Test module and test system

Abstract

The invention discloses a test module and a test system, and relates to the technical field of semiconductor lasers. According to the test module, the light blocking sheet is arranged between the detection light and the laser module, so that the detection light is prevented from being irradiated on the high-reflection solder, the detection light is prevented from being reflected from the solder and returning to the cavity surface of the laser chip through the light path of the detection light source, and the measurement accuracy is improved; the shape of the light blocking sheet and the relative position of the light blocking sheet and the laser chip are optimized and limited, so that the influence on the detection light received by the laser chip due to the addition of the light blocking sheet is reduced, and the measurement accuracy is further improved; besides, in the test system comprising the test module, the relative position between the light blocking sheet and the laser module is adjustable by arranging the spatial position adjusting module, so that the light blocking sheet can adapt to cavity surface measurement of different laser modules, the test accuracy of the test system is effectively ensured, and the test efficiency is improved. The adaptive range of the test module to the laser module is widened, and the industrial application of the test system is greatly promoted.

Description

Technical Field

[0001] This application relates to the technical field of semiconductor lasers, and particularly to a test module and a test system. Background Art

[0002] Measuring the facet temperature of a semiconductor laser is crucial for thermal management, performance optimization, reliability assessment, fault diagnosis, research on thermal lens effect, material research, and process improvement, which helps to improve the device performance and reliability. The thermal reflection method is an effective technique for measuring the facet temperature of a semiconductor laser, with advantages such as non-contact, high resolution, and fast response, and it is widely used in research and development, testing, and fault analysis.

[0003] It should be noted that a layer of metal is generally plated around the front surface of the existing common COS heat sink, which can drain the molten solder to the front surface of the heat sink, thereby improving the packaging yield of the chip. However, in the semiconductor laser facet temperature test device based on the CCD imaging thermal reflection technology, there are inevitable reflections in the optical path, which will result in the actual light beam incident on the facet being the sum of the ideal light beam and the reflected light beam. In addition, in actual operation, due to the high reflectivity and high thermal reflection coefficient of the indium solder layer for the detection light beam, the intensity of this reflected light beam is high and variable, which will seriously affect the measurement accuracy of the chip facet temperature. Summary of the Invention

[0004] The purpose of this application is to provide a test module and a test system to meet the requirements of low reflectivity and high accuracy in chip facet testing.

[0005] An embodiment of this application provides a test module, which includes: A laser module, the laser module includes a laser chip and a heat sink, the laser chip is attached to the heat sink to form an interface, and a solder overflow area is provided on the first side of the heat sink close to the detection light; A light shield, the solder overflow area is located between the light shield and the heat sink, and the light shield is used to block the detection light from irradiating the solder overflow area.

[0006] Further, in a preferred embodiment of the present invention, the distance from the point on the light shield closest to the interface to the optical axis plane of the laser chip parallel to the interface is H, the vertical divergence angle of the laser beam emitted by the laser chip is γ, the distance between the first side of the heat sink and the second side of the laser chip close to the detection light is x, the conical surface of the spatial region corresponding to γ is the divergence angle boundary surface, and the distance between the point on the top surface of the light shield closest to the divergence angle boundary surface and the first side of the heat sink is y, and the H, γ, x, and y satisfy: (y - x) / tanγ / 2 < H.

[0007] Further, in a preferred embodiment of the present invention, the top surface of the light shield close to the joint surface is a flat top surface. When the detection light irradiates the flat top surface of the light shield, a semi-shadow area is formed in the solder overflow area, and the top boundary line of the semi-shadow area coincides with the joint surface.

[0008] Further, in a preferred embodiment of the present invention, the top surface of the light shield close to the joint surface is arranged as an inclined top surface, the inclined top surface faces the detection light, and the top end of the inclined top surface is flush with the joint surface; The complementary angle of the included angle between the inclined top surface and the joint surface is β, and the complementary angle of the included angle formed by the connection line between the bottommost light point far from the optical axis of the detection light and the topmost point of the light shield and the joint surface is α, and β < α.

[0009] Further, in a preferred embodiment of the present invention, the top surface of the light shield close to the joint surface sequentially includes an inclined surface and a flat surface in the direction from far away from the first side surface to close to the first side surface; When the detection light irradiates the flat surface of the light shield, a semi-shadow area is formed in the solder overflow area, and the top boundary line of the semi-shadow area coincides with the joint surface.

[0010] Further, in a preferred embodiment of the present invention, the top surface of the light shield close to the joint surface includes an inclined surface portion, the inclined surface portion faces the detection light, and the complementary angle of the included angle between the inclined surface portion and the joint surface is β, and β and γ satisfy: β < 90° - γ / 2.

[0011] Further, in a preferred embodiment of the present invention, the surface of the light shield for blocking the detection light is provided with an absorbent material and / or is blackened.

[0012] Further, in a preferred embodiment of the present invention, the surface of the light shield for blocking the detection light is provided with a curved surface structure, so that when the detection light irradiates the curved surface structure, the detection light will be reflected outside the main optical path.

[0013] The embodiment of the present application further provides a test system, which includes the aforementioned test module.

[0014] Further, in a preferred embodiment of the present invention, the test system further includes a heat dissipation table and a spatial position adjustment module for adjusting the relative positions of the light shield and the laser module. The spatial position adjustment module is arranged in the test module and installed on the heat dissipation table.

[0015] Further, in a preferred embodiment of the present invention, the spatial position adjustment module includes a first adjustment module and a second adjustment module; The first adjustment module is used to adjust the light shielding sheet and the laser module to approach or move away from each other. The first adjustment module includes a first motor and a first moving member. The light shielding sheet is fixedly connected to the first moving member. The first motor is fixed to the heat dissipation table. The first motor drives the first moving member to move, thereby driving the light shielding sheet to approach or move away from the laser module. The second adjustment module includes a limiting component and a second motor. The limiting component at least includes a moving limiting member. The moving limiting member is detachably and fixedly connected to the laser module. The second motor is installed on the heat dissipation table. The second motor drives the moving limiting member to move, thereby driving the laser module to move in a plane perpendicular to the optical axis of the detection light.

[0016] The following technical effects can be achieved by adopting the technical solutions in the embodiments of the present application: In the test module provided by the embodiment of the present application, by arranging a light shielding sheet between the detection light and the laser module to block the detection light from irradiating on the highly reflective solder in the solder overflow area, it is avoided that the detection light is reflected from the solder and then returns to the cavity surface of the laser chip through the optical path of the detection light source, thereby improving the measurement accuracy. By optimizing and defining the shape of the light shielding sheet, the influence on the detection light received by the laser chip due to the addition of the light shielding sheet is reduced, ensuring the measurement accuracy. Furthermore, by combining the characteristics of the designed shape of the light shielding sheet and the reasonable configuration of the relative position between the light shielding sheet and the laser chip, the setting of the light shielding sheet not only does not affect the detection light from irradiating on the laser chip, but also does not affect the emitted light of the laser chip, thereby further ensuring the measurement accuracy. In addition, by performing a curved surface design, setting an absorbing material, and / or blackening treatment on the surface of the light shielding sheet for blocking the detection light, it is effectively avoided that the light shielding sheet reflects the detection light back to the original detection light optical path and then reflects it to the laser chip, thereby further improving the measurement accuracy of the test module.

[0017] Even further, in the test system provided by the embodiment of the present application, by setting a spatial position adjustment module, the relative position between the light shielding sheet and the laser module is adjustable, so that the light shielding sheet can adapt to the cavity surface measurement of different laser modules, thereby broadening the adaptation range of the test module for laser modules on the basis of effectively ensuring the test accuracy of the test system, and greatly promoting the industrial application of the test system.

[0018] Other features and advantages of the present application will be described in the subsequent specification, and part of them will become obvious from the specification, or will be understood by implementing the technical solutions of the present application. The objectives and other advantages of the present application can be realized and obtained through the structures and / or processes specifically pointed out in the specification, claims, and drawings. Description of the Drawings

[0019] Other features, objectives, and advantages of the present application will become more apparent by reading the following detailed description of non-limiting embodiments with reference to the accompanying drawings: Figure 1 is a schematic diagram of the temperature measurement principle of an illustrative photothermal reflection technology of the present application; Figure 2 is a schematic diagram of a laser cavity surface temperature tester based on the photothermal reflection technology of the present application; Figure 3a is a schematic diagram of the structure of a laser device in the prior art; Figure 3b is a COS imaging image in the prior art; Figure 3c is a schematic diagram of the formation principle of related concepts such as non-shadow area, penumbra area, and umbra area; Figure 4 is a schematic diagram of the structure of the test module in the first embodiment of the present application; Figure 5 is a top view structural schematic diagram of the test system in the first embodiment of the present application; Figure 6 is a top view structural schematic diagram of the light shielding sheet of the test module in the second embodiment of the present application; Figure 7 is a schematic diagram of the structure of the test module in the third embodiment of the present application; Figure 8 is a schematic diagram of the structure of the test module in the fourth embodiment of the present application; Figure 9 is a schematic diagram of the structure of the test module in the fifth embodiment of the present application; Figure 10 is a schematic diagram of the structure of the test module in the sixth embodiment of the present application.

[0020] Icons: 1 - Probe light; 2 - Sample to be measured; 3 - Objective lens; 4 - Dichroic mirror; 5 - Focusing lens; 6 - Beam splitter; 7 - Filter; 8 - Imaging lens; 9 - CCD camera; 10 - Test system; 11 - Laser beam; 12 - Phase-locked signal generator; 14 - Solder; 15 - Non-shadow area; 16 - Penumbra area; 162 - Half-shadow area; 17 - Umbra area; 100 - Laser module; 101 - Heat sink; 110 - Laser chip; 112 - Second side; 114 - Optical axis plane of laser chip; 115 - Interface surface; 116 - Divergence angle boundary surface; 120 - Heat sink; 122 - First side; 130 - Light blocking plate; 140 - Solder overflow area; 150 - Spatial position adjustment module; 152 - First adjustment module; 1522 - First micro-control motor; 1524 - First moving part; 154 - Second adjustment module; 1541 - Fixed limit part; 1542 - Limit component; 1543 - Moving limit part; 1544 - Second micro-control motor; 230 - Second light blocking plate; 330 - Third light blocking plate; 430 - Fourth light blocking plate; 530 - Fifth light blocking plate; 630 - Sixth light blocking plate. Detailed implementation manners

[0021] The present application will be further described in detail below with reference to the accompanying drawings and embodiments. It can be understood that the specific embodiments described herein are only used to explain the related invention, rather than limiting the invention. Additionally, it should be noted that for the sake of description, only the parts related to the relevant invention are shown in the drawings.

[0022] Exemplary laser test system For current laser tests, it is a common laser test scenario to measure the temperature of the laser cavity surface using the temperature measurement principle of the photo-thermal reflection technique. It should be noted that the test module and test system provided in the present application include but are not limited to the measurement of the temperature of the laser cavity surface.

[0023] To enable those skilled in the art to clearly understand the solution of the present application, the following takes the measurement of the temperature of the laser cavity surface as an example to elaborate on the brief principle of the thermal reflection measurement method and the corresponding system.

[0024] As Figure 1 shown, it is a schematic diagram of a temperature measurement principle based on the photo-thermal reflection technique. When the temperature of the sample to be measured changes, due to the displacement of the bandgap and the change of the broadening parameter, the dielectric function of the material changes, causing a change in the reflectivity of the sample. When the temperature change value is small, the temperature change value (△T) and the reflectivity change value (△R) approximately show a linear relationship, as shown in the following formula (1).

[0025] (1)

[0026] In formula (1), ΔR / R is the change in reflectivity caused by temperature change, ΔT is the temperature change, and K is the thermal reflection coefficient, which is a constant.

[0027] Furthermore, as Figure 2 shown, it is a schematic diagram of a laser cavity surface temperature tester based on the photo-thermal reflection technique. The system of this temperature tester mainly consists of a microscopic imaging system, an image acquisition system, and a data processing system. Among them, the laser beam 11 emitted by the laser ( Figure 2 refers to LD, Laser Diode, that is, a laser diode) is reflected by the objective lens 3 and the dichroic mirror 4, while the detection light 1 emitted from the LED (Light Emitting Diode, that is, a light-emitting diode) passes through the focusing lens 5, the beam splitter 6, the dichroic mirror 4, and the objective lens 3 and is focused on the cavity surface of the laser chip, and the detection light 1 reflected by the cavity surface is focused on the CCD camera 9 through the objective lens 3, the dichroic mirror 4, the beam splitter 6, the filter 7, and the imaging lens 8 and is recorded. It should be noted that the temperature tester system cannot directly obtain the change in reflectivity of the sample, which can be indirectly represented by the gray value of the image, and generally, a lock-in signal generator 12 is used to control the laser "on (ON)" and "off (OFF)" and batch imaging to improve the test accuracy.

[0028] However, it should be emphasized that in actual work, as Figure 3a shown, due to the solder 14 being drained to the front surface of the heat sink 120 close to the detection light 1 during the COS packaging, and the high reflectivity of the solder layer, a large amount of the detection light 1 will be reflected back to the original optical path, and this light beam can be re-reflected back to the cavity surface by the objective lens 3, the dichroic mirror 4, etc.; and because the solder temperature also changes during the "on" and "off" processes of the laser, resulting in the variable intensity of this light beam, ultimately resulting in that the light beam irradiating the cavity surface, in addition to the detection light 1 with a fixed intensity, also has a reflected light beam from the solder layer, and the intensity of this light beam is relatively strong and cannot be ignored. Figure 3b is a direct imaging image of the temperature tester system in the prior art for a typical COS. From Figure 3b it can be seen that the reflected light in the solder layer area is very strong. Therefore, in the prior art, the high reflectivity of the solder layer will cause a large amount of the detection light 1 to be reflected back to the original optical path and be re-reflected back to the cavity surface by the objective lens 3, the dichroic mirror 4, etc., and the intensity of these light beams reflected back to the original optical path is variable, seriously affecting the measurement accuracy of the cavity surface temperature of the laser chip 110.

[0029] For the convenience of description and to make it easy for those skilled in the art to understand the solution of this application, it should be noted that in the test module provided in this application, the applicant introduces an objective lens 3 and a corresponding detection light 1 for schematic illustration in the test scenario; the front surface of the heat sink 120 close to the detection light 1 is defined as the first side surface of the heat sink 120; the front surface of the laser chip 110 close to the detection light 1 is defined as the second side surface of the laser chip 110. In addition, it should also be noted that in the field of laser chip testing, there is usually solder 14 drained on the first side surface, and the spatial area occupied by the solder 14 covering the first side surface is defined as the solder overflow area in this application; the second side surface is the side surface where the laser chip 110 emits the laser light source.

[0030] Test module An embodiment of the present application provides a test module, which includes a laser module. The laser module includes a laser chip and a heat sink. The laser chip is attached to the heat sink to form an interface surface. A solder overflow area is provided on the first side surface of the heat sink close to the detection light; and further includes a light blocking sheet. The solder overflow area is located between the light blocking sheet and the heat sink. The light blocking sheet is used to block the detection light from irradiating the solder overflow area. It should be noted that in the embodiment of the present application, the detection light refers to the detection light emitted by the LED and passing through the focusing lens 5, the beam splitter 6, the dichroic mirror 4, and the objective lens 3 in sequence (see Figure 2 ); by setting a light blocking sheet between the detection light and the laser module to block the detection light from irradiating the highly reflective solder in the solder overflow area, it is avoided that the detection light is reflected from the solder and then returns to the cavity surface of the laser chip through the detection light source optical path, thereby improving the measurement accuracy. It should be emphasized that in other embodiments of the present invention, it is not limited that the solder overflow area must be completely filled with the drained solder. The solder overflow area may also have no solder or only partially drained solder.

[0031] Further, in a possible implementation, the distance from the point on the light-shielding sheet closest to the joint surface to the light-axis plane of the laser chip parallel to the joint surface is H, the vertical divergence angle of the laser beam emitted by the laser chip is γ, the distance between the first side surface of the heat sink and the second side surface of the laser chip close to the detection light is x, the conical surface of the spatial region corresponding to γ is the divergence-angle boundary surface, and the distance between the point on the top surface of the light-shielding sheet closest to the divergence-angle boundary surface and the first side surface of the heat sink is y. The H, γ, x, and y satisfy: (y - x) / tan(γ / 2) < H. It should be noted that the above-mentioned light-axis plane of the laser chip specifically refers to the plane parallel to the joint surface where the laser light axis is located; the second side surface of the above-mentioned laser chip, that is, the side surface where the laser chip emits the laser beam, is usually simply referred to as the light-emitting surface of the laser chip in the technical field of the present application. In addition, the reason for limiting (y - x) / tan(γ / 2) < H in the embodiments of the present application is that the laser emitted by the laser chip has a vertical divergence angle, and the light-shielding sheet may affect the laser emission (for example, the top of the light-shielding sheet may block the laser emitted by the laser chip). Therefore, by limiting (y - x) / tan(γ / 2) < H, the influence of the light-shielding sheet on the laser emission can be avoided, thereby ensuring the accuracy of the test.

[0032] Further, in a possible implementation, the top surface of the light-shielding sheet close to the joint surface is a flat top surface. When the detection light irradiates the flat top surface of the light-shielding sheet, a semi-shadow area is formed in the solder overflow area, and the top boundary line of the semi-shadow area coincides with the joint surface. Preferably, the light-shielding sheet is perpendicular to the joint surface, and the thickness direction of the light-shielding sheet is perpendicular to the first side surface of the heat sink, and the light-shielding sheet is attached to the solder in the solder overflow area. It should be noted that by limiting the top boundary line of the semi-shadow area to coincide with the joint surface, it can be ensured that during the process of the light-shielding sheet blocking the detection light, the light incident amount of the detection light entering the cavity surface of the laser chip is not affected, thereby ensuring the accuracy of the measurement. It should be emphasized that in order to facilitate those skilled in the art to understand the semi-shadow area described in the present application, the applicant combines Figure 3c to elaborate on the relevant concepts and principles in detail as follows: Non-shadow area 15: For the irradiated point on the irradiated surface, all point light sources in the light source can irradiate this irradiated point, and the area formed by these irradiated points constitutes the non-shadow area 15; Penumbra area 16: For the irradiated point on the irradiated surface, some point light sources in the light source can irradiate this irradiated point, and some point light sources in the light source cannot irradiate this irradiated point due to occlusion. The area formed by these irradiated points constitutes the penumbra area 16, that is, the semi-shadow area described in the present application; Full-shadow area 17: For the irradiated point on the irradiated surface, all point light sources in the light source cannot irradiate this irradiated point; Shadow area: For the irradiated point on the irradiated surface, at least some of the point light sources in the light source cannot irradiate this irradiated point. The shadow area includes a penumbra area 16 and an umbra area 17.

[0033] Further, in some embodiments of the present application, the top surface of the light blocking sheet close to the joint surface is set as an inclined top surface, the inclined top surface faces the detection light, and the top end of the inclined top surface is flush with the joint surface; in addition, the complementary angle of the included angle between the inclined top surface and the joint surface is β, the complementary angle of the included angle formed by the connection line between the bottommost light point far from the detection light axis of the detection light and the topmost point of the light blocking sheet and the joint surface is α, and β < α. Optionally, the light blocking sheet is attached to the solder in the solder overflow area. It should be noted that by defining that the top end of the inclined top surface is flush with the joint surface, the possible penumbra area can be eliminated, and by defining β < α, it can be ensured that the detection light entering the cavity surface of the laser chip will not be blocked by the inclined top surface of the light blocking sheet, thereby ensuring the accuracy of the measurement.

[0034] Further, in some embodiments of the present application, the top surface of the light blocking sheet close to the joint surface sequentially includes an inclined surface and a flat surface along the direction from far away from the first side to close to the first side; when the detection light irradiates the flat surface of the light blocking sheet, a penumbra area is formed in the solder overflow area, and the top boundary line of the penumbra area coincides with the joint surface. It should be noted that there are two beneficial effects of setting the top surface of the light blocking sheet as these two parts of the inclined surface and the flat surface along the detection light direction in the embodiments of the present application: First, the inclined surface part is used to minimize the blockage of the detection light to be irradiated on the cavity surface of the laser chip by the light blocking sheet; second, the flat surface part is used to avoid and prevent the detection light from penetrating the light blocking sheet and affecting the light shielding effect of the light blocking sheet on the solder overflow area.

[0035] Further, in some preferred embodiments of the present application, the top surface of the light blocking sheet close to the joint surface includes an inclined surface part, the inclined surface part faces the detection light, and the complementary angle of the included angle between the inclined surface part and the joint surface is β, and β and γ satisfy: β < 90° - γ / 2. It should be noted that by preferably defining that β and γ satisfy the relationship of β < 90° - γ / 2, it can be ensured that during the laser emission process of the laser chip, the laser will not be blocked by the top surface of the light blocking sheet due to the vertical divergence angle problem, and it can also be ensured that the detection light entering the cavity surface of the laser chip will not be blocked by the top surface of the light blocking sheet, thereby greatly improving the accuracy of the test.

[0036] Further, in some embodiments of the present application, the light shielding sheet is provided with a light absorbing material and / or blackened on the surface for blocking the detection light; wherein, optionally, the light absorbing material may be set as a matte rubber, magnesium fluoride, or a paint containing silica white, etc., and the blackening treatment may be to attach a black flocked cloth to the surface of the light shielding sheet that needs to block the detection light. Preferably, the surface of the light shielding sheet for blocking the detection light is provided with a light absorbing material and blackened. It should be noted that by setting the light absorbing material and blackening the surface of the light shielding sheet for blocking the detection light, the reflection of the detection light by the light shielding sheet during the process of blocking the detection light can be minimized, thereby reducing the influence on the detection light received by the cavity surface of the laser chip, and further ensuring the accuracy of the test. In addition, it should also be noted that since the surface of the light shielding sheet provided in the embodiments of the present application for blocking the detection light will vary with the different top surface shape structures and the relative positions with respect to the laser module, the embodiments of the present application do not limit the specific position of the surface of the light shielding sheet that needs to be provided with the light absorbing material and blackening treatment. Instead, based on the functional requirements of different structural types and different relative position relationships of the light shielding sheet in actual use for blocking the detection light, the light absorbing material is set on the surface of the light shielding sheet and the blackening treatment is carried out. Of course, in other embodiments of the present application, at least one optionally preferred embodiment is that light absorbing materials are provided on all surfaces of the light shielding sheet and blackening treatment is performed on it.

[0037] Further, in some preferred embodiments of the present application, the surface of the light shielding sheet for blocking the detection light is provided with a curved surface structure, so that when the detection light irradiates on the curved surface structure, the detection light will be reflected outside the main optical path (this main optical path refers to the optical path of the detection light passing through the path of "beam splitter 6 - dichroic mirror 4 - objective lens 3"). It should be noted that in order to further reduce the light shielding sheet from reflecting the detection light back to the original detection light optical path and then returning to the laser chip, which affects the measurement accuracy, the applicant preferably sets the surface of the light shielding sheet for blocking the detection light as a curved surface structure, thereby maximizing the elimination of the possible reflection of the light shielding sheet on the measurement of the laser chip.

[0038] An embodiment of the present application also provides a test system, which includes the aforementioned test module. It should be noted that by configuring the test module in the test system, the accuracy and precision of the test system when testing the laser chip can be greatly improved, and it has broad application prospects.

[0039] Further optionally, in some embodiments of the present application, the test system further includes a heat dissipation table and a spatial position adjustment module for adjusting the relative positions of the light shielding sheet and the laser module. The spatial position adjustment module is disposed in the test module and mounted on the heat dissipation table. It should be noted that by setting the spatial position adjustment module, the relative positions between the light shielding sheet and the laser module can be adjusted, so that the light shielding sheet can adapt to the cavity surface measurement of different laser modules. Thus, on the basis of effectively ensuring the test accuracy of the test system, the adaptation range of the test module to the laser module is broadened, which greatly promotes the industrial application of the test system.

[0040] Further specifically, in a possible implementation manner of the present application, the spatial position adjustment module includes a first adjustment module and a second adjustment module; wherein, the first adjustment module is used to adjust the light shielding sheet and the laser module to approach or move away from each other. The first adjustment module includes a first motor and a first moving member. The light shielding sheet is fixedly connected to the first moving member. The first motor is fixed to the heat dissipation table and is adjustably linked to the first moving member, so that when the first motor drives the first moving member to move, the light shielding sheet is driven to approach or move away from the laser module; The second adjustment module includes a limiting component and a second motor. The limiting component at least includes a moving limiting member; the moving limiting member is detachably and fixedly connected to the laser module. The second motor is mounted on the heat dissipation table and is adjustably linked to the moving limiting member, so that when the second motor drives the moving limiting member to move, the laser module is driven to move in a plane perpendicular to the optical axis of the detection light. It should be noted that preferably, the first motor and the second motor in the embodiments of the present application can use micro-control motors capable of realizing corresponding functions, so as to achieve the effect of accurately controlling the relative position of the light shielding sheet; in addition, preferably, in order to limit the extreme positions of the laser module in the X and Y directions when it is adjusted, the limiting component further includes a fixed limiting member. The fixed limiting member is fixed to the heat dissipation table. The fixed limiting member and the moving limiting member form a U-shaped space for accommodating the laser module, and the opening of the U-shaped space faces the detection light; when the laser module is adjusted to approach the extreme position in the X and / or Y direction, the laser module will abut against the inner wall of the fixed limiting member and be restricted from moving, so that the laser module is more stably limited.

[0041] It should be emphasized that the test system provided by the embodiments of the present application is only one of the enumerated examples among many embodiments. In other embodiments of the present application, it is not limited to the specific structural features of the above-mentioned spatial position adjustment module provided by the embodiments of the present application. It can also be other spatial position adjustment modules, as long as it can realize the adjustable relative position between the light shielding plate and the laser module, so that the light shielding plate can adapt to the cavity surface measurement of different laser modules and ensure the test accuracy of the test system. For example, in other embodiments of the present application, an adjustment device of a micrometer can also be used to replace the corresponding first motor and second motor. Embodiment

[0042] Such as Figure 4 As shown, this embodiment provides a test module, which includes a light shielding plate 130 and a laser module 100 to be tested. The laser module 100 includes a laser chip 110 and a heat sink 120. The laser chip 110 is attached to the heat sink 120 to form an interface surface 115. A solder overflow area 140 is provided on a first side surface 122 of the heat sink 120 close to the detection light 1; the solder overflow area 140 is located between the light shielding plate 130 and the heat sink 120, and the light shielding plate 130 is used to block the detection light 1 from irradiating the solder overflow area 140.

[0043] Furthermore, the top surface of the light shielding plate 130 close to the interface surface 115 is a flat top surface, and the flat top surface is located below the interface surface 115. When the detection light 1 irradiates the flat top surface of the light shielding plate 130, a semi-shadow area 162 is formed in the solder overflow area 140, and the top boundary line of the semi-shadow area 162 coincides with the interface surface 115. In addition, the distance from the point on the light shielding plate 130 closest to the interface surface 115 to the optical axis surface 114 of the laser chip is H, the vertical divergence angle of the laser beam emitted by the laser chip 110 is γ, the distance between the first side surface 122 of the heat sink 120 and the second side surface 112 of the laser chip 110 close to the detection light 1 is x, the conical surface of the spatial region corresponding to γ is the divergence angle boundary surface 116, and the distance between the point on the top surface of the light shielding plate 130 closest to the divergence angle boundary surface 116 and the first side surface 122 of the heat sink 120 is y. H, γ, x, and y satisfy: (y - x) / tanγ / 2 < H.

[0044] Such as Figure 5 As shown, this embodiment also provides a test system 10, which includes the above-mentioned test module provided by this embodiment, a heat dissipation table 101, and a spatial position adjustment module 150 for adjusting the relative position between the light shielding plate 130 and the laser module 100. The spatial position adjustment module 150 is configured in the test module and installed on the heat dissipation table 101; the spatial position adjustment module 150 includes a first adjustment module 152 and a second adjustment module 154.

[0045] Further specifically, the first adjustment module 152 is used to adjust the light shielding plate 130 and the laser module 100 to move closer to or away from each other (i.e., move in the X direction). The first adjustment module 152 includes a first micro-control motor 1522 and a first moving member 1524. The light shielding plate 130 is fixedly connected to the first moving member 1524. The first micro-control motor 1522 is fixed to the heat dissipation table 101 and is adjustably linked to the first moving member 1524. So that when the first micro-control motor 1522 drives the first moving member 1524 to move, it drives the light shielding plate 130 to approach or move away from the laser module 100.

[0046] Even more specifically, the second adjustment module 154 includes a limit component 1542 and a second micro-control motor 1544. The limit component 1542 includes a fixed limit member 1541 and a movable limit member 1543. The fixed limit member 1541 is fixed to the heat dissipation table 101. The fixed limit member 1541 and the movable limit member 1543 form a U-shaped space for accommodating the laser module 100, and the opening of the U-shaped space faces the detection light. The movable limit member 1543 is detachably and fixedly connected to the laser module 100. The second micro-control motor 1544 is installed on the heat dissipation table 101 and is adjustably linked to the movable limit member 1543. So that when the second micro-control motor 1544 drives the movable limit member 1543 to move, it drives the laser module 100 to move in a plane perpendicular to the optical axis of the detection light (including the Y direction and the direction perpendicular to both X and Y simultaneously). Embodiment

[0047] Please refer to Figure 4 and Figure 6 This embodiment provides a test module, which is substantially the same as Embodiment 1. The difference is that in the test module provided in this embodiment, an absorbing material ( Figure 6 not shown) is provided on the surface of the second light shielding plate 230 for blocking the detection light 1, and a curved surface structure is provided on the surface of the second light shielding plate 230 for blocking the detection light 1, so that when the detection light 1 irradiates on the curved surface structure, the detection light 1 will be reflected outside the main optical path of the detection light 1. Embodiment

[0048] As Figure 7 shown, this embodiment provides a test module, which is substantially the same as Embodiment 2. The difference is that in the test module provided in this embodiment, the top surface of the third light shielding plate 330 close to the interface 115 is set as an inclined top surface, the inclined top surface faces the detection light 1, and the top end of the inclined top surface is flush with the interface 115.

[0049] In addition, in this embodiment, the complementary angle of the angle between the inclined top surface and the interface 115 is β, and the complementary angle of the angle formed by the connection line between the bottommost light point of the detection light 1 far from the optical axis of the detection light and the topmost point of the third light shielding plate 330 and the interface 115 is α, and β < α. Embodiment

[0050] As Figure 8 shown, this embodiment provides a test module, which is substantially the same as Embodiment Three. The difference is that in the test module provided in this embodiment, the top of the inclined top surface of the fourth light shield 430 is lower than the interface surface 115. When the detection light 1 irradiates the inclined top surface of the fourth light shield 430, a semi-shadow area 462 is formed in the solder overflow area 140. The top boundary line of the semi-shadow area 462 coincides with the interface surface 115, and β and γ satisfy: β < 90° - γ / 2. Embodiment

[0051] As Figure 9 shown, this embodiment provides a test module, which is substantially the same as Embodiment Three. The difference is that the top surface of the fifth light shield 530 close to the interface surface 115 includes an inclined surface and a flat surface in sequence along the direction of the detection light 1; when the detection light 1 irradiates the flat surface of the fifth light shield 530, a semi-shadow area 562 is formed in the solder overflow area 140. The top boundary line of the semi-shadow area 562 coincides with the interface surface 115. Embodiment

[0052] As Figure 10 shown, this embodiment provides a test module, which is substantially the same as Embodiment Five. The difference is that in the test module provided in this embodiment, β corresponding to the sixth light shield 630 and the vertical divergence angle γ of the laser beam emitted by the laser chip 110 satisfy: β < 90° - γ / 2.

[0053] It should be emphasized that in Embodiments Two to Six above, (y - x) / tanγ / 2 < H is satisfied. Since the differences from other embodiments are mainly emphasized in Embodiments Two to Six, (y - x) / tanγ / 2 < H is not described again. In addition, the above are only preferred specific embodiments of the present application. Each embodiment is only used to illustrate the technical solution of the present application rather than to limit the present application. Any technical solution that can be obtained by those skilled in the art through logical analysis, reasoning or effective verification according to the concept of the present application should fall within the scope of the present application.

[0054] In summary, for the test module provided by the embodiments of the present application, by arranging a light blocking sheet between the detection light and the laser module to block the detection light from irradiating on the highly reflective solder, it is avoided that the detection light is reflected from the solder and then returns to the cavity surface of the laser chip through the optical path of the detection light source, thereby improving the measurement accuracy; by optimizing and defining the shape of the light blocking sheet, the influence on the detection light received by the laser chip due to the addition of the light blocking sheet is reduced to ensure the measurement accuracy; by combining the characteristics of the designed shape of the light blocking sheet and the reasonable configuration of the relative position between the light blocking sheet and the laser chip, the setting of the light blocking sheet not only does not affect the irradiation of the detection light on the laser chip, but also does not affect the emitted light of the laser chip, thereby further ensuring the measurement accuracy; in addition, by performing a curved surface design, an absorbing material setting, and / or a blackening treatment on the surface of the light blocking sheet for blocking the detection light, it is effectively avoided that the light blocking sheet reflects the detection light back to the original optical path of the detection light and then reflects it to the laser chip, thereby further improving the measurement accuracy of the test module. Additionally, for the test system provided by the present application, by arranging a spatial position adjustment module, the relative position between the light blocking sheet and the laser module is adjustable, so that the light blocking sheet can adapt to the cavity surface measurement of different laser modules, thereby broadening the adaptation range of the test module to the laser module on the basis of effectively ensuring the test accuracy of the test system, and greatly promoting the industrial application of the test system.

[0055] For the same or similar parts among the various embodiments in the present application, reference can be made to each other. Each embodiment focuses on the differences from other embodiments.

[0056] In the various embodiments disclosed in the present application, the expressions "first", "second", "the first", or "the second" used can modify various components without being related to the order and / or importance, but these expressions do not limit the corresponding components. The above expressions are only configured for the purpose of distinguishing elements from other elements. For example, the first side and the second side represent different sides, although both are sides.

Claims

1. A test module, characterized in that: It includes: A laser module, the laser module comprising a laser chip and a heat sink, the laser chip and the heat sink being attached to form an interface, and a solder overflow area being provided on a first side of the heat sink close to the detection light; A light shielding sheet, wherein the solder overflow area is located between the light shielding sheet and the heat sink, and the light shielding sheet is used to block the detection light from irradiating the solder overflow area.

2. The test module according to claim 1, characterized in that: The distance from the point of the light shield closest to the intersection surface to the optical axis surface of the laser chip parallel to the intersection surface is H, the vertical divergence angle of the laser beam emitted by the laser chip is γ, the distance between the first side surface of the heat sink and the second side surface of the laser chip close to the detection light is x, the conical surface of the space area corresponding to γ ​​is the divergence angle boundary surface, the distance between the top surface of the light shield closest to the divergence angle boundary surface and the first side surface of the heat sink is y, and H, γ, x and y satisfy: (yx) / tanγ / 2 <H。 3. The test module according to claim 1 or 2, characterized in that: The top surface of the light shielding sheet close to the intersection surface is a flat top surface. When the detection light irradiates the flat top surface of the light shielding sheet, a semi-shadow area is formed in the solder overflow area, and the top boundary line of the semi-shadow area coincides with the intersection surface.

4. The test module according to claim 1 or 2, characterized in that: The top surface of the light shielding sheet close to the interface is set as an inclined top surface, the inclined top surface faces the detection light, and the top end of the inclined top surface is flush with the interface; The complementary angle between the inclined top surface and the intersection surface is β, the complementary angle between the bottommost light point of the detection light away from the detection light optical axis and the topmost point of the light blocking plate and the intersection surface is α, and β<α.

5. The test module according to claim 1 or 2, characterized in that: The top surface of the light blocking sheet close to the intersection surface includes an inclined surface and a flat surface in sequence along a direction away from the first side surface to close to the first side surface; When the detection light is irradiated onto the flat surface of the light shielding sheet, a semi-shadow area is formed in the solder overflow area, and the top boundary line of the semi-shadow area coincides with the intersection surface.

6. The test module according to claim 2, wherein: The top surface of the light shielding sheet close to the intersection surface includes an inclined surface portion, the inclined surface portion faces the detection light, and the complementary angle between the inclined surface portion and the intersection surface is β, and β and γ satisfy: β<90°-γ / 2.

7. The test module according to claim 1, wherein: The surface of the light blocking sheet used for blocking the detection light is provided with light absorbing material and / or is subjected to blackening treatment.

8. The test module according to claim 7, characterized in that: The surface of the light blocking sheet used for blocking the detection light is provided with a curved surface structure, so that when the detection light is irradiated on the curved surface structure, the detection light will be reflected outside the main light path.

9. A testing system, characterized in that: It comprises the test module as claimed in any one of claims 1 to 8.

10. The test system according to claim 9, characterized in that: The test system further comprises a heat sink and a spatial position adjustment module for adjusting the relative position of the light shielding sheet and the laser module. The spatial position adjustment module is configured in the test module and mounted on the heat sink.

11. The test system according to claim 10, characterized in that: The spatial position adjustment module includes a first adjustment module and a second adjustment module; The first adjustment module is used to adjust the light shielding sheet and the laser module to move closer to or farther from each other. The first adjustment module includes a first motor and a first moving part. The light shielding sheet is fixedly connected to the first moving part. The first motor is fixed to the heat sink. The first motor drives the first moving part to move, thereby driving the light shielding sheet to move closer to or farther from the laser module. The second adjustment module includes a limit assembly and a second motor, and the limit assembly includes at least a movable limit piece; the movable limit piece is detachably fixedly connected to the laser module, and the second motor is installed on the heat dissipation platform. The second motor drives the movable limit piece to move, thereby driving the laser module to move in a plane perpendicular to the optical axis of the detection light.

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