Preparation method of electrified visbreaking magnetic conductive adhesive tape

Abstract

The invention relates to a preparation method of an electrified visbreaking magnetic conductive adhesive tape, which comprises the following steps: firstly, stirring a magnetic conductive adhesive material, coating the magnetic conductive adhesive material on a copper foil, and curing to form a first coiled material; stirring an adhesive material, coating the adhesive material on the first coiled material, and curing to form a second coiled material; stirring an electrified visbreaking adhesive material, coating the electrified visbreaking adhesive material on the second coiled material, and curing to form a third coiled material; finally, the third coiled material is attached to a release layer, the electrified visbreaking magnetic conductive adhesive tape is prepared, a magnetic conductive adhesive material of the adhesive tape contains cobalt-nickel ferrite or nanoscale iron, cobalt, nickel and other magnetic conductive filler, an electrified visbreaking adhesive material contains solid conductive salt and a polar proton inert solvent, the adhesive tape has excellent magnetic conductivity, shielding performance and electrified visbreaking performance, and the adhesive tape is suitable for being applied to the field of magnetic conductive adhesive tape. The conductive adhesive is suitable for electromagnetic shielding and conductive bonding in electronic equipment.

Description

Technical Field

[0001] The present invention provides a preparation method of a magneto-conductive tape with power-on viscosity reduction, belonging to the technical field of magneto-conductive tapes. Background Art

[0002] At present, in a high-frequency environment of electronic products, the demand for magneto-conductive shielding tapes is increasing. Compared with other ordinary adhesive tapes, magneto-conductive shielding tapes have more magneto-conductive fillers, and these fillers account for most of the cost of magneto-conductive shielding tapes. Existing magneto-conductive shielding tapes can already meet the requirements of adhesiveness, but it is difficult to tear them off when electronic devices are repaired and recycled, which affects work efficiency. Generally, in order to tear off the tape, the tape is blown with hot air, but this will damage sensitive components, and it is still easy to leave marks when tearing off the tape. In addition, the magnetic conduction efficiency of the tape will also be interfered by electromagnetic waves. How to reduce electromagnetic wave interference is also a problem that needs to be solved.

[0003] Existing patents such as the patents with publication numbers CN 109705759B and CN 110105892B all affect the tape viscosity by emitting light or generating heat after being powered on, but the viscosity of the tape decreases significantly when used again. For exclusive tapes with customized shapes and specifications, if they are replaced after being removed, it will cause an increase in cost and waste of materials. Summary of the Invention

[0004] The present invention provides a preparation method of a magneto-conductive tape with power-on viscosity reduction, which is used to prepare a magneto-conductive tape with power-on viscosity reduction, improve the shielding performance of the magneto-conductive tape, and solve the problem that the magneto-conductive shielding tape is difficult to recycle and use.

[0005] The present invention provides a preparation method of a magneto-conductive tape with power-on viscosity reduction, and the preparation method includes:

[0006] S1. Put the magneto-conductive adhesive material into a reaction kettle at 60 - 80 °C and stir. After the adhesive material is completely polymerized, coat it on the copper foil with a comma coating knife, and the coating thickness is 20 - 50 um. Then send the tape into a curing oven for curing, and after curing, wind it up to obtain the first coil.

[0007] S2. Mix the adhesive materials and put them into a reaction kettle at 40 - 60 °C and stir. After the adhesive materials are completely polymerized, coat them on the first coil with a comma coating knife, and the coating thickness is 10 - 20 um. Then send the tape into a curing oven for curing, and after curing, wind it up to obtain the second coil.

[0008] S3. Mix the electrically conductive tackifying adhesive material and place it in a reactor at 80 - 90 °C for stirring. After the electrically conductive tackifying adhesive material is completely polymerized, coat it on the second coil material with a comma coating knife, and the coating thickness is 30 - 50 μm. Then send the tape into a curing oven for curing, and wind it up after curing to obtain the third coil material.

[0009] S4. Bond the third coil material with the release layer and then wind it up to obtain the electrically conductive tackifying magnetic conductive tape.

[0010] Furthermore, the mass ratio composition of the magnetic conductive adhesive material includes: 10 - 30 parts of magnetic conductive filler, 30 - 50 parts of epoxy resin, 40 - 60 parts of acrylate monomer, and 30 - 50 parts of ethyl acetate. The magnetic conductive filler includes at least one of cobalt-nickel ferrite and nano-scale iron, cobalt, and nickel.

[0011] Furthermore, the preparation method of cobalt-nickel ferrite is as follows: Mix cobalt nitrate, nickel nitrate, and iron nitrate according to a molar ratio of 1:2:2. Dissolve the weighed nitrates in an appropriate amount of deionized water, and heat it to 40 - 50 °C with stirring to make the pH value of the solution between 1 and 2. Subsequently, add citric acid to the solution. Then add an appropriate amount of ethylenediamine to adjust the pH value of the solution to 7. Continue to heat and stir the solution until most of the water evaporates and the solution becomes thick to form a homogeneous sol. Pour the thick sol into a porcelain dish and heat it on an electric furnace until it burns. Collect the ashes after burning and put them into a high-temperature furnace for calcination, and keep them at 800 °C for 2 hours to obtain pure cobalt-nickel ferrite.

[0012] Furthermore, the preparation method of nano-scale iron, cobalt, and nickel is as follows:

[0013] Select common metal salts of iron, cobalt, and nickel and dissolve them in polyol. After complete dissolution, a homogeneous reaction solution is formed.

[0014] Heat the polyol solution containing metal salts to react between 150 °C and 200 °C. After the reaction is completed, cool the reaction system to room temperature to precipitate the nanoparticles.

[0015] Wash the precipitate with acetone to remove the excess polyol and other by-products, and then dry the washed precipitate to obtain pure metal nanoparticles.

[0016] Furthermore, the mass ratio composition of the adhesive material includes: 50 - 80 parts of acrylate monomer, 20 - 30 parts of ethyl acetate, 20 - 30 parts of epoxy resin, and 3 - 5 parts of polyetherimide.

[0017] Furthermore, the mass ratio composition of the electroconductive viscosity-reducing adhesive material includes: 60 - 80 parts of acrylate monomer, 30 - 50 parts of ethyl acetate, 20 - 30 parts of epoxy resin, 20 - 40 parts of solid conductive salt, 20 - 40 parts of polar proton-inert solvent, 10 - 20 parts of methoxypolyethylene glycol, and 1 - 5 parts of coupling agent.

[0018] Furthermore, the solid conductive salt includes at least one of lithium bis(trifluoromethylsulfonyl)imide, lithium bis(fluorosulfonyl)imide, lithium hexafluorophosphate, and lithium trifluoromethanesulfonate, and the particle size of the solid conductive salt is 0.6um - 1um.

[0019] Furthermore, the composition of the polar proton-inert solvent includes at least one of N,N-dimethylformamide (DMF), dimethyl sulfoxide (DMSO), N-methylpyrrolidone (NMP), hexamethylphosphoramide (HMPA), acetonitrile (ACN), tetrahydrofuran (THF), and acetone.

[0020] Furthermore, the preparation method also includes conductive layer attachment treatment. Before the third coil is laminated with the release layer, a conductive layer and an adhesive layer are also laminated.

[0021] Furthermore, the preparation method also includes pre-cutting treatment of the tape. Strip-shaped or columnar electroconductive connection ends are pre-cut at the tape tearing position.

[0022] Advantages of the present invention:

[0023] After stirring and polymerizing the magneto-conductive adhesive material and then coating it to generate the first coil, the first coil has the effect of magneto-conductive shielding. At the same time, by controlling the coil thickness through coating, the first coil with different effects can be obtained; after heating, stirring and polymerizing the adhesive material and then coating it on the first coil and curing it to obtain the second coil, the first coil has excellent adhesiveness, ensuring the tight connection between the first coil and other layers, and adjusting the coating thickness to control the adhesion strength to achieve directional viscosity reduction and tearing; after stirring and polymerizing the electroconductive viscosity-reducing adhesive material and then coating it on the second coil and curing it to obtain the third coil, the magneto-conductive shielding functional layer, the adhesive layer, and the electroconductive viscosity-reducing adhesive layer have been fully connected. The electroconductive viscosity-reducing adhesive layer also has excellent adhesiveness when not electrified. After a short-term electrification treatment, it can be torn off without residue and can continue to be attached after tearing, reducing the maintenance cost.

[0024] The magneto-conductive fillers in the present invention are produced separately. The particle size of the magneto-conductive fillers greatly affects the performance and softness of the magneto-conductive shielding layer. The magneto-conductive fillers produced by this method can improve the performance and electroconductive effect of the magneto-conductive shielding layer and can reduce the skin effect.

[0025] Before the third coil material is bonded to the release layer, the present invention performs a conductive layer attachment process. When the tape has uneven insulating and conductive surfaces, it uses the self - contained conductive layer and adhesive layer to provide a normal conductive circuit and expand the applicable environment of the tape.

[0026] The present invention performs a pre - cutting process on the tape. At the tearing part of the tape, there are pre - cut strip - shaped or column - shaped electrically - connected ends, which provide clamping points for power - on and adhesion reduction, avoiding other operations to form a circuit between the tape and the power source and improving the efficiency of tape adhesion reduction and tearing. Brief Description of the Drawings

[0027] Figure 1 It is the hierarchical structure diagram of Embodiment 1 of the product of the present invention;

[0028] Figure 2 It is the hierarchical structure diagram of Embodiment 2 of the product of the present invention;

[0029] Figure 3 It is the hierarchical structure diagram of Embodiment 3 of the product of the present invention;

[0030] Wherein:

[0031] 1. Magnetic conduction shielding functional layer; 2. Adhesive layer; 3. Power - on and adhesion - reducing adhesive layer; 4. Release layer; 5. Conductive layer. Detailed Embodiments

[0032] In order to more clearly understand the above - mentioned objects, features, and advantages of the present invention, the present invention will be described in detail below with reference to the drawings and specific embodiments. It should be noted that, without conflict, the embodiments of the present application and the features in the embodiments can be combined with each other.

[0033] In the following description, many specific details are set forth to facilitate a full understanding of the present invention. The described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0034] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the technical field to which the present invention belongs. The terms used in the specification of the present invention herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention.

[0035] An embodiment of the present invention, a preparation method of a power - on and adhesion - reducing magnetic conduction tape, the preparation method includes:

[0036] S1. Put the magnetic conductive adhesive material into a reaction kettle at 60 - 80 °C and stir. After the adhesive material is completely polymerized, coat it on the copper foil with a comma coating knife. The coating thickness is 20 - 50 μm. Then send the tape into a curing oven for curing. The curing temperature is divided into 7 sections, and the curing temperatures are 100 °C, 120 °C, 140 °C, 160 °C, 140 °C, 120 °C, and 100 °C respectively. The curing time for each section is 20 - 40 s. After curing, wind it up to obtain the first coil, and the first coil serves as the magnetic conductive shielding functional layer;

[0037] S2. Mix the adhesive material and put it into a reaction kettle at 40 - 60 °C and stir. After the adhesive material is completely polymerized, coat it on the first coil with a comma coating knife. The coating thickness is 10 - 20 μm. Then send the tape into a curing oven for curing. The curing temperature is divided into 7 sections, and the curing temperatures are 80 °C, 100 °C, 120 °C, 130 °C, 120 °C, 100 °C, and 80 °C respectively. The curing time for each section is 10 - 15 s. After curing, wind it up to obtain the second coil, and the second coil is the magnetic conductive shielding functional layer of the cured adhesive;

[0038] S3. Mix the electroconductive pressure - sensitive adhesive material and put it into a reaction kettle at 80 - 90 °C and stir. After the electroconductive pressure - sensitive adhesive material is completely polymerized, coat it on the second coil with a comma coating knife. The coating thickness is 30 - 50 μm. Then send the tape into a curing oven for curing. The curing temperature is divided into 5 sections, and the curing temperatures are 90 °C, 110 °C, 130 °C, 110 °C, and 90 °C respectively. The curing time for each section is 30 - 50 s. After curing, wind it up to obtain the third coil, and the third coil is the magnetic conductive shielding functional layer cured with electroconductive pressure - sensitive adhesive and adhesive;

[0039] S4. Bond the third coil with the release layer and then wind it up to obtain the electroconductive pressure - sensitive magnetic conductive tape.

[0040] The mass ratio composition of the magnetic conductive adhesive material includes: 10 - 30 parts of magnetic conductive filler, 30 - 50 parts of epoxy resin, 40 - 60 parts of acrylate monomer, and 30 - 50 parts of ethyl acetate. The magnetic conductive filler is self - prepared, and the magnetic conductive filler includes at least one of cobalt - nickel ferrite and nano - scale iron, cobalt, and nickel.

[0041] The preparation method of cobalt - nickel ferrite is: Mix cobalt nitrate, nickel nitrate, and iron nitrate in a molar ratio of 1:2:2. Dissolve the weighed nitrates in an appropriate amount of deionized water and heat it to 40 - 50 °C under stirring so that the pH value of the solution is between 1 and 2;

[0042] Then add citric acid as a complexing agent to the solution. The amount of citric acid used is more than 10% of the cation substance amount. Using citric acid helps the metal ions form complexes, so as to be evenly distributed in the subsequent steps;

[0043] Subsequently, an appropriate amount of ethylenediamine was added to adjust the pH value of the solution to 7 to ensure the full complexation of metal ions with citric acid, forming a stable sol.

[0044] Subsequently, the solution was continuously heated and stirred until most of the water evaporated and the solution became thick, forming a homogeneous sol.

[0045] Subsequently, the thick sol was poured into a porcelain dish and heated on an electric furnace until combustion occurred. During the combustion process, an exothermic reaction occurred between citric acid and nitrate, generating a preliminary oxide powder.

[0046] Subsequently, the combustion ash was collected and calcined in a high-temperature furnace at 800 °C for 2 hours to form pure cobalt-nickel ferrite. The cobalt-nickel ferrite obtained in this example had a particle size in the range of 400 - 600 nm.

[0047] In this example, the preparation method of nanoscale iron, cobalt, and nickel was as follows:

[0048] Common metal salts of iron, cobalt, and nickel were selected and dissolved in polyols. The common metal salts of iron, cobalt, and nickel that could be selected were nitrates, chlorides, and sulfates, and the polyols that could be selected were ethylene glycol and glycerol. After complete dissolution, a homogeneous reaction solution was formed. The polyol solution containing metal salts was heated to a temperature between 150 °C and 200 °C for reaction. After the reaction was completed, the reaction system was cooled to room temperature to precipitate the nanoparticles.

[0049] The precipitate was washed with acetone to remove excess polyols and other by-products, and then the washed precipitate was dried to obtain pure metal nanoparticles. In this example, the particle size of the metal nanoparticles was in the range of 10 - 50 nm.

[0050] In this example, the mass ratio composition of the adhesive material included: 50 - 80 parts of acrylate monomer, 20 - 30 parts of ethyl acetate, 20 - 30 parts of epoxy resin, and 3 - 5 parts of polyetherimide.

[0051] In this example, the mass ratio composition of the electro-conductive viscosity-reducing adhesive material included: 60 - 80 parts of acrylate monomer, 30 - 50 parts of ethyl acetate, 20 - 30 parts of epoxy resin, 20 - 40 parts of solid conductive salt, 20 - 40 parts of polar aprotic inert solvent, 10 - 20 parts of methoxypolyethylene glycol, and 1 - 5 parts of coupling agent. Methoxypolyethylene glycol could simultaneously act as an emulsifier, dispersant, thickener, and electrolyte, achieving cost reduction and efficiency improvement. The coupling agents used in this example were silane coupling agent and titanate coupling agent, specifically γ-aminopropyltriethoxysilane and tetra-isopropyl titanate. γ-aminopropyltriethoxysilane was used to improve the interfacial bonding force between the adhesive and the layer, enhancing the bonding strength, while tetra-isopropyl titanate could also improve the interfacial properties and enhance the water resistance and chemical resistance of the adhesive.

[0052] In this embodiment, the solid conductive salts that can be selected include one or more of lithium bis(trifluoromethylsulfonyl)imide, lithium bis(fluorosulfonyl)imide, lithium hexafluorophosphate, and lithium trifluoromethanesulfonate, which are selected according to the applicable temperature and material cost. In this embodiment, lithium bis(trifluoromethylsulfonyl)imide and lithium bis(fluorosulfonyl)imide are selected, and the particle size of the solid conductive salt is 0.6um - 1um.

[0053] The composition of the polar aprotic solvent in this embodiment includes at least one of N,N-dimethylformamide (DMF), dimethyl sulfoxide (DMSO), N-methylpyrrolidone (NMP), hexamethylphosphoramide (HMPA), acetonitrile (ACN), tetrahydrofuran (THF), and acetone.

[0054] Example 2

[0055] The difference from Example 1 is that in order to increase the applicable environment of the tape and apply different material facings, a conductive layer attachment treatment is also carried out before the third coil is laminated with the release layer. A conductive layer is also attached between the electroconductive pressure-sensitive adhesive and the release layer, and an adhesive layer is coated between the conductive layer and the release layer. The conductive layer is a conductive copper foil or a conductive oil film, which has a good film-forming effect and can be well connected with other hierarchical structures; alternatively, an adhesive layer and a release layer are also provided on the copper foil surface of the magnetic conduction shielding functional layer to form a double-sided tape for fixing the tape on a specific surface and performing electroconductive pressure-sensitive adhesive reduction on the facing that needs to be pressure-sensitive adhesive reduced. This treatment method enables the tape to adapt to insulating facings, conductive facings, and other uneven facings at the same time, ensuring the use environment of the tape and improving the application of the tape under various requirements.

[0056] Example 3

[0057] The difference from Example 2 is that in order to improve the convenience of the tape, a pre-cutting treatment is also carried out on the tape, and pre-cut rolling is carried out at the tape tearing and separating position, so that the tape can be torn off more conveniently and neatly. In addition, strip-shaped power-on terminals are pre-cut at the tearing position, which is convenient for the electric clamp to hold during electroconductive pressure-sensitive adhesive reduction, saving the steps of additional cutting or trimming the tape, quickly forming an energized circuit, and completing electroconductive pressure-sensitive adhesive reduction and tearing.

[0058] During use, the power-on terminals of the first coil and the conductive layer are respectively connected to facilitate the connection of an external power supply. The connection ends are respectively connected to the positive and negative poles of the power supply. After power-on for 30 seconds at 10V voltage, the conductive surface can be separated from the electroconductive pressure-sensitive adhesive reduction layer of the tape.

[0059] The epoxy resin, acrylate monomer, ethyl acetate, acetone, alcohols, polyetherimide, and coupling agent used in the embodiments of the present invention were purchased from Zhejiang Yuanbang Material Technology Co., Ltd., and other reagents were purchased from Sigma-Aldrich Corporation (Merck reagents).

[0060] The tapes manufactured in Example 1, Example 2, and Example 3 were used as the control group, and data tests were carried out together with the following comparative tapes. Comparative Example 1 is different from Example 2 in that the copper foil in the magnetic conduction shielding functional layer is replaced by a film cured from conductive ink.

[0061] Comparative Example 2 is different from Example 2 in that the magnetic conduction shielding functional layer is directly bonded to the electrified pressure-sensitive adhesive layer.

[0062] Comparative Example 3 is different from Example 2 in that the filler in the magnetic conduction shielding functional layer has a particle size of 1 - 10 μm.

[0063] Comparative Example 4 is a Chinese patent application with the publication number CN 110105892B.

[0064] Comparative Example 5 is a Chinese patent application with the publication number CN 110105892B.

[0065] Test content

[0066] Electromagnetic shielding performance test was carried out according to the measurement method of material shielding effectiveness in SJ20524 - 1995.

[0067] Magnetic permeability performance test: Using the MICROTEST magnetic permeability tester 6632 - 50, a 25mm * 25mm sample was intercepted and tested in an environment of T = 22 ± 5°C and RH = 55 ± 10%. The test tape was placed in the tester, the test instrument was adjusted, the test frequency was adjusted to 10 kHz, and the initial magnetic permeability data and the maximum magnetic permeability data were read.

[0068] Flex resistance test: Select a 5.0mm thick tempered glass, intercept a 14mm * 5mm sample, stack two pieces of tempered glass horizontally, take a magnetic conduction double-sided tape test sample, evenly attach it to the surfaces and sides of the two pieces of tempered glass, and perform a 90-degree bending attachment. Observe whether the joint of the tempered glass warps every day at room temperature for 1 week.

[0069] Peel strength test: In an environment of T = 22 ± 5°C and RH = 55 ± 10%, a 25mm wide test tape was intercepted, and a roller was used to roll back and forth twice on the stainless steel test surface. With a peel angle of 180 degrees and a speed of 300mm / min, the peel strength test was carried out.

[0070] Adhesion performance test: In an environment of T = 22 ± 5°C and RH = 55 ± 10%, a 180 * 20mm test tape was intercepted. The tape was attached to one side of a 200x 30x 2mm PC board and rolled back and forth once with a 2kg roller and then left standing for 24 hours. The PC board with the attached tape was placed on a 190mm fixture to fix and bend the material. Observe the floating situation at the end after 10 days at room temperature.

[0071] For the electrified tack reduction performance test, in an environment with T = 22 ± 5°C and RH = 55 ± 10%, take a section of the tape with a width of 25 mm to be tested and attach it to a stainless-steel plate. Roll it back and forth twice with a roller. Connect the extended end of the tape to the positive pole of the power supply, and connect the part of the stainless-steel plate where the tape is not attached to the negative pole of the power supply. Apply power for 30 seconds at 10 V. Conduct a peel strength test at a peel angle of 180 degrees and a speed of 300 mm / min, and record whether there is glue residue.

[0072] For the repeated performance test of electrified tack reduction, place the tape with electrified tack reduction performance for 2 hours after electrified peeling, and then perform the electrified tack reduction performance test again. Compare it with the initial test results, and repeat the above steps of electrified treatment, recovery, and retest for multiple cycle tests until the peel strength is less than 60% of the initial peel strength, and record the number of cycles.

[0073]

[0074] In this article, regarding numerical ranges, unless otherwise specified, the above numerical ranges are considered continuous within the range, including the minimum and maximum values of the range, as well as each value between such minimum and maximum values. Further, when the range refers to integers, it includes each integer between the minimum and maximum values of the range. In addition, when multiple ranges are provided to describe features or characteristics, these ranges can be combined. In other words, unless otherwise specified, all ranges disclosed in this article should be understood to include any and all sub-ranges subsumed therein.

[0075] Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalent technologies, the present invention also intends to include these changes and modifications.

Claims

1. A method for preparing an electrically conductive, viscosity-reducing magnetic tape, characterized in that: The preparation method comprises: S1. Place the magnetic conductive adhesive material in a reactor at 60-80°C and stir. When the adhesive material is fully polymerized, apply it on the copper foil with a comma coating scraper. The coating thickness is 20-50um. Then, send the tape into a curing oven for curing. After curing, reel it up to obtain the first coil. S2, mixing the adhesive materials and putting them into a reactor at 40-60° C. and stirring them. When the adhesive materials are completely polymerized, they are coated on the first coil by a comma coating blade with a coating thickness of 10-20 um. Then, the tape is sent to a curing oven for curing. After curing, the tape is rolled up to obtain a second coil; S3, mixing the electrically de-viscous adhesive material and putting it into a reactor at 80-90° C. and stirring, and coating the electrically de-viscous adhesive material on the second coil by a comma coating blade after the polymerization is complete, with a coating thickness of 30-50 um, and then sending the tape into a curing oven for curing, and after curing, winding it up to obtain a third coil; S4, after laminating the third coil to the release layer, rewinding the coil to obtain the energized viscosity-reducing magnetic conductive tape.

2. The method for preparing a magnetic conductive tape with electrical viscosity reduction as claimed in claim 1, characterized in that: The magnetic conductive adhesive material comprises, by mass ratio, 10-30 parts of magnetic conductive filler, 30-50 parts of epoxy resin, 40-60 parts of acrylate monomer and 30-50 parts of ethyl acetate. The magnetic conductive filler comprises cobalt-nickel ferrite and at least one of nano-iron, cobalt and nickel.

3. The method for preparing a magnetic conductive tape with electrical viscosity reduction as claimed in claim 2, characterized in that: The cobalt-nickel ferrite preparation method is: Cobalt nitrate, nickel nitrate and ferric nitrate are mixed in a molar ratio of 1:2:2, the weighed nitrate is dissolved in an appropriate amount of deionized water, and heated to 40-50°C under stirring so that the pH value of the solution is between 1 and 2; citric acid is then added to the solution, the amount of citric acid being higher than 10% of the mass of the cationic substance, and then an appropriate amount of ethylenediamine is added to adjust the pH value of the solution to 7; the solution is continued to be heated and stirred until most of the water evaporates, the solution becomes thick, and a uniform sol is formed; the thick sol is poured into a porcelain container, and placed on an electric furnace for heating until it burns; the ashes after burning are collected, placed in a high-temperature furnace for calcination, and kept warm at 800°C for 2 hours to obtain pure cobalt-nickel ferrite.

4. The method for preparing a magnetic conductive tape with electrical viscosity reduction as claimed in claim 2, characterized in that: The method for preparing nano-scale iron, cobalt and nickel is as follows: Select commonly used metal salts of iron, cobalt and nickel and dissolve them in the polyol to form a uniform reaction solution after complete dissolution; The polyol solution containing the metal salt is heated to between 150°C and 200°C for reaction, and after the reaction is completed, the reaction system is cooled to room temperature to precipitate the nanoparticles; The precipitate is washed with acetone to remove excess polyols and other by-products, and then the washed precipitate is dried to obtain pure metal nanoparticles.

5. The method for preparing a magnetic conductive tape with electrical viscosity reduction as claimed in claim 1, characterized in that: The adhesive material comprises, by mass ratio, 50-80 parts of acrylate monomer, 20-30 parts of ethyl acetate, 20-30 parts of epoxy resin, and 3-5 parts of polyetherimide.

6. The method for preparing a magnetic conductive tape with electrical viscosity reduction as claimed in claim 1, characterized in that: The material composition of the electrification viscosity-reducing adhesive comprises: 60-80 parts of acrylate monomer, 30-50 parts of ethyl acetate, 20-30 parts of epoxy resin, 20-40 parts of solid conductive salt, 20-40 parts of polar aprotic solvent, 10-20 parts of methoxy polyethylene glycol and 1-5 parts of coupling agent.

7. The method for preparing a magnetic conductive tape with electrical viscosity reduction as claimed in claim 6, characterized in that: The solid conductive salt comprises at least one of lithium bis(trifluoromethylsulfonyl)imide, lithium bis(fluorosulfonyl)imide, lithium hexafluorophosphate and lithium trifluoromethanesulfonate, and the particle size of the solid conductive salt is 0.6um-1um.

8. The method for preparing a magnetic conductive tape with electrical viscosity reduction as claimed in claim 6, characterized in that: The polar aprotic solvent composition comprises at least one of N,N-dimethylformamide (DMF), dimethyl sulfoxide (DMSO), N-methylpyrrolidone (NMP), hexamethylphosphoramide (HMPA), acetonitrile (ACN), tetrahydrofuran (THF) and acetone.

9. The method for preparing a magnetic conductive tape with electrical viscosity reduction as claimed in claim 1, characterized in that: The method also includes a conductive layer laminating process, wherein a conductive layer and an adhesive layer are laminated before the third coil is laminated to the release layer.

10. The method for preparing a magnetic conductive tape with electrical viscosity reduction as claimed in claim 1, characterized in that: The method further comprises pre-cutting the adhesive tape, where a strip or columnar electrical connection end is pre-cut at the location where the adhesive tape is torn off.

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