Laser processing machine, laser processing method, processing program creation method, and processing program construction method

Abstract

A control device (NC device (50)) controls the movement mechanism so that the machining head (35) is at a fixed position. The control device controls the laser oscillator (10) such that the laser beam is turned on at a machining start position within a hole formation region where the hole is formed. A control device controls a beam oscillation mechanism (galvanometer scanner unit (32)) so that a laser beam moves from a machining start position to an end of a hole formation region to form a path, and the laser beam moves circularly along the entire circumferential end of the hole formation region to form a hole in a material to be cut (a metal plate (W)). The control device controls the height adjustment mechanism (38) so that the distance between the front end of the nozzle (36) and the surface of the material to be cut is set to a fixed distance of 1.0 mm or more and 6.0 mm or less from the start of machining of the hole at which the irradiation of the laser beam is started at the machining start position to the completion of the formation of the hole.

Description

Technical Field

[0001] The present disclosure relates to a laser processing machine, a laser processing method, a method for creating a processing program, and a method for constructing a processing program. Background Art

[0002] As described in Patent Document 1, a laser processing machine equipped with a galvanometer scanner unit has been put into practical use. Patent Document 1 describes the following: In a state where the processing head is stopped, the laser beam emitted from the opening of the nozzle mounted at the front end of the processing head is moved in a circular shape by the galvanometer scanner unit, thereby forming a hole smaller than the diameter of the opening. According to this laser processing method of forming a hole smaller than the diameter of the opening, compared with the laser processing method of forming a hole while moving the processing head, the processing time for forming the hole can be significantly shortened.

[0003] In addition, Patent Document 1 describes the following: The laser beam is turned on at the center of the opening, and the laser beam is shifted in the direction of the end of the opening by a distance equal to the radius of the hole to be formed by the galvanometer scanner unit, so that the laser beam moves in a circular shape.

[0004] Prior Art Documents

[0005] Patent Documents

[0006] Patent Document 1: International Publication No. 2021 / 112039

[0007] Patent Document 2: Japanese Patent Laid-Open No. 9-220683

[0008] Patent Document 3: Japanese Patent Laid-Open No. 2019-195831

[0009] Patent Document 4: Japanese Patent Laid-Open No. 8-118048 Summary of the Invention

[0010] As described in Patent Document 2, in a laser processing method of forming a hole while moving the processing head, the distance between the front end of the nozzle and the surface of the metal plate is an extremely close distance such as 0.3 mm. Generally, when a laser processing machine cuts a product having an opening from a metal plate, a perforation is made inside the region where the opening is formed, a path is formed from the perforation to the end of the region where the opening is formed, and the metal plate is cut along the region where the opening is formed.

[0011] Based on the matters described in paragraph 0051 of Patent Document 3, it can be understood that the processing of a metal plate by a general laser processing machine will be carried out as follows. When the laser processing machine makes a piercing hole, the distance between the front end of the nozzle and the surface of the metal plate is set longer than that in normal cutting. When the laser processing machine forms a path and cuts the outer or inner periphery of the product in normal cutting, the distance between the front end of the nozzle and the surface of the metal plate is set to a close distance (for example, 0.3 mm).

[0012] Based on the above matters known to those skilled in the art, when forming a hole on the metal plate by moving the laser beam circularly through the galvanometer scanner unit with the processing head stopped, consider setting the distance from the front end of the nozzle to the surface of the metal plate in the following manner for processing.

[0013] The laser processing machine sets the distance between the front end of the nozzle and the surface of the metal plate to a relatively long distance only when making a piercing hole. When the laser processing machine shifts the laser beam in the direction of the end of the opening and when the laser beam moves circularly, the distance between the front end of the nozzle and the surface of the metal plate is set to an extremely close distance such as 0.3 mm. However, if the processing head is moved in the height direction to change the distance between the front end of the nozzle and the surface of the metal plate in this way, the processing speed will decrease. Therefore, consider that from the time when the laser beam is turned on at the center of the opening until the cutting of the hole is completed, the distance between the front end of the nozzle and the surface of the metal plate is set to an extremely close distance such as 0.3 mm.

[0014] The present inventor conducted the following verification: Repeatedly perform the following processing many times, that is, from the time when the laser beam is turned on at the center of the opening until the cutting of the hole is completed, set the distance between the front end of the nozzle and the surface of the metal plate to a close distance, and with the processing head stopped, use the laser processing machine to move the laser beam circularly to form a hole on the metal plate. As a result, it was found that there were sometimes cases where spatter accumulated inside the nozzle and processing could not continue. Therefore, it is required that even when repeatedly performing the processing of forming a hole of a predetermined shape within the range of the opening of the nozzle on the metal plate many times with the processing head stopped, spatter is difficult to accumulate inside the nozzle, and the processable state can be maintained for a long time.

[0015] A first aspect of one or more embodiments provides a laser processing machine, comprising: a laser oscillator that emits a laser beam; a processing head having a nozzle mounted at its front end, the nozzle emitting the laser beam emitted from the laser oscillator from an opening; a moving mechanism that moves the processing head along the surface of a material to be cut; a height adjustment mechanism that adjusts the position of the processing head in the height direction; a beam vibration mechanism that vibrates the laser beam emitted from the opening within the opening; and a control device that controls the laser oscillator, the moving mechanism, the height adjustment mechanism, and the beam vibration mechanism. When forming a hole within the range of the opening on the material to be cut, the control device controls the moving mechanism to fix the processing head at a fixed position, controls the laser oscillator to turn on the laser beam at a processing start position within a hole formation region where the hole is formed, controls the beam vibration mechanism to move the laser beam from the processing start position to the end of the hole formation region to form a path, and moves the laser beam along the entire circumferential end of the hole formation region to form the hole on the material to be cut, and controls the height adjustment mechanism to set the distance between the front end of the nozzle and the surface of the material to be cut to a fixed distance of 1.0 mm or more and 6.0 mm or less from the start of laser beam irradiation at the processing start position until the formation of the hole is completed.

[0016] According to the first aspect of one or more embodiments, since the control device controls the moving mechanism in such a way that the processing head is in a fixed position and controls the beam vibration mechanism to form a hole within the range of the opening of the nozzle on the material to be cut, it is possible to form a hole having a diameter smaller than the diameter of the opening of the nozzle on the material to be cut in a short time. According to the first aspect of one or more embodiments, from the start of hole processing to the completion of hole formation, the distance between the front end of the nozzle and the surface of the material to be cut is set to a fixed distance of 1.0 mm or more and 6.0 mm or less, so it is difficult for spatter to accumulate inside the nozzle. Therefore, the processable state can be maintained for a long time.

[0017] A second aspect of one or more embodiments provides a laser processing method, in which the processing head is set to a stopped state, the distance between the front end of the nozzle mounted on the processing head and the surface of the material to be cut is set to a fixed distance of 1.0 mm or more and 6.0 mm or less, the laser beam is turned on at a processing start position within a hole formation region where a hole within the range of the opening of the nozzle is formed to start laser beam irradiation at the processing start position, the laser beam is moved from the processing start position to the end of the hole formation region to form a path, and the laser beam is moved along the entire circumferential end of the hole formation region to form the hole on the material to be cut.

[0018] According to the second aspect of one or more embodiments, since the processing head is set to a stopped state and the laser beam is moved circularly along the entire circumferential end of the hole formation region to form a hole having a diameter smaller than the diameter of the opening of the nozzle, it is possible to form a hole having a diameter smaller than the diameter of the opening of the nozzle in the material to be cut in a short time. According to the second aspect of one or more embodiments, since the distance between the front end of the nozzle and the surface of the material to be cut is set to a fixed distance of 1.0 mm or more and 6.0 mm or less, and a hole having a diameter smaller than the diameter of the opening of the nozzle is formed, sputtered matter is difficult to accumulate inside the nozzle. Therefore, the processable state can be maintained for a long time.

[0019] The third aspect of one or more embodiments provides a method for creating a machining program, in which the machining program is created in the following manner: setting whether the head-fixed hole machining is valid or invalid, where the head-fixed hole machining is a state in which the processing head is stopped when irradiating a laser beam emitted from the processing head onto the material to be cut to form a hole of a predetermined shape, and the hole is formed by moving the position on the material to be cut where the laser beam is irradiated within the opening of the nozzle mounted at the front end of the processing head; setting the shape of the target hole for which the head-fixed hole machining is to be executed; setting the minimum size and the maximum size of the target hole; setting a coefficient that determines the circumferential time for moving the laser beam in the on state along the entire circumferential end of the target hole to be formed in the material to be cut; when the execution of the head-fixed hole machining is set to be valid, and a specific hole to be formed in the material to be cut is the target hole, and the size of the specific hole is equal to or greater than the minimum size and equal to or less than the maximum size, in the code indicating the formation of the specific hole, it includes a statement formed by connecting a first address word, a second address word, and a third address word in any order, where the first address word specifies the size of the specific hole, the second address word indicates the execution of the head-fixed hole machining, and the third address word represents the coefficient.

[0020] According to the third aspect of one or more embodiments, it is possible to create a machining program suitable for forming a hole within the opening of the nozzle in the material to be cut by head-fixed hole machining on the basis of setting various conditions for executing the head-fixed hole machining.

[0021] A fourth aspect of one or more embodiments provides a method of constructing a machining program, wherein the machining program is constructed in such a manner that, in a code for instructing to form a hole of a predetermined shape in a material to be cut by moving a machining head that emits a laser beam, a statement formed by connecting a first address word, a second address word, and a third address word in any order is included. The first address word specifies the size of the hole. The second address word instructs to perform head-fixed hole machining, and the head-fixed hole machining is set to a state in which the machining head stops. The hole is formed by moving a position on the material to be cut where the laser beam is irradiated within the range of the opening of a nozzle mounted at the front end of the machining head. The third address word represents a coefficient that determines a circumferential time for moving the laser beam in an on state along the entire circumferential end of the hole to be formed in the material to be cut.

[0022] According to the fourth aspect of one or more embodiments, it is not necessary to newly define a code for head-fixed hole machining, and an existing code for instructing to form a hole in a material to be cut by moving a machining head can be used to construct a machining program for head-fixed hole machining.

[0023] According to the laser processing machine and the laser processing method according to one or more embodiments, even when repeatedly performing machining to form a hole of a predetermined shape that falls within the range of the opening of the nozzle in a state where the machining head stops on a metal plate, spatter is difficult to accumulate inside the nozzle, and a processable state can be maintained for a long time. According to the method of creating a machining program according to one or more embodiments, a machining program suitable for the laser processing machine and the laser processing method according to one or more embodiments can be created. According to the method of constructing a machining program according to one or more embodiments, a machining program suitable for the laser processing machine and the laser processing method according to one or more embodiments can be constructed. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 is a diagram showing a laser processing machine according to one or more embodiments.

[0025] Figure 2 is a conceptual diagram showing a height adjustment mechanism for adjusting the position of the machining head in the height direction.

[0026] Figure 3 is a perspective view showing a detailed structural example of a collimator unit and a machining head in a laser processing machine.

[0027] Figure 4 is a diagram for explaining the shift of the irradiation position of the laser beam onto the metal plate based on the beam vibration mechanism.

[0028] Figure 5AThis is a diagram showing an example of a hole formed in a metal plate, having a diameter smaller than the diameter of the opening of the nozzle.

[0029] Figure 5B This is a diagram showing the hole forming area on the metal plate before forming the hole shown in Figure 5A the figure.

[0030] Figure 6A This is a diagram showing a first example of an arc-shaped trajectory traced by a laser beam when the laser beam forms a hole having a diameter smaller than the diameter of the opening of the nozzle.

[0031] Figure 6B This is a diagram showing a second example of an arc-shaped trajectory traced by a laser beam when the laser beam forms a hole having a diameter smaller than the diameter of the opening of the nozzle.

[0032] Figure 7 This is a diagram showing the process of forming a perforation, a path, and a circumferential cutting groove on a metal plate through the first example shown in Figure 6A the figure.

[0033] Figure 8A This is a diagram showing a first example of a spiral-shaped trajectory traced by a laser beam when the laser beam forms a hole having a diameter smaller than the diameter of the opening of the nozzle.

[0034] Figure 8B This is a diagram showing a second example of a spiral-shaped trajectory traced by a laser beam when the laser beam forms a hole having a diameter smaller than the diameter of the opening of the nozzle.

[0035] Figure 8C This is a diagram showing a third example of a spiral-shaped trajectory traced by a laser beam when the laser beam forms a hole having a diameter smaller than the diameter of the opening of the nozzle.

[0036] Figure 8D This is a diagram showing a fourth example of a spiral-shaped trajectory traced by a laser beam when the laser beam forms a hole having a diameter smaller than the diameter of the opening of the nozzle.

[0037] Figure 9 This is a block diagram showing a specific structural example of a CAM device.

[0038] Figure 10 This is a diagram showing an example of a setting image used by a CAM device in the previous stage of creating a machining program.

[0039] Figure 11 This is a diagram showing an example of a machining program for forming a plurality of holes having a diameter smaller than the diameter of the opening of the nozzle on a metal plate.

[0040] Figure 12 This is a diagram showing the state of a metal plate having a plurality of holes formed through the machining program shown in Figure 11 the figure. Detailed implementation mode

[0041] The laser processing machine according to one or more embodiments includes a laser oscillator, a processing head, a moving mechanism, a height adjustment mechanism, and a control device. The laser oscillator emits a laser beam. The processing head is provided with a nozzle at the front end for emitting the laser beam emitted from the laser oscillator from an opening. The moving mechanism moves the processing head along the surface of the metal plate. The height adjustment mechanism adjusts the position of the processing head in the height direction. The light beam vibration mechanism vibrates the laser beam emitted from the opening within the opening. The control device controls the laser oscillator, the moving mechanism, the height adjustment mechanism, and the light beam vibration mechanism.

[0042] When forming a hole in the material to be cut that falls within the range of the opening, the control device controls the moving mechanism so that the processing head is at a fixed position, and controls the laser oscillator so that the laser beam is turned on at the processing start position within the hole formation region where the hole is formed. The control device controls the light beam vibration mechanism so that the laser beam moves from the processing start position to the end of the hole formation region to form a path, and the laser beam moves along the entire circumferential end of the hole formation region to form the hole in the material to be cut. The control device controls the height adjustment mechanism so that the distance between the front end of the nozzle and the surface of the material to be cut is set to a fixed distance of 1.0 mm or more and 6.0 mm or less from the start of the irradiation of the laser beam at the processing start position of the hole to the completion of the formation of the hole.

[0043] In the laser processing method according to one or more embodiments, the state where the processing head is stopped is set, the distance between the front end of the nozzle mounted on the processing head and the surface of the material to be cut is set to a fixed distance of 1.0 mm or more and 6.0 mm or less, the laser beam is turned on at the processing start position within the hole formation region where a hole that falls within the range of the opening of the nozzle is formed to start the irradiation of the laser beam at the processing start position, the laser beam is moved from the processing start position to the end of the hole formation region to form a path, and the laser beam is moved along the entire circumferential end of the hole formation region to form the hole in the material to be cut.

[0044] In the method for creating a machining program according to one or more embodiments, it is set whether to enable or disable the head fixing hole machining. When irradiating a laser beam emitted from a machining head onto a material to be cut to form a hole having a predetermined shape, the head fixing hole machining is set to a state where the machining head stops, and the hole is formed by moving the position on the material to be cut where the laser beam is irradiated within the opening range of a nozzle attached to the front end of the machining head. In the method for creating a machining program according to one or more embodiments, the shape of the target hole for which the head fixing hole machining is to be executed is set, the minimum size and the maximum size of the target hole are set, and a coefficient for determining the circumferential time for moving the laser beam in the on state along the entire circumferential end of the target hole to be formed in the material to be cut is set.

[0045] In the method for creating a machining program according to one or more embodiments, when the head fixing hole machining is set to be enabled and a specific hole to be formed in the material to be cut is the target hole, and the size of the specific hole is equal to or greater than the minimum size and equal to or less than the maximum size, the machining program is created as follows: In the code indicating the formation of the specific hole, there is included a statement formed by connecting a first address word, a second address word, and a third address word in an arbitrary order. The first address word specifies the size of the specific hole, the second address word indicates the execution of the head fixing hole machining, and the third address word represents the coefficient.

[0046] In the method for constructing a machining program according to one or more embodiments, the machining program is constructed as follows: In the code indicating the formation of a hole having a predetermined shape in a material to be cut by moving a machining head that emits a laser beam, there is included a statement formed by connecting a first address word, a second address word, and a third address word in an arbitrary order. The first address word specifies the size of the hole. The second address word indicates the execution of the head fixing hole machining, where the head fixing hole machining is set to a state where the machining head stops, and the hole is formed by moving the position on the material to be cut where the laser beam is irradiated within the opening range of a nozzle attached to the front end of the machining head. The third address word represents a coefficient for determining the circumferential time for moving the laser beam in the on state along the entire circumferential end of the hole to be formed in the material to be cut.

[0047] Hereinafter, a laser processing machine, a laser processing method, a method for creating a machining program, and a method for constructing a machining program according to one or more embodiments will be specifically described with reference to the drawings. First, Figures 1 to 4 a laser processing machine according to one or more embodiments will be described. Figure 1 FIG. 100 shows a laser processing machine as a structural example of a laser processing machine according to one or more embodiments.

[0048] InFigure 1 In Figure 1 , the laser processing machine 100 includes a laser oscillator 10, a process optical fiber 12, a laser processing unit 20, an NC device 50, and an auxiliary gas supply device 80. The laser oscillator 10 generates and emits a laser beam. The process optical fiber 12 transmits the laser beam emitted from the laser oscillator 10 to the laser processing unit 20. The NC device 50 is an example of a control device that controls each part of the laser processing machine 100.

[0049] An NC program database 60 and a processing condition database 70 are connected to the NC device 50. The NC program database 60 and the processing condition database 70 may also be connected to the laser processing machine 100 via a network. A CAM (Computer Aided Manufacturing) device 40 for creating the NC program described later is connected to the NC program database 60. The CAM device 40 may also be connected to the NC program database 60 via a network. The NC program database 60 stores the NC program created by the CAM device 40.

[0050] The CAM device 40 is composed of a computer device that executes a CAM program. The CAM device 40 creates an NC program by executing the NC program creation method of one or more embodiments. The NC program created by the CAM device 40 will be described later.

[0051] As the laser oscillator 10, a laser oscillator that amplifies the pump light emitted from a laser diode and emits a laser beam of a predetermined wavelength, or a laser oscillator that directly uses the laser beam emitted from a laser diode is preferable. The laser oscillator 10 is, for example, a solid-state laser oscillator, a fiber laser oscillator, a disk laser oscillator, or a direct diode laser oscillator (DDL oscillator).

[0052] The laser oscillator 10 emits a laser beam in the 1-μm band with a wavelength of 900 nm to 1100 nm. Taking a fiber laser oscillator and a DDL oscillator as examples, the fiber laser oscillator emits a laser beam with a wavelength of 1060 nm to 1080 nm, and the DDL oscillator emits a laser beam with a wavelength of 910 nm to 950 nm.

[0053] The laser processing unit 20 includes a processing table 21 for placing a metal plate W as a material to be cut, a gantry-type X-axis carriage 22, a Y-axis carriage 23, a collimator unit 30 fixed to the Y-axis carriage 23, and a processing head 35. The X-axis carriage 22 is configured to be movable along the X-axis direction on the processing table 21. The Y-axis carriage 23 is configured to be movable along the Y-axis direction perpendicular to the X-axis on the X-axis carriage 22. The X-axis carriage 22 and the Y-axis carriage 23 function as a moving mechanism for moving the processing head 35 along the surface of the metal plate W in the X-axis direction, the Y-axis direction, or any combined direction of the X-axis and the Y-axis.

[0054] Alternatively, instead of moving the processing head 35 along the surface of the metal plate W, it is configured such that the position of the processing head 35 is fixed and the metal plate W is moved. The laser processing machine 100 only needs to be provided with a moving mechanism for relatively moving the processing head 35 with respect to the surface of the metal plate W. The NC device 50 controls the movement of the processing head 35 performed by the moving mechanism (X-axis carriage 22 and Y-axis carriage 23).

[0055] A nozzle 36 is attached to the processing head 35. The nozzle 36 has a circular opening 36a at its front end, and a laser beam is emitted from the opening 36a. The laser beam emitted from the opening 36a of the nozzle 36 is irradiated onto the metal plate W. The auxiliary gas supply device 80 supplies nitrogen, oxygen, a mixed gas of nitrogen and oxygen, or air as the auxiliary gas to the processing head 35. During the processing of the metal plate W, the auxiliary gas is blown from the opening 36a toward the metal plate W. The auxiliary gas discharges the molten metal within the cut width formed by melting the metal plate W.

[0056] Figure 2 It is a conceptual diagram showing a height adjustment mechanism 38 for adjusting the position of the processing head 35 in the height direction. As Figure 2 shown, the laser processing unit 20 is provided with a height adjustment mechanism 38 for adjusting the position of the processing head 35 in the height direction. The height direction is the Z-axis direction perpendicular to the X-axis and the Y-axis. Specifically, the processing head 35 is movable in the Z-axis direction by a ball screw or a rack and pinion, and the height adjustment mechanism 38 moves the processing head 35 in the Z-axis direction by a servo motor or a linear motor. Sometimes at least a part of the height adjustment mechanism 38 is present inside the processing head 35.

[0057] The distance between the front end of the nozzle 36 and the surface of the metal plate W is adjusted by adjusting the position of the processing head 35 in the Z-axis direction by the height adjustment mechanism 38. The NC device 50 controls the position of the processing head 35 in the Z-axis direction based on the height adjustment mechanism 38.

[0058] Figure 3 It is a perspective view showing a detailed structural example of the collimator unit 30 and the processing head 35 in the laser processing machine 100. As Figure 3 shown, the collimator unit 30 includes a collimator lens 31 that converts the divergent laser beam emitted from the process optical fiber 12 into parallel light (collimated light). In addition, the collimator unit 30 is provided with a galvanometer scanner unit 32 and a bending mirror 33 that reflects the laser beam emitted from the galvanometer scanner unit 32 downward in the Z-axis direction. The processing head 35 is provided with a focusing lens 34 that focuses the laser beam reflected by the bending mirror 33 and irradiates it onto the metal plate W.

[0059] In order to adjust the focal position of the laser beam, the focusing lens 34 is configured to be movable in a direction approaching the metal plate W and a direction away from the metal plate W by a drive unit and a moving mechanism (not shown).

[0060] The laser processing machine 100 centers the laser beam emitted from the opening 36a of the nozzle 36 so that it is located at the center of the opening 36a. In a reference state, the laser beam is emitted from the center of the opening 36a. The galvanometer scanner unit 32 functions as a beam vibration mechanism that vibrates the laser beam traveling in the processing head 35 and emitted from the opening 36a within the opening 36a.

[0061] The galvanometer scanner unit 32 includes: a scanning mirror 321 that reflects the laser beam emitted from the collimator lens 31; and a drive unit 322 that rotates the scanning mirror 321 by a predetermined angle. In addition, the galvanometer scanner unit 32 includes: a scanning mirror 323 that reflects the laser beam emitted from the scanning mirror 321; and a drive unit 324 that rotates the scanning mirror 323 by a predetermined angle. The drive units 322 and 324 can be constituted by motors.

[0062] The drive units 322 and 324 can reciprocally vibrate the scanning mirrors 321 and 323, respectively, within a predetermined angle range based on the control of the NC device 50. By reciprocally vibrating either one or both of the scanning mirror 321 and the scanning mirror 323, the galvanometer scanner unit 32 vibrates the laser beam irradiated onto the metal plate W.

[0063] The galvanometer scanner unit 32 is an example of a beam vibration mechanism, and the beam vibration mechanism is not limited to the galvanometer scanner unit 32 having a pair of scanning mirrors.

[0064] Figure 4 It is a diagram for explaining the shift of the irradiation position of the laser beam onto the metal plate W by the beam vibration mechanism. Figure 4 It shows a state in which the position of the laser beam irradiated onto the metal plate W has shifted due to the inclination of either one or both of the scanning mirror 321 and the scanning mirror 323. In Figure 4 the solid line representing the laser beam that is bent by the bending mirror 33 and passes through the focusing lens 34 indicates the optical axis of the laser beam in the state with the laser processing machine 100 as a reference.

[0065] Furthermore, specifically, due to the operation of the galvanometer scanner unit 32 located in front of the bending mirror 33, the angle of the optical axis of the laser beam incident on the bending mirror 33 changes, and the optical axis deviates from the center of the bending mirror 33. In Figure 4 for simplicity, the incident position of the laser beam on the bending mirror 33 is set to the same position before and after the operation of the galvanometer scanner unit 32.

[0066] By the action of the galvanometer scanner unit 32, the optical axis of the laser beam is displaced from the position shown by the thin solid line to the position shown by the thick solid line. When the laser beam reflected by the bending mirror 33 is inclined at an angle θ, the irradiation position of the laser beam on the metal plate W is displaced by a distance Δs. If the focal length of the focusing lens 34 is set as EFL (Effective Focal Length), the distance Δs is calculated by EFL×sinθ.

[0067] If the galvanometer scanner unit 32 inclines the laser beam at an angle θ in the direction opposite to the Figure 4 direction shown, the irradiation position of the laser beam on the metal plate W can be displaced by a distance Δs in the direction opposite to the Figure 4 direction shown. The distance Δs is a distance smaller than the radius of the opening 36a, and preferably is a distance equal to or less than the maximum distance obtained by subtracting a predetermined margin from the radius of the opening 36a.

[0068] The NC device 50 can vibrate the laser beam in a predetermined direction within the plane of the metal plate W by controlling the drive units 322 and 324 of the galvanometer scanner unit 32. By vibrating the laser beam, the beam spot formed on the surface of the metal plate W can be vibrated. The galvanometer scanner unit 32 can move the position of the laser beam irradiated on the metal plate W, that is, the position of the beam spot formed on the surface of the metal plate W, based on the control of the NC device 50.

[0069] The laser processing machine 100 configured as described above manufactures a product having a predetermined shape by cutting the metal plate W with the laser beam emitted from the laser oscillator 10. The laser processing machine 100 positions the focus of the laser beam at an arbitrary appropriate position on the upper surface of the metal plate W, above the upper surface by a predetermined distance, or below the upper surface by a predetermined distance and within the plate thickness of the metal plate W, and cuts the metal plate while vibrating the laser beam in a predetermined trajectory pattern.

[0070] A machining program for cutting the metal plate W is stored in the machining program database 60. The NC device 50 reads out the machining program from the machining program database 60 and selects any one of the plurality of machining condition files stored in the machining condition database 70. Various machining conditions are set in the machining condition file. The NC device 50 controls the laser processing machine 100 to cut the metal plate W based on the read machining program and the machining conditions set in the selected machining condition file. The machining condition file selected by the NC device 50 is specified in the machining program.

[0071] The laser processing machine 100 configured as described above preferably forms a hole within the range of the opening 36a of the nozzle 36 in the metal plate W, and a laser processing method according to one or more embodiments will be described. Here, as the hole within the range of the opening 36a, a round hole having a diameter smaller than the diameter of the opening 36a is taken as an example. The hole within the range of the opening 36a is not limited to a round hole (perfect circle), and may be any shape such as a long hole, an ellipse, a square, a rectangle, or a polygon with five or more sides.

[0072] Figure 5A Shows an example of a round hole formed in the metal plate W and having a diameter smaller than the diameter of the opening 36a of the nozzle 36. Figure 5B Shows the formation of a Figure 5A hole formation area before the round hole shown in the metal plate W. As Figure 5A shown, the laser processing machine 100 forms a round hole h0 in the metal plate W having a diameter smaller than the diameter of the opening 36a of the nozzle 36. As Figure 5B shown, the area to form the round hole h0 before forming the round hole h0 in the metal plate W is referred to as the hole formation area Ah0.

[0073] The NC device 50 positions the processing head 35 directly above the hole formation area Ah0 in a state where the position of the laser beam irradiated onto the metal plate W is not shifted by the galvanometer scanner unit 32. At this time, the processing head 35 is positioned, for example, at a position where the laser beam emitted from the nozzle 36 irradiates the center of the hole formation area Ah0. In this state, the NC device 50 controls the laser oscillator 10 to turn on the laser beam. Then, as Figure 5B shown, the position irradiated with the laser beam within the hole formation area Ah0 becomes the processing start position P0.

[0074] After the NC device 50 starts irradiating the laser beam at the processing start position P0, it controls the X-axis carriage 22 and the Y-axis carriage 23 so that the position of the processing head 35 in the direction of the surface of the metal plate W becomes a fixed position until the formation of the round hole h0 is completed. In the machining program, it is instructed not to move the position of the processing head 35 in the direction of the surface of the metal plate W.

[0075] Figure 6A And Figure 6B respectively show the first example and the second example of an arc-shaped trajectory formed by shifting the laser beam irradiated onto the metal plate W by controlling the galvanometer scanner unit 32 by the NC device 50. As Figure 6A And Figure 6B shown, in order to form a hole of the size of the round hole h0 in the metal plate W, it is necessary to move the beam spot Bs circularly at a position shifted inward from the hole formation area Ah0 by the radius of the beam spot Bs.

[0076] In Figure 6AIn this case, the NC device 50 controls the galvanometer scanner unit 32 to shift the light beam point Bs so that the light beam point Bs located at the machining start position P0 depicts an arc-shaped locus Tap1 until the end he1 of the hole formation region Ah0. Next, the NC device 50 controls the galvanometer scanner unit 32 to move the light beam point Bs so that the light beam point Bs moves in a circular shape along the entire circumferential end (inner circumferential end) of the hole formation region Ah0 to depict a full-circumference locus Tcc.

[0077] In Figure 6B this case, the NC device 50 controls the galvanometer scanner unit 32 to shift the light beam point Bs so that the light beam point Bs located at the machining start position P0 depicts an arc-shaped locus Tap2 until the end he2 of the hole formation region Ah0. Next, the NC device 50 controls the galvanometer scanner unit 32 to move the light beam point Bs so that the light beam point Bs moves in a circular shape along the inner circumferential end, i.e., the entire circumferential end, of the hole formation region Ah0 to depict a full-circumference locus Tcc.

[0078] The NC device 50 controls the height adjustment mechanism 38 so that the distance between the tip of the nozzle 36 and the surface of the metal plate W is a fixed distance of 1.0 mm or more and 6.0 mm or less until the irradiation of the laser beam starts at the machining start position P0 and the formation of the circular hole h0 is completed. Thus, even when the machining of forming the circular hole h0 on the metal plate W is repeated multiple times, compared with the case where the distance between the tip of the nozzle 36 and the surface of the metal plate W is set to an extremely close distance such as 0.3 mm, spatter is less likely to accumulate inside the nozzle 36, and a machinable state can be maintained for a long time.

[0079] Although not shown in Figure 3 this case, a protective glass is disposed between the focusing lens 34 and the nozzle 36, and this protective glass protects the focusing lens 34 from spatter attachment. By setting the distance between the tip of the nozzle 36 and the surface of the metal plate W to 1.0 mm or more and 6.0 mm or less, the amount of spatter flying toward the nozzle 36 can be reduced, so the amount of spatter flying toward the protective glass becomes less, and the protective glass is less likely to be soiled. The reason for setting the distance between the tip of the nozzle 36 and the surface of the metal plate W to 1.0 mm or more is that if the distance is set to less than 1.0 mm, the amount of spatter flying toward the nozzle 36 or the protective glass will increase significantly. The reason for setting the distance between the tip of the nozzle 36 and the surface of the metal plate W to 6.0 mm or less is that if the distance exceeds 6.0 mm, the amount of dross adhering to the metal plate W will increase significantly.

[0080] Preferably, the distance between the front end of the nozzle 36 and the surface of the metal plate W is set to be 3.0 mm or more and 5.0 mm or less. If the distance between the front end of the nozzle 36 and the surface of the metal plate W is 3.0 mm or more, the amount of spatter flying onto the nozzle 36 or the protective glass can be significantly reduced, and the processable state can be maintained for a longer time. If the distance between the front end of the nozzle 36 and the surface of the metal plate W is 5.0 mm or less, the processing quality of the metal plate W can be improved.

[0081] Preferably, the NC device 50 controls the galvanometer scanner unit 32 so that after irradiating the metal plate W with a laser beam for a predetermined time exceeding 0 at the processing start position P0, the laser beam is moved to the end he1 or he2 of the hole formation region Ah0. If the laser beam is moved to the end he1 or he2 while the laser beam is turned on at the processing start position P0, the spatter generated at the processing start position P0 and its periphery tends to concentrate and fly in a certain direction. In contrast, if the metal plate W is irradiated with a laser beam for a predetermined time exceeding 0 at the processing start position P0 to form a recess having at least a predetermined depth at the processing start position P0, the spatter generated at the processing start position P0 and its periphery tends to disperse in multiple directions.

[0082] The NC device 50 preferably controls the galvanometer scanner unit 32 in such a manner that the metal plate W is irradiated with a laser beam for a time to form a perforation at the processing start position P0. As an example, the NC device 50 controls the galvanometer scanner unit 32 to, for example, set a pause of 5 ms after turning on the laser beam at the processing start position P0 so that the position of the laser beam does not shift for 5 ms. If a pause of, for example, 5 ms is set at the processing start position P0 to form a perforation at the processing start position P0, at least a part of the spatter is discharged to the back side of the metal plate W, and the spatter tends to disperse in multiple directions including the back side.

[0083] In Figure 6A and Figure 6B the processing start position P0 does not necessarily need to be located at the center of the hole formation region Ah0. If the processing start position P0 is located at the center of the hole formation region Ah0, the trajectories Tap1 and Tap2 can be semi - circles having the radius of the hole formation region Ah0 as the diameter. In this way, the arc - shaped trajectories Tap1 and Tap2 are connected to the trajectory Tcc by the tangents to the entire - circumference trajectory Tcc, so that there is almost no shape damage at the ends he1 or he2, and a round hole h0 with good shape accuracy is formed.

[0084] The NC device 50 controls the galvanometer scanner unit 32 so that the beam spot Bs moves circularly in a manner exceeding 1 turn.

[0085] The distance between the tip of the nozzle 36 and the surface of the metal plate W is set as one of the processing conditions in the processing condition file from the start of the irradiation of the laser beam at the processing start position P0 until the formation of the circular hole h0 is completed. In the processing program described later, it is set to make the beam spot Bs orbit around the entire circumferential end for several weeks.

[0086] Figure 7 Yes Figure 6A The first example shown in the figure shows the process of forming the perforation Ps, the approach path AP1, and the full-circumference cutting groove Cc in the metal plate W. The laser beam does not shift at the processing start position P0 for, for example, 5 ms, so the perforation Ps is formed at the processing start position P0 of the metal plate W. In addition, an arc-shaped path AP1 connected to the perforation Ps is formed in the metal plate W. The path AP1 is a groove with a width approximately equivalent to the diameter of the beam spot Bs. After the path AP1 reaches the end he1 of the hole formation region Ah0, the entire circumferential end of the hole formation region Ah0 is cut by the circumferential movement of the laser beam to form the full-circumference cutting groove Cc. The path AP1 is connected to the circumferential cutting groove Cc with a tangent line relative to the circumferential cutting groove Cc, thereby forming a circular hole h0 with good shape accuracy.

[0087] In Figure 7 , the NC device 50 controls the laser oscillator 10 so that the beam spot Bs orbits with an orbiting amount of more than one week, and then, for example, turns off the laser beam at the end he1. As shown by the dashed arrow line, assuming that if the laser beam is turned on, the position where the laser beam is irradiated becomes the processing start position P0, the NC device 50 controls the galvanometer scanner unit 32 to return to the state before the formation of the circular hole h0.

[0088] In addition, the time for turning on the laser beam when forming one circular hole h0 in the metal plate W is determined by the pause time, the time for forming the path AP1, and the time for the beam spot Bs to orbit around the entire circumferential end of the hole formation region Ah0.

[0089] As described above, according to the laser processing machine 100 and the laser processing method executed by the laser processing machine 100, the NC device 50 controls the X-axis carriage 22 and the Y-axis carriage 23 so that the processing head 35 is in a fixed position. In this state, the NC device 50 controls the galvanometer scanner unit 32 to form a circular hole h0 having a diameter smaller than the diameter of the opening 36a of the nozzle 36 on the metal plate W. Therefore, it is possible to form a circular hole h0 having a diameter smaller than the diameter of the opening 36a of the nozzle 36 on the metal plate W in a short time.

[0090] The laser processing machine 100 and the laser processing method performed by the laser processing machine 100 set the distance between the tip of the nozzle 36 and the surface of the metal plate W to be 1.0 mm or more and 6.0 mm or less from the start of machining the round hole h0 to the completion of the formation of the round hole h0. Therefore, according to the laser processing machine 100 and the laser processing method performed by the laser processing machine 100, the amount of spatter flying onto optical components such as the nozzle 36 or the protective glass can be reduced. As a result, spatter is less likely to accumulate inside the nozzle 36 or on the optical components, and the machinable state can be maintained for a long time.

[0091] In the laser processing machine 100 and the laser processing method performed by the laser processing machine 100, as described below, the amount of spatter flying onto the nozzle 36 is further reduced. In the laser processing machine 100 and the laser processing method performed by the laser processing machine 100, a pause is set for a predetermined time after the laser beam is turned on at the machining start position P0. Therefore, a recess (preferably a perforation Ps) of a predetermined depth is formed at least at the machining start position P0, and the beam spot Bs moves in such a way that a path AP1 is formed after the recess or the perforation Ps is formed. As a result, the amount of spatter flying onto the nozzle 36 can be further reduced, spatter is less likely to accumulate inside the nozzle 36, and the optical components are less likely to be soiled.

[0092] In addition, in the laser processing machine 100 and the laser processing method performed by the laser processing machine 100, the path AP1 is set to be arc-shaped instead of linear. Therefore, since the spatter scatters while rotating, it does not scatter in one direction, and the direction of spatter scattering is dispersed. As a result, the amount of spatter flying onto the nozzle 36 can be further reduced, spatter is less likely to accumulate inside the nozzle 36, and the optical components are less likely to be soiled.

[0093] Figures 8A to 8D Instead of Figure 6A The first to fourth examples of the spiral trajectories Tap11 to Tap14 from the machining start position P0 to the end he1 of the hole formation region Ah0, which represent the spiral trajectories for forming the spiral path instead of the arc-shaped trajectory Tap1 shown, are shown. The NC device 50 controls the galvanometer scanner unit 32 to shift the beam spot Bs in such a way as to draw the spiral trajectories Tap11 to Tap14. If a spiral path is formed on the metal plate W, the direction of spatter scattering can be dispersed, and the amount of spatter flying onto the nozzle 36 can be reduced.

[0094] As Figures 8A to 8D shown, when the beam spot Bs is moved from the machining start position P0 to the end he1 in such a way as to draw the spiral trajectories Tap11 to Tap14, the ends of the trajectories Tap11 to Tap14 are smoothly connected to the entire circumference trajectory Tcc. Therefore, there is almost no shape deformation at the end he1, and a round hole h0 with good circular shape accuracy is formed. Compared withFigures 8A to 8D , from the viewpoint of dispersing the direction in which the sputtered matter scatters, it is preferable that the winding amount in the spiral is large, and most preferably Figure 8D the trajectory Tap14 shown.

[0095] In Figure 6A , Figure 6B , Figures 8A to 8D any one of them, it is preferable that the NC device 50 controls the galvanometer scanner unit 32 so that the front end in the path is connected to the tangent direction at the end he1 or he2 of the hole forming region Ah0 from the end he1 or he2.

[0096] Here, with reference to Figures 9 to 11 a method for manufacturing a machining program and a method for configuring a machining program according to one or more embodiments will be described. According to the method for manufacturing a machining program and the method for configuring a machining program according to one or more embodiments, a machining program suitable for the laser processing machine 100 described above and the laser processing method executed by the laser processing machine 100 can be manufactured, and a suitable machining program can be configured.

[0097] Figure 9 shows a specific structural example of the CAM device 40. Figure 10 shows an example of a setting image used in the previous stage of manufacturing a machining program in the CAM device 40. The CAM device 40 includes a central processing unit (hereinafter referred to as CPU) 401, a non-transitory storage medium 402 that stores the CAM program, an operation unit 403, and a display unit 404. The CPU 401 executes the CAM program and displays Figure 10 the setting image shown, and manufactures a machining program according to the settings and various conditions in the setting image. The various conditions include the laser processing machine 100 used, the material and thickness of the metal plate W, and the graphic data of the product with holes to be manufactured by cutting the metal plate W. The graphic data is CAD data manufactured by a CAD (Computer Aided Design) device (not shown).

[0098] The processing of forming a hole of a predetermined shape by moving the position on the metal plate W irradiated with the laser beam within the opening 36a of the nozzle 36 mounted at the front end of the processing head 35 while keeping the processing head 35 in a stopped state is called head-fixed hole processing. The operator Figure 10 in the setting image shown, sets whether to make the execution of head-fixed hole processing effective or ineffective by operating the operation unit 403. In Figure 10 , by selecting the item described as "make head-fixed hole processing effective", the execution of head-fixed hole processing can be made effective.

[0099] The operator is in Figure 10In the set image shown, the shape of the target hole for which the execution head fixing hole machining is made effective is set by operating the operation unit 403. In Figure 10 the example shown, options for the shapes of a round hole, an oblong hole, a square hole, a rectangular hole, and other holes are listed. Here, the round hole is checked and set as the target hole. The operator Figure 10 in the set image shown sets the minimum size and the maximum size of the target hole by operating the operation unit 403. The minimum size may also be the minimum diameter that can be opened by the head fixing hole machining, which is determined by the diameter of the beam spot Bs. The maximum size may also be the maximum diameter of the hole that converges within the range of the opening 36a.

[0100] The operator Figure 10 in the set image shown sets the overlap coefficient by operating the operation unit 403. The overlap coefficient is a coefficient that determines the circumferential time for the laser beam in the opened state to move along the entire circumferential end of the target hole to be formed in the metal plate W by the head fixing hole machining. The operator Figure 10 in the set image shown selects the machining condition number that designates the machining condition file by operating the operation unit 403.

[0101] Figure 11 shows an example of a machining program created by the CPU 401 based on the set image and various conditions set as Figure 10 shown. In Figure 11 , M102 designates the metal plate W to be machined. Here, the metal plate W is SPC-1.0, which is a cold-rolled steel plate with a thickness of 1.0 mm. Although not shown in Figure 10 , the material and thickness of the metal plate W are selected by operating the operation unit 403. "G92X3070.Y1550." indicates the reference position (origin position) where the machining head 35 is located. This is determined by the laser processing machine 100 used.

[0102] M100 is an automatically set code indicating the start of the laser mode. E3 is the machining condition number selected in the Figure 10 set image shown. In the machining condition file with the machining condition number E3 stored in the machining condition database 70, the distance between the front end of the nozzle 36 and the surface of the metal plate W is set.

[0103] In “G112 I1.5 J1.5 L10 S3.”, G112 is the code indicating the opening of a round hole. This code is the same as the code indicating the opening of a round hole on the metal plate W by moving the processing head 35. The processing of forming a hole with a predetermined shape by moving the processing head 35 that emits a laser beam is called head movement hole processing. In the machining program produced by the CAM device 40, the same code is used to indicate the formation of a hole with a predetermined shape in both head movement hole processing and head-fixed hole processing.

[0104] I1.5 and J1.5 are address words (first address words) indicating that the size of the round hole in the X-axis direction is set to 1.5 mm and the size of the round hole in the Y-axis direction is set to 1.5 mm, respectively. The size of the round hole is determined by the size of the round hole in the graphic data. The size of the round hole in the graphic data is a size greater than or equal to the minimum size and less than or equal to the maximum size set in the Figure 10 set image shown. L10 is an address word (second address word) indicating the execution of head-fixed hole processing. S3 is an address word (third address word) representing the overlapping coefficient.

[0105] Here, it is explained how to specifically determine the circumferential time according to the address word S3. In Figure 11 the machining program for initially forming a round hole with a diameter of 1.5 mm is shown, but the case of forming a round hole with a diameter of 1.0 mm is taken as an example. The circumference of a round hole with a diameter of 1.0 mm is 3.14 mm. In the machining condition file with machining condition number E3, the machining speed is set to 54000 mm per minute (900 mm / s). At this time, the laser beam rotates 286.624 times per second according to 900 / 3.14. Therefore, the time for the laser beam to go around the round hole with a diameter of 1.0 mm (hole formation area) once is 0.0035 s according to 1 / 287. The address word S3 indicates that the time for the laser beam to go around the round hole once is 3 times, and it becomes 0.0105 s according to 3×0.0035 s.

[0106] The reason for taking the time that is 3 times the time for the laser beam to rotate around the round hole once through the address word S3 as the circumferential time is as follows. Regarding the scanning mirrors 321 and 323 in the galvanometer scanner unit 32, the smaller the diameter of the round hole, the lower the speed at which they have to rotate compared to the maximum rotation angle of the driving units 322 and 324 in terms of their capabilities. This is because the speeds of the two axes of the scanning mirrors 321 and 323 are zero when passing through the four inflection points. If the diameter of the round hole is large, sufficient acceleration can be achieved between the inflection points where the speed is zero, but if the diameter of the round hole is small, sufficient acceleration cannot be achieved.

[0107] If the time taken for the laser beam to go around the circular hole once is multiplied by 3 to obtain the circumferential time, then even if the diameter of the circular hole is small and the scanning mirrors 321 and 323 rotate at a speed much lower than the maximum rotation angle, the galvanometer scanner unit 32 can still cause the laser beam to go around the circular hole at least once. Here, a circular hole is used as an example for explanation, but the same applies to holes of other shapes.

[0108] In “G136 X100 Y100 I5 J5 P10 K2 L10”, G136 is a code indicating the setting of a grid pattern with multiple circular holes. X100 and Y100 represent the positions where the first circular hole is formed. I5 indicates that the pitch in the X-axis direction is 5 mm, J5 indicates that the pitch in the Y-axis direction is 5 mm, P10 indicates that the number of circular holes in the X-axis direction is 10, and K2 indicates that the number of circular holes in the Y-axis direction is 2. P10 and K2 mean that starting from the first circular hole formed at positions X100 and Y100, 10 more circular holes are further formed in the X-axis direction and 2 more circular holes are further formed in the Y-axis direction. They are determined by the number and arrangement of multiple circular holes in the graphic data.

[0109] Similarly, “G112 I2.8 J2.8 L10 S3.” represents an instruction to open a circular hole with a size of 2.8 mm in the X-axis direction and 2.8 mm in the Y-axis direction through head fixing hole machining. “G136 X100 Y200 I5 J5 P10 K2 L10” means that the first circular hole is formed at positions X100 and Y200, with a pitch of 5 mm in the X-axis direction, a pitch of 5 mm in the Y-axis direction, 10 circular holes in the X-axis direction, and 2 circular holes in the Y-axis direction. M101 represents the end of the laser mode, and G50 represents the end of the machining program. M101 and G50 are automatically set.

[0110] As described above, the method for creating a machining program according to one or more embodiments is as Figure 10 illustrated. As a pre-stage for creating a machining program, it is set whether to make the head fixing hole machining effective or not, and the shape of the target hole for which the head fixing hole machining is to be made effective is set. Also, the method for creating a machining program according to one or more embodiments sets the minimum size and the maximum size of the target hole, and sets an overlap coefficient for determining the circumferential time for causing the laser beam to move along the entire circumferential end of the target hole.

[0111] In the machining program manufacturing method according to more than one embodiment, when the execution head fixing hole machining is set to be effective, and the specific hole to be formed in the metal plate W is the target hole, and the size of the specific hole is equal to or greater than the minimum size and equal to or less than the maximum size, the machining program is manufactured as follows. The machining program manufacturing method according to more than one embodiment manufactures the machining program in the following manner: in the code instructing the formation of the specific hole, a statement formed by connecting a first address word, a second address word, and a third address word in an arbitrary order is included. The first address word specifies the size of the specific hole, the second address word instructs the execution head fixing hole machining, and the third address word represents the overlapping coefficient.

[0112] According to the machining program manufacturing method according to more than one embodiment, it is possible to manufacture a machining program suitable for forming holes within the range of the opening 36a of the nozzle 36 on the metal plate W by head fixing hole machining on the basis of setting various conditions of the execution head fixing hole machining.

[0113] The method for constructing a machining program according to more than one embodiment constructs the machining program in the following manner. The method for constructing a machining program according to more than one embodiment constructs the machining program in the following manner: in the code instructing the formation of a hole used in the head movement hole machining, a statement formed by connecting a first address word, a second address word, and a third address word in an arbitrary order is included.

[0114] According to the method for constructing a machining program according to more than one embodiment, it is not necessary to newly define the code for the head fixing hole machining, and it is possible to use the existing code instructing the formation of a hole in the metal plate W by moving the machining head 35 to construct the machining program for the head fixing hole machining.

[0115] In Figure 11 In the shown machining program, according to the instructions of "G112 I1.5 J1.5 L10 S3." and "G136 X100Y100I5 J5 P10 K2 L10", the round hole formed in the metal plate W is called hole h1. According to the instructions of "G112 I2.8 J2.8 L10S3." and "G136 X100 Y200 I5 J5 P10 K2 L10", the hole formed in the metal plate W is called hole h2.

[0116] Figure 12 Indicates by Figure 11 The state in which a plurality of holes are formed in the metal plate W in the shown machining program. When the NC device 50 controls the laser processing machine 100 to machine the metal plate W according to the Figure 11 shown machining program, as Figure 12As shown, three rows of holes h1 with a diameter of 1.5 mm and three rows of holes h2 with a diameter of 2.8 mm are formed in the metal plate W. One row of the holes h1 contains 11 holes h1 at a pitch of 5 mm in the X-axis direction, and the three rows of the holes h1 are arranged at a pitch of 5 mm in the Y-axis direction. One row of the holes h2 contains 11 holes h2 at a pitch of 5 mm in the X-axis direction, and the three rows of the holes h2 are arranged at a pitch of 5 mm in the Y-axis direction.

[0117] Form Figure 12 The time for forming all the holes h1 and h2 shown becomes the total time of the time for forming each hole h1 and each hole h2 in a state where the position of the processing head 35 is fixed, the time for moving the processing head 35 between adjacent holes h1, the time for moving the processing head 35 between adjacent holes h2, and the time for moving the processing head 35 from the last hole h1 to the first hole h2. Compared with the time for forming each hole h1 and each hole h2 while moving the processing head 35 without shifting the laser beam by the galvanometer scanner unit 32, the time for forming all these holes h1 and h2 is significantly shortened.

[0118] The present invention is not limited to the one or more embodiments described above, and various modifications can be made without departing from the gist of the present invention.

[0119] This application claims the priority based on Japanese Patent Application No. 2022-165552 filed with the Japan Patent Office on October 14, 2022, and the entire disclosure thereof is incorporated herein by reference.

Claims

1. A laser processing machine, characterized in that, it comprises: a laser oscillator that emits a laser beam; a processing head having a nozzle mounted at its front end, and the nozzle emits the laser beam emitted from the laser oscillator from an opening; a moving mechanism that moves the processing head along the surface of the material to be cut; a height adjustment mechanism that adjusts the position of the processing head in the height direction; a beam vibration mechanism that vibrates the laser beam emitted from the opening within the opening; and a control device that controls the laser oscillator, the moving mechanism, the height adjustment mechanism, and the beam vibration mechanism, when forming a hole within the range of the opening on the material to be cut, the control device controls the moving mechanism to set the processing head at a fixed position, the control device controls the laser oscillator to turn on the laser beam at the processing start position within the hole formation region where the hole is formed, the control device controls the beam vibration mechanism to move the laser beam from the processing start position to the end of the hole formation region to form a path, and move the laser beam along the entire circumferential end of the hole formation region to form the hole on the material to be cut, the control device controls the height adjustment mechanism to set the distance between the front end of the nozzle and the surface of the material to be cut to a fixed distance of 1.0 mm or more and 6.0 mm or less from the start of laser beam irradiation at the processing start position to the completion of hole formation.

2. The laser processing machine according to claim 1, characterized in that, the control device controls the beam vibration mechanism to form an arc-shaped path from the processing start position to the end of the hole formation region.

3. The laser processing machine according to claim 2, characterized in that, the control device controls the beam vibration mechanism to form a semi-circular path with the radius of the hole formation region as the diameter as the arc-shaped path.

4. The laser processing machine according to claim 1, characterized in that, the control device controls the beam vibration mechanism to form a spiral path from the processing start position to the end of the hole formation region.

5. The laser processing machine according to claim 2 or 4, characterized in that, the control device controls the beam vibration mechanism so that the front end portion in the path is connected to the end from the direction of the tangent of the end of the hole formation region.

6. The laser processing machine according to any one of claims 1 to 4, characterized in that, the control device controls the beam vibration mechanism so that after irradiating the laser beam at the processing start position for a predetermined time exceeding 0, the laser beam is moved to the end of the hole formation region.

7. A laser processing method, characterized in that, set to a state where the processing head stops, set the distance between the front end of the nozzle mounted on the processing head and the surface of the material to be cut to a fixed distance of 1.0 mm or more and 6.0 mm or less. Start irradiating the laser beam at the machining start position within the hole formation region where holes are to be formed within the range of the opening of the nozzle, thus starting the irradiation of the laser beam at the machining start position. Move the laser beam from the machining start position to the end of the hole formation region to form a path. Move the laser beam along the entire circumferential end of the hole formation region to form the hole in the material to be cut.

8. The laser processing method according to claim 7, characterized in that, A circular arc-shaped path is formed from the machining start position to the end of the hole formation region.

9. The laser processing method according to claim 8, characterized in that, A semi-circular path with the radius of the hole formation region as the diameter is formed as the circular arc-shaped path.

10. The laser processing method according to claim 7, characterized in that, A spiral path is formed from the machining start position to the end of the hole formation region.

11. The laser processing method according to claim 8 or 10, characterized in that, The path is formed such that the front end portion in the path is connected to the end in a direction tangential to the end of the hole formation region.

12. The laser processing method according to any one of claims 7 to 10, characterized in that, After irradiating the laser beam at the machining start position for a predetermined time exceeding 0, move the laser beam to the end of the hole formation region.

13. A method for manufacturing a machining program, characterized in that, A machining program is manufactured by the following method: Set whether the head-fixed hole machining is valid or invalid. The head-fixed hole machining is a state where the machining head stops when irradiating a laser beam emitted from the machining head onto the material to be cut to form a hole with a predetermined shape, and the hole is formed by moving the position on the material to be cut where the laser beam is irradiated within the range of the opening of the nozzle installed at the front end of the machining head; Set the shape of the target hole for which the head-fixed hole machining is to be executed as valid; Set the minimum size and maximum size of the target hole; Set a coefficient that determines the circumferential time for moving the laser beam in the on state along the entire circumferential end of the target hole to be formed in the material to be cut; When the head-fixed hole machining is set to be valid, and a specific hole to be formed in the material to be cut is the target hole, and the size of the specific hole is equal to or greater than the minimum size and equal to or less than the maximum size, in the code indicating the formation of the specific hole, include a statement formed by connecting a first address word, a second address word, and a third address word in any order, The first address word specifies the size of the specific hole, The second address word indicates the execution of the head-fixed hole machining, The third address word represents the coefficient.

14. A method for constructing a machining program, characterized in that, A machining program is constructed by the following method: In the code indicating the formation of a hole with a predetermined shape in the material to be cut by moving the machining head that emits a laser beam, include a statement formed by connecting a first address word, a second address word, and a third address word in any order, The first address word specifies the size of the hole, The second address word indicates the execution of head fixing hole machining, and the head fixing hole machining is set to a state where the machining head stops. The hole is formed by moving the position on the material to be cut where the laser beam is irradiated within the opening range of the nozzle mounted at the front end of the machining head. The third address word represents a coefficient that determines the circumferential time for moving the laser beam in the on state along the entire circumferential end of the hole to be formed in the material to be cut.

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