Heat pipe backboard emergency state intelligent heat dissipation processing device and control method

Abstract

The invention relates to the technical field of heat pipe fault processing, and discloses a heat pipe backboard emergency state intelligent heat dissipation processing device and a control method. Comprising an integrated cabinet, an integrated energy storage box, a temperature sensor A, a temperature sensor B, a temperature sensor C, a first current sensor, a second current sensor, a pressure sensor A, a pressure sensor B, a pressure sensor C and the like, and a backboard fan is installed on the surface of a backboard of the integrated cabinet. Through signal transmission of the sensor, a heat pipe fault and a backboard fan fault can be automatically detected and handled, and the working state of the power supply and the connection condition of the power transmission line D can be flexibly adjusted according to the exhaust temperature of the server and the current of the power transmission line A; the electric valve can be regulated and controlled according to parameters such as the superheat degree of the refrigerant at the outlet of the heat pipe evaporator and the temperature of the refrigerant in the refrigerant liquid storage tank, energy consumption is reduced on the basis of heat safety of the server, and heat dissipation is accurate.

Description

Technical Field

[0001] The present invention relates to the technical field of heat pipe fault handling, and specifically to an intelligent heat dissipation processing device and control method for a heat pipe backplane in an emergency state. Background Technique

[0002] Compared with the traditional computer room precision air conditioning system, the heat pipe backplane used in the data center has advantages such as on-demand cooling and efficient utilization of natural cold sources, and is a cooling device that can effectively promote energy conservation and carbon reduction in the data center.

[0003] However, the existing heat pipe backplane type data centers generally have the following problems: the chilled water storage tank has a large floor area, which will, to a certain extent, cause great difficulties in the design of the data center in a composite building; in an emergency state, the conveying distance of the chilled water from the chilled water storage tank to the heat pipe condenser is long, and the heat pipe condenser cannot obtain the chilled water in the first time, resulting in a weakened condensation effect of the heat pipe condenser, thus causing a situation of too high pressure inside the heat pipe; in an emergency state, the normal operation of the power supply and distribution system of the heat pipe backplane fan depends on the multi-point monitoring carried out by a large number of sensors. If some sensors cannot work normally, the corresponding cabinet backplane fan will not be able to obtain emergency power supply, which will in turn trigger a series of accidents such as server downtime in the cabinet, resulting in serious consequences of data loss. Summary of the Invention

[0004] (1) Technical Problems to be Solved

[0005] In view of the deficiencies of the prior art, the present invention provides an intelligent heat dissipation processing device and control method for a heat pipe backplane in an emergency state to solve the problems put forward in the above background technique, that is, the chilled water storage tank has a large floor area, which will, to a certain extent, cause great difficulties in the design of the data center in a composite building; in an emergency state, the conveying distance of the chilled water from the chilled water storage tank to the heat pipe condenser is long, and the heat pipe condenser cannot obtain the chilled water in the first time, resulting in a weakened condensation effect of the heat pipe condenser, thus causing a situation of too high pressure inside the heat pipe; in an emergency state, the normal operation of the power supply and distribution system of the heat pipe backplane fan depends on the multi-point monitoring carried out by a large number of sensors. If some sensors cannot work normally, the corresponding cabinet backplane fan will not be able to obtain emergency power supply, which will in turn trigger a series of accidents such as server downtime in the cabinet, resulting in serious consequences of data loss.

[0006] (2) Technical Solutions

[0007] To achieve the above object, the present invention provides the following technical solutions: An intelligent heat dissipation processing device for a heat pipe backplane in an emergency state, comprising:

[0008] Integrated cabinet, a backplane fan is installed on the surface of the backplane of the integrated cabinet, a heat pipe evaporator is arranged near the left inner wall surface of the integrated cabinet, the backup power supply end of the backplane fan is connected to a power transmission line D, the main power supply end of the backplane fan is connected to a power transmission line A, and a first current sensor is installed on the power transmission line A;

[0009] Circulation pipeline, arranged at the gas outlet end of the heat pipe evaporator, the circulation pipeline passes through the heat pipe condenser and the integrated energy storage box and is connected to the gas inlet end of the heat pipe evaporator.

[0010] Server, arranged on the right inner wall surface of the integrated cabinet, a heat channel is arranged between the server and the heat pipe evaporator, thermocouples are evenly arranged in the area where the heat channel is located, the thermocouples together form a thermocouple array, a vertical bracket is installed on the left side of the inner cavity of the integrated cabinet, the thermocouple array is installed on the surface of the vertical bracket, a temperature sensor A and a pressure sensor A are installed at the outlet of the heat pipe evaporator, and a temperature sensor B and a pressure sensor B are installed at the outlet of the heat pipe condenser;

[0011] Integrated energy storage box, arranged on the outer side of the bottom of the integrated cabinet, a perforated partition is installed in the inner cavity of the integrated energy storage box, the internal space of the integrated energy storage box is divided into a first cavity and a second cavity by the perforated partition, a first control board is installed on the left side of the inner cavity of the first cavity, a second control board is arranged below the first control board, a power quantity sensor is installed in the middle of the inner cavity of the first cavity, a backup power supply is installed on the right side of the inner cavity of the first cavity, the interface of the backup power supply is connected to a wire, a refrigerant liquid storage tank is installed in the inner cavity of the second cavity, a pipeline A is installed on the left side of the bottom of the refrigerant liquid storage tank, a pipeline B is installed on the right side of the bottom of the refrigerant liquid storage tank, a first electric valve is installed on the pipeline A, a second electric valve is installed on the pipeline B, a temperature sensor C is installed on the upper right side of the refrigerant liquid storage tank, a pressure sensor C is installed on the lower right side of the refrigerant liquid storage tank, a third control board is installed in the lower part of the inner cavity of the second cavity, and a wire is installed on the surface of the third control board;

[0012] Power transmission line E, arranged between the main circuit of the data center and the chiller, a second current sensor is installed on the power transmission line E, and the third control board is connected to the second current sensor.

[0013] Preferably, the refrigerant liquid storage tank is communicated with the circulation pipeline through pipelines A and B respectively equipped with a first electric valve and a second electric valve, and the pipelines A and B are two completely identical pipelines.

[0014] Preferably, a power transmission line B is connected to the power supply end of the first electric valve. The power supply end of the first electric valve is connected to the standby power supply through the power transmission line B. A power transmission line C is connected to the power supply end of the second electric valve. The power supply end of the second electric valve is connected to the standby power supply through the power transmission line C. The weak electric signal receiving ends of the first electric valve and the second electric valve are both connected to the third control board through wires.

[0015] Preferably, different interfaces of the standby power supply are respectively connected to a power transmission line B, a power transmission line C, a power transmission line D, a power replenishment line and a power monitoring line.

[0016] Preferably, the head and the tail of the power transmission line B are respectively the standby power supply and the first electric valve. The head and the tail of the power transmission line C are respectively the standby power supply and the second electric valve. The head and the tail of the power transmission line D are respectively the standby power supply and the backplane fan. The power transmission line D passes through the second control board. The head and the tail of the power replenishment line are respectively the main circuit of the data center and the standby power supply. The power replenishment line passes through the first control board. The two ends of the power monitoring line are respectively the standby power supply and the power sensor. The head and the tail of the power transmission line A are respectively the main circuit of the data center and the backplane fan. The power transmission line A passes through the first current sensor. The head and the tail of the power transmission line E are respectively the main circuit of the data center and the chiller. The power transmission line E passes through the second current sensor.

[0017] Preferably, the standby power supply supplies power to the first electric valve and the second electric valve in real time through the power transmission line B and the power transmission line C.

[0018] Preferably, two small holes on the side wall of the refrigerant liquid storage tank are respectively inserted with a temperature sensor C and a pressure sensor C.

[0019] Preferably, the first control board is used to connect or disconnect the power replenishment line to realize or cut off the power replenishment of the data center main circuit to the standby power supply. The second control board is used to connect or disconnect the power transmission line D to realize or cut off the standby power supply of the standby power supply to the backplane fan. The third control board is used to send weak electric signals to the first electric valve and the second electric valve to regulate the working states of the first electric valve and the second electric valve.

[0020] Preferably, the temperature sensor A, the pressure sensor A, the temperature sensor B, the pressure sensor B, the temperature sensor C, the pressure sensor C, the second current sensor and the data center main control computer are all connected to the third control board. Each thermocouple in the first current sensor and the thermocouple array is connected to the second control board through a wire. The power sensor is connected to the first control board through a wire. The power sensor is connected to the standby power supply through the power monitoring line.

[0021] Preferably, to ensure a reasonable volume value of the integrated energy storage box, the volume of the refrigerant liquid storage tank is estimated according to the formula P×Δt = α×ρ×V r ×r, where P represents the cabinet power; Δt represents a period longer than 15 minutes; α represents a correction factor, which should be determined according to the actual heat exchange situation inside the integrated cabinet; ρ represents the density of the liquid refrigerant corresponding to the saturated temperature under the chilled water supply temperature condition recommended by the "Data Center Design Code" GB50174-2017; r represents the latent heat of vaporization of the liquid refrigerant corresponding to the saturated temperature under the chilled water supply temperature condition recommended by the "Data Center Design Code" GB50174-2017; V r represents the volume of the refrigerant liquid storage tank. For the volume of the integrated energy storage box, it is reasonably calculated based on the volume V of the refrigerant liquid storage tank r and the internal circuit structure and internal pipeline structure of the integrated energy storage box, and the volume redundancy range of the integrated energy storage box is set according to the actual size of the computer room space

[0022] Preferably, under the chilled water supply temperature condition recommended by the "Data Center Design Code" GB50174-2017, the chilled water temperature of the chiller for the heat pipe condenser is T 6,set . Under the chilled water storage condition, the chilled water supply temperature of the chiller for the heat pipe condenser is T 5,set , and the pressure of the refrigerant at the outlet of the heat pipe condenser is p 03 , p 03 corresponding refrigerant saturation temperature is T S03 , ΔT 65 =T 6,set -T 5,set , ΔT 65 The minimum value is not less than 5°C and the maximum value is not higher than 10°C

[0023] Preferably, each thermocouple in the temperature sensor A, pressure sensor A, temperature sensor B, pressure sensor B, temperature sensor C, pressure sensor C, first current sensor, second current sensor, power sensor, and thermocouple array performs data acquisition simultaneously every 10 seconds. The data center main control computer real-time obtains the operating condition information of the chilled water supply of the chiller for the heat pipe condenser and transmits the operating condition information of the chilled water supply of the chiller for the heat pipe condenser to the third control board in real time. After receiving the instruction sent by the third control board, the data center main control computer will immediately send a temperature adjustment instruction to the chiller to adjust the chilled water supply temperature T 0 to T 5,set or T 6,set, the temperature sensor A, pressure sensor A, temperature sensor B, pressure sensor B, first current sensor, power sensor, second current sensor, temperature sensor C, pressure sensor C, and thermocouple array perform data acquisition simultaneously every 10 seconds respectively, and are respectively used to monitor the temperature T of the refrigerant at the outlet of the heat pipe evaporator at the same moment 2 , the pressure p of the refrigerant at the outlet of the heat pipe evaporator 2 , the temperature T of the refrigerant at the outlet of the heat pipe condenser 3 , the pressure p of the refrigerant at the outlet of the heat pipe condenser 3 , the current I of the transmission line D 1 , the remaining power Q of the backup power supply, the current I of the transmission line E 2 , the temperature T of the refrigerant inside the refrigerant liquid storage tank 4 and the pressure p of the refrigerant inside the refrigerant liquid storage tank 4 , the server exhaust air temperature T at the positions of 6 equally spaced thermocouples in the vertical direction of the hot channel 11 , T 12 , T 13 , T 14 , T 15 , T 16 , so as to obtain the saturation temperature T of the refrigerant corresponding to p at this moment 2 , the saturation temperature T of the refrigerant corresponding to p S2 , p 3 , the saturation temperature T of the refrigerant corresponding to p S3 , p 4 , the saturation temperature T of the refrigerant corresponding to p S4 , and further obtain the superheat degree ΔT of the refrigerant at the outlet of the heat pipe evaporator at this moment 2 , the subcooling degree ΔT of the refrigerant at the outlet of the heat pipe condenser 3 , the subcooling degree ΔT of the refrigerant inside the refrigerant liquid storage tank 4 and the maximum value T in the monitoring data of the thermocouple array 1 . The ΔT 2 = T 2 - T S2 , ΔT 3 = T S3 - T 3 , ΔT 4 = T S4 - T 4 , T 1 = max{T 11 , T 12 , T 13 , T 14 , T 15 , T 16}.

[0024] Preferably, the first electric valve and the second electric valve are two electric valves with exactly the same structure and completely synchronized working states. The outer shell of the integrated energy storage box, the refrigerant liquid storage tank, the first electric valve, the second electric valve, and all pipelines are made of suitable high-temperature and high-pressure resistant materials according to the actual working conditions of the refrigerant in the circulation pipeline to ensure the safety of the integrated energy storage box and the integrated cabinet.

[0025] The control method of the intelligent heat dissipation processing device based on the heat pipe backplane in the emergency state includes three controls:

[0026] Control One:

[0027] Step S1: If I 1 = 0, then execute Step S3; otherwise, execute Step S2.

[0028] Step S2: Cut off the power transmission line D, and the backup power supply does not supply power to the backplane fan, and continue to execute Step S1.

[0029] Step S3: If T 1 ≥ T 1,set , then execute Step S4; otherwise, execute Step S5.

[0030] Step S4: Connect the power transmission line D, and the backup power supply supplies power to the backplane fan. The backplane fan runs at the rated power P fan,1 , and continue to execute Step S1.

[0031] Step S5: Connect the power transmission line D, and the backup power supply supplies power to the backplane fan. The backplane fan runs at a non-rated power P fan,2 , and continue to execute Step S1.

[0032] Specifically, Step S1 is the first step to be executed in Control One.

[0033] Specifically, the I 1 in Step S1 is the current monitoring value of the power transmission line A.

[0034] Specifically, the T 1,set in Step S3 is the server exhaust air temperature set value. In Step S3, T 1 = max{T 11 , T 12 , T 13 , T 14 , T 15 , T 16}, and the T 11 , T 12 , T 13 , T 14 , T 15 , T 16They are the monitoring values of the exhaust air temperature of the server by 6 thermocouples at different positions in the thermocouple array respectively;

[0035] Specifically, the P described in step S4 fan,1 and the P described in step S5 fan,2 satisfy P fan,1 >P fan,2 ;

[0036] Specifically, when the backup power supplies power to the backplane fan, on the basis of providing power to the first electric valve and the second electric valve in real time, the backup power can ensure that the backplane fan can operate at the rated power P fan,1 for at least 15 minutes;

[0037] Control two:

[0038] Step S1: If T 4 ≤T S03 +1°C, then execute step S2, otherwise execute step S3;

[0039] Step S2: Close the first electric valve and the second electric valve simultaneously. If ΔT 2 ≥ΔT 2,set , then execute step S3, otherwise execute step S4;

[0040] Step S3: Open the first electric valve and the second electric valve simultaneously. If I 2 ≠0, then execute step S5, otherwise execute step S6;

[0041] Step S4: If I 2 ≠0, then execute step S8, otherwise execute step S1;

[0042] Step S5: If T 0 =T 5,set , then execute step S6, otherwise execute step S7;

[0043] Step S6: If T 4 ≤T S03 , then execute step S2, otherwise execute step S3;

[0044] Step S7: The main control computer of the data center commands the chiller to gradually adjust T 0 to T 5,set , and continue to execute step S6;

[0045] Step S8: If T 0 =T 6,set , then execute step S1, otherwise execute step S9;

[0046] Step S9: The main control computer of the data center commands the chiller to adjust T 0Gradually adjust to T 6set , continue to execute step S1;

[0047] Specifically, step S1 is the first step to be executed in control two;

[0048] Specifically, the I described in step S3 and step S4 2 is the current monitoring value of the power transmission line E;

[0049] Specifically, the ΔT described in step S2 2,set and ΔT 2,set are respectively the superheat setting value of the refrigerant at the outlet of the heat pipe evaporator and the superheat monitoring value of the refrigerant at the outlet of the heat pipe evaporator;

[0050] Specifically, the T described in step S1 4 is the refrigerant temperature monitoring value inside the refrigerant liquid storage tank;

[0051] Specifically, the T described in step S5 and step S8 0 is the chilled water supply temperature of the chiller to the heat pipe condenser;

[0052] Control three:

[0053] Step S1: If Q < Q 0 , then execute step S3, otherwise execute step S2;

[0054] Step S2: Cut off the power supply replenishment line, and the main circuit of the data center does not charge the backup power supply, and continue to execute step S1;

[0055] Step S3: Connect the power supply replenishment line, and the main circuit of the data center charges the backup power supply, and continue to execute step S1;

[0056] Specifically, step S1 is the first step to be executed in control three;

[0057] Specifically, the Q and Q described in step S1 0 are respectively the remaining power monitoring value of the backup power supply and the full power of the backup power supply.

[0058] Beneficial effects

[0059] Compared with the prior art, the present invention provides a heat pipe backplane emergency state intelligent heat dissipation processing device and a control method, having the following beneficial effects:

[0060] 1. The intelligent heat dissipation processing device and control method for the heat pipe backplane in emergency state achieve intelligent control. Through the signal transmission of temperature sensors, pressure sensors, current sensors, etc., the working state of the electric valve, the working state of the backup power supply, and the connection status of the power transmission line D will be flexibly adjusted according to parameters such as the refrigerant superheat at the outlet of the heat pipe evaporator, the temperature of the refrigerant in the refrigerant liquid storage tank, the current of the power transmission line A, and the server exhaust temperature. On the basis of ensuring the prevention of overheating of the integrated cabinet, energy consumption can be reduced, and the effect can be achieved more precisely;

[0061] 2. The intelligent heat dissipation processing device and control method for the heat pipe backplane in emergency state utilize the latent heat of vaporization of the liquid refrigerant for cold storage, and the cold storage density is relatively large. When the liquid refrigerant is lacking in the circulation pipeline, the liquid refrigerant in the refrigerant liquid storage tank flows into the circulation pipeline as the valve opens. At the heat pipe evaporator, the liquid refrigerant exchanges heat with the hot air inside the integrated cabinet, releasing a large amount of cold energy, thereby reducing the heat pipe exhaust temperature and the server exhaust temperature. As the heat exchange intensity between the refrigerant and the hot air at the heat pipe evaporator recovers, and the condensation effect of the heat pipe condenser normalizes, the liquid refrigerant in the circulation pipeline gradually increases, and a large amount of cold energy is stored in the liquid refrigerant. The refrigerant liquid storage tank is gradually filled with the liquid refrigerant and is stored in the refrigerant liquid storage tank as the valve closes. Compared with the cold storage method of traditional data centers, when storing the same amount of cold energy, the volume required for cold storage by utilizing the latent heat of vaporization of the liquid refrigerant will be much smaller than the volume required for cold storage by utilizing the sensible heat of water in traditional data centers. The space occupied by the present invention is smaller, which is suitable for compound buildings such as office buildings, and the application scenarios are more extensive.

[0062] 3. The intelligent heat dissipation processing device and control method for the heat pipe backplane in emergency state have the characteristic of being able to respond in time in emergency state. After a power outage in a traditional data center, the chiller needs to wait until the power is restored to provide low-temperature chilled water for the heat pipe condenser, so as to restore the normal condensation effect of the heat pipe condenser to ensure that there is enough cold energy at the heat pipe evaporator to be delivered to the hot air inside the cabinet. Therefore, during a power outage, due to the abnormal condensation effect of the heat pipe condenser, the cold energy delivered to the hot air inside the cabinet at the heat pipe evaporator is seriously insufficient, and it is very likely that a server downtime accident will occur, resulting in partial data loss in the data center. Under the action of the present invention, it can be ensured that when the data center is in a non-emergency state, the refrigerant liquid storage tank is filled with liquid refrigerant and the first electric valve and the second electric valve are both in the closed state. After the data center enters the emergency state, if it is monitored that ΔT 2 ≥ΔT 2,setIf so, the first electric valve and the second electric valve, both in the closed state, will be opened simultaneously at the first time, and the liquid refrigerant will flow into the circulation pipeline, thereby timely providing liquid refrigerant for the heat pipe evaporator, restoring the heat exchange intensity between the refrigerant and the hot air in the heat pipe evaporator under normal conditions, and further effectively reducing the heat pipe exhaust temperature to ensure the overall heat dissipation efficiency of the device. After the data center enters the emergency state, when the backplane fan loses the power drive from the main circuit of the data center, the transmission line D will be connected at the first time, and the backup power supply in the integrated energy storage box will supply power to the backplane fan through the transmission line D, and adjust the operating power of the backplane fan according to the monitored value T1 of the server exhaust temperature, so as to timely drive the server exhaust air to pass through the heat pipe evaporator for heat exchange, effectively reducing the heat pipe exhaust temperature and the server exhaust temperature while saving a great deal of energy to a large extent. BRIEF DESCRIPTION OF THE DRAWINGS

[0063] Figure 1 is a schematic structural diagram of the present invention;

[0064] Figure 2 is a flowchart of Control One in the present invention;

[0065] Figure 3 is a flowchart of Control Two in the present invention;

[0066] Figure 4 is a flowchart of Control Three in the present invention.

[0067] In the figure: 1, backplane fan; 2, heat pipe evaporator; 3, server; 4, heat pipe condenser; 5, integrated cabinet; 6, thermocouple array; 7, hot channel; 8, circulation pipeline; 9, temperature sensor A; 10, temperature sensor B; 11, vertical bracket; 12, integrated energy storage box; 13, first electric valve; 14, second electric valve; 15, refrigerant liquid storage tank; 16, second control board; 17, pipeline A; 18, third control board; 19, first control board; 20, backup power supply; 21, first current sensor; 22, first cavity; 23, second cavity; 24, power sensor; 25, pressure sensor A; 26, pressure sensor B; 27, temperature sensor C; 28, pressure sensor C; 29, second current sensor; 30, pipeline B. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0068] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0069] The present invention provides a technical solution, a heat pipe backplane emergency state intelligent heat dissipation processing device and a control method.

[0070] Embodiment 1

[0071] Please refer to Figure 1 , an integrated cabinet 5, on the surface of the backplane of the integrated cabinet 5, a backplane fan 1 is installed, near the left inner wall surface of the integrated cabinet 5, a heat pipe evaporator 2 is provided, the standby power supply end of the backplane fan 1 is connected to a power transmission line D, the main power supply end of the backplane fan 1 is connected to a power transmission line A, and a first current sensor 21 is installed on the power transmission line A;

[0072] A circulation pipeline 8 is arranged at the air outlet end of the heat pipe evaporator 2, and the circulation pipeline 8 passes through the heat pipe condenser 4 and the integrated energy storage box 12 and is connected to the air inlet end of the heat pipe evaporator 2.

[0073] A server 3 is arranged on the right inner wall surface of the integrated cabinet 5. There is a heat channel 7 between the server 3 and the heat pipe evaporator 2. Thermocouples are evenly arranged in the area where the heat channel 7 is located, and the thermocouples together form a thermocouple array 6. A vertical bracket 11 is installed on the left side of the inner cavity of the integrated cabinet 5, and the thermocouple array 6 is installed on the surface of the vertical bracket 11. A temperature sensor A9 and a pressure sensor A25 are installed at the outlet of the heat pipe evaporator 2, and a temperature sensor B10 and a pressure sensor B26 are installed at the outlet of the heat pipe condenser 4;

[0074] An integrated energy storage box 12 is arranged outside the bottom of the integrated cabinet 5. A perforated partition is installed in the inner cavity of the integrated energy storage box 12. The internal space of the integrated energy storage box 12 is divided into a first cavity 22 and a second cavity 23 by the perforated partition. A first control board 19 is installed on the left side of the inner cavity of the first cavity 22, a second control board 16 is arranged below the first control board 19, a power sensor 24 is installed in the middle of the inner cavity of the first cavity 22, a standby power supply 20 is installed on the right side of the inner cavity of the first cavity 22, and the interface of the standby power supply 20 is connected with a wire. A refrigerant liquid storage tank 15 is installed in the inner cavity of the second cavity 23. A pipeline A17 is installed on the left side of the bottom of the refrigerant liquid storage tank 15, a pipeline B30 is installed on the right side of the bottom of the refrigerant liquid storage tank 15. A first electric valve 13 is installed on the pipeline A17, a second electric valve 14 is installed on the pipeline B30. A temperature sensor C27 is installed on the upper right side of the refrigerant liquid storage tank 15, a pressure sensor C28 is installed on the lower right side of the refrigerant liquid storage tank 15. A third control board 18 is installed in the lower part of the inner cavity of the second cavity 23, and a wire is installed on the surface of the third control board 18;

[0075] Power transmission line E is arranged between the main circuit of the data center and the chiller. A second current sensor 29 is installed on the power transmission line E, and the third control board 18 is connected to the second current sensor 29.

[0076] The refrigerant liquid storage tank 15 is connected to the circulation pipeline 8 through pipelines A17 and B30 respectively equipped with a first electric valve 13 and a second electric valve 14. Pipelines A17 and B30 are two completely identical pipelines.

[0077] The power supply end of the first electric valve 13 is connected to a power transmission line B. The power supply end of the first electric valve 13 is connected to the standby power supply 20 through the power transmission line B. The power supply end of the second electric valve 14 is connected to a power transmission line C. The power supply end of the second electric valve 14 is connected to the standby power supply 20 through the power transmission line C. The weak signal receiving ends of the first electric valve 13 and the second electric valve 14 are both connected to the third control board 18 through wires.

[0078] Different interfaces of the standby power supply 20 are respectively connected to a power transmission line B, a power transmission line C, a power transmission line D, a power supply replenishment line and a power quantity monitoring line.

[0079] The beginning and end of the power transmission line B are the standby power supply 20 and the first electric valve 13 respectively. The beginning and end of the power transmission line C are the standby power supply 20 and the second electric valve 14 respectively. The beginning and end of the power transmission line D are the standby power supply 20 and the backplane fan 1 respectively. The power transmission line D passes through the second control board 16. The beginning and end of the power supply replenishment line are the main circuit of the data center and the standby power supply 20 respectively. The power supply replenishment line passes through the first control board 19. The two ends of the power quantity monitoring line are the standby power supply 20 and the current sensor 24 respectively. The beginning and end of the power transmission line A are the main circuit of the data center and the backplane fan 1 respectively. The power transmission line A passes through the first current sensor 21. The beginning and end of the power transmission line E are the main circuit of the data center and the chiller respectively. The power transmission line E passes through the second current sensor 29.

[0080] The standby power supply 20 supplies power to the first electric valve 13 and the second electric valve 14 in real time through the power transmission line B and the power transmission line C.

[0081] Two small holes on the side wall of the refrigerant liquid storage tank 15 are respectively inserted with a temperature sensor C27 and a pressure sensor C28.

[0082] The first control board 19 is used to connect or disconnect the power supply replenishment circuit to enable or cut off the power supply replenishment of the backup power supply 20 by the main circuit of the data center. The second control board 16 is used to connect or disconnect the power transmission line D to enable or cut off the backup power supply of the backup power supply 20 to the backplane fan 1. The third control board 18 is used to send weak electric signals to the first electric valve 13 and the second electric valve 14 to regulate the working states of the first electric valve 13 and the second electric valve 14.

[0083] The temperature sensor A9, the pressure sensor A25, the temperature sensor B10, the pressure sensor B26, the temperature sensor C27, the pressure sensor C28, the second current sensor 29 and the main control computer of the data center are all connected to the third control board 18. Each thermocouple in the first current sensor 21 and the thermocouple array 6 is connected to the second control board 16 through a wire. The power sensor 24 is connected to the first control board 19 through a wire, and the power sensor 24 is connected to the backup power supply 20 through a power monitoring line.

[0084] To ensure that the volume value of the integrated energy storage box 12 is reasonable, the volume of the refrigerant liquid storage tank 15 is estimated according to the formula P×Δt = α×ρ×V r ×r. P represents the cabinet power; Δt represents a period longer than 15 minutes; α represents a correction coefficient, which should be determined according to the actual heat exchange situation inside the integrated cabinet 5; ρ represents the density of the liquid refrigerant corresponding to the saturated temperature under the chilled water supply temperature condition recommended in the "Data Center Design Code" GB50174-2017; r represents the latent heat of vaporization of the liquid refrigerant corresponding to the saturated temperature under the chilled water supply temperature condition recommended in the "Data Center Design Code" GB50174-2017; V r represents the volume of the refrigerant liquid storage tank 15. For the volume of the integrated energy storage box 12, it is reasonably calculated according to the volume V of the refrigerant liquid storage tank 15 r and the internal circuit structure and internal pipeline structure of the integrated energy storage box 12, and the volume redundancy range of the integrated energy storage box 12 is set according to the actual size of the computer room space.

[0085] Under the chilled water supply temperature condition recommended in the "Data Center Design Code" GB50174-2017, the chilled water temperature of the chiller for the heat pipe condenser 4 is T 6,set . Under the chilled water storage condition, the chilled water supply temperature of the chiller for the heat pipe condenser 4 is T 5,set , and the pressure of the refrigerant at the outlet of the heat pipe condenser 4 is p 03 , p 03 corresponding refrigerant saturation temperature is T S03 , ΔT 65 = T 6,set - T 5,set ΔT65 The minimum value is not lower than 5°C, and the maximum value is not higher than 10°C.

[0086] Each thermocouple in the temperature sensor A9, pressure sensor A25, temperature sensor B10, pressure sensor B26, temperature sensor C27, pressure sensor C28, first current sensor 21, second current sensor 29, power sensor 24, and thermocouple array 6 performs data acquisition simultaneously every 10 seconds. The main control computer of the data center obtains the operating condition information of the chilled water supply to the heat pipe condenser 4 by the chiller in real time and transmits the operating condition information of the chilled water supply to the heat pipe condenser 4 by the chiller to the third control board 18 in real time. After receiving the instruction sent by the third control board 18, the main control computer of the data center will immediately send a temperature adjustment instruction to the chiller to adjust the chilled water supply temperature T of the chiller to the heat pipe condenser 4 0 to T 5,set or T 6,set , and the temperature sensor A9, pressure sensor A25, temperature sensor B10, pressure sensor B26, first current sensor 21, power sensor 24, second current sensor 29, temperature sensor C27, pressure sensor C28, and thermocouple array perform data acquisition simultaneously every 10 seconds, respectively, for monitoring the temperature T of the refrigerant at the outlet of the heat pipe evaporator, the pressure p of the refrigerant at the outlet of the heat pipe evaporator, the temperature T of the refrigerant at the outlet of the heat pipe condenser, the pressure p of the refrigerant at the outlet of the heat pipe condenser, the current I of the transmission line D, the remaining power Q of the standby power supply 20, the current I of the transmission line E, the temperature T of the refrigerant inside the refrigerant liquid storage tank 15, the pressure p of the refrigerant inside the refrigerant liquid storage tank 15, and the server exhaust air temperature T at the positions of 6 equally spaced thermocouples in the vertical direction of the hot channel 7 at the same moment 2 , the pressure p of the refrigerant at the outlet of the heat pipe evaporator 2 , the temperature T of the refrigerant at the outlet of the heat pipe condenser 3 , the pressure p of the refrigerant at the outlet of the heat pipe condenser 3 , the current I of the transmission line D 1 , the remaining power Q of the standby power supply 20, the current I of the transmission line E 2 , the temperature T of the refrigerant inside the refrigerant liquid storage tank 15 4 , and the pressure p of the refrigerant inside the refrigerant liquid storage tank 15 4 , the server exhaust air temperature T at the positions of 6 equally spaced thermocouples in the vertical direction of the hot channel 7 11 , T 12 , T 13 , T 14 , T 15 , T 16 , so as to obtain the saturation temperature T of the refrigerant corresponding to p 2 at this moment, the saturation temperature T of the refrigerant corresponding to p S2 , the saturation temperature T of the refrigerant corresponding to p 3 at this moment, and further obtain the superheat ΔT of the refrigerant at the outlet of the heat pipe evaporator at this moment S3 , the saturation temperature T of the refrigerant corresponding to p 4 at this moment, the saturation temperature T of the refrigerant corresponding to p S4 at this moment, and then obtain the superheat ΔT of the refrigerant at the outlet of the heat pipe evaporator at this moment 2, the subcooling degree ΔT of the refrigerant at the outlet of the heat pipe condenser 3 , the subcooling degree ΔT of the refrigerant inside the refrigerant liquid storage tank 15 4 and the maximum value T in the monitoring data of the thermocouple array 1 . ΔT 2 = T 2 - T S2 , ΔT 3 = T S3 - T 3 , ΔT 4 = T S4 - T 4 , T 1 = max{T 11 , T 12 , T 13 , T 14 , T 15 , T 16}.

[0087] The first electric valve 13 and the second electric valve 14 are two electric valves with exactly the same structure and completely synchronized working states. The outer shell of the integrated energy storage box, the refrigerant liquid storage tank, the first electric valve 13, the second electric valve 14, and all pipelines are made of appropriate high-temperature and high-pressure resistant materials according to the actual working conditions of the refrigerant in the circulation pipeline 8 to ensure the safety of the integrated energy storage box and the integrated cabinet.

[0088] The control method for the intelligent heat dissipation treatment device based on the heat pipe backplane in the emergency state includes the following steps:

[0089] Control one:

[0090] Step S1: If I 1 = 0, then execute step S3, otherwise execute step S2;

[0091] Step S2: Cut off the power transmission line D, and the backup power supply 20 does not supply power to the backplane fan 1, and continue to execute step S1;

[0092] Step S3: If T 1 ≥ T 1,set , then execute step S4, otherwise execute step S5;

[0093] Step S4: Connect the power transmission line D, and the backup power supply 20 supplies power to the backplane fan 1, and the backplane fan 1 operates at the rated power P fan,1 , and continue to execute step S1;

[0094] Step S5: Connect the power transmission line D, and the backup power supply 20 supplies power to the backplane fan 1, and the backplane fan 1 operates at a non-rated power P fan,2 , and continue to execute step S1;

[0095] Specifically, step S1 is the first step to be executed in Control One;

[0096] Specifically, in step S1, I 1 is the current monitoring value of transmission line A;

[0097] Specifically, in step S3, T 1,set is the set value of the exhaust air temperature of server 3. In step S3, T 1 = max{T 11 , T 12 , T 13 , T 14 , T 15 , T 16}, where T 11 , T 12 , T 13 , T 14 , T 15 , T 16 are the monitoring values of the exhaust air temperature of server 3 by 6 thermocouples at different positions in the thermocouple array 6;

[0098] Specifically, in step S4, P fan,1 and in step S5, P fan,2 satisfy P fan,1 > P fan,2 ;

[0099] Specifically, when the backup power supply 20 powers the backplane fan 1, on the basis of providing power to the first electric valve 13 and the second electric valve 14 in real time, the backup power supply 20 can ensure that the backplane fan 1 can operate at the rated power P fan,1 for at least 15 minutes;

[0100] Control Two:

[0101] Step S1: If T 4 ≤ T S03 + 1°C, then execute step S2, otherwise execute step S3;

[0102] Step S2: Close the first electric valve 13 and the second electric valve 14 simultaneously. If ΔT 2 ≥ ΔT 2,set , then execute step S3, otherwise execute step S4;

[0103] Step S3: Open the first electric valve 13 and the second electric valve 14 simultaneously. If I 2 ≠ 0, then execute step S5, otherwise execute step S6;

[0104] Step S4: If I 2 ≠ 0, then execute step S8, otherwise execute step S1;

[0105] Step S5: If T 0 = T 5,set , then execute Step S6; otherwise, execute Step S7;

[0106] Step S6: If T 4 ≤ T S03 , then execute Step S2; otherwise, execute Step S3;

[0107] Step S7: The main control computer of the data center commands the chiller to gradually adjust T 0 to T 5,set , and continue to execute Step S6;

[0108] Step S8: If T 0 = T 6,set , then execute Step S1; otherwise, execute Step S9;

[0109] Step S9: The main control computer of the data center commands the chiller to gradually adjust T 0 to T 6,set , and continue to execute Step S1;

[0110] Specifically, Step S1 is the first step to be executed in Control II;

[0111] Specifically, in Steps S3 and S4, I 2 is the current monitoring value of the transmission line E;

[0112] Specifically, in Step S2, ΔT 2,set and ΔT 2,set are respectively the superheat setting value of the refrigerant at the outlet of the heat pipe evaporator 2 and the superheat monitoring value of the refrigerant at the outlet of the heat pipe evaporator 2;

[0113] Specifically, in Step S1, T 4 is the refrigerant temperature monitoring value inside the refrigerant liquid storage tank 15;

[0114] Specifically, in Steps S5 and S8, T 0 is the chilled water supply temperature of the chiller to the heat pipe condenser 4;

[0115] Control III:

[0116] Step S1: If Q < Q 0 , then execute Step S3; otherwise, execute Step S2;

[0117] Step S2: Cut off the power supply replenishment line, and the main circuit of the data center does not charge the backup power supply 20, and continue to execute Step S1;

[0118] Step S3: Connect the power supply replenishment line, and charge the backup power supply 20 by the main circuit of the data center, and continue to execute Step S1;

[0119] Specifically, step S1 is the first step to be executed among the three steps;

[0120] Specifically, in step S1, Q and Q 0 are respectively the remaining power monitoring value of the standby power supply 20 and the full power of the standby power supply 20.

[0121] Embodiment 2

[0122] Please refer to Figure 3 , in this embodiment, at the initial moment, the data center is in a non-emergency state, and it is monitored that T 4 ≤T S03 , ΔT 2 <ΔT 2,set , I 2 ≠0 and T 0 =T 6,set ≠T 5,set . At this time, the refrigerant liquid storage tank 15 is already filled with liquid refrigerant, and both the first electric valve 13 and the second electric valve 14 are in the closed state. After the data center enters the emergency state, the main circuit of the data center cannot supply power to the chiller. When it is simultaneously monitored that ΔT 2 ≥ΔT 2,set , I 2 =0, the first electric valve 13 and the second electric valve 14 are opened simultaneously, and the liquid refrigerant in the refrigerant liquid storage tank 15 starts to enter the circulation pipeline through pipeline A17 and pipeline B30, strengthening the heat exchange intensity between the refrigerant in the heat pipe evaporator 2 and the hot air in the integrated cabinet 5. ΔT 2 gradually decreases. Under the action of the backplane fan 1, the temperature of the hot air in the integrated cabinet 5 gradually decreases. After the data center passes through the emergency state, the main circuit power of the data center is restored. When it is simultaneously monitored that ΔT 2 ≥ΔT 2,set , I 2 ≠0, T 4 >T S03 and T 0 ≠T 5,set , the chiller starts to adjust T 0 to T 5,set . The mass flow rate of the liquid refrigerant in the circulation pipeline starts to increase. After a period of time, when it is simultaneously monitored that T 4 ≤T S03 , ΔT 2 <ΔT 2set , I 2 ≠0 and T 0 ≠T 6set , the first electric valve 13 and the second electric valve 14 are closed simultaneously, and the chiller starts to adjust T 0 to T6,set , the mass flow rate of the liquid refrigerant in the circulation pipeline begins to decrease, and at this time, the refrigerant liquid storage tank 15 has been refilled with liquid refrigerant.

[0123] Embodiment 3

[0124] Please refer to Figure 2 , in this embodiment, after the data center enters the emergency state, the main circuit of the data center cannot supply power to the backplane fan 1. When it is simultaneously detected that I 1 = 0 and T 1,set ≥ T 1 , the power transmission line D is switched on, and the standby power supply 20 in the integrated energy storage box 12 starts to supply power to the backplane fan 1, so that the backplane fan 1 operates at the rated power P fan,1 , driving the hot air inside the integrated cabinet 5 through the heat pipe evaporator 2 to reduce the temperature of the hot air inside the integrated cabinet 5. Please refer to Figure 3 , after a period of time, if it is simultaneously detected that I 1 = 0 and T 1,set < T 1 , then the operating power of the backplane fan 1 is reduced from the rated power P fan,1 to P fan,2 . After a period of time, the data center has passed the emergency state, and the power of the main circuit of the data center is restored. At this time, it is detected that I 1 ≠ 0, then the power transmission line D is cut off, and the standby power supply 20 does not supply power to the backplane fan 1. The main circuit of the data center supplies power to the backplane fan 1 through the power transmission line A. While the power of the main circuit of the data center is restored, the main circuit of the data center charges the standby power supply 20 through the power replenishment line. Please refer to Figure 4 , after a period of time, if it is detected that Q = Q 0 , then the power replenishment line is cut off.

[0125] It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or also includes elements inherent to such process, method, article or device.

[0126] Although embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An intelligent heat dissipation treatment device for a heat pipe back plate in emergency state, characterized in that: include: An integrated cabinet (5), wherein a backplane fan (1) is installed on the backplane surface of the integrated cabinet (5), a heat pipe evaporator (2) is provided near the left inner wall surface of the integrated cabinet (5), a backup power supply end of the backplane fan (1) is connected to a power transmission line D, a main power supply end of the backplane fan (1) is connected to a power transmission line A, and a first current sensor (21) is installed on the power transmission line A; A circulation pipeline (8) is arranged at the air outlet end of the heat pipe evaporator (2), and the circulation pipeline (8) passes through the heat pipe condenser (4) and the integrated energy storage box (12), and is connected to the air inlet end of the heat pipe evaporator (2); A server (3) is arranged on the right inner wall of the integrated cabinet (5); a heat channel (7) is arranged between the server (3) and the heat pipe evaporator (2); thermocouples are evenly arranged in the area where the heat channel (7) is located; the thermocouples together form a thermocouple array (6); a vertical bracket (11) is installed on the left side of the inner cavity of the integrated cabinet (5); the thermocouple array (6) is installed on the surface of the vertical bracket (11); a temperature sensor A (9) and a pressure sensor A (25) are installed at the outlet of the heat pipe evaporator (2); and a temperature sensor B (10) and a pressure sensor B (26) are installed at the outlet of the heat pipe condenser (4); An integrated energy storage box (12) is arranged on the outside of the bottom of an integrated cabinet (5); a perforated partition is installed in the inner cavity of the integrated energy storage box (12); the inner space of the integrated energy storage box (12) is divided into a first cavity (22) and a second cavity (23) by the perforated partition; a first control board (19) is installed on the left side of the inner cavity of the first cavity (22); a second control board (16) is arranged below the first control board (19); an electric quantity sensor (24) is installed in the middle of the inner cavity of the first cavity (22); a backup power supply (20) is installed on the right side of the inner cavity of the first cavity (22); a wire is connected to the interface of the backup power supply (20); and the second cavity (23) A refrigerant storage tank (15) is installed in the inner cavity, a pipeline A (17) is installed on the left side of the bottom of the refrigerant storage tank (15), a pipeline B (30) is installed on the right side of the bottom of the refrigerant storage tank (15), a first electric valve (13) is installed on the pipeline A (17), a second electric valve (14) is installed on the pipeline B (30), a temperature sensor C (27) is installed on the upper right side of the refrigerant storage tank (15), a pressure sensor C (28) is installed on the lower right side of the refrigerant storage tank (15), a third control board (18) is installed in the lower part of the inner cavity of the second cavity (23), and a wire is installed on the surface of the third control board (18); The power transmission line E is arranged between the main circuit of the data center and the chiller. A second current sensor (29) is installed on the power transmission line E. The third control board (18) is connected to the second current sensor (29).

2. The intelligent heat dissipation treatment device for emergency state of a heat pipe back plate according to claim 1, characterized in that: The refrigerant liquid storage tank (15) is connected to the circulation pipeline (8) through a pipeline A (17) and a pipeline B (30) respectively equipped with a first electric valve (13) and a second electric valve (14); the pipeline A (17) and the pipeline B (30) are two completely identical pipelines; the first electric valve (13) and the second electric valve (14) are two electric valves with completely identical structures and completely synchronized working states.

3. The intelligent heat dissipation treatment device for emergency state of a heat pipe back plate according to claim 2, characterized in that: The power supply end of the first electric valve (13) is connected to the transmission line B, and the power supply end of the first electric valve (13) is connected to the backup power supply (20) through the transmission line B. The power supply end of the second electric valve (14) is connected to the transmission line C, and the power supply end of the second electric valve (14) is connected to the backup power supply (20) through the transmission line C. The weak current signal receiving end of the first electric valve (13) and the weak current signal receiving end of the second electric valve (14) are both connected to the third control board (18) through wires. Different interfaces of the backup power supply (20) are respectively connected to the transmission line B, the transmission line C, the transmission line D, the power replenishment line and the power monitoring line.

4. The intelligent heat dissipation treatment device for emergency state of a heat pipe back plate according to claim 3, characterized in that: The beginning and the end of the transmission line B are the backup power supply (20) and the first electric valve (13), respectively; the beginning and the end of the transmission line C are the backup power supply (20) and the second electric valve (14), respectively; the beginning and the end of the transmission line D are the backup power supply (20) and the backplane fan (1), respectively; the transmission line D passes through the second control board (16); the beginning and the end of the power replenishment line are the data center main circuit and the backup power supply (20), respectively; the power replenishment line passes through the first control board (19); the two ends of the power monitoring line are the backup power supply (20) and the power sensor ( 24), the beginning and the end of the transmission line A are respectively the main circuit of the data center and the backplane fan (1), the transmission line A passes through a first current sensor (21), the beginning and the end of the transmission line E are respectively the main circuit of the data center and the chiller, the transmission line E passes through a second current sensor (29), the backup power supply (20) supplies real-time power to the first electric valve (13) and the second electric valve (14) through the transmission line B and the transmission line C, and the two small holes on the side wall of the refrigerant storage tank (15) are respectively inserted with a temperature sensor C (27) and a pressure sensor C (28).

5. The intelligent heat dissipation treatment device for emergency state of a heat pipe back plate according to claim 4, characterized in that: The first control panel (19) is used to connect or disconnect the power replenishment circuit to realize or disconnect the power replenishment of the backup power supply (20) by the main circuit of the data center; the second control panel (16) is used to connect or disconnect the transmission line D to realize or disconnect the backup power supply of the backup power supply (20) to the backplane fan (1); the third control panel (18) is used to send a weak current signal to the first electric valve (13) and the second electric valve (14) to adjust the working state of the first electric valve (13) and the second electric valve (14).

6. The heat pipe back plate emergency state intelligent heat dissipation treatment device according to claim 5, characterized in that: The temperature sensor A (9), pressure sensor A (25), temperature sensor B (10), pressure sensor B (26), temperature sensor C (27), pressure sensor C (28), second current sensor (29) and the data center master computer are all connected to the third control board (18). Each thermocouple in the first current sensor (21) and the thermocouple array (6) is connected to the second control board (16) through a wire. The power sensor (24) is connected to the first control board (19) through a wire, and the power sensor (24) is connected to the backup power supply (20) through a power monitoring line.

7. The heat pipe back plate emergency state intelligent heat dissipation treatment device according to claim 6, characterized in that: The volume of the refrigerant liquid storage tank (15) is calculated according to the formula P×Δt=α×ρ×V r ×r to make an estimate; Where: P represents the cabinet power; Δt represents a time period greater than 15 minutes; α represents a correction coefficient, which is determined according to the actual heat exchange situation inside the integrated cabinet (5); ρ represents the density of the liquid refrigerant corresponding to the saturation temperature under the chilled water supply temperature condition recommended by the "Data Center Design Code" GB50174-2017; r represents the latent heat of vaporization of the liquid refrigerant corresponding to the saturation temperature under the chilled water supply temperature condition recommended by the "Data Center Design Code" GB50174-2017; V r represents the volume of the refrigerant liquid storage tank (15). For the volume of the integrated energy storage tank (12), the volume V of the refrigerant liquid storage tank (15) is calculated based on the volume V r Reasonable calculations are performed based on the internal circuit structure and internal pipeline structure of the integrated energy storage box (12), and the volume redundancy range of the integrated energy storage box (12) is set according to the actual size of the machine room space.

8. The intelligent heat dissipation treatment device for emergency state of a heat pipe back plate according to claim 7, characterized in that: The chilled water temperature of the heat pipe condenser (4) of the chiller is T 6,set Under the cold storage condition, the chilled water supply temperature of the chiller to the heat pipe condenser (4) is T 5,set , the refrigerant pressure at the outlet of the heat pipe condenser (4) is p 03 , p 03 The corresponding refrigerant saturation temperature is T S03 , ΔT 65 =T 6,set -T 5,set , ΔT 65 The minimum value is not less than 5℃ and the maximum value is not higher than 10℃.

9. The heat pipe back plate emergency state intelligent heat dissipation treatment device according to claim 8, characterized in that: The temperature sensor A (9), the pressure sensor A (25), the temperature sensor B (10), the pressure sensor B (26), the temperature sensor C (27), the pressure sensor C (28), the first current sensor (21), the second current sensor (29), the power sensor (24) and each thermocouple in the thermocouple array (6) simultaneously collect data once every 10 seconds. The data center main control computer obtains the operating condition information of the chilled water supply of the chilled water unit to the heat pipe condenser (4) in real time, and transmits the operating condition information of the chilled water supply of the chilled water unit to the heat pipe condenser (4) to the third control board (18) in real time. After receiving the instruction sent by the third control board (18), the data center main control computer will immediately send a temperature adjustment instruction to the chilled water unit to adjust the chilled water supply temperature T0 of the chilled water unit to the heat pipe condenser (4) to T 5,set or T 6,set .

10. A control method, comprising the heat pipe back plate emergency state intelligent heat dissipation processing device according to any one of claims 1 to 9, characterized in that: It includes the following three controls: Control One: Step S1: If I1 = 0, then execute Step S3; otherwise, execute Step S2; Step S2: Cut off the power transmission line D, and the backup power supply (20) does not supply power to the backplane fan (1), and continue to execute Step S1; Step S3: If T1 ≥ T 1,set , then execute step S4, otherwise execute step S5; Step S4: Connect the power transmission line D, and use the backup power supply (20) to supply power to the backplane fan (1). The backplane fan (1) operates at a rated power P fan,1 Run, continue to execute step S1; Step S5: Connect the power transmission line D, and use the backup power supply (20) to supply power to the backplane fan (1). The backplane fan (1) operates at a non-rated power P. fan,2 Run, continue to execute step S1; Specifically, Step S1 is the first step to be executed in Control One; Specifically, I1 in Step S1 is the current monitoring value of the power transmission line A; Specifically, the T in step S3 1,set is the exhaust temperature setting value of the server (3), and T1 in step S3 is max{T 11 , T 12 , T 13 , T 14 , T 15 , T 16 }, the T 11 、T 12 、T 13 、T 14 、T 15 、T 16 They are respectively the exhaust air temperature monitoring values ​​of the server (3) by 6 thermocouples at different positions in the thermocouple array (6); Specifically, the P in step S4 fan,1 and P in step S5 fan,2 Satisfy P fan,1 >P fan,2 ; Specifically, when the backup power supply (20) supplies power to the backplane fan (1), the backup power supply (20) can ensure that the backplane fan (1) can be powered at a rated power P on the basis of providing power to the first electric valve (13) and the second electric valve (14) in real time. fan,1 Run for at least 15 minutes; Control Two: Step S1: If T4≤T S03 +1°C, then execute step S2, otherwise execute step S3; Step S2: The first electric valve (13) and the second electric valve (14) are closed simultaneously. If ΔT2 ≥ ΔT 2,set , then execute step S3, otherwise execute step S4; Step S3: Open the first electric valve (13) and the second electric valve (14) simultaneously. If I2 ≠ 0, then execute Step S5; otherwise, execute Step S6; Step S4: If I2 ≠ 0, then execute Step S8; otherwise, execute Step S1; Step S5: If T0=T 5,set , then execute step S6, otherwise execute step S7; Step S6: If T4≤T S03 , then execute step S2, otherwise execute step S3; Step S7: The data center main control computer instructs the chiller to gradually adjust T0 to T 5set , continue to step S6; Step S8: If T0=T 6,set , then execute step S1, otherwise execute step S9; Step S9: The data center main control computer instructs the chiller to gradually adjust T0 to T 6,set , continue to execute step S1; Specifically, Step S1 is the first step to be executed in Control Two; Specifically, I2 in Step S3 and Step S4 is the current monitoring value of the power transmission line E; Specifically, the ΔT in step S2 2,set and ΔT 2,set They are respectively a superheat setting value of the refrigerant at the outlet of the heat pipe evaporator (2) and a superheat monitoring value of the refrigerant at the outlet of the heat pipe evaporator (2); Specifically, T4 in Step S1 is the refrigerant temperature monitoring value inside the refrigerant liquid storage tank (15); Specifically, T0 in Step S5 and Step S8 is the chilled water supply temperature of the chiller to the heat pipe condenser (4); Control Three: Step S1: If Q < Q0, then execute Step S3; otherwise, execute Step S2; Step S2: Cut off the power supplement line, and the data center main circuit does not charge the backup power supply (20), and continue to execute Step S1; Step S3: Connect the power supplement line, and the data center main circuit charges the backup power supply (20), and continue to execute Step S1; Specifically, Step S1 is the first step to be executed in Control Three; Specifically, Q and Q0 in Step S1 are the remaining power monitoring value of the backup power supply (20) and the full charge power of the backup power supply (20), respectively.

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