Laser irradiation system, laser irradiation method and method for manufacturing organic el display

Abstract

A laser irradiation system (1) is provided with: a transfer table (150); an observation device (110) that captures an image of the workpiece; a laser irradiation unit (170) that irradiates the workpiece inspected by the observation device with laser light; a dust collection mechanism (130) that sucks gas in the vicinity of the laser irradiation region; a processing unit (20) that determines whether or not the workpiece has a defect on the basis of a workpiece image captured before the workpiece is irradiated with the laser light; and a control unit that controls the transfer table so that the workpiece is not transferred toward the laser irradiation unit when it is determined that the workpiece has a defect.

Description

Technical Field

[0001] The present invention relates to a laser irradiation system, a laser irradiation method, and a method for manufacturing an organic electroluminescent (EL) display. Background Art

[0002] Patent Document 1 discloses a laser lift-off device. In this laser lift-off device, a linear laser is irradiated onto a substrate. In addition, the substrate is irradiated with a laser during the conveyance of the substrate. Further, the laser lift-off device includes a dust collection unit for collecting dust.

[0003] Citation List

[0004] Patent Document

[0005] Patent Document 1: Unexamined Japanese Patent Application Publication JP 2018-24014. Summary of the Invention

[0006] In the above-described laser lift-off device, when a foreign object adheres to the substrate, the laser is absorbed by the foreign object. Therefore, peeling failure may occur.

[0007] Other problems and novel features will become apparent from the description of the present specification and the drawings.

[0008] According to one embodiment, a laser irradiation system includes: a transfer stage designed to transfer a workpiece including a peeling layer to be peeled by laser lift-off; an observation device designed to capture an image of the workpiece by detecting light from the workpiece being transferred; a laser irradiation unit designed to irradiate the workpiece inspected by the observation device with a laser in a line direction inclined with respect to the transfer direction in a top view perspective; a dust collection mechanism designed to suck gas near the laser irradiation area; a processing unit designed to determine whether the workpiece is defective based on the image of the workpiece captured before irradiating the workpiece with the laser; and a control unit designed to control the transfer stage so that the workpiece is not transferred toward the laser irradiation unit when it is determined that the workpiece is defective, and to control the transfer stage so that the workpiece irradiated with the laser is transferred toward the observation device for the observation device to inspect the workpiece when it is determined that the workpiece is non-defective.

[0009] According to an embodiment, a laser irradiation method includes the following steps: (a) by causing a transfer table to transfer a workpiece so that the workpiece including a peeling layer to be peeled by laser passes through an observation device, an image of the workpiece is taken; (b) based on the taken image of the workpiece, it is determined whether the workpiece has a defect; (c) when it is determined that the workpiece has a defect, the transfer table is controlled so that the workpiece is not transferred toward the laser irradiation unit; (d) when it is determined that the workpiece has no defect, the transfer table is controlled so that the workpiece is transferred toward the laser irradiation unit; (e) the laser irradiation unit irradiates the workpiece with laser in a line direction inclined with respect to the transfer direction in a top view perspective; (f) the gas near the irradiation area of the laser is sucked; (g) by causing the transfer table to transfer the workpiece so that the laser-irradiated workpiece passes through the observation device, an image of the workpiece is taken; and (h) based on the taken image of the laser-irradiated workpiece, it is determined whether the workpiece has a defect.

[0010] According to an embodiment, a method for manufacturing an organic EL display includes the following steps: (SA) forming a peeling layer on a substrate; (SB) forming elements on the peeling layer; (SC) separating the substrate from the peeling layer; and (SD) laminating a film on the peeling layer, wherein the step (SC) of separating the substrate from the peeling layer includes the following steps: (C1) by causing a transfer table to transfer the substrate so that the substrate passes through an observation device, an image of the substrate is taken; (C2) based on the taken image of the substrate, it is determined whether the substrate has a defect; (C3) when it is determined that the substrate has a defect, the transfer table is controlled so that the substrate is not transferred toward the laser irradiation unit; (C4) when it is determined that the substrate has no defect, the transfer table is controlled so that the substrate is transferred toward the laser irradiation unit; (C5) the laser irradiation unit irradiates the substrate with laser in a line direction inclined with respect to the transfer direction in a top view perspective; (C6) the gas near the irradiation area of the laser is sucked; (C7) by causing the transfer table to transfer the substrate so that the laser-irradiated substrate passes through the observation device, an image of the substrate is taken; and (C8) based on the taken image of the laser-irradiated substrate, it is determined whether the substrate has a defect.

[0011] According to this embodiment, the productivity of the laser peeling process can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 is a block diagram showing the overall configuration of a laser irradiation system according to an embodiment.

[0013] Figure 2 is a top view schematically showing the configuration of a laser peeling device according to an embodiment;

[0014] Figure 3 is a side view schematically showing the configuration of a laser peeling device according to an embodiment;

[0015] Figure 4 is a cross-sectional side view schematically showing the configuration of a dust collection mechanism;

[0016] Figure 5 is a flowchart showing a process executed by a processing device for determining whether a workpiece is defective;

[0017] Figure 6 is a cross-sectional view schematically showing an organic EL display device manufactured in a manufacturing process of a laser irradiation system; and

[0018] Figure 7 is a cross-sectional view for explaining a manufacturing process of an organic EL display device. DETAILED DESCRIPTION

[0019] The laser irradiation system according to the present embodiment includes, for example, a laser lift-off device such as a laser lift-off (LLO) device. The laser irradiation system irradiates a workpiece including a layer to be peeled off (hereinafter referred to as a peeling layer) with laser light, thereby performing a laser lift-off process on the workpiece. That is, by laser irradiation, a substrate to be processed (hereinafter referred to as a processing substrate) can be separated from the peeling layer. Hereinafter, the laser irradiation system, method, and manufacturing method according to the present embodiment will be described with reference to the drawings.

[0020] Figure 1 is a block diagram showing the configuration of a system including an LLO device. The laser irradiation system 1 (hereinafter also simply referred to as the system) includes a display 10, a processing unit 20, a control unit 30, and an LLO device 100. The LLO device 100 includes an observation device 110, a dust collection mechanism 130, a transfer table 150, a laser irradiation unit 170, and the like. The workpiece is a substrate including a peeling layer, and elements such as TFTs and organic light-emitting layers are formed on the peeling layer.

[0021] The transfer table 150 transfers the workpiece. The laser irradiation unit 170 irradiates the workpiece being transferred with laser light. The observation device 110 captures images of the workpiece before and after the workpiece is irradiated with laser light. The processing unit 20 inspects the workpiece based on the captured workpiece images. For example, the processing unit 20 detects foreign matter adhering to the workpiece and determines whether the workpiece is defective based on the detection result.

[0022] The dust collection mechanism 130 removes foreign matter from the workpiece W. For example, the dust collection mechanism 130 sucks the gas near the laser irradiation area. The dust collection mechanism 130 can suck away the foreign matter present on the workpiece together with the gas.

[0023] Reference will be made to Figure 2 and Figure 3 to describe the configuration of each of the transfer table 150, the laser irradiation unit 170, the observation device 110, and the dust collection mechanism 130. Figure 2 is a top view schematically showing the configuration of the main part of the LLO device 100, Figure 3 is a side view thereof. Note that inFigure 2 and Figure 3 In Figure 3 , an XYZ orthogonal coordinate system is used for appropriate description. The Y direction is the vertical up / down direction, and the X direction is the conveyance direction of the workpiece W.

[0024] The laser irradiation unit 170, the transfer stage 150, the observation device 110, and the dust collection mechanism 130 are provided in the chamber 101. The laser irradiation unit 170, the observation device 110, and the dust collection mechanism 130 are provided above the workpiece W. The workpiece W is provided on the transfer stage 150. The transfer stage 150 adsorbs and holds the workpiece W. The transfer stage 150 has a surface that contacts the workpiece W, for example, and this surface is formed of a porous material such as ceramics. The porous body sucks gas, thereby adsorbing and holding the workpiece W. In addition, the transfer stage 150 includes a guide mechanism (not shown) and a drive motor (not shown). With the above structure, the workpiece W moves in the X direction by the operation of the drive motor.

[0025] The transfer stage 150 moves the workpiece W in the X direction while holding the workpiece W at a fixed height. The transfer stage 150 conveys the workpiece W so that the observation device 110 captures an image of the workpiece W. The transfer stage 150 conveys the workpiece W so that the laser irradiation unit 170 irradiates the workpiece W with laser light.

[0026] As Figure 3 shown, the laser irradiation unit 170 includes a laser light source 171 and an irradiation optical system 172. The laser light source 171 includes a laser oscillator that generates laser light L1. The laser light source 171 is a pulsed laser light source. An excimer laser with a wavelength of 308 nm or a solid-state laser with a wavelength of 343 nm, etc., can be used as the laser light source 171. In this example, the laser light source 171 generates laser light L1 at a constant repetition frequency.

[0027] The laser light L1 from the laser light source 171 is incident on the irradiation optical system 172. The irradiation optical system 172 includes an optical system that guides the laser light L1 to the workpiece W. For example, the irradiation optical system 172 may include lenses, mirrors, filters, etc. The laser light L2 emitted from the irradiation optical system 172 irradiates the workpiece W. The irradiation optical system 172 focuses the laser light L2 on the workpiece W. The laser light L2 passes through the dust collection mechanism 130 and is incident on the workpiece W.

[0028] The irradiation optical system 172 includes, for example, a cylindrical lens that forms a linear irradiation region 175. As Figure 2As shown, the line direction of the irradiation area 175 is parallel to the Z direction. The Z direction is the longitudinal direction of the linear irradiation area 175, and the X direction is the lateral direction perpendicular to the longitudinal direction. The irradiation area 175 is formed to extend in the Z direction over almost the entire workpiece W. When the transfer table 150 transfers the workpiece W in the X direction, the laser irradiation unit 170 irradiates the workpiece W with the laser L2. Thus, almost the entire workpiece W can be irradiated with the laser L2.

[0029] In addition, the irradiation optical system 172 includes a shutter 173. The shutter 173 is arranged to be insertable into the optical path of the laser L1 and removable from the optical path of the laser L1. That is, when the workpiece W is irradiated with the laser L2, the shutter 173 is removed from the optical path. Additionally, when the workpiece W is not irradiated with the laser L2, the shutter 173 is inserted into the optical path.

[0030] As Figure 3 shown, the observation device 110 includes an illumination light source 111, a photodetector 112, a beam splitter 113, etc. The illumination light source 111 includes a light emitting diode (LED) light source or the like, and generates illumination light L3 for illuminating the workpiece W. The illumination light L3 is reflected by the beam splitter 113 and incident on the workpiece W. The beam splitter 113 is a half mirror or the like. A part of the light scattered or reflected by the workpiece W becomes the detection light L4. The detection light L4 passes through the beam splitter 113 and is incident on the photodetector 112.

[0031] The photodetector 112 detects the detection light L4 from the illumination area of the workpiece W. Specifically, the illumination light irradiates a linear illumination area on the workpiece W in the Z direction. For example, the illumination light source 111 may include a plurality of LED light sources arranged side by side in the X direction. The photodetector 112 is a line sensor having a plurality of pixels arranged side by side in the Z direction. That is, the photodetector 112 is a line camera that captures a one-dimensional image. When the transfer table 150 transfers the workpiece W, the photodetector 112 detects the detection light L4 from the workpiece W. Since the workpiece W passes through the field of view of the photodetector 112 in the X direction, the observation device 110 can capture a two-dimensional image of the workpiece W.

[0032] The illumination light L3 from the illumination light source 111 irradiates almost the entire workpiece W in the Z direction. The photodetector 112 detects the detection light L4 from almost the entire workpiece W in the Z direction. The transfer table 150 transfers the workpiece W in the X direction so that the workpiece W passes through the illumination area. Thus, an image of almost the entire workpiece W is captured. The observation device 110 outputs the image of the entire surface of the workpiece W captured to the processing unit 20 (see Figure 1 ). The pixel data of each pixel in the captured image represents the brightness of the detection light L4. In addition, the address of each pixel indicates the position on the workpiece W.

[0033] When foreign matter or the like adheres to the surface of the workpiece W, the amount of the detection light L4 changes. Therefore, the observation device 110 detects the detection light L4 reflected on the surface of the workpiece W and captures an image of the workpiece W. Note that optical elements such as lenses and filters (not shown) may be provided in the observation device 110.

[0034] The dust collection mechanism 130 is provided directly above the irradiation area 175 of the laser L1. That is, the dust collection mechanism 130 is provided directly below the irradiation optical system 172 of the laser irradiation unit 170. The dust collection mechanism 130 discharges gas directly above the irradiation area 175. An example of the structure of the dust collection mechanism 130 will be described with reference to Figure 4 the following. Figure 4 FIG. is a cross-sectional side view showing the structure of the dust collection mechanism 130. The dust collection mechanism 130 may be made of a metal material such as stainless steel or a resin material.

[0035] The dust collection mechanism 130 includes a window portion 131, a jet portion 132, and an exhaust portion 133. The window portion 131 is provided directly above the irradiation area 175. The laser L2 passes through the window portion 131 and is incident on the workpiece W. The window portion 131 is formed of a transparent material such as a glass substrate.

[0036] The jet portion 132 is connected to a gas supply pipe that supplies gas and jets the gas onto the upper surface of the workpiece W. Specifically, the jet portion 132 jets the gas into the space 135 directly below the window portion 131. Dust (particles) present on the surface of the workpiece W can be blown away by the gas from the jet portion 132.

[0037] The exhaust portion 133 discharges the gas present directly above the workpiece W. For example, the exhaust portion 133 is connected to an exhaust pipe for discharging gas. The exhaust portion 133 discharges the gas present in the space 135 directly below the window portion 131. The dust collection mechanism 130 sucks the gas present in the irradiation area 175 of the laser L2. Therefore, the dust can be sucked from the exhaust portion 133. As a result, since foreign matter on the workpiece W can be removed, the workpiece W can be appropriately irradiated with the laser L2. As a result, the productivity of the laser lift-off process can be improved.

[0038] Return to reference Figure 2 and Figure 3 , and continue the description. Note that the -X side end of the LLO device 100 is the loading position and the unloading position of the workpiece W. The transfer table 150 reciprocates in the X direction to transfer the workpiece W. The observation device 110 captures images of the workpiece W both before and after the workpiece W is irradiated with the laser. That is, the workpiece W is inspected both before and after being irradiated with the laser.

[0039] For example, in a state where the transfer stage 150 is located at the -X side end of the LLO apparatus 100, the transfer robot loads the workpiece W onto the transfer stage 150. Further, the transfer stage 150 transfers the workpiece W in the +X direction, whereby the workpiece W passes through the observation device 110. Accordingly, before the workpiece W is irradiated with the laser, an image of the workpiece W is captured. The transfer stage 150 further moves the workpiece W that has passed through the observation device 110 in the +X direction, whereby the workpiece W passes through the laser irradiation unit 170. Accordingly, the workpiece W is irradiated with the laser L1.

[0040] When the irradiation of the laser L1 is completed, the transfer stage 150 moves the workpiece W in the -X direction. Accordingly, the workpiece W passes through the laser irradiation unit 170 and the observation device 110 in sequence. When the workpiece W passes through the observation device 110 in the -X direction, an image of the laser-irradiated workpiece W is captured. The transfer stage 150 further transfers the workpiece W in the -X direction and moves the workpiece W to the unloading position of the workpiece W. Then, the transfer robot unloads the processed workpiece W from the LLO apparatus 100. In this way, the transfer stage 150 moves the workpiece W in a reciprocating manner such that the workpiece W passes through the observation device 110, the laser irradiation unit 170, and the observation device 110 in sequence.

[0041] Return to reference Figure 1 The observation device 110 outputs the image data of the captured image of the workpiece W to the processing unit 20. The processing unit 20 is an information processing device of a personal computer and includes a memory, a processor, and the like. The processing unit 20 stores a program for inspecting the workpiece W using the image data of the captured image.

[0042] The processing unit 20 determines whether a foreign object is attached to the workpiece W. The processing unit 20 determines whether the workpiece W is defective based on the result of the foreign object detection. For example, when a foreign object having a size larger than the threshold value is detected, the processing unit 20 determines that the workpiece W is defective. When a foreign object having a size larger than the threshold value is not detected, the processing unit 20 determines that the workpiece W is non-defective.

[0043] The processing unit 20 outputs the result of determining whether the workpiece W is defective to the display 10 and the control unit 30. The display 10 displays the determination result of whether the workpiece W is defective. For example, when it is determined that the workpiece W is defective, the display 10 generates an alarm. Further, the display 10 can display an image of the foreign object attachment portion of the workpiece W.

[0044] The control unit 30 is a controller such as a Programmable Logic Controller (PLC) and controls the transfer stage 150. The control unit 30 controls the transfer stage 150 such that the workpiece W is transferred at a constant transfer speed.

[0045] In addition, the control unit 30 controls the transfer table 150 based on the determination result. When it is determined that the workpiece W is defective, the control unit 30 controls the transfer table 150 so that the workpiece W is not transferred toward the laser irradiation unit 170.

[0046] When it is determined that the workpiece W is non-defective, the control unit 30 controls the transfer table 150 so that the workpiece W is transferred toward the laser irradiation unit 170. In addition, the control unit 30 controls the transfer table 150 so that the workpiece W is transferred toward the observation device 110 so that the observation device 110 captures an image of the workpiece W that has been irradiated with the laser.

[0047] For example, if it is determined in the inspection before the laser irradiates the workpiece W that the workpiece W is defective, the control unit 30 controls the transfer table 150 so that the workpiece W is not transferred toward the laser irradiation unit 170. When it is detected that the workpiece W is a defective workpiece, the transfer table 150 moves the workpiece W in the -X direction. That is, the transfer table 150 reverses the transfer direction, so the workpiece W moves to the position where it is unloaded. Therefore, the workpiece W determined to be defective will be unloaded from the LLO device 100 without being irradiated with the laser.

[0048] When there is a foreign object on the workpiece W, the laser is absorbed by the foreign object. Therefore, the stripping layer cannot be irradiated with a sufficient amount of laser, so stripping failure may occur at the position where the foreign object exists. Therefore, in the workpiece W with a relatively large foreign object attached, the possibility of stripping failure will be very high. In this embodiment, the workpiece W is unloaded from the LLO device 100 without being irradiated with the laser. Therefore, the productivity can be improved.

[0049] If it is determined in the inspection before the laser irradiates the workpiece W that the workpiece W is non-defective, the transfer table 150 transfers the workpiece W toward the laser irradiation unit 170. The workpiece W passes through the laser irradiation unit 170, whereby the workpiece W is irradiated with the laser. The transfer table 150 transfers the workpiece W that has been irradiated with the laser toward the observation device 110. The workpiece W passes through the observation device 110, whereby an image of the workpiece W that has been irradiated with the laser is captured. Then, the processing unit 20 determines whether the workpiece W is defective based on the captured image of the workpiece W that has been irradiated with the laser.

[0050] The workpiece W determined to be defective before being irradiated with the laser can be subjected to a cleaning process. By doing so, foreign objects can be removed. Then, after the cleaning process, the workpiece W can be loaded into the LLO device 100 again. Therefore, the productivity can be further improved. The workpiece W determined to be defective before or after being irradiated with the laser can be taken out in batches.

[0051] Reference will be made to Figure 5 Describe an example of the process for determining whether a workpiece is defective performed by the processing unit 20. Figure 5 is a flowchart showing the process performed by the processing unit 20. The processing unit 20 according to Figure 5The process shown performs image processing to determine whether a workpiece has a defect. One or more steps may be omitted in the processes described below.

[0052] First, the processing unit 20 acquires image data captured by the observation device 110 (S11). The processing unit 20 trims the image data (S12). For example, the processing unit 20 removes a transfer table or the like by trimming. The processing unit 20 performs processing on the trimmed image data using a Sobel filter (gradient filter) (S13). As a result, a part of the image data with a large amount of brightness change is extracted.

[0053] The processing unit 20 binarizes the filtered image data (S14). For example, the processing unit 20 compares the brightness data of each pixel with a predetermined threshold value to convert the image data into a binary image (black and white image). The processing unit 20 performs morphological processing on the binary image (S15). The processing unit 20 performs dilation and contraction, whereby gaps in the binary image can be filled. Specifically, the processing unit 20 performs a dilation process for dilating the white pixels of the binary image by one pixel and a contraction process for shrinking the white pixels of the image data that has been dilated by one pixel. By doing so, noise components can be removed.

[0054] The processing unit 20 detects a structure from the image data (S16). For example, the processing unit 20 detects pixels larger than a specific pixel as a structure. The processing unit 20 measures the position and size of the structure (S17). The processing unit 20 determines whether the workpiece has a defect based on the position and size of the structure (S18). For example, when the size of a foreign object is 20 μm or larger, the processing unit 20 determines that the workpiece has a defect. In addition, when the foreign object is located at a position that does not affect the peeling process, the processing unit 20 may determine that the workpiece has no defect. Of course, the criteria for determining whether the workpiece has a defect can be appropriately changed according to operating conditions, laser irradiation conditions, etc.

[0055] By doing so, it is possible to appropriately determine whether the workpiece has a defect. Therefore, it is possible to accurately determine whether the workpiece is defective or non-defective, and the productivity of the LLO process can be improved.

[0056] Each of the processing unit 20 and the control unit 30 is not limited to a single physical device and may be arranged in a distributed manner in multiple devices. That is, the processing unit 20 and the control unit 30 may include multiple memories and multiple processors.

[0057] In addition, some or all of the above processes executed by the processing unit 20, the control unit 30, etc. can be implemented as a computer program. Any type of non-transitory computer-readable medium can be used to store the above program and provide it to a computer. Non-transitory computer-readable media include any type of tangible storage medium. Examples of non-transitory computer-readable media include magnetic storage media (such as floppy disks, magnetic tapes, hard disk drives, etc.), magneto-optical storage media (such as magneto-optical discs), CD-ROM (Compact Disc Read Only Memory), CD-R, CD-R / W, and semiconductor memories (such as mask ROM, PROM (Programmable ROM), EPROM (Erasable PROM), flash ROM, RAM (Random Access Memory), etc.). The program can be provided to a computer using any type of transitory computer-readable medium. Examples of transitory computer-readable media include electrical signals, optical signals, and electromagnetic waves. The transitory computer-readable medium can provide the program to a computer via a wired communication line (such as electric wires and optical fibers) or a wireless communication line.

[0058] The laser irradiation method according to this embodiment includes the following steps (a) to (h):

[0059] (a) By causing the transfer table to transfer the workpiece so that the workpiece including the peeling layer to be peeled off by laser passes through the observation device, an image of the workpiece is taken.

[0060] (b) Based on the taken image of the workpiece, it is determined whether the workpiece has a defect.

[0061] (c) When it is determined that the workpiece has a defect, the transfer table is controlled so that the workpiece is not transferred toward the laser irradiation unit.

[0062] (d) When it is determined that the workpiece has no defect, the transfer table is controlled so that the workpiece is transferred toward the laser irradiation unit.

[0063] (e) The laser irradiation unit irradiates the workpiece with laser in a line direction that is inclined with respect to the transfer direction in a top-down view.

[0064] (f) The gas near the laser irradiation area is sucked.

[0065] (g) By causing the transfer table to transfer the workpiece so that the laser-irradiated workpiece passes through the observation device, an image of the workpiece is taken.

[0066] (h) Based on the image of the laser-irradiated workpiece taken, it is determined whether the workpiece has a defect.

[0067] Therefore, laser irradiation of the laser peeling process can be achieved with high productivity.

[0068] (Organic EL display)

[0069] The laser irradiation system 1 is applicable to a laser lift-off device for an organic electroluminescence (EL) display. That is, the laser irradiation method performed by the laser irradiation system 1 is used as a laser lift-off process in an organic EL display manufacturing process.

[0070] The configuration applicable to an organic EL display manufactured using the laser irradiation system 1 of the present embodiment will be described below. Reference will be made to Figure 6 Describe the structure of an organic electroluminescence (EL) display. Figure 6 It is a cross-sectional view showing an example of an organic EL display. Figure 6 The organic EL display 300 shown is an active matrix display device, which includes a TFT provided in each pixel PX.

[0071] The organic EL display 300 includes a film 318, a peeling layer 302, a thin film transistor (TFT) layer 311, an organic layer 312, a color filter layer 313, and a protective layer 314. Figure 6 A top-emission type organic EL display is shown, where the protective layer 314 side is the viewing side. Note that the following description shows an example configuration of an organic EL display, and the present embodiment is not limited to the configuration described below. For example, in the present embodiment, a bottom-emission type organic EL display can be used.

[0072] The film 318 is a flexible plastic film and is a film that can be bent by applying stress thereto. The peeling layer 302 and the TFT layer 311 are provided above the film 318. The TFT layer 311 includes a TFT 311a provided in each pixel PX. In addition, the TFT layer 311 includes wirings (not shown) connected to the TFT 311a. The TFT 311a and the wirings constitute a pixel circuit.

[0073] The organic layer 312 is provided above the TFT layer 311. The organic layer 312 includes an organic EL light-emitting element 312a provided for each pixel PX. The organic EL light-emitting element 312a has, for example, a stacked structure in which an anode, a hole injection layer, a hole transport layer, a light-emitting layer, an electron transport layer, an electron injection layer, and a cathode are stacked. In the case of top emission, the anode is a metal electrode and the cathode is a transparent conductive film such as indium tin oxide (ITO). In addition, the organic layer 312 is provided with a partition wall 312b that separates the organic EL light-emitting elements 312a of adjacent pixels PX.

[0074] The color filter layer 313 is disposed above the organic layer 312. The color filter layer 313 has color filters 313a for displaying a color image. That is, each pixel PX is provided with a resin layer colored R (red), G (green), or B (blue) as the color filter 313a. When white light emitted from the organic layer 312 passes through the color filter 313a, it is converted into light having one of the RGB colors. Further, in the case of a three-color system in which the organic layer 312 is provided with organic EL light-emitting elements, and each organic EL light-emitting element emits light having one of the corresponding RGB colors, the color filter layer 313 can be omitted.

[0075] The protective layer 314 is disposed above the color filter layer 313. The protective layer 314 is made of a resin material and serves to prevent deterioration of the organic EL light-emitting elements of the organic layer 312.

[0076] The current flowing through the organic EL light-emitting element 312a of the organic layer 312 varies according to the display signal supplied to the pixel circuit. Therefore, by supplying a display signal corresponding to the display image to each pixel PX, the light emission amount of each pixel PX can be controlled. Thus, a desired image can be displayed.

[0077] <Manufacturing Process of Organic EL Display>

[0078] Next, the manufacturing process of the organic EL display described above with reference to Figure 7 will be described. When manufacturing an organic EL display, first, a processing substrate 331 is prepared (step A). For example, a glass substrate that allows laser transmission is used as the processing substrate 331. The processing substrate 331 corresponds to Figures 2 to 4 each workpiece W shown.

[0079] Next, a peeling layer 302 is formed on the processing substrate 331 (step B). For example, polyimide can be used for the peeling layer 302. Subsequently, a circuit element 332 is formed on the peeling layer 302 (step C). At this point, the circuit element 332 includes Figure 6 the TFT layer 311, the organic layer 312, and the color filter layer 313 shown. The circuit element 332 can be formed by using a photolithography technique or a thin film formation technique. Subsequently, a protective layer 314 for protecting the circuit element 332 is formed on the circuit element 332 (step D).

[0080] Next, the processing substrate 331 is turned over so that the processing substrate 331 faces upward (step E). After the turned-over processing substrate 331 is cleaned with a cleaning machine, it is fed into the LLO device 100. The peeling layer 302 is irradiated with a laser L2 from one side of the processing substrate 331 (step F). A line beam can be used for the laser L2. In Figure 7In this case, the processing substrate 331 is conveyed in the X direction so that the laser L2 irradiates from the right side to the left side of the processing substrate 331. Note that before and after the process F, the observation device 110 captures an image of the workpiece W as described above. Then, the processing unit 20 determines whether the workpiece W is defective based on the captured image of the workpiece W. Therefore, only defect-free products can enter the next process. In addition, when it is determined that the workpiece W is defective, the workpiece W can be transported to a cleaning device and then cleaned.

[0081] Subsequently, the processing substrate 331 and the peeling layer 302 are separated (process G). Finally, the film 318 is laminated on the peeling layer 302 (process H). For example, the film 318 is a flexible plastic film and is a film that can be bent by applying stress to it. By using this manufacturing process, a flexible organic EL display 300 can be manufactured.

[0082] Note that the present invention is not limited to the above-described embodiments, and can be appropriately changed without departing from the scope and spirit of the present invention.

[0083] This application is based on and claims the priority of Japanese Patent Application JP 2022-168424 filed on October 20, 2022, the entire disclosure of which is incorporated herein by reference.

[0084] List of Reference Numerals

[0085] 1 Laser irradiation system

[0086] 10 Display

[0087] 20 Processing unit

[0088] 30 Control unit

[0089] 100 Laser lift-off device

[0090] 110 Observation device

[0091] 111 Lighting source

[0092] 112 Photoelectric detector

[0093] 113 Beam splitter

[0094] 130 Dust collection mechanism

[0095] 131 Window portion

[0096] 132 Jetting portion

[0097] 133 Exhaust portion

[0098] 135 Space

[0099] 150 Transfer table

[0100] 170 Laser irradiation unit

[0101] 171 Laser light source

[0102] 172 Irradiation optical system

[0103] 175 Irradiation area

[0104] W Workpiece

[0105] 300 Organic EL display

[0106] 311 TFT layer

[0107] 311a TFT

[0108] 312 Organic layer

[0109] 312a Organic EL light-emitting element

[0110] 312b Partition wall

[0111] 313 Color filter layer

[0112] 313a Color filter (CF)

[0113] 314 Protective layer

[0114] PX Pixel.

Claims

1. Laser irradiation system, comprising: a transfer table designed to transfer a workpiece including a peeling layer to be peeled off by laser; an observation device designed to capture an image of the workpiece by detecting light from the workpiece being transferred; a laser irradiation unit designed to irradiate the workpiece inspected by the observation device with laser in a line direction inclined with respect to the transfer direction in a top-down view; a dust collection mechanism designed to suck gas around the irradiation area of the laser; a processing unit designed to determine whether the workpiece has a defect based on the workpiece image captured before irradiating the workpiece with the laser; and a control unit designed to control the transfer table so that the workpiece is not transferred toward the laser irradiation unit when it is determined that the workpiece has a defect, and to control the transfer table so that the workpiece that has been irradiated with the laser is transferred toward the observation device for the observation device to inspect the workpiece when it is determined that the workpiece has no defect.

2. The laser irradiation system according to claim 1, wherein, the dust collection mechanism includes: a window portion through which the laser passes; a jet portion designed to jet gas toward the workpiece; and an exhaust portion designed to suck the gas present in the irradiation area of the laser.

3. The laser irradiation system according to claim 1 or 2, wherein, the processing unit performs filtering processing on the image data of the captured workpiece image using a gradient filter, the processing unit binarizes the filtered image data, the processing unit performs morphological processing on the binarized image data, the processing unit detects a structure from the morphologically processed image data, and the processing unit determines whether the workpiece has a defect based on the size of the structure.

4. Laser irradiation method, comprising the following steps: (a) Capturing an image of the workpiece by causing a transfer table to transfer the workpiece so that a workpiece including a peeling layer to be peeled off by laser passes through an observation device; (b) Determining whether the workpiece has a defect based on the captured workpiece image; (c) When it is determined that the workpiece has a defect, controlling the transfer table so that the workpiece is not transferred toward a laser irradiation unit; (d) When it is determined that the workpiece has no defect, controlling the transfer table so that the workpiece is transferred toward the laser irradiation unit; (e) Causing the laser irradiation unit to irradiate the workpiece with laser in a line direction inclined with respect to the transfer direction in a top-down view; (f) Sucking the gas near the irradiation area of the laser; (g) Capturing an image of the workpiece by causing the transfer table to transfer the workpiece so that the workpiece that has been irradiated with laser passes through the observation device; and (h) Determining whether the workpiece has a defect based on the image of the workpiece that has been irradiated with laser and captured.

5. The laser irradiation method according to claim 4, wherein, in step (f), a dust collection mechanism sucks the gas present in the irradiation area of the laser, and the dust collection mechanism includes a window portion through which the laser passes and a jet portion designed to jet gas onto the workpiece.

6. The laser irradiation method according to claim 4 or 5, wherein, in the step of determining whether the workpiece has a defect: Filter processing is performed on the image data of the workpiece image captured by using a gradient filter. The filtered image data is binarized. Morphological processing is performed on the binarized image data. Structures are detected from the morphologically processed image data, and It is determined whether the workpiece is defective based on the size of the structure.

7. A method for manufacturing an organic EL display, comprising the following steps: (SA) A release layer is formed on a substrate. (SB) Elements are formed on the release layer. (SC) The substrate is separated from the release layer. And (SD) A film is laminated on the release layer, wherein the step (SC) of separating the substrate from the release layer includes the following steps: (C1) The substrate is conveyed by a transfer table so that the substrate passes through an observation device, thereby capturing an image of the substrate. (C2) It is determined whether the substrate is defective based on the captured image of the substrate. (C3) When it is determined that the substrate is defective, the transfer table is controlled so that the substrate is not conveyed toward a laser irradiation unit. (C4) When it is determined that the substrate is not defective, the transfer table is controlled so that the substrate is conveyed toward the laser irradiation unit. (C5) The laser irradiation unit irradiates the substrate with laser in a line direction inclined with respect to the conveyance direction in a top view perspective. (C6) The gas near the irradiation area of the laser is sucked. (C7) The substrate is conveyed by the transfer table so that the laser-irradiated substrate passes through the observation device, thereby capturing an image of the substrate; and (C8) It is determined whether the substrate is defective based on the captured image of the laser-irradiated substrate.

8. The method for manufacturing an organic EL display according to claim 7, wherein in step (C6), a dust collection mechanism sucks the gas present in the irradiation area of the laser, and the dust collection mechanism includes a window portion through which the laser passes and a jet portion designed to jet the gas onto the workpiece.

9. The method for manufacturing an organic EL display according to claim 7 or 8, wherein in the step of determining whether the substrate is defective: Filter processing is performed on the image data of the captured substrate image by using a gradient filter. The filtered image data is binarized. Morphological processing is performed on the binarized image data. Structures are detected from the morphologically processed image data, and It is determined whether the substrate is defective based on the size of the structure.

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