Wafer supporting device and thin film deposition equipment

Abstract

The invention provides a wafer supporting device and thin film deposition equipment, the wafer supporting device comprises a supporting column and a heavy hammer, and the bottom of the supporting column is provided with a plurality of clamping grooves arranged at intervals in the height direction of the supporting column; a containing cavity and a through hole are formed in the heavy hammer, and the through hole communicates with the exterior of the heavy hammer and the containing cavity; the bottom of the supporting column penetrates through the through hole to be located in the containing cavity, the clamping block is connected with any clamping groove in a clamped mode, and the clamping block is clamped below the through hole. The multiple clamping grooves are formed in the bottom of the supporting column at intervals in the height direction of the supporting column, the clamping block is clamped to any one of the clamping grooves, and then the clamping block is clamped below the through hole, so that clamping and fixing of the supporting column and the heavy hammer are achieved; according to the wafer supporting device, a worker can adjust the supporting height, located outside the heavy hammer, of the supporting column by adjusting clamping connection between the clamping blocks and the clamping grooves in different positions, so that the requirements of machines of different sizes are met, and the adaptability of the wafer supporting device is improved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor production, and particularly to a wafer support device and a thin film deposition apparatus. Background Art

[0002] Semiconductor coating technology is a key technology for forming a thin film with specific functions on the surface of a wafer. This process is usually carried out in a vacuum environment, and metal, non-metal or other compound materials are deposited on the surface of the wafer in the form of gas phase by physical or chemical methods to form a dense thin film.

[0003] At present, the thin film deposition of the wafer is carried out inside the reaction chamber. The manipulator grabs the wafer outside the reaction chamber and enters the inside of the reaction chamber through the valve, and places the wafer on the heating plate so that the wafer deposits the thin film at a high temperature; when the deposition is completed, the manipulator takes away the wafer to transfer it to the next process stage; when the wafer is placed and taken away, in order to ensure that the manipulator and the heating plate do not interfere with each other, a wafer support device is provided on the heating plate to support the wafer after the heating plate descends, which is convenient for the manipulator to place and grab the wafer; however, different machine tools have different sizes, the height of the manipulator entering and exiting the reaction chamber is different, and after the heating plate descends, the height of the wafer support device leaking out is different. At this time, different sizes of wafer support devices need to be used to ensure that the manipulator can place and grab the wafer. Therefore, the adaptability of the current wafer support device is low and it cannot meet the requirements of different machine tools. Summary of the Invention

[0004] Embodiments of the present invention provide a wafer support device and a thin film deposition apparatus to improve the adaptability of the wafer support device and meet the requirements of various sizes of machine tools.

[0005] The present invention provides a wafer support device, which includes:

[0006] Support columns, and a plurality of card slots are arranged at intervals along the height direction at the bottom of the support columns;

[0007] A weight, an accommodation cavity and a through hole are arranged inside the weight, and the through hole communicates the outside of the weight and the accommodation cavity;

[0008] Wherein, the bottom of the support column passes through the through hole and is located inside the accommodation cavity, and any one of the card slots is clamped by a clamping block, and the clamping block is clamped below the through hole.

[0009] In the wafer support device provided by the present invention, the clamping block is provided with a clamping block groove, and the clamping block groove is recessed inward from one end of the clamping block; wherein, the card slot passes through the notch of the clamping block groove to be clamped and fixed with the clamping block groove.

[0010] In the wafer support device provided by the present invention, the diameter of the accommodation cavity is greater than the diameter of the clamping block, and the diameter of the clamping block is greater than the diameter of the through hole.

[0011] In the wafer support device provided by the present invention, the weight includes an upper weight and a lower weight. The upper weight is clamped to the support column, the lower weight is detachably connected to the upper weight, and the lower weight is sleeved on the outer sides of the upper weight and the bottom of the support column.

[0012] In the wafer support device provided by the present invention, a first clamping portion is provided on the outer surface of the upper weight, the lower weight is provided with a fixing cavity formed by recessing downward from its top end, and a second clamping portion is provided on the inner wall of the fixing cavity. The second clamping portion is fixedly clamped to the first clamping portion.

[0013] In the wafer support device provided by the present invention, the first clamping portion includes a protruding block protruding outward from the outer surface of the upper weight, the second clamping portion includes an inner flange protruding toward the center of the fixing cavity from the inner wall of the fixing cavity, and the inner flange is provided with an avoidance opening for avoiding the protruding block.

[0014] Wherein, the lower weight is moved upward so that the protruding block passes through the avoidance opening, and the lower weight is rotated so that the protruding block is stuck below the inner flange.

[0015] In the wafer support device provided by the present invention, the lower weight is further provided with a threaded hole penetrating through its bottom end and the fixing cavity, and the threaded hole communicates with the accommodation cavity. The wafer support device further includes a setscrew.

[0016] Wherein, the bottom end of the support column passes through the accommodation cavity into the threaded hole, and the setscrew is locked to the threaded hole and abuts against the bottom end of the support column.

[0017] In the wafer support device provided by the present invention, the support column includes a support head and a support rod. The support head is connected to the top end of the support rod, and the diameter of the support head is greater than the diameter of the support rod. The support head is stuck on the jack of the heating plate, and the support rod passes through the jack and is connected to the weight.

[0018] In the wafer support device provided by the present invention, the diameter of the support head gradually narrows from top to bottom.

[0019] The present invention further provides a thin film deposition device, which includes the wafer support device described in any one of the above.

[0020] In the present application, a plurality of the card slots are arranged at intervals along the height direction of the bottom of the support column, and then the clamping block is clamped onto any one of the card slots, and then the clamping block is clamped below the through hole, so that the part of the support column below the clamping block is located in the accommodation cavity, realizing the clamping and fixing of the support column and the weight; wherein, the staff can adjust the clamping of the clamping block and the card slots at different positions, thereby adjusting the support height of the support column outside the weight, that is, adjusting the support height of the wafer support device to adapt to the requirements of different sizes of machines. So that under the conditions of different sizes of machines, the wafer support device can realize the support function only by adjusting the clamping position of the clamping block and any one of the card slots, improving the adaptability of the wafer support device. Description of the Drawings

[0021] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the description of the embodiments will be briefly introduced below. Obviously, the drawings in the following description are some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0022] Figure 1 It is a cross-sectional view of the wafer support device in the embodiment of the present invention;

[0023] Figure 2 It is an exploded view of the wafer support device in the embodiment of the present invention;

[0024] Figure 3 It is a structural diagram of the wafer support device in the embodiment of the present invention;

[0025] Figure 4 It is a structural diagram of the support column in the embodiment of the present invention;

[0026] Figures 5a - 5b It is a structural diagram of the upper weight at various angles in the embodiment of the present invention;

[0027] Figures 6a - 6b It is a structural diagram of the lower weight at various angles in the embodiment of the present invention;

[0028] Figure 7 It is a structural diagram of the clamping block in the embodiment of the present invention;

[0029] Figure 8 It is an assembly diagram of the wafer support device and the heating plate in the embodiment of the present invention;

[0030] Figure 9 It is a cross-sectional view of the wafer support device and the heating plate in the embodiment of the present invention;

[0031] Figure 10It is a structural diagram of a thin film deposition device in an embodiment of the present invention;

[0032] Figures 11a - 11c It is a moving process diagram of a heating plate and a wafer support device in an embodiment of the present invention;

[0033] Figure 12 is Figure 11c an enlarged view of part A in

[0034] Figure 13 It is a structural diagram of a clamping block located in another clamping groove in an embodiment of the present invention;

[0035] Figure 14 is Figure 13 an enlarged view of part B in

[0036] The reference numerals in the figure are as follows:

[0037] 1. Wafer support device; 11. Support column; 111. Clamping groove; 112. Support head; 113. Support rod; 12. Counterweight; 121. Accommodation cavity; 122. Through hole; 123. Upper counterweight; 1230. First clamping portion; 1231. Protruding block; 124. Lower counterweight; 1240. Fixed cavity; 1241. Second clamping portion; 12411. Inner flange; 12412. Avoidance opening; 1242. Threaded hole; 13. Clamping block; 131. Clamping block groove; 14. Set screw; 2. Heating plate; 21. Insertion hole; 3. Wafer; 4. Chassis. Detailed implementation manners

[0038] It should be noted that, without conflict, the embodiments in the present application and the features in the embodiments may be combined with each other. Now, with reference to the accompanying drawings, the preferred embodiments of the present invention will be described in detail.

[0039] Referring to Figures 1 to 14 as shown, it shows an embodiment of the wafer support device 1 and the thin film deposition device of the present invention. The wafer support device 1 includes a support column 11 and a counterweight 12. A plurality of clamping grooves 111 are provided at the bottom of the support column 11 at intervals along its height direction; an accommodation cavity 121 and a through hole 122 are provided inside the counterweight 12, and the through hole 122 communicates the outside of the counterweight 12 and the accommodation cavity 121; wherein, the bottom of the support column 11 passes through the through hole 122 and is located in the accommodation cavity 121, and any one of the clamping grooves 111 is clamped by a clamping block 13, and the clamping block 13 is clamped below the through hole 122.

[0040] Specifically, the wafer support device 1 is used to support the wafer 3 to facilitate the placement and grasping of the wafer 3 by the manipulator; the wafer support device 1 is movably connected to the hot plate 2, and the wafer support device 1 is disposed on the hot plate 2, so that when the hot plate 2 moves up and down, the wafer support device 1 moves up and down following the hot plate 2; when the bottom end of the wafer support device 1 abuts against the chassis 4 of the reaction chamber, if the hot plate 2 moves downward, the hot plate 2 continues to move downward, while the wafer support device 1 no longer follows the hot plate 2 to continue descending. At this time, the top end of the wafer support device 1 is higher than the top end of the hot plate 2 to facilitate the manipulator to place or grasp the wafer 3 onto the wafer support device 1, ensuring that the manipulator does not interfere with the hot plate 2.

[0041] The wafer support device 1 includes a support column 11 and a weight 12. The top end of the support column 11 is clamped with the top end of the hot plate 2, and the support column 11 is slidably connected to the hot plate 2. The bottom end of the support column 11 is detachably connected to the weight 12. The top end of the support column 11 is used to contact the wafer 3, thus ensuring that the wafer 3 is placed on the support column 11; the weight 12 is used to support the support column 11, and the weight 12 has a certain weight to ensure that the support column 11 can descend smoothly when the hot plate 2 descends.

[0042] A plurality of card slots 111 are provided at the bottom of the support column 11. The card slots 111 are recessed from the outer surface of the support column 11 inward along the circumferential direction of the support column 11, and the plurality of card slots 111 are arranged at intervals along the height direction of the support column 11 at the bottom of the support column 11. The card slots 111 are used to be clamped with the card blocks 13 to be clamped and fixed with the weight 12; the weight 12 is provided with a through hole 122 and a receiving cavity 121. The receiving cavity 121 is located inside the weight 12, and the through hole 122 penetrates from one side surface of the weight 12 to the inside of the receiving cavity 121. Therefore, the through hole 122 penetrates the outside and the receiving cavity 121 of the weight 12. The through hole 122 is used to avoid the support column 11, so that the bottom of the support column 11 can pass through the through hole 122 and enter the receiving cavity 121.

[0043] Among them, the support column 11 is inserted into the aperture of the heating plate 2, and then the bottom end of the support column 11 passes through the through hole 122 and enters the accommodation cavity 121. At this time, the plurality of card slots 111 are located in the accommodation cavity 121. Then, the clamping block 13 is clamped into any one of the card slots 111, and the clamping block 13 is also clamped with the accommodation cavity 121. That is, the clamping block 13 is first clamped into the card slot 111, so that the clamping block 13 is fixedly connected to the support column 11. Then, the clamping block 13 is clamped below the through hole 122, that is, the top end of the clamping block 13 is clamped with the bottom end of the through hole 122, so that the bottom of the support column 11 is fixedly arranged in the accommodation cavity 121, and thus the support column 11 is fixedly connected to the weight 12.

[0044] In this application, a plurality of the card slots 111 are arranged at intervals along the height direction of the bottom of the support column 11. Then, the clamping block 13 is clamped onto any one of the card slots 111, and the clamping block 13 is clamped below the through hole 122, so that the part of the support column 11 located below the clamping block 13 is located in the accommodation cavity 121, realizing the clamping and fixing of the support column 11 and the weight 12. Among them, the staff can adjust the clamping of the clamping block 13 with the card slots 111 at different positions, so as to adjust the support height of the support column 11 located outside the weight 12, that is, adjust the support height of the wafer support device 1 to adapt to the requirements of different sizes of machines. Under the conditions of different sizes of machines, the wafer support device 1 can realize the support function only by adjusting the clamping position of the clamping block 13 with any one of the card slots 111, improving the adaptability of the wafer support device 1.

[0045] In one embodiment, referring to Figure 1 and Figure 7As shown, the clamping block 13 is provided with a clamping block groove 131, which is formed by inward depression at one end of the clamping block 13; wherein, the clamping groove 111 passes through the notch of the clamping block groove 131 to be clamped and fixed with the clamping block groove 131. Specifically, the clamping block 13 and the clamping groove 111 are clamped and fixed so that the clamping block 13 is fixed on the support column 11. In this embodiment, the clamping groove 111 is formed by inward depression from the outer surface of the support column 11 along the circumferential direction of the support column 11. The support column 11 is of a cylindrical structure, so the clamping block 13 is arranged in an annular structure; the clamping block 13 is provided with a clamping block groove 131 for accommodating the clamping groove 111. When the clamping block 13 and the support column 11 are clamped, the clamping block groove 131 is stuck on the clamping groove 111, thereby realizing the fixed connection between the clamping block 13 and the support column 11; the clamping block groove 131 is formed by inward depression at one end of the clamping block 13, so the notch of the clamping block groove 131 connects the clamping block groove 131 and the outside world, and the clamping block groove 131 penetrates through the upper and lower ends of the clamping block 13, that is, the notch of the clamping block groove 131 makes one end of the clamping block 13 form a notch for avoiding the support column 11. In this embodiment, the clamping block 13 is of a "C" - shaped structure, and the clamping block groove 131 is of a "U" - shaped structure.

[0046] Therefore, when assembling the clamping block 13 and the support column 11, one of the clamping grooves 111 on the support column 11 can be passed through the notch of the clamping block groove 131 and into the clamping block groove 131. Through the clamping connection between the clamping groove 111 and the clamping block groove 131, the clamping connection and fixation between the clamping block 13 and the support column 11 are realized; among them, according to the actual requirements of the machine, a suitable clamping groove 111 can be selected to be clamped with the clamping block 13, so as to adjust the support height of the support column 11.

[0047] In this embodiment, the connection mode between the clamping block 13 and the support column 11 is that the clamping block groove 131 is stuck on the clamping groove 111. The operation mode is simple. And when adjusting the clamping position between the clamping block 13 and the clamping groove 111, the clamping block 13 can be directly taken out of one of the clamping grooves 111 and then clamped onto another clamping groove 111, thereby improving the assembly and disassembly efficiency of the clamping block 13 and the support column 11 and enhancing the user experience.

[0048] In a specific embodiment, refer to Figure 1As shown, the diameter of the accommodation cavity 121 is greater than the diameter of the clamping block 13, and the diameter of the clamping block 13 is greater than the diameter of the through hole 122. Specifically, when assembling the support column 11 and the weight 12, first pass the bottom end of the support column 11 through the through hole 122 and into the accommodation cavity 121, then move the weight 12 upward along the height direction of the support column 11 until the required clamping groove 111 is exposed, then clamp the clamping block 13 onto the clamping groove 111, and then move the weight 12 downward to accommodate both the clamping block 13 and the bottom of the support column 11 in the accommodation cavity 121. Finally, by clamping the clamping block 13 below the through hole 122, the clamping and fixing of the support column 11 and the weight 12 are realized, and the bottom end of the support column 11 is prevented from moving upward away from the weight 12. Therefore, the diameter of the accommodation cavity 121 is set to be greater than the diameter of the clamping block 13 to ensure that the clamping block 13 is placed in the accommodation cavity 121, thereby preventing the clamping block 13 from being knocked and improving the service life of the clamping block 13, and ensuring the use stability of the clamping block 13, thereby improving the structural stability of the wafer support device 1; at the same time, the clamping method of the clamping block 13 and the through hole 122 is to set the diameter of the clamping block 13 to be greater than the diameter of the through hole 122, so that the clamping block 13 is clamped below the through hole 122, that is, the clamping block 13 is clamped in the accommodation cavity 121, preventing the clamping block 13 and the support column 11 from detaching from the weight 12 through the through hole 122.

[0049] In this embodiment, by setting the diameter of the clamping block 13 to be greater than the diameter of the through hole 122 and less than the diameter of the accommodation cavity 121, it is ensured that both the clamping block 13 and the bottom of the support column 11 are located in the accommodation cavity 121, and the clamping block 13 and the support column 11 are prevented from detaching from the weight 12.

[0050] In one embodiment, referring to Figure 1 and Figure 3As shown, the weight 12 includes an upper weight 123 and a lower weight 124. The upper weight 123 is snap-connected to the support column 11. The lower weight 124 is detachably connected to the upper weight 123, and the lower weight 124 is sleeved outside the bottom of the upper weight 123 and the support column 11. Specifically, the weight 12 is composed of the upper weight 123 and the lower weight 124. The upper weight 123 is used to be snap-connected and fixed to the support column 11, so as to fix the support height of the support column 11. The receiving cavity 121 and the through hole 122 are both provided on the upper weight 123. The receiving cavity 121 is provided inside the upper weight 123, and the through hole 122 is provided at the top end of the upper weight 123 and penetrates into the receiving cavity 121. Therefore, the bottom of the support column 11 can pass through the through hole 122 and enter the receiving cavity 121.

[0051] When the height from the position of the clamping block 13 to the bottom end of the support column 11 at the bottom of the support column 11 is greater than the height of the upper weight 123, the bottom end of the support column 11 will protrude outside the upper weight 123 and be located below the bottom end of the upper weight 123. At this time, the bottom end of the support column 11 will directly abut against the chassis 4 of the reaction cavity. The contact area between the support column 11 and the chassis 4 is small, which will make the stability of the support column 11 poor when lifting the wafer 3. Therefore, in this embodiment, a lower weight 124 is also provided. The lower weight 124 is used to contact the chassis 4 to increase the contact area between the wafer support device 1 and the chassis 4, so as to improve the stability of the wafer support device 1 when supporting the wafer 3. The lower weight 124 is detachably connected to the upper weight 123 to facilitate the installation and disassembly of the upper weight 123 and the lower weight 124, and further facilitate the adjustment of the clamping position of the clamping block 13 and the clamping groove 111, improving the assembly efficiency. At the same time, the lower weight 124 is sleeved outside the bottom of the upper weight 123 and the support column 11. Therefore, the cross-sectional area of the bottom end of the lower weight 124 is larger than the cross-sectional area of the bottom end of the support column 11, that is, the lower weight 124 covers both the upper weight 123 and the bottom of the support column 11 to ensure that the bottom end of the lower weight 124 is located below the bottom end of the support column 11. Thus, when the wafer support device 1 descends with the heating plate 2 to contact the chassis 4, the bottom end of the lower weight 124 directly contacts the chassis 4 and supports the support column 11 on the chassis 4. Since the contact area between the lower weight 124 and the chassis 4 is larger than the contact area between the support column 11 and the chassis 4, the stability of the support of the lower weight 124 and the upper weight 123 on the support column 11 is higher, thereby improving the stability of the support column 11 during the process of lifting the wafer 3.

[0052] In a specific embodiment, refer toFigures 5a to 6b As shown, a first clamping portion 1230 is provided on the outer surface of the upper weight 123, a fixing cavity 1240 formed by recessing downward from the top end is provided on the lower weight 124, a second clamping portion 1241 is provided on the inner wall of the fixing cavity 1240, and the second clamping portion 1241 is clamped and fixed with the first clamping portion 1230. Specifically, the connection manner between the upper weight 123 and the lower weight 124 is diverse, and the upper weight 123 and the lower weight 124 are detachably connected. In this embodiment, the connection manner between the upper weight 123 and the lower weight 124 is a clamping manner. More specifically, a first clamping portion 1230 is provided on the outer surface of the upper weight 123, a fixing cavity 1240 is provided inside the lower weight 124, the diameter of the fixing cavity 1240 is larger than the diameter of the upper weight 123, the fixing cavity 1240 is used to accommodate the upper weight 123 and the bottom of the support column 11, the fixing cavity 1240 is formed by recessing downward from the top end of the lower weight 124, and a second clamping portion 1241 is provided on the inner wall of the fixing cavity 1240.

[0053] Therefore, when assembling the heating plate 2 and the wafer support device 1, first insert the support column 11 into the aperture of the heating plate 2, then pass the bottom end of the support column 11 through the through hole 122 of the upper weight 123 into the accommodation cavity 121, move the upper weight 123 upward to clamp the block 13 into the card slot 111, and then move the top end of the lower weight 124 from below the upper weight 123 upward toward the upper weight 123 until the upper weight 123 is embedded inside the fixing cavity 1240, and at the same time, clamp the first clamping portion 1230 and the second clamping portion 1241 to complete the connection between the lower weight 124 and the upper weight 123; when it is necessary to disassemble the lower weight 124 and the upper weight 123, directly release the clamping of the first clamping portion 1230 and the second clamping portion 1241.

[0054] In this embodiment, the upper weight 123 and the lower weight 124 are detachably connected by a clamping manner, with a simple structure and fast operation.

[0055] In one embodiment, refer to Figures 5a to 6bAs shown, the first clamping portion 1230 includes a protruding block 1231 protruding outward from the outer surface of the upper weight 123. The second clamping portion 1241 includes an inner flange 12411 protruding from the inner wall of the fixed cavity 1240 toward the center of the fixed cavity 1240. The inner flange 12411 is provided with an avoidance opening 12412 for avoiding the protruding block 1231. Among them, the lower weight 124 is moved upward so that the protruding block 1231 passes through the avoidance opening 12412, and the lower weight 124 is rotated so that the protruding block 1231 is stuck below the inner flange 12411. Specifically, the first clamping portion 1230 is provided on the outer surface of the upper weight 123. The first clamping portion 1230 includes a protruding block 1231 protruding outward from the outer surface of the upper weight 123. The protruding blocks 1231 are located on opposite sides of the upper weight 123. The second clamping portion 1241 includes an inner flange 12411 disposed in the fixed cavity 1240. The inner flange 12411 extends horizontally from the cavity wall of the fixed cavity 1240 toward the center of the fixed cavity 1240. The inner flange 12411 divides the fixed cavity 1240 into upper and lower two chambers, and the two chambers are interconnected. An avoidance opening 12412 corresponding to the protruding block 1231 is further provided on the inner flange 12411. The avoidance opening 12412 is used to avoid the protruding block 1231, so that the protruding block 1231 passes through the avoidance opening 12412 from one side of the inner flange 12411 to the other side of the inner flange 12411. The avoidance opening 12412 is recessed from the edge of the inner flange 12411 close to the center of the fixed cavity 1240 toward the cavity wall of the fixed cavity 1240, and the size and shape of the avoidance opening 12412 are the same as those of the protruding block 1231.

[0056] When assembling the lower weight 124 and the upper weight 123, the lower weight 124 is moved from bottom to top toward the upper weight 123, and the avoidance opening 12412 is aligned with the position of the protruding block 1231, and the lower weight 124 is moved upward until the protruding block 1231 passes through the avoidance opening 12412 from the upper side of the inner flange 12411 and is located at the lower side of the inner flange 12411, and then the lower weight 124 is rotated to stagger the avoidance opening 12412 and the protruding block 1231 so that the top of the protruding block 1231 It abuts against the lower end of the inner flange 12411, so that the protruding block 1231 is stuck under the inner flange 12411, and finally the assembly of the lower weight 124 and the upper weight 123 is realized; when the lower weight 124 and the upper weight 123 are to be disassembled, the lower weight 124 is first rotated to align the avoidance opening 12412 with the position of the protruding block 1231, and then the lower weight 124 is moved downward to allow the protruding block 1231 to pass through the avoidance opening 12412 until the lower weight 124 and the upper weight 123 are completely separated.

[0057] In this embodiment, through the limiting and fixing method of the protruding block 1231 and the inner flange 12411, the connection between the lower weight 124 and the upper weight 123 can be achieved by only moving and rotating the lower weight 124. The operation is simple, and the installation and disassembly of the lower weight 124 and the upper weight 123 are convenient, thereby improving work efficiency.

[0058] In a specific embodiment, refer to Figure 1 , Figure 12 and Figure 14As shown, the lower weight 124 is further provided with a threaded hole 1242 that penetrates its bottom end and the fixed cavity 1240, and the threaded hole 1242 communicates with the receiving cavity 121. The wafer support device 1 further includes a setscrew 14. Among them, the bottom end of the support column 11 passes through the receiving cavity 121 into the threaded hole 1242, and the setscrew 14 is locked with the threaded hole 1242 and abuts against the bottom end of the support column 11. Specifically, the receiving cavity 121 penetrates from the inside of the upper weight 123 to the bottom end of the upper weight 123. Therefore, the top end and the bottom end of the upper weight 123 are communicated by the through hole 122 and the receiving cavity 121, so that the bottom end of the support column 11 can pass through the through hole 122 and the receiving cavity 121 from above the upper weight 123 and be located below the upper weight 123. The lower weight 124 is further provided with a threaded hole 1242 that penetrates the fixed cavity 1240 and the bottom end of the lower weight 124, that is, the top end and the bottom end of the lower weight 124 are communicated, and the threaded hole 1242 communicates with the receiving cavity 121. The wafer support device 1 further includes a setscrew 14, and the setscrew 14 is used to cooperate with the clamping block 13 to fix the support column 11. The outer surface of the setscrew 14 is provided with threads to be locked and fixed with the threaded hole 1242.

[0059] When the upper weight 123, the lower weight 124 and the support column 11 are assembled, the upper weight 123 is embedded in the fixed cavity 1240, and the bottom end of the receiving cavity 121 is correspondingly connected and communicated with the threaded hole 1242. At this time, the bottom end of the support column 11 passes through the through hole 122 and the receiving cavity 121 into the threaded hole 1242, and then a wrench is used to screw the setscrew 14 into the threaded hole 1242 of the lower weight 124 so that the setscrew 14 is locked and connected with the threaded hole 1242, so that the setscrew 14 abuts against the bottom end of the support column 11. At the same time, the clamping block 13 clamps the card slot 111 and the through hole 122, and the support column 11 is fixed in the upper weight 123 and the lower weight 124 through the setscrew 14 and the clamping block 13, realizing the connection of the support column 11, the upper weight 123 and the lower weight 124.

[0060] In this embodiment, the support height of the support column 11 is adjusted by adjusting the screwing depth of the setscrew 14 and the position where the clamping block 13 is inserted into the card slot 111, improving the fixing stability of the support column 11 with the upper weight 123 and the lower weight 124, and at the same time improving the smoothness of the support column 11 when lifting the wafer 3.

[0061] More specifically, the bottom end of the setscrew 14 is provided with an internal hexagonal head to facilitate the cooperation with the hole of the hexagonal wrench for operation.

[0062] In one embodiment, referring to Figure 4 and Figures 8 to 13 as shown, the support column 11 includes a support head 112 and a support rod 113. The support head 112 is connected to the top end of the support rod 113, and the diameter of the support head 112 is greater than that of the support rod 113. The support head 112 is stuck on the jack 21 of the heating plate 2, and the support rod 113 passes through the jack 21 and is connected to the weight 12. Specifically, the support column 11 includes a support head 112 and a support rod 113. The support head 112 is fixedly connected to the top end of the support rod 113, and the diameter of the support head 112 is greater than that of the support rod 113. That is, the support column 11 is generally in a "T" shape. The support head 112 is used to lift the wafer 3, and the support rod 113 is used to connect to the weight 12 and support the support head 112. When the wafer support device 1 is assembled with the heating plate 2, the support head 112 is stuck above the jack 21 of the heating plate 2. The bottom end of the support rod 113 passes through the jack 21 until it is located below the heating plate 2, and the bottom end of the support rod 113 is connected to the weight 12, and the support rod 113 is movably connected to the jack 21. Therefore, when the support column 11 moves with the heating plate 2 and until the weight 12 abuts against the chassis 4, the support rod 113 can move relative to the heating plate 2, so that there is a certain distance between the support head 112 and the top end of the heating plate 2. The support head 112 can directly support the wafer 3, which is convenient for the manipulator to place or pick up the wafer 3.

[0063] In a specific embodiment, referring to Figure 4 as shown, the diameter of the support head 112 gradually narrows from top to bottom. Specifically, the support head 112 is in an inverted cone structure, that is, the diameter of the support head 112 gradually narrows from top to bottom. The diameter of the top end of the support head 112 is greater than that of the bottom end of the support head 112. The bottom end of the support head 112 is connected to the top end of the support rod 113. The area of the top end of the support head 112 in contact with the wafer 3 is large, so as to improve the stability of the support column 11 in lifting the wafer 3. At the same time, the outer surface of the support head 112 in contact with the heating plate 2 is in an arc structure, so as to avoid damage to the heating plate 2 caused by the support head 112 when the support column 11 moves relative to the heating plate 2, and improve the service life of the support head 112 and the heating plate 2. At the same time, the shape and size of the top end of the jack 21 are the same as those of the support head 112, so that the support head 112 can be completely embedded in the jack 21, and the top end of the support head 112 is flush with the top end of the heating plate 2, ensuring the stability of the wafer 3 on the top end of the heating plate 2.

[0064] Referring to Figures 10 to 14As shown in the figure, this embodiment also provides a thin film deposition device. The thin film deposition device includes a wafer support device 1, and the wafer support device 1 can adopt any one of the wafer support devices 1 provided by the present invention. Since the specific structure and working principle of the wafer support device 1 have been introduced in detail in the previous specification, for the sake of simplicity of the specification, it will not be elaborated here.

[0065] In the thin film deposition device of this embodiment, due to the adoption of the wafer support device 1 provided by the present invention, the adaptability of the wafer support device 1 is high, and it can effectively adapt to machines of different sizes without replacing the wafer support devices 1 of different sizes. By adjusting the clamping position of the clamping block 13 and the clamping groove 111, machines of different sizes can be adapted, so that the working efficiency of the thin film deposition device is high, and there is no need to use multiple wafer support devices 1 to adapt to machines of different sizes, reducing the production cost.

[0066] As described above, the above is only the specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention can easily think of various equivalent modifications or replacements, and these modifications or replacements should all be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention should be subject to the protection scope of the claims.

Claims

1. A wafer support device, characterized in that: include: A support column, wherein the bottom of the support column is provided with a plurality of slots spaced apart along the height direction thereof; A weight, wherein a receiving cavity and a through hole are provided inside the weight, and the through hole communicates with the outside of the weight and the receiving cavity; The bottom of the support column passes through the through hole and is located in the accommodating cavity, and is engaged with any one of the slots through a clamping block, and the clamping block is clamped under the through hole.

2. The wafer support device according to claim 1, characterized in that: The clamping block is provided with a clamping block groove, and the clamping block groove is formed by an inward depression of one end of the clamping block; wherein the clamping groove passes through a notch of the clamping block groove to be clamped and fixed with the clamping block groove.

3. The wafer support device according to claim 1, characterized in that: The diameter of the accommodating cavity is greater than the diameter of the block, and the diameter of the block is greater than the diameter of the through hole.

4. The wafer support device according to claim 1, characterized in that: The weight comprises an upper weight and a lower weight, wherein the upper weight is clamped with the support column, the lower weight is detachably connected to the upper weight, and the lower weight is sleeved on the outer sides of the upper weight and the bottom of the support column.

5. The wafer support device according to claim 4, characterized in that: The outer surface of the upper weight is provided with a first clamping portion, the lower weight is provided with a fixing cavity formed by a downward depression of the top end thereof, the inner wall of the fixing cavity is provided with a second clamping portion, and the second clamping portion is clamped and fixed with the first clamping portion.

6. The wafer support device according to claim 5, characterized in that: The first clamping portion includes a protruding block protruding outward from the outer surface of the upper weight, and the second clamping portion includes an inner flange protruding from the inner wall of the fixing cavity toward the center of the fixing cavity, and the inner flange is provided with an escape opening for avoiding the protruding block; Wherein, the lower weight is moved upward to allow the protruding block to pass through the avoidance opening, and the lower weight is rotated to allow the protruding block to be stuck under the inner flange.

7. The wafer support device according to claim 5, characterized in that: The lower weight is also provided with a threaded hole penetrating through its bottom end and the fixing cavity, and the threaded hole is communicated with the accommodating cavity, and the wafer supporting device also includes a top screw; Wherein, the bottom end of the support column passes through the accommodating cavity into the threaded hole, and the top screw is locked with the threaded hole and abuts against the bottom end of the support column.

8. The wafer support device according to claim 1, characterized in that: The support column includes a support head and a support rod, the support head is connected to the top end of the support rod, and the diameter of the support head is larger than the diameter of the support rod, the support head is clamped on the socket of the heating plate, and the support rod passes through the socket and is connected to the weight.

9. The wafer support device according to claim 8, characterized in that: The diameter of the support head gradually narrows from top to bottom.

10. A thin film deposition device, characterized in that: A wafer supporting device comprising the wafer supporting device according to any one of claims 1 to 9.

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