Reaction cavity device and processing method

Abstract

The invention relates to the technical field of atomic deposition, in particular to a reaction cavity device and a processing method. The reaction cavity device comprises a first container and a guide pipe assembly, a first containing cavity is defined by the first container, the first containing cavity is suitable for containing a workpiece to be machined, and the guide pipe assembly is connected to the first container and comprises a first guide pipe, a second guide pipe, a third guide pipe and a fourth guide pipe which communicate with the first containing cavity. The first guide pipe is suitable for guiding a first reactant into the first containing cavity, the second guide pipe is configured to guide the first reactant which is not attached to the surface of the workpiece to be machined out of the first containing cavity when the first reactant is guided into the first containing cavity, and the third guide pipe is suitable for guiding a second reactant into the first containing cavity. And the fourth guide pipe is configured to guide the second reactant which does not react with the first reactant out of the first accommodating cavity when the second reactant is guided into the first accommodating cavity. The processing method comprises the step of producing the workpiece to be processed by using the reaction cavity device. The reaction cavity device is low in maintenance cost.

Description

Technical Field

[0001] The present invention relates to the technical field of atomic deposition, and particularly relates to a reaction chamber device and a processing method. Background Art

[0002] In a tube-type ALD device, a carrier (aluminum boat) is exposed to different precursors in the time dimension, so that the surface of a workpiece to be processed alternately adsorbs a layer (two kinds) of precursor atoms and undergoes a chemical reaction to generate a required thin film. In the traditional photovoltaic field, the deposited thin film is generally Al 2 O 3 , and the precursors are generally liquid Al(CH 3 ) 3 and H 2 O (pure water), which are carried into the reaction chamber by bubbling through PN 2 (high-purity nitrogen).

[0003] In the current tube-type ALD device, usually two different precursors are sequentially transported into the reaction chamber through the same intake duct, and the two different precursors that have not reacted in the reaction chamber are sequentially discharged from the reaction chamber through the same outlet duct. In short, there is only a shared intake duct and outlet duct in the current tube-type ALD device. In the above structure, it is easier for precursors to remain in both the intake duct and the outlet duct. If the two precursors in the intake duct or the outlet duct come into contact and react, powder will be generated in the intake duct or the outlet duct. As the number of processes increases, the powder accumulation in the intake duct or the outlet duct becomes more serious, resulting in the intake duct or the outlet duct being easily blocked, and the tube-type ALD device has a high maintenance frequency, a short maintenance cycle, and a high maintenance cost. Summary of the Invention

[0004] The main object of the present invention is to propose a reaction chamber device and a processing method, aiming to solve the technical problems of high maintenance frequency, short maintenance cycle, and high maintenance cost of the current tube-type ALD device.

[0005] To achieve the above object, the present invention proposes a reaction chamber device, including:

[0006] A first container, the first container defining a first cavity, and the first cavity is adapted to accommodate a workpiece to be processed;

[0007] A duct assembly, the duct assembly being connected to the first container, and the duct assembly includes a first duct, a second duct, a third duct, and a fourth duct that are respectively communicated with the first cavity;

[0008] Wherein, the first conduit is adapted to introduce a first reactant into the first cavity, the first reactant being capable of adhering to the surface of the workpiece to be processed, the second conduit being configured to export the first reactant that has not adhered to the surface of the workpiece out of the first cavity when introducing the first reactant into the first cavity, the third conduit being adapted to introduce a second reactant into the first cavity, the second reactant being capable of adhering to the surface of the workpiece to be processed and reacting with the first reactant to form a film on the surface of the workpiece to be processed, and the fourth conduit being configured to export the second reactant that has not reacted with the first reactant out of the first cavity when introducing the second reactant into the first cavity.

[0009] In some embodiments, the reaction chamber device includes a second container that defines a second cavity, and the first container is disposed within the second cavity;

[0010] Wherein, a heating element is disposed within the second cavity, and the heating element is used to heat the first container.

[0011] In some embodiments, a first flow equalizing plate, a second flow equalizing plate, a third flow equalizing plate, and a fourth flow equalizing plate are disposed within the first cavity around the circumferential direction of the workpiece to be processed;

[0012] The first flow equalizing plate includes a first diversion hole and a first air outlet hole. The first diversion hole is connected to the first conduit, and the first air outlet hole faces the workpiece to be processed; the second flow equalizing plate includes a second diversion hole and a second air outlet hole. The second diversion hole is connected to the second conduit, and the second air outlet hole faces the workpiece to be processed; the third flow equalizing plate includes a third diversion hole and a third air outlet hole. The third diversion hole is connected to the third conduit, and the third air outlet hole faces the workpiece to be processed; the fourth flow equalizing plate includes a fourth diversion hole and a fourth air outlet hole. The fourth diversion hole is connected to the fourth conduit, and the fourth air outlet hole faces the workpiece to be processed.

[0013] In some embodiments, a fixing bracket is disposed within the first cavity, and the fixing bracket is adapted to fix the workpiece to be processed. Along the length direction of the fixing bracket, the first flow equalizing plate, the second flow equalizing plate, the third flow equalizing plate, and the fourth flow equalizing plate all extend from one end of the fixing bracket to the opposite end of the fixing bracket;

[0014] And / or, along the width direction of the fixing bracket, the first flow equalizing plate, the second flow equalizing plate, the third flow equalizing plate, and the fourth flow equalizing plate all extend from one end of the fixing bracket to the opposite end of the fixing bracket.

[0015] In some embodiments, the first flow equalizing plate is connected to a first driving rod, and the first driving rod is configured to drive the first flow equalizing plate to move in a direction close to or away from the workpiece to be processed; the second flow equalizing plate is connected to a second driving rod, and the second driving rod is configured to drive the second flow equalizing plate to move in a direction close to or away from the workpiece to be processed; the third flow equalizing plate is connected to a third driving rod, and the third driving rod is configured to drive the third flow equalizing plate to move in a direction close to or away from the workpiece to be processed;

[0016] Wherein, the fixing bracket is arranged on the fourth flow equalizing plate.

[0017] In some embodiments, along a first direction, the first conduit and the second conduit are oppositely arranged;

[0018] Along a second direction perpendicular to the first direction, the third conduit and the fourth conduit are oppositely arranged.

[0019] In some embodiments, the first container has a first opening, the first opening communicates with the first cavity, the second container has a second opening, the second opening communicates with the second cavity, and the second opening and the first opening are arranged in the same direction;

[0020] The reaction chamber device includes a sealing portion, the sealing portion is arranged on a side close to the first opening and the second opening, and the sealing portion is configured to be able to move in a direction close to or away from the first opening and the second opening, so that the sealing portion has a sealed state and an open state;

[0021] In the sealed state, the sealing portion seals the first opening and the second opening, and in the open state, the sealing portion opens the first opening and the second opening.

[0022] In some embodiments, the sealing portion includes:

[0023] A sealing plate for sealing the second opening, the sealing plate is provided with a sealing ventilation block, the sealing ventilation block is adapted to introduce the first reactant or the second reactant, and a ventilation pipe extends from the sealing ventilation block toward a side close to the second opening;

[0024] A spraying plate arranged on a side of the sealing plate close to the second opening, the spraying plate is used for sealing the first opening, the spraying plate has an insertion port and a spraying port, the insertion port is used for inserting the ventilation pipe, and the spraying port faces the workpiece to be processed;

[0025] Wherein, the first conduit is connected to the sealing ventilation block for introducing the first reactant into the sealing ventilation block;

[0026] Alternatively, the third conduit is connected to the sealed ventilation block for introducing the second reactant into the sealed ventilation block.

[0027] In some embodiments, an elastic part is provided between the sealing plate and the spraying plate.

[0028] In some embodiments, the first container is provided with a flanging part at the first opening, the flanging part extends along the circumferential direction of the first container away from the first container, and the second container is provided with a groove at the second opening;

[0029] Wherein, the flanging part is adapted to the groove to realize the sealed connection between the first container and the second container.

[0030] Correspondingly, the present invention also proposes another reaction chamber device, including:

[0031] A first container defining a first cavity adapted to receive a workpiece to be processed;

[0032] A conduit assembly connected to the first container, the conduit assembly including a first conduit, a second conduit, and a third conduit respectively communicating with the first cavity;

[0033] Wherein, the first conduit is adapted to sequentially introduce a first reactant and a second reactant into the first cavity, the first reactant and the second reactant can react on the surface of the workpiece to form a film on the surface of the workpiece, the second conduit is configured to export the first reactant that has not adhered to the surface of the workpiece from the first cavity when introducing the first reactant into the first cavity, and the third conduit is configured to export the second reactant that has not reacted with the first reactant from the first cavity when introducing the second reactant into the first cavity.

[0034] Correspondingly, the present invention also proposes a processing method, the processing method using the reaction chamber device described in any of the above embodiments to produce a workpiece to be processed;

[0035] The processing method includes:

[0036] Placing the workpiece to be processed in the first cavity;

[0037] Introducing a first reactant into the first cavity from a first position of the first container so that the first reactant adheres to the surface of the workpiece, and exporting the first reactant that has not adhered to the surface of the workpiece from the first cavity from a third position of the first container when introducing the first reactant into the first cavity;

[0038] Introduce a second reactant from the first position or the second position of the first container into the first cavity, so that the second reactant reacts with the first reactant attached to the surface of the workpiece to form a film on the surface of the workpiece. When introducing the second reactant into the first cavity, export the second reactant that has not reacted with the first reactant from the fourth position of the first container out of the first cavity.

[0039] In some embodiments, after introducing the first reactant into the first cavity and the first reactant is attached to the surface of the workpiece, introduce an inert gas into the first cavity;

[0040] And, after introducing the second reactant into the first cavity and a film is formed on the surface of the workpiece, introduce the inert gas into the first cavity.

[0041] Compared with the prior art, the beneficial effects of the present invention are:

[0042] In the technical solution of the present invention, when processing a workpiece using the reaction chamber device provided by the present invention (specifically, it can be a thin film deposition process of a silicon wafer), first, place the workpiece in the first cavity and ensure that the workpiece is fixed in the first cavity to prevent the introduced air flow from blowing the workpiece off when introducing the first reactant or the second reactant into the first cavity, which affects the processing quality of the workpiece. Secondly, introduce the first reactant into the first cavity through the first conduit, so that the first reactant sweeps the workpiece and adheres to the surface of the workpiece. At the same time, evacuate the air outward through the second conduit, so that the first reactant that has not adhered to the surface of the workpiece in the first cavity can be exported in time, thereby realizing the circulating flow of the first reactant in the first cavity. Then, stop the introduction and export of the first reactant, and introduce the second reactant into the first cavity through the third conduit, so that the second reactant sweeps the workpiece. At this time, the second reactant can react with the first reactant attached to the surface of the workpiece, and a film is formed on the surface of the workpiece. At the same time, evacuate the air outward through the fourth conduit, so that the second reactant that has not reacted with the first reactant in the first cavity can be exported in time, thereby realizing the circulating flow of the second reactant in the first cavity. Finally, repeatedly circulate the introduction and export of the first reactant and the second reactant in the first cavity to ensure that a dense film can be formed on the surface of the workpiece.

[0043] In the present invention, the first conduit and the second conduit only deliver the first reactant into the first cavity, and the third conduit and the fourth conduit only deliver the second reactant into the first cavity. Compared with delivering the first reactant and the second reactant into the first cavity successively through the same conduit, the first reactant and the second reactant in the present invention have different delivery paths, thus effectively preventing the first reactant and the second reactant remaining in the conduit from coming into contact and reacting to form powder in the conduit, ensuring that the conduit will not be blocked by the accumulated powder, thereby reducing the maintenance frequency of the equipment, shortening the maintenance period of the equipment, and reducing the maintenance cost of the equipment.

[0044] When using the above reaction chamber device to produce a workpiece to be processed, the first reactant and the second reactant are respectively introduced into the first cavity from different positions of the first container through the delivery conduits, and are led out of the first cavity from different positions of the first container through the delivery conduits, thereby preventing the first reactant and the second reactant from reacting to form powder after coming into contact in the delivery conduits, avoiding blockage of the delivery conduits caused by the accumulated powder, and being beneficial to reducing the maintenance cost of the reaction chamber device. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on the structures shown in these drawings without creative efforts.

[0046] Figure 1 It is a schematic diagram of the overall structure of the reaction chamber device provided by an embodiment of the present invention;

[0047] Figure 2 It is a cross-sectional view of the overall structure of the reaction chamber device provided by an embodiment of the present invention from the first perspective;

[0048] Figure 3 It is a cross-sectional view of the overall structure of the reaction chamber device provided by an embodiment of the present invention from the second perspective;

[0049] Figure 4 It is a cross-sectional view of the overall structure of the reaction chamber device provided by an embodiment of the present invention from the third perspective;

[0050] Figure 5 It is an exploded view of the overall structure of the reaction chamber device provided by an embodiment of the present invention;

[0051] Figure 6 It is a schematic diagram of the structure of the sealing part in the reaction chamber device provided by an embodiment of the present invention;

[0052] Figure 7Schematic flowchart of the processing method provided by an embodiment of the present invention.

[0053] Explanation of the reference numerals in the drawings:

[0054] 10. Reaction chamber device;

[0055] 100. First container;

[0056] 110. First cavity; 120. First opening; 130. Flanging portion;

[0057] 200. Second container;

[0058] 210. Second cavity; 220. Second opening; 230. Groove;

[0059] 300. Conduit assembly;

[0060] 310. First conduit; 320. Second conduit; 330. Third conduit; 340. Fourth conduit;

[0061] 400. First flow equalizing plate;

[0062] 410. First driving rod;

[0063] 500. Second flow equalizing plate;

[0064] 510. Second driving rod;

[0065] 600. Third flow equalizing plate;

[0066] 610. Third driving rod;

[0067] 700. Fourth flow equalizing plate;

[0068] 800. Fixed bracket;

[0069] 900. Sealing portion;

[0070] 910. Sealing plate; 920. Spraying plate; 930. Elastic portion;

[0071] 911. Sealing ventilation block; 912. Ventilation pipeline;

[0072] 1000. Workpiece to be processed;

[0073] X. First direction;

[0074] Y. Second direction.

[0075] The realization, functional features and advantages of the object of the present invention will be further described with reference to the embodiments and the accompanying drawings. Detailed implementation manners

[0076] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0077] It should be noted that if there are directional indications (such as up, down, left, right, front, back...) involved in the embodiments of the present invention, the directional indications are only used to explain the relative positional relationship and movement conditions between components in a certain specific posture. If the specific posture changes, the directional indications will also change accordingly.

[0078] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one such feature. In addition, if "and / or", "or / and" or "and / or" appears throughout the text, its meaning includes three parallel scenarios. Taking "A and / or B" as an example, it includes scenario A, scenario B, or the scenario where A and B are satisfied simultaneously. In addition, the technical solutions between various embodiments can be combined with each other, but it must be based on the ability of those of ordinary skill in the art to implement. When the combination of technical solutions results in contradictions or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the protection scope required by the present invention.

[0079] The tubular ALD device exposes the carrier (aluminum boat) to different precursors in the time dimension, so that the surface of the workpiece to be processed alternately adsorbs a layer (two kinds) of precursor atoms and undergoes a chemical reaction to generate the required thin film. In the traditional photovoltaic field, the deposited thin film is generally Al 2 O 3 , and the precursors are generally liquid Al(CH 3 ) 3 and H 2 O (pure water), and are carried into the reaction chamber by bubbling through PN 2 (high-purity nitrogen).

[0080] In the current tubular ALD equipment, two different precursors are usually transported into the reaction chamber in sequence by the same air inlet duct, and the two different precursors that have not reacted in the reaction chamber are successively discharged out of the reaction chamber by the same air outlet duct. In short, the current tubular ALD equipment only has one common air inlet duct and air outlet duct. In the above structure, it is easy for the precursor to remain in both the air inlet duct and the air outlet duct. If the two precursors in the air inlet duct or the air outlet duct come into contact and react, powder will be generated in the air inlet duct or the air outlet duct. As the number of processes increases, the accumulation of powder in the air inlet duct or the air outlet duct becomes more serious, causing the air inlet duct or the air outlet duct to be easily blocked, resulting in a high maintenance frequency, short maintenance cycle and high maintenance cost for the tubular ALD equipment.

[0081] Based on this, in order to solve the technical problems of high maintenance frequency, short maintenance cycle and high maintenance cost of current tubular ALD equipment, refer to Figures 1 to 5 An embodiment of the present invention provides a reaction chamber device 10, which includes a first container 100 and a catheter assembly 300. The first container 100 defines a first cavity 110, which is suitable for accommodating a workpiece 1000 to be processed, and the workpiece 1000 to be processed may be a silicon wafer. The first cavity 110 may accommodate a plurality of workpieces 1000 to be processed, and the plurality of workpieces 1000 to be processed may be stacked in the first cavity 110. The catheter assembly 300 is connected to the first container 100, and the catheter assembly 300 includes a first catheter 310, a second catheter 320, a third catheter 330, and a fourth catheter 340 respectively connected to the first cavity 110. The first catheter 310 is suitable for introducing a first reactant (for example, the first reactant may be Al(CH)) into the first cavity 110. 3 ) 3 PN 2 ), the first reactant can adhere to the surface of the workpiece 1000. The second conduit 320 is configured to guide the first reactant that is not attached to the surface of the workpiece 1000 out of the first cavity 110 when the first reactant is introduced into the first cavity 110. The third conduit 330 is suitable for introducing the second reactant (for example, the second reactant can be a liquid carrying H 2 O'PN 2 ), the second reactant can adhere to the surface of the workpiece 1000 and react with the first reactant to form a thin film on the surface of the workpiece 1000. The fourth conduit 340 is configured to guide the second reactant that has not reacted with the first reactant out of the first cavity 110 when the second reactant is introduced into the first cavity 110.

[0082] Preferably, valves are provided on the first conduit 310, the second conduit 320, the third conduit 330, and the fourth conduit 340. When introducing the first reactant into the first cavity 110 through the first conduit 310 and discharging the first reactant from the first cavity 110 through the second conduit 320, the valves of the first conduit 310 and the second conduit 320 can be in the open state, while the valves of the third conduit 330 and the fourth conduit 340 can be in the closed state, ensuring that the first reactant is only transported by the first conduit 310 and the second conduit 320 and will not escape into the third conduit 330 and the fourth conduit 340. When introducing the second reactant into the first cavity 110 through the third conduit 330 and discharging the second reactant from the first cavity 110 through the fourth conduit 340, the valves of the first conduit 310 and the second conduit 320 can be in the closed state, while the valves of the third conduit 330 and the fourth conduit 340 can be in the open state, ensuring that the second reactant is only transported by the third conduit 330 and the fourth conduit 340 and will not escape into the first conduit 310 and the second conduit 320.

[0083] Specifically, in this embodiment, when processing the workpiece 1000 using the reaction chamber device 10 provided in this embodiment (specifically, it can be a thin film deposition process for a silicon wafer), first, place the workpiece 1000 in the first cavity 110 and ensure that the workpiece 1000 is fixed in the first cavity 110 to prevent the introduced airflow from blowing the workpiece 1000 off when introducing the first reactant or the second reactant into the first cavity 110, which may affect the processing quality of the workpiece 1000. Second, introduce the first reactant into the first cavity 110 through the first conduit 310, so that the first reactant sweeps the workpiece 1000 and adheres to the surface of the workpiece 1000. At the same time, draw air out through the second conduit 320, so that the first reactant that has not adhered to the surface of the workpiece 1000 in the first cavity 110 can be discharged in time, thereby realizing the cyclic flow of the first reactant in the first cavity 110. Then, stop the introduction and discharge of the first reactant, and introduce the second reactant into the first cavity 110 through the third conduit 330, so that the second reactant sweeps the workpiece 1000. At this time, the second reactant can react with the first reactant adhering to the surface of the workpiece 1000, and a thin film is formed on the surface of the workpiece 1000. At the same time, draw air out through the fourth conduit 340, so that the second reactant that has not reacted with the first reactant in the first cavity 110 can be discharged in time, thereby realizing the cyclic flow of the second reactant in the first cavity 110. Finally, repeatedly cycle the introduction and discharge of the first reactant and the second reactant in the first cavity 110 to ensure that a dense thin film can be formed on the surface of the workpiece 1000.

[0084] In this embodiment, the first conduit 310 and the second conduit 320 only convey the first reactant into the first cavity 110, and the third conduit 330 and the fourth conduit 340 only convey the second reactant into the first cavity 110. Compared with conveying the first reactant and the second reactant into the first cavity 110 successively by the same conduit, the first reactant and the second reactant in this embodiment have different conveying paths, thus effectively preventing the first reactant and the second reactant remaining in the conduit from coming into contact and reacting to form powder in the conduit, ensuring that the conduit will not be blocked by the accumulated powder, thereby reducing the maintenance frequency of the equipment, shortening the maintenance cycle of the equipment, and reducing the maintenance cost of the equipment.

[0085] In some embodiments, referring to Figures 1 to 5 , the reaction chamber device 10 includes a second container 200 which defines a second cavity 210, and the first container 100 is disposed in the second cavity 210. The first container 100 and the second container 200 are kept in a relatively sealed state to prevent the first reactant and the second reactant in the first cavity 110 from flowing into the second cavity 210 and reacting to form powder in the second cavity 210, increasing the maintenance difficulty of the reaction chamber device 10. Wherein, a heating element is disposed in the second cavity 210, and the heating element is used to heat the first container 100.

[0086] Specifically, in this embodiment, in order to ensure the processing quality and processing accuracy of the workpiece 1000 to be processed and prevent impurities from being generated on the surface of the workpiece 1000 to be processed, the workpiece 1000 to be processed needs to be processed in a vacuum environment. Before introducing the first reactant and the second reactant into the first cavity 110, the first cavity 110 and the second cavity 210 need to be evacuated first. For example, the second cavity 210 can be connected to an evacuation tube, and the first cavity 110 can be evacuated by using the first conduit 310 or the second conduit 320 or the third conduit 330 or the fourth conduit 340, and the second cavity 210 can be evacuated by using the evacuation tube. After evacuating the first cavity 110 and the second cavity 210, since there is a pressure difference between the inside of the first cavity 110, the second cavity 210 and the external atmosphere, in order to avoid deformation of the first container 100 and the second container 200 and at the same time ensure the heating effect of the heating element on the second container 200, the wall thickness of the second container 200 can be thickened so that the second container 200 can withstand the atmospheric pressure, and the wall thickness of the first container 100 can be thinned so that the heat of the heating element can be more easily transferred into the first cavity 110, ensuring the processing efficiency of the workpiece 1000 in the first cavity 110.

[0087] In some embodiments, referring to Figures 1 to 5, circumferentially around the workpiece 1000 to be processed (specifically, the upper, lower, left, and right four directions of the workpiece 1000 to be processed), a first flow equalizing plate 400, a second flow equalizing plate 500, a third flow equalizing plate 600, and a fourth flow equalizing plate 700 are provided in the first cavity 110 (for example, the first flow equalizing plate 400 can be provided above the workpiece 1000 to be processed, the second flow equalizing plate 500 can be provided below the workpiece 1000 to be processed, the third flow equalizing plate 600 can be provided to the left of the workpiece 1000 to be processed, and the fourth flow equalizing plate 700 can be provided to the right of the workpiece 1000 to be processed). The first flow equalizing plate 400 includes a first diversion hole and a first air outlet hole. The first diversion hole is connected to the first conduit 310, and the first air outlet hole faces the workpiece 1000. The second flow equalizing plate 500 includes a second diversion hole and a second air outlet hole. The second diversion hole is connected to the second conduit 320, and the second air outlet hole faces the workpiece 1000. The third flow equalizing plate 600 includes a third diversion hole and a third air outlet hole. The third diversion hole is connected to the third conduit 330, and the third air outlet hole faces the workpiece 1000. The fourth flow equalizing plate 700 includes a fourth diversion hole and a fourth air outlet hole. The fourth diversion hole is connected to the fourth conduit 340, and the fourth air outlet hole faces the workpiece 1000.

[0088] Specifically, in this embodiment, the first reactant in the first conduit 310 can be transported to the first flow equalizing plate 400 through the first diversion hole and diffused to the workpiece 1000 through the first air outlet hole. After the first reactant purges the workpiece 1000 (during the purging process, the first reactant will adhere to the surface of the workpiece 1000), it can be sucked to the second air outlet hole and flow into the second flow equalizing plate 500 through the second air outlet hole, and finally flow into the second conduit 320 through the second diversion hole. The first reactant is exported from the first cavity 110 through the second conduit 320, realizing the circulating flow of the first reactant in the first cavity 110. Similarly, the second reactant in the third conduit 330 can be transported to the third flow equalizing plate 600 through the third diversion hole and diffused to the workpiece 1000 through the third air outlet hole. After the second reactant purges the workpiece 1000 (during the purging process, the second reactant will react with the first reactant adhering to the surface of the workpiece 1000, thereby forming a thin film on the surface of the workpiece 1000), it can be sucked to the fourth air outlet hole and flow into the fourth flow equalizing plate 700 through the fourth air outlet hole, and finally flow into the fourth conduit 340 through the fourth diversion hole. The second reactant is exported from the first cavity 110 through the fourth conduit 340, realizing the circulating flow of the second reactant in the first cavity 110.

[0089] In this embodiment, through the first flow equalizing plate 400, the second flow equalizing plate 500, the third flow equalizing plate 600, and the fourth flow equalizing plate 700, it is ensured that the first reactant and the second reactant can be evenly diffused in the first cavity 110, so that the first reactant and the second reactant evenly purge the workpiece 1000 to be processed, preventing the first reactant and the second reactant from concentrating at a certain position in the first cavity 110. Since a plurality of workpieces 1000 to be processed are stacked in the first cavity 110, with the above structure, it can be ensured that the surfaces of each workpiece 1000 are effectively attached with the first reactant and the second reactant, thereby ensuring the efficiency and quality of thin film deposition on the surface of each workpiece 1000.

[0090] In some embodiments, referring to Figures 2 to 5 , a fixing bracket 800 is provided in the first cavity 110, and the fixing bracket 800 is adapted to fix the workpiece 1000 to be processed. For example, if the workpiece 1000 to be processed is a silicon wafer, the fixing bracket 800 can be an aluminum boat, and a plurality of silicon wafers can be vertically stacked on the aluminum boat. Along the length direction of the fixing bracket 800, the first flow equalizing plate 400, the second flow equalizing plate 500, the third flow equalizing plate 600, and the fourth flow equalizing plate 700 all extend from one end of the fixing bracket 800 to the opposite end of the fixing bracket 800. And / or, along the width direction of the fixing bracket 800, the first flow equalizing plate 400, the second flow equalizing plate 500, the third flow equalizing plate 600, and the fourth flow equalizing plate 700 all extend from one end of the fixing bracket 800 to the opposite end of the fixing bracket 800.

[0091] Specifically, in this embodiment, the length and width dimensions of the first flow equalizing plate 400, the second flow equalizing plate 500, the third flow equalizing plate 600, and the fourth flow equalizing plate 700 correspond to the length and width dimensions of the fixing bracket 800, ensuring that the first flow equalizing plate 400, the second flow equalizing plate 500, the third flow equalizing plate 600, and the fourth flow equalizing plate 700 can completely cover the fixing bracket 800, so that a plurality of workpieces 1000 stacked on the fixing bracket 800 can all fully contact the first reactant and the second reactant, thereby improving the efficiency and effect of thin film deposition on the surface of the workpiece 1000.

[0092] In some embodiments, referring to Figure 4, the first flow equalizing plate 400 is connected to the first driving rod 410, and the first driving rod 410 is configured to drive the first flow equalizing plate 400 to move in a direction closer to or away from the workpiece 1000 to be processed. The second flow equalizing plate 500 is connected to the second driving rod 510, and the second driving rod 510 is configured to drive the second flow equalizing plate 500 to move in a direction closer to or away from the workpiece 1000 to be processed. The third flow equalizing plate 600 is connected to the third driving rod 610, and the third driving rod 610 is configured to drive the third flow equalizing plate 600 to move in a direction closer to or away from the workpiece 1000 to be processed. The first driving rod 410, the second driving rod 510, and the third driving rod 610 can be driven by a driving motor or a driving cylinder. Among them, the fixed bracket 800 is arranged on the fourth flow equalizing plate 700.

[0093] Specifically, in this embodiment, when processing the workpiece 1000 to be processed, the first driving rod 410 drives the first flow equalizing plate 400 to move in a direction closer to the workpiece 1000 to be processed, so as to shorten the distance between the first flow equalizing plate 400 and the workpiece 1000 to be processed. At the same time, the second driving rod 510 drives the second flow equalizing plate 500 to move in a direction closer to the workpiece 1000 to be processed, so as to shorten the distance between the second flow equalizing plate 500 and the workpiece 1000 to be processed. At the same time, the third driving rod 610 drives the third flow equalizing plate 600 to move in a direction closer to the workpiece 1000 to be processed, so as to shorten the distance between the third flow equalizing plate 600 and the workpiece 1000 to be processed. And, since the fourth flow equalizing plate 700 bears the fixed bracket 800, and the fixed bracket 800 is used to fix the workpiece 1000 to be processed, the distance between the fourth flow equalizing plate 700 and the workpiece 1000 to be processed is relatively short, and there is no need to adjust the position of the fourth flow equalizing plate 700. At the same time, keeping the fourth flow equalizing plate 700 relatively fixed can ensure the placement stability of the fixed bracket 800, prevent the workpiece 1000 from shifting due to moving the fixed bracket 800, and ultimately affect the processing quality of the workpiece 1000 to be processed.

[0094] Arranging the first flow equalizing plate 400, the second flow equalizing plate 500, the third flow equalizing plate 600, and the fourth flow equalizing plate 700 close to the workpiece 1000 to be processed can ensure that most of the first reactant and the second reactant directly flow to the fixed bracket 800, so that the first reactant, the second reactant and the surface of the workpiece 1000 to be processed are in full contact and react, improving the utilization rate of the first reactant and the second reactant, as well as the efficiency and quality of the film formed on the surface of the workpiece 1000 to be processed. At the same time, arranging the first flow equalizing plate 400, the second flow equalizing plate 500, the third flow equalizing plate 600, and the fourth flow equalizing plate 700 close to the workpiece 1000 to be processed can effectively prevent the first reactant and the second reactant from diffusing everywhere in the first cavity 110, avoid the formation of reaction powder on the inner side wall of the first container 100, thereby reducing the frequency of cleaning and maintaining the first container 100 and lowering the cost of cleaning and maintaining the first container 100.

[0095] After the workpiece 1000 to be processed is coated, the first driving rod 410 drives the first flow equalizing plate 400 to move away from the workpiece 1000 to increase the spacing distance between the first flow equalizing plate 400 and the workpiece 1000. At the same time, the second driving rod 510 drives the second flow equalizing plate 500 to move away from the workpiece 1000 to increase the spacing distance between the second flow equalizing plate 500 and the workpiece 1000. At the same time, the third driving rod 610 drives the third flow equalizing plate 600 to move away from the workpiece 1000 to increase the spacing distance between the third flow equalizing plate 600 and the workpiece 1000. Through the above operations, it is convenient to move the fixing bracket 800 out of the first cavity 110, ensuring that the fixing bracket 800 will not interfere with the first flow equalizing plate 400, the second flow equalizing plate 500, and the third flow equalizing plate 600 when moving the fixing bracket 800.

[0096] Referring to the above embodiments, since the reaction chamber device 10 includes the first container 100 and the second container 200, and the first driving rod 410, the second driving rod 510, and the third driving rod 610 need to pass through the second container 200 and extend into the first container 100. In order to ensure that the first container 100 and the second container 200 are in a relatively sealed state, a sealing bellows can be provided between the first container 100 and the second container 200, and an independent sealing channel is formed inside the sealing bellows. The first driving rod 410, the second driving rod 510, and the third driving rod 610 can first pass through the sealing bellows and then extend into the first cavity 110.

[0097] In some embodiments, referring to Figures 1 to 5 , along the first direction X, the first conduit 310 and the second conduit 320 are arranged oppositely. Along the second direction Y perpendicular to the first direction X, the third conduit 330 and the fourth conduit 340 are arranged oppositely. That is, the flow paths of the first reactant and the second reactant are arranged in a cross manner. For example, if the first direction X is the length direction of the first container 100, the second direction Y can be the width direction or the height direction of the first container 100 to ensure that the first reactant and the second reactant can flow into the first cavity 110 from different directions.

[0098] Specifically, in this embodiment, the first conduit 310 and the second conduit 320 are arranged oppositely, which can extend the flow path of the first reactant in the first cavity 110 and ensure that the first reactant can fully contact and react with the workpiece 1000. Similarly, the third conduit 330 and the fourth conduit 340 are arranged oppositely, which can extend the flow path of the second reactant in the first cavity 110 and ensure that the second reactant can fully contact and react with the workpiece 1000, thereby facilitating the improvement of the processing quality and processing efficiency of the finally formed film on the surface of the workpiece 1000.

[0099] The flow paths of the first reactant and the second reactant are arranged to cross each other, which can reduce the direct contact between the first reactant and the second reactant, avoid the generation of a large amount of powder of the first reactant and the second reactant in the first cavity 110, thus being beneficial to maintaining the cleanliness in the first cavity 110 and reducing the maintenance frequency of the first container 100.

[0100] In some embodiments, referring to Figure 5 and Figure 6 , the first container 100 has a first opening 120, the first opening 120 communicates with the first cavity 110, the second container 200 has a second opening 220, the second opening 220 communicates with the second cavity 210, and the second opening 220 and the first opening 120 are arranged in the same direction. The reaction chamber device 10 includes a sealing portion 900, and the sealing portion 900 is disposed on one side close to the first opening 120 and the second opening 220. The sealing portion 900 is configured to be movable in a direction close to or away from the first opening 120 and the second opening 220, so that the sealing portion 900 has a sealed state and an open state. In the sealed state, the sealing portion 900 seals the first opening 120 and the second opening 220, and in the open state, the sealing portion 900 opens the first opening 120 and the second opening 220.

[0101] Specifically, in this embodiment, when the workpiece 1000 to be processed is placed into the first cavity 110 or removed from the first cavity 110, the sealing portion 900 is driven to move in a direction away from the first opening 120 and the second opening 220, so that the first opening 120 and the second opening 220 are in an open state. At this time, the workpiece 1000 can be moved in or out through the first opening 120 and the second opening 220. When processing the workpiece 1000, the sealing portion 900 is driven to move in a direction close to the first opening 120 and the second opening 220, so that the first opening 120 and the second opening 220 are in a sealed state. At this time, the sealing performance inside the first container 100 and the second container 200 can be ensured, the first reactant and the second reactant in the first container 100 can be ensured not to escape, and the second container 200 can be ensured to be in a vacuum state.

[0102] In some embodiments, the sealing portion 900 has at least two degrees of freedom. For example, the sealing portion 900 can move along the axial direction of the first container 100 (or the second container 200). At the same time, the sealing portion 900 can also move in a direction perpendicular to the axial direction of the first container 100 (or the second container 200), ensuring that the first opening 120 and the second opening 220 have a sufficiently large opening area and preventing the sealing portion 900 from interfering with the movement in or out of the workpiece 1000.

[0103] In some embodiments, reference Figure 6 , the sealing part 900 includes a sealing plate 910 and a spray plate 920. The sealing plate 910 is used to seal the second opening 220, and the sealing plate 910 is provided with a sealing ventilation block 911, which is suitable for passing the first reactant or the second reactant, and the sealing ventilation block 911 is extended to a side close to the second opening 220 and is provided with a ventilation pipe 912. The ventilation pipe 912 is sealed and connected between the sealing ring and the sealing plate 910. The spray plate 920 is arranged on a side of the sealing plate 910 close to the second opening 220, and the spray plate 920 is used to seal the first opening 120. The spray plate 920 has a plug-in interface and a spray port, and the plug-in interface is used to plug the ventilation pipe 912, and the spray port faces the workpiece 1000 to be processed. Among them, the first conduit 310 is connected to the sealing ventilation block 911, and is used to pass the first reactant into the sealing ventilation block 911. Alternatively, the third conduit 330 is connected to the sealed ventilation block 911 and is used to introduce the second reactant into the sealed ventilation block 911 .

[0104] It should be noted that the function of the spray plate 920 is similar to that of the first flow plate 400 , the second flow plate 500 , the third flow plate 600 and the fourth flow plate 700 in the above embodiment, and can ensure that the first reactant or the second reactant is evenly diffused in the first cavity 110 .

[0105] Specifically, in the present embodiment, when the sealing portion 900 is in a sealed state, the sealing plate 910 of the sealing portion 900 can seal the second container 200, and the spray plate 920 of the sealing portion 900 can seal the first container 100, so that the first container 100 and the second container 200 are in a relatively sealed state. The first reactant or the second reactant can be introduced into the first cavity 110 along the axial direction of the first container 100 (or the second container 200) through the spray plate 920. For example, when the first reactant is introduced into the first cavity 110 through the spray plate 920, the sealing ventilation block 911 can be connected to the first conduit 310. At this time, the first reactant in the first conduit 310 can flow into the sealing ventilation block 911, and through the ventilation pipe 912, the first reactant in the sealing ventilation block 911 can flow from the plug interface to the spray plate 920, and finally the first reactant is introduced into the first cavity 110 by the spray port of the spray plate 920. The first reactant in the first cavity 110 can be discharged from an end of the first container 100 opposite to the shower plate 920 .

[0106] For another example, when introducing the second reactant into the first cavity 110 through the spray plate 920, the sealed ventilation block 911 can be connected to the third conduit 330. At this time, the second reactant in the third conduit 330 can flow into the sealed ventilation block 911. Through the ventilation pipe 912, the second reactant in the sealed ventilation block 911 can flow from the insertion port into the spray plate 920, and finally the second reactant can be introduced into the first cavity 110 through the spray ports of the spray plate 920. The second reactant in the first cavity 110 can be exported from the end of the first container 100 opposite to the spray plate 920.

[0107] In the above structure, the spray plate 920 can not only be used to seal the first container 100, but also introduce the first reactant or the second reactant into the first cavity 110, which is beneficial to simplifying the structural design of the reaction chamber device 10.

[0108] In some embodiments, the first conduit 310 or the third conduit 330 connected to the sealed ventilation block 911 can be a corrugated pipe with telescopic elasticity. When the sealing part 900 moves towards or away from the first opening 120 and the second opening 220, the first conduit 310 or the third conduit 330 can telescopically expand or contract, so as not to affect the movement of the sealing part 900.

[0109] In some embodiments, referring to Figure 6 , an elastic part 930 is provided between the sealing plate 910 and the spray plate 920.

[0110] Specifically, in this embodiment, the distance between the spray plate 920 and the sealing plate 910 can be greater than the distance from the fixed bracket 800 to the outer end face of the first opening 120. When the spray plate 920 seals the first opening 120, it will be subjected to the extrusion force of the fixed bracket 800. At this time, the spray plate 920 has a tendency to move towards the sealing plate 910. Under the action of the elastic part 930, the spray plate 920 will be in close contact with the fixed bracket 800, thereby effectively shortening the interval distance between the spray plate 920 and the workpiece 1000 on the fixed bracket 800, and improving the contact reaction effect between the first reactant or the second reactant and the workpiece 1000.

[0111] It should be noted that, in the above embodiments, the ventilation pipe 912 can be a corrugated pipe with stretchability to ensure that the spray plate 920 can achieve dynamic adjustment. Or, a small gap can be reserved between the ventilation pipe 912 and the spray plate 920 to ensure that the spray plate 920 can have a movable space.

[0112] In some embodiments, referring to Figure 5, at the first opening 120 of the first container 100, a flanging portion 130 is provided, and the flanging portion 130 extends along the circumferential direction of the first container 100 away from the first container 100. At the second opening 220 of the second container 200, a groove 230 is provided. Among them, the flanging portion 130 is adapted to the groove 230 to achieve the sealed connection between the first container 100 and the second container 200.

[0113] Specifically, in this embodiment, through the cooperation between the flanging portion 130 and the groove 230, the tight connection between the first container 100 and the second container 200 can be achieved, the connection gap between the first container 100 and the second container 200 can be eliminated, the relative seal between the first container 100 and the second container 200 can be ensured, and the first reactant or the second reactant in the first cavity 110 can be effectively prevented from escaping into the second cavity 210.

[0114] Correspondingly, another embodiment of the present invention further provides a reaction chamber device 10, which includes a first container 100 and a conduit assembly 300. The first container 100 defines a first cavity 110, and the first cavity 110 is adapted to accommodate a workpiece 1000 to be processed. The conduit assembly 300 is connected to the first container 100, and the conduit assembly 300 includes a first conduit 310, a second conduit 320, and a third conduit 330 that are respectively communicated with the first cavity 110. Among them, the first conduit 310 is adapted to sequentially introduce a first reactant and a second reactant into the first cavity 110, and the first reactant and the second reactant can react on the surface of the workpiece 1000 to form a film on the surface of the workpiece 1000. The second conduit 320 is configured to export the first reactant that is not attached to the surface of the workpiece 1000 from the first cavity 110 when introducing the first reactant into the first cavity 110. The third conduit 330 is configured to export the second reactant that does not react with the first reactant from the first cavity 110 when introducing the second reactant into the first cavity 110.

[0115] Specifically, different from the reaction chamber device 10 provided in the above first embodiment, in the reaction chamber device 10 provided in this embodiment, the first reactant and the second reactant are sequentially introduced into the first cavity 110 through the same conduit (i.e., the first conduit 310), and the first reactant and the second reactant in the first cavity 110 are respectively exported through different conduits (i.e., the second conduit 320 and the third conduit 330). Since the air flow in the intake conduit (i.e., the first conduit 310) is large, compared with the exhaust conduits (i.e., the second conduit 320 and the third conduit 330), the amount of powder generated by the reaction of the first reactant and the second reactant in the intake conduit (i.e., the first conduit 310) is small, that is, the intake conduit (i.e., the first conduit 310) is not easily blocked. With the above structure, it is beneficial to simplify the pipeline layout of the reaction chamber device 10.

[0116] Correspondingly, another embodiment of the present invention further provides a processing method. Referring to Figure 7 , this processing method uses the reaction chamber device 10 provided in the above first embodiment or uses the reaction chamber device 10 provided in the above second embodiment to produce the workpiece 1000 to be processed. This processing method includes the following steps:

[0117] S100: Place the workpiece 1000 to be processed in the first cavity 110.

[0118] S200: Introduce the first reactant into the first cavity 110 from the first position of the first container 100, so that the surface of the workpiece 1000 is attached with the first reactant. When introducing the first reactant into the first cavity 110, export the first reactant that is not attached to the surface of the workpiece 1000 from the third position of the first container 100 out of the first cavity 110.

[0119] S300: Introduce the second reactant into the first cavity 110 from the first position or the second position of the first container 100, so that the second reactant reacts with the first reactant attached to the surface of the workpiece 1000, and a thin film is formed on the surface of the workpiece 1000. When introducing the second reactant into the first cavity 110, export the second reactant that has not reacted with the first reactant from the fourth position of the first container 100 out of the first cavity 110.

[0120] S400: Recursively introduce the first reactant and the second reactant into the first container 100 several times to ensure that a dense thin film is deposited on the surface of the workpiece 1000.

[0121] Specifically, in this embodiment, when using the above reaction chamber device 10 to produce the workpiece 1000 to be processed, the first reactant and the second reactant are respectively introduced into the first cavity 110 from different positions of the first container 100 through the conveying conduits, and are exported from different positions of the first container 100 out of the first cavity 110 through the conveying conduits, so as to prevent the first reactant and the second reactant from reacting in the conveying conduits to generate powder, avoid the blockage of the conveying conduits caused by the accumulated powder, and is beneficial to reducing the maintenance cost of the reaction chamber device 10.

[0122] In some embodiments, after introducing the first reactant into the first cavity 110 and the surface of the workpiece 1000 is attached with the first reactant, an inert gas is introduced into the first cavity 110. And, after introducing the second reactant into the first cavity 110 and a thin film is formed on the surface of the workpiece 1000, an inert gas is introduced into the first cavity 110. For example, the inert gas can be high-purity nitrogen.

[0123] Specifically, in this embodiment, after the first reactant and the workpiece 1000 are in full contact, the remaining first reactant in the first cavity 110 is drained using an inert gas. After the second reactant and the workpiece 1000 are in full contact, the remaining second reactant in the first cavity 110 is drained using an inert gas. By intermittently introducing the inert gas into the first cavity 110, it is possible to effectively prevent the reaction between the first reactant and the second reactant remaining in the first cavity 110, thereby generating more powder in the first cavity 110. This is conducive to reducing the frequency of cleaning and maintenance of the first container 100, extending the cycle of cleaning and maintenance of the first container 100, and reducing the cost of cleaning and maintenance of the first container 100.

[0124] Thanks to the improvement of the reaction chamber device 10 described above, the processing method of this embodiment has the same technical effects as the above reaction chamber device 10, which will not be elaborated here.

[0125] It should be noted that other contents of the reaction chamber device 10 and the processing method disclosed in the present invention can be referred to the prior art, which will not be elaborated here.

[0126] The above are only the preferred embodiments of the present invention, and do not limit the patent scope of the present invention accordingly. Any equivalent structural transformation made using the description and drawings of the present invention under the inventive concept of the present invention, or direct / indirect application in other related technical fields, is included in the patent protection scope of the present invention.

Claims

1. A reaction chamber device, characterized in that: include: A first container, wherein the first container defines a first cavity, and the first cavity is suitable for accommodating a workpiece to be processed; A catheter assembly, the catheter assembly is connected to the first container, the catheter assembly includes a first catheter, a second catheter, a third catheter and a fourth catheter respectively connected to the first cavity; The first conduit is suitable for introducing a first reactant into the first cavity, the first reactant being able to adhere to the surface of the workpiece to be processed; the second conduit is configured to guide the first reactant that is not attached to the surface of the workpiece to be processed out of the first cavity when the first reactant is introduced into the first cavity; the third conduit is suitable for introducing a second reactant into the first cavity, the second reactant being able to adhere to the surface of the workpiece to be processed and react with the first reactant to form a thin film on the surface of the workpiece to be processed; and the fourth conduit is configured to guide the second reactant that is not reacted with the first reactant out of the first cavity when the second reactant is introduced into the first cavity.

2. The reaction chamber device according to claim 1, characterized in that: The reaction chamber device comprises a second container, the second container defines a second cavity, and the first container is disposed in the second cavity; Wherein, a heating element is arranged in the second cavity, and the heating element is used to heat the first container.

3. The reaction chamber device according to claim 1, characterized in that: A first flow equalizer plate, a second flow equalizer plate, a third flow equalizer plate and a fourth flow equalizer plate are arranged in the first cavity around the circumference of the workpiece to be processed; The first flow equalizer plate includes a first guide hole and a first air outlet, the first guide hole is connected to the first conduit, and the first air outlet faces the workpiece to be processed; the second flow equalizer plate includes a second guide hole and a second air outlet, the second guide hole is connected to the second conduit, and the second air outlet faces the workpiece to be processed; the third flow equalizer plate includes a third guide hole and a third air outlet, the third guide hole is connected to the third conduit, and the third air outlet faces the workpiece to be processed; the fourth flow equalizer plate includes a fourth guide hole and a fourth air outlet, the fourth guide hole is connected to the fourth conduit, and the fourth air outlet faces the workpiece to be processed.

4. The reaction chamber device according to claim 3, characterized in that: A fixing bracket is provided in the first cavity, and the fixing bracket is suitable for fixing the workpiece to be processed. Along the length direction of the fixing bracket, the first flow plate, the second flow plate, the third flow plate and the fourth flow plate all extend from one end of the fixing bracket to the other end opposite to the fixing bracket; And / or, along the width direction of the fixing bracket, the first flow equalizer plate, the second flow equalizer plate, the third flow equalizer plate and the fourth flow equalizer plate all extend from one end of the fixing bracket to the other end opposite to the fixing bracket.

5. The reaction chamber device according to claim 4, characterized in that: The first flow equalizer plate is connected to a first driving rod, and the first driving rod is configured to drive the first flow equalizer plate to move in a direction close to or away from the workpiece to be processed; the second flow equalizer plate is connected to a second driving rod, and the second driving rod is configured to drive the second flow equalizer plate to move in a direction close to or away from the workpiece to be processed; the third flow equalizer plate is connected to a third driving rod, and the third driving rod is configured to drive the third flow equalizer plate to move in a direction close to or away from the workpiece to be processed; Wherein, the fixing bracket is arranged on the fourth flow equalizer plate.

6. The reaction chamber device according to claim 1, characterized in that: Along a first direction, the first conduit and the second conduit are arranged opposite to each other; The third conduit and the fourth conduit are arranged opposite to each other along a second direction perpendicular to the first direction.

7. The reaction chamber device according to claim 2, characterized in that: The first container has a first opening, the first opening is connected to the first cavity, the second container has a second opening, the second opening is connected to the second cavity, and the second opening and the first opening are arranged in the same direction; The reaction chamber device comprises a sealing portion, the sealing portion is arranged at a side close to the first opening and the second opening, and the sealing portion is configured to be able to move toward or away from the first opening and the second opening, so that the sealing portion has a sealing state and an open state; In the sealed state, the sealing portion seals the first opening and the second opening, and in the open state, the sealing portion opens the first opening and the second opening.

8. The reaction chamber device according to claim 7, characterized in that: The sealing portion comprises: A sealing plate, the sealing plate is used to seal the second opening, the sealing plate is provided with a sealing ventilation block, the sealing ventilation block is suitable for introducing the first reactant or the second reactant, and the sealing ventilation block is provided with a ventilation pipe extending toward a side close to the second opening; A spray plate, the spray plate is arranged on a side of the sealing plate close to the second opening, the spray plate is used to seal the first opening, the spray plate has an insertion port and a spray port, the insertion port is used to plug the ventilation pipe, and the spray port faces the workpiece to be processed; Wherein, the first conduit is connected to the sealed ventilation block and is used to introduce the first reactant into the sealed ventilation block; Alternatively, the third conduit is connected to the sealed ventilation block and is used to introduce the second reactant into the sealed ventilation block.

9. The reaction chamber device according to claim 8, characterized in that: An elastic portion is arranged between the sealing plate and the shower plate.

10. The reaction chamber device according to claim 7, characterized in that: The first container is provided with a flange portion at the first opening, and the flange portion is extended along the circumference of the first container in a direction away from the first container, and the second container is provided with a groove at the second opening; The flange portion is adapted to the groove to achieve a sealed connection between the first container and the second container.

11. A reaction chamber device, characterized in that: include: A first container, wherein the first container defines a first cavity, and the first cavity is suitable for accommodating a workpiece to be processed; A catheter assembly, the catheter assembly is connected to the first container, the catheter assembly includes a first catheter, a second catheter and a third catheter respectively connected to the first cavity; The first conduit is suitable for sequentially introducing a first reactant and a second reactant into the first cavity, the first reactant and the second reactant can react on the surface of the workpiece to be processed to form a thin film on the surface of the workpiece to be processed, the second conduit is configured to guide the first reactant that is not attached to the surface of the workpiece to be processed out of the first cavity when the first reactant is introduced into the first cavity, and the third conduit is configured to guide the second reactant that has not reacted with the first reactant out of the first cavity when the second reactant is introduced into the first cavity.

12. A processing method, characterized in that: The processing method utilizes the reaction chamber device according to any one of claims 1 to 11 to produce a workpiece to be processed; The processing method comprises: Placing the workpiece to be processed in the first cavity; Introducing a first reactant into the first cavity from a first position of the first container so that the first reactant adheres to the surface of the workpiece to be processed, and when the first reactant is introduced into the first cavity, guiding the first reactant that is not attached to the surface of the workpiece to be processed out of the first cavity from a third position of the first container; A second reactant is introduced into the first cavity from the first position or the second position of the first container so that the second reactant reacts with the first reactant attached to the surface of the workpiece to be processed and forms a thin film on the surface of the workpiece to be processed. When the second reactant is introduced into the first cavity, the second reactant that has not reacted with the first reactant is guided out of the first cavity from the fourth position of the first container.

13. The processing method according to claim 12, characterized in that: Introducing the first reactant into the first cavity, and after the first reactant adheres to the surface of the workpiece, introducing an inert gas into the first cavity; And, the second reactant is introduced into the first cavity, and after a thin film is formed on the surface of the workpiece, the inert gas is introduced into the first cavity.

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