Method for improving solderability through FeCoNiCrCu high-entropy alloy metallization engineering ceramic surface

Abstract

The invention belongs to the technical field of brazing, and discloses a method for improving brazability through a FeCoNiCrCu high-entropy alloy metallization engineering ceramic surface. According to the method, the FeCoNiCrCu high-entropy alloy film is efficiently deposited on the surface of the engineering ceramic through the magnetron sputtering technology, and the wettability of the ceramic substrate is remarkably improved; the high-entropy alloy metallization method is easy and convenient to operate and controllable, and the uniform alloy film with the controllable thickness can be obtained by accurately controlling the sputtering power, time and atmosphere conditions. The method is suitable for various engineering ceramic materials, the requirements of different application fields can be met, the FeCoNiCrCu high-entropy alloy adopted during metallization is excellent in performance, and the method is suitable for application and popularization.

Description

Technical Field

[0001] The present invention relates to the technical field of brazing, and relates to a method for improving the brazability by metallizing the surface of engineering ceramics through FeCoNiCrCu high-entropy alloy, specifically a method for metallizing the surface of engineering ceramics by magnetron sputtering deposition of FeCoNiCrCu high-entropy alloy thin film to improve the brazability. Background Art

[0002] Engineering ceramics are a class of inorganic non-metallic materials with excellent physical, chemical and mechanical properties, and are widely used in the fields of aerospace, mechanical manufacturing, energy, electronics and biomedicine. Compared with metal materials, engineering ceramics have higher hardness, wear resistance, high temperature resistance and corrosion resistance, and are suitable for applications in harsh environments. Common engineering ceramics include carbide ceramics (SiC, TiC), oxide ceramics (Al 2 O 3 , ZrO 2 , SiO 2 ), nitride ceramics (Si 3 N 4 , BN, AlN) and composite ceramics. Metal materials are widely used in engineering due to their excellent room temperature strength, ductility, electrical conductivity and thermal conductivity. However, at high temperatures, the mechanical properties and oxidation resistance of metal materials usually decrease sharply. To make up for this deficiency, combining ceramics with metals to form a composite structure has become an effective solution. Manufacturing a composite structure of ceramics and metals through welding technology can not only achieve the low-cost manufacturing of complex components, but also endow the product with multifunctional characteristics and realize the performance complementarity between the two.

[0003] At present, the welding between engineering ceramics and dissimilar metal materials mainly adopts two methods: brazing and diffusion welding. Brazing technology has significant advantages in the welding of dissimilar materials with large differences in physical and chemical properties, and is one of the common methods for connecting engineering ceramics and metals. Brazing has the advantages of simple operation, high connection strength, and suitability for extreme environments such as high temperature and high pressure. However, in the brazing process of engineering ceramics and metals, the problem of poor wettability is often faced, resulting in difficulties in connection. Since the wettability between metals and engineering ceramics is usually poor, and there is even a situation of complete non-wettability, the method of surface metallization treatment of engineering ceramics is often used to improve the wettability between the filler metal and the ceramics. The quality of wettability is usually characterized by the contact angle θ. When the contact angle is 0°, the molten metal completely wets and spreads on the surface of the engineering ceramics; when 0° < θ < 90°, the molten metal can wet the engineering ceramics, and the smaller θ is, the better the wettability.

[0004] Specifically, Wei et al. from Nanchang University explored the wetting and spreading behavior of Ag-Cu filler metals on different coated TiC-Ni cermets. The research shows that Ag-Cu has good spreading effects on Ni-coated cermets, Ni + 1% Mo-coated, and Ni + 5% CeO 2 coated cermets; Shi et al. from Chang'an University found that Ti coatings significantly improve the wettability of Cu on the Al 2 O 3 surface.

[0005] Compared with traditional alloy metallization, the films produced by high-entropy alloy metallization have high-entropy effects and retarded diffusion effects, which can inhibit the formation of interfacial intermetallic compounds, promote interfacial reactions and the formation of solid solutions; the synergistic effect of multiple elements in high-entropy alloys can also reduce the contact angle on the surface of industrial ceramics, improve the chemical bonding force between the alloy film and the surface of industrial ceramics, enhance the interfacial adhesion, and improve the brazing performance. Patent CN118455677A discloses a method for preparing a composite brazed joint with a regenerated gradient high-entropy film. According to the strength of atomic adsorption, the deposition target elements and the film deposition sequence are selected. A multi-gradient composite layer film composed of multiple deposited elements is prepared by deposition on the surface to be joined of the ceramic matrix composite, and then welding is carried out. However, its process is complex, requires a large amount of calculation, and sputters different metals in layers. It focuses on solving the brazed joint problem of the same composite material and cannot solve the brazing connection problem between metals and ceramics.

[0006] Therefore, the present invention selects FeCoNiCrCu high-entropy alloy for the metallization of the surface of engineering ceramics. Summary of the Invention

[0007] In view of this, the present invention provides a method for improving the brazability by metallizing the surface of engineering ceramics with FeCoNiCrCu high-entropy alloy.

[0008] Specifically, the present invention discloses a method for metallizing the surface of engineering ceramics with FeCoNiCrCu high-entropy alloy by magnetron sputtering film deposition, and the metallization improves the wettability of the surface of engineering ceramics.

[0009] To achieve the above object, the present invention adopts the following technical solutions:

[0010] The present invention discloses a method for metallizing the surface of engineering ceramics with FeCoNiCrCu high-entropy alloy by magnetron sputtering film deposition, and the method specifically includes the following steps;

[0011] S1, Cleaning: Immerse the engineering ceramic substrate in an acetone solution and clean it multiple times with an ultrasonic cleaner to remove surface oil stains and other impurities, take it out and dry it;

[0012] S2, Place the substrate: Place the engineering ceramic substrate on the sample stage in the deposition chamber, and rotate the sample stage baffle to completely cover the substrate;

[0013] S3, Place the target: Install the high-entropy alloy bulk target on the non-magnetic target position, adjust the vertical distance between the target and the sample stage, and close the chamber door;

[0014] S4, Atmosphere preparation: First, use a mechanical pump to evacuate the deposition chamber to less than 10.0 Pa, and then use a molecular pump to evacuate the deposition chamber to a vacuum of less than 1.0×10 -4 Pa, open the gas inlet to introduce high-purity argon, and adjust the gas flow rate;

[0015] S5, Parameter setting: Turn on the DC power supply of the corresponding target, and set the sputtering power, sputtering time, and sample stage rotation speed respectively to obtain the thin film;

[0016] S6, Preparation completed: After sputtering, turn off the DC power supply of the corresponding target, turn off the high-purity argon, stop the rotation of the sample stage, let the thin film cool to room temperature in a vacuum state and then vent and take it out to obtain the FeCoNiCrCu high-entropy alloy thin film.

[0017] Furthermore, the mass percentages of the components of the FeCoNiCrCu high-entropy alloy thin film are as follows:

[0018] Fe 19.32 wt.%, Co 20.3 wt.%, Ni 20.31 wt.%, Cr 17.99 wt.%, and Cu 21.99 wt.%.

[0019] Furthermore, the engineering ceramic substrate is one of Al 2 O 3 , SiC, h-BN.

[0020] Furthermore, the high-entropy alloy bulk target is a FeCoNiCrCu high-entropy alloy bulk obtained by mixing five elements of Fe, Co, Ni, Cr, and Cu in an equiatomic ratio;

[0021] The vertical distance between the target and the sample stage is 5 - 10 cm.

[0022] Furthermore, the sputtering power is 100 W; the sputtering time is 600 s - 3600 s, the deposition film thickness is related to the sputtering time, and it is measured that the film thickness is about 600 nm when the sputtering time is 3600 s, specifically 580 - 620 nm; the rotation speed of the sample stage is 20 - 30 r / min.

[0023] In addition, the present invention also provides an application method for testing the wettability of molten metal on the surface of engineering ceramics after the above S6 treatment, which specifically includes: placing the prepared engineering ceramic substrate metallized with FeCoNiCrCu high-entropy alloy on the surface in a high-temperature vacuum wetting furnace, and using the improved sessile drop method to conduct a wetting experiment in the high-temperature vacuum wetting furnace. Through a data acquisition and processing system, measure and record the contact angles of molten Sn, Al, and Cu on the surface of the metallized engineering ceramic substrate.

[0024] Furthermore, the high-temperature vacuum wetting furnace includes a furnace body, a heating system, a vacuum system, a dripping system, and a data acquisition and processing system (equipped with a laser backlight, a CCD high-resolution camera / CMOS high-speed camera, and droplet shape analysis software on a computer terminal).

[0025] Furthermore, the process of the improved sessile drop method is as follows: horizontally place the metallized engineering ceramic substrate in the vacuum chamber, and store the metal sample in a quartz storage tube outside the heating zone; evacuate the air. When the vacuum degree in the chamber reaches 1×10 -4 Pa, start heating and raise the temperature at a rate of 25 °C / min until the experimental temperature is reached. Drop the metal sample onto the surface of the substrate through an alumina dropper and keep it warm for 30 minutes; define the initial moment as the moment when the metal bead is completely melted and spherical. Use the backlight projection technology to monitor and record the spreading process of the molten droplet in real time; use SurfaceMeter software (OSA60, NBSI, China) to analyze the droplet profile and obtain the contact angle; after the isothermal experiment, use high-purity argon as the medium to rapidly cool until the droplet solidifies, and then take out the sample.

[0026] Furthermore, the metal droplet is one of Sn, Al, and Cu.

[0027] Furthermore, the experimental temperatures are 800 °C for Sn, 900 °C for Al, and 1100 °C for Cu.

[0028] Compared with the prior art, the present invention has the following beneficial effects:

[0029] First, the present invention efficiently deposits the FeCoNiCrCu high-entropy alloy thin film onto the surface of engineering ceramics through magnetron sputtering technology, significantly improving the wettability of the ceramic substrate.

[0030] Second, the method for metallizing the high-entropy alloy of the present invention is simple and controllable in operation. By precisely controlling the sputtering power, time, and atmosphere conditions, a uniform and thickness-controllable alloy thin film can be obtained. The sputtering time is proportional to the film thickness and can be adjusted according to needs to meet different thickness requirements.

[0031] Third, the present invention is applicable to a variety of engineering ceramic materials (Al 2 O 3, SiC and h-BN), these ceramic materials are widely used in modern industry and have excellent thermal, mechanical and chemical properties. At the same time, the vacuum and argon environment are used, and the sputtering process is not affected by adverse environmental factors such as oxidation, which ensures the quality of the film and the stability of the alloy, and can meet the needs of different application fields.

[0032] Fourth, the FeCoNiCrCu high entropy alloy used in the metallization of the present invention has excellent performance, and its improvement on the performance of ceramic materials includes the following points:

[0033] 1. Improve the interfacial bonding strength of engineering ceramics

[0034] High entropy alloys significantly enhance the adhesion between the film and the ceramic substrate by forming a strong metal-ceramic reaction layer. In particular, Fe and Cr in the elements can react with oxides or other impurities on the ceramic surface to promote the formation of chemical bonds, further improving the interfacial bonding strength. Co and Ni provide higher stability and strength in high temperature environments, allowing the bonding strength between the alloy film and the ceramic substrate to remain stable under long-term high temperature conditions.

[0035] 2. Enhance the wear resistance and corrosion resistance of engineering ceramics

[0036] Fe and Ni enhance the oxidation resistance of the alloy, especially in acidic, alkaline or high-temperature corrosion environments. The addition of Cr can form a high-temperature resistant Cr oxide protective layer to prevent oxidation and corrosion. The hardness of Co improves the wear resistance of the alloy, making the film less likely to be damaged or fail when subjected to friction. In addition, the addition of Cu contributes to the uniformity of the alloy, reduces the brittle area in the film, and thus improves the overall corrosion and wear resistance.

[0037] Through the synergistic effect of five elements, FeCoNiCrCu high entropy alloy is sputtered on the surface of engineering ceramics to form a metallized film with excellent wettability, good interface bonding, strong wear resistance, corrosion resistance and thermal stability. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments of the present invention. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0039] Figure 1 It is a flow chart of a method for metallizing an engineering ceramic surface with FeCoNiCrCu high entropy alloy provided by an embodiment of the present invention;

[0040] Figure 2It is the change of the contact angle of Al on the surface of the h-BN engineering ceramic substrate with time (a) and the macroscopic morphology after wetting (b) provided by Embodiment 1 of the present invention;

[0041] Figure 3 It is the change of the contact angle of Al on the surface of the Al 2 O 3 engineering ceramic substrate with time (a) and the macroscopic morphology after wetting (b) provided by Embodiment 2 of the present invention;

[0042] Figure 4 It is the change of the contact angle of Al on the surface of the SiC engineering ceramic substrate with time (a) and the macroscopic morphology after wetting (b) provided by Embodiment 3 of the present invention;

[0043] Figure 5 It is the change of the contact angle of Cu on the surface of the SiC engineering ceramic substrate with time (a) and the macroscopic morphology after wetting (b) provided by Embodiment 4 of the present invention;

[0044] Figure 6 It is the change of the contact angle of Sn on the surface of the Al 2 O 3 engineering ceramic substrate with time (a) and the macroscopic morphology after wetting (b) provided by Embodiment 5 of the present invention;

[0045] Figure 7 It is the brazing process curve (a) and the macroscopic morphology after brazing (b) of the FeCoNiCrCu high-entropy alloy after metallization provided by Embodiment 6 of the present invention. Detailed implementation manners

[0046] In order to make the objectives, technical solutions and advantages of the present invention clearer, the present invention will be further described in detail below with reference to embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0047] In response to what is mentioned in the background art, the present invention provides a method for metallizing FeCoNiCrCu high-entropy alloy on the surface of engineering ceramics by magnetron sputtering thin film deposition, and the metallization improves the wettability of the surface of the engineering ceramics.

[0048] The magnetron sputtering equipment used is SLCK-300 provided by Shenyang Silian Vacuum Equipment Co., Ltd.

[0049] Embodiment 1:

[0050] S1, Cleaning: Immerse the h-BN ceramic substrate in an acetone solution and clean it multiple times with an ultrasonic cleaner to remove surface oil stains and other impurities, take it out and dry it;

[0051] S2, Substrate placement: Place the h-BN ceramic substrate on the sample stage in the deposition chamber, and rotate the sample stage baffle to completely cover the substrate.

[0052] S3, Target placement: Install the FeCoNiCrCu high-entropy alloy bulk target on the non-magnetic target position, adjust the vertical distance between the target and the sample stage, and close the chamber door.

[0053] S4, Atmosphere preparation: First, use a mechanical pump to evacuate the deposition chamber to less than 10.0 Pa, and then use a molecular pump to evacuate the deposition chamber to a vacuum of less than 1.0×10 -4 Pa, open the gas inlet to introduce high-purity argon, and adjust the gas flow rate.

[0054] S5, Parameter setting: Turn on the DC power supply for the corresponding target, set the sputtering power to 100 W, the sputtering time to 3600 s, and the sample stage rotation speed to 25 r / min to obtain the film.

[0055] S6, Preparation completed: After sputtering, turn off the DC power supply for the corresponding target, turn off the high-purity argon, stop the rotation of the sample stage, allow the film to cool to room temperature in a vacuum state, and then vent and take it out to obtain an h-BN ceramic substrate with a surface metallized with FeCoNiCrCu high-entropy alloy.

[0056] S7, Place the h-BN ceramic substrate with a surface metallized with FeCoNiCrCu high-entropy alloy prepared in step S6 in a high-temperature vacuum wetting furnace, and perform a wetting experiment in the high-temperature vacuum wetting furnace using the improved sessile drop method. Through the data acquisition and processing system, measure and record the contact angle of molten Al on the h-BN ceramic substrate with a surface metallized with FeCoNiCrCu high-entropy alloy.

[0057] Furthermore, the high-temperature vacuum wetting furnace includes a furnace body, a heating system, a vacuum system, a dripping system, and a data acquisition and processing system (equipped with a laser backlight, a CCD high-resolution camera / CMOS high-speed camera, and droplet shape analysis software on a computer terminal).

[0058] Furthermore, the process of the improved sessile drop method is as follows: Horizontally place the h-BN ceramic substrate with a surface metallized with FeCoNiCrCu high-entropy alloy in a vacuum chamber, and store the metal sample in a quartz storage tube outside the heating zone; evacuate the air, and when the pressure in the chamber reaches 1×10 -4Start heating at a vacuum degree of Pa and increase the temperature at a rate of 25 °C / min until 900 °C is reached. At this temperature, it can ensure that the metal Al is completely melted. Drop the alloy sample onto the substrate surface through an alumina dropper and keep it warm for 30 minutes. The initial moment (t = 0 s) is defined as the moment when the alloy bead is completely melted and spherical (0 - 10 s), and then use the backlight projection technology to monitor and record the spreading process of the molten droplet in real time. Use SurfaceMeter software (OSA60, NBSI, China) and analyze the droplet profile to obtain the contact angle. After the wetting experiment, in order to obtain accurate interface information during the wetting process, use high-purity argon gas (purity > 99.99%) as the medium to achieve rapid cooling (cooling rate ~ 50 °C / min) until the droplet solidifies, and then take out the specimen.

[0059] Further, the h-BN ceramic substrate is a wafer with a diameter of 30 mm and a thickness of 2 - 3 mm.

[0060] Example results: The contact angle of Al on the h-BN engineering ceramic substrate metallized with the surface FeCoNiCrCu high-entropy alloy was measured to be 13.2°, and the wetting effect was good. From the macroscopic morphology after wetting, the Al melt almost completely spread on the substrate surface, as shown in the appendix. Figure 2 as shown.

[0061] Example 2:

[0062] This example is basically the same as Example 1, except that in step S1, the engineering ceramic substrate is an Al 2 O 3 substrate, a rectangular sheet with dimensions of approximately 15 × 23 mm and a thickness of 2 - 3 mm.

[0063] Example results: The contact angle of Al on the h-BN engineering ceramic substrate metallized with the surface FeCoNiCrCu high-entropy alloy was measured to be 0°, indicating complete wetting. From the macroscopic morphology after wetting, the Al melt completely spread on the substrate surface, as shown in the appendix. Figure 3 as shown.

[0064] Example 3:

[0065] This example is basically the same as Example 1, except that in step S1, the engineering ceramic substrate is a SiC substrate, a square sheet with dimensions of approximately 22 × 22 mm and a thickness of 2 - 3 mm.

[0066] Example results: The contact angle of Al on the SiC engineering ceramic substrate metallized with the surface FeCoNiCrCu high-entropy alloy was measured to be 5.64°, and the wetting effect was good. From the macroscopic morphology after wetting, the Al melt completely spread on the substrate surface, as shown in the appendix. Figure 4 as shown.

[0067] Example 4:

[0068] This example is basically the same as Example 1, except that the engineering ceramic substrate described in step S1 is a SiC substrate, which is a square piece with a size of 22×22 mm and a thickness of 2-3 mm; the metal used for wetting is Cu.

[0069] Example result: The contact angle of Cu on the SiC engineering ceramic substrate metallized with FeCoNiCrCu high-entropy alloy on the surface was measured to be 10.93°, and the wetting effect was good. From the macroscopic morphology after wetting, the Cu melt completely spread on the substrate surface, as shown in the appendix Figure 5 as shown.

[0070] Example 5:

[0071] This example is basically the same as Example 1, except that the engineering ceramic substrate described in step S1 is an Al 2 O 3 substrate, which is a rectangular piece with a size of 20×25 mm and a thickness of 2-3 mm; the metal used for wetting is Sn.

[0072] Example result: The contact angle of Cu on the SiC engineering ceramic substrate metallized with FeCoNiCrCu high-entropy alloy on the surface was measured to be 10.93°, and the wetting effect was good. From the macroscopic morphology after wetting, the Sn melt completely spread on the substrate surface, as shown in the appendix Figure 6 as shown.

[0073] Example 6:

[0074] Based on the results of the above examples, brazing of engineering ceramics was carried out in this example.

[0075] The steps of this example are basically the same as those of Example 1, except that in step S7, the engineering ceramic substrate metallized with FeCoNiCrCu high-entropy alloy on the surface prepared in step S6 is placed in a high-temperature vacuum wetting furnace, and a brazing experiment is carried out in the high-temperature vacuum wetting furnace using the improved sessile drop method. The brazing process curve is as shown in the appendix Figure 7 (a).

[0076] The high-temperature vacuum wetting furnace includes a furnace body, a heating system, a vacuum system, a dripping system, and a data acquisition and processing system (equipped with a laser backlight, a CCD high-resolution camera / CMOS high-speed camera, and droplet shape analysis software on a computer terminal).

[0077] The process of brazing using the improved sessile drop method is as follows: Place the engineering ceramic substrate (a triangular piece with a side length of 16 mm and a thickness of 2 - 3 mm) metallized with FeCoNiCrCu high-entropy alloy horizontally in a vacuum chamber, and then place a triangular piece of the same size above it. Store Sn in a quartz storage tube outside the heating zone; evacuate the chamber, and start heating when the vacuum degree in the chamber reaches 4×10 -4 Pa, and increase the temperature at a rate of 25°C / min until the experimental temperature of 800°C is reached. At this temperature, it can ensure that Sn is completely melted and has excellent fluidity. Drop the molten Sn onto the contact of the metallized engineering ceramic substrate through an alumina dropper for brazing, and keep it warm for 30 minutes. After the holding time ends, in order to obtain accurate interface information during the wetting process, use high-purity argon gas (purity > 99.99%) as the medium to achieve rapid cooling (cooling rate ~ 50°C / min) until the droplet solidifies, and then take out the specimen.

[0078] Example results: From the macroscopic morphology after brazing, as shown in the appendix Figure 7 it can be seen that the engineering ceramic substrate metallized with FeCoNiCrCu high-entropy alloy is well connected, and no cracks occur during rapid cooling at 50°C / min.

[0079] The data results of the above examples are presented in the form of drawings and tables as follows:

[0080] Table 1 Contact angles measured in the above examples

[0081]

[0082] In summary, from the data in Table 1, it can be seen that the method of metallizing FeCoNiCrCu high-entropy alloy on the surface of engineering ceramics by magnetron sputtering thin film deposition provided by the present invention obtains extremely small or low contact angles on the surface of the engineering ceramic substrate, improves the wettability of the engineering ceramic surface, and exhibits excellent wettability, especially on the Al 2 O 3 engineering ceramic substrate, where the contact angle is 0°, achieving complete wetting.

[0083] From the macroscopic morphology after wetting obtained in our examples, after Sn, Al, and Cu metals are melted, they are nearly completely spread or completely spread on the surface of the engineering ceramic substrate. This fully demonstrates that the FeCoNiCrCu high-entropy alloy metallization method of the present invention endows the surface of engineering oxygen ceramics with excellent wettability, which lays a foundation for obtaining good brazed joints. From the brazing results of Example 6, good connection between the engineering ceramic substrates is achieved, further demonstrating the rationality of the design of the present invention.

[0084] The foregoing description of the disclosed embodiments enables those skilled in the art to practice or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A method for improving the brazing property of FeCoNiCrCu high entropy alloy metallization on the surface of engineering ceramics by magnetron sputtering thin film deposition, characterized in that: The method specifically comprises the following steps: S1, cleaning: immerse the engineering ceramic substrate in an acetone solution and clean it several times with an ultrasonic cleaner to remove surface oil stains and other impurities, then take it out and dry it; S2, placing the substrate: placing the engineering ceramic substrate on the sample stage of the deposition chamber, and rotating the sample stage baffle to completely cover the substrate; S3, target placement: install the high entropy alloy block target on the non-magnetic target position, adjust the vertical distance between the target and the sample stage, and close the hatch; S4, atmosphere preparation: first use a mechanical pump to evacuate the deposition chamber to less than 10.0 Pa, and then use a molecular pump to evacuate the deposition chamber to less than 1.0×10 -4 Pa, open the gas to introduce high-purity argon gas and adjust the gas flow rate; S5, parameter setting: turn on the DC power supply of the corresponding target material, set the sputtering power, sputtering time, and sample stage speed respectively, and obtain a thin film; S6, preparation completed: After sputtering is completed, turn off the DC power supply of the corresponding target material, turn off the high-purity argon gas, stop the rotation of the sample stage, and the film is cooled to room temperature under vacuum and then released and taken out to obtain a FeCoNiCrCu high-entropy alloy film.

2. The method for improving brazing performance by metallizing FeCoNiCrCu high entropy alloy on the surface of engineering ceramics by magnetron sputtering thin film deposition according to claim 1, characterized in that: The mass percentages of the components of the FeCoNiCrCu high entropy alloy film are as follows: Fe 19.32wt.%, Co 20.3wt.%, Ni 20.31wt.%, Cr 17.99wt.% and Cu 21.99wt.%.

3. The method for improving brazing performance by metallizing FeCoNiCrCu high entropy alloy on the surface of engineering ceramics by magnetron sputtering thin film deposition according to claim 1, characterized in that: The engineering ceramic substrate is one of Al2O3, SiC and h-BN.

4. The method for improving brazing performance by metallizing FeCoNiCrCu high entropy alloy on the surface of engineering ceramics by magnetron sputtering thin film deposition according to claim 1, characterized in that: The high entropy alloy bulk target is a FeCoNiCrCu high entropy alloy bulk obtained by mixing five elements of Fe, Co, Ni, Cr and Cu in equal atomic proportions; The vertical distance between the target material and the sample stage is 5 to 10 cm.

5. The method for improving brazing performance by metallizing FeCoNiCrCu high entropy alloy on the surface of engineering ceramics by magnetron sputtering thin film deposition according to claim 1, characterized in that: The sputtering power is 100W; the sputtering time is 600s-3600s, the thickness of the deposited film is related to the sputtering time, and the film thickness is 580-620nm when the sputtering time is 3600s after testing; the sample stage rotation speed is 20-30r / min.

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