A double-sided, folded glass article and method of making

Abstract

The application discloses a kind of double-sided folding glass products and preparation method, the glass product mainly includes substrate, substrate includes spaced-apart through-hole area in the first direction, and folding area is arranged between two through-hole areas, through-hole area is provided with through-hole, and folding area includes the first surface and the second surface that are oppositely arranged and mutually face recess, while folding area is provided with first blind hole and second blind hole in the second direction, first blind hole and second blind hole are alternately arranged in multiple groups in the first direction, and the first surface and the second surface are provided with reinforcing layer to fill and protect blind hole respectively.The application is recessed to the two surfaces of folding area oppositely, to make thinner folding area to meet the bending demand of different thickness glass products, and the function of folding area bidirectional folding is realized by alternative blind hole structure design, and the protection in blind area folding process is realized by reinforcing layer, the stability of folding process and service life are improved.

Description

Technical Field

[0001] This invention relates to the field of glass processing technology, and in particular to a double-sided folded glass product and its preparation method. Background Technology

[0002] With the rise of foldable screen devices, such as mobile phones and tablet displays, the requirements for foldable screen support structures are becoming increasingly stringent. Currently, the commonly used folding structures are mostly achieved by processing micro-holes in glass and filling them with special materials to disperse the stress during the folding process and thus make the glass products foldable. However, this method can only process thin glass substrates, and the design structure is mostly designed to meet only the unidirectional folding requirements. For thicker glass structures, it is difficult to process them well and cannot meet their complex folding requirements.

[0003] Therefore, how to meet the bidirectional folding requirements of glass products and improve their folding lifespan is a technical problem that urgently needs to be solved by those skilled in the art. Summary of the Invention

[0004] In view of this, the purpose of the present invention is to provide a double-sided folding glass product to meet the bidirectional folding requirements of glass products and improve their folding service life.

[0005] Another object of the present invention is to provide a method for preparing the above-mentioned double-sided folded glass article.

[0006] To achieve the above objectives, the present invention provides the following technical solution:

[0007] A double-sided folding glass product includes a substrate, the substrate including spaced through-hole areas in a first direction, and a folding area disposed between two adjacent through-hole areas, wherein the through-hole areas are provided with through holes according to pattern requirements and are metallized.

[0008] The folded area includes a first surface and a second surface that are disposed opposite to each other in a second direction and are recessed towards each other. The folded area is provided with a first blind hole and a second blind hole in the second direction. The opening of the first blind hole is located on the first surface, and the opening of the second blind hole is located on the second surface. Multiple sets of the first blind hole and the second blind hole are alternately arranged in the folded area along the first direction. The first surface and the second surface are respectively provided with a reinforcing layer, and a portion of the reinforcing layer fills the blind holes.

[0009] Preferably, in the above-mentioned double-sided folding glass product, both the first surface and the second surface are arc-shaped concave areas, and the lowest points of both the first surface and the second surface are located at the midpoint of the folding area in the first direction.

[0010] Preferably, in the above-mentioned double-sided folded glass product, the minimum thickness of the folded area is not less than 50 μm, and the depth of the first blind hole accounts for 60%-80% of the thickness of the corresponding position of the folded area.

[0011] Preferably, in the above-mentioned double-sided folded glass product, a single set of first blind holes includes a plurality of spaced-apart partition holes, and the distance between two adjacent partition holes in a single set of first blind holes is 30μm-300μm.

[0012] Preferably, in the above-mentioned double-sided folding glass product, the reinforcing layer disposed on the first surface includes a first reinforcing layer, a second reinforcing layer and a third reinforcing layer. The first reinforcing layer is a flexible layer and fills the bottom of the first blind hole. The second reinforcing layer seals the first blind hole and extends to the first surface. The third reinforcing layer is completely located outside the first blind hole and covers the second reinforcing layer.

[0013] Preferably, in the above-mentioned double-sided folded glass product, the opening area of ​​the first blind hole and / or the second blind hole is an outwardly expanding horn-shaped configuration.

[0014] A method for preparing double-sided folded glass, used to prepare the double-sided folded glass article described in any of the above embodiments, the preparation method comprising at least the following steps:

[0015] Partitioning: The substrate with a thickness of a first preset thickness is divided into a through-hole area and a folded area. The folded area is located between the two through-hole areas. The two sides of the folded area in the thickness direction are respectively defined as the first surface and the second surface. The through-hole area is set with positioning marks.

[0016] One laser treatment: laser modification of the through-hole area and the folded area. The through-hole area is processed by drilling through holes according to the graphic requirements. The first and second surfaces of the folded area are subjected to depth modification of the concave structure. The modified first and second surfaces are uniformly concave from both sides to the middle.

[0017] One-time etching: The substrate after one laser treatment is etched using alkaline solution and / or acid solution. The laser-treated area of ​​the through-hole region is etched into a through-hole structure, and the first and second surfaces of the folded area are respectively etched into a smooth and continuous recessed structure.

[0018] Secondary laser processing: The first and second surfaces of the folded area are pre-drilled by laser to generate multiple staggered first and second blind holes;

[0019] Secondary etching: The substrate is etched twice. The first and second blind holes, which are treated by secondary laser, are formed into blind hole structures with outward expansion of the opening. The through holes in the through hole area are formed into preset specifications.

[0020] Preferably, in the above preparation method, after the secondary etching step, the following step is further included:

[0021] Post-processing: The substrate after secondary etching is subjected to basket tempering to achieve tempering treatment of through holes and blind holes, and the first and second surfaces of the folded area are masked by masking film.

[0022] Through-hole area treatment: Metallization treatment of through-holes in the through-hole area by chemical deposition and / or physical deposition;

[0023] Folding area treatment: Remove the masking film on the folding area, fill the first blind hole and the second blind hole with a flexible first reinforcing layer, then add a second reinforcing layer that extends into the blind hole, and then set a third reinforcing layer that covers the second reinforcing layer in a continuous state.

[0024] Polishing: Polishing the surface of a substrate to create a substrate intermediate for foldable glass products.

[0025] Preferably, in the above preparation method, the etching solution used in the secondary etching step is an alkaline sodium hydroxide or potassium hydroxide solution.

[0026] Preferably, in the above preparation method, in the first etching step, the minimum thickness of the folded region after etching is 50μm-200μm, and the thickness of the folded region is 33%-66% of the thickness of the through-hole region.

[0027] Preferably, in the above preparation method, in the folded area treatment step, the first reinforcing layer is a flexible epoxy resin or polyurethane resin, and fills the blind holes to a depth of 20%-40%; the second reinforcing layer is an organosilicon resin or organosilicon-modified polyurethane resin with greater flexibility than the first reinforcing layer, and the second reinforcing layer fills the blind holes and partially overflows them; the third reinforcing layer is a flexible reinforcing film with a thickness of 25μm-50μm.

[0028] Preferably, in the above preparation method, in the secondary etching step, the aperture of the opening region of the first blind hole and the second blind hole is 50μm-500μm, the thickness of the folded region at the bottom of the blind hole is 20μm-80μm, and the distance between adjacent first blind holes and second blind holes is 30μm-100μm.

[0029] Preferably, in the above preparation method, the first preset thickness is 0.1mm-1.0mm.

[0030] As can be seen from the above technical solution, the double-sided folding glass product provided by the present invention sets the substrate as a through-hole area and a folding area. Specifically, the through-hole areas are spaced apart in the first direction, and a folding area is set between two adjacent through-hole areas. The through-hole areas are used to set through holes according to graphic requirements, and the through holes are metallized to meet display requirements. The folding area is used to realize the bending of the substrate. The two opposite sides of the folding area in the second direction are a first surface and a second surface, and the first surface and the second surface are recessed towards each other to reduce the thickness of the folding area compared to the through-hole area. At the same time, the folding area is provided with a first blind hole and a second blind hole to meet its bending requirements while maintaining the connection effect of the folding area and through the stiffness weakening effect of the blind holes. Specifically, both the first and second blind holes are blind holes arranged along the second direction, i.e., the thickness direction of the folded area. The first blind hole opens onto the first surface area, and the second blind hole opens onto the second surface area, to meet the bending requirements of the folded area in both directions on the first and second surfaces. At the same time, multiple sets of the first and second blind holes are alternately arranged on the folded area along the first direction to make the bending performance of the folded area similar in both directions, thereby improving the service life of the folded area. In addition, the folded area is provided with reinforcing layers on the first and second surfaces respectively. On the one hand, the reinforcing layers are filled into the blind holes through a flexible structure to unload and transfer the bending force of the blind holes during the folding process of the folded area, reducing the risk of damage to the blind hole location. On the other hand, the reinforcing layers cover the first and second surfaces to protect the blind holes and improve the integrity of the folded area, so that the folded area has a more stable folding effect. Attached Figure Description

[0031] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0032] Figure 1 This is a schematic diagram of the substrate structure provided in an embodiment of the present invention;

[0033] Figure 2 for Figure 1 A top-down view;

[0034] Figure 3 for Figure 2 Schematic diagram of the blind hole structure in the folded area;

[0035] Figure 4 This is a schematic diagram of the cross-sectional structure of the folded area;

[0036] Figure 5 This is a schematic diagram of the substrate being folded in two directions;

[0037] Figure 6 A schematic diagram of the process for preparing double-sided folded glass according to an embodiment of the present invention;

[0038] Figure 7 This is a schematic diagram of the substrate cross-sectional state corresponding to some steps of the preparation method;

[0039] Figure 8 This is a schematic diagram of the single-sided structure of the folded area after a single laser treatment.

[0040] Figure 9 This is a schematic diagram of the substrate cross-section corresponding to another step in the preparation method;

[0041] Figure 10 This is a schematic diagram of the substrate structure after secondary laser processing;

[0042] Figure 11 This is a schematic diagram of the substrate cross-section state corresponding to other steps in the preparation method.

[0043] Wherein, 10-substrate; 20-through hole region; 30-folded region; 310-first surface; 320-second surface; 330-first blind hole; 3310-separation hole; 340-second blind hole; 3510-first reinforcing layer; 3520-second reinforcing layer; 3530-third reinforcing layer. Detailed Implementation

[0044] The core of this invention is to disclose a double-sided folding glass product to meet the bidirectional folding requirements of glass products and improve their folding service life.

[0045] Another object of the present invention is to provide a method for preparing the above-mentioned double-sided folded glass article.

[0046] To enable those skilled in the art to better understand the present invention, embodiments of the present invention will be described below with reference to the accompanying drawings. Furthermore, the embodiments shown below do not limit the scope of the invention as described in the claims. Additionally, the complete contents of the configurations shown in the embodiments below are not limited to those necessary for the solution of the invention described in the claims.

[0047] like Figures 1-5As shown, the double-sided folding glass product provided in this embodiment of the invention includes a substrate 10 structure. It should be noted that the substrate 10 does not need to be thinned to below 0.1 mm as in conventional techniques to obtain the folding properties of flexible glass, thus avoiding brittle fracture or significant flatness issues due to insufficient strength. Specifically, the substrate 10 mainly includes a through-hole area 20 and a folding area 30. The through-hole area 20 is used for graphic display, while the folding area 30 is a region on the substrate 10 with bending properties to enable the bending of the glass product having the substrate 10.

[0048] Through-hole areas 20 are spaced apart in a first direction, and a folding area 30 is provided between two adjacent through-hole areas 20. Here, the first direction is generally the length direction of the substrate 10, so that two through-hole areas 20 arranged in the length direction of the substrate 10 can perform similar bending actions. The substrate 10 may have only one folding area 30, so that the substrate 10 has bending performance in only one area. For substrates 10 of different lengths or with different folding requirements, multiple folding areas 30 may be provided, so that the substrate 10 has multiple bendable areas, as long as each folding area 30 has through-hole areas 20 for display on both sides in the first direction. It should also be noted that, according to the pattern requirements, through-hole structures are formed in the thickness direction of the through-hole area 20. The opening can be done by laser combined with solution etching to maintain the smoothness and dimensional requirements of the opening area. At the same time, the through-holes are metallized to deposit metal in the through-holes and connect different optoelectronic components through the through-holes to meet the system performance requirements.

[0049] The folded region 30 on the substrate 10 includes a first surface 310 and a second surface 320 disposed opposite each other in a second direction. This second direction is typically the thickness direction of the folded region 30 and is perpendicular to the first direction. The first surface 310 and the second surface 320, located on either side of the folded region 30 in the thickness direction, are recessed towards each other. Specifically, this means that the first surface 310 has a recessed structure with its bottom recessed from the inside of the folded region 30 towards the second surface 320, and the second surface 320 also has a recessed structure with its bottom recessed from the inside of the folded region 30 towards the first surface 310. This ensures that the thickness of the folded region 30 at all locations is less than that of the through-hole regions 20 on both sides. It should be noted that the mutually recessed structure of the first surface 310 and the second surface 320 allows the substrate 10 to maintain sufficient thickness to meet strength requirements while only adaptively thinning the folded region 30 to meet bending requirements. This precise processing maintains the consistency between the thickness of the substrate 10 and the bending requirements.

[0050] Specifically, the folding area 30 is also provided with a first blind hole 330 and a second blind hole 340 in the first direction. Both the first blind hole 330 and the second blind hole 340 open along the thickness direction of the folding area 30. The opening of the first blind hole 330 is located on the first surface 310, that is, the first blind hole 330 is a blind hole structure that opens based on the first surface 310 and faces the second surface 320. The second blind hole 340 is a blind hole structure that opens based on the second surface 320 and faces the first surface 310. The blind hole structure is designed to maintain the continuity of the folding area 30 in the first direction while allowing the folding area 30 to bend through the deformation area of ​​its inner diameter. Since both the first surface 310 and the second surface 320 of the folding area 30 have blind hole structures, the folding area 30 has folding effects in both the forward and reverse directions in the second direction. One bending direction is a bending form where the first surface 310 contracts and the second surface 320 expands; while the other bending direction is a bending form where the first surface 310 expands and the second surface 320 contracts. Both bending processes are achieved through the opening of the first blind hole 330 and the second blind hole 340. At the same time, the blind hole structure improves the structural stability of the folding area 30 during the bending process.

[0051] To enhance the structural stability of the folding region 30, multiple sets of first blind holes 330 and second blind holes 340 are alternately arranged along the first direction in the folding region 30. The number of sets is the same or similar, ensuring that the folding performance of the folding region 30 is similar in both directions. This avoids the problem of reduced service life caused by poor unidirectional folding performance. Furthermore, the multiple sets of first blind holes 330 and second blind holes 340 can work together during the bending process of the folding region 30 to reduce the deformation of individual blind holes and lower the risk of damage. In addition, the first surface 310 and the second surface 320 of the folding region 30 are respectively provided with reinforcing layers. A portion of the flexible area of ​​the reinforcing layer fills the blind holes to protect them and improve the ductility and compressive strength of the blind hole area. Simultaneously, a more flexible portion of the reinforcing layer is located outside the blind holes to cover and protect the first surface 310 and the second surface 320, giving this area the technical effects of heat resistance, corrosion resistance, high elasticity, and ductility.

[0052] It should be noted that in the above embodiments, the substrate 10 can be 0.1mm-1.0mm thick, and by fine processing of the first surface 310 and the second surface 320 of the folding area 30, the bending performance requirements of the substrate 10 can be met while maintaining good structural strength through local thinning, without having to set the entire thickness to less than 0.1mm as in the prior art, thus improving the structural stability of the substrate 10 and subsequent glass products.

[0053] Furthermore, in the double-sided folding glass product provided in the embodiments of the present invention, the recessed structure of the first surface 310 and the second surface 320 is to achieve local thinning of the thickness of the folding area 30, and the bidirectional folding effect of the folding area 30 is achieved after setting the first blind hole 330 and the second blind hole 340. The first surface 310 and the second surface 320 can adopt a stepped recessed structure, a linear recessed structure, or an alternating concave-convex structure in the first direction to achieve thinning of the folding area 30. At the same time, the recessed structures of the first surface 310 and the second surface 320 can also be the same or different. In order to further optimize the structural stability and folding effect of the folding area 30, in some embodiments of the present invention, the first surface 310 and the second surface 320 are both arc-shaped recessed areas, and preferably the lowest point of the first surface 310 and the second surface 320 are both located at the midpoint of the folding area 30 in the first direction, that is, the arc-shaped structures of the first surface 310 and the second surface 320 are symmetrically arranged. It should be noted that the concavity of the arc-shaped structure makes both the first surface 310 and the second surface 320 arc-shaped, which can reduce the risk of stress concentration when the folding area 30 is folded in any direction. Furthermore, the corresponding setting of the lowest points of the first surface 310 and the second surface 320 makes the folding area 30 present a structure in which the thickness gradually decreases from both sides to the middle, thus better balancing the requirements between structural strength and bending performance.

[0054] Meanwhile, to balance the strength and bending performance requirements of the folding region 30, in the double-sided folded glass product provided in this embodiment of the invention, the minimum thickness of the folding region 30 on the substrate 10 is not less than 50 μm, to avoid the risk of breakage due to excessive thinness of the folding region 30. In the above embodiment, the distance between the line connecting the apex positions of the arc surfaces of the first surface 310 and the second surface 320 in the thickness direction of the folding region 30 is not less than 50 μm. Simultaneously, in the area where the first blind hole 330 is provided on the folding region 30, the hole depth of the first blind hole 330 accounts for 60%-80% of the thickness of the corresponding position of the folding region 30. While maintaining good connectivity of the folding region 30 at the bottom of the first blind hole 330, the hole depth meets the deformation requirements of the bending angle. It should be noted that the structure of the second blind hole 340 is preferably the same as that of the first blind hole 330, so that the structural strength and folding performance of the folding region 30 on the first surface 310 and the second surface 320 are similar, thus avoiding the problem of premature unidirectional damage and failure. The specific structure and depth dimensions of the second blind hole 340 will not be described further here.

[0055] In the above embodiments, the first blind via 330 and the second blind via 340 are arranged in multiple alternating groups on the substrate 10 along the first direction. A single group of first blind vias 330 can be a single hole structure in a third direction or a partition hole 3310 structure. It should be noted that the third direction is the width direction of the substrate 10 based on the first and second directions, i.e., the first, second, and third directions are mutually perpendicular. To reduce the drilling difficulty of large-sized blind vias and improve the structural strength of the blind via area in the folded region 30, in a specific embodiment of the present invention, a single group of first blind vias 330 includes multiple partition holes 3310 spaced apart in the third direction, and the spacing between two adjacent partition holes 3310 within a single group of first blind vias 330 is 30μm-300μm, to leave sufficient structural area to maintain the strength of the folded region 30 while maintaining the density of the partition holes 3310. It should also be noted that the specific structure of the second blind via 340 is the same as that of the first blind via 330, and will not be described again here.

[0056] Regarding the reinforcing layers disposed on the first surface 310 and the second surface 320, taking the first surface 310 as an example, the reinforcing layer has a layered structure, namely, the reinforcing layer disposed on the first surface 310 mainly includes a first reinforcing layer 3510, a second reinforcing layer 3520, and a third reinforcing layer 3530. Among them, the first reinforcing layer 3510 is a flexible material layer that fills a portion of the first blind hole 330, that is, the first reinforcing layer 3510 is an independent layer structure disposed within each first blind hole 330 to increase the ductility and compressive strength of the first blind hole 330; while the second reinforcing layer 3520 cooperates with the first reinforcing layer 3510 in a portion of its area to completely fill the first blind hole 330 and seal the first blind hole 330; while the other areas of the second reinforcing layer 3520 are located outside the first blind hole 330 and extend to the first surface 310, that is, the second reinforcing layer 3520 is an integral structure and has multiple protruding areas extending out to fill multiple first blind holes 330. It should be noted that the second reinforcing layer 3520 has greater flexibility than the first reinforcing layer 3510 and possesses good adhesion, heat resistance, and ductility. The third reinforcing layer 3530 is located entirely outside the first blind hole 330. The third reinforcing layer 3530 is provided with a flexible reinforcing film to cover and protect the second reinforcing layer 3520 and to adhere the bending substrate 10, thereby effectively fixing the first reinforcing layer 3510 and the second reinforcing layer 3520. During the bending process of the folding area 30, the bending force is transferred and dissipated layer by layer through the third reinforcing layer 3530, the second reinforcing layer 3520, the first reinforcing layer 3510, and the bending substrate 10 to achieve a stable bending effect.

[0057] Furthermore, in some embodiments of the present invention, the opening regions of one or more of the first blind hole 330 and the second blind hole 340 are configured as an outwardly flared horn shape to have a greater expansion or contraction margin during folding, thereby improving the bending strength at the opening position of the blind hole.

[0058] Furthermore, such as Figures 6-11 As shown, this embodiment of the invention also provides a method for preparing double-sided folded glass, for use in preparing the double-sided folded glass product provided in any of the above embodiments. Specifically, the preparation method includes at least the following steps:

[0059] S01: Partitioning: The substrate with a thickness of a first preset thickness is divided into a through-hole area and a folded area. The folded area is located between the two through-hole areas. The two sides of the folded area in the thickness direction are respectively defined as the first surface and the second surface. The through-hole area is set with positioning marks.

[0060] It should be noted that in step S01, the first preset thickness is 0.1mm-1.0mm, so that the preparation method can process a thicker substrate 10; while setting the mark positioning mark is to set a reference point or optical positioning point on the substrate 10, so as to provide a precise positioning reference for the automated processing equipment during the processing, and ensure that the substrate 10 can be accurately placed in the predetermined position.

[0061] S02: First laser treatment: Laser modification of the through-hole area and the folded area. The through-hole area is processed by drilling through holes according to the graphic requirements. The first and second surfaces of the folded area are subjected to depth modification of the concave structure. The modified first and second surfaces are uniformly concave from both sides to the middle.

[0062] It should be noted that in step S02, during the laser processing of the folded area 30, the laser path set on the first surface 310 and the second surface 320 is preferably in a fan-shaped structure, so as to process the first surface 310 and the second surface 320 into an arc surface structure.

[0063] S03: Single etching: Using one or more of alkaline and acidic solutions, the substrate after single laser treatment is etched. The laser-treated area of ​​the through-hole region is etched into a through-hole structure, and the first and second surfaces of the folded region are respectively etched into a smooth and continuous recessed structure.

[0064] In step S03, further treatment of the substrate 10 with alkaline and acidic solutions enables smooth trimming of the laser-treated substrate 10. The acidic etching solution typically contains fluorine compounds such as hydrofluoric acid (HF) and ammonium fluoride (NH4F), which dissolve silicon dioxide through the complexation of fluoride ions to etch the substrate 10. The alkaline etching solution typically uses sodium hydroxide (NaOH) or ammonium hydroxide (NH4OH) to react chemically with the material, generating soluble salts to complete the etching. Acidic solutions are more corrosive and have a faster etching process, while alkaline solutions have a slower etching rate and are suitable for short-term etching before molding. Different etching methods can be selected for the substrate 10 depending on the production conditions.

[0065] It should be further explained that in the preparation method provided in the embodiments of the present invention, the laser processing of the substrate 10 is only a modification treatment to improve the etching rate of local areas on the substrate 10, so as to facilitate the subsequent etching solution to process through holes or arc-shaped structures on the substrate 10.

[0066] S04: Secondary laser processing: The first and second surfaces of the folded area are respectively laser-drilled to generate multiple staggered first and second blind holes.

[0067] It should be noted that for the folded area 30 on the substrate 10, the recessed treatment needs to be completed before the first blind via 330 and the second blind via 340 are opened to avoid the problem of high defect rate caused by abnormal corrosion. Therefore, after steps S02 and S03, the folded area 30 only forms the first surface 310 and the second surface 320 with recessed areas. After step S03, step S04 is performed to form the general configuration of the first blind via 330 and the second blind via 340 through secondary laser processing, and then etching is performed again in step S05. It should also be noted that when the substrate 10 is in step S04, the position is obtained by automatic setting of the mark positioning mark to ensure the accuracy of the secondary laser processing.

[0068] S05: Secondary etching: The substrate is etched a second time. The first and second blind holes, which are treated by secondary laser, are formed into blind hole structures with outward expansion of the opening. The through holes in the through hole area are formed into preset specifications.

[0069] It should be noted that in step S05, the solution used for etching the substrate 10 is an alkaline solution such as sodium hydroxide or potassium hydroxide, in order to improve the etching accuracy and prevent over-etching caused by excessively fast etching rate.

[0070] Furthermore, in the preparation method disclosed in the above embodiments, in step S04, laser drilling is used to generate multiple staggered first blind holes 330 and second blind holes 340. Specifically, the staggered arrangement means that in the first direction, two adjacent blind holes are each a first blind hole 330 and a second blind hole 340, and when viewed from above in the second direction, two adjacent first blind holes 330 or two adjacent second blind holes 340 are also arranged in a cross-shaped manner. Taking the first blind holes 330 on the first surface 310 as an example, if a single group of first blind holes 330 is a single hole, it can be arranged in a staggered manner. If there are multiple first blind holes 330 in a single group, they can be arranged in a cross-shaped structure of three, four, or three in the first direction. The staggered arrangement of the first blind holes 330 and second blind holes 340 can further balance the structural strength and folding performance of the folding region 30, thereby improving the service life of the substrate 10.

[0071] Furthermore, the outward expansion of the opening of the first blind hole 330 and the second blind hole 340 enhances the folding strength of the blind holes. In the preparation method provided in this embodiment of the invention, the outer diameter of the opening area of ​​the first blind hole 330 and the second blind hole 340 is 50μm-500μm. In order to avoid excessive damage to the structure of the folded area 30 by the blind holes, the material thickness at the bottom of the blind hole in the area where the blind hole is opened on the folded layer still accounts for 20%-40% of the minimum thickness of the folded area 30, that is, 20μm-80μm. At the same time, for the blind hole structure, if a partition hole 3310 structure is provided in a single set of first blind holes 330 or second blind holes 340, the distance between two adjacent partition holes 3310 in a single set of blind holes is 30μm-300μm, while the distance between an adjacent set of first blind holes 330 and second blind holes 340 in the first direction is 30μm-100μm.

[0072] It should be noted that the thickness of the substrate 10 after step S05 is 0.05mm-0.9mm, while the thickness of the folded region 30 is 20μm-300μm, which is typically 33%-66% of the structural thickness of the through-hole region 20; more preferably, the thickness of the folded region 30 is 50μm-150μm.

[0073] It should be further noted that, in the above embodiments, the measurement methods for aperture and width can be two-dimensional measurement and scanning electron microscopy (SEM), while the measurement methods for aperture depth or groove thickness can be cross-sectional two-dimensional measurement, SEM measurement, or step meter.

[0074] Furthermore, based on the above embodiments, the preparation method provided by the present invention, after step S05 is completed, can also include the following steps:

[0075] S06: Post-processing: The substrate after secondary etching is subjected to basket tempering to achieve tempering treatment of through holes and blind holes, and the first and second surfaces of the folded area are masked by masking film.

[0076] It should be noted that the basket tempering involves designing a dedicated steel mesh based on the size and layout of the through holes and blind holes. This mesh fills the through holes with the required structural layers to enhance the strength of the folded area 30 and the through hole area 20. The surface stress of the treated substrate 10 is greater than 450 MPa. The masking films on the first surface 310 and the second surface 320 are used to protect these surfaces, allowing for subsequent separate processing of the through hole area 20.

[0077] S07: Through-hole area treatment: Metallize the through-holes in the through-hole area by one or both of chemical deposition and physical deposition.

[0078] It should be noted that through-hole metallization can be achieved through electroplating, vapor deposition, or physical filling, while metal (usually copper) is deposited inside the through-hole to meet subsequent connection and display requirements.

[0079] S08: Folding area treatment: Remove the masking film on the folding area, fill the first blind hole and the second blind hole with a flexible first reinforcing layer, then add a second reinforcing layer that extends into the blind hole, and then set a third reinforcing layer that covers the second reinforcing layer and is in a continuous state.

[0080] S09: Polishing: Polishing the surface of a substrate to produce a substrate intermediate for foldable glass products.

[0081] It should be noted that in step S08, the first reinforcing layer 3510 is a flexible epoxy resin or polyurethane resin, and fills 20%-40% of the depth of the blind holes to enhance the ductility and compressive strength of the blind hole area. The tensile strength of the first reinforcing layer 3510 is 5 MPa-10 MPa, its elongation is greater than 50%, and its temperature resistance is greater than 130°C. The second reinforcing layer 3520 is more flexible than the first reinforcing layer 3510, and it can be silicone resin, silicone-modified polyurethane resin, or silicone-modified acrylate resin, etc. The second reinforcing layer 3520 fills the remaining area of ​​the blind holes, that is, 60%-80% of the depth of the blind holes. It should also be noted that the tensile strength of the second reinforcing layer 3520 is 1 MPa-5 MPa, its elongation is greater than 100%, and its temperature resistance is greater than 250°C. Based on this, the third reinforcing layer 3530 is a flexible reinforcing film that covers the second reinforcing layer 3520 and adheres to the bent substrate 10. It should be noted that the third reinforcing layer 3530, as an outer protective layer, has stronger tensile strength. Specifically, the tensile strength of the third reinforcing layer 3530 is 60 MPa-100 MPa, the elongation is greater than 50%, and the temperature resistance is greater than 220℃. The thickness of the third reinforcing layer 3530 is 25 μm-50 μm. The three reinforcing layers ensure the heat resistance, corrosion resistance, and ductility of the folded area 30, and effectively absorb the pressure during the bending process of the folded area 30, thereby improving the mechanical properties of the folded area 30.

[0082] The above embodiments enable the fabrication of a bidirectional bending substrate 10, and obtain a substrate 10 with a thickness of 0.05mm-0.9mm by setting blind holes and a reinforcing layer, and the bending radius of the substrate 10 reaches 1mm-3mm, with a bending number of not less than 300,000 times.

[0083] Furthermore, in a specific embodiment of the present invention, the substrate 10 is prepared by the above-described preparation method, and the preparation process specifically includes:

[0084] S101: Obtain a 0.4mm thick glass substrate, perform ultrasonic cleaning on the substrate, and adjust the laser pulse energy and pulse duration to perform double-sided laser fan-shaped modification on the area designated as the folded region on the substrate. This creates a structure where the modification depth gradually increases from the through-hole area towards the folded region, until reaching the center of the folded region. Then, the modification depth gradually decreases towards the through-hole area on the other side of the folded region, forming a modified structure with the maximum modification depth at the center of the folded region and the first and second surfaces forming a fan shape. The through-hole area is laser-drilled according to the drawing requirements, and a mark is set.

[0085] S102: The substrate is etched with hydrofluoric acid (HF) to form through holes, and the folded area of ​​the substrate is vertically inserted into a basket to immerse in HF through hole solution to form through holes up to 0.340 mm; the inner diameter of the through hole area is processed to 10 μm and the outer diameter is processed to 61 μm; the folded area is formed into a double-sided arc surface and the thickness of the thinnest area is 130 μm.

[0086] S103: Perform a second laser drilling on the substrate after ultrasonic cleaning: Obtain the substrate position using the mark positioning marker, and perform double-sided cross-drilling of blind holes in the folded area. Similarly, the modification depth of the blind holes gradually decreases from the through-hole area to the folded area, and then gradually increases from the folded area towards the through-hole area on the other side after reaching the center of the folded area. At the center of the folded area, i.e., the thinnest area on the substrate, the preset laser modification depth is 65μm. At the same time, the single group of blind holes in the center area of ​​the folded area is set as a three-row partitioned hole structure, while the number of blind holes on both sides in the first direction gradually increases, so that the blind hole structure on one side surface forms a hole trend with a small center and wide sides, which is conducive to bending.

[0087] It should also be noted that for the blind hole structure, the spacing between individual holes is 15 μm, the light spot size is 15 μm, and the length of a single group of blind holes is 4 mm. For the initial group of blind holes in the central region of the folded area, the spacing between two adjacent separating holes within a single group is 70 μm. In the first direction, on the first surface or the second surface, the spacing between two adjacent groups of blind holes is 215 μm. Furthermore, the spacing increases by 30 μm for every two groups from the folded area towards the through-hole area. Twenty-four groups are arranged side-by-side and staggered on the first and second surfaces.

[0088] S104. A second through-hole is made on the substrate using potassium hydroxide (KOH) solution. The substrate thickness is processed to 0.3 mm. The inner diameter of the through-hole in the through-hole area is processed to 55 μm and the outer diameter is processed to 102 μm. The thinnest part of the center of the folded area is processed to 90 μm. The material thickness of the folded area at the bottom of the blind hole is 27 μm. The outer flared diameter of the single blind hole in the center area of ​​the folded area is 115 μm.

[0089] S105. The substrate is ultrasonically cleaned and then tempered. The vertical insertion basket in the folded area has a surface stress depth of 11.3μm and a surface stress of 570Mpa after tempering.

[0090] S106. Select a UV dissociation film to perform double-sided masking on the folded area on the substrate.

[0091] S107. Metallize the through-hole area: Precisely locate the hole using a mark, use inkjet printing, inject conductive metal adhesive into the hole through a micro-nozzle, and then vacuum thermo-press to cure it. The conductive adhesive used is nano copper paste.

[0092] S108. Remove the masking film from the folded area, fill and cure the blind holes on the first and second surfaces with epoxy resin and silicone-modified polyurethane resin, using the same filling method as the hole metallization and UV curing method; then apply a polyimide reinforced film.

[0093] S109. With a bending radius of 2mm, it undergoes 300,000 bending tests.

[0094] This completes the fabrication of substrate 10 in this embodiment.

[0095] The terms "first," "second," "left side," and "right side," etc., used in the specification, claims, and accompanying drawings of this invention are used to distinguish different objects, not to describe a specific order. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or apparatus that includes a series of steps or units may include steps or units not listed, but rather steps or units not listed.

[0096] The above description of the disclosed embodiments enables those skilled in the art to make or use the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A double-sided folding glass product, characterized in that, The substrate includes a substrate, which includes through-hole regions spaced apart in a first direction and a folded region disposed between two adjacent through-hole regions. The through-hole regions are provided with metallized through-hole structures according to pattern requirements. The folded area includes a first surface and a second surface that are disposed opposite to each other in a second direction and are recessed towards each other. The folded area is provided with a first blind hole and a second blind hole in the second direction. The opening of the first blind hole is located on the first surface, and the opening of the second blind hole is located on the second surface. Multiple sets of the first blind hole and the second blind hole are alternately arranged in the folded area along the first direction. The first surface and the second surface are respectively provided with a reinforcing layer, and a portion of the reinforcing layer fills the blind holes. Both the first surface and the second surface are arc-shaped concave regions, and the lowest point of both the first surface and the second surface is located at the midpoint of the folded area in the first direction; The reinforcing layer disposed on the first surface includes a first reinforcing layer, a second reinforcing layer and a third reinforcing layer. The first reinforcing layer is a flexible layer and fills the bottom of the first blind hole. The second reinforcing layer seals the first blind hole and extends to the first surface. The third reinforcing layer is completely located outside the first blind hole and covers the second reinforcing layer.

2. The double-sided folding glass product as described in claim 1, characterized in that, The minimum thickness of the folded area is not less than 50 μm, and the depth of the first blind hole accounts for 60%-80% of the thickness of the corresponding position of the folded area.

3. The double-sided folding glass product as described in claim 1, characterized in that, Each set of first blind holes includes multiple spaced-apart partition holes, and the distance between two adjacent partition holes in a single set of first blind holes is 30μm-300μm.

4. The double-sided folding glass product as described in claim 1, characterized in that, The opening regions of the first blind hole and / or the second blind hole are flared outwards in a horn-like configuration.

5. A method for preparing double-sided folded glass, characterized in that, The method for preparing the double-sided folded glass article according to any one of claims 1-4 includes at least the following steps: Partitioning: The substrate with a thickness of a first preset thickness is divided into a through-hole area and a folded area. The folded area is located between the two through-hole areas. The two sides of the folded area in the thickness direction are respectively defined as the first surface and the second surface. The through-hole area is set with positioning marks. One laser treatment: laser modification of the through-hole area and the folded area. The through-hole area is processed by drilling through holes according to the graphic requirements. The first and second surfaces of the folded area are subjected to depth modification of the concave structure. The modified first and second surfaces are uniformly concave from both sides to the middle. One-time etching: The substrate after one laser treatment is etched using alkaline solution and / or acid solution. The laser-treated area of ​​the through-hole region is etched into a through-hole structure, and the first and second surfaces of the folded area are respectively etched into a smooth and continuous recessed structure. Secondary laser processing: The first and second surfaces of the folded area are pre-drilled by laser to generate multiple staggered first and second blind holes; Secondary etching: The substrate is etched twice. The first and second blind holes, which are treated by secondary laser, are formed into blind hole structures with outward expansion of the opening. The through holes in the through hole area are formed into preset specifications.

6. The preparation method according to claim 5, characterized in that, Following the secondary etching step, the following steps are also included: Post-processing: The substrate after secondary etching is subjected to basket tempering to achieve tempering treatment of through holes and blind holes, and the first and second surfaces of the folded area are masked by masking film. Through-hole area treatment: Metallization treatment of through-holes in the through-hole area by chemical deposition and / or physical deposition; Folding area treatment: Remove the masking film on the folding area, fill the first blind hole and the second blind hole with a flexible first reinforcing layer, then add a second reinforcing layer that extends into the blind hole, and then set a third reinforcing layer that covers the second reinforcing layer in a continuous state. Polishing: Polishing the surface of a substrate to create a substrate intermediate for foldable glass products.

7. The preparation method according to claim 5, characterized in that, In the secondary etching step, the etching solution is an alkaline sodium hydroxide or potassium hydroxide solution.

8. The preparation method according to claim 5, characterized in that, In the first etching step, the minimum thickness of the folded area after etching is 50μm-200μm, and the thickness of the folded area is 33%-66% of the thickness of the through-hole area.

9. The preparation method according to claim 6, characterized in that, In the folded area processing step, the first reinforcing layer is a flexible epoxy resin or polyurethane resin, and fills the blind holes to a depth of 20%-40%; the second reinforcing layer is an organosilicon resin or organosilicon-modified polyurethane resin with greater flexibility than the first reinforcing layer, and the second reinforcing layer fills the blind holes and partially overflows them; the third reinforcing layer is a flexible reinforcing film with a thickness of 25μm-50μm.

10. The preparation method according to claim 5, characterized in that, In the secondary etching step, the aperture of the opening region of the first blind hole and the second blind hole is 50μm-500μm, the thickness of the folded region at the bottom of the blind hole is 20μm-80μm, and the distance between adjacent first blind holes and second blind holes is 30μm-100μm.

11. The preparation method according to claim 5, characterized in that, The first preset thickness is 0.1mm-1.0mm.

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