Evaporation point source device

Abstract

According to the technical scheme, the evaporation point source device comprises a base plate, an evaporation point source device body and a point source assembly, the evaporation point source device body and the point source assembly are fixed in an evaporation device, the point source assembly is arranged on the upper surface of the base plate in a lifting mode, the point source assembly comprises a point source array, and the point source array comprises a plurality of point sources used for conducting evaporation treatment on a to-be-evaporated assembly. According to the evaporation point source device, the point source can be suitable for materials with more evaporation temperatures by changing the source-substrate distance TS, the optimal film thickness uniformity and film forming quality are obtained by adjusting the TS, the evaporation performance of the point source is optimal, and meanwhile the TS is properly adjusted to obtain the optimal material utilization rate.

Description

Technical Field

[0001] The present invention relates to the technical field of evaporation coating equipment, and particularly relates to an evaporation coating point source device. Background Art

[0002] In existing evaporation coating equipment, when using a point-type evaporation source for evaporation coating, a single point source or several point sources are used and directly fixed on the cavity. The distance between the evaporation source and the substrate, that is, the source-substrate distance TS, is not adjustable.

[0003] As an advanced thin film preparation equipment, the perovskite evaporation coater has a wide range of applications in the field of solar thin film batteries. The main principle of the perovskite evaporation coater is vacuum evaporation coating technology. In a vacuum environment, the perovskite material is heated to a vaporized state by an evaporation source and then deposited on a substrate to form a thin film. In this process, it is crucial to precisely control parameters such as the evaporation temperature, deposition rate, and substrate temperature, which can ensure the quality and performance of the thin film. The thin film prepared by the perovskite evaporation coater can improve the conversion efficiency of solar cells, reduce costs, and promote the sustainable development of the photovoltaic industry. The evaporation source is the core device of the perovskite evaporation coater, and currently, the point-type evaporation source is widely used in the perovskite industry.

[0004] In existing evaporation coating equipment using a point-type evaporation source, the point source is directly fixed on the cavity, and the source-substrate distance TS is not adjustable. In fact, the source-substrate distance is related to multiple parameters such as the material utilization rate and film formation quality of the evaporation coating. It should be noted that in the evaporation coating equipment, the substrate is horizontally conveyed, and due to mechanical structure limitations, the height of the substrate is generally not adjustable. For evaporation coating, the emission of the evaporation coating material is isotropic. Through a shielding device on the point source, such as a baffle, the evaporation coating material is emitted within a certain conical region and reaches the substrate to be evaporated coated. As Figure 1As shown, the height of the substrate is fixed, the height of the point source varies up and down, and the coating area is also different at each TS position. When the source-substrate distance is relatively large, the material utilization rate is low because more materials will fall into the space outside the substrate. However, the coating area covers a wider range, and the evaporated material molecules will fly and mix evenly in a larger space, which is beneficial to improving the film thickness uniformity, especially when multiple materials are co-evaporated. And some materials require a very high evaporation temperature. For example, the evaporation temperature of Ag is above 1200 °C. At this time, a larger TS is required to prevent the temperature of the film formed on the substrate from being too high, which is beneficial to the growth of the film layer. When the source-substrate distance is small, the material utilization rate will be improved to a certain extent. At the same time, since the coating area is more concentrated on the substrate area, more materials received by the substrate come from the periphery of the center of the coating area. When the material molecules reach the substrate, they have greater kinetic energy, so they can bind more firmly to the substrate surface, improving the film-substrate adhesion. However, the time for the particles to fly and mix in the space is shorter, and the difference in the number of molecules corresponding to different regions on the substrate is also greater, which may cause the film thickness uniformity after reaching the substrate to decrease. However, the case of a smaller TS is more suitable for materials with a low evaporation temperature, such as C60, whose evaporation temperature is about 600 °C.

[0005] The prior art directly fixes the point source on the cavity, and the source-substrate distance is not adjustable. This results in that each point source can only be suitable for a specific several evaporation materials. If other evaporation materials are replaced, there may be a situation where the source-substrate distance does not match the material, because different materials may require different source-substrate distances. For example, if the evaporation temperature of the new material changes, the film thickness uniformity needs to be adjusted, or if you want to improve the material utilization rate, then this fixed TS setting cannot meet the process requirements. Summary of the Invention

[0006] In order to improve the film formation quality and material utilization rate of the evaporation equipment, the present application provides an evaporation point source device with an adjustable source-substrate distance.

[0007] The technical solution of the present invention provides an evaporation point source device, including: A substrate for fixing the evaporation point source device within the evaporation setting, A point source component, the point source component is arranged to be lifted and lowered on the upper surface of the substrate, the point source component includes a point source array, and the point source array includes a plurality of point sources for performing evaporation treatment on the component to be evaporated.

[0008] Preferably, it further includes a lifting mechanism for driving the lifting of the point source component.

[0009] Preferably, the lifting mechanism includes a plurality of guiding components and a plurality of driving components fixedly arranged on the upper surface of the substrate; the point source component is driven by the driving component to move linearly on the guiding component to realize lifting.

[0010] Preferably, a plurality of guide shafts are distributed within the projection of the point source assembly on the substrate, and at least one ball screw drives the point source assembly to move up and down; Preferably, a plurality of guide shafts and a plurality of ball screws are distributed within the projection of the point source assembly on the substrate, and any one guide shaft and the ball screw are arranged in a group and dispersed.

[0011] Preferably, the ball screw is driven by a drive shaft via a synchronous belt, and the synchronous belt is tensioned by a tension pulley with an adjustable position; Or, the ball screw is driven by a central shaft via a chain, and the chain is tensioned by a sprocket with an adjustable position.

[0012] Preferably, the drive assembly is connected to an external power source via a transmission shaft having a plurality of couplings, and the transmission shaft is sealed by a magnetic fluid seal.

[0013] Preferably, the position of the point source on the point source array is adjustable, and the point source is arranged on a moving mechanism of the point source array.

[0014] Preferably, the moving mechanism includes a stacked adjustment plate and a sliding plate. The adjustment plate and the sliding plate can rotate relative to each other around a common axis to achieve mutual dislocation in the circumferential direction; First grooves and second grooves are respectively arranged in groups on the adjustment plate and the sliding plate; Both the first grooves and the second grooves extend radially towards the edge, and the first grooves and the second grooves within the group arranged in groups are staggered at an angle; The point source is slidably arranged in both the first grooves and the second grooves at the same time and is positioned at the intersection of the first grooves and the second grooves.

[0015] Preferably, the cooperation between the lifting mechanism and the moving mechanism enables the total emission area to remain unchanged during evaporation of multiple point sources; Or, the lifting amount of the point source assembly and the change amount of the radial distance from the point source to the common axis satisfy where is the emission angle of the point source.

[0016] Preferably, the position of the point source on the point source array is adjustable, and the point source is arranged on a moving mechanism of the point source array; The moving mechanism includes a moving structure one on both sides and a moving structure two in the middle. There are three point sources one installed on the moving structure one on both sides of the device, and three point sources two installed on the moving structure two in the middle; The moving structure includes a first mounting plate, a linear guide rail, and a screw mechanism. The two sides below the first mounting plate are fixed on the sliders of the linear guide rail. The linear guide rail is fixed on the lifting plate. Stoppers are provided at both ends of the linear guide rail, corresponding to the initial position and the final position of the slider movement respectively, to limit the stroke of the slider movement.

[0017] The second moving structure mainly includes a second mounting plate. The second mounting plate is directly fixed on the lifting plate and has long holes at both ends. The size and position of the long holes are consistent with those of the first mounting plate. The middle point source of the second point source is directly fixed on the second mounting plate, and the two side point sources are connected to the second mounting plate through the long holes. The moving mode of the two side point sources is the same as that of the first point source.

[0018] The evaporation point source device of the present application can make the point source applicable to more materials with evaporation temperatures by changing the source-substrate distance TS, obtain the best film thickness uniformity and film formation quality by adjusting TS, make the evaporation performance of the point source optimal, and at the same time appropriately adjust TS to obtain the best material utilization rate. Description of the Drawings

[0019] Figure 1 is a schematic diagram of the prior art of the present invention; Figure 2 is a schematic diagram of the overall structure of the evaporation point source device of the present invention; Figure 3 is a schematic diagram of the lifting structure of the point source component S2; Figure 4 、 14 -16 are schematic diagrams of the embodiments of the lifting structure of the point source component S2; Figure 5 is a schematic diagram of the installation of the evaporation point source device; Figure 6 is a schematic diagram of the point source component S2; Figure 7 is a schematic diagram of the moving mechanism S22; Figure 8 is a schematic diagram of the motion matching of the point source component S2; Figure 9 and Figure 10 is a schematic diagram of the matching of the emission angle with the point source component TS and the radial position; Figures 11-13 is a schematic diagram of the moving mechanism S22; Figure 17 is a schematic diagram after the point source component S2 in the evaporation point source device moves.

[0020] In the figure: 11: Cavity bottom plate; 12: Base; 121: Ball screw assembly; 122: Guide shaft assembly; 123: Sprocket; 124: Upper mounting plate; 127: Bottom mounting plate; 13: Tension pulley assembly; 133: Central shaft; 14: Driving wheel; 15: Chain; 16: Motor assembly; 17: Lifting plate; 2: Moving structure 1; 21: Mounting plate 1; 211: Flap; 22: Linear guide; 221: Stop block; 23: Screw mechanism; 231: Base 1; 233: Base 2; 234: Positioning clip; 3: Moving structure 2; 31: Mounting plate 2; 41: Point source 1; 42: Point source 2; S1: Substrate; S2: Point source assembly; S21: Point source array; S211: Point source; S22: Moving mechanism; S221: Adjusting plate; S2211: First groove; S222: Sliding plate; S2221: Second groove; S3: Lifting mechanism; S31: Guide component; S311: Guide shaft; S32: Driving component; S321: Ball screw; S322: Driving shaft; S323: Timing belt; S324: Tension pulley; S9: Base; S91: First coupling; S92: Magnetic fluid seal; S93: Second coupling; S94: Reducer; S95: Motor; SW: Component to be vapor-deposited. Detailed implementation mode

[0021] The following combines the drawings and specific embodiments to elaborate on the type of this patent in detail. In this specification, the dimensions of the drawings do not represent the actual size ratio. The drawings are only used to reflect the relative positional relationship and connection relationship between components. Components with the same name or the same reference numeral represent similar or identical structures, and are for illustrative purposes only. When the term "several" is used in this application, it is defaulted to refer to an indefinite quantity, usually understood to be at least one.

[0022] Figure 2 It is a schematic diagram of the overall structure of the vapor deposition point source device of the present application. It includes a substrate S1 and a point source assembly S2 that is lifted and lowered on the upper surface of the substrate S1. The substrate S1 is conveyed on the inner platform of the vapor deposition equipment as described in the background technology, and its upper surface is used to place the point source for evaporation. The lifting and lowering setting means lifting and lowering along the normal direction of the upper surface. In an actual vapor deposition equipment, this is also the direction away from or close to the component to be vapor-deposited W. More likely, depending on the installation direction of the equipment, it may also be the direction of gravity. The reason for lifting and lowering the point source assembly S2 is to adjust the distance between the point source assembly S2 and the component to be vapor-deposited W, that is, the source-substrate distance TS. Thus, by adjusting the source-substrate distance TS, quality control in aspects such as film formation uniformity and film formation adhesion can be achieved for different materials or different requirements. Another advantage is that the control of the effective film formation area during vapor deposition can be achieved by adjusting the source-substrate distance TS, so that the effective film formation area better matches the area to be film-formed of the component to be vapor-deposited W, improving the utilization rate of the vapor deposition material.

[0023] Figure 3 It is a schematic diagram of the lifting structure of the point source component S2. The evaporation point source device further includes a lifting mechanism S3 for driving the point source component S2. The lifting mechanism S3 includes a plurality of guiding components S31 fixedly arranged on the upper surface of the substrate S1 and a plurality of driving components S32. The point source component S2 is driven by the driving component S32 to move linearly on the guiding member S31 to achieve lifting. Specifically in the embodiment, a plurality of guiding shafts S311 can be relatively dispersed within the projection of the point source component S2 in the substrate S1, and it is particularly suitable to be arranged almost evenly as the guiding components S31, and at least one ball screw S321 is arranged to drive the lifting of the point source component S2. The ball screw S321 can be driven by a driving shaft S322. When only one ball screw S321 is arranged, preferably the ball screw S321 is arranged at or near the area center of the projection of the point source component S2 on the substrate S1. Figure 3 In the embodiment of, a technical solution of the guiding shaft S311 and the ball screw S321 being arranged in groups is given. Any guiding shaft S311 and the ball screw S321 are arranged in groups and dispersed one by one, and all the ball screws S321 are synchronously driven by a unified driving shaft S322 to achieve the stable lifting of the point source component S2. The figure shows a transmission scheme, which is realized by a synchronous belt S323, and the tension of the synchronous belt S323 is ensured by a tension pulley S324 with an adjustable position.

[0024] The transmission system can also be a transmission mechanism composed of a chain and sprockets. Such as Figure 4 , Figures 14-15 In the embodiment of, the TS lifting mechanism includes a cavity bottom plate 11, a base 12, a tension pulley assembly 13, a driving wheel 14, a chain 15, a motor assembly 16 and a lifting plate 17. The cavity bottom plate 11 is horizontally placed, and the vacuum environment and the atmospheric environment are respectively above and below it. Four bases 12 are installed on the cavity bottom plate 11. The base 12 includes a ball screw assembly 121, a guiding shaft assembly 122, a sprocket 123, an upper mounting plate 124 and a bottom mounting plate 127. A flange 125 is also installed on the guiding shaft 122, and a linear bearing 126 is arranged in the flange 125. The linear bearing 126 and the guiding shaft 122 cooperate for lifting. A key is arranged between the sprocket 123 and the ball screw 121, and the two can rotate synchronously. The upper mounting plate 124 is used to install and fix the guiding shaft and the ball screw, and the bottom mounting plate 127 is connected to the cavity bottom plate 11. Three-direction tension sprocket 13 assemblies and a fourth-direction driving sprocket 14 assembly are also arranged. The sprockets 123 of the bases 12, the tension sprockets 13 and the driving sprocket 14 are connected in series by a chain 15. The tension pulley 13 assembly includes a mounting plate 131, a sprocket 132 and a central shaft 133. The mounting plate 131 and the cavity bottom plate 11 can be connected by screws or other connection methods. In this application, it is preferably connected by screws. The mounting holes of the mounting plate 131 are long holes, so that the position of the tension pulley 13 assembly can be moved to adjust the tension degree of the chain 15.

[0025] Figure 5 It is a schematic installation diagram of an evaporation point source device. The evaporation point source device is arranged on the base S9 of the evaporation equipment and is connected to the power assembly of an external speed reducer S94 and a motor S95 through a transmission shaft with a number of couplings. The transmission shaft realizes the internal and external sealing of the base S9 through a magnetic fluid seal S92. The couplings are the first coupling S91 and the second coupling S93 in the figure.

[0026] To more clearly show the internal structure, the power sprocket 14 assembly is shown in the form of a Figure 4 sectional view. The power sprocket 14 assembly is fixed on the cavity bottom plate 11. The central axis 141 of the assembly is fixed up and down by means of bearings and retaining rings. The sprocket 142 is fixed in the middle position. A key is arranged between the sprocket 142 and the central axis 141 so that the sprocket and the central axis can rotate synchronously. The bottom of the central axis 141 is connected to the magnetic fluid seal 164 through a coupling 165. The magnetic fluid part 164 is connected to the cavity bottom plate at the flange surface on the atmosphere side, and there is an O-ring in the middle to ensure vacuum sealing. The shaft end of the magnetic fluid on the atmosphere side is connected to the speed reducer 162 and the servo motor 161 through a coupling 163. The four sides of the lifting plate 17 are fixed on the nut of the ball screw and the flange 125 of the guide shaft. Driven by the power input from the servo motor 161, the power sprocket 142 rotates, and the torque is transmitted by the chain 15. The ball screw 121 is driven to rotate by the sprockets 123 at the four corners, so as to lift and lower the lifting plate 17 in the vertical direction. The stroke of the ball screw is related to the adjustment range of TS. After the adjustment range is determined, a corresponding screw stroke can be adapted.

[0027] The servo motor connection control system can control the rotation direction and number of turns of the servo motor. The point source array is at the lowest position, and the distance TS between it and the substrate is also the largest. During evaporation coating, when it is necessary to adjust TS, for example, if TS needs to be reduced by M, that is, the height of the point source array rises by M, and the lead of the ball screw is P, then the ball screw needs to rotate M / P turns in the direction of spiral ascent. Assuming the speed ratio of the reduction gear is A, the motor needs to rotate forward by MA / P turns; when TS increases, just reverse the direction. In the control system, the lowest position of the point source array is set as the zero position, that is, the initial position. For the convenience of adjustment, the input parameter of the control system is set as the TS value. Assuming the TS at the initial position is 500mm and the real-time position display is 450mm, it means that TS has decreased by 50mm compared with the initial position. At this time, if it is necessary to lower the height of the point source by 20mm, that is, TS increases by 20, then the input parameter is set as 470, and the control system automatically reverses the motor by (470 - 450)A / P turns; if it is necessary to raise the height of the point source by 30mm, that is, TS decreases by 30, then the input parameter is set as 420, and the control system automatically rotates the motor forward by (450 - 420)A / P turns to complete the operation of adjusting the TS value. The control system displays the TS value in real time and can be adjusted at any time during the process.

[0028] As Figure 6 shown, preferably in the present application, a point source array 21 having not less than two point sources 211 is provided on the point source component 2 to implement the evaporation coating process for the large-area component W to be evaporated coated. The point source array 21 is arranged on the upper surface of the point source component 2 and has a plurality of point sources 211 arranged on one side of the upper surface of the point source component 2. The evaporation openings of the point sources 211 face the component W to be evaporated coated and emit materials during operation. The point sources 211 are preferably arrayed regularly on the upper surface of the point source component 2 facing the component W to be evaporated coated, such as a circular array, a rectangular array, or other arrangements. Through the distribution of the plurality of point sources 211, the evaporation coating operation for the large-size component W to be evaporated coated can be realized. In some cases, a reasonable arrangement spacing of the point sources 211 combined with a suitable source-substrate distance TS can achieve the optimal material utilization rate.

[0029] Obviously, in many cases, it is insufficient to change the source-substrate distance TS only by changing the height position of the point source component 2. Changing the source-substrate distance not only affects the film layer uniformity and film formation quality, but also affects the actual film formation area and thus affects the material utilization rate. For this reason, the point source array 21 has a function of adjusting the spacing between the point sources 211, which is realized by the moving mechanism 22.

[0030] Figure 7Schematic diagram of the moving mechanism S22. It is preferably applicable to the annular array solution. Specifically, it includes two stacked adjustment plates S221 and a sliding plate S222. The adjustment plate S221 and the sliding plate S222 can rotate relative to each other around a common axis to achieve circumferential relative displacement between the adjustment plate S221 and the sliding plate S222. First grooves S2211 and second grooves S2221 are respectively arranged in groups on the adjustment plate S221 and the sliding plate S222. As shown in the figure, the second grooves S2221 are arranged on the sliding plate S222, and the first grooves S2211 are arranged on the adjustment plate S221. Both the first grooves S2211 and the second grooves S2221 extend radially from the lateral edge of the plate, which naturally excludes the case of strictly circumferential concentric circular arcs. At this time, during displacement, the change in the radial position of the point source S211 cannot be achieved. The first grooves S2211 and the second grooves S2221 within the group arranged in groups are angularly staggered. The point source S211 is slidably arranged in both the first grooves S2211 and the second grooves S2221 at the same time. In the height direction, the point source S211 generally clamps the adjustment plate S221 or the sliding plate S222 through the flange provided thereon to limit the height and maintain the direction of the point source S211. When the adjustment plate S221 and the sliding plate S222 are displaced, the first grooves S2211 and the second grooves S2221 rotate relative to each other, changing the radial distance of their intersection from the common axis. The point source S211 slides in both the first grooves S2211 and the second grooves S2221 at the same time, so it can only be positioned at the intersection, and at the same time, the radial distance of the point source S211 is changed. That is, the purpose of pitch adjustment is achieved.

[0031] In the preferred solution, the rotation of the moving mechanism S22 is linked with the lifting of the lifting mechanism S3 to always maintain the optimal pitch of the point source array S21. In a specific embodiment, in addition to driving the drive shaft S322, the drive assembly S32 also synchronously drives the relative rotation between the adjustment plate S221 and the sliding plate S222. Taking the sliding plate S222 fixed on the point source assembly S2 as an example, at this time, the adjustment plate S221 is rotatably arranged around the common axis, and the drive shaft S322 drives the adjustment plate S221 to rotate through a set of transmission systems to match the radial movement of the point source S211 with the lifting of the point source assembly S2. As Figure 8 shown, it is a specific matching schematic diagram. The cooperation between the lifting mechanism S3 and the moving mechanism S22 ensures that the coating area during evaporation of multiple point sources S211 remains unchanged. Specifically, while lifting the point source assembly S2, it changes the radial position of the point source S211 so that the emission range of the evaporation material remains basically unchanged at the position of the component to be evaporated SW. In short, ensuring the lifting amount of the point source assembly S2 and the change amount of the radial distance of the point source S211 from the common axis meet , where is the emission angle of the point source S211. Here, in practical applications, the connection between the transmission system and the adjustment plate S221 is adjustable. Before evaporation coating, according to the area of the component SW to be evaporated coated, the adjustment plate S221 can be locked at a suitable position with the transmission system, so that the coverage area at this time is optimal, for example, covering the component SW to be evaporated coated, to obtain the initial setting of the adjustment system. Then during the evaporation coating process, the coverage area can be maintained unchanged all the time when adjusting the point source component S2.

[0032] The emission angle of the point source S211 is determined by the opening angle of the nozzle inside the point source S211. Obviously, the emission angle is mainly related to the evaporation range of the material. Within a certain angle range, the two are positively correlated. The emission angle determines the running trajectory and distribution range of the particles after flying out by affecting the evaporation range, all of which are closely related to the film thickness uniformity and material utilization rate. When TS remains unchanged, when the emission angle is larger, the material distribution range is larger, the mixing is more uniform, and the film thickness uniformity after reaching the substrate is better, but because the spatial distribution is more dispersed, the material utilization rate will decrease; when the emission angle is smaller, the result is just the opposite. However, when TS changes, the relationship between the emission angle and the film thickness uniformity and material utilization rate is no longer a simple correlation, but becomes a dynamic change relationship. Therefore, with a suitable emission angle, and matching a suitable point source component TS and radial position, the optimal film thickness uniformity and material utilization rate results can be obtained under a specific substrate size. Figure 8 The situation where the emission angle of the point source remains unchanged is shown. Then the emission angle can also become larger or smaller. Figure 9 and Figure 10 is the adjustment situation when the evaporation coating area remains unchanged while the emission angle changes. As Figure 9 shown, only by adjusting the TS of the point source can evaporation coating with a variety of different emission angles be matched. As Figure 10 shown, only by adjusting the radial position of the point source can evaporation coating with a variety of different emission angles be matched. In other cases, it may be necessary to adjust the TS and radial position simultaneously, which will not be elaborated here. So after the substrate size is determined, the evaporation coating range is immediately determined. Then, according to the change of the emission angle, the TS or radial position of the point source component can be adjusted in real time to obtain the optimal film thickness uniformity and material utilization rate on the premise of keeping the evaporation coating range unchanged.

[0033] The moving mechanism S22 can also be adjusted manually. Figures 11-13 An embodiment of the moving mechanism s22, the moving mechanism s22 includes the moving structure one 2 on both sides and the moving structure two 3 in the middle. There are 3 point sources one 41 installed on the moving structure one 2 on both sides of the device, and 3 point sources two 42 installed on the moving structure two 3 in the middle. Figure 11 、 12 can be defined as the initial positions of the moving structure one 2 and the moving structure two 3 in the middle. Figure 13The direction indicated by the arrow is the movement direction of the first moving structure 2 and the middle moving structure 3. The moving structure 2 includes a first mounting plate 21, a linear guide rail 22, and a screw mechanism 23. Both sides below the first mounting plate 21 are fixed on the sliders of the linear guide rail 22, and the linear guide rail 22 is fixed on the lifting plate 17. Stoppers 221 are provided at both ends of the linear guide rail, corresponding to the initial position and the final position of the slider movement respectively, to limit the stroke of the slider movement. The screw mechanism 23 includes a central screw 231, the first bases 232 and 233 on both sides, and a positioning clip 234. There is a section of smooth rod at the bottom of the screw 231, and the length of the smooth rod exceeds the first base 232. The first base 232 is fixed on the lifting plate 17, and a bearing is provided inside the first base 232. The bearing cooperates with the smooth rod of the screw 231 to support the rotation of the screw. The positioning clip 234 is used to clamp between the smooth rod end of the screw 231 and the first base 232. After clamping, the screw 231 can no longer rotate, playing a limiting role on the first mounting plate 21. The second base 233 is fixed on the first mounting plate 21, and there is a through threaded hole on the second base 233, which cooperates with the screw 231. Manually rotating the smooth rod ends of the two screw mechanisms 23 can drive the first mounting plate 21 to move, so as to realize the overall displacement of the two side point sources 41 in the Y-axis direction. After moving to the appropriate position, use the positioning clip 234 to clamp to ensure that the first mounting plate 21 can no longer move.

[0034] Scale lines are provided at the middle positions on both sides of the lifting plate 17, and a baffle 211 is provided at the middle position of the first mounting plate 21 for aligning with the scale lines, so that the moving distance of the first mounting plate 21 is controllable. The spacing of the scale lines is determined according to actual needs, and can be set to one every 5 mm, one every 10 mm, etc. The middle point source of the first point source 41 is directly fixed on the first mounting plate 21. Long holes are provided on both sides of the first mounting plate 21, and are flange-connected to the two side point sources 41 through the long holes, and the point source 41 can be fixed with bolts. Figure 9 The position shown is where the flange of the first point source 41 and one end of the long hole are fixed, which can be defined as the initial position. When the position of the point source needs to be moved, loosen the bolt, move to the corresponding position, and then lock the bolt. Scale lines are provided on both sides of the first mounting plate 21, and a single position line is provided on the point source flange for aligning with the scale lines on the first mounting plate 21, so that the moving distance of the two side point sources 41 is controllable. The spacing of the scale lines is determined according to actual needs, and can be set to one every 5 mm, one every 10 mm, etc.

[0035] The moving structure two 3 mainly includes the mounting plate two 31. The mounting plate two 31 is directly fixed on the lifting plate 17, with long holes opened at both ends. The size and position of the long holes are consistent with those of the mounting plate one 21. The middle point source of the point source two 42 is directly fixed on the mounting plate two 31, and the two side point sources are connected to the mounting plate two 31 through the long holes. The moving mode of the two side point sources is the same as that of the point source one 41. Scale lines are also arranged on both sides of the mounting plate two 31, and the position and spacing of the scale lines are consistent with those of the mounting plate one 21. Through the cooperation of the long holes, scale lines on the mounting plate one 21 and the mounting plate two 31, and the point source one 41 and the point source two 42, the displacement of the point source position in the X-axis direction is realized.

[0036] Figure 13 The directions of the X-axis and Y-axis are indicated in . When the horizontal position of the point source needs to be adjusted, first confirm the displacement amounts required in the X-axis and Y-axis directions. For example, if it is required to increase the point source spacing in the X-axis by 100 mm and in the Y-axis by 200 mm, then in the X-axis direction, it is achieved by directly moving the position of the point source, with each side moving 50 mm. In the Y-axis direction, by manually rotating the screw 231, the two mounting plates one 21 on both sides each run a displacement of 100 mm, and the requirement for position adjustment can be achieved. The running direction of the substrate is usually such that the short side is parallel to the Y-axis direction and the long side is parallel to the X-axis direction. The spacing in the X-axis direction is usually related to the evaporation opening area, and the size of the opening area is related to the length of the substrate. The longer the substrate, the generally larger the required opening area. By changing the spacing in the X-axis direction, the point source array can be adapted to substrates of different lengths. For example, the initial spacing is 300 mm, which can be used for evaporating a substrate with a length of 400 mm. When it is increased to 400 mm, it can be used for substrates with lengths of 500 mm or even 600 mm. The spacing in the Y-axis direction is related to the width of the substrate. The wider the substrate, the larger the required spacing. By changing the spacing in the Y-axis direction, the point source array can be adapted to substrates of different widths. For example, the initial spacing is 400 mm, which can be used for evaporating substrates with widths of 350 - 400 mm. When it is increased to 600 mm, it can be used for substrates with widths of 550 - 600 mm. By changing the spacing in the X-axis and Y-axis directions, the point source array can be adapted to substrates of different sizes, greatly enhancing the practicability of the evaporation equipment.

[0037] In this application, through moving components such as linear guides and screw mechanisms, the horizontal positions of all point sources can be moved. These moving components are installed on the lifting plate, thereby realizing that while the point source array TS is adjustable, the size of the array square can be changed. This structure can achieve large-area co-evaporation of multiple materials, can be applicable to coating substrates of various sizes. At the same time, the TS of the point source array is adjustable, enabling the evaporation equipment to be applicable to more types of materials. By adjusting the TS, the best film thickness uniformity can be obtained, and at the same time, the TS can be appropriately reduced to obtain the best material utilization rate.

[0038] The present application provides a point source array with adjustable TS, and the horizontal position of the point source is also adjustable. Compared with the existing single point source or array with fixed TS, it can be applied to large-area co-evaporation of various materials. By changing the square size of the array, it can be applied to substrates of various sizes; by adjusting the height of TS, the point source array can be applied to more types of materials, and the best film thickness uniformity can be obtained by adjusting TS. At the same time, the number of TS is appropriately reduced to obtain the best material utilization rate.

[0039] Figure 16 It is a schematic diagram after the point source component S2 in the evaporation point source device moves. Compared with the initial position, the height of the lifting plate 17 rises, driving the height of the entire upper point source component to rise. Horizontally, the positions of each point source expand outward in the X-axis or Y-axis direction. The present application only describes a 3x3 style point source array, but the square form can be changed and can be changed into arrays of styles such as 3x2 and 4x3 according to actual needs. The materials evaporated by each point source can be matched according to process requirements, and co-evaporation of various materials can be realized. The common point source capacities are 50cc, 200cc, and even 500cc and above. For point sources with different capacities, their flange sizes are different, and the installation dimensions and related features can be adapted according to the flange size of the point source, so as to meet the installation of point sources with various capacities.

[0040] PbI2, CsBr, C60, and Ag are several commonly used evaporation materials in the perovskite industry, and their evaporation temperatures are 450°C, 500°C, 600°C, and 1200°C respectively. For materials with different evaporation temperatures, the TS they are adapted to is usually different. Then, through this point source device with adjustable TS, the TS of various materials can be compatible, and only the corresponding low-temperature point source and high-temperature point source need to be replaced, avoiding the need to re-develop new evaporation equipment. Moreover, by using only a single point source in the array, or a certain row or column of point sources, the requirements for single-material evaporation can also be met, such as materials like C60 and Ag that need to be evaporated separately. In the perovskite industry, several materials such as PbI2, CsBr, and PbBr usually need to be co-evaporated into a film to form a perovskite absorption layer. Then, a point source array can be used to fill these materials in different point sources and form a perovskite layer through co-evaporation.

[0041] Whether it is single-material evaporation or co-evaporation of multiple materials, the evaporation performance of the point source array can be optimized by adjusting the TS. During evaporation, assume that the initial TS value is set to 500, and then keep the evaporation rate of each point source unchanged. Adjust the TS up and down, for example, in the range of 500±50. After each adjustment to a certain value, record film layer parameters such as film thickness uniformity, film-substrate adhesion, and material utilization rate, so as to find the highest material utilization rate and the best film thickness uniformity through the most suitable TS at a specific evaporation rate. It is also possible to change the evaporation rate at different TS values and record a series of film layer parameters in the same way, so as to find the best film layer parameters through the most suitable evaporation rate at a specific TS. Store the obtained data in the control system. When evaporating the same material later, the TS can be directly set to the optimal position corresponding to the evaporation rate or the evaporation rate can be set to the optimal value corresponding to the TS to achieve the optimized evaporation result. Through the above operations, it can be found that the two important properties of TS and evaporation rate have an impact on the evaporated film layer parameters. When developing new evaporation equipment later, the obtained data can be used as a basis, which is beneficial to shortening the development cycle and reducing the development cost.

[0042] Innovative points of this application: 1. Through a large-area point source array, large-area co-evaporation of multiple materials can be achieved; 2. Through the combination of a series of components such as motors, sprockets, chains, and ball screws, continuous adjustment of the TS of the point source array is realized; 3. The horizontal positions of all point sources are adjustable. By changing the size of the square array, the point source array can be used for evaporation on substrates of various sizes; 4. By adjusting the TS of the point source array, it can be applied to more types of evaporation materials, improving practicability, reducing the cost of re-development, and obtaining the best film thickness uniformity and film formation quality by adjusting the TS, while appropriately reducing the TS to obtain the best material utilization rate.

[0043] The above content is only a description of the preferred implementation modes of this patent type and does not limit the scope of this patent type. Without departing from the design spirit of this patent type, various deformations and improvements made by those of ordinary skill in the art to the technical solutions of this patent type shall fall within the protection scope determined by the claims of this patent type.

Claims

1. A vapor deposition point source device, characterized in that: include: The substrate (S1) is used to fix the evaporation point source device in the evaporation device. A point source component (S2) is arranged to be lifted and lowered on the upper surface of the substrate (S1), and the point source component (S2) includes a point source array (S21), and the point source array (S21) includes a plurality of point sources (S211) for performing vapor deposition on the vapor deposition component (SW).

2. The evaporation point source device according to claim 1, characterized in that: It also includes a lifting mechanism (S3), and the lifting mechanism (S3) is used to drive the point source component (S2) to rise and fall.

3. The evaporation point source device according to claim 2, characterized in that: The lifting mechanism (S3) comprises a plurality of guide components (S31) and a plurality of drive components (S32) fixed on the upper surface of the base plate (S1); the point source component (S2) is driven by the drive component (S32) to move linearly on the guide component (S31) to achieve lifting.

4. The evaporation point source device according to claim 3, characterized in that: A plurality of guide shafts (S311) are distributed within the projection of the point source component (S2) within the substrate (S1), and at least one ball screw (S321) drives the point source component (S2) to rise and fall.

5. The evaporation point source device according to claim 3, characterized in that: A plurality of guide shafts (S311) and a plurality of ball screws (S321) are distributed within the projection of the point source component (S2) within the substrate (S1), and any guide shaft (S311) and ball screw (S321) are dispersedly arranged in groups one by one.

6. The evaporation point source device according to claim 3, characterized in that: The ball screw (S321) is driven by a driving shaft (S322) via a synchronous belt (S323), and the synchronous belt (S323) is tensioned via a tensioning wheel (S324) with an adjustable position; Or, the ball screw (S321) is driven by the central shaft (133) via 15, and the chain (15) is tensioned via a sprocket (123) with an adjustable position; Alternatively, the driving assembly (S32) is connected to an external power source via a transmission shaft having a plurality of couplings, and the transmission shaft is sealed by a magnetic fluid seal (S92).

7. The evaporation point source device according to any one of claims 1 to 6, characterized in that: The position of the point source (S211) on the point source array (S21) is adjustable, and the point source (S211) is arranged on a moving mechanism (S22) of the point source array (S21).

8. The evaporation point source device according to claim 7, characterized in that: The moving mechanism (S22) comprises a stacked adjustment plate (S221) and a sliding plate (S222), wherein the adjustment plate (S221) and the sliding plate (S222) can rotate relative to each other around a common axis to achieve mutual displacement in the circumferential direction; The first groove (S2211) and the second groove (S2221) are respectively arranged in groups on the adjustment plate (S221) and the sliding plate (S222); The first groove (S2211) and the second groove (S2221) both extend radially toward the edge, and the first grooves (S2211) and the second grooves (S2221) in the group are staggered at an angle; The point source (S211) is slidingly arranged in the first groove (S2211) and the second groove (S2221) at the same time, and is positioned at the intersection of the first groove (S2211) and the second groove (S2221).

9. The evaporation point source device according to claim 8, characterized in that: The cooperation between the lifting mechanism (S3) and the moving mechanism (S22) ensures that the total emission area of ​​the multiple point sources (S211) remains unchanged during evaporation; Or, the lifting amount of the point source component (S2) The change in the radial distance from the point source (S211) to the common axis Satisfaction between ,in is the emission angle of the point source (S211).

10. The evaporation point source device according to any one of claims 1 to 6, characterized in that: The position of the point source (S211) on the point source array (S21) is adjustable, and the point source (S211) is arranged on a moving mechanism (S22) of the point source array (S21); The moving mechanism (s22) includes moving structures 1 (2) on both sides and moving structure 2 (3) in the middle. Three point sources 1 (41) are installed on the moving structure 1 (2) on both sides of the device, and three point sources 2 (42) are installed on the moving structure 2 (3) in the middle. The moving structure (2) comprises a mounting plate (21), a linear guide rail (22) and a screw mechanism (23). The two sides below the mounting plate (21) are fixed on the sliders of the linear guide rail (22). The linear guide rail (22) is fixed on the lifting plate (17). Stoppers (221) are provided at both ends of the linear guide rail, which respectively correspond to the initial position and the final position of the slider movement, thereby limiting the movement stroke of the slider. The mobile structure 2 (3) mainly includes a mounting plate 2 (31), which is directly fixed on the lifting plate (17) and has long holes at both ends. The size and position of the long holes are consistent with those of the mounting plate 1 (21). The middle point source of the point source 2 (42) is directly fixed on the mounting plate 2 (31), and the point sources on both sides are connected to the mounting plate 2 (31) through the long holes. The movement mode of the point sources on both sides is consistent with that of the point source 1 (41).

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