Wafer Cassette Adjusting Device and Wafer Immersion Device

Abstract

The present application provides a wafer cassette adjusting device and a wafer soaking device. Among them, the wafer cassette adjusting device includes a cassette rack, a wafer cassette, and a flipping mechanism. A hard limit member is provided on the cassette rack. The wafer cassette is pivotally connected to the cassette rack through a first pivot shaft and is used to hold wafers. The flipping mechanism is connected to the wafer cassette and is used to drive the wafer cassette to rotate around the first pivot shaft. Among them, during the process of the wafer cassette rotating towards the horizontal state, when the wafer cassette abuts against the hard limit member, the wafer cassette is in the horizontal state. The present application can prevent the wafer cassette from rotating excessively, ensure the levelness of the wafer cassette, ensure the accuracy when picking and placing wafers, avoid structural interference caused by the deviation of the levelness of the wafer cassette, and significantly reduce the risk of wafer breakage.

Description

Technical Field

[0001] This application relates to the field of semiconductor manufacturing technology, and in particular, to a wafer cassette adjusting device and a wafer soaking device. Background Art

[0002] In the field of semiconductor manufacturing, a slot - single - wafer combined photoresist stripping device realizes efficient photoresist stripping and surface treatment of wafers by integrating slot - type chemical soaking and single - wafer high - pressure cleaning processes. When the device is operating, the robot extracts the wafer from the loading port and transfers it to a wafer cassette in a horizontal state. Subsequently, the wafer cassette is driven by a flipping mechanism to be flipped to a vertical state, and the vertical wafer cassette is immersed in the chemical liquid tank by a lifting mechanism to soak the photoresist on the wafer surface with chemical liquid. After the process is completed, the wafer cassette is reset above the chemical liquid tank by a lifting device and is driven back to the horizontal state by the flipping mechanism. The robot takes out the wafer from the wafer cassette in this horizontal state and transfers the wafer to a cleaning chamber with a high - pressure nozzle to remove the residual glue softened by soaking on the wafer surface by spraying cleaning liquid through the high - pressure nozzle. Finally, the robot transfers the wafer to a cleaning chamber with an atmospheric - pressure nozzle to complete the cleaning and drying of the wafer surface.

[0003] However, after multiple processes, affected by mechanical wear, the lifting mechanism and the flipping mechanism cause an inclination deviation between the wafer cassette and the horizontal plane when the wafer cassette rotates to the horizontal state.

[0004] Among them, a plurality of slots for accommodating wafers are provided in the wafer cassette. Due to the inclination deviation between the wafer cassette and the horizontal plane, the slots of the wafer cassette also show an inclination deviation. When the robot picks up and places the wafer from the slot of the wafer cassette, due to the inclination deviation between the slot and the horizontal plane, on the one hand, it increases the interference risk between the robot and the slot, and on the other hand, it also increases the abnormal interference risk between the wafer and the slot, thereby bringing a relatively serious risk of wafer breakage. Summary of the Invention

[0005] The purpose of this application is to provide a wafer cassette adjusting device and a wafer soaking device, which can prevent the over - rotation of the wafer cassette, ensure the levelness of the wafer cassette, ensure the accuracy when picking up and placing wafers, avoid structural interference caused by the levelness deviation of the wafer cassette, and significantly reduce the risk of wafer breakage.

[0006] In a first aspect, a wafer cassette adjustment device is provided, which includes a cassette frame, a wafer cassette, and a flipping mechanism. A hard limit member is provided on the cassette frame. The wafer cassette is pivotally connected to the cassette frame through a first pivot shaft for holding wafers. The flipping mechanism is connected to the wafer cassette and is used to drive the wafer cassette to rotate around the first pivot shaft. The flipping mechanism includes a first driving mechanism and a lifting assembly. The lifting assembly is pivotally connected to the wafer cassette through a second pivot shaft. The first driving mechanism is used to drive the lifting assembly to move up and down, so that the lifting assembly drives the wafer cassette to rotate and makes the wafer cassette rotate around the first pivot shaft. Wherein, during the rotation of the wafer cassette towards the horizontal state, when the wafer cassette abuts against the hard limit member, the wafer cassette is in the horizontal state. And when the wafer cassette is in the horizontal state, the lifting assembly makes the wafer cassette keep abutting against the hard limit member under the drive of the first driving mechanism.

[0007] In an implementable solution, the lifting assembly includes a connecting rod, a connecting member, and a combined structure; the combined structure includes a fixing frame, an upper plate, a guiding member, and an elastic member; one end of the fixing frame is connected to the first driving mechanism, and the first driving mechanism is used to drive the fixing frame to move up and down. The other end of the fixing frame has an installation plane, and a first through hole is provided on the installation plane; the upper plate is located above the installation plane, and a second through hole is provided on the upper plate; the guiding member passes through the second through hole from top to bottom and is fixedly connected to the installation plane. A limiting portion with a diameter larger than the second through hole is provided on the upper portion of the guiding member; the elastic member is arranged between the upper plate and the installation plane and is used to apply a force to the upper plate away from the installation plane; the upper end of the connecting rod passes through the first through hole and is fixedly connected to the upper plate; the lower end of the connecting rod is pivotally connected to the first end of the connecting member, and the second end of the connecting member is pivotally connected to the wafer cassette through a second pivot shaft.

[0008] In an implementable solution, the combined structure further includes a limiting block, a contact sensor, and a control device; the limiting block is installed on the installation plane and is located below the upper plate, and the contact sensor is installed on the top surface of the limiting block; the control device is respectively communicatively connected to the contact sensor and the first driving mechanism; wherein, when the bottom surface of the upper plate contacts the contact sensor, the contact sensor sends an electrical signal to the control device, so that the control device controls the first driving mechanism to stop according to the electrical signal.

[0009] In an implementable solution, the hard limit member is installed on the cassette frame in a manner that its height position is adjustable.

[0010] In an implementable solution, the cassette frame includes two right-angled triangular frames, the two right-angled triangular frames are arranged oppositely, the wafer cassette is located between the two right-angled triangular frames, the two right-angled sides of the two right-angled triangular frames extend along the vertical direction and the horizontal direction respectively, and the hard limit member is provided on the inclined side of at least one right-angled triangular frame.

[0011] In an implementable solution, the wafer cassette adjustment device further includes a lifting mechanism, which includes a second driving mechanism, a lifting seat, and a sleeve; the lifting seat is installed on the second driving mechanism, and the second driving mechanism is used to drive the lifting seat to move up and down; the upper end of the sleeve is fixedly connected to the lifting seat, and the lower end of the sleeve is fixedly connected to the cassette rack; the first driving mechanism is installed on the lifting seat, and the connecting rod movably passes through the sleeve.

[0012] In a second aspect, the present application provides a wafer immersion device, which includes the aforementioned wafer cassette adjustment device, and further includes a liquid medicine tank and an upper housing; the liquid medicine tank is used to contain the liquid medicine for immersing the wafer, and it has an upper opening; the upper housing is arranged above the liquid medicine tank, the upper housing has a lower opening, and the lower opening is docked with the upper opening. The upper housing is used to form a sealed cavity with the liquid medicine tank, and a chamber opening that can be opened and closed is arranged on the side of the upper housing for the wafer to enter and exit.

[0013] In an implementable solution, a measured part is arranged on the wafer cassette of the wafer cassette adjustment device, and a level detector is arranged outside the chamber opening of the upper housing; when the wafer cassette rotates to a horizontal state and faces the chamber opening, the measured part is directly opposite to the level detector.

[0014] In an implementable solution, the wafer immersion device includes a chamber door switch mechanism, which includes a lifting module, a horizontal displacement module, and a chamber door; the lifting module is installed on the outer wall of the upper housing and is located above the chamber opening, the horizontal displacement module is installed on the lifting module, and the chamber door is installed at the output end of the horizontal displacement module; wherein, the lifting module is used to drive the horizontal displacement module to move up and down in the height direction, and the horizontal displacement module is used to drive the chamber door to move horizontally to approach or move away from the chamber opening.

[0015] In an implementable solution, a suction channel is arranged outside the chamber opening, and the suction channel is provided with a lateral suction port and an exhaust port. The lateral suction port is used to suck the gas at the chamber opening, and the exhaust port is used to discharge the gas sucked by the lateral suction port.

[0016] In an implementable solution, the suction channel is further provided with a drain port.

[0017] In an implementable solution, the wafer immersion device further includes a first leak-proof tray, which is arranged around the upper housing and is located below the chamber opening, and the first leak-proof tray is provided with a liquid outlet.

[0018] In an implementable solution, the wafer immersion device further includes a second leak-proof tray, which is arranged below the liquid medicine tank; the liquid outlet and the drain port are respectively communicated with the second leak-proof tray.

[0019] Compared with the prior art, the beneficial effects of the present application at least include: In the wafer cassette adjustment device of the present application, the flipping mechanism drives the wafer cassette to rotate around the first pivot axis, rotates the wafer cassette towards the horizontal state, and finally makes the edge of the wafer cassette abut against the hard limit member to reach the horizontal state. Under the limitation of the hard limit member, the situation of excessive rotation of the wafer cassette can be eliminated. And when the wafer cassette is in the horizontal state, the lifting assembly can keep the wafer cassette always abutting against the hard limit member under the drive of the first driving mechanism, ensuring the levelness of the wafer cassette, significantly reducing the tilting deviation, reducing the interference risk between the manipulator and the wafer cassette, and reducing the interference risk between the wafer and the wafer cassette slot. By preventing the excessive rotation of the wafer cassette to ensure the levelness of the wafer cassette, the accuracy during wafer picking and placing is ensured, the structural interference caused by the levelness deviation is avoided, and the risk of wafer breakage is significantly reduced.

[0020] In a further solution, in the lifting assembly of the flipping mechanism, the upper end of the connecting rod is connected to the first driving mechanism through a combined structure. When the edge of the wafer cassette abuts against the hard limit member to reach the horizontal state, the first driving mechanism further lifts the fixing frame, and the fixing frame and the upper plate further compress the elastic member. At this time, the elastic member exerts a force on the upper plate away from the fixing frame, that is, gives the upper plate a tendency to move upward continuously. Since the upper end of the connecting rod is fixedly connected to the upper plate, the upper plate can always exert an upward pulling force on the connecting rod, thereby effectively ensuring that the wafer cassette can always abut against the hard limit member. Thus, on the basis of preventing the excessive rotation of the wafer cassette, the insufficient flipping of the wafer cassette is also prevented, and the wafer cassette can be ensured to always maintain the horizontal state, and further more effectively ensure that the levelness of the wafer cassette meets the requirements.

[0021] At the same time, in the wafer soaking device of the present application, the liquid medicine tank is sealed by the upper shell, and the electrical components for motion control are placed outside the sealed environment, so that the corrosion damage of the components caused by the volatilization of the liquid medicine can be prevented. At the same time, further, a measured part is provided on the wafer cassette. When the wafer cassette rotates to the horizontal state, the measured part is directly opposite to the level detector outside the upper shell, thereby helping to judge whether the wafer cassette is in the horizontal state. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required to be used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present application, and therefore should not be regarded as limiting the scope. For those of ordinary skill in the art, other related drawings can be obtained based on these drawings without creative efforts.

[0023] Figure 1a and Figure 1b FIG. 17 is a schematic diagram of a wafer cassette adjustment device shown according to an embodiment of the present application.

[0024] Figure 2 Schematic diagram when the wafer cassette shown in the embodiment of the present application is in a horizontal state.

[0025] Figure 3a Schematic diagram of the combination of the cassette rack and the hard limit member shown in the embodiment of the present application.

[0026] Figure 3b Front view schematic diagram of a hard limit member shown in the embodiment of the present application.

[0027] Figure 3c For Figure 3b Schematic diagram of the limiting element of the hard limit member in

[0028] Figure 3d For Figure 3b Front view schematic diagram of the fixing part of the hard limit member in

[0029] Figure 3e For Figure 3b Top view schematic diagram of the fixing part of the hard limit member in

[0030] Figure 4 Schematic diagram when the wafer cassette shown in the embodiment of the present application is in a vertical state.

[0031] Figure 5 Schematic diagram when the wafer cassette shown in the embodiment of the present application is tilted at a predetermined angle.

[0032] Figure 6 Schematic diagram of the lifting mechanism and the wafer cassette adjustment device shown in the embodiment of the present application.

[0033] Figure 7 Schematic diagram when the wafer cassette shown in the embodiment of the present application descends into the liquid medicine tank.

[0034] Figure 8 Schematic diagram of a wafer immersion device shown in the embodiment of the present application.

[0035] Figure 9 Schematic diagram of a wafer immersion device with a second anti-leakage tray shown in the embodiment of the present application.

[0036] Figure 10 For Figure 9 Schematic diagram of the chamber door switch mechanism in

[0037] Figure 11 Side view schematic diagram of setting a horizontal detection structure on the wafer cassette shown in the embodiment of the present application.

[0038] Figure 12A top view schematic diagram of a horizontal detection structure provided on a wafer cassette according to an embodiment of the present application.

[0039] In the figure: 1. Cassette frame; 101. Right-angled triangular frame; 102. Long slot; 100. Hard limit member; 111. Limit element; 1111. Limit protrusion; 112. Fixing part; 1121. Opening; 1122. Fixing hole; 2. Wafer cassette; 21. Screw; 3. First driving mechanism; 4. Connecting rod; 5. Connecting member; 6. Combined structure; 61. Fixing frame; 601. Mounting plane; 611. First through hole; 62. Upper plate; 621. Second through hole; 63. Guide member; 631. Limiting part; 64. Elastic member; 65. Limit block; 66. Contact sensor; 7. Second driving mechanism; 8. Lifting seat; 9. Sleeve; 10. Liquid medicine tank; 11. Upper shell; 1101. Chamber opening; 1102. Bellows; 1103. Top suction port; 1104. Suction channel; 1105. Lateral suction port; 1106. Exhaust port; 1107. Drain port; 12. Measured part; 121. Guide groove; 13. Level detector; 14. Chamber door switch mechanism; 1401. Lifting module; 1402. Horizontal displacement module; 1403. Chamber door; 1404. Mounting frame; 15. First anti-leakage tray; 1501. Liquid outlet; 16. Second anti-leakage tray. Detailed implementation manners

[0040] To make the objectives, technical solutions, and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are some, but not all, of the embodiments of the present application. Usually, the components of the embodiments of the present application described and illustrated in the accompanying drawings here can be arranged and designed in various different configurations.

[0041] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application claimed, but merely represents selected embodiments of the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present application without creative efforts shall fall within the scope of protection of the present application.

[0042] Embodiment 1

[0043] As Figures 1a to 2 shown, the embodiment of the present application first provides a wafer cassette adjustment device, which at least includes a cassette frame 1, a wafer cassette 2, and a flipping mechanism. Among them, a plurality of card slots are provided in the wafer cassette 2, and wafers are sent into the card slots by a manipulator and held by the card slots.

[0044] A hard limit member 100 is provided on the cassette holder 1, and the wafer cassette 2 and the cassette holder 1 are pivotally connected by a first pivot S1. The flipping mechanism is connected to the wafer cassette 2 and is used to drive the wafer cassette 2 to rotate around the first pivot S1. Among them, during the rotation of the wafer cassette 2 towards the horizontal state, when the wafer cassette 2 abuts against the hard limit member 100, the wafer cassette 2 is in the horizontal state. At this time, the wafer cassette 2 will not continue to rotate under the restriction of the hard limit member 100.

[0045] Before the wafer is soaked, it is necessary to rotate the wafer cassette 2 to the horizontal state so that the wafer can be placed into the card slot of the wafer cassette 2 by the manipulator. And after the wafer is soaked, it is necessary to rotate the wafer cassette 2 to the horizontal state so that the wafer can be taken out from the card slot of the wafer cassette 2 by the manipulator. When the flipping mechanism drives the wafer cassette 2 to rotate around the first pivot S1 to make the wafer cassette 2 rotate towards the horizontal state and make the wafer cassette 2 abut against the hard limit member 100 to reach the horizontal state, under the restriction of the hard limit member 100, the wafer cassette 2 is in the horizontal state and will not continue to rotate, thus eliminating the situation of excessive rotation of the wafer cassette 2, ensuring the levelness of the wafer cassette 2, controlling the tilt deviation of the wafer cassette 2 within the range that meets the process requirements, such as within 0.5°, significantly reducing the tilt deviation, reducing the interference risk between the manipulator and the wafer cassette 2, and reducing the risk of abnormal interference between the wafer and the card slot of the wafer cassette 2 during the process of picking and placing the wafer, and preventing the wafer from being broken.

[0046] In this embodiment, as Figure 1a and Figure 1b shown, the flipping mechanism may include a first driving mechanism 3 and a lifting assembly. The lifting assembly is pivotally connected to the wafer cassette 2 by a second pivot S2. The first driving mechanism 3 is used to drive the lifting assembly to move up and down so that the lifting assembly drives the wafer cassette 2 to rotate and makes the wafer cassette 2 rotate around the first pivot S1. The lifting assembly is configured such that when the wafer cassette 2 is in the horizontal state, the lifting assembly drives the wafer cassette 2 to always abut against the hard limit member 100 under the drive of the first driving mechanism 3, thereby keeping the wafer cassette 2 in the horizontal state.

[0047] In this embodiment, a pressure sensor may be provided at the abutting position between the hard limit member 100 and the wafer cassette 2. When the wafer cassette 2 rotates to the horizontal state and abuts against the hard limit member 100, it squeezes the pressure sensor, and the pressure sensor sends an electrical signal to the control device that controls the action of the first driving mechanism 3. The control device receives the electrical signal and analyzes whether the pressure value detected by the pressure sensor reaches the preset pressure threshold. If it reaches the preset pressure threshold, the control device controls the first driving mechanism 3 to stop operating, thereby preventing the first driving mechanism 3 from being overloaded.

[0048] In this embodiment, preferably, as Figure 1a and Figure 1bAs shown in the figure, the lifting assembly may include a connecting rod 4, a connecting member 5, and a combined structure 6. The combined structure 6 includes a fixing bracket 61, an upper plate 62, a guiding member 63, and an elastic member 64. One end of the fixing bracket 61 is connected to the first driving mechanism 3, and the first driving mechanism 3 drives the fixing bracket 61 to move up and down. The other end of the fixing bracket 61 has an installation plane 601, and a first through hole 611 is provided on the installation plane 601. The upper plate 62 is located above the installation plane 601, and a second through hole 621 is provided on the upper plate 62; the guiding member 63 passes through the second through hole 621 of the upper plate 62 from top to bottom and is fixedly connected to the installation plane 601 of the fixing bracket 61. A limiting portion 631 with a diameter larger than the second through hole 621 is provided at the upper part of the guiding member 63 to prevent the guiding member 63 from coming out of the upper plate 62. The elastic member 64 is arranged between the upper plate 62 and the installation plane 601 of the fixing bracket 61, and the elastic member 64 is used to apply a force to the upper plate 62 to move away from the installation plane 601. The upper end of the connecting rod 4 passes through the first through hole 611 of the fixing bracket 61 and is fixedly connected to the upper plate 62. The lower end of the connecting rod 4 is pivotally connected to the first end of the connecting member 5, and the second end of the connecting member 5 is pivotally connected to the wafer cassette 2 through a second pivot S2.

[0049] Among them, when the first driving mechanism 3 works, it drives the overall lifting of the combined structure 6, and then lifts the connecting rod 4, so that the connecting member 5 drives the wafer cassette 2 to rotate around the first pivot S1 through the second pivot S2. Finally, the wafer cassette 2 abuts against the hard limiting member 100, and the wafer cassette 2 is in the Figure 1a horizontal state as shown in the figure. During this process, the top surface of the upper plate 62 is in contact with the limiting portion 631. Subsequently, as shown in Figure 1b , the first driving mechanism 3 further lifts the combined structure 6. Because the wafer cassette 2 is restricted by the hard limiting member 100 and will not continue to rotate, the positions of the connecting member 5, the connecting rod 4, and the upper plate 62 connected to the wafer cassette 2 will not change. The fixing bracket 61 is further lifted upward under the further driving of the first driving mechanism 3. The fixing bracket 61 drives the guiding member 63 to rise and compresses the elastic member 64. The elastic member 64 applies a force to the upper plate 62 to move away from the installation plane 601, that is, gives the upper plate 62 a tendency to continue moving upward. During this process, after the fixing bracket 61 drives the guiding member 63 to rise, there is a gap between the top surface of the upper plate 62 and the limiting portion 631. Since the upper end of the connecting rod 4 is fixedly connected to the upper plate 62, the upper plate 62 can always apply an upward pulling force to the connecting rod 4, thereby effectively ensuring that the wafer cassette 2 can always abut against the hard limiting member 100. On the basis of preventing the wafer cassette 2 from rotating excessively, it also prevents the wafer cassette 2 from insufficient flipping, and can ensure that the wafer cassette 2 always maintains a horizontal state, and further effectively ensures that the levelness of the wafer cassette 2 meets the requirements.

[0050] Moreover, due to the presence of the elastic member 64, when the wafer cassette 2 abuts against the hard stop 100, a violent impact will not occur, and the first driving mechanism 3 can still have a certain upward movement distance. Thus, through the improvement of the mechanical structure, the occurrence of motion overload is effectively prevented.

[0051] In this embodiment, there are multiple guiding members 63, and the multiple guiding members 63 can be evenly arranged around the connecting rod 4 to improve the balance of the upward lifting action.

[0052] In this embodiment, as Figure 1a shown, the guiding member 63 can be a bolt, and the bolt passes through the second through hole 621 of the upper plate 62 from top to bottom and is fixedly connected to a pre-set threaded hole in the lower fixing frame 61. In addition, the guiding member 63 can also adopt a smooth shaft structure, with its bottom fixedly connected to the fixing frame 61 and a limiting portion provided at the top to prevent the smooth shaft structure from disengaging from the upper plate 62.

[0053] In this embodiment, as Figure 1a shown, the elastic member 64 can be a spring, and the spring can be sleeved on the outer periphery of the guiding member 63 and is located between the upper plate 62 and the mounting plane 601 of the fixing frame 61. In addition, the elastic member 64 can also adopt an elastic leaf spring structure, a pneumatic rod or a hydraulic rod structure, which is arranged between the upper plate 62 and the mounting plane 601 of the fixing frame 61 and applies a force to the upper plate 62 away from the mounting plane 601.

[0054] In this embodiment, as Figure 1a shown, the combined structure 6 can further include a limiting block 65 and a contact sensor 66. The limiting block 65 is installed on the mounting plane 601 of the fixing frame 61 and is located below the upper plate 62, and the contact sensor 66 is installed on the top surface of the limiting block 65. During the operation of the first driving mechanism 3 to drive the overall lifting of the combined structure 6, there is no contact between the bottom surface of the upper plate 62 and the contact sensor 66, and the distance between the bottom surface of the upper plate 62 and the contact sensor 66 is H1. Figure 1b In the illustrated example, under the limitation of the hard stop 100, the distance that the first driving mechanism 3 further lifts the fixing frame 61 is less than H1.

[0055] Meanwhile, as Figure 1a and Figure 1b shown, the control device of the wafer cassette adjustment device is respectively communicatively connected to the contact sensor 66 and the first driving mechanism 3. Among them, when the bottom surface of the upper plate 62 contacts the contact sensor 66, the contact sensor 66 sends an electrical signal to the control device, so that the control device controls the first driving mechanism 3 to stop according to this electrical signal.

[0056] If the elastic force of the elastic member 64 decays such that the elastic member 64 cannot provide sufficient separating force to the fixing bracket 61 and the upper plate 62, when the first driving mechanism 3 further lifts the fixing bracket 61, the bottom surface of the upper plate 62 will first come into contact with the contact sensor 66, thereby triggering the contact sensor 66 to send an electrical signal to the control device to control the first driving mechanism 3 to stop operating and prevent overload.

[0057] In this embodiment, as Figure 2 shown, the cassette holder 1 may include two right-angled triangular frames 101 to enhance the structural stability. The two right-angled triangular frames 101 are arranged oppositely, and the wafer cassette 2 is located between the two right-angled triangular frames 101. The two right-angled side frames of the right-angled triangular frame 101 extend along the vertical direction and the horizontal direction respectively, and at least one inclined side frame of the right-angled triangular frame 101 is provided with a hard limit member 100.

[0058] In this embodiment, the hard limit member 100 can be installed on the cassette holder 1 in a manner that the height position is adjustable to facilitate adjusting the levelness that the wafer cassette 2 can reach. As Figure 3a shown, the inclined side frames of the two right-angled triangular frames 101 are both provided with hard limit members 100. In this case, it is necessary to ensure that the two hard limit members 100 are at the same height so that the wafer cassette 2 is subjected to the acting forces of the two hard limit members 100 on a straight line, further ensuring the levelness of the wafer cassette 2. In Figure 3a the example shown, a long slot 102 extending along the inclined side frame may be provided on the inclined side frame of the right-angled triangular frame 101. The hard limit member 100 is installed in the long slot 102 and can slide and be fixed along the long slot 102. The hard limit member 100 can be fixed in the long slot 102 through structures such as screw fasteners and snap locking members.

[0059] When adjusting the position of the hard limit member 100, release the fixation of the hard limit member 100, slide the hard limit member 100 along the long slot 102 to a predetermined position, and then lock the hard limit member 100. The height adjustment is flexible and free, and stepless adjustment of the height position of the hard limit member 100 can be achieved within the range of the long slot 102, so as to cope with the horizontal limit of wafer cassettes 2 of different sizes and at the same time have higher horizontal limit accuracy.

[0060] In this embodiment, a plurality of mounting hole positions with different heights (not shown in the figure) may also be provided on the inclined side frame of the right-angled triangular frame 101. By adjusting the mounting hole position where the hard limit member 100 is located, the position of the hard limit member 100 can be adjusted, thereby facilitating the adjustment of the achievable levelness and adapting to wafer cassettes 2 of different sizes. By setting the fixing method of fixing the hard limit member 100 through the mounting hole positions, the hard limit member 100 is not likely to shift up and down, avoiding affecting the levelness of the wafer cassette 2.

[0061] Combined reference Figures 3b to 3e As shown in Figures 3b to 3e , the hard limit member 100 includes a limit element 111 and a fixing part 112. The limit element 111 is designed in a T-shaped structure. The limit element 111 has a limit protrusion 1111, and the limit protrusion 1111 is used to abut against the wafer cassette 2. The fixing part 112 has an opening 1121 and a fixing hole 1122, and the opening 1121 is for the limit protrusion 1111 to pass through. When the hard limit member 100 is installed on the inclined side frame of the right-angled triangle frame 101, the limit element 111 is clamped with the fixing part 112, and the limit protrusion 1111 of the limit element 111 passes through the opening 1121 of the fixing part 112, and then a bolt (not shown in the figure) is used to fix the hard limit member 100 on the inclined side frame of the right-angled triangle frame 101 through the fixing hole 1122 and the installation hole position described above.

[0062] In this embodiment, the hard limit member 100 can also limit the vertical state of the wafer cassette 2. Specifically, as Figure 4 shown, when the flipping mechanism drives the wafer cassette 2 to rotate towards the vertical state, when the wafer cassette 2 abuts against the hard limit member 100, the wafer cassette 2 cannot continue to rotate, and the wafer cassette 2 is in the vertical state. The wafer cassette 2 is stably maintained in the vertical state, which is beneficial to wafer soaking.

[0063] At the same time, with the cooperation of the combined structure 6 of the flipping mechanism, it can also effectively ensure the problem of insufficient flipping when the wafer cassette 2 rotates towards the vertical state.

[0064] In other embodiments, as Figure 5 shown, during the wafer soaking process, the wafer cassette 2 is inclined at a predetermined angle, which is beneficial to more firmly hold the wafer and avoid the situation where adjacent two wafers may stick together when the liquid medicine is disturbed between any two adjacent wafers. Therefore, the hard limit member 100 can also limit the wafer cassette 2 at the inclined predetermined angle. The position of the hard limit member 100 is adjusted according to the actual process. It should be noted that the card slots of the wafer cassette 2 are designed to be able to support the wafers from below in the vertical state or the inclined state to prevent the wafers from falling.

[0065] In summary, in the further solution of this embodiment, the hard limit member 100 can not only limit the horizontal state of the wafer cassette 2 before or after wafer soaking, but also limit the vertical state and the inclined state of the wafer cassette 2 during wafer soaking, and effectively solves the technical problems of horizontal, vertical and inclined limiting of the wafer cassette 2 under various working conditions through the innovative configuration of a single component.

[0066] Embodiment Two

[0067] As Figure 6As shown in the figure, the embodiment of the present application also provides a wafer cassette adjustment device. Different from the first embodiment, the wafer cassette adjustment device of the present application further includes a lifting mechanism for driving the cassette holder 1 and the wafer cassette 2 to move up or down.

[0068] Specifically, as Figure 6 shown, the lifting mechanism includes a second driving mechanism 7, a lifting seat 8, and a sleeve 9. The lifting seat 8 is installed on the second driving mechanism 7. The second driving mechanism 7 is used to drive the lifting seat 8 to move up and down. The upper end of the sleeve 9 is fixedly connected to the lifting seat 8, and the lower end of the sleeve 9 is fixedly connected to the cassette holder 1. The first driving mechanism 3 of the flipping mechanism is installed on the lifting seat 8, and the connecting rod 4 is movably inserted through the sleeve 9. The second driving mechanism 7 drives the lifting seat 8 to move up and down. The lifting seat 8 drives the sleeve 9 to move up and down. The sleeve 9 drives the cassette holder 1 to move up and down. The wafer cassette 2 moves up and down with the cassette holder 1.

[0069] With reference to Figure 1a 、 Figure 1b and Figure 4 , before wafer soaking, the wafer cassette 2 is lifted above the liquid medicine tank 10 by the lifting mechanism. First, the first driving mechanism 3 lifts the connecting rod 4, so that the connecting member 5 drives the wafer cassette 2 to rotate around the first pivot S1 in the first direction F1 through the second pivot S2, that is, the wafer cassette 2 rotates towards the horizontal state. Finally, the wafer cassette 2 abuts against the hard limiting member 100. At this time, the wafer cassette 2 is transformed into the horizontal state and maintains the horizontal state, as Figure 1b . Then, the manipulator sequentially places the wafers into the card slots of the wafer cassette 2.

[0070] Next, the first driving mechanism 3 operates to lower the connecting rod 4, so that the connecting member 5 drives the wafer cassette 2 to rotate around the first pivot S1 in the second direction F2 (opposite to the first direction F1) through the second pivot S2, and the wafer cassette 2 rotates from the horizontal state to the vertical state. Until the wafer cassette 2 abuts against the hard limiting member 100 again to limit the continuous rotation of the wafer cassette 2, indicating that the wafer cassette 2 has rotated to the desired vertical state, as Figure 4 .

[0071] After that, the second driving mechanism 7 operates to drive the lifting seat 8 and the first driving mechanism 3 installed on the lifting seat 8 to descend as a whole, as Figure 7 shown, and finally the vertically placed wafer cassette 2 is immersed in the liquid medicine tank 10. After the soaking process is completed, the above actions are run in reverse.

[0072] Embodiment 3

[0073] As Figure 8 and Figure 9As shown in the figure, the embodiment of the present application further provides a wafer soaking device, which includes the wafer cassette adjustment device in Embodiment 2, and further includes a liquid medicine tank 10 and an upper housing 11.

[0074] Among them, the liquid medicine tank 10 is used to hold the liquid medicine for soaking the wafer, and it has an upper opening. The upper housing 11 is arranged above the liquid medicine tank 10. The upper housing 11 has a lower opening, and the lower opening is docked with the upper opening of the liquid medicine tank 10. The upper housing 11 is used to form a sealed cavity with the liquid medicine tank 10. A chamber opening 1101 that can be opened and closed is arranged on the side of the upper housing 11 for the wafer to enter and exit.

[0075] In some embodiments, a through hole (not shown in the figure) is arranged on the top surface of the upper housing 11. The sleeve 9 of the wafer cassette adjustment device is movably inserted through the through hole, and a sealed connection is formed between the two. The cassette rack 1 and the wafer cassette 2 are located in the sealed cavity formed by the liquid medicine tank 10 and the upper housing 11, and the first driving mechanism 3, the second driving mechanism 7, and the lifting seat 8 are located outside the sealed cavity. Among them, a bellows 1102 can be used to achieve a sealed connection between the through hole and the sleeve 9, which can not only ensure the sealing effect but also not affect the up and down movement of the sleeve 9.

[0076] In this embodiment, the connecting rod 4 of the lifting assembly and the sleeve 9 are preferably configured for movable sealing. For example, a bellows can also be used to connect the connecting rod 4 and the sleeve 9 to achieve movable sealing between the two. Another example is that a sliding seal ring structure can be arranged between the sleeve 9 and the connecting rod 4 to achieve movable sealing between the two.

[0077] For the wafer soaking device in this embodiment, the liquid medicine tank 10 is sealed, and the motion control electrical components, etc. are placed outside the sealed environment, so that it can prevent the corrosion and damage of the components caused by the volatilization of the liquid medicine.

[0078] In this embodiment, as Figure 9 and Figure 10 shown, the wafer soaking device further includes a chamber door switch mechanism 14, which includes a lifting module 1401, a horizontal displacement module 1402, and a chamber door 1403. The lifting module 1401 is installed on the outer wall of the upper housing 11 and is located above the chamber opening 1101. The horizontal displacement module 1402 is installed on the lifting module 1401, and the chamber door 1403 is installed at the output end of the horizontal displacement module 1402. The lifting module 1401 is used to drive the horizontal displacement module 1402 to move up and down in the height direction. The horizontal displacement module 1402 is used to drive the chamber door 1403 to move horizontally to approach or away from the chamber opening 1101, so as to close or open the chamber opening 1101 with the chamber door 1403. After the chamber door 1403 closes the chamber opening 1101, the upper housing 11 and the liquid medicine tank 10 form a sealed cavity. A sealing gasket can be arranged on the side of the chamber door 1403 facing the chamber opening 1101 to achieve better sealing.

[0079] In addition, as Figure 10 shown, the chamber door switching mechanism 14 may further include a mounting bracket 1404. The mounting bracket 1404 may be part of the lifting module 1401 or part of the horizontal displacement module 1402. The mounting bracket 1404 is mounted on the output end of the lifting module 1401, and the horizontal displacement module 1402 is mounted on the mounting bracket 1404. It should be noted that the mounting bracket 1404 is not necessary, and the horizontal displacement module 1402 may also be directly mounted on the output end of the lifting module 1401.

[0080] In this embodiment, as Figure 9 shown, a top suction port 1103 penetrating the interior may be provided at the top of the upper housing 11 for sucking the gas inside the upper housing 11. The gas described in the embodiments of the present application is, for example, the gas generated by the evaporation of the liquid medicine.

[0081] In this embodiment, as Figure 9 shown, a suction channel 1104 may be provided outside the chamber opening 1101. The suction channel 1104 is provided with a lateral suction port 1105 and an exhaust port 1106. The lateral suction port 1105 is used for sucking the gas at the chamber opening 1101, and the exhaust port 1106 is used for discharging the gas sucked by the lateral suction port 1105.

[0082] In this embodiment, the suction channel 1104 is further provided with a downward liquid discharge port 1107. If the gas sucked by the lateral suction port 1105 condenses into a liquid, it can be discharged from the liquid discharge port 1107.

[0083] Preferably, suction channels 1104 are respectively provided on both sides of the chamber opening 1101, and the lateral suction ports 1105 of the two suction channels 1104 face each other, so as to be able to suck away the gas at the chamber opening 1101 more timely.

[0084] In this embodiment, an observation window (not marked in the figure) may also be provided on other side walls of the upper housing 11 except for the side wall where the chamber opening 1101 is located, so as to facilitate the staff to observe the internal operation condition.

[0085] In this embodiment, as Figure 8 and Figure 9 shown, the wafer immersion device may further include a first leak-proof tray 15. The first leak-proof tray 15 is provided on the periphery of the upper housing 11 and is located below the chamber opening 1101, and the first leak-proof tray 15 is provided with a liquid outlet 1501. The first leak-proof tray 15 can receive the leaked liquid at the chamber opening 1101 and / or the observation window, and discharge it through the centralized liquid outlet 1501. In Figure 8 and Figure 9In the illustrated example, the first leak-proof tray 15 is disposed around the periphery of the upper housing 11.

[0086] In this embodiment, as Figure 8 and Figure 9 shown, the wafer soaking device may further include a second leak-proof tray 16, which is disposed below the liquid medicine tank 10 (fixed by a structural frame). The liquid outlet 1501 of the first leak-proof tray 15 and the liquid discharge port 1107 of the suction channel 1104 are respectively communicated with the second leak-proof tray 16, and the second leak-proof tray 16 can receive the liquid in the first leak-proof tray 15, the condensed liquid in the suction channel 1104, and the leaked liquid from the liquid medicine tank 10.

[0087] In this embodiment, as Figure 11 shown, a device under test 12 may be provided on the wafer cassette 2 of the wafer cassette adjusting device, and a level detector 13 is disposed outside the chamber opening 1101 of the upper housing 11. When the wafer cassette 2 rotates to a horizontal state and faces the chamber opening 1101, the device under test 12 is directly opposite to the level detector 13.

[0088] Meanwhile, the level detector 13 may be connected to a control device. When the control device receives the electrical signal sent by the level detector 13, the control device can determine whether the wafer cassette 2 has reached a horizontal state, so as to facilitate the next operation.

[0089] In this embodiment, as Figure 12 shown, the distance between the device under test 12 and the level detector 13 can be adjusted to adapt to the measurement stroke of the level detector 13 and achieve a more accurate recognition effect. The device under test 12 is provided with a guiding groove 121, and the wafer cassette 2 is provided with a screw 21. The screw 21 fixes the device under test 12 on the wafer cassette 2 through the guiding groove 121. When adjusting the distance between the device under test 12 and the level detector 13, loosen the screw 21 to make the guiding groove 121 slide relative to the screw 21. After determining the position of the device under test 12, tighten the screw 21.

[0090] Embodiment 4

[0091] As Figure 9 shown, an embodiment of the present application provides a wafer soaking device, including a liquid medicine tank 10 and an upper housing 11.

[0092] Among them, the liquid medicine tank 10 is used to hold the liquid medicine for soaking the wafers, and it has an upper opening. The upper shell 11 has a lower opening, and the lower opening is docked with the upper opening of the liquid medicine tank 10. The upper shell 11 is used to form a sealed cavity with the liquid medicine tank 10. A chamber opening 1101 that can be opened and closed is provided on the side of the upper shell 11 for the wafers to enter and exit. An extraction channel 1104 is provided outside the chamber opening 1101. The extraction channel 1104 is provided with a lateral extraction port 1105 and an exhaust port 1106. The lateral extraction port 1105 is used to extract the gas at the chamber opening 1101, and the exhaust port 1106 is used to discharge the gas extracted by the lateral extraction port 1105.

[0093] In this embodiment, the extraction channel 1104 is further provided with a downward liquid discharge port 1107. If the gas extracted by the lateral extraction port 1105 condenses into a liquid, it can be discharged from the liquid discharge port 1107.

[0094] In this embodiment, as Figure 9 shown, extraction channels 1104 are respectively provided on both sides of the chamber opening 1101, and the lateral extraction ports 1105 of the two extraction channels 1104 face each other, so that the gas at the chamber opening 1101 can be evacuated more timely.

[0095] In this embodiment, as Figure 9 shown, the wafer soaking device may further include a first leak-proof tray 15. The first leak-proof tray 15 is arranged on the periphery of the upper shell 11 and is located below the chamber opening 1101, and the first leak-proof tray 15 is provided with a liquid outlet 1501.

[0096] In this embodiment, as Figure 9 shown, the wafer soaking device may further include a second leak-proof tray 16, which is arranged below the liquid medicine tank 10. The liquid outlet 1501 of the first leak-proof tray 15 and the liquid discharge port 1107 of the extraction channel 1104 are respectively communicated with the second leak-proof tray 16.

[0097] The above are only the preferred embodiments of the present application and are not used to limit the present application. For those skilled in the art, various changes and modifications can be made to the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A wafer cassette adjusting device, characterized in that, Comprising: A cassette rack (1) provided with a hard limit member (100) thereon; A wafer cassette (2) pivotally connected to the cassette rack (1) through a first pivot shaft for holding wafers; A flipping mechanism connected to the wafer cassette (2) for driving the wafer cassette (2) to rotate about the first pivot shaft; the flipping mechanism includes a first driving mechanism (3) and a lifting assembly, the lifting assembly is pivotally connected to the wafer cassette (2) through a second pivot shaft, and the first driving mechanism (3) is used to drive the lifting assembly to move up and down so that the lifting assembly drives the wafer cassette (2) to rotate and makes the wafer cassette (2) rotate about the first pivot shaft; Wherein, during the rotation of the wafer cassette (2) towards the horizontal state, when the wafer cassette (2) abuts against the hard limit member (100), the wafer cassette (2) is in the horizontal state; and when the wafer cassette (2) is in the horizontal state, the lifting assembly drives the wafer cassette (2) to keep abutting against the hard limit member (100) under the drive of the first driving mechanism (3).

2. The wafer cassette adjusting device according to claim 1, wherein The lifting assembly includes a connecting rod (4), a connecting member (5) and a combined structure (6); The combined structure (6) includes a fixing frame (61), an upper plate (62), a guiding member (63) and an elastic member (64); One end of the fixing frame (61) is connected to the first driving mechanism (3), the first driving mechanism (3) is used to drive the fixing frame (61) to move up and down, the other end of the fixing frame (61) has an installation plane (601), and a first through hole (611) is provided on the installation plane (601); The upper plate (62) is located above the installation plane (601), and a second through hole (621) is provided on the upper plate (62); the guiding member (63) passes through the second through hole (621) from top to bottom and is fixedly connected to the installation plane (601), and a limiting portion (631) with a diameter larger than the second through hole (621) is provided on the upper part of the guiding member (63); The elastic member (64) is arranged between the upper plate (62) and the installation plane (601) for applying a force to the upper plate (62) to move away from the installation plane (601); The upper end of the connecting rod (4) passes through the first through hole (611) and is fixedly connected to the upper plate (62); The lower end of the connecting rod (4) is pivotally connected to the first end of the connecting member (5), and the second end of the connecting member (5) is pivotally connected to the wafer cassette (2) through the second pivot shaft.

3. The wafer cassette adjusting device according to claim 2, wherein The combined structure (6) further includes a limiting block (65), a contact sensor (66) and a control device; The limiting block (65) is installed on the installation plane (601) and is located below the upper plate (62), and the contact sensor (66) is installed on the top surface of the limiting block (65); The control device is respectively in communication connection with the contact sensor (66) and the first driving mechanism (3); When the bottom surface of the upper plate (62) contacts the contact sensor (66), the contact sensor (66) sends an electrical signal to the control device, so that the control device controls the first driving mechanism (3) to stop operating according to the electrical signal.

4. The wafer cassette adjusting device according to claim 1, wherein The hard limit member (100) is installed on the cassette rack (1) in a manner that the height position is adjustable.

5. The wafer cassette adjusting device according to claim 1, wherein, The cassette rack (1) includes two right-angled triangular frames (101). The two right-angled triangular frames (101) are arranged oppositely. The wafer cassette (2) is located between the two right-angled triangular frames (101). The two right-angled side frames of the two right-angled triangular frames (101) extend along the vertical direction and the horizontal direction respectively. The hard limit member (100) is provided on the inclined side frame of at least one of the right-angled triangular frames (101).

6. The wafer cassette adjusting device according to claim 2, characterized in that, The wafer cassette adjusting device further includes a lifting mechanism, which includes a second driving mechanism (7), a lifting seat (8) and a sleeve (9); The lifting seat (8) is installed on the second driving mechanism (7), and the second driving mechanism (7) is used to drive the lifting seat (8) to move up and down; The upper end of the sleeve (9) is fixedly connected to the lifting seat (8), and the lower end of the sleeve (9) is fixedly connected to the cassette rack (1); The first driving mechanism (3) is installed on the lifting seat (8), and the connecting rod (4) movably passes through the sleeve (9).

7. A wafer immersion device, characterized in that, Including the wafer cassette adjusting device according to any one of claims 1 to 6, further including a liquid medicine tank (10) and an upper housing (11); The liquid medicine tank (10) is used to contain the liquid medicine for soaking wafers and has an upper opening; the upper housing (11) is arranged above the liquid medicine tank (10). The upper housing (11) has a lower opening, and the lower opening is docked with the upper opening. The upper housing (11) is used to form a sealed cavity with the liquid medicine tank (10). A chamber opening (1101) that can be opened and closed is provided on the side of the upper housing (11) for wafers to enter and exit.

8. The wafer soaking device according to claim 7, wherein A measured part (12) is provided on the wafer cassette (2) of the wafer cassette adjusting device, and a level detector (13) is arranged outside the chamber opening (1101) of the upper housing (11); When the wafer cassette (2) rotates to a horizontal state and faces the chamber opening (1101), the measured part (12) is directly opposite to the level detector (13).

9. The wafer soaking device according to claim 7, characterized in that, Including a chamber door switch mechanism (14), the chamber door switch mechanism (14) includes a lifting module (1401), a horizontal displacement module (1402) and a chamber door (1403); The lifting module (1401) is installed on the outer wall of the upper housing (11) and is located above the chamber opening (1101). The horizontal displacement module (1402) is installed on the lifting module (1401), and the chamber door (1403) is installed at the output end of the horizontal displacement module (1402); Among them, the lifting module (1401) is used to drive the horizontal displacement module (1402) to move up and down in the height direction, and the horizontal displacement module (1402) is used to drive the chamber door (1403) to move horizontally to approach or move away from the chamber opening (1101).

10. The wafer soaking device according to claim 7, wherein, A suction channel (1104) is provided outside the chamber opening (1101). The suction channel (1104) is provided with a lateral suction port (1105) and an exhaust port (1106). The lateral suction port (1105) is used to suck the gas at the chamber opening (1101), and the exhaust port (1106) is used to discharge the gas sucked by the lateral suction port (1105).

11. The wafer soaking device according to claim 10, characterized in that, The suction channel (1104) is further provided with a liquid discharge port (1107).

12. The wafer soaking device according to claim 11, wherein, It further includes a first anti-leakage tray (15). The first anti-leakage tray (15) is arranged on the periphery of the upper shell (11) and is located below the chamber opening (1101), and the first anti-leakage tray (15) is provided with a liquid outlet (1501).

13. The wafer soaking device according to claim 12, wherein, It further includes a second anti-leakage tray (16), which is arranged below the liquid medicine tank (10); The liquid outlet (1501) and the liquid discharge port (1107) are respectively communicated with the second anti-leakage tray (16).

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