Full-wave dipole with a new feeding method

Abstract

The present invention discloses a full-wave dipole with a novel feeding method, which comprises a radiation metal plate, a coaxial cable and a coupling feeding plate; the coupling feeding plate is arranged opposite to and spaced from the radiation metal plate in parallel, and the coaxial cable is electrically connected to the coupling feeding plate to feed the radiation metal plate; wherein, the coupling feeding plate comprises symmetric coupling parts arranged orthogonally; each symmetric coupling part comprises a pair of coupling surfaces, correspondingly coupling a pair of oscillator arms of the radiation metal plate; the overlapping coupling area between the coupling surface and the oscillator arm accounts for 10-15% of the area of the oscillator arm. The full-wave dipole with the novel feeding method provided by the present invention has a relatively wide operating bandwidth, the bandwidth ratio is as high as 33%, the radiation pattern converges and the gain is relatively high, and the gain is 9.8db-10.3db in the frequency band of 690Mhz-960Mhz.

Description

Technical Field

[0001] The present invention relates to the technical field of antennas, and particularly to a full-wave dipole with a novel feeding method. Background Art

[0002] The existing feeding methods for full-wave dipoles mainly include direct feeding and coupled balun feeding.

[0003] Among them, for the full-wave dipole with the direct feeding method, the ground layer and the core of the coaxial cable 1' are respectively connected to two dipole arms 2' for feeding, as Figure 17 shown. Although the structure is simple and the cost is low, due to the presence of the dielectric plate, the loss is large, and thus the gain is low.

[0004] For the full-wave dipole with the coupled balun feeding method, a quarter-wavelength open circuit line is used to couple to the balun 3' to feed the dipole arms 2', as Figure 21 shown, which shows an integrally die-cast full-wave dipole with the balun-coupled feeding method. Although the structure is simple and the gain is high, it requires mold opening and electroplating, which not only have high costs and are not environmentally friendly, but also have a narrow bandwidth, about 16%. Because the operating frequency is determined by its physical length (the length is about one wavelength), its resonant frequency range is narrow. When the frequency deviates from the resonant point, the impedance matching and radiation efficiency of the antenna will decrease significantly, resulting in a limited effective bandwidth; this resonant characteristic makes the integrally die-cast full-wave dipole can only maintain high-efficiency radiation within a narrow frequency range. Summary of the Invention

[0005] In order to solve the above problems, the present invention provides a full-wave dipole with a novel feeding method.

[0006] To achieve the above object, the present invention adopts the following technical solutions:

[0007] A full-wave dipole with a novel feeding method, which includes a radiation metal plate, a coaxial cable, and a coupled feeding plate; the coupled feeding plate is relatively parallel and spaced apart from the radiation metal plate, and the coaxial cable is electrically connected to the coupled feeding plate to feed the radiation metal plate; wherein,

[0008] the coupled feeding plate includes symmetric coupling parts arranged orthogonally; each symmetric coupling part includes a ground coupling surface and a feeding coupling surface arranged diagonally, correspondingly coupling a pair of dipole arms of the radiation metal plate; the overlapping coupling area S between the coupling surface and the dipole arm accounts for 10-15% of the area of the dipole arm.

[0009] Further, the ground coupling surface and the feeding coupling surface arranged diagonally are coupled through a microstrip line; the core of the coaxial cable is welded to the feeding hole on the microstrip line connected to the ground coupling surface.

[0010] Further, the coupled feed board further includes a dielectric board. The symmetric coupling parts arranged orthogonally include two pairs of front coupling surfaces and two pairs of back coupling surfaces formed on the front and back sides of the dielectric board respectively. Along the thickness direction of the dielectric board, the coupling surfaces of the two pairs of front coupling surfaces and the two pairs of back coupling surfaces overlap each other and are electrically connected.

[0011] Further, the coupled feed board is fixedly and insulatingly connected under the radiation metal plate. The radiation metal plate and the coupled feed board are parallel to each other and there is a gap therebetween.

[0012] Further, at least one through hole is formed on each of the coupling surfaces.

[0013] Further, an insulating board is arranged between the coupled feed board and the radiation metal plate.

[0014] Further, the coupling surface is a copper-clad surface formed on the dielectric board and its shape is square.

[0015] Further, there is a gap between adjacent coupling surfaces.

[0016] Further, it further includes an oscillator base for connecting the end of the coaxial cable far from the coupled feed board to the reflection metal plate.

[0017] Further, the radiation metal plate is an integrally formed aluminum metal plate.

[0018] The present invention has the following beneficial effects:

[0019] The full-wave oscillator with the novel feeding method provided by the present invention has a relatively wide operating bandwidth, and the bandwidth ratio is as high as 33%. The radiation pattern converges and the gain is relatively high, and there is a gain of 9.8 dB - 10.3 dB in the frequency band of 690 MHz - 960 MHz.

[0020] The radiation metal plate made of aluminum metal plate has high chemical stability and strong corrosion resistance of aluminum metal, and also has advantages in terms of cost compared with traditional die-cast oscillators. It eliminates multiple processes such as mold opening and electroplating, and greatly reduces the cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 is a schematic structural diagram of the full-wave oscillator of the present invention;

[0022] Figure 2 is another schematic structural diagram of the full-wave oscillator of the present invention;

[0023] Figure 3 is Figure 2 the top view of;

[0024] Figure 4 is Figure 2 exploded view;

[0025] Figure 5 is Figure 2 The enlarged schematic view of part A in

[0026] Figure 6 The front view schematic of the coupling feed board of the present invention;

[0027] Figure 7 The back view schematic of the coupling feed board of the present invention;

[0028] Figure 8 is Figure 2 The front view of the full-wave dipole shown schematically;

[0029] Figure 9 is Figure 8 The enlarged schematic view of part B in

[0030] Figure 10 The top view of the radiation metal plate of the present invention;

[0031] Figure 11 The structural schematic of the coupling feed board, coaxial cable and oscillator base of the present invention;

[0032] Figure 12 The circuit path diagram of the full-wave dipole simulation test of the through-hole-free coupling feed board of the present invention;

[0033] Figure 13 The circuit path diagram of the full-wave dipole simulation test of the coupling feed board with through holes of the present invention;

[0034] Figure 14 The standing wave diagram of the full-wave dipole simulation test of the novel feeding method of the present invention;

[0035] Figure 15 The radiation pattern diagram of the full-wave dipole simulation test of the novel feeding method of the present invention;

[0036] Figure 16 The gain data diagram of the full-wave dipole simulation test of the novel feeding method of the present invention;

[0037] Figure 17 The structural schematic of the full-wave dipole of the existing direct feeding method;

[0038] Figure 18 The standing wave diagram of the full-wave dipole simulation test of the existing direct feeding method;

[0039] Figure 19 The radiation pattern diagram of the full-wave dipole simulation test of the existing direct feeding method;

[0040] Figure 20 The gain data diagram of the full-wave dipole simulation test of the existing direct feeding method;

[0041] Figure 21 It is a schematic structural diagram of a full-wave dipole with an existing balun feeding method;

[0042] Figure 22 It is a standing wave diagram of a simulation test of a full-wave dipole with an existing balun feeding method;

[0043] Figure 23 It is a radiation pattern of a simulation test of a full-wave dipole with an existing balun feeding method;

[0044] Figure 24 It is a gain data diagram of a full-wave dipole with an existing balun feeding method in a real test. Specific implementation manners

[0045] To enable those skilled in the art to better understand the solution of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0046] Please refer to Figure 1-11 , which shows a full-wave dipole with a new feeding method. Figure 2 is Figure 1 a schematic structural diagram without showing the reflective metal plate 6. As Figure 2-11 shown, the full-wave dipole with the new feeding method includes a radiation metal plate 1, a coaxial cable 2, and a coupling feeding plate 3; the coupling feeding plate 3 is relatively parallel and spaced apart from the radiation metal plate 1, and the coaxial cable 2 is electrically connected to the coupling feeding plate 3 to feed the radiation metal plate 1.

[0047] The coupling feeding plate 3 includes a dielectric plate 31 and symmetric coupling parts 32, 33 provided on the dielectric plate 31 and arranged orthogonally; each pair of symmetric coupling parts 32, 33 includes grounded coupling surfaces 32a, 33a and feeding coupling surfaces 32b, 33b arranged diagonally (32a and 32b are a pair, 33a and 33b are a pair, the same below), corresponding to coupling a pair of dipole arms 11a, 11b, 12a, 12b of the radiation metal plate 1; wherein, the overlapping coupling area S between each coupling surface 32a, 32b, 33a, 33b and each dipole arm 11a, 11b, 12a, 12b accounts for 10-15% of the area of each dipole arm 11a, 11b, 12a, 12b.

[0048] Exemplarily, please refer to Figure 6, the ground coupling surfaces 32a, 33a and the feed coupling surfaces 32b, 33b are coupled through the microstrip line 34; the core 21 of the coaxial cable 2 is welded to the feed hole 35 on the microstrip line 34 connected to the ground coupling surfaces 32a, 33a. Designed in this way, in the feeding part, compared with the traditional feeding method, it has a larger coupling area S, can provide more resonant points, and thus realizes a wider operating bandwidth. At the same time, in the grounding part, the coupling area S is also increased, which can better balance the current on the oscillator and make it easier for the oscillator to achieve impedance matching. Moreover, the proportion of the coupling area S should not be too large. After exceeding 15%, the standing wave performance will deteriorate.

[0049] Exemplarily, please refer to Figure 6 , located on the same layer of the dielectric substrate 31, there are gaps 36 between the adjacent coupling surfaces 32a, 32b, 33a, 33b to achieve impedance matching. Preferably but not limited to, the width of the gap 36 is 1 - 5 mm, and it can be 1 mm, 2 mm, 3 mm, 4 mm, 5 mm, etc.

[0050] Exemplarily, on one side surface of the dielectric substrate 31, such as the front surface 31a, there are symmetric coupling parts 32, 33 arranged orthogonally. Since there are no symmetric coupling parts 32, 33 on the back surface 31b, there will be an extra layer of dielectric, resulting in losses. To solve this problem, symmetric coupling parts 32, 33 arranged orthogonally can be provided on both side surfaces of the dielectric substrate 31, that is, on the front surface 31a of the dielectric substrate 31, there are two pairs of front coupling surfaces and on the back surface 31b, there are two pairs of back coupling surfaces. Please refer to Figure 6 , 7 . Each pair of front coupling surfaces and each pair of back coupling surfaces each include the ground coupling surfaces 32a, 33a and the feed coupling surfaces 32b, 33b arranged diagonally. In the thickness direction of the dielectric substrate 31, the respective coupling surfaces 32a, 32b, 33a, 33b of the two pairs of front coupling surfaces and the two pairs of back coupling surfaces overlap each other and are electrically conducted through metal vias. Designed in this way, the loss of the dielectric substrate 31 to the gain can be reduced to achieve higher gain.

[0051] Exemplarily, please refer to Figure 6 , 7 , the metal vias include the first metal via 37 and the second metal via 38; the ground coupling surfaces 32a, 33a located on the front and back surfaces 31a, 31b of the dielectric substrate 31 and corresponding to each other are electrically conducted through the first metal via 37; the feed coupling surfaces 32b, 33b located on the front and back surfaces 31a, 31b of the dielectric substrate 31 and corresponding to each other are electrically conducted through the second metal via 38.

[0052] Exemplarily, the coupling surfaces 32a, 32b, 33a, and 33b are copper-clad surfaces formed on the dielectric substrate 31, and their shapes can be square or other shapes, that is, they can be flexibly set, or other polygons that satisfy the aforementioned symmetry characteristics.

[0053] Exemplarily, please refer to Figure 6 、 7 On the same pair of front coupling surfaces, one end of the microstrip line 34 is connected to the ground coupling surfaces 32a and 33a, and the other end extends or extends through a via to the feed hole 35. The feed hole 35 is located at the concave position of the diagonal of the feed coupling surfaces 32b and 33b close to the ground coupling surfaces 32a and 33a, but is not connected to the feed coupling surfaces 32b and 33b. In the +45° direction, the microstrip line 34 is the first microstrip line 341, one end is directly connected to the diagonal of the ground coupling surfaces 32a and 33a, and the other end extends to connect to the feed hole 35 and is coupled to the feed coupling surfaces 32b and 33b. In the -45° direction, the microstrip line 34 includes a second microstrip line 342 and a third microstrip line 343. One end of the second microstrip line 342 is connected to the feed hole 35 and is coupled to the feed coupling surfaces 32b and 33b; the other end is connected to the metallized via 439. One end of the third microstrip line 343 located on the reverse side 31b of the dielectric substrate 31 is connected to the metallized via 439, and the other end is connected to the ground coupling surfaces 32a and 33a located on the reverse side 31b of the dielectric substrate 31 and is conducted to the ground coupling surfaces 32a and 33a located on the front side 31a of the dielectric substrate 31 through a metal via.

[0054] Exemplarily, please refer to Figure 6 、 7 The feed hole 35 is located on one side of the front side 31a of the dielectric substrate 31, and the first solder dip 351 is provided at its edge. The core 21 of a coaxial cable 2 passes through the feed hole 35 and is welded to the first solder dip 351 for feeding the feed coupling surfaces 32b and 33b in two polarization directions, and then the feed coupling surfaces 32b and 33b are used to couple and feed the oscillator arms 11a, 11b, 12a, and 12b. The feed hole 35 is located on one side of the reverse side 31b of the dielectric substrate 31, and the second solder dip 352 is provided at its edge. The shield 22 of a coaxial cable 2 abuts against the second solder dip 352 and is welded together, and the core 21 provided in the shield 22 passes through the feed hole 35 and is welded to the first solder dip 351. The first metal via 37 is located on one side of the reverse side 31b of the dielectric substrate 31, and the third solder dip 371 is provided at its edge. The shields 22 of other coaxial cables 2 are welded to the third solder dip 371, but the cores 21 do not pass through the first metal via 37. Specifically, the shields 22 of the four coaxial cables 2 are welded to the second solder dip 352 and the third solder dip 371 to connect and support the coupling feed plate 3 and the radiation metal plate 1, that is, one side of the coaxial cable 2 is vertically connected to the coupling feed plate 3.

[0055] Exemplarily, please refer to Figure 8 and 9 . The coupling feed board 3 and the radiation metal board 1 are arranged parallel to each other at intervals. The coupling feed board 3 is fixedly and insulatingly connected under the radiation metal board 1, preferably but not limited to being fixedly connected to the radiation metal board 1 through insulating rivets. Specifically, please refer to Figure 1-7 . Through holes 4 are provided on both the coupling feed board 3 and the radiation metal board 1 to facilitate the insulating rivets to pass through and rivet the coupling feed board 3 to the radiation metal board 1. Further, at least one through hole 4 is provided on each of the coupling surfaces 32a, 32b, 33a, 33b. In specific implementation, one through hole 4, two through holes 4, three through holes 4, etc. are provided on each of the coupling surfaces 32a, 32b, 33a, 33b, and corresponding through holes 4 of the same number are also provided on the oscillator arms 11a, 11b, 12a, 12b. With such a structural design, opening holes on the oscillator arms 11a, 11b, 12a, 12b and the coupling surfaces 32a, 32b, 33a, 33b can increase the current path to a certain extent while fixing each other, thereby increasing the resonance points and expanding the frequency bandwidth. As Figure 12 shows, this figure is the current path simulated without opening holes on the coupling surface. However, if the current path can be extended, the frequency bandwidth can be broadened. As Figure 13 shows, by opening through holes 4 on the coupling surfaces 32a, 32b, 33a, 33b, the current will flow around the through holes 4. As can be seen from Figure 12 and 13 , obviously the current path is increased. Therefore, the through holes 4 can serve two purposes, ensuring both electrical performance and reliability.

[0056] Exemplarily, the coupling feed board 3 and the radiation metal board 1 can be fixedly connected by insulating rivets (not shown in the figure) passing through the through holes 4, not only being parallel to each other but also having a gap 7. As Figure 9 shows, the height of the gap 7 can be 0.1 - 0.4 mm. Due to the gap between the coupling feed board 3 and the radiation metal board 1, a parasitic capacitance will be generated, and the parasitic capacitance will increase the electrical length, further improving the working bandwidth of the oscillator. Preferably, an insulating board (not shown in the figure) is provided between the coupling feed board 3 and the radiation metal board 1 to make them parallel and insulated from each other, that is, an insulating board is selected to fill the gap 7. Preferably but not limited to, the insulating board is selected from thin insulating boards with a lower dielectric constant, such as an insulating board with a thickness of 0.1 - 0.4 mm, which is convenient for insulating the coupling feed board 3 and the radiation metal board 1 and can reduce intermodulation.

[0057] Exemplarily, please refer to Figure 4 and 10, the radiation metal plate 1 is an integrally formed aluminum metal plate. The radiation metal plate 1 has two symmetric oscillators 11, 12 arranged orthogonally. Each pair of symmetric oscillators 11, 12 includes two oscillator arms 11a, 11b, 12a, 12b arranged diagonally. Fine slits 13 are provided between adjacent oscillator arms 11a, 11b, 12a, 12b. Hollow portions 14 are provided inside the oscillator arms 11a, 11b, 12a, 12b. The hollow portions 14 and the fine slits 13 are mainly for proper impedance matching and isolation optimization. In this embodiment, the radiation metal plate 1 can be composed of four oscillator arms 11a, 11b, 12a, 12b with heart-shaped-like hollows connected end to end. It can be understood that other oscillator arm structures of 11a, 11b, 12a, 12b are also possible. Specifically, the symmetric oscillators 11, 12 are directly formed by stamping on the aluminum metal plate at one time without a dielectric plate 31. It should be noted that slits can also be formed on the entire aluminum plate. Using the aluminum metal plate to form the radiation metal plate 1, aluminum has high chemical stability and strong corrosion resistance. In terms of cost, it also has advantages compared with traditional die-cast oscillators, eliminating multiple processes such as mold opening and electroplating, and greatly reducing costs.

[0058] Exemplarily, please refer to Figure 10 , each oscillator arm 11a, 11b, 12a, 12b includes a first L-shaped arm 16 and a second L-shaped arm 17. As shown in the figure, after the radiation metal plate 1 is fixedly connected to the coupling feeding plate 3 in the vertical direction, the first L-shaped arm 16 serves as a coupling area and overlaps with the coupling surfaces 32a, 32b, 33a, 33b. The two second L-shaped arms 17 are respectively connected to the outer sides of the two ends of the first L-shaped arm 16. The ends of the two second L-shaped arms 17 away from the first L-shaped arm 16 are arranged close to each other and are both connected with support arms 18. Both support arms 18 have hypotenuses 181, and the hypotenuses 181 of the two support arms 18 are arranged opposite to each other at intervals and in parallel. As shown in the figure, the first L-shaped arm 16, the second L-shaped arm 17 and the support arm 18 enclose a hollow portion 14. The first L-shaped arms 16 of the four oscillator arms 11a, 11b, 12a, 12b are arranged orthogonally to enclose a central hollow 15 to expose the welding area of the coupling feeding plate 3, which is used for welding connection with the wire core 21 of the coaxial cable 2.

[0059] Exemplarily, please refer to Figure 1 , 2, 4, 5, 11, this application includes four coaxial cables 2, all of which have a coaxially arranged core 21 and a shielding layer 22, and the shielding layer 22 is wrapped around the outer periphery of the core 21. The cores 21 and the shielding layers 22 of two of the coaxial cables 2 are of the same length and are the first group of coaxial cables. The two ends of the shielding layer 22 are respectively welded to the solder deposits (the second solder deposit 352 and the third solder deposit 371) on the reverse side 31b of the coupling feed plate 3 and the fifth solder deposit of the oscillator base 5, and the cores 21 are not welded. The cores 21 of the other two coaxial cables 2 are longer than the shielding layers 22 and are the second group of coaxial cables. The two ends of each core 21 extend outwards on both sides of the shielding layer 22 respectively, facilitating welding and feeding respectively with the first solder deposit 351 of the coupling feed plate 3 and the fourth solder deposit 52 of the oscillator base 5, as Figure 5 , 11 shown; the two ends of the shielding layer 22 of the second group of coaxial cables are respectively welded to the solder deposits (the second solder deposit 352 and the third solder deposit 371) on the reverse side 31b of the coupling feed plate 3 and the fifth solder deposit of the oscillator base 5.

[0060] Exemplarily, please refer to Figure 1 , 2 , 4, 11, this application includes an oscillator base 5. Two fourth solder deposits 52 are provided in the copper foil surface 51 on the plane of the oscillator base 5 away from the coupling feed plate 3, which are respectively welded to the two cores 21 and can be welded to two polarized external feed networks. The fourth solder deposits 52 are insulated from the copper foil surface 51; four fifth solder deposits are provided in the copper foil surface 51 on the plane of the oscillator base 5 facing the coupling feed plate 3, which are respectively welded to the four shielding layers 22 of the coaxial cable 2, realizing the vertical connection between the coaxial cable 2 and the oscillator base 5. The copper foil surfaces 51 on different surfaces of the oscillator base 5 are electrically connected to each other through metallized holes.

[0061] The oscillator base 5 is fixedly connected to the reflective metal plate 6 through an insulating rivet (not shown in the figure), preferably but not limited to being fixedly connected to the reflective metal plate 6 through an insulating rivet (not shown in the figure). Specifically, openings are provided on both the oscillator base 5 and the reflective metal plate 6 to facilitate the insulating rivet (not shown in the figure) to pass through and rivet the oscillator base 5 to the reflective metal plate 6.

[0062] Exemplarily, the dielectric plates 31 of the coupling feed plate 3 and the oscillator base 5 are epoxy plates. It can be understood that the coupling feed plate 3 and the oscillator base 5 are made of a PCB board using a Fr4 epoxy plate.

[0063] The assembly process of the full-wave dipole with the novel feeding method of the present invention is as follows: First, both sides of the coaxial cable 2 are respectively welded to the coupling feeding plate 3 and the dipole base 5. Specifically, the two ends of the cores 21 of the two coaxial cables 2 respectively pass through the feeding holes 35 of the coupling feeding plate 3 and the dipole base 5 and are welded to the first solder pad 351 and the fourth solder pad 52. The shielding layers 22 of the four coaxial cables are respectively abutted and welded to the second solder pad 352, the third solder pad 371 and the fifth solder pad on the coupling feeding plate 3 and the dipole base 5. Through the coaxial cable 2, the coupling feeding plate 3 and the dipole base 5 are parallel to each other, and both the coupling feeding plate 3 and the dipole base 5 are perpendicular to the coaxial cable 2; Then, after placing the insulating plate behind the coupling feeding plate 3, the coupling feeding plate 3 is riveted and fixedly connected to the radiation metal plate 1 through insulating rivets, and the insulating plate is located between the coupling feeding plate 3 and the radiation metal plate 1; Finally, the dipole base 5 is riveted and fixedly connected to the reflection metal plate 6 through insulating rivets.

[0064] Please refer to Figure 14-16 , it can be seen from the standing wave pattern that the bandwidth of the full-wave dipole with this novel feeding method is 0.69 - 0.96 GHz. It can be observed that the bandwidth is very wide, and the bandwidth ratio is as high as 33%, while the bandwidth ratio of the full-wave dipole with the existing direct feeding method is about 29% (as Figure 18 shown); the bandwidth ratio of the full-wave dipole with the existing balun feeding method is about 16% (as Figure 22 shown). It can be seen from the radiation pattern that the direction Figure 1 is consistent and relatively convergent. From the gain data, it can be seen that within this frequency band, the gain data shows that the gain is relatively high, with a gain of 9.8 db - 10.3 db in the 690 MHz - 960 MHz frequency band (as Figure 16 shown), which is basically close to the gain of the full-wave dipole with the existing balun feeding method (as Figure 24 shown), while the full-wave dipole with the existing direct feeding method only has a gain of 9.17 - 9.94 db (as Figure 20 shown).

[0065] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention.

[0066] In addition, the terms "first" and "second" are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise specifically defined.

[0067] In the present invention, unless otherwise clearly specified and defined, terms such as "mounted", "connected", "connected to", "fixed" and the like should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection, an electrical connection or communicable with each other; it may be directly connected, or indirectly connected through an intermediate medium, and may be the communication inside two elements or the interaction relationship between two elements, unless otherwise clearly defined. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0068] Obviously, the embodiments described above are only a part of the embodiments of the present application, rather than all embodiments. The preferred embodiments of the present application are given in the drawings, but do not limit the patent scope of the present application. The present application can be implemented in many different forms. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present application more thorough and comprehensive. Although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing specific embodiments, or perform equivalent replacements for some of the technical features. Any equivalent structure directly or indirectly using the content of the specification and drawings of the present application in other related technical fields shall be similarly within the scope of patent protection of the present application.

Claims

1. A full-wave dipole with a new feeding method, characterized in that, It includes a radiation metal plate, a coaxial cable, and a coupling feeding plate; the coupling feeding plate is relatively parallel and spaced from the radiation metal plate, and the coaxial cable is electrically connected to the coupling feeding plate to feed the radiation metal plate; wherein, the coupling feeding plate includes symmetric coupling parts arranged orthogonally; each symmetric coupling part includes a ground coupling surface and a feeding coupling surface arranged diagonally, corresponding to coupling a pair of oscillator arms of the radiation metal plate; the overlapping coupling area S between the ground coupling surface or the feeding coupling surface and the oscillator arm accounts for 10-15% of the area of the oscillator arm; the coupling feeding plate further includes a dielectric plate, and the symmetric coupling parts arranged orthogonally include two pairs of front coupling surfaces and two pairs of back coupling surfaces formed on the front and back sides of the dielectric plate respectively; along the thickness direction of the dielectric plate, the coupling surfaces of the two pairs of front coupling surfaces and the two pairs of back coupling surfaces overlap each other and are electrically connected; at least one through hole is formed on each coupling surface.

2. The full-wave dipole with the novel feeding method according to claim 1, characterized in that The diagonally arranged ground coupling surface and feeding coupling surface are coupled through a microstrip line; the core of the coaxial cable is welded to the feeding hole on the microstrip line connected to the ground coupling surface.

3. The full-wave dipole with the novel feeding method according to claim 1, characterized in that, The coupling feeding plate is fixedly and insulatingly connected under the radiation metal plate, and there is a gap between the radiation metal plate and the coupling feeding plate and they are parallel to each other.

4. The full-wave dipole with the novel feeding method according to claim 1, characterized in that An insulating plate is arranged between the coupling feeding plate and the radiation metal plate.

5. The full-wave dipole with the novel feeding method according to claim 1, characterized in that, The coupling surface is a copper-clad surface formed on the dielectric plate, and its shape is square.

6. The full-wave dipole with the novel feeding method according to claim 1, characterized in that, There is a gap between adjacent coupling surfaces.

7. The full-wave dipole with the novel feeding method according to any one of claims 1 to 6, characterized in that It further includes an oscillator base for connecting the end of the coaxial cable far from the coupling feeding plate to the reflection metal plate.

8. The full-wave dipole with the novel feeding method according to claim 1, characterized in that, The radiation metal plate is an integrally formed aluminum metal plate.

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