Avoiding recirculation zone in vacuum line of deposition tool

Abstract

An example provides a deposition tool. The deposition tool includes a processing chamber and a vacuum system. The vacuum system includes a vacuum line configured to carry an exhaust stream from the processing chamber. The vacuum system also includes a valve positioned within the vacuum line. The vacuum system also includes a purge gas inlet disposed along the vacuum line.

Description

Background Art

[0001] The semiconductor device manufacturing process may involve many steps of material deposition, patterning, and removal to form an integrated circuit on a substrate. Various methods can be used to selectively deposit materials onto the substrate. One example is chemical vapor deposition. The chemical vapor deposition process involves flowing one or more precursor gases over a substrate in a processing chamber. Conditions in the processing chamber are controlled so that the precursor gases react and / or decompose on the substrate surface to form a film. Summary of the Invention

[0002] The present invention content is provided to introduce a selection of concepts in a simplified form, which will be further described in the following detailed description. The present invention content is not intended to identify the key features or essential features of the claimed subject matter, nor is it intended to limit the scope of the claimed subject matter. In addition, the claimed subject matter is not limited to implementations that solve any or all of the disadvantages mentioned in any part of the present disclosure.

[0003] One example provides a deposition tool. The deposition tool includes a processing chamber and a vacuum system. The vacuum system includes a vacuum line configured to carry an exhaust gas flow from the processing chamber. The vacuum system also includes a valve positioned within the vacuum line. The vacuum system further includes a purge gas inlet disposed along the vacuum line.

[0004] In some such examples, the purge gas inlet is alternatively or additionally disposed upstream of the valve.

[0005] In some such examples, the purge gas inlet is alternatively or additionally disposed downstream of the valve.

[0006] In some such examples, the purge gas inlet is alternatively or additionally configured to direct a purge gas flow towards the valve.

[0007] In some such examples, the purge gas inlet is alternatively or additionally incorporated into a purge component that forms part of the vacuum line.

[0008] In some such examples, the purge gas inlet alternatively or additionally includes an opening formed in the purge component, the opening having an annular shape.

[0009] In some such examples, the purge gas inlet alternatively or additionally includes a gap formed in the purge component, the gap having a width configured to provide a uniform purge gas flow at different radial positions of the opening.

[0010] In some such examples, the purge gas inlet alternatively or additionally includes a plurality of openings formed in the purge component.

[0011] In some such examples, the purge component alternatively or additionally includes a flange configured to connect to a valve component that holds the valve.

[0012] In some such examples, the flange alternatively or additionally includes a groove and a seal located within the groove.

[0013] In some such examples, the purge gas inlet is alternatively or additionally a first purge gas inlet, and the deposition tool alternatively or additionally includes a second purge gas inlet that is disposed along the vacuum line on a side of the valve opposite the first purge gas inlet.

[0014] In some such examples, the purge gas inlet alternatively or additionally includes an opening in a side of the vacuum line.

[0015] In some such examples, the purge gas inlet is alternatively or additionally configured to direct the purge gas flow in an angled direction relative to an axial direction of the vacuum line.

[0016] In some such examples, the deposition tool alternatively or additionally includes a heater configured to heat the purge gas inlet.

[0017] Another example provides a purge component for a vacuum line of a deposition tool. The purge component includes a body that defines a portion of the vacuum line for an exhaust flow from a processing chamber. The purge component also includes a gas port configured to connect to a purge gas source. The purge component also includes a purge gas inlet fluidly connected to the gas port. The purge gas inlet is configured to direct a purge gas flow into the vacuum line. The purge component also includes a connector configured to couple the body to another component of the vacuum line.

[0018] In some such examples, the purge gas inlet alternatively or additionally includes an opening having an annular shape or a partial annular shape.

[0019] In some such examples, the purge gas inlet alternatively or additionally includes a gap having a width configured to provide a uniform purge gas flow at different radial positions of the opening.

[0020] In some such examples, the connector alternatively or additionally includes a flange that includes a groove for a seal.

[0021] Another example provides a pipe section component for a vacuum line of a deposition tool. The pipe section component includes a pipe section that defines a portion of the vacuum line for an exhaust gas flow from a processing chamber. The pipe section component also includes a purge gas inlet that includes an opening in one side of the pipe section. The pipe section component also includes a connector configured to couple the pipe section to another component of the vacuum line.

[0022] In some such examples, the purge gas inlet is alternatively or additionally configured to direct a purge gas flow in an angled direction relative to an axial direction of the exhaust gas flow through the vacuum line. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 An exemplary deposition tool is schematically shown.

[0024] Figure 2 An exemplary vacuum line including a purge component is schematically shown.

[0025] Figure 3 Schematically shown along Figure 2 taken along line 3-3 of Figure 2 a bottom view of the purge component.

[0026] Figure 4 A bottom view of another example purge component is schematically shown.

[0027] Figure 5 An exemplary vacuum line including a purge component with an angled gas port is schematically shown.

[0028] Figure 6 An exemplary vacuum line including a purge gas inlet upstream of a valve is schematically shown.

[0029] Figure 7 Another exemplary vacuum line including a purge gas inlet downstream of a valve is schematically shown. DETAILED DESCRIPTION

[0030] The term "annular shape" can generally denote a substantially annular shape that defines an opening.

[0031] The term "body" can generally denote a physical mass of a component of a vacuum line.

[0032] The term "chemical vapor deposition" (CVD) can generally denote a process that forms a solid-phase film on a substrate by directing one or more precursor gases over a substrate surface under conditions configured to cause chemical conversion of the precursor gases into the film.

[0033] The term "connector" generally can represent an entity structure configured to fasten a component of a vacuum line to an adjacent component of the vacuum line.

[0034] The term "deposition" and its variants generally can represent a process of forming a film on a substrate in a processing chamber. An example deposition process is CVD.

[0035] The term "deposition tool" generally can represent a machine that includes a processing chamber and other hardware configured to enable a deposition process to be performed in the processing chamber.

[0036] The term "exhaust gas" generally can represent the gas exhausted from the processing chamber of a deposition tool. Examples of the gas in the processing chamber exhaust include unreacted precursors, reaction by-products, and inert gases.

[0037] The term "flange" generally can represent an outwardly protruding edge of a component of a vacuum line to couple the component to another component of the vacuum line.

[0038] The term "gap" generally can represent a volume of space formed in a purge component, which serves as a plenum for the purge gas flow in the purge component.

[0039] The term "gas port" generally can represent a physical structure on a purge component configured to be connected to a purge gas source.

[0040] The term "opening" generally can represent a region along a vacuum line in which a purge gas is introduced into the vacuum line using a purge gas inlet.

[0041] The term "pipe segment" generally can represent a part of a pipe spool component that defines a passage for the exhaust gas flow from a processing chamber.

[0042] The term "precursor gas" generally can represent a material introduced into a processing chamber to form a film on a substrate disposed in the processing chamber. An exemplary precursor gas is tetraethyl orthosilicate (TEOS).

[0043] The term "processing chamber" generally can represent an enclosure in which chemical and / or physical processes are performed on a substrate. Exemplary chemical processes include deposition processes such as chemical vapor deposition (CVD).

[0044] The term "purge component" generally can represent an entity structure that forms part of a vacuum system. The purge component includes a purge gas inlet and a gas port.

[0045] The term "purge gas" generally can represent a gas used to remove other gases from at least a part of a processing chamber and / or at least a part of a vacuum line. Examples of the purge gas for a vacuum line include nitrogen, argon, and clean dry air.

[0046] The term "purge gas inlet" generally may denote a structure configured to direct a purge gas stream into the interior of a vacuum line.

[0047] The term "seal" generally may denote an entity structure that helps to separate one fluid environment from another. Exemplary seals include O-rings and centering rings.

[0048] The term "pipe section component" generally may denote an entity structure that forms part of the vacuum line of a deposition tool. The pipe section component may include a purge gas inlet.

[0049] The term "substrate" generally may denote any object on which a film may be deposited.

[0050] The term "vacuum line" generally may denote an entity path that includes pipes, valves, and other components for removing exhaust gas from a processing chamber of a deposition tool.

[0051] The term "vacuum system" generally may denote a vacuum line, one or more pumps, and other hardware configured to remove exhaust gas from a processing chamber of a deposition tool.

[0052] The term "valve" generally may denote an entity structure disposed within a vacuum line and used to maintain a process pressure in a processing chamber. Exemplary valves include pendulum valves and combination valves.

[0053] The term "valve component" generally may denote an entity structure that forms part of a vacuum line and holds a valve.

[0054] As described above, fabricating an integrated circuit on a substrate involves many independent steps such as material addition, patterning, modification, and removal. Chemical vapor deposition may be used to deposit films of various compositions on a substrate surface. Chemical vapor deposition involves exposing a substrate to one or more reactive precursor gases under conditions that cause the precursor gases to react and / or decompose on the substrate.

[0055] Chemical vapor deposition is typically carried out in a processing chamber under a controlled gas environment. During a chemical vapor deposition process, a vacuum system evacuates exhaust gas from the processing chamber and through a vacuum line for evacuation. The vacuum system may also include controllable valves that may be adjusted during operation to maintain a process pressure in the processing chamber.

[0056] However, under some conditions, a recirculation zone may form in the exhaust flow in the vacuum line near the valve. Such a recirculation zone may cause unreacted film precursors to accumulate in the recirculation zone. Over time, as the unreacted precursors are converted into particles of the deposited material, this may lead to the formation and accumulation of powder residues in the vacuum line. As a more specific example, unreacted TEOS in the vacuum line forms silica powder. This powder accumulation may cause a negative pressure leak, which may prevent the achievement of low-pressure processing conditions in the processing chamber. As a result, it may be difficult to achieve the substrate processing pressure conditions.

[0057] To avoid such problems, the vacuum line can be periodically disassembled and cleaned to remove the accumulated powder. However, such disassembly and cleaning result in a significant amount of tool downtime and associated costs.

[0058] One possible solution to prevent such powder formation is to add heaters along portions of the vacuum line to help avoid the condensation of precursor gases that can lead to powder accumulation. However, heating portions of the vacuum line may not be sufficient to prevent powder formation.

[0059] Accordingly, examples are disclosed that relate to introducing a purge gas into the vacuum line of a deposition tool to reduce the recirculation region in the vacuum line. In brief, the disclosed examples utilize purge gas inlets disposed along the vacuum line to reduce the recirculation region near the valve in the vacuum line. In various examples, the purge gas inlets can be disposed upstream and / or downstream of the valve. Each purge gas inlet directs a purge gas flow into the vacuum line along a direction that helps avoid the formation of a recirculating exhaust flow. In this way, the purge gas inlets can help reduce the recirculation region near the valve during the deposition process. Reducing the recirculation region helps reduce the residence time of unreacted precursor gases in the vacuum line. This can help avoid powder accumulation in the vacuum line. Although described herein in the context of TEOS precursor gas, the purge gas inlets can be used to reduce the recirculation region in the vacuum line during deposition of any suitable deposition process using any suitable precursor.

[0060] Before discussing these examples in detail, Figure 1 a schematic diagram of an exemplary deposition tool 100 is shown. In some examples, the deposition tool 100 can be configured to deposit large-area films at a relatively high deposition rate. In other examples, the deposition tool 100 can be configured for carbon chemical vapor deposition. The deposition tool 100 includes a first processing station 102A and a second processing station 102B positioned within a processing chamber 104. The first processing station 102A and the second processing station 102B are configured to expose substrates 106A, 106B to one or more precursor gases during a deposition process. The deposition tool 100 may also include Figure 1Additional stations not shown. In some examples, the deposition tool 100 includes four stations.

[0061] The first processing station 102A includes a first substrate holder 108A and a first substrate holder support 110A positioned within a first well portion 112A of the processing chamber 104. The first processing station 102A also includes a first process gas outlet 114A fluidly connected to a first precursor gas source 116A. The first precursor gas source 116A is configured to supply one or more precursor gases to the first process gas outlet 114A. The first substrate holder 108A supports the first substrate 106A during the deposition process. The first substrate holder support 110A can be configured to raise and lower the first substrate holder 108A, for example, to adjust the gap between the first substrate holder 108A and the first process gas outlet 114A.

[0062] Similarly, the second processing station 102B includes a second substrate holder 108B and a second substrate holder support 110B positioned within a second well portion 112B. The second processing station 102B also includes a second process gas outlet 114B fluidly connected to a second precursor gas source 116B. The second precursor gas source 116B is configured to supply one or more precursor gases to the second process gas outlet 114B. The second substrate holder 108B supports the second substrate 106B during the deposition process. The second substrate holder support 110B can be configured to raise and lower the second substrate holder 108B.

[0063] The processing tool 100 also includes a vacuum system 118 to evacuate the processing chamber 104. The vacuum system 118 includes a vacuum line 120 configured to carry an exhaust stream from the processing chamber 104. The vacuum system 118 also includes one or more pumps 121. The exhaust can include unreacted precursors, deposition by-products, and / or inert gases used in the deposition process. In the depicted example, the exhaust from the first processing station 102A enters the vacuum system 118 through a first discharge port 122A. Similarly, the exhaust from the second processing station 102B enters the vacuum system 118 through a second discharge port 122B. The vacuum lines from the first discharge port 122A and the second discharge port 122B then combine into the vacuum line 120. The vacuum system 118 also includes a valve assembly 124. The valve assembly 124 holds a valve configured to maintain the process pressure in the processing chamber 104 during the deposition process. Examples of valves include swing valves and combination valves.

[0064] The vacuum system 118 also includes a first purge gas inlet 126 disposed along the vacuum line 120. The first purge gas inlet 126 is configured to direct a purge gas flow into the vacuum line 120. In this example, the first purge gas inlet 126 is configured to direct the purge gas flow toward the valve of the valve member 124. Such a configuration can help reduce the recirculation region in the exhaust flow near the valve member 124. This can help reduce or prevent powder accumulation near the valve. In the depicted example, the first purge gas inlet 126 is incorporated into a purge member 128 upstream of the valve member 124. The purge member 128 forms part of the vacuum line 120. Although the purge member 128 is shown as a separate component of the vacuum line 120, in other examples, the purge member 128 may be incorporated into another component of the vacuum line 120.

[0065] The vacuum system 118 also includes a second purge gas inlet 130. The second purge gas inlet 130 is disposed downstream of the valve member 124. Similar to the first purge gas inlet 126, the second purge gas inlet 130 is configured to direct a purge gas flow into the vacuum line 120. In the depicted example, the second purge gas inlet 130 is incorporated into a pipe section member 132. The pipe section member 132 forms part of the vacuum line 120. In other examples, one of the first purge gas inlet 126 or the second purge gas inlet 130 may be omitted. Additionally, in still other examples, additional purge gas inlets may be included in the vacuum line of the deposition tool.

[0066] The deposition tool 100 also includes a purge gas source 134 that includes a purge gas that can be directed into the processing chamber 104. As shown, the purge gas is directed from the purge gas source 134 through a first purge valve 136 and a first orifice 138 to the first purge gas inlet 126. The first orifice 138 controls the flow rate of the purge gas passing through the first purge gas inlet 126. Thus, the size of the first orifice 138 can be selected based on the desired flow rate of the purge gas flowing toward the first purge gas inlet 126. In the depicted configuration, the first orifice 138 can be replaced without disrupting the vacuum conditions in the processing chamber 104. This can allow for adjustment of the purge gas flow rate without causing tool downtime. In other examples, a flow controller may be used in place of the first orifice 138.

[0067] Similarly, purge gas is also directed to the second purge gas inlet 130 through the second purge valve 140 and the second orifice 142. The second orifice 142 controls the flow rate of the purge gas through the second purge gas inlet 130. Thus, the size of the second orifice 142 can be selected based on the desired flow rate of the purge gas flowing to the second purge gas inlet 130. In the depicted configuration, the second orifice 142 can be replaced without disrupting the vacuum conditions of the processing chamber 104. Additionally, in other examples, a flow controller can be used to control the gas flow rate through the second purge gas inlet 130.

[0068] In Figure 1 examples, the purge gas flow to the first purge gas inlet 126 and the second purge gas inlet 130 can be controlled separately. For example, the purge flow time to the first purge gas inlet 126 and the second purge gas inlet 130 can be controlled separately by controlling the first purge valve 136 and the second purge valve 140. In the depicted example, the first purge gas inlet 126 and the second purge gas inlet 130 receive purge gas from a purge gas source 134. In other examples, the first purge gas inlet 126 and the second purge gas inlet 130 can each receive purge gas from a separate purge gas source. In some examples, the purge gas can be heated before reaching the first purge gas inlet 126 and / or the second purge gas inlet 130. Thus, each of the first purge gas inlet 126 and / or the second purge gas inlet 130 optionally includes a heater configured to heat the purge gas, as shown at 131 and 133. Heating the purge gas can further help avoid condensation of unreacted precursors in the vacuum line 120.

[0069] The deposition tool 100 also includes a controller 144 configured to control the deposition tool 100 to perform a process cycle. For example, the controller 144 is connected to the process valves 146A, 146B, the first purge valve 136, the second purge valve 140, and the chamber purge valve 148. The controller 144 can also be connected to the vacuum system 118. In some examples, when exhaust gas flows through the vacuum line 120, the controller 144 selectively directs purge gas to the first purge gas inlet 126 and / or the second purge gas inlet 130. As a more specific example, during a silicon oxide deposition process using TEOS as a precursor, nitrogen can be directed to the first purge gas inlet 126 and the second purge gas inlet 130. The controller 144 can also control the process valves 146A, 146B, the chamber purge valve 148, and the vacuum system 118 to control the pressure and gas composition within the processing chamber 104.

[0070] The controller 144 can also control the substrate holder supports 110A, 110B to raise and lower the substrate. The controller 144 can additionally control Figure 1Other components not shown, such as a substrate holder heater, a gas line heater, a substrate transfer robot, a load lock, and / or any other suitable components.

[0071] Figure 2 A schematic diagram showing a portion of an exemplary vacuum line 200 of a vacuum system schematically. Vacuum line 200 is an example of vacuum line 120. Vacuum line 200 includes a valve member 202 that holds valve 204. In the depicted example, valve 204 includes a swing valve. In other examples, valve 204 may include a combination valve or other suitable valve. For clarity, the pipe section components above and below the depicted portion of vacuum line 200 are omitted.

[0072] Vacuum system 200 also includes a purge component 206. Purge component 206 includes a body 208. Body 208 defines a first portion of vacuum line 200. A first purge gas inlet 212 is in fluid communication with a gas port 214. Gas port 214 is configured to be connected to a purge gas source. First purge gas inlet 212 is configured to direct a purge gas flow into vacuum line 200. As shown, gas port 214 includes an orientation that is approximately orthogonal to first purge gas inlet 212. In other examples, the gas port may have an orientation different from the depicted orientation.

[0073] First purge gas inlet 212 includes an opening 216. First purge gas inlet 212 also includes a gap 218 between gas port 214 and opening 216. Gap 218 is configured to serve as a plenum chamber for the purge gas flow from gas port 214. Thus, gap 218 has a width configured to provide a suitably uniform purge gas flow through opening 216 at different radial positions of opening 216. The term "suitably uniform purge gas flow" is a flow that reduces the formation of a recirculation region in which powder may accumulate due to unreacted precursors. More specifically, the width of the gap is configured to allow the purge gas to flow circumferentially through gap 218 and then through opening 216 towards valve 204. With such a configuration, gap 218 can help reduce the recirculation region near valve 204. In this way, gap 218 helps reduce powder accumulation near valve 204. The width of gap 218 and / or the flow rate of the purge gas through first purge gas inlet 212 can be selected based on a desired velocity profile, which results in a reduction of the recirculation region and the species mass fraction of the precursor gas at positions where a recirculation region may form.

[0074] The cleaning component 206 further includes a connector. The connector is configured to couple the body 208 to the valve component 202. As shown, the connector includes a flange 220, and the flange 220 includes a groove 222 for a seal 224. The seal 224 may include an O-ring, a centering ring, or any other suitable seal. In other examples, any other suitable connector may be used. The cleaning component 206 also includes a second connector (not shown in the figure) on the opposite end compared to the flange 220 to couple the body 208 to another component of the vacuum line 200. Although the cleaning component 206 is shown adjacent to the valve component 202, in other examples, an intermediate component may be located between the cleaning component 206 and the valve component 202. In a further example, the cleaning component may alternatively or additionally be positioned downstream of the valve 204.

[0075] The vacuum system 200 further includes a pipe section component 226 positioned downstream of the valve 204. The pipe section component 226 includes a pipe section 228. The pipe section 228 defines another portion of the vacuum line 200. The pipe section component 226 also includes a second purge gas inlet 232, and the second purge gas inlet 232 includes an opening 234 in one side of the pipe section 228. In this example, the second purge gas inlet 232 is configured to direct the purge gas flow along an angled line direction with respect to the axial direction of the exhaust flow through the vacuum line 200. As shown, the angled direction is towards the valve 204. This helps to reduce the recirculation area near the valve 204. Thus, this may help to reduce or avoid powder formation and accumulation. The angle of the angled direction may be selected based at least on the desired velocity profile near the valve 204. In other examples, the second purge gas inlet 232 may direct the purge gas flow along any other suitable direction other than the direction shown. The pipe section component 226 also includes a connector 236. The connector 236 includes a flange and is configured to couple the pipe section 228 to the valve component 202. In other examples, other suitable connectors may be used. The pipe section component 226 also includes a second connector (not shown in the figure) located on the opposite end compared to the connector 236 to couple the pipe section 228 to another component of the vacuum line 200.

[0076] In the depicted example, the pipe section component 226 includes a single purge gas inlet. In other examples, the pipe section component may include two or more purge gas inlets. Each purge gas inlet may direct the purge gas flow along any suitable direction to help prevent the formation of a recirculation area.

[0077] Figure 3 Schematically shown along Figure 2A bottom view of the cleaning component 206 taken along line 3-3. As previously described, the first cleaning gas inlet 212 includes an opening 216. As shown, the opening 216 has an annular shape. The annular shape may help reduce the recirculation area around the circumference of the vacuum line 200. In other examples, the opening 216 may have a partial annular shape or other suitable shape.

[0078] Figure 4 A bottom view schematically showing another exemplary cleaning component 400 including a plurality of openings. The cleaning component 400 is an example of the cleaning component 128. The cleaning component 400 includes a body 402 that defines a portion of the vacuum line 404. The cleaning component 400 also includes a cleaning gas inlet 406 configured to direct a cleaning gas flow into the vacuum line 404. As shown, the cleaning gas inlet 406 includes a plurality of openings 408 formed in the cleaning component 400. In other examples, the cleaning gas inlet 406 may include a different arrangement of a plurality of openings. The cleaning component 400 also includes a connector 410 in the form of a flange.

[0079] Figure 5 A portion of another exemplary vacuum line 500 having a cleaning component 502 is schematically depicted. The cleaning component 502 includes an angled gas port. The vacuum line 500 is an example of the vacuum line 120. The vacuum line 500 includes a valve member 504 that holds a valve 506. The cleaning component 502 is positioned upstream of the valve 506. The cleaning component 502 includes a body 508 that defines a portion of the vacuum line 500. The first cleaning gas inlet 512 is in fluid communication with the gas port 514. The gas port 514 is configured to be connected to a cleaning gas source. The first cleaning gas inlet 512 is configured to direct a cleaning gas flow into the vacuum line 500. As shown, the gas port 514 includes an angled orientation relative to the first cleaning gas inlet 512. Such an arrangement may help reduce the velocity loss of the cleaning gas flow compared to a gas port having an orthogonal orientation. The cleaning component 502 also includes a connector 516 to connect the cleaning component 502 to the valve member 504 or other suitable component.

[0080] The vacuum system 500 also includes a pipe section component 522 positioned downstream of the valve 506. A pipe section 524 of the pipe section component 522 defines another portion of the vacuum pipeline 500. The pipe section component 522 includes a second purge gas inlet 528. The second purge gas inlet 528 includes an opening in one side of the pipe section 524. As shown, the second purge gas inlet 528 is configured to direct a purge gas flow in a direction substantially orthogonal to the axial direction of the exhaust gas flow through the vacuum pipeline 500. In other examples, the pipe section component may include two or more purge gas inlets. The pipe section component 522 also includes a connector 530. The connector 530 is configured to connect the pipe section 524 to the valve component 504 to connect the pipe section component 522 to the valve component 504 or other suitable components.

[0081] In the above example, the first purge gas inlet is provided upstream of the valve, and the second purge gas inlet is provided downstream of the valve. In other examples, the vacuum system may use a single purge gas inlet. Figure 6 A portion of an exemplary vacuum pipeline 600 is schematically shown, where a purge gas inlet 602 is provided upstream of a valve 604. The vacuum pipeline 600 can be used in, for example, a deposition tool 100. The vacuum pipeline 600 includes a valve component 606 that holds the valve 604. A purge component 608 is positioned upstream of the valve 604. The purge component 608 includes a body 610 that defines a portion of the vacuum pipeline 600. The purge component 608 also includes a purge gas inlet 602 that is in fluid communication with a gas port 614. In various examples, the purge gas inlet 602 and the gas port 614 can be configured in any suitable manner discussed herein. The purge component 608 also includes a connector 616. The connector 616 is configured to connect the body 610 to the valve component 606 or other suitable components. A pipe section component 618 is positioned downstream of the valve 604. In this example, the pipe section component 618 omits the purge gas inlet.

[0082] Figure 7Schematically shows a portion of another exemplary vacuum line 700 having a purge gas inlet 702 disposed downstream of a valve 704. The vacuum line 700 can be used in, for example, a deposition tool 100. The vacuum line 700 includes a valve component 706 that holds the valve 704. A first pipe section component 708 is positioned downstream of the valve 704. The first pipe section component 708 includes a pipe section 710 that defines a portion of the vacuum line 700. The first pipe section component 708 includes the purge gas inlet 702, which includes an opening 714 in one side of the pipe section 710. In various examples, the purge gas inlet 702 can be configured in any suitable manner discussed herein. The vacuum system 700 also includes a second pipe section component 716 positioned upstream of the valve 704. In the depicted example, the second pipe section component 716 omits the purge gas inlet. In other examples, the second pipe section component 716 can include an additional purge gas inlet. Similar to the purge gas inlet 702, the additional purge gas inlet can include an opening in one side of the second pipe section component 716.

[0083] A vacuum system including one or more purge gas inlets as disclosed herein can help reduce a recirculation region in the exhaust flow in a vacuum line near a valve. Thus, one or more purge gas inlets can help reduce powder accumulation of precursor gas from near the valve during a deposition process. This can help reduce the downtime of the deposition tool for cleaning powder accumulation.

[0084] It should be understood that the configurations and / or methods described herein are exemplary in nature and these specific one or more embodiments or examples should not be considered limiting as many variations are possible. The specific routines or methods described herein can represent one or more of any number of processing strategies. Accordingly, the various acts shown and / or described can be performed in the order shown and / or described, in other orders, in parallel, or omitted. Likewise, the order of the above processes can be changed.

[0085] The subject matter of the present disclosure includes all novel and non-obvious combinations and sub-combinations of various processes, systems, and configurations, as well as other features, functions, acts, and / or properties disclosed herein, and any and all equivalents thereof.

Claims

1. A deposition tool, comprising: A processing chamber; and A vacuum system, comprising A vacuum line configured to carry an exhaust gas stream from the processing chamber, A valve positioned within the vacuum line, and A purge gas inlet disposed along the vacuum line.

2. The deposition tool according to claim 1, wherein the purge gas inlet is disposed upstream of the valve.

3. The deposition tool according to claim 1, wherein the purge gas inlet is disposed downstream of the valve.

4. The deposition tool according to claim 1, wherein the purge gas inlet is configured to direct a purge gas stream towards the valve.

5. The deposition tool according to claim 1, wherein the purge gas inlet is incorporated into a purge component that forms part of the vacuum line.

6. The deposition tool according to claim 5, wherein the purge gas inlet comprises an opening formed in the purge component, the opening having an annular shape.

7. The deposition tool according to claim 6, wherein the purge gas inlet comprises a gap formed in the purge component, the gap having a width configured to provide a uniform purge gas stream at different radial positions of the opening.

8. The deposition tool according to claim 5, wherein the purge gas inlet comprises a plurality of openings formed in the purge component.

9. The deposition tool according to claim 5, wherein the purge component comprises a flange configured to connect to a valve component that holds the valve.

10. The deposition tool according to claim 9, wherein the flange comprises a groove and a seal located within the groove.

11. The deposition tool according to claim 1, wherein the purge gas inlet is a first purge gas inlet and further comprises a second purge gas inlet disposed along the vacuum line on the side of the valve opposite the first purge gas inlet.

12. The deposition tool according to claim 1, wherein the purge gas inlet comprises an opening in a side of the vacuum line.

13. The deposition tool according to claim 1, wherein the purge gas inlet is configured to direct a purge gas stream at an oblique angle with respect to the axial direction of the vacuum line.

14. The deposition tool according to claim 1, further comprising a heater configured to heat the purge gas inlet.

15. A purge component for a vacuum line of a deposition tool, the purge component comprising: A body that defines a portion of the vacuum line for an exhaust gas stream from a processing chamber; A gas port configured to connect to a purge gas source; A purge gas inlet fluidly connected to the gas port, the purge gas inlet configured to direct a purge gas stream into the vacuum line; and A connector configured to couple the body to another component of the vacuum line.

16. The purge component according to claim 15, wherein the purge gas inlet comprises an opening having an annular shape or a partial annular shape.

17. The cleaning component according to claim 16, wherein the cleaning gas inlet further comprises a gap having a width configured to provide a uniform cleaning gas flow at different radial positions across the opening.

18. The cleaning component according to claim 15, wherein the connector comprises a flange, and the flange comprises a groove for a seal.

19. A pipe section component for a vacuum pipeline of a deposition tool, the pipe section component comprising: a pipe section defining a part of the vacuum pipeline for an exhaust gas flow from a processing chamber; a cleaning gas inlet comprising an opening in one side of the pipe section; and a connector configured to couple the pipe section to another component of the vacuum pipeline.

20. The pipe section component according to claim 19, wherein the cleaning gas inlet is configured to direct a cleaning gas flow at an oblique angle direction with respect to an axial direction of the exhaust gas flow through the vacuum pipeline.

Images