Insect-proof protective glue as well as preparation method and application thereof

Abstract

The invention relates to the technical field of three-proofing glue, in particular to insect-proof protection glue as well as a preparation method and application thereof. The insect-proof protective glue comprises the following components in parts by weight: 1-50 parts of organic silicon modified resin; 1 to 50 parts of acrylic resin; 1 to 50 parts of terpene phenolic resin; 0.01-2 parts of a rare earth zirconium catalyst; and 1-50 parts of a solvent. The organosilicone modified resin has heat-resistant, waterproof, chemical-resistant, corrosion-resistant, mildew-resistant and other protective properties and improves the adhesion performance, the acrylic resin is beneficial to improving the quick-drying performance and can also improve the film strength, water resistance and weather resistance after film formation, and the terpene phenolic resin has good compatibility with the other two resins and can play a role in filling and protection. The thickness of a formed film is improved, and the thermal stability after film formation is improved. The rare earth zirconium catalyst can improve the quick-drying performance of the insect-proof protective glue. Therefore, a film layer formed after the insect-proof protection glue is cured can prevent egg adhesion, insect biting and contact with a protected electronic element.

Description

Technical Field

[0001] The present application relates to the technical field of three-proof glue, and in particular to insect-proof protective glue and a preparation method and application thereof. Background Art

[0002] Electronic components and circuits, such as various flexible rigid circuit boards, aviation instruments, computer control boards, semiconductor crystal circuits, home appliance controllers, etc., are easily affected by moisture, salt spray, humidity, high temperature, and other chemical reagents during long-term use, which can lead to corrosion, mold growth, open circuits, short circuits, etc., resulting in failures of electronic components and circuits. For this reason, the existing technology often uses a protective film formed by a three-proof adhesive to isolate and protect them and increase their service life.

[0003] However, in some usage scenarios, especially outdoors, kitchens, hot and humid areas in the south, and places that are not cleaned for a long time, electronic components or pins are often attached with insect eggs. These eggs, especially cockroach, mosquito and ant eggs, will breed a large number of insects after hatching in a warm environment. The protective film formed by the existing protective glue often cannot fully cover or the protective performance is not enough. These insects crawl or bite at will, which will cause the precision electronic components to fail or short-circuit, catch fire and be damaged. For this reason, the existing three-proof glue is often made into a potting glue to wrap the entire motherboard, such as wrapping the entire computer PCB board. Although this can effectively prevent water, dust and insects, it will cause the device to be heavy, inconvenient to use, impractical, and costly, and the internal components cannot be seen clearly. In addition, most of the existing three-proof glues are insulated. When the electronic components using the three-proof glue are performing operations such as pin soldering, the three-proof glue will degenerate and fail, affecting the soldering effect, resulting in unstable circuit connection or even short circuit, so it needs to be cleaned before soldering or the impurities need to be cleaned after soldering.

[0004] Therefore, a protective glue is needed that can effectively prevent insects and ensure the safety and stability of electronic components and circuits. Summary of the invention

[0005] The purpose of the present application is to provide an insect-proof protective glue and a preparation method and application thereof, aiming to solve the technical problem that the three-proof glue in the prior art cannot take into account both the insect-proof and soldering effects.

[0006] In order to achieve the above application purpose, the technical solution adopted in this application is as follows:

[0007] In a first aspect, the present application provides an insect-proof protective glue, which includes the following components in parts by weight:

[0008]

[0009] The anti-insect protective glue of the present application contains three kinds of resins. Among them, the silicone-modified resin endows the anti-insect protective glue with protective properties such as heat resistance, waterproofness, chemical resistance, anti-corrosion, and anti-mildew, which are the basic properties of the three-proof glue, and improves the adhesion performance. The acrylic resin is beneficial to improving the quick-drying performance of the anti-insect protective glue, and can also improve the film layer strength, waterproof and weather resistance after film formation. The terpene phenolic resin has good compatibility with the other two resins, can play a role in filling and protection, improve the thickness of the film formed, and is also beneficial to improving the thermal stability after film formation. The rare earth zirconium catalyst can improve the quick-drying performance of the anti-insect protective glue. These components are uniformly dispersed in the solvent, and the obtained anti-insect protective glue can firmly adhere to the electronic components or pins. The film layer formed after curing can prevent the attachment of insect eggs, prevent insects from biting, and prevent contact with the protected electronic components, preventing situations such as short circuits and open circuits. Moreover, the electronic components can be soldered without cleaning.

[0010] In a second aspect, the present application provides a preparation method of the above-mentioned anti-insect protective glue of the present application, including the following steps:

[0011] Mix the raw materials including silicone-modified resin, acrylic resin, terpene phenolic resin, rare earth zirconium catalyst, and solvent.

[0012] The preparation method of the present application mixes the above-mentioned components of the anti-insect protective glue, so that each component is fully and evenly mixed in the solvent. The silicone-modified resin, acrylic resin, terpene phenolic resin, and rare earth zirconium catalyst interact with each other, making the prepared anti-insect protective glue have a variety of excellent properties, taking into account the effects of preventing the attachment of insect eggs, preventing insects from biting, insulation protection, weather resistance, and solder cleaning-free. The preparation method has controllable process, and the prepared anti-insect protective glue has stable performance.

[0013] In a third aspect, the present application provides an application of the above-mentioned anti-insect protective glue of the present application or the anti-insect protective glue prepared by the above-mentioned preparation method of the present application in electronic components and power transmission.

[0014] Due to the above-mentioned anti-insect protective glue of the present application having a variety of excellent properties, it can be widely applied to various flexible and rigid circuit boards, aviation instruments, computer control boards, semiconductor crystal circuits, household appliance controllers, and power transmission, and can prevent the attachment of insect eggs and prevent insects from damaging electronic components. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for use in the embodiments or the description of the prior art. Obviously, the following drawings are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0016] Figure 1Schematic diagram of the anti-insect protective glue of Embodiment 1 of the present application for automatic coating of electronic components;

[0017] Figure 2 Schematic diagram of the anti-insect protective glue of Embodiment 1 of the present application for soldering through the furnace on a PCB board;

[0018] Figure 3 Schematic diagram of the anti-insect protective glue of Embodiment 1 of the present application for post-furnace gasification test of electronic component pins;

[0019] Figure 4 Schematic diagram of the live body and insulation test of the anti-insect protective glue of Embodiment 1 of the present application after being used on electronic components. Detailed implementation manners

[0020] In order to make the technical problems to be solved, technical solutions and beneficial effects of the present application clearer, the following further details the present application in conjunction with embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0021] In the present application, the term "and / or" describes the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B may represent: A exists alone, A and B exist simultaneously, and B exists alone. Where A and B may be singular or plural. The character " / " generally indicates that the associated objects before and after are an "or" relationship.

[0022] In the present application, "at least one" means one or more, and "a plurality" means two or more. "At least one of the following" or its similar expression refers to any combination of these items, including any combination of single item (s) or plural item (s).

[0023] It should be understood that in various embodiments of the present application, the magnitude of the serial numbers of the above processes does not mean the order of execution. Some or all steps may be executed in parallel or sequentially. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation to the implementation process of the embodiments of the present application.

[0024] In the description of the embodiments of the present application, the weight of the relevant components not only refers to the specific content of each component, but also represents the proportional relationship of the weights between the components. Therefore, as long as the content of the relevant components in the description of the embodiments of the present application is enlarged or reduced in proportion, it is within the scope disclosed in the description of the embodiments of the present application. Specifically, the mass in the description of the embodiments of the present application may be mass units well known in the chemical industry such as μg, mg, g, kg, etc.

[0025] The terms "first" and "second" are for descriptive purposes only, used to distinguish objects such as substances from each other, and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. For example, without departing from the scope of the embodiments of the present application, the first XX may also be referred to as the second XX, and similarly, the second XX may also be referred to as the first XX. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features.

[0026] In the first aspect of the embodiments of the present application, an insect-proof protective glue is provided. The insect-proof protective glue comprises the following components in parts by weight:

[0027] Organosilicon-modified resin: 1 - 50 parts;

[0028] Acrylic resin: 1 - 50 parts;

[0029] Terpene phenolic resin: 1 - 50 parts;

[0030] Rare earth zirconium catalyst: 0.01 - 2 parts;

[0031] Solvent: 1 - 50 parts.

[0032] The insect-proof protective glue in the embodiments of the present application contains three kinds of resins. Among them, the organosilicon-modified resin endows the insect-proof protective glue with protective properties such as heat resistance, waterproofness, chemical resistance, anti-corrosion, and anti-mildew, which are the basis of a three-proof glue, and also improves the adhesion performance. The acrylic resin is beneficial to improving the quick-drying performance of the insect-proof protective glue, and can also improve the film layer strength, waterproof and weather resistance after film formation. The terpene phenolic resin has good compatibility with the other two resins, can play a filling and protective role, improve the thickness of the film formed, and is also beneficial to improving the thermal stability after film formation. The rare earth zirconium catalyst can improve the quick-drying performance of the insect-proof protective glue. These components are uniformly dispersed in the solvent to obtain the insect-proof protective glue, which can firmly adhere to electronic components or pins. The film layer formed after curing can prevent the attachment of insect eggs, prevent insects from gnawing, and prevent contact with the protected electronic components, preventing situations such as short circuits and open circuits.

[0033] In addition, the film layer formed after the insect-proof protective glue is cured is insulating, and will not vaporize even at a temperature as high as 120 - 130 °C, with good heat resistance, ensuring the stability of the insulating film layer and being beneficial to the stability of electrical signals in the circuit without being interfered by the environment. Moreover, the film layer has good weather resistance and can resist water, high temperature, humidity, mildew, salt, and chemical corrosion. Finally, after the insect-proof protective glue is applied to electronic components or pins, it can be directly welded without cleaning, can be melted at high temperature during soldering (such as a tin temperature of 260 - 265 °C) without affecting the soldering, the conductivity of the soldering part will not decrease due to this insect-proof protective glue, and there is almost no impurity residue after soldering, and no cleaning is required after soldering. Therefore, this insect-proof protective glue also saves the cleaning steps before and after the soldering of electronic components and reduces the process flow.

[0034] [Regarding silicone-modified resin]

[0035] Silicone-modified resin has been widely used in three-proof adhesives. It is a composite material that combines silicone materials with resin substrates. Generally, it is made from silicone intermediates and other organic resins (such as alkyd resins, polyester resins, epoxy resins, acrylic resins, polyurethane resins, phenolic resins, etc.). It can be modified by direct physical mixing or chemical synthesis. It has a relatively high thermal decomposition temperature and a low coefficient of thermal expansion, good thermal stability, and a high heat resistance grade. It can also withstand the erosion of environmental factors such as ultraviolet rays, humidity, and oxidation for a long time, with good weather resistance. It also has a high insulation resistance and a low dielectric loss, with excellent insulating electrical properties. It can also form good adhesion with a variety of materials, which is beneficial to the combination of the protective adhesive and the substrate, improving adhesion and durability. It also has good flexibility and can adapt to the surfaces of substrates with various complex shapes, especially in the scenarios of electronic components and pins, which are precise, complex, and small in size, facilitating the formation of a uniform coating. Therefore, silicone-modified resin has strong protective properties. However, pure silicone-modified resin is relatively soft. By complementing and filling each other with acrylic resin, it is beneficial to enhance the brittleness of the insect-proof protective adhesive, improve elasticity, increase toughness, and enhance the insect-proof protection performance.

[0036] In some embodiments, the silicone-modified resin includes at least one of methylphenyl silicone resin, polyphenol-modified silicone resin, vinyl silicone oil, dimethyl silicone oil, and hydroxyl-terminated polydimethylsiloxane. The solid content can be 50% - 70%, and preferably 60% - 70%. Among them, the methylphenyl silicone resin can be methylphenyl silicone resin 1053. The polyphenol-modified silicone resin can be obtained by reacting phenyl chlorosilane, methyl chlorosilane, and silicone resin. It can be the FJN-9804 type of polyphenol-modified silicone resin produced by Changzhou Jiayuan Silicone Co., Ltd., with a viscosity of 20 - 40 S / 25°C (measured by the coating-4 cup method), a solid content of 50% ± 2%, and a heat resistance of up to 250°C / 200h without cracking, bubbling, or peeling. These silicone-modified resins are beneficial to further improve the insect-proof effect, thermal stability, weather resistance, adhesion, elasticity, and toughness of the insect-proof protective adhesive.

[0037] [Regarding acrylic resin]

[0038] Acrylic resin is a resin made from acrylic acid through polymerization reaction, which can be a homopolymer of acrylic acid; the raw materials can also include methacrylic acid and its derivatives (such as esters, nitriles, amides), and acrylic acid to obtain copolymers. Compared with the silicone-modified resin and terpene phenolic resin in the components, the main characteristics of acrylic resin are high tensile strength, elastic modulus and wear resistance, so that the insect repellent protective glue can meet a variety of mechanical requirements after curing; in addition, acrylic resin can also withstand ultraviolet radiation, high temperature, low temperature and other environmental conditions, is not prone to oxidative decomposition and aging, improves weather resistance, and is suitable for outdoor use; acrylic resin has good tolerance to chemical substances such as water, hydrochloric acid, alkali and organic acid, and can maintain stability in complex chemical environments; acrylic resin has good quick-drying properties, is conducive to rapid film formation, and has certain heat shrinkage.

[0039] In some embodiments, the acrylic resin includes a thermoplastic acrylic resin. The thermoplastic acrylic resin softens when heated, which is beneficial to the insect-proof protective glue being free of cleaning when welding electronic components. It is a BS1206 thermoplastic acrylic resin of Jiangsu Sanmu Group Co., Ltd., with a solid content of 50%±1%, a Grignard viscosity of 40-70S / 25°C, and a hydroxyl value of 3-6mgKOH / g. These thermoplastic acrylic resins are beneficial to further improve the insect-proof effect, mechanical properties, weather resistance and other properties of the insect-proof protective glue.

[0040] In some embodiments, the weight ratio of the silicone modified resin to the acrylic resin can be 1: (1-3). In the exemplary embodiment, it can include but is not limited to any ratio of 1: 1, 1: 1.3, 1: 1.6, 1: 2, 1: 3 or any range between two ratios. The ratio of silicone resin to acrylic resin in these ratios can further exert the performance of the two resins and improve the protectiveness, film-forming property, quick-drying property, toughness, elasticity and other properties of the insect-proof protective glue. Among them, the amount of acrylic resin can be slightly higher than that of silicone resin. Acrylic resin as the main body is beneficial to increase the elasticity of the insect-proof protective glue, but if the amount of acrylic resin is too high, it is easy to cause the film to be brittle, while silicone resin is softer, so the amount of silicone resin should not be too small, and the two can be compounded according to the above ratio.

[0041] [About terpene phenolic resin]

[0042] Terpene phenolic resin, also known as terpene phenol resin, is a terpene resin modified by phenol. It contains rich polar groups, so it has good compatibility with the above-mentioned two other resins, can improve the cohesive strength and dispersion uniformity of the insect-proof protective glue, has a significant tackifying effect, and is conducive to improving the thermal stability after film formation. In addition, the terpene phenolic resin has strong adhesion, is non-toxic and odorless, resistant to aging, resistant to dilute acids and alkalis, heat-resistant and light-resistant, and has strong electrical insulation, which is conducive to further improving the insect-proof effect, mechanical properties, weather resistance and other properties of the insect-proof protective glue. The terpene phenolic resin is solid at room temperature and can play a filling and protective role in the insect-proof protective glue, improve the solid content of the whole insect-proof protective glue, and increase the hardness, abrasion resistance and thickness of the film formed.

[0043] Moreover, the terpene phenolic resin contains rosin components. The rosin components help to keep the welding surface clean, are also conducive to protecting the molten tin from oxidation, ensuring the welding effect, helping the solder to wet the welded parts and form an ideal solder joint shape; are also conducive to isolating the metal of the solder joint from the air, thereby preventing the metal surface of the solder joint from being continuously oxidized by the oxygen in the air; are even more conducive to making the solder joint more solid, thereby reducing the probability of false soldering, and helping to improve the appearance quality of the solder joint, making it more bright and plump. Therefore, the terpene phenolic resin is conducive to improving the solder quality during circuit connection.

[0044] In some embodiments, the terpene phenolic resin may include at least one of the models T-120, 138, 145, 210, 422. The 210 model, namely 210 modified phenolic rosin resin, can be formed by the condensation reaction of phenol or diphenylolpropane (bisphenol A) with formaldehyde and then esterification with polyol. In some embodiments, the hydroxyl value of the terpene phenolic resin is 10-15 mgKOH / g, and the acrylic resin with these parameters is conducive to further improving the insect-proof effect, mechanical properties, weather resistance and other properties of the insect-proof protective glue.

[0045] [Regarding rare earth zirconium catalyst]

[0046] The rare earth zirconium catalyst can accelerate the cross-linking polymerization and curing of the resin in the insect-proof protective glue in the air, and also has a drying effect, accelerating the drying and curing of the insect-proof protective glue. The common catalysts of this type in the prior art include compounds of cobalt, manganese, lead, zinc and calcium elements, while the rare earth zirconium catalyst in this application mainly contains zirconium element and also contains a small amount of rare earth elements, which can reduce the dosage of the catalyst and accelerate the catalytic and drying effects. Among them, the rare earth elements can include cerium, and can be selected from substances such as cerium isooctanoate and cerium naphthenate, and the zirconium element can be selected from oxides, salts and their organic acid soaps. In the demonstration example, it can include substances such as zirconium isooctanoate, zirconium naphthenate, zirconium octanoate, zirconium sulfate, zirconium oxide, etc. Mixing the rare earth and zirconium catalysts in this way has higher efficacy than using them alone.

[0047] Rare earth zirconium catalysts are generally stored dissolved in a solvent to obtain a liquid rare earth zirconium catalyst, and the rare earth zirconium catalyst can be of the 827-1 model from Shanghai Changfeng Chemical Factory.

[0048] [Regarding the solvent]

[0049] The solvent evenly disperses the above components therein and reduces viscosity to improve fluidity. In some embodiments, the solvent may include at least one of xylene, solvent naphtha No. 200, ethyl acetate, butyl acetate, diethylene glycol monobutyl ether, ethylene glycol monobutyl ether, dimethyl carbonate, and de-aromatized solvent naphtha. Among them, the optional solvent is a mixed solvent of xylene, ethyl acetate, solvent naphtha No. 200, and diethylene glycol monobutyl ether. The optional solvent is de-aromatized solvent naphtha, which has no peculiar smell and is an environmentally friendly solvent, and can be of models such as D20, D30, D40, etc.

[0050] In some embodiments, the insect-proof protective glue further includes a flame retardant; wherein, the weight portion of the flame retardant can be 0.01 to 20 parts. Adding the flame retardant is beneficial to improving the flame retardant performance of the insect-proof protective glue, and it is not easy to burn due to high temperature during the soldering of electronic components, thereby improving fire safety. In some embodiments, the flame retardant may include phosphate flame retardants.

[0051] [Regarding the entire insect-proof protective glue]

[0052] Under the synergistic effect of the above organosilicon-modified resin, acrylic resin, terpene phenolic resin, and rare earth zirconium catalyst, together with the solvent, an insect-proof protective glue is obtained, which has various excellent properties. It can firmly adhere to electronic components or leads, and the film layer formed after curing can prevent the attachment of insect eggs, prevent insects from gnawing, and prevent contact with the protected electronic components, preventing situations such as short circuits and open circuits. Moreover, the film layer formed after curing is insulating, which is beneficial to the stability of electrical signals in the circuit without being interfered by the environment. The film layer has good weather resistance and can resist water, high temperature, humidity, mildew, salt, and chemical corrosion.

[0053] The components in the insect-proof protective glue can be in the following parts by weight: 1 to 50 parts of silicone-modified resin. In exemplary embodiments, it can include but is not limited to any value among 1 part, 5 parts, 10 parts, 20 parts, 50 parts or the range between any two values. 1 to 50 parts of acrylic resin. In exemplary embodiments, it can include but is not limited to any value among 1 part, 5 parts, 10 parts, 20 parts, 50 parts or the range between any two values. 1 to 50 parts of terpene phenolic resin. In exemplary embodiments, it can include but is not limited to any value among 1 part, 5 parts, 10 parts, 20 parts, 50 parts or the range between any two values. 0.01 to 2 parts of rare earth zirconium catalyst. In exemplary embodiments, it can include but is not limited to any value among 0.01 part, 0.05 part, 0.1 part, 0.5 part, 2 parts or the range between any two values. 1 to 50 parts of solvent. In exemplary embodiments, it can include but is not limited to any value among 1 part, 5 parts, 10 parts, 20 parts, 50 parts or the range between any two values. When a flame retardant is included, the parts by weight can be 1 to 20 parts. In exemplary embodiments, it can include but is not limited to any value among 1 part, 3 parts, 5 parts, 10 parts, 20 parts or the range between any two values.

[0054] In some embodiments, the insect-proof protective glue of the embodiments of the present application may further include the following components in parts by weight:

[0055] 5 to 20 parts of silicone-modified resin;

[0056] 30 to 50 parts of acrylic resin;

[0057] 20 to 40 parts of terpene phenolic resin;

[0058] 0.01 to 0.05 part of rare earth zirconium catalyst;

[0059] 1 to 50 parts of solvent.

[0060] The insect-proof protective glue obtained from these components in parts by weight is more conducive to improving the adhesion, achieving cleaning-free in the welding process, and can further improve the insect-proof effect and weather resistance after film formation. In exemplary embodiments, the insect-proof protective glue can include the following combinations in parts by weight: silicone-modified resin, acrylic resin, terpene phenolic resin, rare earth zirconium catalyst, and solvent can be obtained according to the ratio of 20 parts, 40 parts, 30 parts, 0.03 part, 30 parts, and can also be obtained according to the ratio of 15 parts, 30 parts, 25 parts, 0.02 part, 20 parts, and can also be obtained according to the ratio of 10 parts, 30 parts, 30 parts, 0.05 part, 40 parts.

[0061] It is detected that the pH value of the insect-proof protective glue is 6 to 8; the flame retardant level of the insect-proof protective glue ≥ 94Vo.

[0062] The second aspect of the embodiments of the present application provides a preparation method for the above-mentioned insect-proof protective glue of the embodiments of the present application, including the following steps:

[0063] S10: Mix the raw materials including silicone-modified resin, acrylic resin, terpene phenolic resin, rare earth zirconium catalyst, and solvent.

[0064] In the preparation method of the embodiment of the present application, the components of the above-mentioned insect-proof protective glue are mixed, so that the components are fully and evenly mixed in the solvent. The silicone-modified resin, acrylic resin, terpene phenolic resin, and rare earth zirconium catalyst interact with each other, so that the prepared insect-proof protective glue has a variety of excellent properties, taking into account the effects of preventing egg attachment, preventing insects from biting, insulating protection, weather resistance, and solder cleaning-free. The preparation method has controllable process, and the prepared insect-proof protective glue has stable performance.

[0065] In the demonstration example, step S10 may include the following steps:

[0066] S11: First prepare the solvent, and the solvent may include a mixed solvent prepared from xylene, ethyl acetate, solvent oil No. 200, and diethylene glycol butyl ether.

[0067] S12: Then add terpene phenolic resin and acrylic resin to the solvent. You can add terpene phenolic resin first and then acrylic resin, or add acrylic resin first and then terpene phenolic resin, and mix them evenly.

[0068] S13: Then add silicone-modified resin. If a flame retardant is also contained, the flame retardant can be added after adding the silicone resin.

[0069] S14: Finally, add rare earth zirconium catalyst.

[0070] Such a feeding order is conducive to the raw materials being fully and evenly mixed. Finally, adding rare earth zirconium catalyst enables the resins to crosslink and react with each other, and can be used on electronic components to accelerate film formation by curing.

[0071] The third aspect of the embodiment of the present application provides an application of the insect-proof protective glue of the above-mentioned embodiment of the present application or the insect-proof protective glue prepared by the preparation method of the above-mentioned embodiment of the present application in electronic components and power transmission.

[0072] Since the insect-proof protective glue of the above-mentioned embodiment of the present application has a variety of excellent properties, it can be widely used in various flexible and rigid circuit boards, aviation instruments, computer control boards, semiconductor crystal circuits, household appliance controllers, and power transmission, and can prevent egg attachment and prevent mosquitoes and ants from damaging electronic components.

[0073] In the demonstration example, the pins of the electronic components can be immersed in the insect-proof protective glue, or the insect-proof protective glue can be applied to the pins of the electronic components. It can be quickly dried under low-temperature baking at about fifty to sixty degrees Celsius or under a certain gas convection, without the need for high-temperature baking. After drying, a protective film layer is formed, and the thickness of the film layer can be ≥ 30 μm. Due to the high flame-retardant grade, when the electronic components need to be welded, they can be directly soldered without cleaning, and there are no components such as halogen-containing and lead-containing soldering fluxes in it, meeting the national standards and EU standards, etc., reducing the harm to the human body. There will be no impurity residues after welding, so there is no need to clean after welding either. The effect of non-cleaning greatly reduces the process flow.

[0074] The following is an illustration with specific embodiments.

[0075] Embodiment 1

[0076] This embodiment provides an insect-proof protective glue and its preparation method. The insect-proof protective glue includes the following components in parts by weight:

[0077]

[0078] Among them, the silicone-modified resin is the FJN-9804 polyphenol-modified silicone resin of Changzhou Jiano Silicone Co., Ltd., the acrylic resin is BS1206 of Jiangsu Sanmu Group Co., Ltd., the terpene phenolic resin is of the T-120 model, the flame retardant is a phosphate ester flame retardant, the rare earth zirconium catalyst is of the 827-1 model of Changfeng Chemical Factory, and the solvent is a mixed solvent prepared from xylene, ethyl acetate, No. 200 solvent oil, and diethylene glycol butyl ether.

[0079] The preparation method includes the following steps:

[0080] S1: First, prepare a mixed solvent from xylene, ethyl acetate, No. 200 solvent oil, and diethylene glycol butyl ether.

[0081] S2: Then, sequentially add the terpene phenolic resin and the acrylic resin to the solvent and stir evenly.

[0082] S3: Add the silicone-modified resin and stir evenly.

[0083] S4: Add the flame retardant and stir evenly.

[0084] S5: Finally, add the rare earth zirconium catalyst and stir evenly to obtain the insect-proof protective glue.

[0085] Embodiment 2

[0086] This embodiment provides an insect-proof protective glue and its preparation method. The difference from Embodiment 1 is only that: the parts by weight of the components are adjusted, and the others are the same. See Table 1 for details.

[0087] Embodiment 3

[0088] This embodiment provides an insect-proof protective glue and its preparation method. The difference from Embodiment 1 is only that: the weight parts of the components are adjusted, and the others are the same. See Table 1 for details.

[0089] Embodiment 4

[0090] This embodiment provides an insect-proof protective glue and its preparation method. The difference from Embodiment 1 is only that: the weight parts of the components are adjusted, and the others are the same. See Table 1 for details.

[0091] Embodiment 5

[0092] This embodiment provides an insect-proof protective glue and its preparation method. The difference from Embodiment 1 is only that: the weight parts of the components are adjusted, and the others are the same. See Table 1 for details.

[0093] Embodiment 6

[0094] This embodiment provides an insect-proof protective glue and its preparation method. The difference from Embodiment 1 is only that: the organosilicon modified resin is changed to methylphenyl silicone resin 1053, and the others are the same. See Table 1 for details.

[0095] The component differences between Embodiment 1 to Embodiment 6 are shown in Table 1. The units of the values in Table 1 are all (weight parts).

[0096] Table 1

[0097]

[0098]

[0099] Performance detection

[0100] Coat the insect-proof protective glue provided in the above Embodiment 1 to Embodiment 6 on electronic components. For example, it can be coated on the pins of electronic components or on the interfaces of PCB boards. The coating process of Embodiment 1 is as Figure 1 shown in the automatic coating process. The liquid in the cylinder is the insect-proof protective glue.

[0101] Apply the insect-proof protective glue of Embodiment 1 on the PCB board. After baking into a film at 50 °C, then conduct an oven soldering experiment at a temperature of about 260 °C without cleaning. The result is as Figure 2 shown. It can be seen that the soldering effect is good, the shape of the solder joints is ideal, and the solder joints are full, bright and plump.

[0102] Apply the insect-proof protective glue of Embodiment 1 on the pins of electronic components. After baking into a film at 50 °C, then conduct a schematic diagram of the oven gasification test at a temperature of about 125 °C, as Figure 3 shown, Figure 3 it can be seen from that at this temperature, the formed protective film will not gasify and has good heat resistance.

[0103] Apply the anti-insect protection glue of Example 1 on the electronic components. After baking at a low temperature of 50 °C to form a film, then conduct live body and insulation tests. As Figure 4 shown, the formed cured film has good anti-insect effect and good insulation performance.

[0104] The above are only the preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. An insect-proof protective glue, characterized in that: The composition comprises the following components in parts by weight:

2. The insect-proof protective glue according to claim 1, characterized in that: The composition comprises the following components in parts by weight:

3. The insect-proof protective glue according to claim 1 or 2, characterized in that: The weight ratio of the organosilicon modified resin to the acrylic resin is 1:(1-3); And / or, the organosilicon-modified resin includes at least one of methylphenyl silicone resin, polyphenol-modified silicone resin, vinyl silicone oil, dimethyl silicone oil, and hydroxy-terminated polydimethylsiloxane.

4. The insect-proof protective glue according to claim 1 or 2, characterized in that: The acrylic resin includes a thermoplastic acrylic resin; And / or, the hydroxyl value of the thermoplastic acrylate is 3 to 6 mgKOH / g.

5. The insect-proof protective glue according to claim 1 or 2, characterized in that: The terpene phenolic resin has a hydroxyl value of 10 to 15 mgKOH / g.

6. The insect-proof protective glue according to claim 1 or 2, characterized in that: The rare earth zirconium catalyst contains at least one of zirconium isooctanoate, zirconium sulfate and zirconium oxide; And / or, the solvent includes at least one of xylene, No. 200 solvent oil, ethyl acetate, butyl acetate, diethylene glycol butyl ether, ethylene glycol butyl ether, dimethyl carbonate, and dearomatized solvent oil.

7. The insect-proof protective glue according to claim 1 or 2, characterized in that: Also included are flame retardants; wherein, The weight portion of the flame retardant is 0.01 to 20 parts; And / or, the flame retardant includes a phosphate flame retardant.

8. The insect-proof protective glue according to claim 1 or 2, characterized in that: The pH value of the insect-proof protective glue is 6 to 8; And / or, the flame retardant grade of the insect-proof protective glue is ≥94Vo.

9. A method for preparing the insect-proof protective glue according to any one of claims 1 to 8, characterized in that: The steps include: The raw materials including the organosilicon modified resin, the acrylic resin, the terpene phenolic resin, the rare earth zirconium catalyst and the solvent are mixed.

10. Use of the insect-proof protective glue according to any one of claims 1 to 8 or the insect-proof protective glue prepared by the preparation method according to claim 9 in electronic components and power transmission.

Images