High-performance epoxy resin adhesive for wood and capable of being rapidly cured at room temperature and preparation method of high-performance epoxy resin adhesive

Abstract

The invention discloses a high-performance wood epoxy resin adhesive capable of being rapidly cured at room temperature and a preparation method thereof. The preparation method comprises the following steps: adding bisphenol A, epoxy chloropropane and a catalyst into a first reaction kettle; in response to complete dissolution of bisphenol A, dropwise adding a sodium hydroxide solution with a first preset concentration into the first reaction kettle, and heating to perform an alkalization ring-closure reaction; regularly taking out the first reaction solution and the acid catalyst for reaction heat release to obtain the heat release temperature; obtaining an epoxy value in the first reaction solution according to the heat release temperature; in response to the condition that the epoxy value in the first reaction solution reaches a preset requirement, sequentially carrying out water washing desalination, reduced pressure distillation and filtration on the first reaction solution to obtain an epoxy resin adhesive main agent; adding a solvent, an amine catalyst, polythiol and acrylics into a second reaction kettle, heating, refluxing and stirring for reaction; and cooling and distilling to obtain the epoxy resin adhesive curing agent. The curing efficiency can be improved.

Description

Technical Field

[0001] The present invention relates to the field of epoxy resin adhesives, and particularly to a high-performance epoxy resin adhesive for wood with rapid curing at room temperature and a preparation method thereof. Background Art

[0002] Epoxy resin adhesives have good process performance, are less affected by weather and environment during use, do not require complex pretreatment, and have excellent bonding performance, electrical insulation performance and mechanical properties, and are widely used in the national defense and civilian fields. Especially with the rapid development of cryogenic engineering, aerospace applications, and superconducting technology, the demand for epoxy resin adhesives, sealants and transfer molding matrix resins is increasing.

[0003] Epoxy resin glue consists of two parts: epoxy resin (prepolymer) and curing agent (such as amines, anhydrides). After the two are mixed, a cross-linking reaction occurs to form a three-dimensional network structure. The curing reaction of epoxy resin and curing agent generally includes the following steps: 1. Ring-opening reaction: The active hydrogen in the curing agent attacks the oxygen atom of the epoxy group of the epoxy resin, causing the epoxy ring to open. 2. Chain growth: The generated hydroxyl group (-OH) further reacts with other epoxy groups to form an ether bond (-O-). 3. Cross-linked network: Finally, a highly cross-linked three-dimensional network structure is formed, endowing the material with high strength, heat resistance and chemical stability. It can be found from this process that the epoxy value in the main agent of epoxy resin is very important for the curing process. In the prior art, the reaction of producing the main agent of epoxy resin generally determines whether the reaction is completed according to the reaction time. The method based on the reaction time rarely considers external influences, so there may be under-reaction or over-reaction. In the case of under-reaction, the epoxy value is low, and in the case of over-reaction, by-products are generated and the epoxy value is also low. This will lead to the instability of the epoxy value of the main agent of epoxy resin. The instability of the epoxy value affects the reaction efficiency between the main agent of epoxy resin and the curing agent, and thus reduces the curing efficiency. Summary of the Invention

[0004] In view of the above-mentioned partial defects of the prior art, the technical problem to be solved by the present invention is to provide a high-performance epoxy resin adhesive for wood with rapid curing at room temperature and a preparation method thereof, aiming to ensure that the epoxy value in the epoxy resin adhesive meets the requirements, thereby ensuring the reaction efficiency with the curing agent and improving the curing efficiency.

[0005] To achieve the above object, the first aspect of the present invention discloses a preparation method of a high-performance epoxy resin adhesive for wood with rapid curing at room temperature, and the method includes:

[0006] Step S1: Add bisphenol A and epichlorohydrin into the first reaction kettle according to a first preset ratio; according to the addition amounts of the bisphenol A and the epichlorohydrin, add a corresponding amount of catalyst into the first reaction kettle; introduce nitrogen into the first reaction kettle for protection, stir and heat up to 55 - 60 °C to dissolve the bisphenol A; wherein, the first reaction kettle is connected with an extraction detection pipeline through a first valve, the extraction detection pipeline is sleeved with a first temperature control jacket for controlling the temperature of the liquid in the extraction detection pipeline, the extraction detection pipeline is connected to a detection container through a second valve, a second temperature control jacket for keeping the liquid in the detection container at a constant temperature is arranged outside the detection container, a first temperature sensor is arranged inside the detection container, and the detection container is filled with a first preset amount of acidic catalyst;

[0007] Step S2: In response to the complete dissolution of the bisphenol A, dropwise add a sodium hydroxide solution with a first preset concentration into the first reaction kettle, and heat for an alkali - closed - loop reaction;

[0008] Step S3: During the alkali - closed - loop reaction process, regularly open the first valve and the second valve, extract a second preset amount of the first reaction solution from the first reaction kettle to the detection container, so that the first reaction solution reacts with the acidic catalyst to release heat; collect the first temperature increased in the detection container through the first temperature sensor, and obtain the epoxy value in the first reaction solution according to the temperature - epoxy value function relationship; wherein, the first reaction solution maintains the temperature at a second temperature through the first temperature control jacket, the acidic catalyst is maintained at a third temperature through the second temperature control jacket, replace the acidic catalyst in the detection container before each extraction of the first reaction solution, and close the second temperature control jacket when the first reaction solution reacts with the acidic catalyst;

[0009] Step S4: In response to the epoxy value in the first reaction solution reaching the preset requirement, perform water washing and desalting, vacuum distillation, and filtration on the first reaction solution in sequence to obtain the main agent of the epoxy resin adhesive;

[0010] Step S5: Add a solvent, an amine catalyst, a polythiol, and an acrylate into the second reaction kettle according to a second preset ratio, and heat under reflux and stir for reaction;

[0011] Step S6: In response to the complete reaction in the second reaction kettle, obtain a second reaction solution; perform cooling distillation on the second reaction solution to obtain the curing agent of the epoxy resin adhesive; wherein, the high - performance wood - used epoxy resin adhesive with rapid room - temperature curing comprises the main agent of the epoxy resin adhesive and the curing agent of the epoxy resin adhesive.

[0012] Optionally, the step of obtaining the temperature - epoxy value function relationship includes:

[0013] Step S201: Obtain the first reaction solution with the second preset amount and the first epoxy value, and heat the first reaction solution with the first epoxy value to the second temperature; obtain the first preset amount of the acidic catalyst, and heat the acidic catalyst to the third temperature; wherein, the first epoxy value is known;

[0014] Step S202: Add the first reaction solution with the first epoxy value to the acidic catalyst, and collect and record the increased first experimental temperature;

[0015] Step S203: Repeat Step S201 and Step S202 to obtain different epoxy values and their corresponding experimental temperatures; perform fitting on each epoxy value and its corresponding experimental temperature to obtain the temperature-epoxy value functional relationship.

[0016] Optionally, Step S1 includes:

[0017] Add bisphenol A and epichlorohydrin to the first reaction kettle at a molar ratio of 1:12; according to the addition amounts of bisphenol A and epichlorohydrin, add a catalyst accounting for 0.3% of the mass of bisphenol A to the first reaction kettle; introduce nitrogen into the first reaction kettle for protection, stir and heat up to 55-60°C to dissolve bisphenol A; wherein, the catalyst is tetramethylammonium chloride.

[0018] Optionally, Step S2 includes:

[0019] In response to the complete dissolution of bisphenol A, raise the temperature of the first reaction kettle to 60-70°C and dropwise add half of the 20% sodium hydroxide solution for reaction; raise the temperature of the first reaction kettle to 85-90°C and dropwise add the other half of the 20% sodium hydroxide solution for reaction.

[0020] Optionally, Step S4 includes:

[0021] In response to the epoxy value in the first reaction solution reaching the preset requirement, wash the first reaction solution with 80°C hot water three times, stir for 20 minutes each time, and discard the lower-layer brine after standing and stratifying;

[0022] Under a vacuum of -0.095 MPa, raise the temperature of the first reaction solution after water washing and desalting to 120°C to remove epichlorohydrin, toluene, and moisture;

[0023] Filter the first reaction solution through a 5-μm filter element to obtain the main agent of the epoxy resin adhesive.

[0024] Optionally, after Step S6, the method further includes:

[0025] The main agent of the epoxy resin adhesive and the curing agent of the epoxy resin adhesive are separately packaged in a two-chamber packaging bag that isolates moisture according to a volume ratio of 2:1.

[0026] The present invention also discloses a high-performance epoxy resin adhesive for wood with rapid room-temperature curing, and the high-performance epoxy resin adhesive for wood with rapid room-temperature curing is prepared according to the above-mentioned preparation method of the high-performance epoxy resin adhesive for wood with rapid room-temperature curing.

[0027] Advantages of the present invention: 1. In the present invention, the first reaction kettle is connected with an extraction detection pipeline through a first valve, and the extraction detection pipeline is sleeved with a first temperature control jacket for controlling the temperature of the liquid in the extraction detection pipeline. The extraction detection pipeline is connected to a detection container through a second valve. A second temperature control jacket for keeping the liquid in the detection container at a constant temperature is arranged outside the detection container. A first temperature sensor is arranged in the detection container, and the detection container is filled with a first preset amount of acidic catalyst. During the alkalization and ring-closure reaction process, the first valve and the second valve are periodically opened, and a second preset amount of the first reaction solution is extracted from the first reaction kettle to the detection container, so that the first reaction solution reacts with the acidic catalyst to release heat; the first temperature increased in the detection container is collected by the first temperature sensor, and according to the relationship between the first temperature and the temperature-epoxy value function, the epoxy value in the first reaction solution is obtained. In this way, the present invention can detect the epoxy value in real time to ensure that the alkalization and ring-closure reaction will not cause insufficient reaction or overreaction resulting in a decrease in the epoxy value, so that there are enough epoxy groups to carry out the curing reaction with the curing agent, thereby accelerating the curing efficiency. 2. The epoxy value detection of the present invention only needs to detect the temperature. Compared with the existing titration technology and spectral detection technology, the present invention effectively improves the detection efficiency, greatly reduces the hysteresis, and makes the epoxy value detection result more credible.

[0028] In summary, the preparation method of the present invention can effectively ensure the number of epoxy groups in the main agent of the epoxy resin adhesive, and thus effectively accelerate the curing efficiency of the epoxy resin adhesive during use, achieving rapid curing even at room temperature. Brief Description of the Drawings

[0029] Figure 1 is a schematic flow chart of a preparation method of a high-performance epoxy resin adhesive for wood with rapid room-temperature curing provided by a specific embodiment of the present invention;

[0030] Figure 2 is a schematic structural diagram of a first reaction kettle provided by a specific embodiment of the present invention. Detailed Embodiments

[0031] The present invention discloses a high-performance epoxy resin adhesive for wood with rapid curing at room temperature and a preparation method thereof. Those skilled in the art can draw on the content of this article and appropriately improve the technical details to achieve it. It should be particularly noted that all similar substitutions and modifications are obvious to those skilled in the art, and they are all considered to be included in the present invention. The method and application of the present invention have been described through preferred embodiments, and those related can obviously make changes or appropriate alterations and combinations to the methods and applications described herein without departing from the content, spirit, and scope of the present invention to implement and apply the technology of the present invention.

[0032] Through research by the applicant, it is found that: epoxy resin adhesive consists of two parts, epoxy resin (prepolymer) and curing agent (such as amines, acid anhydrides). After the two are mixed, a cross-linking reaction occurs to form a three-dimensional network structure. The curing reaction of epoxy resin and curing agent generally includes the following steps: 1. Ring-opening reaction: The active hydrogen in the curing agent attacks the oxygen atom of the epoxy group of the epoxy resin, causing the epoxy ring to open. 2. Chain growth: The generated hydroxyl group (-OH) further reacts with other epoxy groups to form ether bonds (-O-). 3. Cross-linked network: Finally, a highly cross-linked three-dimensional network structure is formed, endowing the material with high strength, heat resistance, and chemical stability. It can be found from this process that the epoxy value in the main agent of epoxy resin is very important for the curing process. In the prior art, the production of the main agent of epoxy resin generally determines whether the reaction is completed according to the reaction time, and there is rarely detection of the epoxy value. Even if there is detection, there is a certain lag in the detection rate, which results in the instability of the epoxy value of the main agent of epoxy resin, and further leads to slow curing efficiency during use.

[0033] Therefore, the embodiment of the present invention provides a preparation method of a high-performance epoxy resin adhesive for wood with rapid curing at room temperature, as Figure 1 shown, this method includes:

[0034] Step S1: Add bisphenol A and epichlorohydrin into the first reaction kettle according to the first preset ratio; according to the addition amounts of bisphenol A and epichlorohydrin, add the corresponding amount of catalyst into the first reaction kettle; introduce nitrogen into the first reaction kettle for protection, stir and heat up to 55 - 60 °C to dissolve bisphenol A.

[0035] Among them, the first reaction kettle is connected with an extraction detection pipeline through a first valve. The extraction detection pipeline is sleeved with a first temperature control jacket for controlling the temperature of the liquid in the extraction detection pipeline. The extraction detection pipeline is connected to a detection container through a second valve. A second temperature control jacket for keeping the liquid in the detection container at a constant temperature is arranged outside the detection container. A first temperature sensor is arranged inside the detection container, and the detection container is filled with a first preset amount of acidic catalyst.

[0036] In this specific embodiment, the structural schematic diagram of the first reaction kettle can be as Figure 2 shown,Figure 2 Among them, 201 is the first reaction kettle, 202 is the first valve, 203 is the extraction and detection pipeline, 204 is the first temperature control jacket, 205 is the second valve, 206 is the detection container, and 207 is the second temperature control jacket.

[0037] With such a structure, the first reaction solution in the first reaction kettle can be extracted for effective real-time epoxy value detection.

[0038] In a specific application, step S1 includes:

[0039] Add bisphenol A and epichlorohydrin to the first reaction kettle according to a molar ratio of 1:12; according to the addition amounts of bisphenol A and epichlorohydrin, add a catalyst of 0.3% of the mass of bisphenol A to the first reaction kettle; introduce nitrogen into the first reaction kettle for protection, stir and heat up to 55 - 60 °C to dissolve bisphenol A; among them, the catalyst is tetramethylammonium chloride.

[0040] In step S2, in response to the complete dissolution of bisphenol A, add a sodium hydroxide solution with a first preset concentration dropwise to the first reaction kettle and heat for an alkalization and ring-closure reaction.

[0041] In a specific application, step S2 includes:

[0042] In response to the complete dissolution of bisphenol A, raise the temperature of the first reaction kettle to 60 - 70 °C and add half of the 20% sodium hydroxide solution for reaction; raise the temperature of the first reaction kettle to 85 - 90 °C and add the other half of the 20% sodium hydroxide solution for reaction.

[0043] It should be noted that adding the sodium hydroxide solution in two portions can make the reaction more complete, reduce other side reactions, and thus improve the yield rate of the main agent prepared.

[0044] In step S3, during the alkalization and ring-closure reaction, regularly open the first valve and the second valve, extract a second preset amount of the first reaction solution from the first reaction kettle to the detection container so that the first reaction solution reacts with the acidic catalyst to release heat; collect the first temperature rise in the detection container through the first temperature sensor, and obtain the epoxy value in the first reaction solution according to the relationship between the first temperature and the temperature-epoxy value function.

[0045] Among them, the first reaction solution maintains the temperature at a second temperature through the first temperature control jacket, the acidic catalyst is maintained at a third temperature through the second temperature control jacket, replace the acidic catalyst in the detection container before each extraction of the first reaction solution, and close the second temperature control jacket when the first reaction solution reacts with the acidic catalyst.

[0046] It should be noted that by maintaining both the first reaction solution and the acidic catalyst at the corresponding temperatures to reduce variables, the influence of the exothermic reaction between the first reaction solution and the acidic catalyst on the temperature increase can be obtained more intuitively. Replacing the acidic catalyst ensures more accurate test results each time. When the first reaction solution reacts with the acidic catalyst, the second temperature control jacket is closed to avoid the influence of the temperature change generated by the second temperature control jacket on the measured temperature.

[0047] In this specific embodiment, the steps for obtaining the temperature-epoxy value function relationship include:

[0048] Step S201: Obtain a second preset amount of a first reaction solution having a first epoxy value, and heat the first reaction solution having the first epoxy value to a second temperature; obtain a first preset amount of an acidic catalyst, and heat the acidic catalyst to a third temperature; wherein, the first epoxy value is known.

[0049] It should be noted that the first epoxy value being known can be measured by spectroscopy or titration. Although the present invention may utilize spectroscopy or titration, it will only be used when obtaining the temperature-epoxy value function relationship, while the prior art has been using it during the epoxy value detection process. Compared with directly using these two methods, the detection efficiency of the present invention is faster, greatly reducing the lag and ensuring that the measured epoxy value is not much different from the actual epoxy value.

[0050] Step S202: Add the first reaction solution having the first epoxy value to the acidic catalyst, and collect and record the increased first experimental temperature.

[0051] Step S203: Repeat Step S201 and Step S202 to obtain different epoxy values and their corresponding experimental temperatures; fit each epoxy value and its corresponding experimental temperature to obtain the temperature-epoxy value function relationship.

[0052] It should be noted that through this step of the present invention, the temperature-epoxy value function relationship can be effectively obtained. Furthermore, when it is known that the epoxy value is acidified to increase the temperature, the epoxy value can be known. At the same time, the amounts and temperatures in this step are the same as those during actual detection, which can ensure the reliability of the temperature-epoxy value function relationship.

[0053] Step S4: In response to the epoxy value in the first reaction solution reaching the preset requirement, wash, desalt, perform vacuum distillation, and filter the first reaction solution in sequence to obtain the main agent of the epoxy resin adhesive.

[0054] In a specific application, Step S4 includes:

[0055] In response to the epoxy value in the first reaction solution reaching the preset requirement, wash the first reaction solution with 80°C hot water 3 times, stir for 20 minutes each time, and discard the lower layer of brine after standing and separating layers;

[0056] Under a vacuum of -0.095 MPa, the first reaction solution after water washing and desalting is heated to 120 °C to remove epichlorohydrin, toluene and moisture;

[0057] The first reaction solution is filtered through a 5 μm filter element to obtain the main agent of the epoxy resin adhesive.

[0058] It should be noted that the specific application can effectively obtain the main agent of the epoxy resin adhesive with a qualified purity.

[0059] Step S5: Add a solvent, an amine catalyst, a polythiol, and an acrylate to the second reaction kettle according to a second preset ratio, and heat, reflux and stir for reaction;

[0060] Step S6: In response to the completion of the reaction in the second reaction kettle, obtain a second reaction solution; cool and distill the second reaction solution to obtain a curing agent for the epoxy resin adhesive.

[0061] Among them, the high-performance wood epoxy resin adhesive with room-temperature rapid curing includes the main agent of the epoxy resin adhesive and the curing agent of the epoxy resin adhesive.

[0062] It should be noted that the preparation of the main agent corresponding to steps S1-S4 and the curing agent corresponding to steps S5-S6 do not have a sequential relationship, and any one of them can be prepared first or both can be prepared simultaneously.

[0063] In this specific embodiment, the main agent of the epoxy resin adhesive and the curing agent of the epoxy resin adhesive are packaged in a moisture-proof double-chamber packaging bag according to a volume ratio of 2:1.

[0064] It should be noted that in the actual application process, the main agent of the epoxy resin adhesive and the curing agent of the epoxy resin adhesive are generally mixed according to a volume ratio of 2:1. Therefore, such packaging can avoid material waste.

[0065] Based on the above preparation method of the high-performance wood epoxy resin adhesive with room-temperature rapid curing, the embodiment of the present invention also provides a high-performance wood epoxy resin adhesive with room-temperature rapid curing, and the high-performance wood epoxy resin adhesive with room-temperature rapid curing is prepared according to the above preparation method of the high-performance wood epoxy resin adhesive with room-temperature rapid curing.

[0066] In an embodiment of the present invention, the first reactor is connected with a lead-out detection pipeline through a first valve. A first temperature control jacket for controlling the temperature of the liquid in the lead-out detection pipeline is sleeved outside the lead-out detection pipeline. The lead-out detection pipeline is connected to a detection container through a second valve. A second temperature control jacket for keeping the liquid in the detection container at a constant temperature is arranged outside the detection container. A first temperature sensor is arranged in the detection container, and the detection container is filled with a first preset amount of acidic catalyst. During the alkali-closed-loop reaction process, the first valve and the second valve are periodically opened, and a second preset amount of the first reaction solution is led out from the first reactor to the detection container, so that the first reaction solution reacts with the acidic catalyst to release heat. The increased first temperature in the detection container is collected by the first temperature sensor, and according to the relationship between the first temperature and the temperature-epoxy value function, the epoxy value in the first reaction solution is obtained. In this way, the epoxy value can be detected in real time in the embodiment of the present invention, so as to ensure that the alkali-closed-loop reaction does not occur under-reaction or over-reaction resulting in a decrease in the epoxy value, and further ensure that there are enough epoxy groups to carry out a curing reaction with the curing agent, thereby accelerating the curing efficiency.

[0067] For the epoxy value detection in the embodiment of the present invention, only the temperature needs to be detected. Compared with the existing titration technology and spectral detection technology, the embodiment of the present invention effectively improves the detection efficiency, greatly reduces the hysteresis, and makes the epoxy value detection result more credible.

[0068] In summary, the embodiment of the present invention can effectively accelerate the curing efficiency of the epoxy resin adhesive during use, so as to achieve rapid curing even at room temperature.

[0069] It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements not only includes those elements, but also includes other elements not expressly listed, or further includes elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "comprising an..." does not exclude the existence of additional identical elements in the process, method, article or device comprising the element.

[0070] Each embodiment in this specification is described in a related manner. The same or similar parts between the embodiments can be referred to each other, and the differences between each embodiment and other embodiments are emphasized. In particular, for the system embodiment, since it is basically similar to the method embodiment, the description is relatively simple, and the relevant parts can be referred to the partial description of the method embodiment.

[0071] The above are only the preferred embodiments of the present invention and are not intended to limit the protection scope of the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention are all included in the protection scope of the present invention.

Claims

1. A method for preparing a high-performance epoxy resin adhesive for wood that cures quickly at room temperature, characterized in that: The method comprises: Step S1, adding bisphenol A and epichlorohydrin into a first reactor according to a first preset ratio; adding a corresponding amount of catalyst into the first reactor according to the added amounts of the bisphenol A and the epichlorohydrin; introducing nitrogen into the first reactor for protection, stirring and heating to 55-60° C. to dissolve the bisphenol A; wherein the first reactor is connected to an outlet detection pipeline through a first valve, the outlet detection pipeline is externally connected with a first temperature control jacket for controlling the temperature of the liquid in the outlet detection pipeline, the outlet detection pipeline is connected to a detection container through a second valve, the outside of the detection container is provided with a second temperature control jacket for maintaining a constant temperature of the liquid in the detection container, a first temperature sensor is provided in the detection container, and the detection container is loaded with a first preset amount of acidic catalyst; Step S2, in response to the bisphenol A being completely dissolved, adding a sodium hydroxide solution of a first preset concentration into the first reaction kettle, and heating to perform an alkalization ring-closing reaction; Step S3, during the alkalization closed-loop reaction process, regularly opening the first valve and the second valve, and drawing a second preset amount of the first reaction solution from the first reactor to the detection container, so that the first reaction solution and the acidic catalyst react and release heat; collecting the first temperature increased in the detection container by a first temperature sensor, and obtaining the epoxy value in the first reaction solution according to the first temperature and the temperature-epoxy value function relationship; wherein the temperature of the first reaction solution is maintained at a second temperature by the first temperature-control jacket, and the acidic catalyst is maintained at a third temperature by the second temperature-control jacket, and the acidic catalyst in the detection container is replaced before drawing out the first reaction solution each time, and the second temperature-control jacket is closed when the first reaction solution and the acidic catalyst react; Step S4, in response to the epoxy value in the first reaction solution reaching a preset requirement, the first reaction solution is sequentially subjected to water washing, desalination, reduced pressure distillation and filtration to obtain an epoxy resin adhesive main agent; Step S5, adding a solvent, an amine catalyst, a polythiol, and an acrylate into the second reaction kettle according to a second preset ratio, heating under reflux and stirring to react; Step S6, in response to the completion of the reaction in the second reactor, a second reaction solution is obtained; the second reaction solution is cooled and distilled to obtain an epoxy resin adhesive curing agent; wherein the high-performance epoxy resin adhesive for wood that cures quickly at room temperature includes the epoxy resin adhesive main agent and the epoxy resin adhesive curing agent.

2. The method for preparing a high-performance epoxy resin adhesive for wood that cures quickly at room temperature according to claim 1, characterized in that: The step of obtaining the temperature-epoxy value function relationship comprises: Step S201, obtaining the second preset amount of the first reaction solution having the first epoxy value, and heating the first reaction solution having the first epoxy value to the second temperature; obtaining the first preset amount of the acidic catalyst, and heating the acidic catalyst to the third temperature; wherein the first epoxy value is known; Step S202, adding the first reaction solution having the first epoxy value to the acidic catalyst, and collecting and recording the increased first experimental temperature; Step S203, repeating step S201 and step S202 to obtain different epoxy values ​​and their corresponding experimental temperatures; fitting each epoxy value and its corresponding experimental temperature to obtain the temperature-epoxy value function relationship.

3. The method for preparing a high-performance epoxy resin adhesive for wood that cures quickly at room temperature according to claim 1, characterized in that: The step S1 comprises: Bisphenol A and epichlorohydrin are added to a first reaction kettle in a molar ratio of 1:12; according to the added amounts of the bisphenol A and the epichlorohydrin, a catalyst of 0.3% by mass of the bisphenol A is added to the first reaction kettle; nitrogen is introduced into the first reaction kettle for protection, and the mixture is stirred and heated to 55-60° C. to dissolve the bisphenol A; wherein the catalyst is tetramethylammonium chloride.

4. The method for preparing a high-performance epoxy resin adhesive for wood that cures quickly at room temperature according to claim 1, characterized in that: The step S2 comprises: In response to the complete dissolution of the bisphenol A, the first reaction kettle is heated to 60-70° C. and half of the 20% sodium hydroxide solution is added dropwise to carry out a reaction; the first reaction kettle is heated to 85-90° C. and the other half of the 20% sodium hydroxide solution is added dropwise to carry out a reaction.

5. The method for preparing a high-performance epoxy resin adhesive for wood that cures quickly at room temperature according to claim 1, characterized in that: The step S4 comprises: In response to the epoxy value in the first reaction solution reaching the preset requirement, washing the first reaction solution with 80° C. hot water for three times, stirring for 20 minutes each time, and discarding the lower salt water after standing and stratifying; The first reaction solution after washing and desalting was heated to 120° C. under a vacuum degree of −0.095 MPa to remove epichlorohydrin, toluene and water; The first reaction solution is filtered through a 5 μm filter element to obtain the epoxy resin adhesive main agent.

6. The method for preparing a high-performance epoxy resin adhesive for wood that cures quickly at room temperature according to claim 1, characterized in that: After step S6, the method further includes: The epoxy resin adhesive main agent and the epoxy resin adhesive curing agent are packed in a moisture-proof double-chamber packaging bag at a volume ratio of 2:

1.

7. A high-performance epoxy resin adhesive for wood that cures quickly at room temperature, characterized in that: The room temperature fast-curing high-performance epoxy resin adhesive for wood is prepared according to the preparation method of the room temperature fast-curing high-performance epoxy resin adhesive for wood according to claims 1-6.

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