Air bridge deployment method and device, electronic equipment and storage medium

Abstract

The embodiment of the invention provides an air bridge deployment method and device, electronic equipment and a storage medium. According to the scheme, the method comprises the following steps: acquiring first deployment data required by air bridge deployment corresponding to a first layer in a quantum chip layout, wherein the first deployment data comprises a first placement rule and a first air bridge parameter; and placing a first air bridge matched with the first air bridge parameter on the skeleton line in the first layer according to a first placement rule. According to the technical scheme provided by the embodiment of the invention, the automatic deployment of the air bridge in the quantum chip layout is realized, and the duration required by the deployment of the air bridge is shortened.

Description

Technical Field

[0001] The present application relates to the technical field of chip design, and in particular, to an air bridge deployment method, apparatus, electronic device, and storage medium. Background Art

[0002] During the quantum chip layout design process, a large number of qubits, resonators, and signal transmission lines need to be deployed in the quantum chip layout, which causes the ground plane in the quantum chip layout to be cut by the signal transmission lines, forming a large number of incomplete and independent small regions, seriously affecting the integrity of the ground plane.

[0003] Currently, for the skeleton lines corresponding to the signal transmission lines in the quantum chip layout, air bridges are added to the skeleton lines to connect the small regions in the quantum chip layout, thereby ensuring the integrity of the ground plane.

[0004] However, there are a large number of signal transmission lines in the quantum chip layout, and multiple air bridges also need to be deployed on the skeleton lines corresponding to each signal transmission line, which requires designers to deploy a large number of air bridges in the quantum chip layout. If designers deploy the air bridges one by one, it will take a long time to deploy the air bridges. Summary of the Invention

[0005] The purpose of the embodiments of the present application is to provide an air bridge deployment method, apparatus, electronic device, and storage medium to realize the automatic deployment of air bridges in the quantum chip layout and shorten the time required for air bridge deployment. The specific technical solutions are as follows:

[0006] The embodiments of the present application provide an air bridge deployment method, and the method includes:

[0007] Obtain first deployment data required for air bridge deployment corresponding to the first layer in the quantum chip layout, where the first deployment data includes a first placement rule and first air bridge parameters;

[0008] Place a first air bridge matching the first air bridge parameters on the skeleton line in the first layer according to the first placement rule.

[0009] Optionally, the first placement rule includes: a first identifier of the first layer, a minimum distance between the center point of the air bridge and the end point of the skeleton line in the first layer, a minimum distance between the center points of the air bridges, and a placement step size of the air bridge;

[0010] The first air bridge parameters include: a second layer where two bridge piers are located, a third layer where the bridge deck is located, the length and width corresponding to the bridge piers, the length and width corresponding to the bridge deck, and the interval distance between the two bridge piers.

[0011] Optionally, the first deployment data further includes a deployment avoidance rule;

[0012] The step of placing a first air bridge matching the first air bridge parameters on the skeleton line in the first layer according to the first placement rule includes:

[0013] Based on the first placement rule and the deployment avoidance rule, place a first air bridge matching the first air bridge parameters on the skeleton line in the first layer.

[0014] Optionally, the deployment avoidance rule is a first avoidance rule;

[0015] The first avoidance rule includes: the second identifier of the fourth layer where each avoidance object that needs to be avoided in the air bridge deployment is located, and the distance between each avoidance object and the air bridge.

[0016] Optionally, the deployment avoidance rule is a second avoidance rule; the second avoidance rule is used to indicate whether the deployment of the air bridge avoids the inflection point of the skeleton line.

[0017] Optionally, if the second avoidance rule indicates that the deployment of the air bridge avoids the inflection point of the skeleton line, the second avoidance rule includes the minimum distance between the air bridge and the inflection point of the skeleton line.

[0018] Optionally, after placing a first air bridge matching the first air bridge parameters on the skeleton line in the first layer according to the first placement rule, the method further includes:

[0019] Obtain second deployment data required for air bridge deployment corresponding to the fifth layer in the quantum chip layout, where the second deployment data includes a second placement rule and second air bridge parameters;

[0020] Place a second air bridge matching the second air bridge parameters on the skeleton line in the fifth layer according to the second placement rule.

[0021] Optionally, the priority of air bridge deployment in the first layer is higher than the priority of air bridge deployment in the fifth layer;

[0022] The first air bridge parameters are different from the second air bridge parameters.

[0023] Optionally, after placing a second air bridge matching the second air bridge parameters on the skeleton line in the fifth layer according to the second placement rule, the method further includes:

[0024] Generate and display a quantum chip layout including the first air bridge and the second air bridge according to the placement position of the first air bridge in the first layer and the placement position of the second air bridge in the fifth layer.

[0025] The embodiment of the present application also provides an air bridge deployment device, and the device includes:

[0026] A first acquisition module, configured to acquire first deployment data required for air bridge deployment corresponding to a first layer in a quantum chip layout, where the first deployment data includes a first placement rule and first air bridge parameters;

[0027] A first deployment module, configured to place a first air bridge matching the first air bridge parameters on a backbone line in the first layer according to the first placement rule.

[0028] The embodiment of the present application also provides an electronic device, including a processor, a communication interface, a memory, and a communication bus. Among them, the processor, the communication interface, and the memory complete communication with each other through the communication bus;

[0029] The memory is used to store a computer program;

[0030] The processor is configured to implement the steps of the air bridge deployment method described in any one of the above when executing the program stored on the memory.

[0031] The embodiment of the present application also provides a computer-readable storage medium, where a computer program is stored in the computer-readable storage medium, and when the computer program is executed by a processor, the steps of the air bridge deployment method described in any one of the above are implemented.

[0032] The embodiment of the present application also provides a computer program product including instructions, which when running on a computer, causes the computer to execute the air bridge deployment method described in any one of the above.

[0033] Advantages of the embodiment of the present application:

[0034] The technical solution provided by the embodiment of the present application can, after obtaining the first deployment data required for air bridge deployment corresponding to the first layer in the quantum chip layout, place an air bridge with a size matching the first size in the first deployment data on the backbone line in the first layer according to the first placement rule in the first deployment data, realizing the automatic deployment of the air bridge on the backbone line in the first layer, and thus realizing the automatic deployment of the air bridge on each backbone line in the quantum chip layout. Moreover, during the air bridge deployment process in the first layer, the same placement rule and the same air bridge parameters are used for air bridge deployment, and it is no longer necessary to deploy each air bridge separately one by one, effectively shortening the time required for air bridge deployment and improving the convenience and speed of air bridge deployment.

[0035] Of course, when implementing any product or method of the present application, it is not necessarily required to achieve all the above advantages simultaneously. Description of the Drawings

[0036] To more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0037] Figure 1 The first flow schematic diagram of the air bridge deployment method provided by the embodiment of the present application;

[0038] Figure 2 A schematic structural diagram of the air bridge provided by the embodiment of the present application;

[0039] Figure 3 A schematic diagram of the air bridge on the backbone line provided by the embodiment of the present application;

[0040] Figure 4 The second flow schematic diagram of the air bridge deployment method provided by the embodiment of the present application;

[0041] Figure 5 The third flow schematic diagram of the air bridge deployment method provided by the embodiment of the present application;

[0042] Figure 6 The fourth flow schematic diagram of the air bridge deployment method provided by the embodiment of the present application;

[0043] Figure 7 A schematic diagram of the quantum chip layout provided by the embodiment of the present application;

[0044] Figure 8-a A schematic diagram of the configuration interface for the corresponding deployment rules of the backbone line provided by the embodiment of the present application;

[0045] Figure 8-b A schematic diagram of the configuration interface for the corresponding air bridge size of the backbone line provided by the embodiment of the present application;

[0046] Figure 9 A schematic structural diagram of the air bridge deployment device provided by the embodiment of the present application;

[0047] Figure 10 A schematic structural diagram of the electronic device provided by the embodiment of the present application. Detailed implementation manners

[0048] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

[0049] To solve the problems in the related art, an air bridge deployment method is provided in an embodiment of the present application. As Figure 1 shown, Figure 1 FIG. 1 is a first flowchart of the air bridge deployment method provided in an embodiment of the present application. This method can be applied to any electronic device, and the electronic device can be installed with chip design software. In Figure 1 the method shown, the following steps are included.

[0050] Step S101: Obtain first deployment data required for air bridge deployment corresponding to the first layer in the quantum chip layout. The first deployment data includes a first placement rule and first air bridge parameters.

[0051] Step S102: Place a first air bridge matching the first air bridge parameters on the skeleton line in the first layer according to the first placement rule.

[0052] In an embodiment of the present application, the above chip design software can be Quantum Electronic Design Automation (QEDA) software, etc. Here, no specific limitation is made on the above chip design software.

[0053] By Figure 1 the method shown, after obtaining the first deployment data required for air bridge deployment corresponding to the first layer in the quantum chip layout, a first air bridge with a size matching the first size in the first deployment data can be placed on the skeleton line in the first layer according to the first placement rule in the first deployment data, realizing the automatic deployment of air bridges on the skeleton lines in the first layer, and thus realizing the automatic deployment of air bridges on each skeleton line in the quantum chip layout. Moreover, during the air bridge deployment process in the first layer, the same placement rule and the same air bridge parameters are used for air bridge deployment, and there is no need to deploy each air bridge separately one by one, effectively shortening the time required for air bridge deployment and improving the convenience and speed of air bridge deployment.

[0054] The embodiments of the present application will be described below through specific examples.

[0055] Regarding the above-mentioned step S101, that is, obtaining the first deployment data required for the air bridge deployment corresponding to the first layer in the quantum chip layout, the first deployment data includes a first placement rule and first air bridge parameters.

[0056] In the embodiments of the present application, the quantum chip layout may include multiple layers, and different devices are deployed in each layer, as well as the skeleton lines corresponding to different signal transmission lines, etc.

[0057] In the process of quantum chip layout design, designers first deploy the positions of quantum bits, resonators, the skeleton lines corresponding to the readout bus (denoted as the first skeleton line), the skeleton lines corresponding to the pulse modulation line (denoted as the second skeleton line), and the skeleton lines corresponding to the flux modulation line (denoted as the third skeleton line), etc. in the quantum chip. Then, air bridges are deployed on the basis of the deployed skeleton lines.

[0058] In an alternative embodiment, for the above-mentioned first skeleton line, second skeleton line, and third skeleton line, according to the different types of signal transmission lines corresponding to the skeleton lines, the first skeleton line, second skeleton line, and third skeleton line may be deployed in different layers or in the same layer. For example, the above-mentioned first skeleton line may be deployed in layer 12, and the second skeleton line and third skeleton line may be deployed in layer 0.

[0059] In another alternative embodiment, for the above-mentioned first skeleton line, second skeleton line, and third skeleton line, designers may also deploy any one of the skeleton lines in a separate layer.

[0060] In the embodiments of the present application, the layers where the above-mentioned first skeleton line, second skeleton line, and third skeleton line are located may be set according to the needs of designers, and no specific limitation is made here.

[0061] After the above-mentioned quantum bits, resonators, first skeleton line, second skeleton line, and third skeleton line, etc. are deployed, for the first layer in the quantum chip layout, designers can configure the deployment data required for the air bridge deployment in the first layer (denoted as the first deployment data) through the chip design software installed in the electronic device.

[0062] The above-mentioned first deployment data may include: the placement rule corresponding to the placement of the air bridge on the skeleton line (denoted as the first placement rule), and the relevant dimension parameters of the air bridge placed on the skeleton line (denoted as the first air bridge parameters).

[0063] After the electronic device detects that the designer has configured the above-mentioned first deployment data, it can obtain the first deployment data.

[0064] In an embodiment of the present application, the above-mentioned first layer may be a layer where any of the skeleton lines in the quantum chip layout is located. The position where the skeleton line is located in the above-mentioned first layer is the corresponding position of the signal transmission line in the quantum chip when forming a coplanar waveguide. That is, each skeleton line in the first layer has a corresponding signal transmission line.

[0065] The skeleton line in the above-mentioned first layer may be one or more of the above-mentioned first skeleton line, second skeleton line, and third skeleton line. Here, there is no specific limitation on the above-mentioned first layer, the skeleton line in the first layer, and the number of skeleton lines included in the first layer.

[0066] In an optional embodiment, considering that in the process of quantum chip layout design, the above-mentioned resonator can be represented in the form of a coplanar waveguide together with the above-mentioned flux modulation line and pulse modulation line. At this time, the above-mentioned resonator is represented as a signal transmission line in the quantum chip layout. Therefore, the above-mentioned first layer may also be a layer where the skeleton line corresponding to the resonator is located. For ease of understanding, the following will only take the skeleton line in the first layer as the above-mentioned first skeleton line, second skeleton line, or third skeleton line as an example for illustration.

[0067] For the above-mentioned air bridge, the air bridge may be as Figure 2 shown, Figure 2 which is a schematic structural diagram of the air bridge provided by an embodiment of the present application. In the Figure 2 shown air bridge, the air bridge includes piers 201 and a bridge deck 202. Among them, the number of piers 201 is 2.

[0068] In an optional embodiment, the above-mentioned first placement rule may include: the first identifier of the above-mentioned first layer, the minimum distance between the center point of the air bridge and the end point of the skeleton line in the first layer, the minimum distance between the center points of the air bridges, and the placement step of the air bridge.

[0069] For each skeleton line in the above-mentioned first layer, the end point of the skeleton line may be any one of the two end points of the skeleton line, that is, the end point closest to the air bridge when the electronic device deploys the first air bridge on the skeleton line. The distance between this end point and the center point of the air bridge is the above-mentioned minimum distance between the center point of the air bridge and the end point of the skeleton line in the first layer.

[0070] In the process of quantum chip layout design, since a large number of signal transmission lines are designed on the quantum chip layout, therefore, the end points of some signal transmissions are adjacent to the end points of other signal transmission lines. By setting the above-mentioned minimum distance between the center point of the air bridge and the end point of the skeleton line in the first layer, a certain distance (i.e., this minimum distance) can be made between the end point of the skeleton line and its closest air bridge, avoiding the influence on other signal transmission lines caused by the deployment of the air bridge at the end point of the skeleton line.

[0071] The minimum distance between the central points of the above-mentioned air bridges can be: the minimum distance between the central points of two adjacent air bridges on the same backbone line in the first layer, and the minimum distance between the central points of the two air bridges with the closest distance on different backbone lines in the first layer.

[0072] The placement step of the above-mentioned air bridges is the distance between the central points of adjacent air bridges on the same backbone line.

[0073] In the embodiment of the present application, since the placement step of the above-mentioned air bridges is usually greater than the minimum distance between the mid-line points of the above-mentioned air bridges, therefore, the minimum distance between the central points of the above-mentioned air bridges is usually used to limit the distance between the central points of the two air bridges with the closest distance on different backbone lines in the first layer.

[0074] The minimum distance between the central point of the above-mentioned air bridge and the end point of the backbone line in the first layer, the minimum distance between the central points of the air bridges, and the placement step of the air bridges can be set according to the size of the air bridge, the needs of the designer, and the design experience of the designer, etc., and no specific limitation is made here.

[0075] In the embodiment of the present application, the minimum distance between the central point of the air bridge and the end point of the backbone line in the first layer, the minimum distance between the central points of the air bridges, and the placement step of the air bridges in the above-mentioned first placement rule are all set according to the central point of the air bridge. This central point of the air bridge can be expressed as the geometric center of the air bridge shown above Figure 2 In addition to this, it can also be set according to other points on the air bridge. For example, Figure 2 the four vertices of the bridge deck 202 shown, or the midpoints of the long sides on both sides of the bridge deck 202, etc. For example, the minimum distance between the central points of the air bridges can be replaced by: the distance between the midpoints of the left side of the air bridge deck. For the convenience of understanding, the following only takes the case of setting according to the central point of the air bridge in the first placement rule as an example for illustration, and it does not play any limiting role.

[0076] Through the parameters included in the above-mentioned first placement rule, the electronic device can deploy multiple air bridges on the backbone line according to this first placement rule, improving the accuracy and speed of air bridge deployment.

[0077] In another optional embodiment, when there is only one backbone line in the first layer, the above-mentioned first placement rule may only include: the first identifier of the above-mentioned first layer, the minimum distance between the central point of the air bridge and the end point of the backbone line in the first layer, and the placement step of the air bridge.

[0078] In the embodiment of the present application, no specific limitation is made on the parameters included in the above-mentioned first placement rule.

[0079] In an alternative embodiment, the first air bridge parameters include: the second layer where the two bridge piers are located, the third layer where the bridge deck is located, the corresponding length and width of the bridge piers, the corresponding length and width of the bridge deck, and the spacing distance between the two bridge piers.

[0080] For ease of understanding, taking the air bridge shown above Figure 2 as an example for illustration. The length of the above-mentioned bridge pier is Figure 2 the length A1 shown, the width of the bridge pier is Figure 2 the width A3 shown, the length of the bridge deck is Figure 2 A4 shown, the width of the bridge deck is Figure 2 A shown, and the spacing distance between the two bridge piers is Figure 2 A2 shown.

[0081] The second layer and the third layer in the above-mentioned first air bridge parameters can be used to represent the layers spanned by the air bridge, that is, they reflect the height of the air bridge.

[0082] In the embodiments of the present application, the above-mentioned first air bridge parameters may further include other parameters, for example, the height of the bridge pier, the thickness of the bridge deck, etc. Here, no specific limitations are imposed on the above-mentioned first air bridge parameters.

[0083] By configuring the above-mentioned first air bridge parameters, the electronic device can generate an air bridge that matches the first air bridge parameters according to the first air bridge parameters, improving the accuracy and uniformity of the deployed air bridge. In addition, for different layers, the set first air bridge parameters can be different, greatly increasing the flexibility of air bridge deployment.

[0084] Regarding the above step S102, that is, according to the first placement rule, place the first air bridge that matches the first air bridge parameters on the backbone line in the first layer.

[0085] In this step, the electronic device can generate an air bridge (denoted as the first air bridge) that matches the first air bridge parameters according to the first air bridge parameters in the above-mentioned first deployment data. The electronic device can determine the first layer corresponding to the first identifier in the quantum chip layout as the layer where the air bridge to be deployed is located according to the layer identifier (i.e., the above-mentioned first identifier) in the above-mentioned first placement rule. For each backbone line in the first layer, the electronic device can place the first air bridge on the backbone line according to other parameters in the above-mentioned first placement rule.

[0086] In an alternative embodiment, if there is only one skeleton line in the above-mentioned first layer, the electronic device may start from one endpoint of the skeleton line and place the first air bridge at a position whose distance from the starting point is the minimum distance between the center point of the air bridge and the endpoint of the skeleton line in the first placement rule, and then place the other air bridges along the skeleton line in sequence according to the air bridge placement step in the first placement rule.

[0087] For ease of understanding, Figure 3 the placement of the above-mentioned air bridge will be described. Figure 3 FIG. is a schematic diagram of an air bridge on a skeleton line provided by an embodiment of the present application.

[0088] When there is only Figure 3 the skeleton line 301 as shown in the above-mentioned first layer, the electronic device may start from the left endpoint of the skeleton line 301 and place the air bridge 303 at a distance a (i.e., the minimum distance between the center point of the air bridge and the endpoint of the skeleton line in the first layer), and then place the air bridge 304 at a distance c (i.e., the above-mentioned air bridge placement step) from the air bridge 303 on the skeleton line 301 in sequence, place the air bridge 305 at a distance c from the air bridge 304, and place the air bridge 306 at a distance c from the air bridge 305.

[0089] Since the distance between the air bridge 306 and the other endpoint of the skeleton line 301, i.e., the non-starting endpoint, is less than the above-mentioned distance c, the air bridge 306 is the last air bridge placed on the skeleton line 301.

[0090] In another alternative embodiment, if there are multiple skeleton lines in the above-mentioned first layer, when the electronic device starts from one endpoint of each skeleton line and places the first air bridge at a position whose distance from the starting point is the minimum distance between the center point of the air bridge and the endpoint of the skeleton line in the first placement rule, and when placing the other air bridges along the skeleton line in sequence according to the air bridge placement step in the first placement rule, it is necessary to ensure that the distance between the air bridges placed on each skeleton line and the two nearest air bridges on other skeleton lines is greater than or equal to the minimum distance between the center points of the air bridges in the first placement rule.

[0091] For ease of understanding, still taking the above Figure 3 as an example for description. For Figure 3The shown backbone lines 301 and 302. After the electronic device finishes placing the air bridges on the backbone line 301 according to the above method, that is, after placing air bridges 303 to 306 on the backbone line 301, air bridge placement can be performed for the backbone line 302. At this time, in addition to considering the distance a and the distance c in the above first placement rule, the electronic device also needs to consider the minimum distance between the centers of the air bridges in the above first placement rule, that is Figure 3 the shown distance b. When the electronic device places the air bridge 307 on the backbone line 302, the placement position of the air bridge 307 needs to ensure that the distance between it and the air bridge 305 on the backbone line 301 is greater than or equal to the distance b.

[0092] In the above embodiment, for ease of understanding, only the case where there are multiple backbone lines in the first layer and the air bridges on each backbone line are deployed one by one is taken as an example for illustration. In addition, to improve the efficiency of air bridge deployment, the electronic device can deploy the air bridges on multiple backbone lines simultaneously. Here, the deployment order and deployment method of the air bridges on each backbone line when there are multiple backbone lines in the first layer are not specifically limited.

[0093] In the embodiments of the present application, according to the lengths of the backbone lines in the above first layer and the parameters in the above first placement rule, the number of air bridges placed on each backbone line in the first layer can be the same or different. Here, the number of air bridges placed on each backbone line in the above first layer is not specifically limited.

[0094] Regarding the minimum distance in the above first placement rule, that is, the minimum distance between the center point of the air bridge and the end point of the backbone line in the first layer, and the minimum distance between the center points of the air bridges, when the electronic device deploys the air bridges according to this minimum distance, the actual placement position of the air bridge can be greater than or equal to this minimum distance.

[0095] Regarding the minimum distance in the above first placement rule, since the actual air bridge deployment process can be adjusted based on this minimum distance, that is, the air bridge is placed at a certain position greater than this minimum distance, to avoid too large an adjustment distance, the above first placement rule can also include a fine-tuning distance corresponding to each minimum distance. This fine-tuning distance can be a specific value or a specific value range. Here, the fine-tuning distance and the parameters included in the above first placement rule are not specifically limited.

[0096] In an alternative embodiment, the above first deployment data may further include a deployment avoidance rule. When the above first deployment data further includes a deployment avoidance rule, according to the above Figure 1 shown method, the embodiments of the present application also provide an air bridge deployment method. As Figure 4 shown, Figure 4This is the second process schematic diagram of the air bridge deployment method provided by the embodiments of this application. The method includes the following steps.

[0097] Step S401: Obtain the first deployment data required for air bridge deployment corresponding to the first layer in the quantum chip layout. The first deployment data includes the first placement rule and the first air bridge parameters.

[0098] The above step S401 is the same as the above step S101.

[0099] Step S402: Based on the first placement rule and the deployment avoidance rule, place the first air bridge matching the first air bridge parameters on the backbone line in the first layer.

[0100] In an optional embodiment, the above deployment avoidance rule may be the first avoidance rule.

[0101] When the above deployment avoidance rule is the first avoidance rule, the first avoidance rule may include: the second identifier of the fourth layer where each avoidance object that needs to be avoided during air bridge deployment is located, and the interval distance between each avoidance object and the air bridge.

[0102] In an optional embodiment, the above avoidance object may be a device, such as a resonator, an indium wall, etc., or a certain section of the signal transmission line, such as the part where the above flux modulation line or pulse modulation line is coupled to the above qubit respectively. Here, the above avoidance object is not specifically limited.

[0103] In an optional embodiment, when the above first deployment data includes the above first avoidance rule, when the electronic device places the first air bridge matching the first air bridge parameters on the backbone line in the first layer according to the first placement rule, the placement of each first air bridge needs to synchronously consider the first avoidance rule in addition to considering the above first placement rule, that is, ensure that the distance between the placement position of the first air bridge and the closest avoidance object that needs to be avoided is greater than or equal to the above interval distance.

[0104] For ease of understanding, still taking the above Figure 3 as an example for illustration. In Figure 3 , the device 308 is the above avoidance object.

[0105] Since the device 308 is closest to the backbone line 302, when the electronic device deploys an air bridge for the backbone line 302, the above first avoidance rule needs to be considered. Specifically, when deploying the air bridge 307, the electronic device can, in addition to considering the distances a, b, and c in the above first placement rule, also determine the layer where the avoidance object is located (denoted as the fourth layer) according to the second identifier in the above first avoidance rule, so as to determine the placement position of the air bridge in the first layer based on the position of the avoidance object in the fourth layer and the interval distance between each avoidance object and the air bridge in the first avoidance rule. For example, Figure 3 The distance between the air bridge 307 and the device 308 in Figure 3 needs to be greater than or equal to the interval distance d between the avoidance object and the air bridge.

[0106] In the embodiment of the present application, since the avoidance object is in the fourth layer and the air bridge is deployed in the first layer, the interval distance between the above avoidance object and the air bridge can be expressed as the distance between the projection center point and the center point of the air bridge after the avoidance object is projected onto the first layer. Here, the expression form of the interval distance between the avoidance object and the air bridge is not specifically limited.

[0107] In the embodiment of the present application, different first avoidance rules can be set for different avoidance objects. That is, the second identifiers included in the first avoidance rule corresponding to each type of avoidance object can be different, and the interval distance between the avoidance object and the air bridge can be the same or different. Here, the number of the above first avoidance rules and the parameters in the first avoidance rule are not specifically limited.

[0108] Through the setting of the above first avoidance rule, when the electronic device deploys an air bridge based on the first avoidance rule, the distance between the air bridge and the avoidance object can be effectively maintained, so that the signal can be completely transmitted in the avoidance object, avoiding the transmission of short-circuit signals, and laying a foundation for the normal use of the quantum chip in the later stage.

[0109] In another alternative embodiment, the above deployment avoidance rule can also be a second avoidance rule. When the above deployment avoidance rule is the second avoidance rule, the second avoidance rule can be used to indicate whether the deployment of the air bridge avoids the inflection point of the backbone line. That is, the second avoidance rule can indicate that the deployment of the air bridge avoids the inflection point of the backbone line, or the second avoidance rule can indicate that the deployment of the air bridge does not avoid the inflection point of the backbone line.

[0110] In the embodiments of the present application, according to the different precisions of the corresponding manufacturing processes of the quantum chip, the designer can choose whether to avoid the inflection points of the backbone line. For example, when the precision of the quantum chip manufacturing process is low, if the air bridge is deployed at the inflection point of the backbone line, this may become a risk point when the quantum chip is manufactured, affecting the normal use of the quantum chip. At this time, the designer can choose to deploy the air bridge to avoid the inflection point of the backbone line, that is, the above-mentioned second avoidance rule instructs the deployment of the air bridge to avoid the inflection point of the backbone line. For another example, when the precision of the quantum chip manufacturing process is high, deploying the air bridge at the inflection point of the backbone line will not generate a risk point. At this time, the designer can choose to deploy the air bridge without avoiding the inflection point of the backbone line, that is, the above-mentioned second avoidance rule instructs the deployment of the air bridge not to avoid the inflection point of the backbone line.

[0111] In an alternative embodiment, if the above-mentioned second avoidance rule instructs the deployment of the air bridge to avoid the inflection point of the backbone line, the second avoidance rule may include the minimum distance between the air bridge and the inflection point of the backbone line.

[0112] For ease of understanding, still taking the above Figure 3 as an example for illustration. For the backbone line 301 in Figure 3 , the position 309 is the position where the inflection point of the backbone line 301 is located.

[0113] When the above-mentioned first deployment data includes the above-mentioned second avoidance rule, and the second avoidance rule instructs the deployment of the air bridge to avoid the inflection point of the backbone line, the minimum distance between the air bridge in the second avoidance rule and the inflection point of the backbone line can be Figure 3 the distance e shown.

[0114] After the electronic device places the air bridge 303 on the backbone line 301, it is now assumed that the position c away from the center point of the air bridge 303 is exactly the position 309. At this time, if the above-mentioned second avoidance rule instructs the deployment of the air bridge not to avoid the inflection point of the backbone line, the air bridge 304 will be placed at the position 309. If the above-mentioned second avoidance rule instructs the deployment of the air bridge to avoid the inflection point of the backbone line, the air bridge 304 cannot be placed at the position 309, and the electronic device can place the air bridge 304 at a position e away from the position 309, that is, Figure 3 the position where the air bridge 304 is located in

[0115] In the above embodiments, only the above-mentioned deployment avoidance rules are taken as the above-mentioned first avoidance rule or the second avoidance rule for illustration respectively. In addition to this, the above-mentioned deployment avoidance rules may also include both the above-mentioned first avoidance rule and the above-mentioned second avoidance rule. At this time, when the electronic device places the above-mentioned first air bridge, it can comprehensively consider the above-mentioned first placement rule, the first avoidance rule and the second avoidance rule. The method for placing the air bridge can refer to the above description and will not be specifically described here.

[0116] In an optional embodiment, according to the method described above Figure 1 shown, the embodiment of the present application also provides a method for deploying air bridges. As Figure 5 shown Figure 5 is the third schematic flowchart of the air bridge deployment method provided by the embodiment of the present application. The method includes the following steps.

[0117] Step S501: Obtain first deployment data required for air bridge deployment corresponding to the first layer in the quantum chip layout. The first deployment data includes a first placement rule and first air bridge parameters.

[0118] Step S502: Place a first air bridge matching the first air bridge parameters on the backbone line in the first layer according to the first placement rule.

[0119] The above steps S501 - S502 are the same as the above steps S101 - S102.

[0120] Step S503: Obtain second deployment data required for air bridge deployment corresponding to the fifth layer in the quantum chip layout. The second deployment data includes a second placement rule and second air bridge parameters.

[0121] In an optional embodiment, the above second placement rule may include: a third identifier of the fifth layer, the minimum distance from the center point of the air bridge to the end point of the backbone line in the fifth layer, the minimum distance between the center points of the air bridges, and the placement step of the air bridge.

[0122] In an optional embodiment, the above second air bridge parameters may include: the sixth layer where the two bridge piers are located, the seventh layer where the bridge deck is located, the length and width corresponding to the bridge piers, the length and width corresponding to the bridge deck, and the interval distance between the two bridge piers.

[0123] For the description of the above second deployment data, second placement rule and second air bridge parameters, reference may be made to the description of the above first deployment data, first placement rule and first air bridge parameters, and no specific description will be given here.

[0124] Step S504: Place a second air bridge matching the second air bridge parameters on the backbone line in the fifth layer according to the second placement rule.

[0125] For the execution manner of the above steps S503 - S504, reference may be made to the execution manner of the above steps S101 - S102, and no specific description will be given here.

[0126] In the above Figure 5In the illustrated embodiment, the above-mentioned step S503 - step S504 are executed after step S501 - step S502. In addition to this, the above-mentioned step S503 - step S504 can also be executed simultaneously with the above-mentioned step S501 - step S502, or be executed after step S501 - step S502. Here, the execution order of the above-mentioned step S501 - step S502 and the above-mentioned step S503 - step S504 is not specifically limited.

[0127] Through the above Figure 5 shown method, for multiple layers including backbone lines in the quantum chip layout, the electronic device can deploy air bridges for the backbone lines in each layer layer by layer, ensuring the unity and accuracy of air bridge deployment corresponding to each layer.

[0128] In an optional embodiment, the priority of air bridge deployment in the above-mentioned first layer is higher than that in the fifth layer. At this time, the above-mentioned step S501 - step S502 are executed before the above-mentioned step S503 - step S504.

[0129] In the embodiments of the present application, designers can set the priorities corresponding to each layer according to the type of signal transmission line corresponding to the backbone line in each layer, the line width of the signal transmission line, and the size of the air bridge, etc.

[0130] For ease of understanding, the above-mentioned first backbone line, second backbone line, and third backbone line are taken as examples for illustration. Since the signal transmission line corresponding to the above-mentioned first backbone line is the read bus in the quantum chip, and the signal transmission lines corresponding to the second backbone line and the third backbone line are the flux modulation line and the pulse modulation line in the quantum chip respectively. Also, the line width of the read bus in the quantum chip is usually greater than that of the flux modulation line and the pulse modulation line, and the size of the air bridge on the read bus is also greater than that of the air bridge on the flux modulation line and the pulse modulation line. Therefore, when designers set the priorities for the layers corresponding to the first backbone line, second backbone line, and third backbone line, they can set the priority of the layer corresponding to the first backbone line to be higher than that of the layers corresponding to the second backbone line and the third backbone line, and the priority of the layer corresponding to the second backbone line can be the same as that of the layer corresponding to the second backbone line.

[0131] The above-mentioned first layer is the layer corresponding to the above-mentioned first backbone line, and the fifth layer is the layer corresponding to the second backbone line or the third backbone line.

[0132] In the embodiments of the present application, when deploying air bridges for different signal transmission lines, it is necessary to deploy a sufficient number of air bridges on the read bus to ensure the integrity of the ground plane. For the air bridges deployed on the pulse modulation line and the flux modulation line, when the remaining space is limited, the deployment of some air bridges can be omitted. Therefore, by setting the above priorities, it can be ensured that the deployment of the air bridges on the first layer is before the deployment of the air bridges on the fifth layer, effectively ensuring that there is sufficient space to accommodate the required air bridges during the deployment of the air bridges on the first backbone line, ensuring the integrity of the ground plane, and improving the accuracy of air bridge deployment.

[0133] In an alternative embodiment, when the priority of the backbone line in the first layer is higher than the priority of the backbone line in the fifth layer, the first air bridge parameters are different from the second air bridge parameters. That is, the first air bridge is different from the second air bridge. For example, the first air bridge is larger than the second air bridge.

[0134] In an alternative embodiment, according to the above Figure 5 In the embodiment shown, the embodiments of the present application also provide an air bridge deployment method. As Figure 6 shown, Figure 6 This is the fourth flowchart of the air bridge deployment method provided by the embodiments of the present application. In the Figure 6 method, the following step is added, that is, step S505.

[0135] Step S505, generate and display a quantum chip layout including the first air bridge and the second air bridge according to the placement positions of the first air bridge in the first layer and the second air bridge in the fifth layer.

[0136] For ease of understanding, take Figure 7 as an example for illustration. Figure 7 This is a schematic diagram of a quantum chip layout provided by the embodiments of the present application.

[0137] In Figure 7 the quantum chip layout shown, there are resonator 701, indium wall 702, flux modulation line 703, pulse modulation line 704, read bus 705, and air bridge 706 deployed. Since the resonator 701, flux modulation line 703, pulse modulation line 704, and read bus 705 are finally represented in the quantum chip in the form of coplanar waveguides. Therefore, when deploying air bridges, air bridges are arranged on the resonator 701, flux modulation line 703, pulse modulation line 704, and read bus 705, such as air bridge 707.

[0138] The electronic device can generate and display a quantum chip layout as Figure 7 shown according to the deployment position of each air bridge.

[0139] In an alternative embodiment, after generating and displaying the quantum chip layout including the above-mentioned first air bridge and second air bridge, the designer can adjust the placement position of the air bridge according to the air bridge in the displayed quantum chip layout. For example, the electronic device can separately set the backbone line to be adjusted in a single layer, so as to redeploy the air bridge on the backbone line in this layer.

[0140] Through the above step S505, after the electronic device completes the air bridge deployment, by displaying the quantum chip layout including the air bridge, it is convenient for the designer to timely and accurately know the deployment situation of the air bridge, so as to facilitate the designer to determine whether there are problems with the air bridge deployment and whether adjustment is needed, and it is convenient for the designer to know and adjust in a timely manner.

[0141] In the above Figure 6 In the method shown, only the example where after both the first air bridge and the second air bridge are deployed, a quantum chip layout including the first air bridge and the second air bridge is generated and displayed is described. In addition to this, after the above step S502 is executed, the electronic device can also generate and display the first layer including the first air bridge or the quantum chip layout including the first air bridge according to the placement position of the first air bridge. Or, after the above step S504 is executed, the electronic device can also generate and display the fifth layer including the second air bridge or the quantum chip layout including the second air bridge according to the placement position of the second air bridge.

[0142] For ease of understanding, the deployment of the air bridge will be described below in conjunction with Figure 8-a and Figure 8-b to illustrate the deployment of the air bridge. Figure 8-a FIG. is a schematic diagram of a configuration interface for the deployment rule corresponding to the backbone line provided by an embodiment of the present application. Figure 8-b FIG. is a schematic diagram of a configuration interface for the air bridge size corresponding to the backbone line provided by an embodiment of the present application.

[0143] Now assume that the first backbone line is deployed in the above-mentioned first layer, and the second backbone line and the third backbone line are deployed in the above-mentioned fifth layer.

[0144] For the above-mentioned first backbone line, second backbone line, and third backbone line, the designer can configure the above-mentioned first deployment data in the above-mentioned chip design software.

[0145] When the designer selects the rule in area 801, the display interface of the chip design software will display a deployment rule configuration interface as shown in Figure 8-a . Among them, area 802 is the configuration area corresponding to the above-mentioned first avoidance rule, area 803 is the configuration area of the above-mentioned first placement rule, and area 804 is the configuration area of the above-mentioned second avoidance rule.

[0146] In the above-mentioned area 802, there are four columns, namely number, layer, interval, and avoidance. Among them, the number is the layer identifier corresponding to the layer, the layer is the layer name, the interval is the interval distance between the above-mentioned avoidance object and the air bridge, and the avoidance is the option for whether to perform avoidance. For example, after the layers numbered 4 and 6 are selected as the layers that need to perform avoidance, the designer can set the interval distance between the avoidance object and the air bridge in the interval columns corresponding to numbers 4 and 6. For the above-mentioned first backbone line, second backbone line, and third backbone line, the avoidance objects that the air bridge on different backbone lines needs to avoid can be the same or different, and the interval distances between the avoidance object and the air bridge can be the same or different, which are not specifically limited here.

[0147] In area 803, the designer can configure the first identifier in the above-mentioned first placement rule (i.e., the layer where the backbone line for air bridge placement is located in area 803), the above-mentioned distance a, distance b, and distance c.

[0148] In area 804, the designer can configure the above-mentioned second avoidance rule. For example, when the designer selects to avoid the inflection point of the backbone line in area 804, the above-mentioned second avoidance rule indicates that the air bridge deployment needs to avoid the inflection point of the backbone line in the first layer. At this time, the designer can set the minimum distance between the inflection point of the backbone line and the center of the air bridge in area 804. When the designer selects to place an arc at the inflection point of the backbone line in area 804, the above-mentioned second avoidance rule indicates that the air bridge deployment does not need to avoid the inflection point of the backbone line in the first layer. At this time, the minimum distance between the inflection point of the backbone line and the center of the air bridge in area 804 can be defaulted to empty.

[0149] When the designer selects the size in area 801, the content displayed on the display interface of the chip design software will switch to Figure 8-b the air bridge size configuration interface shown. Among them, Layer-Pier is the layer where the pier is located, Layer-Deck is the layer where the bridge deck is located, and A, A1, A2, A3, A4 correspond to A, A1, A2, A3, A4 in the above Figure 2 above.

[0150] Compared with the pulse modulation line and the flux modulation line, the line width corresponding to the above-mentioned read bus when forming a coplanar waveguide is relatively large. Therefore, in order to ensure the matching of the deployed air bridge with different signal transmission lines, the air bridge parameters corresponding to the air bridge on the first backbone line can be greater than the air bridge parameters corresponding to the air bridges on the second backbone line and the third backbone line. Regarding the size information corresponding to the air bridges on each backbone line, it is not specifically limited here.

[0151] The designer is following Figure 8-a and Figure 8-bAfter the configuration of the above-mentioned first deployment data and second deployment data is completed on the shown interface, the configured first deployment data and second deployment data can be cached.

[0152] When performing air bridge deployment for the above-mentioned first layer and fifth layer, the electronic device respectively obtains the cached first deployment data and second deployment data, and performs the deployment of the above-mentioned first air bridge in the first layer according to the first deployment data, and performs the deployment of the above-mentioned second air bridge in the fifth layer according to the second deployment data.

[0153] Based on the same inventive concept, according to the air bridge deployment method provided in the embodiment of the present application above, the embodiment of the present application also provides an air bridge deployment device. As Figure 9 shown, Figure 9 is a schematic structural diagram of an air bridge deployment device provided in an embodiment of the present application. The device includes the following modules.

[0154] The first acquisition module 901 is configured to acquire first deployment data required for air bridge deployment corresponding to the first layer in the quantum chip layout, where the first deployment data includes a first placement rule and first air bridge parameters;

[0155] The first deployment module 902 is configured to place a first air bridge matching the first air bridge parameters on the skeleton line in the first layer according to the first placement rule.

[0156] Optionally, the above-mentioned first placement rule includes: the first identifier of the first layer, the minimum distance between the center point of the air bridge and the end point of the skeleton line in the first layer, the minimum distance between the center points of the air bridges, and the placement step of the air bridge;

[0157] The above-mentioned first air bridge parameters include: the second layer where the two bridge piers are located, the third layer where the bridge deck is located, the length and width corresponding to the bridge piers, the length and width corresponding to the bridge deck, and the interval distance between the two bridge piers.

[0158] Optionally, the above-mentioned first deployment data may further include a deployment avoidance rule;

[0159] The step of placing a first air bridge matching the first air bridge parameters on the skeleton line in the first layer according to the first placement rule includes:

[0160] Based on the first placement rule and the deployment avoidance rule, place a first air bridge matching the first air bridge parameters on the skeleton line in the first layer.

[0161] Optionally, the above-mentioned deployment avoidance rule may be the first avoidance rule;

[0162] The above first avoidance rule includes: the second identifier of each avoidance object in the fourth layer that needs to be avoided during the air bridge deployment, and the interval distance between each avoidance object and the air bridge.

[0163] Optionally, the above deployment avoidance rule can be the second avoidance rule; the second avoidance rule is used to indicate whether the deployment of the air bridge avoids the inflection point of the backbone line.

[0164] Optionally, if the second avoidance rule indicates that the deployment of the air bridge avoids the inflection point of the backbone line, the second avoidance rule includes the minimum distance between the air bridge and the inflection point of the backbone line.

[0165] Optionally, the above air bridge deployment device may further include:

[0166] A second acquisition module, configured to, after placing a first air bridge matching the first air bridge parameters on the backbone line in the first layer according to the first placement rule, acquire second deployment data required for air bridge deployment corresponding to the fifth layer in the quantum chip layout, where the second deployment data includes a second placement rule and second air bridge parameters;

[0167] A second deployment module, configured to place a second air bridge matching the second air bridge parameters on the backbone line in the fifth layer according to the second placement rule.

[0168] Optionally, the priority of air bridge deployment in the above first layer is higher than the priority of air bridge deployment in the fifth layer;

[0169] The above first air bridge parameters are different from the second air bridge parameters.

[0170] Optionally, the above air bridge deployment device may further include:

[0171] After placing a second air bridge matching the second air bridge parameters on the backbone line in the fifth layer according to the second placement rule, generate and display a quantum chip layout including the first air bridge and the second air bridge based on the placement position of the first air bridge in the first layer and the placement position of the second air bridge in the fifth layer.

[0172] Through the device provided by the embodiments of the present application, after obtaining the first deployment data required for the air bridge deployment corresponding to the first layer in the quantum chip layout, according to the first placement rule in the first deployment data, air bridges with sizes matching the first size in the first deployment data are placed on the backbone lines in the first layer, realizing the automatic deployment of air bridges on the backbone lines in the first layer, and thus realizing the automatic deployment of air bridges on each backbone line in the quantum chip layout. Moreover, during the air bridge deployment process in the first layer, the same placement rule and the same air bridge parameters are used for air bridge deployment, eliminating the need to separately deploy each air bridge one by one, effectively shortening the time required for air bridge deployment, and improving the convenience and speed of air bridge deployment.

[0173] Based on the same inventive concept, according to the air bridge deployment method provided by the embodiments of the present application above, the embodiments of the present application also provide an electronic device, as Figure 10 shown, including a processor 1001, a communication interface 1002, a memory 1003, and a communication bus 1004. Among them, the processor 1001, the communication interface 1002, and the memory 1003 communicate with each other through the communication bus 1004.

[0174] The memory 1003 is used to store a computer program;

[0175] When the processor 1001 is used to execute the program stored on the memory 1003, the following steps are implemented:

[0176] Obtain the first deployment data required for the air bridge deployment corresponding to the first layer in the quantum chip layout, where the first deployment data includes a first placement rule and first air bridge parameters;

[0177] According to the first placement rule, place the first air bridge matching the first air bridge parameters on the backbone lines in the first layer.

[0178] Through the electronic device provided by the embodiments of the present application, after obtaining the first deployment data required for the air bridge deployment corresponding to the first layer in the quantum chip layout, according to the first placement rule in the first deployment data, air bridges with sizes matching the first size in the first deployment data are placed on the backbone lines in the first layer, realizing the automatic deployment of air bridges on the backbone lines in the first layer, and thus realizing the automatic deployment of air bridges on each backbone line in the quantum chip layout. Moreover, during the air bridge deployment process in the first layer, the same placement rule and the same air bridge parameters are used for air bridge deployment, eliminating the need to separately deploy each air bridge one by one, effectively shortening the time required for air bridge deployment, and improving the convenience and speed of air bridge deployment.

[0179] The communication bus mentioned in the above electronic device may be a Peripheral Component Interconnect (PCI) bus, an Extended Industry Standard Architecture (EISA) bus, or the like. The communication bus can be divided into an address bus, a data bus, a control bus, etc. For the sake of convenience in representation, only a thick line is used in the figure, but it does not mean that there is only one bus or one type of bus.

[0180] The communication interface is used for communication between the above electronic device and other devices.

[0181] The memory may include a Random Access Memory (RAM), and may also include a Non-Volatile Memory (NVM), such as at least one disk memory. Optionally, the memory may also be at least one storage device located far from the aforementioned processor.

[0182] The above-mentioned processor may be a general-purpose processor, including a Central Processing Unit (CPU), a Network Processor (NP), etc.; it may also be a Digital Signal Processor (DSP), an Application Specific Integrated Circuit (ASIC), a Field-Programmable Gate Array (FPGA), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components.

[0183] Based on the same inventive concept, according to the air bridge deployment method provided in the above embodiments of the present application, the embodiments of the present application also provide a computer-readable storage medium, in which a computer program is stored, and when the computer program is executed by a processor, the steps of any of the above air bridge deployment methods are implemented.

[0184] Based on the same inventive concept, according to the air bridge deployment method provided in the above embodiments of the present application, the embodiments of the present application also provide a computer program product containing instructions, which when running on a computer, causes the computer to execute any of the air bridge deployment methods in the above embodiments.

[0185] In the above embodiments, it can be implemented in whole or in part by software, hardware, firmware, or any combination thereof. When implemented using software, it can be implemented in whole or in part in the form of a computer program product. The computer program product includes one or more computer instructions. When the computer program instructions are loaded and executed on a computer, the processes or functions described in the embodiments of the present application are generated in whole or in part. The computer can be a general-purpose computer, a special-purpose computer, a computer network, or other programmable devices. The computer instructions can be stored in a computer-readable storage medium or transmitted from one computer-readable storage medium to another. For example, the computer instructions can be transmitted from one website, computer, server, or data center to another website, computer, server, or data center by wire (such as coaxial cable, optical fiber, digital subscriber line (DSL)) or wireless (such as infrared, wireless, microwave, etc.). The computer-readable storage medium can be any available medium that can be accessed by a computer or a data storage device such as a server or data center that includes one or more integrated available media. The available medium can be a magnetic medium (such as a floppy disk, hard disk, magnetic tape), an optical medium (such as a DVD), or a semiconductor medium (such as a solid state disk (SSD)).

[0186] It should be noted that, in this document, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including", or any other variation thereof is intended to cover non-exclusive inclusion, so that a process, method, article, or device that includes a series of elements includes not only those elements but also other elements that are not explicitly listed, or elements that are inherent to such process, method, article, or device. Without further limitation, an element defined by the statement "including one..." does not exclude the existence of additional identical elements in the process, method, article, or device that includes the element.

[0187] Each embodiment in this specification is described in a related manner. The same or similar parts between the embodiments can be referred to each other, and the differences between each embodiment and other embodiments are emphasized. In particular, for embodiments such as devices, electronic devices, computer-readable storage media, and computer program products, since they are basically similar to the method embodiments, the description is relatively simple, and the relevant parts can be referred to the partial description of the method embodiments.

[0188] The above are only the preferred embodiments of the present application and are not intended to limit the protection scope of the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present application are all included in the protection scope of the present application.

Claims

1. An air bridge deployment method, characterized in that, the method includes: Obtain the first deployment data required for air bridge deployment corresponding to the first layer in the quantum chip layout, where the first deployment data includes the first placement rule and the first air bridge parameters; According to the first placement rule, place the first air bridge matching the first air bridge parameters on the skeleton line in the first layer.

2. The method according to claim 1, characterized in that, the first placement rule includes: the first identifier of the first layer, the minimum distance from the center point of the air bridge to the end point of the skeleton line in the first layer, the minimum distance between the center points of the air bridges, and the placement step length of the air bridge; the first air bridge parameters include: the second layer where the two piers are located, the third layer where the bridge deck is located, the length and width corresponding to the piers, the length and width corresponding to the bridge deck, and the interval distance between the two piers.

3. The method according to claim 1, characterized in that, the first deployment data further includes a deployment avoidance rule; the step of placing the first air bridge matching the first air bridge parameters on the skeleton line in the first layer according to the first placement rule includes: Based on the first placement rule and the deployment avoidance rule, place the first air bridge matching the first air bridge parameters on the skeleton line in the first layer.

4. The method according to claim 3, characterized in that, the deployment avoidance rule is the first avoidance rule; the first avoidance rule includes: the second identifier of the fourth layer where each avoidance object required for air bridge deployment is located, and the interval distance between each avoidance object and the air bridge.

5. The method according to claim 3, characterized in that, the deployment avoidance rule is the second avoidance rule; the second avoidance rule is used to indicate whether the deployment of the air bridge avoids the inflection point of the skeleton line.

6. The method according to claim 5, characterized in that, If the second avoidance rule indicates that the deployment of the air bridge avoids the inflection point of the skeleton line, then the second avoidance rule includes the minimum distance from the air bridge to the inflection point of the skeleton line.

7. The method according to any one of claims 1-6, characterized in that, After placing the first air bridge matching the first air bridge parameters on the skeleton line in the first layer according to the first placement rule, the method further includes: Obtain the second deployment data required for air bridge deployment corresponding to the fifth layer in the quantum chip layout, where the second deployment data includes the second placement rule and the second air bridge parameters; According to the second placement rule, place the second air bridge matching the second air bridge parameters on the skeleton line in the fifth layer.

8. The method according to claim 7, characterized in that, the priority of air bridge deployment in the first layer is higher than the priority of air bridge deployment in the fifth layer; the first air bridge parameters are different from the second air bridge parameters.

9. The method according to claim 7, characterized in that, After placing a second air bridge matching the second air bridge parameters on the backbone line in the fifth layer according to the second placement rule, the method further includes: Generating and displaying a quantum chip layout including the first air bridge and the second air bridge according to the placement position of the first air bridge in the first layer and the placement position of the second air bridge in the fifth layer.

10. An air bridge deployment device, characterized in that, the device includes: A first acquisition module, configured to acquire first deployment data required for air bridge deployment corresponding to a first layer in a quantum chip layout, where the first deployment data includes a first placement rule and first air bridge parameters; A first deployment module, configured to place a first air bridge matching the first air bridge parameters on the backbone line in the first layer according to the first placement rule.

11. An electronic device, characterized in that, It includes a processor, a communication interface, a memory, and a communication bus. Among them, the processor, the communication interface, and the memory complete mutual communication through the communication bus; The memory is used to store a computer program; The processor is configured to implement the method steps described in any one of claims 1-9 when executing the program stored on the memory.

12. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the method steps described in any one of claims 1-9 are implemented.

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