Method and device for measuring copper-phosphorus brazing filler metal and storage medium

Abstract

The invention discloses a copper-phosphorus brazing filler metal measuring method and device and a storage medium, and belongs to the field of copper-phosphorus brazing filler metal detection. The method for determining the copper-phosphorus brazing filler metal comprises the following steps: providing the copper-phosphorus brazing filler metal to be detected and a digestion solution, wherein the digestion solution comprises hydrochloric acid and hydrogen peroxide; adding the to-be-detected copper-phosphorus brazing filler metal and the digestion solution into a digestion container, so that the digestion solution digests the copper-phosphorus brazing filler metal to obtain a to-be-detected solution; and determining the to-be-detected liquid to obtain the determined content of the phosphorus element and the determined content of the silver element in the copper-phosphorus brazing filler metal.

Description

Technical Field

[0001] This application belongs to the field of copper - phosphorus filler metal detection, and specifically relates to a method for determining copper - phosphorus filler metal, a determination device, and a storage medium. Background Art

[0002] With the progress of technology, during the brazing process, filler metals are usually used, and the filler metal can be copper - phosphorus filler metal. Among them, copper - phosphorus contains silver element, copper element, and phosphorus element. To ensure the quality of copper - phosphorus filler metal, it is necessary to detect the content of phosphorus element and silver element in the copper - phosphorus filler metal. However, in the related technology, the retrieval of the content of phosphorus element and silver element in copper - phosphorus filler metal is relatively cumbersome, and the detection efficiency is low. Summary of the Invention

[0003] The purpose of the embodiments of this application is to provide a method for determining copper - phosphorus filler metal, a determination device, and a storage medium, which at least solve the problems that the retrieval of the content of phosphorus element and silver element in copper - phosphorus filler metal is relatively cumbersome and the detection efficiency is low.

[0004] In a first aspect, the embodiments of this application provide a method for determining copper - phosphorus filler metal, and the method for determining copper - phosphorus filler metal includes: Providing a copper - phosphorus filler metal to be detected and a digestion solution, where the digestion solution includes hydrochloric acid and hydrogen peroxide; Adding the copper - phosphorus filler metal to be detected and the digestion solution into a digestion container, so that the digestion solution digests the copper - phosphorus filler metal to obtain a solution to be detected; Measuring the solution to be detected to obtain the measured content of phosphorus element and the measured content of silver element in the copper - phosphorus filler metal.

[0005] Optionally, adding the copper - phosphorus filler metal to be detected and the digestion solution into a digestion container, so that the digestion solution digests the copper - phosphorus filler metal to obtain a solution to be detected, includes: Adding the copper - phosphorus filler metal to be detected and the digestion solution into a digestion container, and heating the digestion container for a preset duration, so that the digestion solution digests the copper - phosphorus filler metal.

[0006] Optionally, heating the digestion container for a preset duration includes: Heating the digestion container so that the digestion container reaches a preset temperature, and keeping the temperature of the digestion container at the preset temperature for a preset duration.

[0007] Optionally, before measuring the solution to be detected, the method for determining copper - phosphorus filler metal further includes: Transferring the solution to be detected from the digestion container to a volumetric flask; Rinsing the digestion container with hydrochloric acid and combining the hydrochloric acid for rinsing the digestion container into the volumetric flask; Wash the digestion container with distilled water and combine the distilled water used to wash the digestion container into the volumetric flask.

[0008] Optionally, the step of rinsing the digestion container with hydrochloric acid and combining the hydrochloric acid used to rinse the digestion container into the volumetric flask includes: Rinse the digestion container with the hydrochloric acid multiple times, and the amount of hydrochloric acid used for each rinsing of the digestion container is fixed; Combine the hydrochloric acid used for each rinsing of the digestion container into the volumetric flask.

[0009] Optionally, after washing the digestion container with distilled water and combining the distilled water used to wash the digestion container into the volumetric flask, the copper - phosphorus brazing filler metal determination method further includes: Add distilled water to the volumetric flask to make the liquid level of the solution in the volumetric flask reach a preset scale.

[0010] Optionally, after measuring the liquid to be detected to obtain the measured content of phosphorus element and the measured content of silver element in the copper - phosphorus brazing filler metal, the copper - phosphorus brazing filler metal determination method further includes: Determine the difference between the measured content of the phosphorus element and the first standard content to obtain a first difference, and determine the difference between the measured content of the silver element and the second standard content to obtain a second difference; Determine whether the first difference is within a first numerical range and whether the second difference is within a second numerical range; If the first difference is within the first numerical range and the second difference is within the second numerical range, then the copper - phosphorus brazing filler metal meets the requirements.

[0011] Optionally, the step of providing the copper - phosphorus brazing filler metal to be detected and the digestion solution includes: Provide a first quantity of copper - phosphorus brazing filler metal, a second quantity of hydrochloric acid, and a third quantity of hydrogen peroxide, and the second quantity of hydrochloric acid and the third quantity of hydrogen peroxide form the digestion solution.

[0012] In a second aspect, an embodiment of the present application provides a copper - phosphorus brazing filler metal measuring device, and the copper - phosphorus brazing filler metal measuring device includes: A providing module, configured to provide a copper - phosphorus brazing filler metal to be detected and a digestion solution, where the digestion solution includes hydrochloric acid and hydrogen peroxide; An adding module, configured to add the copper - phosphorus brazing filler metal to be detected and the digestion solution into a digestion container so that the digestion solution digests the copper - phosphorus brazing filler metal to obtain a liquid to be detected; A measuring module, configured to measure the liquid to be detected to obtain the measured content of phosphorus element and the measured content of silver element in the copper - phosphorus brazing filler metal.

[0013] In a third aspect, an embodiment of the present application provides an electronic device, including a processor and a memory. The memory stores a program or instruction that can run on the processor. When the program or instruction is executed by the processor, the steps of the copper-phosphorus solder determination method described in any one of the above first aspects are implemented.

[0014] In a fourth aspect, an embodiment of the present application provides a storage medium, on which a program or instruction is stored. When the program or instruction is executed by a processor, the steps of the copper-phosphorus solder determination method described in the above first aspect are implemented.

[0015] In a fifth aspect, an embodiment of the present application provides a chip, which includes a processor and a communication interface. The communication interface is coupled to the processor, and the processor is used to run a program or instruction to implement the method described in the first aspect.

[0016] In a sixth aspect, an embodiment of the present application provides a computer program product, which is stored in a storage medium and is executed by at least one processor to implement the method described in the first aspect.

[0017] In the embodiment of the present application, by providing a copper-phosphorus solder to be detected and a digestion solution, the digestion solution includes hydrochloric acid and hydrogen peroxide; adding the copper-phosphorus solder to be detected and the digestion solution into a digestion container to enable the digestion solution to digest the copper-phosphorus solder and obtain a solution to be detected; measuring the solution to be detected to obtain the measured content of phosphorus element and the measured content of silver element in the copper-phosphorus solder. That is, in the embodiment of the present application, the content of silver element and the content of phosphorus element are directly measured through the solution to be detected, so that the retrieval of the content of phosphorus element and the content of silver element in the copper-phosphorus solder is relatively simple and the detection efficiency is relatively high. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It represents a flowchart of a copper-phosphorus solder determination method provided by an embodiment of the present application; Figure 2 It represents a schematic diagram of a copper-phosphorus solder determination device provided by an embodiment of the present application; Figure 3 It represents a schematic diagram of an electronic device provided by an embodiment of the present application; Figure 4 It represents a schematic diagram of the hardware structure of an electronic device provided by an embodiment of the present application. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0019] Next, the technical solutions in the embodiments of the present application will be clearly described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art belong to the scope of protection of the present application.

[0020] The terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, rather than to describe a specific order or sequence. It should be understood that such data can be interchanged under appropriate circumstances so that the embodiments of the present application can be implemented in an order other than those illustrated or described herein, and the objects distinguished by "first", "second", etc. are generally of the same type, and the number of objects is not limited. For example, the first object can be one or multiple. In addition, "and / or" in the specification and claims means at least one of the connected objects, and the character " / " generally indicates an "or" relationship between the associated objects before and after.

[0021] Referring to Figure 1 , a flowchart of a method for determining a copper-phosphorus brazing filler metal provided by an embodiment of the present application is shown. As Figure 1 shown, the method for determining the copper-phosphorus brazing filler metal includes: Step 101: Provide a copper-phosphorus brazing filler metal to be detected and a digestion solution, where the digestion solution includes hydrochloric acid and hydrogen peroxide.

[0022] Among them, the copper-phosphorus brazing filler metal contains silver element, phosphorus element and copper element. The provided digestion solution includes hydrochloric acid and hydrogen peroxide. Once the copper-phosphorus brazing filler metal contacts the digestion solution, the digestion solution can digest the copper-phosphorus brazing filler metal. Among them, hydrochloric acid can react with the copper-phosphorus brazing filler metal, and during the reaction, hydrogen peroxide can act as a reaction oxidant, thereby effectively increasing the reaction rate, and the excess hydrogen peroxide can be removed by heating later. That is, by setting the digestion solution to include hydrochloric acid and hydrogen peroxide, the copper-phosphorus brazing filler metal can be effectively digested.

[0023] It should be noted that if nitric acid is used to digest the copper-phosphorus brazing filler metal, nitric acid reacts with the silver element in the copper-phosphorus brazing filler metal to generate silver nitrate. Since silver nitrate is unstable and easily decomposes when exposed to light, it is difficult to determine the content of silver element in the copper-phosphorus brazing filler metal later. If hydrofluoric acid is used to digest the copper-phosphorus brazing filler metal, hydrofluoric acid reacts with the silver element in the copper-phosphorus brazing filler metal to generate silver fluoride, but hydrofluoric acid is a highly toxic substance; perchloric acid has strong corrosiveness and strong irritation, and there is a risk of combustion and explosion when contacting or mixing with reducing organic substances and reducing agents. In summary, hydrochloric acid is selected in the present application, and hydrogen peroxide is creatively added, so that hydrochloric acid and hydrogen peroxide form a digestion solution, which can effectively digest the copper-phosphorus brazing filler metal, and the digestion solution is relatively safe.

[0024] In addition, in some implementation manners, the implementation manner of step 101 may be: providing a first quantitative amount of copper-phosphorus solder, a second quantitative amount of hydrochloric acid, and a third quantitative amount of hydrogen peroxide, and the second quantitative amount of hydrochloric acid and the third quantitative amount of hydrogen peroxide form a digestion solution. Herein, the first quantitative amount, the second quantitative amount, and the third quantitative amount are all different from each other.

[0025] Among them, by providing a first quantitative amount of copper-phosphorus solder, the amount of copper-phosphorus solder is determined accordingly. Subsequently, when detecting the silver element and the phosphorus element in the copper-phosphorus solder, the detection results can be directly divided by the amount of copper-phosphorus solder to obtain the relatively accurate contents of the phosphorus element and the silver element. In addition, by providing a second quantitative amount of hydrochloric acid and a third quantitative amount of hydrogen peroxide, the amounts of hydrochloric acid and hydrogen peroxide are determined, that is, the amount of the digestion solution is determined, so as to ensure that the digestion solution can completely digest the copper-phosphorus solder subsequently.

[0026] It should be noted that the first quantitative amount, the second quantitative amount, and the third quantitative amount can all be set according to actual needs. For example, the first quantitative amount is 0.1 g, the second quantitative amount is 10 mL, and the third quantitative amount is 5 mL.

[0027] Step 102: Add the copper-phosphorus solder to be detected and the digestion solution into a digestion container so that the digestion solution digests the copper-phosphorus solder to obtain a solution to be detected.

[0028] Among them, by adding the solder to be detected and the digestion solution into the digestion container, it can be ensured that after the digestion solution digests the copper-phosphorus solder, the copper-phosphorus solder is dissolved in the digestion solution to obtain a solution to be detected. And the presence of the digestion container avoids the loss of the detection solution, thus facilitating the subsequent determination of the contents of the phosphorus element and the silver element in the copper-phosphorus solder.

[0029] It should be noted that the digestion container can be made of a material that does not react with the digestion solution to avoid the reaction between the digestion solution and the digestion container, which affects the subsequent determination of the contents of the phosphorus element and the silver element in the copper-phosphorus solder. For example, the digestion container is made of polytetrafluoroethylene.

[0030] In addition, in some implementation manners, the implementation manner of step 102 may be: adding the copper-phosphorus solder to be detected and the digestion solution into a digestion container and heating the digestion container for a preset duration so that the digestion solution digests the copper-phosphorus solder.

[0031] Among them, the copper-phosphorus solder to be detected and the digestion solution can be added into the digestion container, and then the digestion container is heated. And heating for the preset duration can effectively shorten the time for the digestion solution to dissolve the copper-phosphorus solder, thus saving time and improving the determination efficiency for the copper-phosphorus solder determination.

[0032] Of course, in the embodiments of the present application, after adding the copper-phosphorus brazing filler metal to be detected and the digestion solution into the digestion container, the digestion container may not be heated.

[0033] It should be noted that the digestion container can be placed in an electric heating digestion instrument, and the digestion container is heated by the electric heating digestion instrument to increase the temperature of the digestion solution in the digestion container, thereby shortening the time for the digestion solution to digest the copper-phosphorus brazing filler metal.

[0034] In addition, in some implementation manners, the implementation manner of heating the digestion container for a preset duration may be: heating the digestion container to make the digestion container reach a preset temperature, and keeping the temperature of the digestion container at the preset temperature for a preset duration.

[0035] By keeping the temperature of the digestion container at the preset temperature for a preset duration, the time for the digestion solution to digest the copper-phosphorus brazing filler metal can be effectively shortened.

[0036] It should be noted that the preset temperature can be set according to actual needs. For example, the preset temperature is 150 °C, or for another example, the preset temperature is 100 °C. The specific value of the preset temperature is not limited in the embodiments of the present application. In addition, the preset duration can be set according to actual needs. For example, the preset duration is 1 hour, or for another example, the preset duration is 1.5 hours. The specific value of the preset duration is not limited in the embodiments of the present application.

[0037] In addition, in order to improve the efficiency of the digestion solution to digest the copper-phosphorus brazing filler metal, in the embodiments of the present application, the preset temperature can be set to 150 °C and the preset duration can be set to 1 hour, that is, the digestion container is heated to 150 °C and kept for 1 hour.

[0038] In addition, in some implementation manners, before measuring the test solution, the copper-phosphorus brazing filler metal determination method may further include: transferring the test solution from the digestion container to a volumetric flask; rinsing the digestion container with hydrochloric acid and combining the hydrochloric acid for rinsing the digestion container into the volumetric flask; cleaning the digestion container with distilled water and combining the distilled water for cleaning the digestion container into the volumetric flask.

[0039] Among them, the digestion solution contains hydrochloric acid. During the process of the digestion solution digesting the copper-phosphorus brazing filler metal, hydrochloric acid and hydrogen peroxide in the digestion solution react with silver in the copper-phosphorus brazing filler metal to finally form a soluble complex [Ag(Cl) 2 — , however, during the subsequent dilution and volume fixation process, as distilled water is continuously added, the concentration of Cl — decreases accordingly and is not sufficient to support [Ag(Cl) 2 — ​​It persists stably, causing silver chloride to precipitate and affecting the subsequent determination of the silver element content. To avoid this problem, in the embodiments of the present application, the digestion container is rinsed with hydrochloric acid, and the hydrochloric acid for rinsing the digestion container is combined into the volumetric flask, so that hydrochloric acid can effectively supplement Cl in the solution in the volumetric flask. — , and further ensure [Ag(Cl) 2 — persists stably, facilitating the subsequent determination of the silver element content.

[0040] In addition, in some implementation manners, the implementation manner of rinsing the digestion container with hydrochloric acid and combining the hydrochloric acid for rinsing the digestion container into the volumetric flask can be: the digestion container is rinsed with hydrochloric acid multiple times, and the dosage of hydrochloric acid for rinsing the digestion container each time is fixed; the hydrochloric acid for rinsing the digestion container each time is combined into the volumetric flask.

[0041] Among them, by setting the dosage of hydrochloric acid for rinsing the digestion container each time to be fixed, the final amount of hydrochloric acid in the volumetric flask can be determined. This can not only ensure that the copper-phosphorus brazing filler is effectively dissolved, but also ensure that the proportion of hydrochloric acid in the final solution in the volumetric flask can maintain [Ag(Cl) 2 — persists stably.

[0042] It should be noted that when rinsing the digestion container with hydrochloric acid, it can be rinsed 3 times, and 15 mL of hydrochloric acid is used each time, so as to ensure that the digestion container can be rinsed clean and determine that a total of 45 mL of hydrochloric acid is used for rinsing the digestion container. Thus, if the amount of hydrochloric acid contained in the digestion solution is determined, for example, the amount of hydrochloric acid contained in the digestion solution is 10 mL, then the total amount of hydrochloric acid in the detection solution is 55 mL.

[0043] In addition, in some implementation manners, after rinsing the digestion container with distilled water and combining the distilled water for rinsing the digestion container into the volumetric flask, the copper-phosphorus brazing filler determination method may further include: adding distilled water to the volumetric flask to make the liquid level of the solution in the volumetric flask reach a preset scale.

[0044] Among them, the preset scale can be set according to actual needs. For example, the preset scale is 250 mL, or for another example, the preset scale is 300 mL. In this regard, the embodiments of the present application do not make any limitations here.

[0045] It should be noted that in the embodiments of the present application, the proportion of hydrochloric acid in the final solution in the volumetric flask can be 22%. Of course, it can also be other values, for example, 21%. In this regard, the embodiments of the present application do not make any limitations here. Among them, the final solution in the volumetric flask includes the digestion solution, the hydrochloric acid for rinsing the digestion container, the distilled water for rinsing the digestion container, and the distilled water subsequently added to the volumetric flask, that is, the liquid level of the final solution in the volumetric flask reaches the preset scale.​​

[0046] Step 103: Measure the liquid to be detected to obtain the measured content of phosphorus element and the measured content of silver element in the copper-phosphorus solder.

[0047] Among them, when measuring the liquid to be detected, it can be measured by an inductively coupled plasma emission spectrometer. Specifically, scan the spectrum of the liquid to be detected by the inductively coupled plasma emission spectrometer, and then determine the measured content of phosphorus element and the measured content of silver element in the copper-phosphorus solder according to the spectrum.

[0048] In addition, in some implementation manners, after step 103, the copper-phosphorus solder measurement method may further include: determining the difference between the measured content of phosphorus element and the first standard content to obtain a first difference, and determining the difference between the measured content of silver element and the second standard content to obtain a second difference; determining whether the first difference is within a first numerical range and whether the second difference is within a second numerical range; if the first difference is within the first numerical range and the second difference is within the second numerical range, then the copper-phosphorus solder meets the requirements.

[0049] Among them, both the first numerical range and the second numerical range can be set according to actual needs.

[0050] In the embodiments of the present application, by providing a copper-phosphorus solder to be detected and a digestion solution, the digestion solution includes hydrochloric acid and hydrogen peroxide; adding the copper-phosphorus solder to be detected and the digestion solution into a digestion container so that the digestion solution digests the copper-phosphorus solder to obtain a liquid to be detected; measuring the liquid to be detected to obtain the measured content of phosphorus element and the measured content of silver element in the copper-phosphorus solder. That is, in the embodiments of the present application, directly measure the content of silver element and the content of phosphorus element through the liquid to be detected, so that the retrieval of the content of phosphorus element and the content of silver element in the copper-phosphorus solder is relatively simple and the detection efficiency is relatively high.

[0051] The embodiments of the present application provide a copper-phosphorus solder measuring device, as Figure 2 shown. The copper-phosphorus solder measuring device 200 includes: A providing module 201, configured to provide a copper-phosphorus solder to be detected and a digestion solution, the digestion solution includes hydrochloric acid and hydrogen peroxide; An adding module 202, configured to add the copper-phosphorus solder to be detected and the digestion solution into a digestion container so that the digestion solution digests the copper-phosphorus solder to obtain a liquid to be detected; A measuring module 203, configured to measure the liquid to be detected to obtain the measured content of phosphorus element and the measured content of silver element in the copper-phosphorus solder.

[0052] In an embodiment of the present application, a copper-phosphorus brazing filler metal to be detected and a digestion solution are provided. The digestion solution includes hydrochloric acid and hydrogen peroxide. The copper-phosphorus brazing filler metal to be detected and the digestion solution are added to a digestion container so that the digestion solution digests the copper-phosphorus brazing filler metal to obtain a solution to be detected. The solution to be detected is measured to obtain the measured content of phosphorus element and the measured content of silver element in the copper-phosphorus brazing filler metal. That is, in the embodiment of the present application, the content of silver element and the content of phosphorus element are directly measured through the solution to be detected, so that the retrieval of the content of phosphorus element and the content of silver element in the copper-phosphorus brazing filler metal is relatively simple and the detection efficiency is relatively high.

[0053] Optionally, as Figure 3 shown, an embodiment of the present application further provides an electronic device 300, including a processor 301 and a memory 302. A program or instruction that can run on the processor 301 is stored on the memory 302. When the program or instruction is executed by the processor 301, each step of the above-mentioned embodiment of the copper-phosphorus brazing filler metal determination method is implemented, and the same technical effect can be achieved. To avoid repetition, it will not be elaborated here.

[0054] It should be noted that the electronic device in the embodiment of the present application includes the above-mentioned mobile electronic device and non-mobile electronic device.

[0055] Figure 4 A schematic diagram of the hardware structure of an electronic device for implementing an embodiment of the present application.

[0056] The electronic device 1000 includes but is not limited to: a radio frequency unit 1001, a network module 1002, an audio output unit 1003, an input unit 1004, a sensor 1005, a display unit 1006, a user input unit 1007, an interface unit 1008, a memory 1009, and a processor 1010 and other components.

[0057] Those skilled in the art can understand that the electronic device 1000 may further include a power supply (such as a battery) for supplying power to each component. The power supply can be logically connected to the processor 1010 through a power management system, so as to implement functions such as management of charging, discharging, and power consumption management through the power management system. Figure 4 The structure of the electronic device shown in does not constitute a limitation on the electronic device. The electronic device may include more or fewer components than shown, or combine certain components, or have different component arrangements, which will not be elaborated here.

[0058] Among them, the processor 1010 is used to provide a copper-phosphorus brazing filler metal to be detected and a digestion solution. The digestion solution includes hydrochloric acid and hydrogen peroxide. The copper-phosphorus brazing filler metal to be detected and the digestion solution are added to a digestion container so that the digestion solution digests the copper-phosphorus brazing filler metal to obtain a solution to be detected. The solution to be detected is measured to obtain the measured content of phosphorus element and the measured content of silver element in the copper-phosphorus brazing filler metal.

[0059] Optionally, the processor 1010 is further configured to: add the copper-phosphorus brazing filler metal to be detected and the digestion solution into a digestion container, and heat the digestion container for a preset duration, so that the digestion solution digests the copper-phosphorus brazing filler metal.

[0060] Optionally, the processor 1010 is further configured to: heat the digestion container so that the digestion container reaches a preset temperature, and keep the temperature of the digestion container at the preset temperature for a preset duration.

[0061] Optionally, the processor 1010 is further configured to: transfer the liquid to be detected from the digestion container to a volumetric flask; rinse the digestion container with hydrochloric acid and combine the hydrochloric acid for rinsing the digestion container into the volumetric flask; wash the digestion container with distilled water and combine the distilled water for washing the digestion container into the volumetric flask.

[0062] Optionally, the processor 1010 is further configured to: rinse the digestion container with hydrochloric acid multiple times, and the amount of hydrochloric acid used for rinsing the digestion container each time is fixed; Combine the hydrochloric acid for rinsing the digestion container each time into the volumetric flask.

[0063] Optionally, the processor 1010 is further configured to: add distilled water to the volumetric flask so that the liquid level of the solution in the volumetric flask reaches a preset scale.

[0064] Optionally, the processor 1010 is further configured to: determine the difference between the measured content of the phosphorus element and the first standard content to obtain a first difference, and determine the difference between the measured content of the silver element and the second standard content to obtain a second difference; determine whether the first difference is within a first numerical range and whether the second difference is within a second numerical range; if the first difference is within the first numerical range and the second difference is within the second numerical range, then the copper-phosphorus brazing filler metal meets the requirements.

[0065] Optionally, the processor 1010 is further configured to: provide a first quantity of copper-phosphorus brazing filler metal, a second quantity of hydrochloric acid, and a third quantity of hydrogen peroxide, and the second quantity of hydrochloric acid and the third quantity of hydrogen peroxide form a digestion solution.

[0066] In the embodiments of the present application, by providing the copper-phosphorus brazing filler metal to be detected and a digestion solution, the digestion solution includes hydrochloric acid and hydrogen peroxide; adding the copper-phosphorus brazing filler metal to be detected and the digestion solution into a digestion container so that the digestion solution digests the copper-phosphorus brazing filler metal to obtain a liquid to be detected; measuring the liquid to be detected to obtain the measured content of the phosphorus element and the measured content of the silver element in the copper-phosphorus brazing filler metal. That is, in the embodiments of the present application, the content of the silver element and the content of the phosphorus element are directly measured through the liquid to be detected, so that the retrieval of the content of the phosphorus element and the content of the silver element in the copper-phosphorus brazing filler metal is relatively simple, and the detection efficiency is relatively high.

[0067] It should be understood that in the embodiments of the present application, the input unit 1004 may include a Graphics Processing Unit (GPU) 10041 and a microphone 10042. The graphics processor 10041 processes the image data of static pictures or videos obtained by an image capture device (such as a camera) in a video capture mode or an image capture mode. The display unit 1006 may include a display panel 10061, and the display panel 10061 may be configured in the form of a liquid crystal display, an organic light emitting diode, or the like. The user input unit 1007 includes at least one of a touch panel 10071 and other input devices 10072. The touch panel 10071 is also referred to as a touch screen. The touch panel 10071 may include two parts, a touch analysis device and a touch controller. The other input devices 10072 may include, but are not limited to, a physical keyboard, function keys (such as volume control keys, switch keys, etc.), a trackball, a mouse, and a joystick, which will not be elaborated herein.

[0068] The memory 1009 can be used to store software programs and various data. The memory 1009 may mainly include a first storage area for storing programs or instructions and a second storage area for storing data. Among them, the first storage area may store an operating system, application programs or instructions required for at least one function (such as a sound playback function, an image playback function, etc.). In addition, the memory 1009 may include a volatile memory or a non-volatile memory, or the memory 1009 may include both a volatile and a non-volatile memory. Among them, the non-volatile memory may be a read-only memory (ROM), a programmable read-only memory (PROM), an erasable programmable read-only memory (EPROM), an electrically erasable programmable read-only memory (EEPROM), or a flash memory. The volatile memory may be a random access memory (RAM), a static random access memory (SRAM), a dynamic random access memory (DRAM), a synchronous dynamic random access memory (SDRAM), a double data rate synchronous dynamic random access memory (DDR SDRAM), an enhanced synchronous dynamic random access memory (ESDRAM), a synch link dynamic random access memory (SLDRAM), and a direct rambus random access memory (DRRAM). The memory 1009 in the embodiments of the present application includes, but is not limited to, these and any other suitable types of memories.

[0069] The processor 1010 may include one or more processing units; optionally, the processor 1010 integrates an application processor and a modem processor. Among them, the application processor mainly processes operations related to the operating system, user interface, and application programs, etc., and the modem processor mainly processes wireless communication signals, such as a baseband processor. It can be understood that the above modem processor may not be integrated into the processor 1010 either.

[0070] The embodiments of the present application provide a computer program product. The program product is stored in a storage medium and is executed by at least one processor to implement each process of the embodiments of the above copper-phosphorus solder determination method, and can achieve the same technical effects. To avoid repetition, it will not be elaborated here.

[0071] It should be noted that in this article, the terms "including", "comprising" or any other variants thereof are intended to cover non-exclusive inclusion, such that a process, method, article or device comprising a series of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "comprising an..." does not exclude the existence of additional identical elements in the process, method, article or device comprising that element. In addition, it should be pointed out that the scope of the methods and devices in the embodiments of the present application is not limited to performing functions in the order shown or discussed, and may also include performing functions in a substantially simultaneous manner or in a reverse order according to the functions involved. For example, the described methods may be performed in an order different from that described, and various steps may be added, omitted, or combined. Additionally, features described with reference to certain examples may be combined in other examples.

[0072] Through the description of the above embodiments, those skilled in the art can clearly understand that the above-described embodiment methods can be implemented by means of software plus a necessary general hardware platform. Of course, they can also be implemented by hardware, but in many cases the former is a better implementation. Based on this understanding, the technical solution of the present application, in essence, or the part that contributes to the prior art, can be embodied in the form of a computer software product. This computer software product is stored in a storage medium (such as ROM / RAM, magnetic disk, optical disc) and includes several instructions for causing a terminal (which can be a mobile phone, computer, server, or network device, etc.) to execute the methods described in various embodiments of the present application.

[0073] The embodiments of the present application have been described above with reference to the accompanying drawings. However, the present application is not limited to the above specific embodiments. The above specific embodiments are merely illustrative and not restrictive. Those of ordinary skill in the art, under the inspiration of the present application and without departing from the purpose of the present application and the scope protected by the claims, can also make many forms, all of which fall within the protection scope of the present application.

Claims

1. A method for measuring copper-phosphorus solder, characterized in that: The copper-phosphorus solder determination method comprises: Providing a copper-phosphorus solder to be tested and a digestion solution, wherein the digestion solution comprises hydrochloric acid and hydrogen peroxide; Adding the copper-phosphorus solder to be tested and a digestion solution into a digestion container, so that the digestion solution digests the copper-phosphorus solder to obtain a solution to be tested; The liquid to be tested is measured to obtain the measured content of phosphorus element and the measured content of silver element in the copper-phosphorus solder.

2. The copper-phosphorus solder determination method according to claim 1, characterized in that: The copper-phosphorus solder to be tested and a digestion solution are added into a digestion container so that the digestion solution digests the copper-phosphorus solder to obtain a solution to be tested, comprising: The copper-phosphorus solder to be tested and a digestion solution are added into a digestion container, and the digestion container is heated for a preset time so that the digestion solution digests the copper-phosphorus solder.

3. The copper-phosphorus solder determination method according to claim 2, characterized in that: The heating of the digestion container for a preset time period includes: The digestion container is heated so that the digestion container reaches a preset temperature, and the temperature of the digestion container is maintained at the preset temperature for a preset time period.

4. The copper-phosphorus solder determination method according to claim 1, characterized in that: Before measuring the liquid to be tested, the copper-phosphorus solder measuring method further comprises: Transferring the liquid to be tested from the digestion container to a volumetric flask; Rinse the digestion container with hydrochloric acid, and combine the hydrochloric acid used to rinse the digestion container into the volumetric flask; The digestion container was cleaned with distilled water, and the distilled water used to clean the digestion container was combined into the volumetric flask.

5. The copper-phosphorus solder determination method according to claim 4, characterized in that: The step of rinsing the digestion container with hydrochloric acid and combining the hydrochloric acid used for rinsing the digestion container into the volumetric flask comprises: The digestion container is rinsed with the hydrochloric acid for multiple times, and the amount of hydrochloric acid used for rinsing the digestion container each time is fixed; Combine the hydrochloric acid used to rinse the digestion vessel each time into the volumetric flask.

6. The copper-phosphorus solder determination method according to claim 4, characterized in that: After the digestion container is cleaned with distilled water and the distilled water used to clean the digestion container is combined into the volumetric flask, the copper-phosphorus solder determination method further includes: The distilled water is added into the volumetric flask so that the liquid level of the solution in the volumetric flask reaches a preset scale.

7. The copper-phosphorus solder determination method according to claim 1, characterized in that: After the liquid to be tested is measured to obtain the measured content of phosphorus and the measured content of silver in the copper-phosphorus solder, the copper-phosphorus solder determination method further includes: Determine the difference between the measured content of the phosphorus element and the first standard content to obtain a first difference, and determine the difference between the measured content of the silver element and the second standard content to obtain a second difference; determining whether the first difference is within a first numerical range, and whether the second difference is within a second numerical range; If the first difference is within the first numerical range and the second difference is within the second numerical range, the copper-phosphorus solder meets the requirements.

8. The copper-phosphorus solder determination method according to claim 1, characterized in that: The method of providing the copper-phosphorus solder to be tested and the digestion solution comprises: A first quantitative amount of copper-phosphorus solder, a second quantitative amount of hydrochloric acid and a third quantitative amount of hydrogen peroxide are provided, and the second quantitative amount of hydrochloric acid and the third quantitative amount of hydrogen peroxide form the digestion solution.

9. A copper-phosphorus solder measuring device, characterized in that: The copper-phosphorus solder measuring device comprises: Providing a module for providing a copper-phosphorus solder to be tested and a digestion solution, wherein the digestion solution includes hydrochloric acid and hydrogen peroxide; An adding module, used for adding the copper-phosphorus solder to be tested and a digestion solution into a digestion container, so that the digestion solution digests the copper-phosphorus solder to obtain a solution to be tested; The determination module is used to determine the liquid to be tested to obtain the determined content of phosphorus and the determined content of silver in the copper-phosphorus solder.

10. A storage medium, characterized in that: The storage medium stores a program or instruction, and when the program or instruction is executed by the processor, the steps of the copper-phosphorus solder determination method according to any one of claims 1 to 8 are implemented.

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