Multi-channel control circuit and control device of flow battery

Abstract

The invention provides a multi-channel control circuit and control device for a flow battery, and the circuit comprises a mainboard which is provided with a plurality of control channels, and the plurality of control channels are arranged corresponding to a plurality of battery units in the flow battery; wherein each control channel comprises a channel interface used for connecting a corresponding battery unit in the flow battery; the modular circuit is integrated by a plurality of circuit elements, and the modular circuit is vertically connected to the mainboard; and the controller is connected with the modular circuit, and the controller is connected with the corresponding battery unit in the flow battery through the channel interface. According to the multi-channel control circuit of the flow battery provided by the invention, a plurality of control channels are arranged on the mainboard, and a plurality of circuit elements of each control channel are integrated into a modular circuit which is vertically connected with the mainboard, so that the area of the mainboard is reduced, the heat dissipation efficiency is improved, and miniaturization of a control device is facilitated.

Description

Technical Field

[0001] The present invention relates to the technical field of flow batteries, and particularly to a multi-channel control circuit and a control device for a flow battery. Background Art

[0002] With the development of energy storage technologies, flow battery technologies have emerged. Flow batteries can be used to generate and store electrical energy. The stack is the core component of a flow battery, and the stack is composed of a positive electrode, a negative electrode, an electrolyte, a current collector, etc. The energy storage method of a flow battery is to convert chemical energy into electrical energy. The positive electrode and the negative electrode in the flow battery are isolated by the electrolyte, but the electrolyte can conduct ions. During the battery charging process, a chemical reaction converts the stored energy into electrical energy and generates a voltage between the electrodes. During the discharging process, the battery releases the stored energy, and the chemical reaction is reversed to convert electrical energy into chemical energy.

[0003] In order to ensure the normal operation of the flow battery, it is necessary to control the balance of the input and output currents of each battery unit (CELL) of the stack through a control circuit. Due to the large number of battery units in the stack, there are problems such as high current and poor heat dissipation when the control circuit controls multiple battery units simultaneously, which is not conducive to the large-scale production of flow batteries. Summary of the Invention

[0004] Based on this, in view of the problems in the above background art, it is necessary to provide a multi-channel control circuit for a flow battery, which can at least avoid high current and poor heat dissipation of the control circuit and improve the performance of the control circuit.

[0005] To achieve the above object and other related objects, one aspect of the present application provides a multi-channel control circuit for a flow battery, including: a main board, on which a plurality of control channels are provided, and the plurality of control channels are correspondingly arranged with a plurality of battery units in the flow battery; wherein, each control channel includes: a channel interface for connecting the corresponding battery unit in the flow battery; a modular circuit, which is integrated by a plurality of circuit elements, and the modular circuit is vertically connected to the main board; a controller, which is connected to the modular circuit, and the controller is connected to the corresponding battery unit in the flow battery through the channel interface.

[0006] In one embodiment, the number of control channels provided on the main board is greater than or equal to the number of battery units in the flow battery.

[0007] In one embodiment, the plurality of circuit elements of the modular circuit at least include power elements, and the controller controls the current and / or voltage of the corresponding battery unit in the flow battery by controlling the power of the power elements.

[0008] In one embodiment, each control channel further includes a vertical mounting interface, and the modular circuit is detachably connected to the main board via the vertical mounting interface. By detachably connecting the modular circuit to the main board, when the modular circuit is damaged, it can be directly replaced, avoiding the need to replace the entire main board.

[0009] In one embodiment, the vertical mounting interface includes: a pad, the current carrying capacity of the pad is a first current, and the mechanical strength of the pad is a first strength; a solder reinforcement groove, the solder reinforcement groove is provided in the middle area of the pad, the current carrying capacity of the pad and the solder reinforcement groove is a second current, the ratio of the second current to the first current is greater than 1.3, the mechanical strength of the pad and the solder reinforcement groove is a second strength, and the ratio of the second strength to the first strength is greater than 1.2. By providing a solder reinforcement groove on the pad, not only can the current carrying capacity be increased, but also the mechanical strength can be enhanced, improving the safety performance of the circuit and ensuring the stable connection between the modular circuit and the main board.

[0010] In one embodiment, the main board includes main board lines for connecting a plurality of vertical mounting interfaces, and the current carrying capacity of the main board lines is greater than 10A.

[0011] In one embodiment, the main board includes channel lines for connecting the channel interfaces, modular circuits, and controllers of each control channel.

[0012] In one embodiment, the modular circuit includes a heat dissipation surface and a connection surface, the area of the heat dissipation surface is larger than the area of the connection surface, power components are arranged on the heat dissipation surface, and pin ends are arranged on the connection surface for connection to the main board.

[0013] In one embodiment, the number of control channels is greater than 20, and the multiple control channels are arranged in a matrix on the main board.

[0014] On the other hand, the present invention provides a control device for a flow battery, including the multi-channel control circuit of the flow battery described in any one of the above.

[0015] According to the multi-channel control circuit and control device of the flow battery provided by the present invention, a plurality of control channels are arranged on the main board, and the multiple circuit elements of each control channel are integrated into a modular circuit and vertically connected to the main board, reducing the area of the main board, improving the heat dissipation efficiency, and facilitating the miniaturization of the control device. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] To better describe and illustrate the embodiments and / or examples of those applications disclosed herein, one or more drawings may be referred to. Additional details or examples used to describe the drawings should not be considered as limiting the scope of any of the disclosed applications, the currently described embodiments and / or examples, and the currently understood best mode of these applications.

[0017] Figure 1 Schematic diagram of the structure of a multi-channel control circuit of a flow battery provided in an embodiment;

[0018] Figure 2A Schematic diagram of the structure of a modular circuit provided in an embodiment;

[0019] Figure 2B Front view of a modular circuit provided in an embodiment;

[0020] Figure 2C Top view of a modular circuit provided in an embodiment;

[0021] Figure 2D Side view of a modular circuit provided in an embodiment;

[0022] Figure 3A Schematic diagram of the structure of a vertical mounting interface provided in an embodiment;

[0023] Figure 3B Front view of a vertical mounting interface provided in an embodiment;

[0024] Figure 3C Top view of a vertical mounting interface provided in an embodiment;

[0025] Figure 3D Side view of a vertical mounting interface provided in an embodiment.

[0026] Explanation of reference numerals:

[0027] 100, main board; 110, main board circuit; 200, control channel; 210, channel interface; 220, modular circuit; 221, power element; 230, controller; 240, vertical mounting interface; 241, pad; 242, solder reinforcement groove. Detailed implementation manners

[0028] For ease of understanding of this application, the following will describe this application more comprehensively with reference to the relevant drawings. Preferred embodiments of this application are shown in the drawings. However, this application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, these embodiments are provided to make the disclosure of this application more thorough and comprehensive.

[0029] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field to which this application belongs. The terms used in the specification of this application herein are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0030] The purpose of the terms used herein is only to describe specific embodiments and is not a limitation of the present application. As used herein, the singular forms "a", "an" and "the" are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the terms "comprising" and / or "including", when used in this specification, identify the presence of the stated features, integers, steps, operations, elements and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or groups. As used herein, the term "and / or" includes any and all combinations of the related listed items.

[0031] It should be noted that the diagrams provided in this embodiment only illustrate the basic concept of the present application in a schematic manner. Although only the components related to the present application are shown in the diagrams and are not drawn according to the number, shape and size of the components in actual implementation, the types, quantities and proportions of the components in actual implementation can be arbitrarily changed, and the component layout type may also be more complex.

[0032] In the prior art, the control circuit of the flow battery adopts a conventional printed circuit board (PCB) flat design. Therefore, the area of the circuit board is large, the heat dissipation effect is poor, and the line width is limited. As a result, the entire control device has a large volume, poor heat dissipation, and unstable performance. When a single channel is damaged, the entire printed circuit board needs to be scrapped, and the cost is extremely high.

[0033] In view of the above problems, the present invention provides a multi-channel control circuit for a flow battery, as Figure 1 shown, including:

[0034] A main board 100, on which a plurality of control channels 200 are provided, and the plurality of control channels are correspondingly arranged with a plurality of battery units in the flow battery;

[0035] Wherein, each control channel 200 includes:

[0036] A channel interface 210 for connecting to the corresponding battery unit in the flow battery;

[0037] A modular circuit 220, which is integrated by a plurality of circuit elements, and the modular circuit is vertically connected to the main board 100;

[0038] A controller 230, the controller 230 is connected to the modular circuit 220, and the controller 230 is connected to the corresponding battery unit in the flow battery via the channel interface 210.

[0039] In one embodiment, the main board 100 employs a printed circuit board (PCB) substrate. The PCB substrate can be at least one of a rigid PCB, a flexible printed circuit (FPC), and a substrate for semiconductor packaging. Further, conductive lines and electrodes connected to the conductive lines are also formed on the PCB substrate. Specifically, the conductive lines formed on the PCB substrate at least include channel lines (not shown) and main board lines 110. Among them, the channel lines are used to connect the components in each control channel 200. For example, the connection between the channel interface 210, the modular circuit 220, and the controller 230 is realized through the channel lines. The main board lines 110 are used to connect different control channels 200. Refer to Figure 3A As shown, the mutual connection of multiple vertical mounting interfaces 240 is realized through the main board lines 110. When the modular circuit 220 is mounted to the vertical mounting interface 240, the mutual connection of multiple modular circuits 220 is realized.

[0040] In one embodiment, the control channels 200 provided on the main board 100 are independent signal channels. The number of control channels 200 provided on the main board 100 is greater than or equal to the number of battery cells (CELL) in the flow battery. Specifically, when the number of battery cells in the flow battery is 30, the number of control channels 200 provided on a single main board is also 30, and the number of control channels 200 is equal to the number of battery cells in the flow battery, so that the control channels 200 are arranged in one-to-one correspondence with the battery cells in the flow battery. Further, the number of control channels 200 can also be redundantly designed. For example, when the number of battery cells in the flow battery is 30, the number of control channels 200 provided on a single main board is made greater than 30, such as 32, 35, or 40. In this way, when some control channels fail, there are still enough available control channels to be arranged in correspondence with the battery cells in the flow battery.

[0041] In one embodiment, the multi-channel control circuit of the flow battery provided by the present invention is applicable to a flow battery having a plurality of battery cells (CELLs), and the number of control channels is generally greater than 20. On the one hand, the number of control channels provided in the multi-channel control circuit of the flow battery should not be too small. When the number of control channels is only a single digit, such as 3 or 5, since the control circuit only controls a single-digit number of battery cells (CELLs), even if the control circuit of the flow battery adopts a tiled design, it usually will not cause problems such as high current in the control circuit and poor heat dissipation. Moreover, if the integration level of the multi-channel control circuit is low, it is not conducive to the miniaturization of the control device. On the other hand, the number of control channels should also be adapted to the development of the flow battery. Since the number of battery cells in the current flow battery is usually 30 and is developing towards 60 or more, the number of control channels in the multi-channel control circuit of the flow battery should also reach 30, 60 or more accordingly.

[0042] In one embodiment, a plurality of control channels 200 are arranged in a matrix on the main board 100. Specifically, the arrangement of the plurality of control channels 200 on the main board 100 is multi-row and multi-column. Taking 30 control channels as an example, when arranged in a single row and multi-column layout, that is, 30 control channels are arranged horizontally in a row, it is not conducive to the heat dissipation of the modular circuit 220; when arranged in a multi-row and single-column layout, that is, 30 control channels are connected longitudinally in a line, it is not conducive to the integration and miniaturization of the control device. The 30 control channels arranged in a multi-row and multi-column layout can be arranged in a 2×15 (2 rows and 15 columns) or 3×10 (3 rows and 10 columns) layout, or other layout methods can also be used, which are not limited here. Further, when the plurality of control channels 200 are arranged in a multi-row and multi-column layout, each row and each column are aligned with each other to achieve the matrix arrangement of the plurality of control channels 200 on the main board 100. By arranging the plurality of control channels in a multi-row and multi-column matrix layout, the balance of the control circuit in terms of heat dissipation and integration can be achieved, and the performance of the control circuit can be improved.

[0043] In one embodiment, each control channel 200 includes at least one channel interface 210 to connect to the corresponding battery cell in the flow battery. The channel lines formed on the PCB substrate realize the connection between the channel interface 210, the modular circuit 220 and the controller 230. Therefore, the modular circuit 220 is connected to the corresponding battery cell in the flow battery through the channel interface 210, and the controller 230 is connected to the corresponding battery cell in the flow battery through the channel interface 210.

[0044] In one embodiment, refer to Figures 2A to 2DAs shown, the modular circuit 220 integrated by multiple circuit elements is a whole structure and is vertically connected to the main board 100, that is, the modular circuit 220 is perpendicularly connected to the main board 100. By vertically connecting the modular circuit 220 to the main board 100, the area of the connection surface between the modular circuit 220 and the main board 100 can be made smaller than the area of the heat dissipation surface of the modular circuit 220. Taking the modular circuit 220 as a cuboid as an example, the modular circuit 220 includes a first side length, a second side length, and a third side length, where the first side length is greater than the second side length, and the second side length is greater than the third side length. Since the surface formed by the first side length and the second side length is the largest surface among the six surfaces of the cuboid, the surface formed by the first side length and the second side length serves as the heat dissipation surface and not as the connection surface. The connection surface can be selected as the smallest surface formed by the second side length and the third side length, or the surface formed by the first side length and the third side length. In Figures 2A to 2D the illustrated embodiment, the first side length serves as the length of the cuboid, the second side length serves as the height of the cuboid, the third side length serves as the width of the cuboid, the surface formed by the first side length and the second side length serves as the heat dissipation surface, and the surface formed by the first side length and the third side length serves as the connection surface.

[0045] In one embodiment, referring to Figures 2A to 2D as shown, the multiple circuit elements at least include a power element 221, and the power element 221 is disposed on the heat dissipation surface of the modular circuit 220. Specifically, the heat dissipation surface includes two opposite surfaces, and one or more power elements can be respectively disposed on the two surfaces, and the positions of the power elements can also be set as needed. Further, the surface of the power element 221 can be flush with the heat dissipation surface, can protrude from the heat dissipation surface, or can be set to penetrate through the two heat dissipation surfaces, which is not limited here. In Figures 2A to 2D the illustrated embodiment, two power elements are disposed on each heat dissipation surface, and the positions of the power elements disposed on the opposite surfaces are the same, and the power element 221 protrudes from the plane of the heat dissipation surface.

[0046] In the modular circuit 220, the power element 221 is the main heat-generating element. Therefore, by disposing the power element 221 on the heat dissipation surface of the modular circuit 220, it is beneficial to the heat dissipation of each modular circuit 220 on the entire main board 100. By integrating multiple circuit elements into the modular circuit 220 and vertically connecting it to the main board 100, a three-dimensional space is formed for heat dissipation, and the heat dissipation efficiency can be increased by more than 50%, and even reach about 65%. In addition, by integrating multiple circuit elements into the modular circuit 220, the area of the main board 100 is also reduced, and the area of the main board 100 can be reduced by more than 30%, and even reach about 45%. This not only improves the heat dissipation efficiency of the control circuit, but also is beneficial to the miniaturization of the control device.

[0047] In one embodiment, the modular circuit 220 further includes pin ends disposed on the connection surface of the modular circuit 220. The pin ends of the modular circuit 220 protrude from the connection surface to enable connection of the modular circuit 220 to the main board 100 through the pin ends. The pin ends include metal pins for connecting to wires (such as channel lines, main board lines) in the main board 100, and the height of the pin ends is less than or equal to the thickness of the main board 100. To ensure a stable connection between the modular circuit 220 and the main board 100, the height of the pin ends is at least greater than half of the thickness of the main board 100. In Figure 2B and Figure 2D the example shown, the height of the pin ends of the modular circuit 220 is the same as the thickness of the main board 100.

[0048] In one embodiment, the power of the power element 221 is related to the current and voltage of the corresponding battery cell in the flow battery. Therefore, the controller 230 can adjust the voltage and / or current of the corresponding battery cell in the flow battery by adjusting the power of the power element 221.

[0049] In one embodiment, referring to Figures 3A to 3D shown, each control channel further includes a vertical mounting interface 240. The modular circuit 220 is connected to the main board 100 via the vertical mounting interface 240. The connection between the modular circuit 220 and the main board 100 can be a fixed connection or a detachable connection. The connection methods of the fixed connection include but are not limited to welding, and the connection methods of the detachable connection include but are not limited to plugging. By detachably connecting the modular circuit 220 to the main board 100, when the modular circuit 220 fails, the faulty modular circuit 220 can be directly disassembled and a new modular circuit 220 can be installed, avoiding the situation of replacing the entire main board due to a local fault.

[0050] In one embodiment, since the multi-channel control circuit of the present application includes multiple control channels, such as more than 20 control channels, the current of the wires (such as channel lines and main board lines) in the main board 100 is very large and can reach 10 A. Therefore, the current carrying capacity of the wires (such as channel lines and main board lines) in the main board 100 is greater than 10 A. Since the line width of the wires (such as channel lines and main board lines) in the main board 100 is positively correlated with the current carrying capacity, the current carrying capacity can be increased by increasing the width of the wires (such as channel lines and main board lines) in the main board 100. Since multiple circuit elements originally disposed on the PCB substrate are integrated into the modular circuit 220, the wires originally formed on the PCB substrate are correspondingly simplified, and space for widening the wires can be provided on the PCB substrate. Specifically, the width of the wires (such as channel lines and main board lines) in the main board 100 can be increased by 30% to increase the current carrying capacity and improve the electrical performance of the control circuit.

[0051] In addition, the material of the conductors (such as channel lines and main board lines) in the main board 100 can be conductive metals such as aluminum, copper, and gold. In this embodiment, the conductors (such as channel lines and main board lines) in the main board 100 are copper foil lines.

[0052] In one embodiment, referring to Figure 3A With Figure 3C As shown, the vertical mounting interface 240 includes a pad 241, and the pad 241 is used to connect the pin ends of the modular circuit 220 to the conductors (such as channel lines and main board lines) in the main board 100. Since the current-carrying capacities of the conductors (such as channel lines and main board lines) in the main board 100 are all greater than 10A, the current-carrying capacity of the pad 241 for the conductors (such as channel lines and main board lines) in the main board 100 is also greater than 10A. The area of the pad is positively correlated with the current-carrying capacity of the pad. Therefore, the current-carrying capacity can be increased by increasing the area of the pad. However, the area of the pad 241 needs to be smaller than the area of the connection surface of the modular circuit 220.

[0053] In one embodiment, referring to Figure 3A With Figure 3C As shown, the vertical mounting interface 240 further includes a solder reinforcement groove 242, and the solder reinforcement groove 242 is provided in the middle area of the pad 241. The solder reinforcement groove 242 can be formed by soldering processes such as wave soldering. By forming the solder reinforcement groove 242 in the middle area of the pad 241, on the one hand, the current-carrying capacity can be increased. For example, when the vertical mounting interface 240 only has the pad 241, the current-carrying capacity of the pad 241 is the first current. When the solder reinforcement groove 242 is formed in the middle area of the pad 241, the current-carrying capacity of the pad 241 and the solder reinforcement groove 242 is the second current, and the second current is greater than 10A. By providing the solder reinforcement groove 242 on the pad 241, the current-carrying capacity can be increased by at least 30%. Therefore, the ratio of the current-carrying capacity of the pad and the solder reinforcement groove (i.e., the second current) to the current-carrying capacity of the pad (i.e., the first current) is greater than 1.3, such as 1.35, 1.5, 1.8, etc. Further, the solder reinforcement groove 242 can be used as a solder support reinforcement rib to increase the mechanical strength of the vertical mounting. For example, when the vertical mounting interface 240 only has the pad 241, the mechanical strength of the pad 241 is the first strength. When the solder reinforcement groove 242 is formed in the middle area of the pad 241, the mechanical strength of the pad 241 and the solder reinforcement groove 242 is the second strength. By providing the solder reinforcement groove 242 on the pad 241, the mechanical strength can be increased by at least 20%. Therefore, the ratio of the mechanical strength of the pad and the solder reinforcement groove (i.e., the second strength) to the mechanical strength of the pad (i.e., the first strength) is greater than 1.2, such as 1.25, 1.3, 1.5, etc.

[0054] In one embodiment, the depth of the vertical mounting interface 240 can penetrate the main board 100 or can be set to match the pin ends of the modular circuit 220. In Figure 3B and Figure 3D the illustrated embodiment, the vertical mounting interface 240 penetrates the main board 100. In this way, regardless of how the height of the pin ends of the modular circuit 220 is set, the connection between the modular circuit 220 and the main board 100 can be achieved.

[0055] Since the flow battery stack includes multiple battery cells (CELLs), the control circuit for the flow battery in this application adopts a multi-channel design. That is, multiple control channels 200 are provided on the main board 100, and the multiple control channels 200 are independent of each other, avoiding the situation where the entire main board is scrapped due to the damage of a single control channel. Due to the large number of battery cells (CELLs) in the flow battery, in order to set the control channels 200 on the main board 100 in one-to-one correspondence with the multiple battery cells in the flow battery, the number of control channels 200 provided on the main board 100 needs to be greater than or equal to the number of battery cells (CELLs) in the flow battery. In this way, the number of control channels 200 provided on the main board 100 is usually greater than 20. When the number of control channels 200 provided on the main board 100 is large, it will cause various problems such as an increase in the area of the main board, a decrease in the heat dissipation effect, and an increase in the line current. In order to simultaneously reduce the area of the main board and improve the heat dissipation effect, in this application, multiple circuit elements are integrated into a modular circuit 220. The modular circuit 220 is vertically connected to the main board 100 as a whole structure, transforming the control circuit from a planar design to a three-dimensional design, and the area of the main board can be reduced by more than 30%. The modular circuit 220 vertically connected to the main board 100 is arranged in a matrix, which not only increases the heat dissipation space and improves the heat dissipation efficiency, but also can further promote the heat dissipation between the modular circuits 220 through auxiliary devices such as air cooling. For the situation of increased line current, when the control single circuit adopts a planar design, due to the complex circuit line conditions of the control circuit, the width of the line is limited. In this application, by forming the modular circuit 220, the circuit in the main board is simplified, providing space for increasing the line width. Therefore, this application can increase the current-carrying capacity by increasing the width of the conductors (such as channel lines and main board lines) in the main board 100, so that the current-carrying capacity of each line on the main board 100 exceeds 10A. For the connection between the modular circuit 220 and the main board 100, in order to increase the current-carrying capacity at the vertical mounting interface 240, a solder reinforcement groove 242 is provided in the middle area of the pad 241. The solder reinforcement groove 242 can not only increase the current-carrying capacity by at least 30%, but also increase the mechanical strength by at least 20%, not only improving the safety performance of the circuit, but also enabling a stable connection between the modular circuit 220 and the main board 100.

[0056] The present invention also provides a control device for a flow battery, including the multi-channel control circuit of the flow battery as described above. Among them, the multi-channel control circuit of the flow battery includes:

[0057] A main board 100, on which a plurality of control channels 200 are provided, and the plurality of control channels are correspondingly arranged with a plurality of battery units in the flow battery;

[0058] Among them, each control channel 200 includes:

[0059] A channel interface 210 for connecting to the corresponding battery unit in the flow battery;

[0060] A modular circuit 220, which is integrated by a plurality of circuit elements, and the modular circuit is vertically connected to the main board 100;

[0061] A controller 230, the controller 230 is connected to the modular circuit 220, and the controller 230 is connected to the corresponding battery unit in the flow battery via the channel interface 210.

[0062] According to the multi-channel control circuit and control device of the flow battery provided by the present invention, a plurality of control channels are provided on the main board, and the plurality of circuit elements of each control channel are integrated into a modular circuit and vertically connected to the main board, reducing the area of the main board, improving the heat dissipation efficiency, and facilitating the miniaturization of the control device.

[0063] Please note that the above embodiments are only for illustrative purposes and do not imply any limitation to this application.

[0064] Each embodiment in this specification is described in a progressive manner. The key point of each embodiment is to illustrate the differences from other embodiments. The same or similar parts among the embodiments can be referred to each other.

[0065] The technical features of the above-described embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope described in this specification.

[0066] The above-described embodiments only represent several implementation manners of this application. The description is relatively specific and detailed, but it should not be construed as a limitation to the scope of the patent application. It should be noted that for those of ordinary skill in the art, without departing from the concept of this application, several deformations and improvements can still be made, and these all belong to the protection scope of this application.

Claims

1. A multi-channel control circuit for a flow battery, characterized in that: include: A main board, wherein a plurality of control channels are arranged on the main board, and the plurality of control channels are arranged corresponding to a plurality of battery cells in the flow battery; Wherein, each of the control channels comprises: A channel interface, used to connect corresponding battery cells in the flow battery; A modular circuit, wherein the modular circuit is integrated with a plurality of circuit elements and the modular circuit is vertically connected to the main board; A controller is connected to the modular circuit, and the controller is connected to the corresponding battery cell in the liquid flow battery via the channel interface.

2. The multi-channel control circuit of a flow battery according to claim 1, characterized in that: The number of control channels arranged on the main board is greater than or equal to the number of battery cells in the flow battery.

3. The multi-channel control circuit of a flow battery according to claim 1, characterized in that: The plurality of circuit elements of the modular circuit include at least a power element, and the controller controls the current and / or voltage of a corresponding battery cell in the flow battery based on controlling the power of the power element.

4. The multi-channel control circuit of a flow battery according to claim 1, characterized in that: Each of the control channels further includes a vertical mounting interface, and the modular circuit is detachably connected to the main board via the vertical mounting interface.

5. The multi-channel control circuit of a flow battery according to claim 4, characterized in that: The vertical installation interface includes: A pad, wherein the current carrying capacity of the pad is a first current, and the mechanical strength of the pad is a first strength; A solder reinforcement groove, wherein the solder reinforcement groove is arranged in the middle area of ​​the pad, the current carrying capacity of the pad and the solder reinforcement groove is a second current, the ratio of the second current to the first current is greater than 1.3, the mechanical strength of the pad and the solder reinforcement groove is a second strength, and the ratio of the second strength to the first strength is greater than 1.

2.

6. The multi-channel control circuit of a flow battery according to claim 4, characterized in that: The mainboard includes a mainboard circuit, and the mainboard circuit is used to connect a plurality of the vertical mounting interfaces. The current carrying capacity of the mainboard circuit is greater than 10A.

7. The multi-channel control circuit of a flow battery according to claim 1, characterized in that: The main board includes channel lines, and the channel lines are used to connect the channel interfaces, modular circuits and controllers of each control channel.

8. The multi-channel control circuit of a flow battery according to claim 3, characterized in that: The modular circuit includes a heat dissipation surface and a connection surface. The area of ​​the heat dissipation surface is larger than that of the connection surface. The power element is arranged on the heat dissipation surface. The connection surface is provided with pin ends for connecting with a mainboard.

9. The multi-channel control circuit of a flow battery according to claim 1, characterized in that: The number of the control channels is greater than 20, and the multiple control channels are arranged in a matrix on the mainboard.

10. A control device for a flow battery, characterized in that: A multi-channel control circuit comprising the liquid flow battery according to any one of claims 1 to 9.

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