Bare chip cooling fin installation method and electronic equipment

Abstract

The invention relates to the technical field of chip heat dissipation, and discloses a bare chip cooling fin and an installation method thereof, and the cooling fin comprises a heat dissipation substrate, through hole supporting columns, a mixed fixing assembly and a heat dissipation fin array. The heat dissipation substrate is made of high-thermal-conductivity copper alloy, and the surface of the heat dissipation substrate is plated with a nano oxide layer to improve the heat radiation efficiency; the height of the through hole supporting column is matched with that of elements around the chip, and the bottom is provided with an anti-skid rubber pad to prevent installation inclination and buffer mechanical stress; the mixed fixing assembly comprises screw fixing holes distributed diagonally and plastic buckle fixing holes distributed diagonally, a plastic buckle can rotate by 0-90 degrees, a limiting spring is arranged in the plastic buckle to provide tactile feedback, and rapid installation and damage-free disassembly are achieved; the radiating fin array adopts a gradient height design, is matched with heat source distribution of the chip and optimizes an airflow channel. Through the dual-redundancy fixing structure and the gradient heat dissipation design, the heat dissipation efficiency and the installation reliability are remarkably improved, and the heat dissipation device is suitable for high-vibration and high-heat-dissipation-demand scenes such as data centers and automatic driving.

Description

Technical Field

[0001] The present invention relates to the technical field of chip heat dissipation, and specifically relates to a bare die chip heat sink, and also relates to a method for installing a bare die chip heat sink and an electronic device applying the bare die chip heat sink. Background Art

[0002] With the continuous improvement of the integration and performance of electronic devices, as the core component of electronic devices, the heat generation of chips has increased sharply accordingly. During the operation of chips, due to the energy losses such as resistance, capacitance, and inductance accompanied by the transmission of electronic signals, these losses will be converted into heat energy, resulting in an increase in chip temperature. For an electronic chip that works stably and continuously, the maximum temperature usually cannot exceed 85 °C, otherwise it will lead to a decline in chip performance or even damage.

[0003] In high-power-consuming electronic devices such as high-performance computing and artificial intelligence processing, the heat dissipation problem of bare die chips is particularly prominent because they are directly exposed to the air without encapsulation protection. Traditional heat dissipation methods such as air cooling and liquid cooling often have difficulty meeting their stringent cooling requirements when facing highly dense and small-sized bare die chips.

[0004] Specifically, although air cooling has a simple design, low cost, and convenient installation, its heat dissipation efficiency is limited by the low thermal conductivity of air, and it has limited effects in high-load and densely operated AI chips. Liquid cooling technology uses liquid as the heat transfer medium and utilizes its high heat capacity and high thermal conductivity to quickly remove the heat generated by the chips. The heat dissipation efficiency is significantly higher than that of air cooling, but the liquid cooling system is relatively complex, has a high cost, has relatively strict requirements for installation and maintenance, and there is a risk of leakage.

[0005] In addition, referring to Figure 5 , there are also many problems in the installation and disassembly processes of existing heat sink design schemes. For example, the heat sink is prone to tilt due to gravity or improper operation during installation, thus crushing the surrounding resistors and capacitors, and even causing serious consequences such as warping and deformation of the circuit board. In order to avoid these problems, conventional designs need to leave a large safety space, which undoubtedly wastes valuable heat dissipation space and further reduces the heat dissipation efficiency.

[0006] Therefore, developing a high-efficiency, reliable, easy-to-install and disassemble bare die chip heat dissipation device has become an urgent problem to be solved in the current semiconductor packaging and thermal management technology field. Summary of the Invention

[0007] The present invention provides a bare die chip heatsink, which is particularly suitable for the heat dissipation requirements of bare die chips in high-power electronic devices such as high-performance computing and artificial intelligence processors. The invention aims to solve the problems of insufficient heat dissipation efficiency, difficult installation and disassembly, and easy damage to the PCB in the prior art, and provides an efficient, reliable and easy-to-maintain heat dissipation solution.

[0008] To achieve the above object, the present invention provides the following technical solutions:

[0009] A bare die chip heatsink of the present invention includes:

[0010] A heat dissipation substrate for attaching to the surface of the bare die chip to conduct heat.

[0011] A plurality of through-hole support columns are arranged at the fixing holes of the heat dissipation substrate, and are used to provide vertical support during the installation and disassembly processes to prevent the heatsink from tilting.

[0012] A hybrid fixing component includes at least one set of diagonally distributed screw fixing holes and one set of diagonally distributed plastic buckle fixing holes. The plastic buckle fixing holes are embedded with rotatable plastic buckles, which are used to achieve the quick installation and directional disassembly of the heatsink. Screws are threadedly connected in the diagonally distributed screw fixing holes to fix the heatsink.

[0013] A heat dissipation fin array is evenly distributed on the upper surface of the heat dissipation substrate, and is used to increase the heat dissipation area and optimize the air flow channel.

[0014] In addition to the above technical features, the present invention has also made optimization improvements in the following aspects:

[0015] As a preferred technical solution of the present invention, the height of the through-hole support column matches the installation height of the resistors and capacitors around the bare die chip, so that the heat dissipation substrate is parallel to the chip surface, and an anti-slip rubber pad is provided at the bottom of the support column to buffer mechanical stress.

[0016] As a preferred technical solution of the present invention, the rotation angle of the plastic buckle is 0° to 90°. When rotated to 20° to 90°, the plastic buckle disengages from the mating slot on the circuit board for non-destructive disassembly of the heatsink.

[0017] As a preferred technical solution of the present invention, the heat dissipation fin array adopts a gradient height distribution, and the fin height in the central area close to the bare die chip is greater than that in the edge area to match the heat source distribution of the bare die chip.

[0018] As a preferred technical solution of the present invention, the material of the heat dissipation substrate is a copper alloy with high thermal conductivity, and the surface is plated with a nano-oxide layer to improve the heat radiation efficiency.

[0019] As a preferred technical solution of the present invention, the screw fixing holes and plastic buckle fixing holes of the hybrid fixing component are symmetrically distributed at the four corners of the heat dissipation substrate, forming a dual redundant fixing structure to ensure the stability of the heat sink in a vibrating environment.

[0020] As a preferred technical solution of the present invention, the plastic buckle is internally provided with a limiting spring, which automatically pops up when rotated to the disassembly position to provide tactile feedback.

[0021] As a preferred technical solution of the present invention, the present invention further provides an installation method for a bare die chip heat sink, including an installation step and a disassembly step;

[0022] The installation step includes:

[0023] Align the heat dissipation substrate with the surface of the bare die chip, and fix the screw fixing holes distributed diagonally through screws;

[0024] Press the plastic buckle into the circuit board fitting slot to complete the quick fixing of the plastic buckle fixing holes distributed diagonally in the other group;

[0025] The disassembly step includes:

[0026] Rotate the plastic buckle by 90°, and vertically remove the heat sink after disengaging from the slot to avoid warping of the circuit board.

[0027] As a preferred technical solution of the present invention, during the disassembly step, a uniform pulling force needs to be applied along the axial direction of the heat dissipation substrate, and the elastic force of the limiting spring is used to assist in separation.

[0028] As a preferred technical solution of the present invention, the present invention further provides an electronic device, including the above-mentioned bare die chip heat sink, and the electronic device is a computing chip, an artificial intelligence processor or a storage device.

[0029] Combined with the description of the above technical content, the technical effects of a bare die chip heat sink of the present invention are mainly reflected in the following aspects:

[0030] 1. Precise heat dissipation performance optimization

[0031] Gradient heat dissipation fin design: By matching the high and low fins with the gradient of the chip heat source distribution, the high fins in the central area strengthen the core heat dissipation, and the low fins at the edge reduce the air flow resistance, significantly improving the heat dissipation efficiency and reducing the chip hot spot temperature by 15% - 20%.

[0032] High thermal conductivity substrate material: The copper alloy substrate combined with the nano-oxide coating realizes the optimization of bidirectional heat conduction, with the thermal conductivity increased by 25% and the surface radiation efficiency increased by 30% at the same time, which is suitable for the continuous heat dissipation requirements of high-power AI chips (>300W).

[0033] 2. Installation reliability and seismic stability

[0034] Hybrid Redundancy Fixed Structure: Diagonally distributed screws and plastic fasteners are used for double fixation to form mechanical-elastic double locking. The displacement during vibration testing is <0.1 mm, which is applicable to strong vibration scenarios such as vehicle-mounted / industrial equipment.

[0035] Anti-tilting Design of Thru-hole Support Posts: The height of the support posts matches the peripheral components, combined with an anti-slip rubber pad (buffering stress > 50 N / mm 2 ), ensuring that the deviation of the fitting degree between the substrate and the chip surface is <5 μm, and avoiding local overheating caused by tilting.

[0036] 3. Fast and Non-destructive Disassembly and Assembly Technology

[0037] Rotating Snap Fastener Directional Unlocking: The plastic snap fastener rotates 20° - 90° to disengage, combined with the tactile feedback of the limiting spring, reducing the disassembly time to within 3 seconds and avoiding the risk of PCB board warping (warping rate < 0.05%) caused by traditional screwdriver operation.

[0038] Axial Uniform Tensile Force Assistance: When disassembling, the spring force assists in separation, reducing the external force required for disassembly to less than 5 N and reducing the probability of chip solder joint damage.

[0039] 4. Compatibility and Expandability

[0040] Height Adaptability Design: The height of the support posts can be customized to match different package resistors and capacitors (0.5 - 3 mm), applicable to various package scenarios from 7 nm to 3D stacked chips.

[0041] Lightweight Structure: The combination of a copper alloy substrate and plastic snap fasteners reduces the overall weight by 40% (compared with a fully metal radiator), suitable for ultra-thin electronic devices (such as edge computing modules).

[0042] 5. Application Scenario Expansion

[0043] Support for High-performance Computing Devices: The bare die chip heatsink of the present invention can be integrated into AI training chips (such as GPU / TPU) or high-frequency storage devices (HBM), maintaining the junction temperature ≤ 85°C under full load and extending the chip life by 2 - 3 times.

[0044] In summary, the bare die chip heat dissipation device proposed by the present invention shows significant superiority in technical effects. It not only significantly improves the heat dissipation efficiency, but also enhances the system stability, simplifies the assembly and maintenance processes, improves the system compatibility, and enhances the anti-interference ability and electromagnetic shielding effect. This heatsink achieves three core breakthroughs in efficient heat dissipation, seismic stability, and non-destructive maintenance, and is particularly suitable for fields such as 5G communication, autonomous driving, and data centers where strict requirements are imposed on heat dissipation and reliability. Description of the Drawings

[0045] Figure 1It is a schematic structural diagram of the bare die chip heatsink of the present invention;

[0046] Figure 2 It is a schematic structural diagram showing the state of the heat dissipation substrate of the present invention;

[0047] Figure 3 It is a schematic diagram of the split structure of the bare die chip heatsink of the present invention;

[0048] Figure 4 It is a schematic structural diagram of the disassembled state of the bare die chip heatsink of the present invention;

[0049] Figure 5 It is a schematic structural diagram of an existing bare die chip heatsink. Among them, 5a shows the structural diagram of the removed heatsink, 5b shows the split structure and the state diagram during splitting, and 5c shows the structural diagram after setting the steps;

[0050] Figure 6 It is a flow chart of the installation steps of the bare die chip heatsink of the present invention;

[0051] Figure 7 It is a flow chart of the disassembly steps of the bare die chip heatsink of the present invention.

[0052] In the figure:

[0053] 1. Heat dissipation substrate; 2. Through-hole support column; 21. Anti-slip rubber pad; 3. Hybrid fixing component; 31. Screw fixing hole; 32. Plastic buckle fixing hole; 33. Plastic buckle; 331. Limit spring; 34. Screw; 4. Heat dissipation fin array; 5. Chip. Detailed implementation manners

[0054] The following describes the preferred embodiments of the present invention with reference to the accompanying drawings. It should be understood that the preferred embodiments described herein are only used to illustrate and explain the present invention, and are not used to limit the present invention.

[0055] I. Explanation of descriptive terms in the present invention

[0056] The embodiments given in combination with the technical solutions of the present invention are to make the present invention more thorough and complete, and to fully express the scope of the present invention to those skilled in the art. It should be noted that: unless otherwise specifically stated in the present invention, the relative arrangements of the components described in these embodiments should be construed as merely exemplary, rather than as a limitation to the technical solutions of the present invention.

[0057] In the present invention, if directional terms such as "upper", "lower", "left", "right", "bottom", "top", etc. are involved, they are defined relative to the directions in the respective drawings and are only used to represent relative positional relationships. When the absolute position of the object being described changes, the relative positional relationship may also change accordingly. These or other directional terms should not be construed as restrictive terms.

[0058] In the present invention, similar terms such as "a", "an", "one kind", "the", etc. do not represent a limitation in quantity and may represent singular or plural. The terms "comprising", "including", "having" and any variations thereof involved in the present invention are intended to cover non-exclusive inclusion; if the present invention involves terms such as "first", "second", "third", etc., they are only used to distinguish similar objects and do not represent a specific order for the objects.

[0059] In the present invention, when it is described that a specific device is located between a first device and a second device, there may or may not be an intermediate device between the specific device and the first device or the second device. When it is described that a specific device is connected to other devices, the specific device may be directly connected to the other devices without an intermediate device, or may not be directly connected to the other devices but have an intermediate device.

[0060] In addition, the present invention does not discuss in detail the technologies and devices known to those of ordinary skill in the relevant art, but under appropriate circumstances, the said technologies and devices should be regarded as part of the specification.

[0061] II. Core technical problems to be solved by the technical solution of the present application

[0062] There are many problems in the heat dissipation of bare die chips in the prior art. With the improvement of the integration and performance of electronic devices, the heat generation of chips has increased sharply, and traditional heat dissipation methods such as air cooling and liquid cooling are difficult to meet the stringent cooling requirements of high-power electronic devices. Air cooling is limited by the low thermal conductivity of air, and the heat dissipation efficiency is limited; although liquid cooling technology has high heat dissipation efficiency, the system is complex, the cost is high, and there is a risk of leakage. In addition, the existing heat sink design solutions are also prone to problems during installation and disassembly. For example, the heat sink is prone to tilt during installation, damaging surrounding components, and even causing warping and deformation of the circuit board. To avoid these problems, conventional designs need to leave a large safety space, but this wastes valuable heat dissipation space and reduces the heat dissipation efficiency.

[0063] Therefore, there is an urgent need to develop a highly efficient, reliable, easy-to-install and disassemble bare die chip heat dissipation device to solve the heat dissipation problems faced in the current semiconductor packaging and thermal management technology fields.

[0064] III. Based on the above problems, the present invention specifically provides a technical solution to solve the above problems. The technical solution, working principle and technical effects of the present invention will be described in detail below with reference to specific embodiments.

[0065] Please refer to Figures 1-3 As shown, this embodiment provides an efficient heat sink solution for a 7nm process CPU bare die chip (TDP 280W), which is particularly suitable for the next-generation servers of cloud computing service providers. It can achieve efficient heat dissipation in a limited space, support rapid replacement during data center operation and maintenance, and effectively avoid the PCB deformation problem caused by frequent disassembly. The following are the specific embodiments of the present invention:

[0066] (I) Heat sink structure design

[0067] (1) Heat dissipation substrate 1

[0068] Material: C-15760 copper alloy is used, and its thermal conductivity is as high as ≥380W / m·K, ensuring excellent heat conduction performance.

[0069] Surface coating: A 80nm thick Al 2 O 3 nanometer oxide layer is plated on the surface of the heat dissipation substrate, and the thermal emissivity reaches 0.89, further enhancing the heat radiation ability of the heat dissipation substrate.

[0070] Size and chamfer: The size of the heat dissipation substrate is 40mm×40mm×2mm, and the edges are chamfered by 0.5mm to reduce air flow turbulence and improve heat dissipation efficiency.

[0071] (2) Through-hole support pillar 2

[0072] Height matching: The height of the support pillar is designed to be 1.5mm, and the height of the through-hole support pillar matches the installation height of the resistors and capacitors around the bare die chip, accurately matching the installation heights of tantalum capacitors (1.45mm±0.05mm) and inductors (1.55mm) on the PCB, ensuring parallel fitting of the heat dissipation substrate and the chip surface.

[0073] Anti-slip rubber pad 21: Fluorosilicone rubber material is used, with a hardness of 50 Shore A and a compressive strength of 35MPa. Micro-convex point arrays with a diameter of 0.2mm and a pitch of 0.5mm are designed at the bottom of the rubber pad, effectively enhancing the anti-slip property and reducing potential damage to the PCB during installation and disassembly.

[0074] (3) Hybrid fixing component 3 includes: screw fixing hole 31, plastic buckle fixing hole 32, plastic buckle 33, limit spring 331, screw 34.

[0075] Diagonally distributed screw fixing holes 31: M3 stainless steel screws are used, pre-coated with thermal conductive silicone grease (thermal conductivity 5.2 W / m·K), and the locking torque is 0.8 N·m. This design not only achieves a stable mechanical connection but also improves the thermal conduction efficiency.

[0076] Plastic buckle 33: PEEK material is selected, with a temperature resistance up to 260 °C and a dielectric strength of 25 kV / mm. As Figure 4 shown, the rotating shaft of the plastic buckle 33 is internally equipped with a ceramic bearing, with a rotation angle of 0° - 90°, and the unlocking critical angle is 25°. At this time, the tactile feedback force. This design makes the heat sink more convenient to install and disassemble, and can avoid damage to the PCB.

[0077] Limit spring 331: Titanium alloy spring is used, with a wire diameter of 0.3 mm. During disassembly, the peak spring force reaches 4.5 N, providing sufficient elastic force to assist in separating the heat sink from the chip.

[0078] Heat sink fin array 4

[0079] Gradient design: The heat sink fins adopt a gradient design. The fin height in the central area is 18 mm (pitch 1.2 mm), and the fin height in the edge area is 12 mm (pitch 1.8 mm). This design can better match the heat source distribution of the chip and improve the heat dissipation efficiency.

[0080] Airflow optimization: The heat sink fin array is evenly distributed on the upper surface of the heat sink substrate to increase the heat dissipation area and optimize the airflow channel.

[0081] The fin surface has been treated with laser etching to form longitudinal flow channels with a depth of 0.3 mm and an inclination angle of 10°. This design optimizes the airflow channel, enabling the heat sink to better match the server air duct and further improving the heat dissipation performance.

[0082] (III) Heat sink installation and disassembly method (refer to Figure 6 、 Figure 4 、 Figure 7 )

[0083] 1. Installation process:

[0084] (1) Pre-alignment: Place the heat sink substrate 1 on the surface of the CPU bare die chip 5, ensuring that the support posts 2 avoid capacitor / inductor components, with the deviation controlled within <0.1 mm.

[0085] (2) Screw fixation: Lock the M3 screws 31 distributed diagonally. The torque is applied in two steps. First, perform preliminary fixation with a pre-tightening torque of 0.4 N·m, and then perform final fixation with a final tightening torque of 0.8 N·m.

[0086] (3) Snap Lock: Press the plastic snap 33 into the PCB slot of the bare die chip 5, and control the operating force at about 6N. When the snap is rotated to 0°, a "click" sound will be emitted. At this time, the compression amount of the limit spring 331 is 1.2mm, indicating that the snap is fully locked.

[0087] 2. Disassembly Process (refer to Figure 4 、 Figure 7 ):

[0088] (1) Unlock the snap: Use a special tool or manually rotate the plastic snap 33 to 25°. At this time, the spring 331 releases and pushes the plastic snap out by 2mm, providing obvious tactile feedback.

[0089] (2) Axial separation: Apply force evenly along the normal direction of the substrate (tensile force ≤ 5N), and the micro - protrusions of the anti - slip rubber pad 21 gradually disengage from the PCB slot of the bare die chip 5. The entire separation process should be completed within < 5 seconds to avoid unnecessary damage to the PCB.

[0090] Through the above - mentioned specific implementation manners, the present invention provides an efficient, convenient and reliable heat sink solution, which is particularly suitable for the heat dissipation requirements of 7nm - process CPU bare die chips in the next - generation servers of cloud computing service providers.

[0091] This application not only improves the heat dissipation efficiency, but also supports quick replacement, effectively avoiding the problem of PCB deformation caused by frequent disassembly, and providing strong support for the operation and maintenance of the data centers of cloud computing service providers.

[0092] In addition to the above application scenarios, the bare die chip heat sink of this embodiment is particularly suitable for high - power electronic devices such as high - performance computing and artificial intelligence processing. By adopting the above heat sink solution, the bare die chips in these devices can be more effectively heat - managed, thereby improving the working stability and service life of the chips.

[0093] Experiments show that under the same conditions, through comparative tests, it is found that after adopting this heat dissipation device, the maximum temperature rise value of the target sample is significantly reduced by about 30%, greatly improving the working efficiency and reliability of the device.

[0094] (3) The bare die chip heat sink solution provided in this embodiment realizes efficient heat dissipation for 7nm - process CPU bare die chips (TDP 280W) through efficient heat conduction, optimized air - flow design and quick disassembly and assembly mechanisms. To more clearly illustrate this application, the working principle of this application is described as follows:

[0095] 1. Optimization of Heat Conduction and Heat Radiation

[0096] Heat dissipation substrate heat conduction: The heat dissipation substrate is made of C-15760 copper alloy (thermal conductivity ≥ 380 W / m·K), which can quickly conduct the heat generated by the CPU bare die chip from the chip surface to the heat dissipation substrate. The 80-nm-thick Al 2 O 3 nanometer oxide layer on the substrate surface further enhances the heat radiation efficiency (heat radiation rate 0.89), and dissipates the heat to the surrounding environment in the form of infrared radiation.

[0097] Gradient fin heat diffusion: The heat dissipation fins adopt a gradient height design (18 mm in the center and 12 mm at the edge), which matches the 5 heat source distributions of the bare die chip. The high fins in the center concentrate heat dissipation, and the low fins at the edge reduce the air flow resistance, forming an efficient heat diffusion channel. The laser-etched flow guiding grooves (depth 0.3 mm, inclination angle 10°) on the fin surface optimize the air flow path and enhance the forced convection heat dissipation effect.

[0098] 2. Mechanical support and stress buffering

[0099] Precise matching of the through-hole support posts: The height of the support posts is 1.5 mm, which precisely matches the installation heights of the tantalum capacitors (1.45 mm ± 0.05 mm) and inductors (1.55 mm) on the PCB, ensuring that the heat dissipation substrate is parallel and attached to the chip surface, and avoiding the increase in local thermal resistance caused by tilting. The fluorosilicone rubber pads (hardness 50 Shore A) at the bottom of the support posts provide anti-slip and buffering functions through the micro-bump array (diameter 0.2 mm, pitch 0.5 mm), reducing the damage to the PCB caused by mechanical stress during installation and disassembly.

[0100] 3. Quick disassembly and assembly of the hybrid fixing components

[0101] (1) Screw fixation and enhanced heat conduction:

[0102] The screw fixing holes distributed diagonally use M3 stainless steel screws, pre-coated with thermal conductive silicone grease (thermal conductivity 5.2 W / m·K), to achieve a stable mechanical connection under a locking torque of 0.8 N·m. At the same time, the microscopic gaps are filled with silicone grease to improve the heat conduction efficiency.

[0103] (2) Quick locking and unlocking of the plastic snap:

[0104] The plastic snap is made of PEEK material (temperature resistance 260 °C), with a built-in ceramic bearing and a rotation angle of 0° - 90°. When rotated to 25°, the snap unlocks, and the limit spring (made of titanium alloy, elastic modulus 110 GPa) releases elastic force (peak value 4.5 N), pushing the snap out 2 mm, providing obvious tactile feedback. This design makes the installation and disassembly of the heat sink more convenient and avoids damage to the PCB.

[0105] 4. Airflow optimization and heat dissipation efficiency improvement

[0106] (1) Synergistic effect of gradient fins and flow guiding grooves:

[0107] The central high fins (18 mm) focus on heat dissipation, and the edge low fins (12 mm) reduce air flow resistance, forming an efficient heat diffusion channel. The laser-etched flow guiding grooves on the fin surface (depth 0.3 mm, inclination angle 10°) optimize the air flow path and enhance the forced convection heat dissipation effect.

[0108] (2) Matching with the server air duct:

[0109] The air flow channel design of the heat sink matches the height of the server air duct, ensuring that cold air can flow efficiently through the fin surface to carry away heat. Experiments show that this design can reduce the air flow resistance by 40%, significantly improving the heat dissipation efficiency.

[0110] 5. Quick disassembly and PCB protection

[0111] (1) Installation process:

[0112] Pre-alignment: The deviation between the heat dissipation substrate and the chip surface is controlled within <0.1 mm.

[0113] Screw fixation: The locking M3 screws distributed diagonally are tightened in two steps (pre-tightening torque of 0.4 N·m, final tightening torque of 0.8 N·m).

[0114] Snap lock: Press the plastic snap into the PCB slot and rotate it to 0° to lock. The compression amount of the limiting spring is 1.2 mm, providing a "click" sound feedback.

[0115] (2) Disassembly process:

[0116] Unlock the snap: Rotate the snap to 25°, and the spring releases to push the snap out by 2 mm.

[0117] Axial separation: Apply force evenly along the normal direction of the substrate (tensile force ≤5 N), and the micro-protrusions of the rubber pad gradually separate from the PCB to avoid PCB warping.

[0118] 6. Experimental verification and performance improvement

[0119] Temperature rise test: On a 7 nm CPU bare die chip with a TDP of 280 W, after using this heat sink, the maximum temperature rise value is reduced by about 30% (from 110 °C to 78 °C), significantly improving the working stability of the chip.

[0120] Vibration test: Through the SAE J1455 vehicle vibration standard test, after 10 hours of swept-frequency vibration, the displacement of the heat sink is <0.1 mm, and there is no screw loosening or snap detachment.

[0121] Disassembly test: After 50 repeated disassemblies, the warpage of the PCB is < 0.03 mm, and there is no wear on the surface of the buckle, which proves its reliability for long-term use.

[0122] In summary, this heat sink solution realizes efficient heat dissipation for high-power bare die chips through efficient heat conduction, optimized airflow design, and a quick disassembly and assembly mechanism. At the same time, it supports quick replacement during the operation and maintenance of data centers, effectively avoiding the problem of PCB deformation caused by frequent disassembly.

[0123] The technical solution adopted in this application provides a reliable heat dissipation solution for high-power electronic devices such as high-performance computing and artificial intelligence processing from multiple aspects including heat conduction, mechanical support, airflow optimization, and quick disassembly and assembly.

[0124] This application also provides an electronic device, which includes a computing chip, an artificial intelligence processor, or a storage device, and the bare die heat sink is connected to the electronic device circuit board through a hybrid fixing component.

[0125] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

[0126] In addition, the technical solutions between various embodiments can be combined with each other, but it must be based on the ability of those of ordinary skill in the art to implement; when the combination of technical solutions results in contradictions or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the protection scope required by the present invention.

Claims

1. A bare chip heat sink, characterized in that: include: A heat dissipation substrate (1) is used to adhere to the surface of the bare crystal chip to conduct heat; A plurality of through-hole support columns (2) are arranged at the fixing hole positions of the heat dissipation substrate and are used to provide vertical support during installation and removal to prevent the heat sink from tilting; A hybrid fixing assembly (3) comprises at least one group of diagonally distributed screw fixing holes (31) and one group of diagonally distributed plastic buckle fixing holes (32), wherein the plastic buckle fixing holes (32) are embedded with rotatable plastic buckles (33) for realizing rapid installation and directional removal of the heat sink; and screws (34) are threadedly connected to the diagonally distributed screw fixing holes for fixing the heat sink; The heat dissipation fin array (4) is evenly distributed on the upper surface of the heat dissipation substrate and is used to increase the heat dissipation area and optimize the air flow channel.

2. The bare die chip heat sink according to claim 1, characterized in that: The height of the through hole support column (2) matches the installation height of the resistor and capacitor around the bare crystal chip (5), so that the heat dissipation substrate is parallel to the chip surface, and an anti-slip rubber pad (21) is provided at the bottom of the support column to buffer mechanical stress.

3. The bare die chip heat sink according to claim 1, characterized in that: The rotation angle of the plastic buckle (33) is 0° to 90°. When the plastic buckle (33) is rotated to 20° to 90°, the plastic buckle (33) is separated from the matching slot on the circuit board, so that the heat sink can be disassembled without damage.

4. The bare die chip heat sink according to claim 1, characterized in that: The heat dissipation fin array (4) adopts a gradient height distribution, and the height of the fins in the central area close to the bare crystal chip (5) is greater than that in the edge area, so as to match the heat source distribution of the bare crystal chip (5).

5. The bare die chip heat sink according to claim 1, characterized in that: The heat dissipation substrate (1) is made of a copper alloy with high thermal conductivity, and its surface is plated with a nano-oxide layer to improve the heat radiation efficiency.

6. The bare die chip heat sink according to claim 1, characterized in that: The screw fixing holes (31) and the plastic buckle fixing holes (32) of the hybrid fixing assembly (3) are symmetrically distributed at the four corners of the heat dissipation substrate (1), forming a dual redundant fixing structure to ensure the stability of the heat sink in a vibration environment.

7. The bare die chip heat sink according to claim 3, characterized in that: The plastic buckle (33) has a built-in limit spring (331) which automatically pops out when rotated to the disassembly position, providing tactile feedback.

8. A method for installing a bare chip heat sink, characterized in that: Including installation steps and disassembly steps; The installation steps include: Align the heat dissipation substrate (1) with the surface of the bare crystal chip (5), and fix the diagonally distributed screw fixing holes (31) with screws (34); Press the plastic buckle (33) to the matching slot of the circuit board to complete the quick fixation of another set of diagonally distributed plastic buckle fixing holes (32); The disassembly step comprises: Rotate the plastic clip (33) to 90°, remove the heat sink vertically after it is out of the slot to avoid warping of the circuit board.

9. The installation method according to claim 8, characterized in that: In the disassembly step, a uniform pulling force needs to be applied along the axial direction of the heat dissipation substrate (1), and the separation is assisted by the elastic force of the limit spring (331).

10. An electronic device, characterized in that: A bare crystal chip heat sink comprising any one of claims 1 to 7, wherein the electronic device is a computing chip, an artificial intelligence processor or a storage device.

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