Automatic detection device for semiconductor packaging

Abstract

The invention relates to the technical field of semiconductors, and provides an automatic detection device for semiconductor packaging, which comprises a bottom plate, and a groove is formed in the top of the bottom plate. The controller controls the air cylinder to start and synchronously drives the L-shaped strip and the round rod to move downwards, the detection frame covers the outer surface of the packaged workpiece, when the detection frame makes contact with the movable frame, the fixed frame just makes contact with the first pressure sensor, it is indicated that the packaged workpiece is small or thick and does not meet the standard, and it is judged that the packaged workpiece is a defective product; when the detection frame slides along the outer surface of the third guide rod, the detection frame is pressed on the packaged workpiece, does not make contact with the positioning sliding block and does not generate a signal, the uniformity of the packaged workpiece does not meet the standard, and the packaged workpiece is judged to be a defective product, so that the thickness and the packaging uniformity of the packaged workpiece can be detected at the same time, the process is simple, and the detection efficiency is high. Therefore, the automatic detection efficiency of the packaged workpiece is improved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and particularly to an automated detection device for semiconductor packaging. Background Art

[0002] Semiconductor packaging is an important link in the manufacturing process of semiconductor devices. It involves protecting and connecting the fabricated semiconductor chips to ensure their reliability and performance during use. Semiconductor packaging refers to the process of processing the tested wafers into independent chips according to product models and functional requirements, that is, placing the fabricated semiconductor devices into plastic, ceramic, or metal shells with support and protection, and connecting them to external drive circuits and other electronic components. Its main purpose is to protect the chips from the influence of the external environment (such as temperature changes, electric shock, chemical and physical damage, etc.), and at the same time realize the connection and communication between the chips and the external circuit.

[0003] In the prior art, during the semiconductor packaging process, the chip and the substrate need to be encapsulated together with resin. Subsequently, it is necessary to detect the thickness and encapsulation neatness of the packaged workpiece. Currently, the detection of the thickness and encapsulation neatness of the packaged workpiece is carried out separately, and the detection process is relatively cumbersome, resulting in a low efficiency of automated detection of the packaged workpiece. Summary of the Invention

[0004] The purpose of the present invention is to solve the problem that in the prior art, during the semiconductor packaging process, the chip and the substrate need to be encapsulated together with resin. Subsequently, it is necessary to detect the thickness and encapsulation neatness of the packaged workpiece. Currently, the detection of the thickness and encapsulation neatness of the packaged workpiece is carried out separately, and the detection process is relatively cumbersome, resulting in a low efficiency of automated detection of the packaged workpiece.

[0005] To achieve the above object, the present invention adopts the following technical solutions: An automatic detection device for semiconductor packaging, comprising: a bottom plate, a groove is opened at the top of the bottom plate, and two first guide rods are symmetrically and fixedly connected to opposite sides of the inner wall of the groove. Two movable strips are symmetrically slidably connected to the outer surfaces of the two first guide rods. A bracket is fixedly connected to the top of the movable strip. A plurality of placement tables are fixedly connected to the top of one of the brackets at equal intervals. A fixed frame is slidably connected to the outer surface of the placement table near the center. An movable frame is fixedly connected to the outer surface of the placement table near the top. A plurality of positioning sliders are fixedly connected to the top of the fixed frame. The positioning sliders are slidably connected to the movable frame. Springs are fixedly connected to the four corners of the top of the fixed frame. The springs are fixedly connected to the movable frame. A plurality of first pressure sensors are fixedly connected to the top of the bracket at equal intervals. A U-shaped frame is fixedly connected to the top of the bottom plate. A cylinder is fixedly connected to the top of the U-shaped frame. The telescopic end of the cylinder is fixedly connected to a movable plate. An L-shaped strip is fixedly connected to one side of the movable plate. A round rod is fixedly connected to the side of the L-shaped strip near the bottom. One side of one of the brackets is fixedly connected to a square plate through a support rod. A guide groove is opened on one side of the square plate. The outer surface of the round rod is slidably connected inside the guide groove. A plurality of third guide rods are fixedly connected to the bottom of the movable plate in pairs and at equal intervals. A detection frame is slidably connected to the outer surfaces of the two third guide rods. A detection plate is slidably connected inside the detection frame. A second pressure sensor is fixedly connected to the top of the inner wall of the detection frame. A spring is arranged on the outer surface of the second pressure sensor. The spring is fixedly connected to the detection frame and the detection plate respectively.

[0006] Preferably, a spring is arranged on the outer surface of the third guide rod. The spring is fixedly connected to the movable plate and the detection frame respectively.

[0007] Preferably, chutes are opened on opposite sides of the U-shaped frame. The outer surface of the movable plate is slidably connected inside the two chutes. An auxiliary groove is opened on one side of the U-shaped frame. An auxiliary block is slidably connected inside the auxiliary groove. The auxiliary block is fixedly connected to the L-shaped strip.

[0008] Preferably, a receiving frame is fixedly connected to the top of the other bracket. A plurality of indicator lights are fixedly connected to one side of the receiving frame at equal intervals. The inner wall of the bottom of the receiving frame is inclined.

[0009] Preferably, a first connecting strip is rotatably connected to the center of the bottom of the inner wall of the groove through a support rod. Both ends of the bottom of the first connecting strip are rotatably connected to a second connecting strip through a support rod. The second connecting strip is rotatably connected to the movable strip through a support rod.

[0010] Preferably, a fixed plate is fixedly connected to the top of one of the brackets. A pneumatic telescopic rod I is fixedly connected to the center of the fixed plate. One end of the pneumatic telescopic rod I is fixedly connected to a pushing plate. Two guide rods II are symmetrically and slidably connected to one side of the fixed plate, and both of the two guide rods II are fixedly connected to the pushing plate.

[0011] Preferably, an L-shaped plate is fixedly connected to the top of the bottom plate. A pneumatic telescopic rod II is fixedly connected to the top of the L-shaped plate. One end of the pneumatic telescopic rod II is fixedly connected to a disc. A pressing plate is fixedly connected to one side of the movable plate.

[0012] Preferably, a spring II is arranged on the outer surface of the pneumatic telescopic rod II, and the spring II is fixedly connected to the L-shaped plate and the disc respectively.

[0013] Preferably, the other end of the pneumatic telescopic rod II is fixedly connected to a rubber hose. One end of the rubber hose is fixedly connected to the other end of the pneumatic telescopic rod I. One end of the rubber hose is communicated with the compression cavity of the pneumatic telescopic rod I, and the other end of the rubber hose is communicated with the compression cavity of the pneumatic telescopic rod II.

[0014] Compared with the prior art, the advantages and positive effects of the present invention are as follows.

[0015] 1. In the present invention, the cylinder is controlled by a controller to start and extend, pushing the movable plate to slide downward along the chute, synchronously driving the L-shaped bar and the round bar to move downward. First, the round bar slides downward along the inclined chute section of the guide groove, applying a force to the square plate and simultaneously applying a force to one of the brackets, driving one of the movable bars to slide toward the middle along the outer surface of the first guide rod. When the round bar slides to the vertical chute section of the guide groove, at this time, the placement table moves to directly below the U-shaped frame. Synchronously, with the downward movement of the movable plate, the third guide rod, the detection frame, etc. are driven to move downward, so that the detection frame covers the outer surface of the encapsulated workpiece. When the detection frame contacts the positioning slider, the positioning slider will slide downward, driving the fixed frame to slide downward, stretching the first spring. When the detection frame contacts the movable frame, at this time, the fixed frame just contacts the first pressure sensor, causing the first pressure sensor to receive a pressure and generate a signal. Synchronously, when the detection frame covers the encapsulated workpiece, the top of the encapsulated workpiece will contact the detection plate, applying an upward force to the detection plate, causing the detection plate to slide into the interior of the detection frame, compressing the fourth spring, and causing the second pressure sensor to receive the pressure of the detection plate. When a signal is generated simultaneously or with a very short time interval, it indicates that the thickness of the encapsulated workpiece meets the standard. On the contrary, when the first pressure sensor and the second pressure sensor receive pressure and the signal generation times are different, it indicates that the thickness of the encapsulated workpiece is too shallow or too thick and does not meet the standard, and it is judged as a defective product. The elastic strength of the third spring is greater than the elastic strength of the fourth spring and the first spring, so that when the alignment of the encapsulated workpiece meets the standard, the detection frame will not slide along the third guide rod. When the detection frame slides along the outer surface of the third guide rod, it indicates that the detection frame presses on the encapsulated workpiece and does not contact the positioning slider, so that the first pressure sensor and the second pressure sensor do not receive pressure and do not generate a signal, indicating that the alignment of the encapsulated workpiece does not meet the standard and is judged as a defective product. In this way, the thickness and alignment of the encapsulated workpiece can be detected simultaneously, and this process is relatively simple, thus improving the efficiency of automatic detection of the encapsulated workpiece.

[0016] 2. In the present invention, when the movable plate moves downward, it can drive the pressing plate to move downward. When it moves a certain distance, the pressing plate will contact the disc and exert a downward force on the disc, causing the second pneumatic telescopic rod to contract and the second spring to be compressed. As a result, the gas inside the compression chamber of the second pneumatic telescopic rod enters the compression chamber of the first pneumatic telescopic rod through the rubber hose. Since the detection frame covers or presses on the packaged workpiece at this time, the first pneumatic telescopic rod extends to drive the pushing plate to move a short distance to contact the detection frame, causing the pushing plate to be limited and unable to extend further. Consequently, the air pressure inside the compression chamber of the first pneumatic telescopic rod increases. When the cylinder contracts and drives the movable plate, the L-shaped bar, and the round rod to move upward, since the round rod is located in the vertical groove section of the guiding groove at this time, when the detection frame moves upward, the bracket, the placement table, and the receiving frame remain stationary. When the detection frame moves away from the packaged workpiece, the limit on the pushing plate is released, enabling the first pneumatic telescopic rod to continue to extend and drive the pushing plate to push the packaged workpiece on the placement table into the receiving frame. In this way, the automatically detected packaged workpiece can be automatically unloaded, thereby improving the automation degree of this device.

[0017] 3. In the present invention, by applying a force to one of the brackets, driving one of the movable bars to slide towards the middle along the outer surface of the first guiding rod, simultaneously applying a force to one of the second connecting bars to drive the first connecting bar to rotate by an appropriate angle and drive the other second connecting bar to rotate by an appropriate angle, applying a force to the other movable bar to drive the other bracket to move towards the middle. When the round rod slides to the vertical groove section of the guiding groove, at this time, the placement table moves to directly below the U-shaped frame, and the receiving frame moves to a position below and close to the placement table. On the contrary, when the round rod slides into the inclined groove of the guiding groove, through the cooperation of the first connecting bar and the second connecting bar, the two movable bars can be separated from each other, simultaneously driving the placement table and the receiving frame to move away from each other. In this way, the positions of the placement table and the receiving frame can be automatically moved, facilitating subsequent detection of the packaged workpiece and collection of the packaged workpiece. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 is a schematic structural diagram of an automatic detection device for semiconductor packaging provided by the present invention;

[0019] Figure 2 is an automatic detection device for semiconductor packaging provided by the present invention Figure 1 magnified structural diagram at A in;

[0020] Figure 3 is a schematic side view structural diagram of an automatic detection device for semiconductor packaging provided by the present invention;

[0021] Figure 4Schematic diagram of the placement table structure of an automatic detection device for semiconductor packaging provided by the present invention;

[0022] Figure 5 An automatic detection device for semiconductor packaging provided by the present invention Figure 4 Enlarged schematic diagram of part B in

[0023] Figure 6 Schematic diagram of the detection frame structure of an automatic detection device for semiconductor packaging provided by the present invention;

[0024] Figure 7 Schematic diagram of the sectional structure of an automatic detection device for semiconductor packaging provided by the present invention;

[0025] Figure 8 An automatic detection device for semiconductor packaging provided by the present invention Figure 7 Enlarged schematic diagram of part C in

[0026] Legend description:

[0027] 1. Bottom plate; 101. Groove; 102. First guide rod; 103. Movable strip; 104. Bracket; 105. First connecting strip; 106. Second connecting strip; 107. Material receiving frame; 108. Indicator light; 109. Placement table; 110. Movable frame; 111. Fixed frame; 112. Positioning slider; 113. First pressure sensor; 114. First spring; 2. U-shaped frame; 201. Cylinder; 202. Movable plate; 203. L-shaped strip; 204. Round rod; 205. Square plate; 206. Guide groove; 207. Slide groove; 208. Auxiliary groove; 209. Auxiliary block; 3. Fixed plate; 301. First pneumatic telescopic rod; 302. Second guide rod; 303. Rubber hose; 304. Pressing plate; 305. Pushing plate; 306. L-shaped plate; 307. Second pneumatic telescopic rod; 308. Second spring; 309. Disc; 4. Third guide rod; 401. Detection frame; 402. Third spring; 403. Detection plate; 404. Second pressure sensor; 405. Fourth spring. Detailed implementation manners

[0028] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0029] Embodiment, as Figure 1 - Figure 8As shown in the figure, the present invention provides a technical solution: an automatic detection device for semiconductor packaging, including: a bottom plate 1, a groove 101 is opened at the top of the bottom plate 1, and two guide rods 102 are symmetrically and fixedly connected to the opposite sides of the inner wall of the groove 101. Two movable bars 103 are symmetrically slidably connected to the outer surfaces of the two guide rods 102. A bracket 104 is fixedly connected to the top of the movable bar 103. A plurality of placement platforms 109 are fixedly connected to the top of one of the brackets 104 at equal intervals. A fixed frame 111 is slidably connected to the outer surface near the center of the placement platform 109. A movable frame 110 is fixedly connected to the outer surface near the top of the placement platform 109. A plurality of positioning sliders 112 are fixedly connected to the top of the fixed frame 111. The positioning sliders 112 are slidably connected to the movable frame 110. Four corners of the top of the fixed frame 111 are fixedly connected with a first spring 114 respectively. The first spring 114 is fixedly connected with the movable frame 110. A plurality of first pressure sensors 113 are fixedly connected to the top of the bracket 104 at equal intervals. A U-shaped frame 2 is fixedly connected to the top of the bottom plate 1. A cylinder 201 is fixedly connected to the top of the U-shaped frame 2. A movable plate 202 is fixedly connected to the telescopic end of the cylinder 201. An L-shaped bar 203 is fixedly connected to one side of the movable plate 202. A round bar 204 is fixedly connected to the side near the bottom of the L-shaped bar 203. One side of one of the brackets 104 is fixedly connected with a square plate 205 through a support rod. A guide groove 206 is opened on one side of the square plate 205. The outer surface of the round bar 204 is slidably connected to the inside of the guide groove 206. A plurality of third guide rods 4 are fixedly connected to the bottom of the movable plate 202 in pairs and at equal intervals. A detection frame 401 is slidably connected to the outer surfaces of the two third guide rods 4. A detection plate 403 is slidably connected to the inside of the detection frame 401. A second pressure sensor 404 is fixedly connected to the top of the inner wall of the detection frame 401. A fourth spring 405 is arranged on the outer surface of the second pressure sensor 404. The fourth spring 405 is fixedly connected with the detection frame 401 and the detection plate 403 respectively.

[0030] Further, as Figure 1 - Figure 8 shown, a third spring 402 is arranged on the outer surface of the third guide rod 4. The third spring 402 is fixedly connected with the movable plate 202 and the detection frame 401 respectively. Under the restoring force of the third spring 402, the detection frame 401 can be reset.

[0031] Further, as Figure 1 - Figure 8As shown, sliding grooves 207 are formed on the opposite sides of the U-shaped frame 2, and the outer surface of the movable plate 202 is slidably connected to the interiors of the two sliding grooves 207. An auxiliary groove 208 is formed on one side of the U-shaped frame 2, and an auxiliary block 209 is slidably connected to the interior of the auxiliary groove 208. The auxiliary block 209 is fixedly connected to the L-shaped strip 203. Through the mutual cooperation of the auxiliary groove 208 and the auxiliary block 209, it plays a role in assisting the support of the L-shaped strip 203. When the L-shaped strip 203 moves downward, it can drive the auxiliary block 209 to move downward along the auxiliary groove 208, and the acting force received by the L-shaped strip 203 can be shared.

[0032] Further, as Figure 1 - Figure 8 shown, a material receiving frame 107 is fixedly connected to the top of another support 104. A plurality of indicator lights 108 are fixedly connected to one side of the material receiving frame 107 at equal intervals. The inner wall of the bottom of the material receiving frame 107 is inclined. Through the setting of the material receiving frame 107, it is convenient to collect the detected packaged workpieces, and with the cooperation of the indicator lights 108, it is convenient to observe which packaged workpieces are defective and which are good products.

[0033] Further, as Figure 1 - Figure 8 shown, a connecting strip one 105 is rotatably connected to the center of the bottom of the inner wall of the groove 101 through a support rod. Both ends of the bottom of the connecting strip one 105 are rotatably connected to a connecting strip two 106 through support rods. The connecting strip two 106 is rotatably connected to the movable strip 103 through a support rod. Through the mutual cooperation of the connecting strip one 105 and the two connecting strip two 106, when one of the movable strips 103 slides towards the middle or towards the outside along the guide rod one 102, the other movable strip 103 will also slide towards the middle or towards the outside along the guide rod one 102.

[0034] Further, as Figure 1 - Figure 8 shown, a fixed plate 3 is fixedly connected to the top of one of the supports 104. A pneumatic telescopic rod one 301 is fixedly connected to the center of the fixed plate 3. One end of the pneumatic telescopic rod one 301 is fixedly connected to a pushing plate 305. Two guide rods two 302 are symmetrically and slidably connected to one side of the fixed plate 3. Both of the two guide rods two 302 are fixedly connected to the pushing plate 305. Through the above setting, when the pneumatic telescopic rod one 301 extends, it can drive the pushing plate 305 to move to one side and simultaneously drive the guide rods two 302 to slide to one side.

[0035] Further, as Figure 1 - Figure 8As shown, a L-shaped plate 306 is fixedly connected to the top of the bottom plate 1. A pneumatic telescopic rod two 307 is fixedly connected to the top of the L-shaped plate 306. One end of the pneumatic telescopic rod two 307 is fixedly connected to a disc 309. A pressing plate 304 is fixedly connected to one side of the movable plate 202. Through the above settings, when the pressing plate 304 applies a downward pressure on the disc 309, the pneumatic telescopic rod two 307 will contract.

[0036] Furthermore, as Figure 1 - Figure 8 shown, a spring two 308 is arranged on the outer surface of the pneumatic telescopic rod two 307. The spring two 308 is fixedly connected to the L-shaped plate 306 and the disc 309 respectively. Under the restoring force of the spring two 308, the pneumatic telescopic rod two 307 can be reset.

[0037] Furthermore, as Figure 1 - Figure 8 shown, the other end of the pneumatic telescopic rod two 307 is fixedly connected to a rubber hose 303. One end of the rubber hose 303 is fixedly connected to the other end of the pneumatic telescopic rod one 301. One end of the rubber hose 303 is communicated with the compression cavity of the pneumatic telescopic rod one 301. The other end of the rubber hose 303 is communicated with the compression cavity of the pneumatic telescopic rod two 307. Through the above settings, the compression cavity of the pneumatic telescopic rod one 301 and the compression cavity of the pneumatic telescopic rod two 307 can be communicated through the rubber hose 303.

[0038] Working principle: During use, after the semiconductor packaging is completed, the packaged workpiece is placed on the placement table 109 by means of a manipulator or other transmission methods, with the substrate facing downwards. The substrate is in close contact with the three positioning sliders 112 exactly. The extended length of the positioning sliders 112 is less than the thickness of the substrate. The packaged workpiece is positioned by the three positioning sliders 112. When it is necessary to detect the thickness and packaging neatness of the packaged workpiece, the controller controls the cylinder 201 to start and extend, pushing the movable plate 202 to slide down along the chute 207, synchronously driving the L-shaped bar 203 and the round rod 204 to move downwards. The round rod 204 first slides down along the inclined chute section of the guide groove 206, applying a force to the square plate 205 and simultaneously applying a force to one of the brackets 104, driving one of the movable bars 103 to slide towards the middle along the outer surface of the guide rod one 102, synchronously applying a force to one of the connecting bars two 106, driving the connecting bar one 105 to rotate by an appropriate angle, and driving the other connecting bar two 106 to rotate by an appropriate angle, applying a force to the other movable bar 103, driving the other bracket 104 to move towards the middle. When the round rod 204 slides to the vertical chute section of the guide groove 206, at this time, the placement table 109 moves to directly below the U-shaped frame 2, and the receiving frame 107 moves to a position close to the lower part of the placement table 109. Synchronously, with the downward movement of the movable plate 202, the guide rod three 4 and the detection frame 401, etc. are driven to move downwards, so that the detection frame 401 covers the outer surface of the packaged workpiece. When the detection frame 401 contacts the positioning slider 112, it will cause the positioning slider 112 to slide downwards, driving the fixed frame 111 to slide downwards, stretching the first spring 114. When the detection frame 401 contacts the movable frame 110, at this time, the fixed frame 111 just contacts the first pressure sensor 113, causing the first pressure sensor 113 to receive a pressure and generate a signal. Synchronously, when the detection frame 401 covers the packaged workpiece, the top of the packaged workpiece will contact the detection plate 403, causing the detection plate 403 to receive an upward force, causing the detection plate 403 to slide into the interior of the detection frame 401, compressing the fourth spring 405, and causing the second pressure sensor 404 to be pressured by the detection plate 403. When a signal is generated simultaneously or with an extremely short time interval, it indicates that the thickness of the packaged workpiece meets the standard. On the contrary, when the first pressure sensor 113 and the second pressure sensor 404 receive pressure and the signal generation times are different, it indicates that the thickness of the packaged workpiece is shallower or thicker and does not meet the standard, and it is judged as a defective product. The elastic strength of the third spring 402 is greater than the elastic strength of the fourth spring 405 and the elastic strength of the first spring 114, so that when the neatness of the packaged workpiece meets the standard, the detection frame 401 will not slide along the guide rod three 4. When the detection frame 401 slides along the outer surface of the guide rod three 4, it indicates that the detection frame 401 presses on the packaged workpiece and does not contact the positioning slider 112, so that the first pressure sensor 113 and the second pressure sensor 404 are not pressured and do not generate a signal.It indicates that the neatness of the encapsulated workpiece does not meet the standard, and it is judged as a defective product. In this way, the thickness and encapsulation neatness of the encapsulated workpiece can be detected simultaneously. This process is relatively simple, thus improving the efficiency of automatic detection of the encapsulated workpiece. Synchronously, by the downward movement of the movable plate 202, the pressing plate 304 can be driven to move downward. When moving a certain distance, the pressing plate 304 will contact the disc 309 and apply a downward force to the disc 309, causing the second pneumatic telescopic rod 307 to contract and the second spring 308 to be compressed. The gas inside the compression chamber of the second pneumatic telescopic rod 307 enters the compression chamber of the first pneumatic telescopic rod 301 through the rubber hose 303. Since the detection frame 401 covers or presses on the encapsulated workpiece at this time, the first pneumatic telescopic rod 301 extends to drive the pushing plate 305 to move a short distance to contact the detection frame 401, causing the pushing plate 305 to be limited and unable to extend, thereby increasing the air pressure inside the compression chamber of the first pneumatic telescopic rod 301. When the cylinder 201 contracts and drives the movable plate 202, the L-shaped bar 203 and the round rod 204 to move upward, since the round rod 204 is located in the vertical section of the guide groove 206 at this time, when the detection frame 401 moves upward, the support 104, the placement table 109 and the receiving frame 107 remain stationary. When the detection frame 401 moves away from the encapsulated workpiece, the limit on the pushing plate 305 is released, causing the first pneumatic telescopic rod 301 to continue to extend, driving the pushing plate 305 to push the encapsulated workpiece on the placement table 109 into the receiving frame 107. When the round rod 204 slides into the inclined groove of the guide groove 206, through the cooperation of the first connecting bar 105 and the second connecting bar 106, the two movable bars 103 can be made to move away from each other, synchronously driving the placement table 109 and the receiving frame 107 to move away from each other. With the cooperation of the inclined setting of the inner wall of the bottom of the receiving frame 107, it can prevent the encapsulated workpiece from slipping. In this way, the automatically detected encapsulated workpiece can be automatically unloaded, thereby improving the automation degree of this device. And by judging the color of the lit indicator light 108, it can be determined which encapsulated workpiece is a good product and which is a defective product. The controller receives the signals transmitted by the first pressure sensor 113 and the second pressure sensor 404 to judge whether the encapsulated workpiece is a defective product, and then controls the color of the lit indicator light 108 through the controller. Under the reset force of the second spring 308, the second pneumatic telescopic rod 307 can be reset, so that the first pneumatic telescopic rod 301 is reset with the cooperation of the rubber hose 303. Under the reset force of the fourth spring 405, the detection plate 403 can be reset. Under the reset force of the third spring 402, the detection frame 401 can be reset. Under the reset force of the first spring 114, the fixed frame 111 can be reset.

[0039] The above are only the preferred embodiments of the present invention, and are not intended to limit the present invention in other forms. Any person skilled in the art may use the technical content disclosed above to make changes or modifications into equivalent embodiments with equivalent changes and apply them to other fields. However, as long as it does not depart from the technical solution content of the present invention, any simple modification, equivalent change and modification made to the above embodiments based on the technical essence of the present invention still fall within the protection scope of the technical solution of the present invention.

Claims

1. An automated inspection device for semiconductor packaging, characterized in that: include: A bottom plate (1), wherein a groove (101) is provided at the top of the bottom plate (1), two guide rods (102) are symmetrically fixedly connected to opposite sides of the inner wall of the groove (101), two movable bars (103) are symmetrically slidably connected to the outer surfaces of the two guide rods (102), the tops of the movable bars (103) are fixedly connected to a bracket (104), the top of one of the brackets (104) is equidistantly fixedly connected to a plurality of placement platforms (109), the outer surfaces of the placement platforms (109) near the center are slidably connected to a fixed frame (111), The outer surface of the placement platform (109) near the top is fixedly connected to a movable frame (110), the top of the fixed frame (111) is fixedly connected to a plurality of positioning slide blocks (112), the positioning slide blocks (112) are slidably connected to the movable frame (110), the four corners of the top of the fixed frame (111) are fixedly connected to springs (114), the springs (114) are fixedly connected to the movable frame (110), the top of the bracket (104) is equidistantly fixedly connected to a plurality of pressure sensors (113), the top of the bottom plate (1) is fixedly connected to a U-shaped frame ( 2), the top of the U-shaped frame (2) is fixedly connected to a cylinder (201), the telescopic end of the cylinder (201) is fixedly connected to a movable plate (202), one side of the movable plate (202) is fixedly connected to an L-shaped bar (203), the side of the L-shaped bar (203) close to the bottom is fixedly connected to a round rod (204), one side of one of the brackets (104) is fixedly connected to a square plate (205) through a support rod, one side of the square plate (205) is provided with a guide groove (206), the outer surface of the round rod (204) is slidably connected to the guide groove (206). 6), the bottom of the movable plate (202) is symmetrically and equidistantly fixedly connected with a plurality of guide rods three (4), the outer surfaces of two of the guide rods three (4) are slidably connected with a detection frame (401), the interior of the detection frame (401) is slidably connected with a detection plate (403), the top of the inner wall of the detection frame (401) is fixedly connected with a pressure sensor two (404), the outer surface of the pressure sensor two (404) is provided with a spring four (405), and the spring four (405) is fixedly connected to the detection frame (401) and the detection plate (403), respectively.

2. The automatic detection device for semiconductor packaging according to claim 1, characterized in that: The outer surface of the guide rod three (4) is provided with a spring three (402), and the spring three (402) is fixedly connected to the movable plate (202) and the detection frame (401) respectively.

3. The automatic detection device for semiconductor packaging according to claim 2, characterized in that: The U-shaped frame (2) is provided with a sliding groove (207) on opposite sides, and the outer surface of the movable plate (202) is slidably connected to the inside of the two sliding grooves (207). An auxiliary groove (208) is provided on one side of the U-shaped frame (2), and an auxiliary block (209) is slidably connected to the inside of the auxiliary groove (208), and the auxiliary block (209) is fixedly connected to the L-shaped bar (203).

4. The automatic detection device for semiconductor packaging according to claim 1, characterized in that: A material receiving frame (107) is fixedly connected to the top of the other bracket (104), a plurality of indicator lights (108) are fixedly connected to one side of the material receiving frame (107) at equal intervals, and the inner wall of the bottom of the material receiving frame (107) is arranged to be inclined.

5. The automatic detection device for semiconductor packaging according to claim 1, characterized in that: A connecting strip 1 (105) is rotatably connected to the center of the bottom of the inner wall of the groove (101) via a support rod, and both ends of the bottom of the connecting strip 1 (105) are rotatably connected to a connecting strip 2 (106) via a support rod, and the connecting strip 2 (106) is rotatably connected to the movable strip (103) via a support rod.

6. The automatic detection device for semiconductor packaging according to claim 4, characterized in that: The top of one of the brackets (104) is fixedly connected to a fixed plate (3), the center of the fixed plate (3) is fixedly connected to a pneumatic telescopic rod (301), one end of the pneumatic telescopic rod (301) is fixedly connected to a push plate (305), one side of the fixed plate (3) is symmetrically slidably connected to two guide rods (302), and the two guide rods (302) are fixedly connected to the push plate (305).

7. The automatic detection device for semiconductor packaging according to claim 3, characterized in that: The top of the bottom plate (1) is fixedly connected to an L-shaped plate (306), the top of the L-shaped plate (306) is fixedly connected to a second pneumatic telescopic rod (307), one end of the second pneumatic telescopic rod (307) is fixedly connected to a disc (309), and one side of the movable plate (202) is fixedly connected to a pressure plate (304).

8. The automatic detection device for semiconductor packaging according to claim 7, characterized in that: The outer surface of the second pneumatic telescopic rod (307) is provided with a second spring (308), and the second spring (308) is fixedly connected to the L-shaped plate (306) and the disc (309) respectively.

9. The automatic detection device for semiconductor packaging according to claim 8, characterized in that: The other end of the pneumatic telescopic rod 2 (307) is fixedly connected to a rubber hose (303), one end of the rubber hose (303) is fixedly connected to the other end of the pneumatic telescopic rod 1 (301), one end of the rubber hose (303) is communicated with the compression chamber of the pneumatic telescopic rod 1 (301), and the other end of the rubber hose (303) is communicated with the compression chamber of the pneumatic telescopic rod 2 (307).

Images