Fixing structure of evaporation pot cover plate

Abstract

The invention relates to an evaporation pot cover plate fixing structure, and relates to the technical field of wafer evaporation, the evaporation pot cover plate fixing structure comprises a pot body, the pot body is provided with a plurality of installation holes for wafer installation, each installation hole is covered with a cover plate, each installation hole corresponds to at least four spring pressing sheets, the spring pressing sheets are rotatably arranged on the pot body, and the cover plate is arranged on the pot body. And the spring pressing sheets are distributed in the circumferential direction of the mounting hole and are pressed on the top surface of the cover plate. The cover plate is tightly pressed in the mode that the spring pressing piece is shifted to rotate, and the problem that time and labor are wasted in the conventional screw turning process is solved; the multiple spring pressing pieces act on the top face of the cover plate in the circumferential direction of the cover plate, so that the cover plate is stably pressed on the wafer, the acting force of the spring pressing pieces is consistent, the cover plate can be kept flat, a certain edge of the cover plate is prevented from being tilted, the evaporation stability is guaranteed, and the wafer is not prone to being damaged. And through the positioning groove and the convex ring, the position of the spring pressing piece is locked, and the situation that the spring pressing piece rotates spontaneously, and consequently the cover plate is loosened is avoided.

Description

Technical Field

[0001] The present application relates to the technical field of wafer evaporation coating, and particularly relates to a fixing structure for an evaporation coating pot cover plate. Background Art

[0002] In the thin film deposition step of wafer manufacturing, it is necessary to fix the wafer on the evaporation coating pot, and deposit a metal thin film with a certain thickness on the wafer surface by evaporation coating. At present, the fixing method of the wafer is usually as follows: Place the placement ring containing the wafer on the evaporation coating pot, then cover the cover plate on the placement ring, and then cooperate with the pressing piece and screws on the evaporation coating pot body to fix the cover plate, thereby fixing the wafer.

[0003] The utility model patent with the existing publication number CN208995585U discloses a one-to-many positioning ring and evaporation pot for chip vacuum coating, including a positioning plate. A plurality of first circular through holes for placing chips are opened on the positioning plate, and the plurality of first circular through holes are evenly arranged. It further includes a circular cover plate, and the circular cover plate covers the positioning plate. A rotating shaft is provided at the center of the evaporation pot. A plurality of second circular through holes are also provided on the evaporation pot. A positioning ring for placing chips is installed on each second circular through hole. A plurality of spring pieces are also provided on the evaporation pot, and the spring pieces correspond to the second circular through holes one by one (for pressing and fixing the chips); A one-to-many positioning ring for chip vacuum coating is installed on at least one positioning ring on the evaporation pot (corresponding to the spring piece pressing the corresponding circular cover plate).

[0004] Regarding the above related technologies, the inventor believes that using a single spring piece to press the wafer or the cover plate, the edge position of the cover plate lacks pressing. Under the action of thermal expansion and contraction, it is easy to cause a certain edge of the cover plate to warp, and then problems such as air leakage or wafer displacement occur, which has an adverse impact on evaporation coating. Summary of the Invention

[0005] The present application provides a fixing structure for an evaporation coating pot cover plate, which can press multiple positions at the edge of the cover plate, avoid the edge of the cover plate from warping, and ensure the normal progress of the evaporation coating process.

[0006] The fixing structure for an evaporation coating pot cover plate provided by the present application adopts the following technical solutions: A fixing structure for an evaporation coating pot cover plate includes a pot body. A plurality of mounting holes for installing wafers are provided on the pot body. A cover plate is covered on each mounting hole. At least four spring pressing pieces correspond to each mounting hole respectively. The spring pressing pieces are rotatably arranged on the pot body. The spring pressing pieces are distributed circumferentially around the mounting hole, and the spring pressing pieces press on the top surface of the cover plate.

[0007] By adopting the above technical solution, multiple spring pressing pieces act on the top surface of the cover plate circumferentially, thereby firmly pressing the cover plate onto the wafer, and the acting forces of the spring pressing pieces are consistent, avoiding the warping of a certain edge of the cover plate.

[0008] Optionally, a bolt is threadedly connected to the pot body, the bolt penetrates through the spring pressing piece, and the spring pressing piece is clamped by the screw head of the bolt and the surface of the pot body.

[0009] By adopting the above technical solution, the rotational connection between the spring pressing piece and the pot body is realized through the bolt.

[0010] Optionally, the bolt includes a frustum portion located between the threaded section and the screw head of the bolt. The bolt is pressed against the surface of the pot body through the frustum portion, and the spring pressing piece is sleeved outside the frustum portion.

[0011] By adopting the above technical solution, by providing the frustum portion, the distance between the screw head of the bolt and the pot body is limited to the thickness of the frustum portion. Whether the bolt is tightened or not will not change the force of the screw head of the bolt pressing the spring pressing piece, making the pressures received by all spring pressing pieces consistent and the rotational resistances also consistent; and when the spring pressing piece rotates, it will not act on the contact surface between the frustum portion and the pot body, so it is not easy to loosen the bolt, improving the stability of the spring pressing piece during use.

[0012] Optionally, the middle part of the spring pressing piece is arched upward to form a bending portion.

[0013] By adopting the above technical solution, the bending portion is used to improve the elastic capacity of the spring pressing piece on the one hand, and on the other hand, it is convenient for personnel to drive the spring pressing piece to rotate by touching the bending portion with the hand.

[0014] Optionally, the inner side of the bending portion is an inner groove, and a convex ring is fixed to the edge of the top surface of the cover plate, and the convex ring is used to be embedded in the inner groove.

[0015] By adopting the above technical solution, after the convex ring enters the inner groove, the position of the spring pressing piece is locked. During the working process of the evaporation pot, the pot body rotates. Through locking, the spring pressing piece is prevented from rotating spontaneously, thereby avoiding the loosening of the cover plate.

[0016] Optionally, a plurality of positioning grooves are formed on the surface of the cover plate along the circumferential direction. The positioning grooves are flared grooves and are used for the ends of the spring pressing pieces to be embedded.

[0017] By adopting the above technical solution, after the end of the spring pressing piece is rotated onto the cover plate, due to the shape of the flared positioning groove, the end of the spring pressing piece can quickly enter the positioning groove to complete positioning, and the positioning groove can also play a certain limiting effect on the spring pressing piece, avoiding the spontaneous rotation of the spring pressing piece.

[0018] Optionally, a bouncing core is provided at the center of the cover plate. The cover plate includes an inner cover and an outer cover. The inner cover and the outer cover have the same diameter. The outer cylinder of the bouncing core is fixed to the outer cover, and the inner rod of the bouncing core is fixedly connected to the inner cover.

[0019] By adopting the above technical solution, through the bouncing core, the distance between the inner cover and the outer cover can be changed by pressing the bouncing core, so as to adjust the overall thickness of the cover plate. After the overall thickness of the cover plate is reduced, it is convenient for the spring pressing piece to rotate.

[0020] Optionally, an outer guide ring is fixed to the outer cover, and an inner guide ring is fixed to the inner cover. The outer guide ring is sleeved outside the inner guide ring and is in sliding contact with the inner guide ring.

[0021] By adopting the above technical solution, through the sliding guiding action of the outer guide ring and the inner guide ring, the sliding stability between the inner cover and the outer cover is improved, and the inclination between the inner cover and the outer cover is avoided.

[0022] Optionally, the end of the outer cylinder of the bouncing core protrudes from the top surface of the outer cover and is fixed with a grip ring.

[0023] By adopting the above technical solution, it is convenient for personnel to pick up the cover plate through the grip ring.

[0024] Optionally, a positioning ring for placing the wafer is fixed to the inner wall of the mounting hole.

[0025] By adopting the above technical solution, the wafer is placed on the positioning ring, and the gas acts on the bottom surface of the wafer during evaporation coating.

[0026] In summary, the present application includes at least one of the following beneficial technical effects: 1. By pressing the cover plate by turning the spring pressing piece, the problem of time-consuming and laborious conventional screwing is avoided; 2. Multiple spring pressing pieces act on the top surface of the cover plate from the circumferential direction of the cover plate, so as to firmly press the cover plate on the wafer, and the acting forces of the spring pressing pieces are consistent. The cover plate can be kept flat, and the warping of a certain edge of the cover plate is avoided, so as to ensure the stability of evaporation coating and not easily damage the wafer; 3. Through the positioning groove and the convex ring, the position of the spring pressing piece is locked, and the spontaneous rotation of the spring pressing piece is avoided, so as to prevent the cover plate from loosening. Description of the Drawings

[0027] Figure 1 is a perspective view of a fixing structure of an evaporation coating pot cover plate of an embodiment; Figure 2 is Figure 1 an enlarged view of part A of Figure 3 is a partial cross-sectional view of the embodiment; Figure 4It is a cross-sectional view of the cover plate of the embodiment; Figure 5 It is a cross-sectional view of the outer cover of the embodiment after approaching the inner cover.

[0028] Explanation of reference numerals: 1, pot body; 11, mounting hole; 12, positioning ring; 2, cover plate; 3, spring pressing piece; 4, bolt; 41, frustum part; 31, bending part; 32, inner groove; 20, bouncing core; 21, inner cover; 22, outer cover; 23, grip ring; 24, outer guide ring; 25, inner guide ring; 26, convex ring; 27, positioning groove. Specific embodiments

[0029] The following further describes the present application in detail with reference to the accompanying drawings.

[0030] Refer to Figure 1 , this embodiment discloses a fixing structure for a cover plate of an evaporation pot, including a pot body 1, on which a plurality of mounting holes 11 for wafer installation are provided, and a positioning ring 12 for placing wafers is fixed on the inner wall of the mounting holes 11. A cover plate 2 is covered on each mounting hole 11, and each mounting hole 11 corresponds to at least four spring pressing pieces 3 respectively. The spring pressing pieces 3 are rotatably arranged on the pot body 1, and the spring pressing pieces 3 are circumferentially distributed around the mounting holes 11, and the spring pressing pieces 3 press on the top surface of the cover plate 2. In this embodiment, the number of spring pressing pieces 3 corresponding to each cover plate 2 is four, and the cover plate 2 is pressed into the mounting hole 11 by the spring pressing pieces 3.

[0031] Refer to Figure 2 and Figure 3 , a bolt 4 is threadedly connected to the pot body 1, and the pot body 1 provides a columnar protruding part for the bolt 4 to be threadedly connected. The bolt 4 passes through the spring pressing piece 3, and the spring pressing piece 3 can rotate around the bolt 4. The spring pressing piece 3 is clamped by the screw head of the bolt 4 and the surface of the pot body 1. The bolt 4 includes a frustum part 41, and the frustum part 41 is located between the threaded section and the screw head of the bolt 4. The bolt 4 is pressed against the surface of the pot body 1 through the frustum part 41, and the spring pressing piece 3 is sleeved outside the frustum part 41.

[0032] The thickness of the frustum part 41 corresponds to that of the spring pressing piece 3. By setting the frustum part 41, the distance between the screw head of the bolt 4 and the pot body 1 is limited to the thickness of the frustum part 41. Whether the bolt 4 is tightened or not will not change the force of the screw head of the bolt 4 pressing the spring pressing piece 3, making the pressure received by all spring pressing pieces 3 the same and the rotational resistance the same; and when the spring pressing piece 3 rotates, it will not act on the contact surface between the frustum part 41 and the pot body 1, so it is not easy to loosen the bolt 4, improving the stability of the spring pressing piece 3 during use.

[0033] The middle part of the spring pressing piece 3 is arcuately bulged upward to form a bending part 31. The inner side of the bending part 31 is an inner groove 32. On the one hand, the bending part 31 is used to improve the elastic ability of the spring pressing piece 3. On the other hand, it is convenient for personnel to drive the spring pressing piece 3 to rotate by touching the bending part 31 with their hands.

[0034] Refer to Figure 4 , a bouncing core 20 is arranged at the center of the cover plate 2. The cover plate 2 includes an inner cover 21 and an outer cover 22. The inner cover 21 and the outer cover 22 have the same diameter. The outer cylinder of the bouncing core 20 is fixed to the outer cover 22, and the inner rod of the bouncing core 20 is fixedly connected to the inner cover 21. The end of the outer cylinder of the bouncing core 20 protrudes from the top surface of the outer cover 22 and is fixed with a grip ring 23, which is convenient for personnel to take the cover plate 2 through the grip ring 23. Through the combination of the inner cover 21 and the outer cover 22, the cover plate 2 forms a double-layer structure. Through the bouncing core 20, the distance between the inner cover 21 and the outer cover 22 can be changed by pressing the bouncing core 20, so as to adjust the overall thickness of the cover plate 2. The bouncing core 20 is also called a bouncing valve core, which is a prior art and is mostly used in a drainer, so it will not be elaborated here.

[0035] The outer cover 22 is fixed with an outer guide ring 24, and the inner cover 21 is fixed with an inner guide ring 25. The outer guide ring 24 is sleeved outside the inner guide ring 25 and is in sliding contact with the inner guide ring 25. Through the sliding guiding action of the outer guide ring 24 and the inner guide ring 25, the stability of the sliding between the inner cover 21 and the outer cover 22 is improved, and the inclination between the inner cover 21 and the outer cover 22 is avoided.

[0036] Refer to Figure 3 and Figure 4 , a convex ring 26 is fixed at the edge of the top surface of the cover plate 2. The convex ring 26 is specifically located on the outer cover 22. The convex ring 26 is used to be embedded in the inner groove 32. When the bouncing core 20 is in the extended state, the outer cover 22 and the inner cover 21 are far away from each other, and the convex ring 26 enters the inner groove 32. The edge of the convex ring 26 contacts the groove wall of the inner groove 32. Through the convex ring 26, the rotation of the spring pressing piece 3 is avoided, and the position of the spring pressing piece 3 is locked.

[0037] Refer to Figure 2 and Figure 3 , a plurality of positioning grooves 27 are circumferentially formed on the surface of the cover plate 2. The positioning grooves 27 are specifically located on the outer cover 22. The positioning grooves 27 are flared grooves, and the positioning grooves 27 are used for the end of the spring pressing piece 3 to be embedded. After the end of the spring pressing piece 3 is rotated to the cover plate 2, due to the shape of the flared positioning grooves 27, the end of the spring pressing piece 3 can quickly enter the positioning grooves 27 to complete the positioning. The positioning grooves 27 can also play a certain limiting effect on the spring pressing piece 3 to avoid the spontaneous rotation of the spring pressing piece 3.

[0038] The implementation principle of a fixing structure for a vapor deposition pot cover plate in an embodiment of this application is as follows: Before placing the cover plate 2, the spring pressing piece 3 is located outside the mounting hole 11, the bouncing core 20 is in a shortened state, the outer cover 22 is close to the inner cover 21, and the overall thickness of the cover plate 2 is small. When preparing for vapor deposition, a wafer is placed on the positioning ring 12, and then the cover plate 2 is placed on the wafer.

[0039] Referring to Figure 5 , then rotate the spring pressing piece 3 to move the end of the spring pressing piece 3 onto the cover plate 2. At this time, since the outer cover 22 extends into the mounting hole 11, it is relatively easy to rotate the spring pressing piece 3. The end of the spring pressing piece 3 does not contact the outer cover 22, so the surface of the outer cover 22 will not be worn, and the convex ring 26 will not hinder the rotation of the spring pressing piece 3.

[0040] Referring to Figure 3 , after the position of the spring pressing piece 3 is rotated, press down the cover plate 2 to switch the bouncing core 20 to an extended state. Then the outer cover 22 moves upward by a certain distance, so that the end of the spring pressing piece 3 is embedded in the positioning groove 27, and the convex ring 26 enters the inner groove 32, thereby locking the position of the spring pressing piece 3. During the working process of the vapor deposition pot, the pot body 1 rotates. Through locking, it is avoided that the spring pressing piece 3 rotates spontaneously, which may cause the cover plate 2 to become loose.

[0041] Multiple spring pressing pieces 3 act on the top surface of the cover plate 2 from the circumferential direction of the cover plate 2, thereby firmly pressing the cover plate 2 on the wafer. Moreover, the acting forces of the spring pressing pieces 3 are consistent, avoiding one edge of the cover plate 2 from warping. It should be noted that the overall pressure of the spring pressing piece 3 is not enough to press the bouncing core 20, and the bouncing core 20 can only be pressed manually.

[0042] Referring to Figure 5 , after the vapor deposition is completed, press down the outer cover 22 to switch the bouncing core 20 to a shortened state. Then the outer cover 22 moves downward by a certain distance. At this time, you can rotate a circle with your finger at the orifice of the mounting hole 11 to turn all the spring pressing pieces 3 away from the mounting hole 11 with high efficiency, and then the cover plate 2 can be removed.

[0043] The above are all the preferred embodiments of this application. The protection scope of this application is not limited accordingly. Therefore, all equivalent changes made according to the structure, shape, and principle of this application should be covered within the protection scope of this application.

Claims

1. A fixing structure for a cover plate of a vapor deposition pot, comprising a pot body (1), the pot body (1) being provided with a plurality of mounting holes (11) for mounting wafers, each mounting hole (11) being covered with a cover plate (2), characterized in that: Each of the mounting holes (11) corresponds to at least four spring pressing plates (3), the spring pressing plates (3) are rotatably arranged on the pot body (1), the spring pressing plates (3) are distributed circumferentially with respect to the mounting holes (11), and the spring pressing plates (3) are pressed on the top surface of the cover plate (2).

2. The fixing structure of the evaporation pot cover according to claim 1, characterized in that: A bolt (4) is threadedly connected to the pot body (1), and the bolt (4) is arranged to penetrate the spring pressing plate (3). The spring pressing plate (3) is clamped by the screw head of the bolt (4) and the surface of the pot body (1).

3. The fixing structure of the evaporation pot cover according to claim 2, characterized in that: The bolt (4) comprises a truncated cone portion (41), wherein the truncated cone portion (41) is located between the threaded section and the screw head of the bolt (4), the bolt (4) is pressed against the surface of the pot body (1) through the truncated cone portion (41), and the spring pressing sheet (3) is sleeved outside the truncated cone portion (41).

4. The fixing structure of the evaporation pot cover according to claim 1, characterized in that: The middle part of the spring pressing sheet (3) bulges upward in an arc shape to form a curved portion (31).

5. The fixing structure of the evaporation pot cover according to claim 4, characterized in that: The inner side of the curved portion (31) is an inner groove (32), and a convex ring (26) is fixed to the edge of the top surface of the cover plate (2), and the convex ring (26) is used to be embedded in the inner groove (32).

6. The fixing structure of the evaporation pot cover according to claim 1, characterized in that: The surface of the cover plate (2) is provided with a plurality of positioning grooves (27) along the circumferential direction. The positioning grooves (27) are expanded grooves. The positioning grooves (27) are used for the end of the spring pressing sheet (3) to be embedded.

7. The fixing structure of the evaporation pot cover according to claim 1, characterized in that: A spring core (20) is arranged at the center of the cover plate (2). The cover plate (2) comprises an inner cover (21) and an outer cover (22). The inner cover (21) and the outer cover (22) have the same diameter. The outer cylinder of the spring core (20) is fixed to the outer cover (22), and the inner rod of the spring core (20) is fixedly connected to the inner cover (21).

8. The fixing structure of the evaporation pot cover according to claim 7, characterized in that: The outer cover (22) is fixed with an outer guide ring (24), the inner cover (21) is fixed with an inner guide ring (25), and the outer guide ring (24) is sleeved outside the inner guide ring (25) and is in sliding contact with the inner guide ring (25).

9. The fixing structure of the evaporation pot cover according to claim 7, characterized in that: The outer tube end of the spring core (20) protrudes from the top surface of the outer cover (22) and is fixed with a grip ring (23).

10. The fixing structure of the evaporation pot cover according to claim 1, characterized in that: A positioning ring (12) for placing a wafer is fixed on the inner wall of the mounting hole (11).

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