairing envelope. At the same time, the protruding size of the star should be utilized as much as possible, so as to minimize the shielding of the heat dissipation surface of the starship cabin panel and have little impact on the thermal design of the satellite body.

[0023] S22. Paste an OSR sheet or spray white paint on the side of the equipment heat dissipation plate facing the cryogenic space as the heat dissipation window of the heat dissipation plate; The equipment heat dissipation plate is on the same side as the equipment installation, and a heating sheet and a thermistor are pasted. The satellite monitors the temperature of the equipment installation surface in real time through the temperature acquisition data of the thermistor. Once the temperature is lower than the allowable temperature threshold, the cabin panel heating sheet is turned on to heat the equipment installation surface; When the temperature is higher than the allowable temperature threshold, the cabin panel heating sheet is disconnected. Through the precise control of the temperature threshold, the working environment temperature of the equipment is ensured to be within the allowable range, and the temperature fluctuation range is small.

[0024] S3. Thermal insulation between the equipment and the internal environment of the star: To avoid the thermal interaction between the equipment and the internal environment of the star and affect the equipment temperature control effect, it is necessary to design thermal insulation between the temperature control environment of the equipment and the star.

[0025] S31. Install thermal insulation pads at the connection points between the equipment heat dissipation plate and the starship cabin panel to reduce the thermal interaction between the equipment heat dissipation plate and the starship cabin panel;

[0026] S32. For the part of the equipment entering the cabin interior, use a thermal control thermal insulation cover for thermal shielding protection to reduce the thermal interaction between the equipment and the interior of the star.

[0027] The precise temperature control layout of the in-star equipment realized by the method of the present invention is as shown in Figure 1 and Figure 2 shown.

[0028] The content not described in detail in the specification of the present invention belongs to the well-known technology of those skilled in the art.

[0029] Although the present invention has been disclosed above in preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make possible changes and modifications to the technical solution of the present invention by using the methods and technical contents disclosed above without departing from the spirit and scope of the present invention. Therefore, any simple modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention without departing from the technical solution of the present invention shall fall within the protection scope of the technical solution of the present invention.

Claims

1. A layout method adapted to precise temperature control of satellite equipment, characterized in that: include: S1. Determine the equipment opening on the satellite cabin board according to the size of the equipment; S2. Calculate the required heat dissipation area of ​​the equipment according to the temperature control requirements of the equipment, and then determine the size of the equipment heat sink; paste OSR sheet or spray white paint on the side of the equipment heat sink facing the deep cold space, and paste heating sheet and thermistor on the other side. The heating sheet is used for heating, and the thermistor is used for temperature monitoring; S3. Take heat insulation measures for the equipment.

2. The layout method according to claim 1, characterized in that: The opening size should be larger than the equipment size and retain a safety distance of more than 10mm.

3. The layout method according to claim 1, characterized in that: The size of the equipment's heat sink is designed to ensure a safe distance from extra-satellite components while being compatible with the fairing envelope. At the same time, the size of the protruding satellite should be used as much as possible to minimize the obstruction of the heat dissipation surface of the satellite cabin.

4. The layout method according to claim 1, characterized in that: The satellite monitors the temperature of the device installation surface in real time through the temperature collection data of thermistors. Once the temperature is lower than the allowable temperature threshold, the heating plate is turned on to heat the device installation surface; when the temperature is higher than the allowable temperature threshold, the heating plate is disconnected.

5. The layout method according to claim 4, characterized in that: Through precise control of the temperature threshold, the operating environment temperature of the equipment is ensured to be within the allowable range and the temperature fluctuation is small.

6. The layout method according to claim 1, characterized in that: The insulation measures include: installing insulation pads at the connection points between the equipment's heat sink and the satellite cabin panel, and using a thermal control insulation cover for heat shielding protection on the part of the equipment entering the cabin.

7. The layout method according to claim 1, characterized in that: The equipment is arranged close to the edge of the deck.

8. The layout method according to claim 1, characterized in that: The cabin panels are used to provide shielding and protection for the equipment from space radiation and ionization environment.