Ring main unit with heat dissipation structure

Abstract

The invention discloses a ring main unit with a heat dissipation structure, and belongs to the technical field of ring main unit equipment. The device mainly comprises a ring main unit, the ring main unit is provided with a side plate, and the side plate is provided with a heat dissipation window; the frame body is provided with a window; the side cabinet is provided with a fan; the liquid cooling mechanism comprises a liquid cooling plate, the liquid cooling plate is provided with a liquid cooling frame installed on the seat plate, a liquid cooling net is arranged in the middle of the liquid cooling frame, the liquid cooling net is formed by uniformly arranging a plurality of layers of criss-cross cooling pipes which are communicated end to end, and uniform air holes for air flow to pass through are formed among the plurality of layers of criss-cross cooling pipes. According to the ring main unit with the heat dissipation structure, by arranging the fan and the liquid cooling assembly, the ring main unit can be cooled in a cooling mode of combining air cooling and liquid cooling, and meanwhile, the liquid cooling assembly can continuously cool the hot air flow, so that the hot air flow is prevented from flowing into surrounding air at a relatively high temperature, and the heat dissipation efficiency is improved. Therefore, the overall heat dissipation of the ring main unit is facilitated.

Description

Technical Field

[0001] This application relates to the technical field of ring main unit equipment, and specifically relates to a ring main unit with a heat dissipation structure. Background Art

[0002] A ring network refers to a looped distribution network, that is, the power supply main line forms a closed loop. The power supply feeds power to this looped main line, and then distributes power outward through high-voltage switches one by one from the main line. A ring main unit is to install a switch cabinet (outgoing switch cabinet) for each distribution branch. The busbar of this switch cabinet is at the same time a part of the looped main line. That is to say, the looped main line is jointly composed of the busbars of each outgoing cabinet, and each outgoing cabinet is called a ring main unit;

[0003] A ring main unit is a set of high-voltage switchgear, usually installed in a metal or non-metal insulated cabinet, or made into a prefabricated sectionalized ring network power supply unit. Its core part uses a load switch and a fuse, and has the advantages of simple structure, small volume, low price, and can improve power supply parameters and performance as well as power supply safety. It is widely used in distribution substations and box-type substations in load centers such as urban residential areas, high-rise buildings, large public buildings, and industrial enterprises;

[0004] A ring main unit is an intelligent power distribution device in the power system, suitable for cooperating with an intelligent power grid and a new power system, and has functions such as fault analysis and data analysis. The inside of the ring main unit contains a large number of cables, wires, and electrical components using environmentally friendly materials, with the characteristics of low carbon, energy saving, reducing energy consumption and pollution;

[0005] As one of the common devices in the power system, with the continuous increase of its power, the heat generated by the ring main unit is also increasing. In order to improve the reliability and safety of the ring main unit, it is necessary to perform reasonable heat dissipation treatment on the ring main unit. Otherwise, it will affect its normal operation. Therefore, it is necessary to provide a ring main unit with a heat dissipation structure to solve the above problems.

[0006] It should be noted that the above information disclosed in this background art section is only used to understand the background art of the concept of this application, and therefore, it may include information that does not constitute the prior art. Summary of the Invention

[0007] Based on the above problems existing in the prior art, the problem to be solved by this application is: to provide a ring main unit with a heat dissipation structure, achieving the effect of timely heat dissipation for the ring main unit.

[0008] The technical solution adopted by the present application to solve its technical problems is as follows: A ring main unit with a heat dissipation structure, including a ring main unit, which has side plates, and heat dissipation windows for heat dissipation are provided on the side plates; a frame body, on which a window is provided; a side cabinet, on the side of which a fan is installed; a liquid cooling mechanism, which is arranged inside the side cabinet between the frame body and the fan. The liquid cooling mechanism includes: a baffle, which is installed on the frame body; a seat plate, which is installed on the side of the baffle close to the frame body; a liquid cooling plate, which has a liquid cooling frame installed with the seat plate. A liquid cooling net is arranged in the middle of the liquid cooling frame. The liquid cooling net is uniformly arranged by multiple layers of cooling pipes that are crisscrossed and connected end to end. Uniform ventilation holes for air flow to pass through are formed between the multiple layers of crisscrossed cooling pipes; wherein, an inlet pipe and an outlet pipe are provided on the liquid cooling frame, and both the inlet pipe and the outlet pipe are communicated with the cooling pipes in the liquid cooling net, so as to introduce and export the external refrigerant.

[0009] Further, multiple groups of cylinders are installed at the bottom of the side cabinet, and a base is provided at the output end of the cylinders; the base is in sealed sliding connection with the inner wall of the side cabinet; a cleaning plate is installed on the side of the base away from the cylinders, and convex platforms adapted to the ventilation holes are provided on the cleaning plate.

[0010] Further, a guide post is installed on the base, and a second lug is installed at the other end of the liquid cooling frame. The guide post is adapted to pass through the second lug, and a spring is installed between the second lug and the base. The spring is sleeved on the outer circle of the guide post; an avoidance hole is provided on the baffle.

[0011] Further, a second gap is formed between multiple groups of the convex platforms, heat dissipation holes communicated with the second gap are provided on the bottom surface of the cleaning plate, and a through groove communicated with the heat dissipation holes is provided on the base.

[0012] Further, a first lug is installed on one side of the liquid cooling frame, a rod assembly is provided at the lower end of the first lug, a bracket is installed on the base, and a slideway assembly is installed on the bracket. The slideway assembly is adapted to approach or move away from the rod assembly and is adapted to cooperate with the rod assembly to control the position of the cleaning plate.

[0013] Further, the rod assembly includes a seat body installed on the first lug, a rod body is rotatably installed at the lower end of the seat body, a sphere is fixedly installed at the lower end of the rod body, and the sphere has elasticity.

[0014] Further, the slideway assembly includes a sliding plate installed on the bracket. The sliding plate has a first slideway arranged vertically. A second slideway is connected to the lower end of the first slideway. The second slideway is an inclined slideway, and the bottom of the second slideway is lower than the bottom of the first slideway. The end of the second slideway is connected to an inclined third slideway. The bottom of the third slideway is lower than the bottom of the second slideway. A first stagnation point is provided at the connection of the second slideway and the third slideway, and the first stagnation point is located in the third slideway.

[0015] The ring main unit with a heat dissipation structure provided by this application has the following beneficial effects:

[0016] 1. By providing a fan and a liquid cooling component, the ring main unit can be cooled by a combined air cooling and liquid cooling method. At the same time, the liquid cooling component can continuously cool the hot air flow, thereby preventing the hot air flow from flowing into the surrounding air at a relatively high temperature, and thus being beneficial to the overall heat dissipation of the ring main unit.

[0017] 2. By providing a cylinder and a cleaning plate, the liquid cooling component can be cleaned when needed. And during the cleaning, only the liquid cooling component is blocked for a short time, so it will not have too much impact on the heat dissipation of the ring main unit.

[0018] 3. By providing a rod assembly, a slideway assembly and a bottom plate 23 that cooperate with each other, during the process of blocking the liquid cooling component, the impurities cleaned can be discharged, thereby purifying the hot air flow space.

[0019] In addition to the purposes, features and advantages described above, this application has other purposes, features and advantages. The following will refer to the drawings to make a further detailed description of this application. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The specification drawings constituting a part of this application are used to provide a further understanding of this application. The schematic embodiments of this application and their descriptions are used to explain this application and do not constitute an improper limitation to this application.

[0021] In the drawings:

[0022] Figure 1 is the overall schematic diagram of a ring main unit with a heat dissipation structure in this application;

[0023] Figure 2 is Figure 1 the exploded structure schematic diagram of the heat dissipation mechanism in;

[0024] Figure 3 is Figure 2 the overall structure schematic diagram of the liquid cooling component in; Figure 1 ;

[0025] Figure 4 is Figure 2 the overall structural schematic diagram of the liquid cooling component in Figure 2 ;

[0026] Figure 5 is Figure 2 the partial structural schematic diagram at position A in

[0027] Figure 6 is Figure 3 the partial structural schematic diagram at position B in

[0028] Figure 7 is Figure 3 the partial structural schematic diagram at position C in

[0029] Figure 8 is Figure 4 the partial structural schematic diagram at position D in

[0030] Figure 9 is Figure 7 the overall structural schematic diagram of the rod component in

[0031] Figure 10 is Figure 7 the overall structural schematic diagram of the slideway component in

[0032] Among them, the reference numerals in the figure are as follows:

[0033] 1, ring main unit; 11, side plate; 12, frame; 121, window;

[0034] 2, heat dissipation mechanism; 21, side cabinet; 22, fan; 23, bottom plate; 231, low - level plate; 232, high - level plate; 233, inclined plate;

[0035] 3, liquid cooling mechanism; 31, base; 311, through - slot; 32, cylinder; 33, seat plate; 34, baffle; 341, avoidance hole; 35, liquid cooling plate; 351, liquid cooling frame; 352, liquid cooling net; 353, inlet pipe; 354, first lug; 355, second lug; 356, outlet pipe; 36, support; 37, guide post; 38, cleaning plate; 381, boss; 382, heat dissipation hole; 39, spring;

[0036] 4, rod component; 41, seat body; 42, rod body; 43, sphere;

[0037] 5, slideway component; 51, slide plate; 52, first slideway; 53, second slideway; 54, third slideway; 55, fourth slideway; 56, fifth slideway; 57, first stagnation point; 58, second stagnation point; 59, third stagnation point. Specific embodiments

[0038] It should be noted that, without conflict, the embodiments in the present application and the features in the embodiments may be combined with each other. The following will describe the present application in detail with reference to the accompanying drawings and in combination with the embodiments.

[0039] In order to enable those skilled in the art to better understand the solution of the present application, the following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

[0040] Embodiment 1:

[0041] As Figure 1 shown, the present application provides a ring main unit with a heat dissipation structure, including a ring main unit 1, which is arranged in a distribution substation and a box-type substation at the load center such as urban residential quarters, high-rise buildings, large public buildings, and factory enterprises, and is mainly used for power supply;

[0042] As Figure 1 - Figure 2 shown, a side plate 11 is arranged on the ring main unit 1, and a heat dissipation window (not shown in the figure) for heat dissipation is arranged on the side plate 11, so that the heat generated in the ring main unit 1 can be transported to the outside through the heat dissipation window, and then the effect of reducing the temperature of the ring main unit 1 is achieved to maintain the normal operation of the ring main unit 1;

[0043] In order to further improve the heat dissipation effect of the ring main unit 1, a heat dissipation mechanism 2 is also arranged on the side plate 11. The heat dissipation mechanism 2 is arranged at the position of the heat dissipation window to accelerate and cool the hot air flow flowing out of the heat dissipation window. Specifically:

[0044] As Figure 1 - Figure 2 shown, the heat dissipation mechanism 2 includes a frame body 12 fixedly installed on the side plate 11. A window 121 corresponding to the heat dissipation window is arranged on the frame body 12. At the same time, a side cabinet 21 is also fixedly installed on the side plate 11. The side cabinet 21 is arranged on the outer circle of the frame body 12 to completely wrap the frame body 12, and a fan 22 is installed on the side of the side cabinet 21. When the fan 22 works, it is adapted to discharge the hot air flow led out from the window 121 into the surrounding air through the fan 22;

[0045] Because the surrounding air and the ring main unit 1 are in the same environment, if the temperature of the surrounding air rises, the cooling speed of the ring main unit 1 will also decrease. Therefore, it is necessary to cool the hot air discharged from the ring main unit 1. As Figure 2 - Figure 4As shown, a liquid cooling mechanism 3 is provided inside the side cabinet 21 between the frame 12 and the fan 22. The liquid cooling mechanism 3 includes a baffle 34 fixedly mounted on the frame 12. A seat plate 33 is fixedly mounted on a side of the baffle 34 close to the frame 12. A liquid cooling plate 35 is mounted on a side of the seat plate 33 close to the frame 12. The liquid cooling plate 35 is adapted to the window 121 and is used to cool the hot air flow derived from the window 121.

[0046] like Figure 3 - Figure 4 and Figure 6 As shown, the liquid cooling plate 35 includes a liquid cooling frame 351 fixedly mounted on the seat plate 33, and a liquid cooling net 352 is arranged in the middle of the liquid cooling frame 351. The liquid cooling net 352 is formed by evenly arranging multiple layers of cooling pipes that are crisscrossed and connected end to end. It can be understood that a uniform first gap (hereinafter referred to as an air hole) for air flow to pass through is formed between the multiple layers of crisscrossed cooling pipes, and a through square hole (not marked in the figure) is arranged in the middle of the baffle 34 and the seat plate 33, so that the hot air flow derived from the window 121 can reach the position of the fan 22 through the air hole and the square hole;

[0047] In order to cool the hot air flow passing through the liquid cooling network 352, a liquid inlet pipe 353 and a liquid outlet pipe 356 are provided on the liquid cooling frame 351. The liquid inlet pipe 353 and the liquid outlet pipe 356 are both connected to the cooling pipe in the liquid cooling network 352, so that the external refrigerant can be introduced through the liquid inlet pipe 353 and input into the cooling pipe. When the refrigerant is transported in the cooling pipe, it can contact and exchange heat with the hot air flow passing through, thereby cooling the hot air flow. After the heat exchange of the refrigerant is completed, it is discharged through the liquid outlet pipe 356. The refrigerant is input in such a cycle to continuously cool the hot air flow, thereby preventing the hot air flow from flowing into the surrounding air at a higher temperature, which is beneficial to the overall heat dissipation of the ring network cabinet 1.

[0048] Embodiment 2:

[0049] During the long-term cooling process of the liquid cooling network 352, the air holes may be blocked by impurities such as dust. Mild blockage does not affect the heat dissipation function of the liquid cooling network 352. However, when the air holes are blocked in large quantities, the hot air flow cannot smoothly pass through the air holes to exchange heat with the cooling pipes, thereby affecting the heat dissipation of the ring network cabinet 1.

[0050] In order to solve the above problems, Figure 2 and Figure 4As shown, multiple groups of cylinders 32 are fixedly installed at the bottom of the side cabinet 21. A base 31 is provided at the output end of the cylinder 32. Thus, the base 31 is adapted to approach the liquid cooling mesh 352 driven by the cylinder 32. It should be noted that the base 31 is in sealed sliding connection with the inner wall of the side cabinet 21, and the output end of the cylinder 32 contacts the base 31 in the initial state. Thus, the base 31 can approach the liquid cooling mesh 352 when the cylinder 32 extends;

[0051] To enable the base 31 to return to the initial position, as Figure 4 and Figure 8 shown, a guide post 37 is fixedly installed on the base 31. At the same time, a second lug 355 is fixedly installed at the other end of the liquid cooling frame 351. The guide post 37 is adapted to penetrate through the second lug 355, and a spring 39 is fixedly installed between the second lug 355 and the base 31. The spring 39 is sleeved on the outer circle of the guide post 37;

[0052] At the same time, an avoidance hole 341 is provided on the baffle 34 to avoid the guide post 37. Thus, driven by the cylinder 32, the base 31 is adapted to approach the liquid cooling frame 351 and compress the spring 39. And after the cylinder 32 retracts, the base 31 can be reset driven by the spring 39;

[0053] At the same time, a cleaning plate 38 is fixedly installed on the side of the base 31 away from the cylinder 32. A boss 381 adapted to the ventilation holes is provided on the cleaning plate 38. Thus, the cleaning plate 38 can move synchronously with the base 31 and pass through the ventilation holes through the boss 381 to clean the ventilation holes;

[0054] It should be noted that since the cleaning plate 38 is provided with spaced bosses 381, a second gap (not marked in the figure) is formed between multiple groups of bosses 381. At the same time, heat dissipation holes 382 communicating with the second gap are provided on the bottom surface of the cleaning plate 38, and a through groove 311 communicating with the heat dissipation holes 382 is provided on the base 31. Thus, when the cleaning plate 38 is in the initial position, hot air can be introduced in the direction of the fan 22 through the second gap and the through groove 311, and thus the heat dissipation of the ring main unit 1 will not be affected. And since the time for the boss 381 to enter the ventilation holes during cleaning is short, the short-term blockage during cleaning will not have too much impact on the heat dissipation effect of the ring main unit 1.

[0055] Embodiment 3:

[0056] Although the above method can achieve the cleaning of the liquid cooling mesh 352, however, after the liquid cooling mesh 352 is cleaned, the removed impurities will still remain in the ring main unit 1. In this way, not only will it affect the normal operation of the ring main unit 1, but also the liquid cooling mesh 352 may be blocked again in a short time;

[0057] To solve the above problems, as Figure 7 - Figure 10 shown, a first lug 354 is fixedly installed on one side of the liquid cooling frame 351. A rod assembly 4 is provided at the lower end of the first lug 354. At the same time, a bracket 36 is fixedly installed on the base 31. A slideway assembly 5 is installed on the bracket 36. The slideway assembly 5 is adapted to approach or move away from the rod assembly 4 and is adapted to cooperate with the rod assembly 4 to control the position of the cleaning plate 38. Specifically:

[0058] As Figure 9 - Figure 10 shown, the rod assembly 4 includes a seat body 41 fixedly installed on the first lug 354. A rod body 42 is rotatably installed at the lower end of the seat body 41. A sphere 43 is fixedly installed at the lower end of the rod body 42. The sphere 43 has elasticity, so that the sphere 43 can adaptively switch between steps at different heights;

[0059] The slideway assembly 5 includes a slide plate 51 fixedly installed on the bracket 36. The slide plate 51 has a first slideway 52 arranged vertically. In the initial state, the sphere 43 is located at the upper end of the first slideway 52. At this time, the cleaning plate 38 is in a position away from the liquid cooling mesh 352;

[0060] Continuing to refer to Figure 10 , a second slideway 53 is communicated with the lower end of the first slideway 52. The second slideway 53 is an inclined slideway. The bottom position of the second slideway 53 is lower than the bottom position of the first slideway 52. Thus, the sphere 43 is adapted to slide from the first slideway 52 into the second slideway 53, but cannot return from the second slideway 53 to the first slideway 52;

[0061] At the same time, an inclined third slideway 54 is communicated with the end of the second slideway 53. The bottom position of the third slideway 54 is lower than the bottom position of the second slideway 53. Thus, the sphere 43 is adapted to slide from the second slideway 53 into the third slideway 54, but cannot return from the third slideway 54 to the second slideway 53. And a first stop point 57 is provided at the connection of the second slideway 53 and the third slideway 54. The first stop point 57 is located in the third slideway 54;

[0062] And a fourth slideway 55 is communicated with the end of the third slideway 54. The fourth slideway 55 is an inclined slideway. The bottom position of the fourth slideway 55 is lower than the bottom position of the third slideway 54. Thus, the sphere 43 is adapted to slide from the third slideway 54 into the fourth slideway 55, but cannot return from the fourth slideway 55 to the third slideway 54. And a second stop point 58 is provided at the connection of the third slideway 54 and the fourth slideway 55. The second stop point 58 is located in the fourth slideway 55;

[0063] Thus, when the cylinder 32 drives the cleaning plate 38 to approach the liquid cooling frame 351, the sphere 43 synchronously enters the second slideway 53 along the first slideway 52, and reaches the first stagnation point 57 with the cylinder 32 reaching the limit position. At this time, the boss 381 on the cleaning plate 38 passes through and protrudes from the ventilation hole to clean the ventilation hole;

[0064] Then the cylinder 32 starts to retract. At this time, the cleaning plate 38 drives by the spring 39 and retracts synchronously with the base 31. However, at this time, the sphere 43 starts to move along the third slideway 54, and when the sphere 43 reaches the position of the second stagnation point 58, the sphere 43 is restricted and cannot move further;

[0065] At this time, because the slide plate 51 is hooked by the sphere 43, the cleaning plate 38 cannot move synchronously either, so that the boss 381 stays in the ventilation hole and blocks the ventilation hole;

[0066] Because the impurities generated by the cleaning of the boss 381 at this time exist in the hot air flow and cannot pass through the ventilation hole. In order to discharge the impurities, as Figure 2 and Figure 5 shown, a bottom plate 23 is fixedly installed at the inner bottom of the side cabinet 21. The bottom plate 23 is divided into a low-level plate 231 close to the liquid cooling frame 351, a high-level plate 232 close to the fan 22, and an inclined plate 233 connecting the low-level plate 231 and the high-level plate 232. Thus, in the initial state, the base 31 is in sealed contact with the high-level plate 232, and the base 31 is in sealed slideway connection with the other three inner surfaces of the side cabinet 21;

[0067] As the base 31 approaches the liquid cooling frame 351 under the action of the cylinder 32, the base 31 will slowly cross over the high-level plate 232 and reach the position of the low-level plate 231 via the inclined plate 233. At this time, a third gap (not shown in the figure) is formed between the base 31 and the low-level plate 231, and at this time the ventilation hole is blocked by the boss 381, so that the hot air flow can only flow to the position of the fan 22 through the third gap;

[0068] At the same time, the impurities generated by cleaning also flow out from the third gap along with the hot air flow, so that the chamber of the hot air flow can be purified and cleaned. The impurities entering the position of the fan 22 can be intercepted by adding a filter net on the fan 22 and removed manually later. This cleaning work is relatively easy and will not increase the burden on the staff;

[0069] In order to reset the cleaning plate 38 to release the blockage of the ventilation hole, continue to refer to Figure 10 , a fifth slideway 56 is connected to the end of the fourth slideway 55. The fifth slideway 56 is divided into a first section connected to the fourth slideway 55 and a second section connected to the first slideway 52;

[0070] The first section is a channel with the same height at the bottom of the groove, and the bottom position of the first section is lower than the bottom position of the fourth slideway 55, so that the sphere 43 is adapted to slide from the fourth slideway 55 into the first section and cannot return from the first section to the fourth slideway 55. A third stationary point 59 is provided at the connection between the fourth slideway 55 and the first section. The third stationary point 59 is located in the first section and is flush with the first stationary point 57.

[0071] At the same time, the second section is a channel with an inclined bottom of the groove. The bottom position of the second section gradually rises along the direction close to the first slideway 52, and a step is formed at the connection between the second section and the first slideway 52, so that the sphere 43 is adapted to slide from the second section into the first slideway 52 and cannot return from the first slideway 52 to the second section.

[0072] In summary, when the cylinder 32 extends again and abuts against the base 31 to move, the sphere 43 will pass through the fourth slideway 55 to reach the third stationary point 59, and when the cylinder 32 retracts, the sphere 43 will return to the initial position of the first slideway 52 through the fifth slideway 56.

[0073] At this time, the base 31 will return to the initial position under the action of the spring 39 to facilitate the next cleaning work.

[0074] The above is only the preferred embodiment of the present application and is not used to limit the present application. For those skilled in the art, various changes and modifications can be made to the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A ring main unit with a heat dissipation structure, characterized in that: include: A ring main unit (1), the ring main unit (1) having a side plate (11), the side plate (11) being provided with a heat dissipation window for heat dissipation; A frame (12), wherein a window (121) is provided on the frame (12); A side cabinet (21), a fan (22) being installed on a side of the side cabinet (21); A liquid cooling mechanism (3), the liquid cooling mechanism (3) being arranged inside the side cabinet (21) and between the frame (12) and the fan (22), the liquid cooling mechanism (3) comprising: a baffle (34), the baffle (34) being mounted on the frame (12); A seat plate (33), the seat plate (33) being mounted on a side of the baffle plate (34) close to the frame (12); A liquid cooling plate (35), the liquid cooling plate (35) having a liquid cooling frame (351) installed with the seat plate (33), a liquid cooling net (352) being arranged in the middle of the liquid cooling frame (351), the liquid cooling net (352) being formed by evenly arranged multiple layers of cooling pipes that are crisscrossed and connected end to end, and evenly arranged air holes for air flow to pass through are formed between the multiple layers of crisscrossed cooling pipes.

2. The ring main unit with a heat dissipation structure according to claim 1, characterized in that: The liquid cooling frame (351) is provided with a liquid inlet pipe (353) and a liquid outlet pipe (356), and the liquid inlet pipe (353) and the liquid outlet pipe (356) are both connected to the cooling pipe in the liquid cooling network (352) to facilitate the introduction and export of external refrigerant.

3. The ring main unit with a heat dissipation structure according to claim 2, characterized in that: A plurality of groups of cylinders (32) are installed at the bottom of the side cabinet (21), and a base (31) is provided at the output end of the cylinder (32); The base (31) and the inner wall of the side cabinet (21) are in sealed sliding connection; A cleaning plate (38) is installed on the side of the base (31) away from the cylinder (32), and a boss (381) adapted to the air hole is provided on the cleaning plate (38).

4. The ring main unit with a heat dissipation structure according to claim 3, characterized in that: A guide column (37) is installed on the base (31), a second lug (355) is installed on the other end of the liquid cooling frame (351), the guide column (37) is suitable for passing through the second lug (355), a spring (39) is installed between the second lug (355) and the base (31), and the spring (39) is sleeved on the outer ring of the guide column (37); The baffle plate (34) is provided with an avoidance hole (341).

5. The ring main unit with a heat dissipation structure according to claim 4, characterized in that: A second gap is formed between the plurality of groups of bosses (381); a heat dissipation hole (382) communicating with the second gap is provided on the bottom surface of the cleaning plate (38); and a through groove (311) communicating with the heat dissipation hole (382) is provided on the base (31).

6. The ring main unit with a heat dissipation structure according to claim 5, characterized in that: A first lug (354) is installed on one side of the liquid cooling frame (351), and a rod assembly (4) is provided at the lower end of the first lug (354). A bracket (36) is installed on the base (31), and a slide assembly (5) is installed on the bracket (36). The slide assembly (5) is suitable for approaching or moving away from the rod assembly (4) and is suitable for cooperating with the rod assembly (4) to control the position of the cleaning plate (38).

7. The ring main unit with a heat dissipation structure according to claim 6, characterized in that: The rod assembly (4) comprises a seat body (41) mounted on the first lug (354), a rod body (42) is rotatably mounted on the lower end of the seat body (41), a sphere (43) is fixedly mounted on the lower end of the rod body (42), and the sphere (43) is elastic.

8. The ring main unit with a heat dissipation structure according to claim 7, characterized in that: The slideway assembly (5) comprises a slideway (51) mounted on the bracket (36), wherein the slideway (51) has a vertically arranged first slideway (52).

9. The ring main unit with a heat dissipation structure according to claim 8, characterized in that: The lower end of the first slideway (52) is connected to a second slideway (53), the second slideway (53) is a slideway arranged at an angle, and the groove bottom position of the second slideway (53) is lower than the groove bottom position of the first slideway (52).

10. The ring main unit with a heat dissipation structure according to claim 9, characterized in that: The end of the second slideway (53) is connected to an inclined third slideway (54), the groove bottom position of the third slideway (54) is lower than the groove bottom position of the second slideway (53), and a first stagnation point (57) is provided at the connection point between the second slideway (53) and the third slideway (54), and the first stagnation point (57) is located in the third slideway (54).

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