Central processing unit heat dissipation device

Abstract

The invention discloses a central processing unit cooling device, and relates to the field of cooling devices.The central processing unit cooling device comprises a radiator, a cooling fan is installed at the top of the radiator, a protection frame is installed on the outer side of the circumference of the radiator, a bottom plate is fixedly connected to the bottom of the protection frame and covers a mainboard, and a central processing unit is installed on the surface of the mainboard; radiating fins are arranged on the outer side of the radiator, an upper connecting seat is fixedly arranged on the upper side of the inner wall of each radiating fin, a middle connecting seat is mounted at the bottom of each upper connecting seat, and a lower connecting seat is mounted at the bottom of each middle connecting seat. According to the heat dissipation device for the central processing unit, when silicone grease of the central processing unit is replaced, a heat dissipation device on the central processing unit does not need to be disassembled; the radiator does not need to be disassembled, which means that the technical requirement on a user is reduced, a common user can easily operate, the problems caused by improper operation are reduced, and even people without too many computer hardware maintenance experiences can complete silicone grease replacement by themselves.

Description

Technical Field

[0001] The present invention relates to the field of heat dissipation devices, and specifically to a central processing unit heat dissipation device. Background Art

[0002] The central processing unit heat dissipation device of a computer mainly achieves heat dissipation through the collaborative work of a heat sink, a cooling fan, a heat conduction medium, and a chassis air duct, etc. The specific method is as follows: The cooling fan drives the fan blades to rotate through a motor, generating an air flow to accelerate the air flow, thereby taking away the heat on the heat sink; According to the principle of thermodynamics, hot air will naturally rise and cold air will naturally fall. The fan utilizes this principle to prompt the hot air to leave the heat sink faster and continuously supplement the cold air, forming a continuous heat exchange process; The fan is installed near the heat sink or directly on the heat sink. When the fan rotates, the hot air around the heat sink is extracted, causing the air on the surface of the heat sink to flow, and new cold air continuously contacts the heat sink, improving the heat dissipation efficiency.

[0003] Regarding the patent of the central processing unit heat dissipation device, after retrieval, the publication number CN2380958Y discloses a fixing seat for a central processing unit heat dissipation device. The text includes that both sides of the upper seat body of the fixing seat are each bent downward by a preset height to form side plates, and two horizontal push-pull pieces are connected to the bottom side of the side plates. A fan is fixed inside the upper seat body.

[0004] Although the above device can dissipate heat from the central processing unit, in actual use, silicone grease is applied on the surface of the central processing unit. Its purpose is an important medium to help the CPU and the radiator closely combine and improve the heat conduction efficiency; However, as the usage time increases, the silicone grease will dry out and age, reducing the heat conduction performance; It is necessary to disassemble the radiator above the central processing unit. During the process of disassembling the radiator, if the operation is improper, it may cause physical damage to the CPU, the motherboard, or the radiator itself; For example, excessive force may cause the CPU pins to bend or break. For some CPUs using flip-chip packaging, it may also damage the connection between the chip and the substrate. Summary of the Invention

[0005] The purpose of the present invention is to provide a central processing unit heat dissipation device to solve the defects mentioned in the above background art.

[0006] To achieve the above-mentioned purpose, a central processing unit heat dissipation device is provided, including a radiator, a cooling fan is installed on the top of the radiator, a protective frame is installed on the outer side of the circumference of the radiator, the bottom of the protective frame is fixedly connected to a base plate, the base plate covers the mainboard, the mainboard is installed on the surface of the mainboard, and cooling fins are arranged on the outer side of the radiator, an upper connecting seat is fixedly arranged on the upper side of the inner wall of the cooling fin, a middle connecting seat is installed on the bottom of the upper connecting seat, a lower connecting seat is installed on the bottom of the middle connecting seat, a thermal conductive seat is fixedly arranged on the bottom of the lower connecting seat, and the thermal conductive seat is arranged directly above the central processing unit.

[0007] As an improvement of the above scheme, a support frame is installed on the upper side of the cooling fan, and the support frame is arranged in a cross shape. The end of the support frame is screwed and fixed to the outer frame of the cooling fan, and the bottom of the outer frame is screwed and fixed to the screw column fixedly connected to the inner wall of the circumference of the upper connecting seat.

[0008] As an improvement of the above scheme, the radiator includes a base plate, cooling fins, an upper connecting seat, a middle connecting seat and a lower connecting seat. The upper connecting seat, the middle connecting seat and the lower connecting seat are all arranged in a ring shape, and multiple groups of cooling fins are evenly arranged on the circumferential outer walls of the upper connecting seat, the middle connecting seat and the lower connecting seat.

[0009] As an improvement of the above solution, the heat sink fins include an upper extension piece, a lower extension piece and a through hole, the lower extension piece is fixedly arranged at the bottom of the upper extension piece, the upper extension piece is provided with two groups of slots, and the lower extension piece is provided with a circular through hole.

[0010] As an improvement on the above scheme, the protective frame includes a mounting plate, a spring, a locking bolt, a stud, a column and a frame. The mounting plate is fixedly arranged on the surface of the mainboard, and the surface of the mounting plate is fixedly provided with a stud. The stud passes through a hole groove opened at the end of the base plate and is screwed and fixed with the locking bolt. The top of the stud is fixedly connected to the column, and a limiting plate is fixedly installed on the outer side of the bottom circumference of the column.

[0011] As an improvement of the above solution, the base plate is set in an "H" shape, and four groups of studs are evenly installed on the base plate. Pillars are set on the tops of the four groups of studs, and frames are installed on the four groups of pillars. The frame is wrapped around the outer side of the circumference of the radiator.

[0012] As an improvement of the above scheme, the frame includes narrow strips, wide strips and connecting ribs, and both ends of the narrow strips and wide strips are provided with through holes. The narrow strips and wide strips are arranged in two groups and are relatively distributed and installed on four groups of columns. The frame is supported on the columns by limit plates.

[0013] As an improvement of the above solution, the narrow strips and the wide strips are both arranged in an arc shape, and the narrow strips and the wide strips are fixedly connected by connecting ribs, and the connecting ribs are arranged obliquely.

[0014] As an improvement to the above solution, the heat conduction base includes a positioning groove, a positioning seat, a heat transfer sheet, a silicone grease filling groove, an operation sheet, and a stress tail seat. A positioning groove is provided at the bottom of the heat conduction base, and the size of the positioning groove is adapted to that of the positioning seat. The positioning seat is inserted into the positioning groove, and the depth of the positioning groove is equal to the thickness of the positioning seat.

[0015] As an improvement to the above solution, both the positioning groove and the positioning seat are octagonal. A heat transfer sheet is fixedly provided at the bottom of the positioning seat. The bottom area of the heat transfer sheet is larger than the surface area of the central processing unit. A silicone grease filling groove is provided on the bottom surface of the heat transfer sheet, and the silicone grease filling groove is in a plum blossom shape.

[0016] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0017] 1. In the present invention, a frame is provided on the outer side of the radiator. The frame is composed of multiple narrow strips and wide strips and wraps around the outer side of the radiator, which can prevent the hand from touching the sharp heat dissipation fins during operation, such as when repairing or cleaning the dust inside the chassis, thus avoiding hand scratches; at the same time, the frame can protect the radiator and prevent the heat dissipation fins from being bent or damaged due to external collision or misoperation, extending the service life of the radiator.

[0018] 2. In the present invention, the heat transfer sheet is installed at the bottom of the heat conduction base through the positioning groove and the top of the positioning seat. Finally, by tightening the locking bolts simultaneously, the bottom plate moves downward horizontally, enabling a brand-new layer of silicone grease to cover the surface of the central processing unit, thus completing the application of the silicone grease; when replacing the silicone grease on the central processing unit, there is no need to disassemble the radiator on the central processing unit; not having to disassemble the radiator means that the technical requirements for users are reduced, and ordinary users can easily operate it, reducing problems caused by improper operation. Even those without much experience in computer hardware maintenance can replace the silicone grease by themselves. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The drawings incorporated herein and constituting a part of the specification illustrate embodiments of the present invention and, together with the specification, are further used to explain the principles of the present invention and enable those skilled in the relevant art to implement and use the present invention.

[0020] Figure 1 It is a front view schematic diagram of the structure of the present invention;

[0021] Figure 2 For Figure 1 side view;

[0022] Figure 3 For Figure 1 top view;

[0023] Figure 4 It is a top view of the installation structure of the radiator and the protective frame;

[0024] Figure 5 It is Figure 4 the enlarged structural schematic diagram of part A in

[0025] Figure 6 the schematic diagram of the radiator;

[0026] Figure 7 It is Figure 6 the sectional view of

[0027] Figure 8 the structural schematic diagram of the heat conducting base;

[0028] Figure 9 the side view of the heat conducting base.

[0029] [Reference Signs]

[0030] 1. Radiator; 11. Bottom plate; 12. Heat dissipation fins; 1201. Upper extension piece; 1202. Lower extension piece; 1203. Through hole; 121. Upper connecting seat; 122. Middle connecting seat; 123. Lower connecting seat; 124. Heat conducting base; 1240. Positioning groove; 1241. Positioning seat; 1242. Heat transfer piece; 1243. Thermal grease filling groove; 1244. Operating piece; 1245. Force receiving tail seat; 2. Heat dissipation fan; 20. Outer frame; 3. Support frame; 4. Protection frame; 41. Mounting piece; 42. Spring; 43. Locking bolt; 44. Stud; 45. Column; 451. Limiting piece; 46. Frame; 461. Narrow strip; 462. Wide strip; 463. Connecting rib; 5. Motherboard; 51. Central processing unit. Detailed Embodiments

[0031] The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments. At the same time, it should be noted here that in order to make the embodiments more detailed, the following embodiments are the best and preferred embodiments. For some well-known technologies, those skilled in the art can also adopt other alternative methods for implementation; moreover, the accompanying drawings are only for more specific description of the embodiments, and are not intended to specifically limit the present invention.

[0032] It should be pointed out that in the specification, when referring to "an embodiment", "embodiment", "exemplary embodiment", "some embodiments", etc., it indicates that the described embodiment may include specific features, structures or characteristics, but not necessarily every embodiment includes such specific features, structures or characteristics. In addition, when combining an embodiment to describe a specific feature, structure or characteristic, implementing such feature, structure or characteristic in combination with other embodiments (whether explicitly described or not) should be within the knowledge scope of those skilled in the relevant art.

[0033] Generally, terms can be understood at least in part from their use in context. For example, depending at least in part on the context, the term "one or more" as used herein can be used to describe any feature, structure, or property in a singular sense, or can be used to describe a combination of features, structures, or properties in a plural sense. Additionally, the term "based on" can be understood as not necessarily intended to convey a set of exclusive factors, but rather can alternatively, depending at least in part on the context, allow for the existence of other factors that are not necessarily explicitly described.

[0034] It will be understood that the meanings of "on", "above", and "over" in the present invention should be construed in the broadest manner such that "on" not only means "directly on" something, but also includes the meaning of being "on" something with intervening features or layers therebetween, and "above" or "over" not only means "above" or "over" something, but can also include the meaning of being "above" or "over" something with no intervening features or layers therebetween.

[0035] In addition, spatial relative terms such as "beneath", "below", "lower", "above", "upper", etc. are used herein for convenience of description to describe the relationship of one element or feature to another or other elements or features, as shown in the figures. The spatial relative terms are intended to cover different orientations in the use or operation of the device in addition to the orientation depicted in the figures. The device may be oriented in other ways, and the spatial relative descriptors used herein may be interpreted accordingly.

[0036] Specific Embodiment 1: Please refer to Figures 1-3 , the present invention provides a technical solution: a central processing unit heat dissipation device, including a radiator 1, a heat dissipation fan 2 is installed on the top of the radiator 1, a protective frame 4 is installed on the outer circumference of the radiator 1, the bottom of the protective frame 4 is fixedly connected to a bottom plate 11, the bottom plate 11 covers the main board 5, a central processing unit 51 is installed on the surface of the main board 5, heat dissipation fins 12 are arranged on the outer side of the radiator 1, an upper connection seat 121 is fixedly arranged on the upper side of the inner wall of the heat dissipation fins 12, a middle connection seat 122 is installed at the bottom of the upper connection seat 121, a lower connection seat 123 is installed at the bottom of the middle connection seat 122, a heat conduction seat 124 is fixedly arranged at the bottom of the lower connection seat 123, and the heat conduction seat 124 is arranged directly above the central processing unit 51.

[0037] As Figure 1 , Figure 3 and Figure 4As shown in the figure, Specific Embodiment 2: This embodiment is a further limitation of Specific Embodiment 1. A support frame 3 is installed on the upper side of the cooling fan 2. The support frame 3 is in a cross shape. The ends of the support frame 3 are screwed and fixed on the outer frame 20 of the cooling fan 2. The bottom of the outer frame 20 is screwed and fixed on the screw posts fixedly connected to the inner circumferential wall of the upper connection seat 121.

[0038] As Figure 1 shown in the figure, Specific Embodiment 3: This embodiment is a further limitation of Specific Embodiment 1. The radiator 1 includes a bottom plate 11, heat dissipation fins 12, an upper connection seat 121, a middle connection seat 122, and a lower connection seat 123. The upper connection seat 121, the middle connection seat 122, and the lower connection seat 123 are all annularly arranged. Multiple groups of heat dissipation fins 12 are evenly arranged on the outer circumferential walls of the upper connection seat 121, the middle connection seat 122, and the lower connection seat 123.

[0039] As Figure 1 、 Figure 6 and Figure 7 shown in the figure, Specific Embodiment 4: This embodiment is a further limitation of Specific Embodiment 3. The heat dissipation fins 12 include an upper extension piece 1201, a lower extension piece 1202, and a through hole 1203. The lower extension piece 1202 is fixedly arranged at the bottom of the upper extension piece 1201. Two groups of slot holes are opened on the upper extension piece 1201, and a circular through hole 1203 is opened on the lower extension piece 1202.

[0040] As Figure 1 shown in the figure, Specific Embodiment 5: This embodiment is a further limitation of Specific Embodiment 1. The protection frame 4 includes a mounting piece 41, a spring 42, a locking bolt 43, a stud 44, a column 45, and a frame 46. The mounting piece 41 is fixedly arranged on the surface of the main board 5. A stud 44 is fixedly arranged on the surface of the mounting piece 41. The stud 44 passes through the hole groove opened at the end of the bottom plate 11 and is screwed and fixed to the locking bolt 43. The top of the stud 44 is fixedly connected to a column 45, and a limiting piece 451 is fixedly installed on the outer circumference of the bottom of the column 45.

[0041] As Figure 1 、 Figure 6 and Figure 7 shown in the figure, Specific Embodiment 6: This embodiment is a further limitation of Specific Embodiment 5. The bottom plate 11 is in an "H" shape. Four groups of studs 44 are evenly installed on the bottom plate 11. Columns 45 are arranged at the tops of the four groups of studs 44. A frame 46 is installed on the four columns 45, and the frame 46 wraps around the outer circumference of the radiator 1.

[0042] As Figure 1 、 Figure 2 、 Figure 3 、 Figure 4 、 Figure 5 and Figure 7As shown, Specific Embodiment Seven: This embodiment is a further limitation of Specific Embodiment Five. The frame 46 includes a narrow strip 461, a wide strip 462, and a connecting rib 463. Perforations are provided at both ends of the narrow strip 461 and the wide strip 462. The narrow strip 461 and the wide strip 462 are both provided in two groups and are oppositely distributed and installed on the four columns 45. The frame 46 is supported on the columns 45 by a limiting piece 451.

[0043] As Figure 1 Figure 5 shown, Specific Embodiment Eight: This embodiment is a further limitation of Specific Embodiment Seven. The narrow strip 461 and the wide strip 462 are both arc-shaped. The narrow strip 461 and the wide strip 462 are fixedly connected by the connecting rib 463, and the connecting rib 463 is inclined.

[0044] Working principle: During actual use, the heat conduction base 124 at the bottom of the radiator 1 is attached to the central processing unit 51. At this time, when the computer is working, the heat generated by the central processing unit 51 is transferred to a large number of heat dissipation fins 12 through the heat conduction base 124. At the same time, the cooling fan 2 starts to work, and can perform air-cooling heat dissipation work on a large number of heat dissipation fins 12. A frame 46 is arranged on the outer side of the radiator 1. The frame 46 is composed of multiple narrow strips 461 and wide strips 462, which are wrapped around the outer side of the radiator 1, and can prevent the hand from touching the sharp heat dissipation fins 12 during operation, such as when repairing or cleaning the dust inside the chassis, causing hand scratches. At the same time, the frame 46 can protect the radiator 1, prevent the heat dissipation fins from being bent or damaged due to external force collision or misoperation, and extend the service life of the radiator. It enhances the overall rigidity of the radiator 1 and reduces deformation or loosening caused by vibration or movement. It can also reduce the noise generated by the radiator 1 due to the fan or vibration and improve the use experience. When it is necessary to replace the dried and unusable thermal grease, at this time, the locking bolt 43 screwed on the stud 44 is loosened. At this time, the compressed spring 42 rebounds, and the bottom plate 11 rises horizontally. Hold the force-bearing tail seat 1245 by hand, and pull out the operating piece 1244 at the end of the force-bearing tail seat 1245 from the inside of the heat transfer piece 1242 without detaching it. At this time, press down the operating piece 1244 to make the positioning groove 1240 and the positioning seat 1241 disengage, and the heat transfer piece 1242 can be detached from the bottom of the bottom plate 11. The thermal grease can be applied to the inside of the thermal grease filling groove 1243. The setting of the thermal grease filling groove 1243 can limit the application trajectory of the thermal grease, so that the thermal grease can be evenly applied to the bottom surface of the heat transfer piece 1242 and increase the usage amount of the thermal grease. When the operation of applying the thermal grease to the heat transfer piece 1242 is completed, hold the force-bearing tail seat 1245 by hand, and install the heat transfer piece 1242 at the bottom of the heat conduction base 124 through the top of the positioning groove 1240 and the positioning seat 1241. Finally, tighten the locking bolt 43 at the same time, and the bottom plate 11 moves horizontally downward, so that the brand-new thermal grease covers the surface of the central processing unit 51, and the work of applying the thermal grease is completed. When replacing the thermal grease of the central processing unit 51, there is no need to disassemble the radiator 1 on the central processing unit 51. Not having to disassemble the radiator means that the technical requirements for users are reduced, and ordinary users can easily get started, reducing problems caused by improper operation. Even people without much computer hardware maintenance experience can replace the thermal grease by themselves. During the process of disassembling the radiator 1, the pins of the central processing unit 51 may be bent or broken due to uneven force or operation errors, or the surface of the central processing unit 51 may be scratched, affecting the performance of the central processing unit 51 or even causing it to be scrapped. Not disassembling the radiator can avoid such situations and effectively protect the safety of the central processing unit 51.The traditional method of applying thermal grease to the disassembled radiator 1 involves multiple steps such as unscrewing the fixing screws and separating the radiator 1 from the central processing unit 51. However, applying thermal grease without disassembling the radiator 1 can skip these cumbersome operations and directly add thermal grease through the heat conduction base 124 at the bottom of the radiator 1, greatly simplifying the process; significantly shortening the time for thermal grease replacement, enabling users to complete maintenance work in a shorter time, reducing the computer downtime, and resuming normal use as soon as possible.

[0045] As Figure 8 and Figure 9 shown, Specific Embodiment Nine: This embodiment is a further limitation of Specific Embodiment Seven. The heat conduction base 124 includes a positioning groove 1240, a positioning seat 1241, a heat transfer fin 1242, a thermal grease filling groove 1243, an operation piece 1244, and a force-receiving tail seat 1245. A positioning groove 1240 is formed at the bottom of the heat conduction base 124, and the dimensions of the positioning groove 1240 are adapted to those of the positioning seat 1241. The positioning seat 1241 is inserted into the interior of the positioning groove 1240, and the depth of the positioning groove 1240 is equal to the thickness of the positioning seat 1241.

[0046] As Figure 1 , Figure 8 and Figure 9 shown, Specific Embodiment Ten: This embodiment is a further limitation of Specific Embodiment Nine. Both the positioning groove 1240 and the positioning seat 1241 are octagonal. A heat transfer fin 1242 is fixedly arranged at the bottom of the positioning seat 1241. The bottom area of the heat transfer fin 1242 is larger than the surface area of the central processing unit 51. A thermal grease filling groove 1243 is formed on the bottom surface of the heat transfer fin 1242, and the thermal grease filling groove 1243 is in a plum blossom shape.

[0047] The bottom plate 11 moves horizontally downward, so that brand-new thermal grease covers the surface of the central processing unit 51. The brand-new thermal grease is used as a heat transfer medium between the central processing unit 51 and the heat transfer sheet 1242. The heat generated by the central processing unit 51 can be transferred to the heat conduction base 124 through the heat transfer sheet 1242. The heat received by the heat conduction base 124 can be dissipated through a large number of heat dissipation fins 12. Upper extension pieces 1201, lower extension pieces 1202 and through holes 1203 are respectively arranged on the heat dissipation fins 12; the overall shape is "concave", and through holes 1203 and slot holes are formed thereon; the "concave"-shaped heat dissipation fins 12 can guide the air flow to make it flow more smoothly through the channels between the fins; compared with the planar structure, the "concave" shape can form an effect similar to a wind channel, allowing the air to blow more concentratedly on the fins, thereby improving the heat dissipation efficiency; the heat dissipation fins 12 can guide the air blown by the fan to flow better through the fins and take away the heat; the "concave" design can increase the contact area with the air under the same space and material usage compared with the simple flat fins; the extra surface area means that there are more areas for heat exchange, enabling the heat to be dissipated more quickly into the surrounding environment; the design of the through holes 1203 and the slot holes provides additional channels for the air, enabling the air to flow more freely between the fins and form convection; convection can accelerate the discharge of hot air and the intake of cold air, further enhancing the heat dissipation effect; at the same time, some tiny vortices may be generated when the air passes through the holes, and these vortices can disrupt the air boundary layer and make the heat transfer more sufficient.

[0048] The present invention covers any substitutions, modifications, equivalent methods and solutions made on the essence and scope of the present invention. For the public to have a thorough understanding of the present invention, specific details are described in detail in the following preferred embodiments of the present invention. However, those skilled in the art can also fully understand the present invention without the description of these details. In addition, in order to avoid unnecessary confusion to the essence of the present invention, well-known methods, processes, procedures, components and circuits are not described in detail.

[0049] The above are only the preferred embodiments of the present invention. It should be noted that for those of ordinary skill in the art, without departing from the principle of the present invention, several improvements and refinements can be made, and these improvements and refinements should also be regarded as the protection scope of the present invention.

Claims

1. A central processing unit cooling device, comprising a heat sink (1), characterized in that: A cooling fan (2) is installed on the top of the heat sink (1), a protective frame (4) is installed on the outer side of the circumference of the heat sink (1), a bottom plate (11) is fixedly connected to the bottom of the protective frame (4), the bottom plate (11) covers the main board (5), a central processing unit (51) is installed on the surface of the main board (5), a heat sink (12) is arranged on the outer side of the heat sink (1), an upper connecting seat (121) is fixedly arranged on the upper side of the inner wall of the heat sink (12), a middle connecting seat (122) is installed on the bottom of the upper connecting seat (121), a lower connecting seat (123) is installed on the bottom of the middle connecting seat (122), a heat conducting seat (124) is fixedly arranged on the bottom of the lower connecting seat (123), and the heat conducting seat (124) is arranged directly above the central processing unit (51).

2. The CPU cooling device according to claim 1, characterized in that: A support frame (3) is installed on the upper side of the heat dissipation fan (2). The support frame (3) is arranged in a cross-shaped manner. The end of the support frame (3) is screwed and fixed on the outer frame (20) of the heat dissipation fan (2). The bottom of the outer frame (20) is screwed and fixed on a screw column fixedly connected to the inner wall of the circumference of the upper connecting seat (121).

3. The CPU cooling device according to claim 1, characterized in that: The heat sink (1) comprises a base plate (11), heat dissipation fins (12), an upper connecting seat (121), a middle connecting seat (122) and a lower connecting seat (123); the upper connecting seat (121), the middle connecting seat (122) and the lower connecting seat (123) are all arranged in an annular shape; and a plurality of groups of heat dissipation fins (12) are evenly arranged on the circumferential outer walls of the upper connecting seat (121), the middle connecting seat (122) and the lower connecting seat (123).

4. The CPU cooling device according to claim 3, characterized in that: The heat dissipation fin (12) comprises an upper extension piece (1201), a lower extension piece (1202) and a through hole (1203); the lower extension piece (1202) is fixedly arranged at the bottom of the upper extension piece (1201); two groups of slots are provided on the upper extension piece (1201); and a circular through hole (1203) is provided on the lower extension piece (1202).

5. The CPU cooling device according to claim 1, characterized in that: The guard frame (4) comprises a mounting plate (41), a spring (42), a locking bolt (43), a stud (44), a column (45) and a frame (46); the mounting plate (41) is fixedly arranged on the surface of the main board (5); the surface of the mounting plate (41) is fixedly arranged with a stud (44); the stud (44) passes through a hole groove provided at the end of the bottom plate (11) and is screwed and fixed with the locking bolt (43); the top of the stud (44) is fixedly connected with the column (45); and a limiting plate (451) is fixedly arranged on the outer side of the bottom circumference of the column (45).

6. The CPU cooling device according to claim 5, characterized in that: The base plate (11) is arranged in an "H" shape, and four groups of studs (44) are evenly installed on the base plate (11). The tops of the four groups of studs (44) are all provided with upright posts (45). The four groups of upright posts (45) are provided with frames (46), and the frames (46) are wrapped around the outer circumference of the radiator (1).

7. The CPU cooling device according to claim 5, characterized in that: The frame (46) comprises a narrow strip (461), a wide strip (462) and a connecting rib (463), and both ends of the narrow strip (461) and the wide strip (462) are provided with through holes. The narrow strip (461) and the wide strip (462) are arranged in two groups and are relatively distributed and installed on four groups of columns (45). The frame (46) is supported on the columns (45) by means of a limiting piece (451).

8. The CPU cooling device according to claim 7, characterized in that: The narrow strip (461) and the wide strip (462) are both arranged in an arc shape, and the narrow strip (461) and the wide strip (462) are fixedly connected via a connecting rib (463), and the connecting rib (463) is arranged obliquely.

9. The CPU cooling device according to claim 7, characterized in that: The heat conducting seat (124) comprises a positioning groove (1240), a positioning seat (1241), a heat transfer sheet (1242), a silicone grease filling groove (1243), an operating sheet (1244) and a force-bearing tail seat (1245). The bottom of the heat conducting seat (124) is provided with a positioning groove (1240), and the size of the positioning groove (1240) is matched with that of the positioning seat (1241). The positioning seat (1241) is inserted into the interior of the positioning groove (1240), and the depth of the positioning groove (1240) is equal to the thickness of the positioning seat (1241).

10. The CPU cooling device according to claim 9, characterized in that: The positioning groove (1240) and the positioning seat (1241) are both arranged in the shape of a regular octagon. A heat transfer plate (1242) is fixedly arranged at the bottom of the positioning seat (1241). The bottom area of ​​the heat transfer plate (1242) is larger than the surface area of ​​the central processing unit (51). A silicone grease filling groove (1243) is provided on the bottom surface of the heat transfer plate (1242). The silicone grease filling groove (1243) is arranged in a plum blossom shape.

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