An automated soldering device for a circuit board chip

Abstract

The present invention discloses an automatic soldering device for circuit board chips, which relates to the field of chip soldering. It includes a soldering workbench and a welding rod feeding mechanism. A rectangular tooling groove is formed on the top surface of the soldering workbench. The welding rod feeding mechanism includes a chip storage seat, a heating seat, and a welding rod storage seat arranged in sequence along the length direction of the soldering workbench. Two electric heating sheets are arranged on the top of the heating seat. A through hole is formed on the top of the welding rod storage seat. Two welding rod storage grooves are formed on both sides of the rectangular groove on the top surface of the welding rod storage seat. The width of the welding rod storage groove can only accommodate one welding rod. A chip storage groove is formed on the top surface of the chip storage seat. A gantry conveying mechanism and a negative pressure feeding pipe arranged on the gantry conveying mechanism are arranged above the soldering workbench. A thermal soldering mechanism is arranged on one side of the rectangular tooling groove on the soldering workbench. The thermal soldering mechanism is used to contact the pins of the chip to melt the welding rod, abandoning the traditional welding method of a welding torch, and can complete the soldering of the chip in a narrow space.

Description

Technical Field

[0001] The present invention relates to the technical field of chip soldering, and specifically to an automatic soldering device for circuit board chips. Background Art

[0002] A circuit board is an important electronic component, a support for electronic components, and a carrier for the electrical connection of electronic components. Printed circuit boards have developed from single-layer to double-sided, multi-layer, and flexible, and still maintain their respective development trends. Due to the continuous development towards high precision, high density, and high reliability, continuously reducing volume, cost, and improving performance, printed circuit boards still maintain strong vitality in the development of future electronic devices. In the production of integrated circuits, chips need to be soldered onto the circuit board. Currently, the soldering method for chips is still to use a soldering gun to solder the pins of the chip to the solder holes on the circuit board. Since the volume of the chip is small, secondly, during the soldering process, it is necessary to ensure that the pins of the chip always correspond to the solder holes, and it is necessary to ensure that the position of the chip does not shift during the soldering process, resulting in a small movement space for the soldering gun, making it easy for the soldering gun to collide with the positioning mechanism of the chip during movement. Therefore, it is difficult to fully automate the soldering of chips, and manual soldering of chips is still required, and its production efficiency cannot be effectively improved. Summary of the Invention

[0003] The purpose of the present invention is to overcome the deficiencies of the prior art and provide an automatic soldering device for circuit board chips to solve the deficiencies of the prior art.

[0004] The object of the present invention is achieved by the following technical solutions: An automatic welding device for a circuit board chip, comprising a welding workbench. A rectangular tooling groove is formed on the top surface of the welding workbench. One end of the welding workbench is provided with a welding rod feeding mechanism. The welding rod feeding mechanism includes a chip storage seat, a heating seat, and a welding rod storage seat arranged in sequence along the length direction of the welding workbench. A rectangular groove is formed on the top of the heating seat. Electric heating sheets are arranged on both sides of the rectangular groove on the top surface of the heating seat. A through hole is formed on the top of the welding rod storage seat. Two welding rod storage grooves are formed on both sides of the rectangular groove on the top surface of the welding rod storage seat. The width of the welding rod storage groove can only accommodate one welding rod. A chip storage groove is formed on the top surface of the chip storage seat. A gantry conveying mechanism and a negative pressure feeding pipe arranged on the gantry conveying mechanism are provided above the welding workbench. The gantry conveying mechanism has three degrees of freedom of movement in three perpendicular directions in the space coordinate system. A thermal welding mechanism is arranged on one side of the rectangular tooling groove on the welding workbench. The thermal welding mechanism includes a moving column, a moving plate, and a thermal welding rod. The moving column is slidably arranged on the welding workbench and has a degree of freedom of movement along the length direction of the welding workbench. The moving plate is slidably installed on the moving column and has a degree of freedom of movement along the width direction of the welding workbench. Two thermal welding rods are connected to one end of the moving plate close to the rectangular tooling groove.

[0005] Further, a jacking column is slidably arranged in the through hole. The jacking column has a degree of freedom of movement along the height direction of the welding rod storage seat. A plurality of jacking bars are fixed on both sides of the jacking column. The plurality of jacking bars are arranged at intervals along the length direction of the welding rod storage groove. Vertical grooves are formed in the welding rod storage seat at positions corresponding to the jacking bars. The vertical grooves penetrate through in the width direction of the welding rod storage groove. The jacking bars extend into the vertical grooves to support the welding rods.

[0006] Further, the bottom of the welding rod storage seat is connected to a driving seat. A driving cavity is arranged in the driving seat. A lead screw is rotatably arranged in the driving cavity. A support block is threadedly sleeved on the lead screw. The top surface of the support block is provided with a first wedge surface. The bottom of the jacking column slidably penetrates into the driving cavity and is fixed with a lifting block. The bottom of the lifting block is provided with a second wedge surface. The second wedge surface is in contact and cooperation with the first wedge surface. A reduction motor is installed on the side wall of the driving seat. The output shaft of the reduction motor is drivingly connected to the lead screw.

[0007] Furthermore, a welding rod lowering mechanism is provided above the welding rod storage base. The welding rod lowering mechanism includes a welding rod lowering base and a base. A first cylinder is vertically installed at the top of the base. The telescopic shaft of the first cylinder is connected to a top plate. A second cylinder is horizontally installed on the top plate. The telescopic shaft of the second cylinder is connected to the welding rod lowering base. Four welding rod placement grooves are formed through the welding rod lowering base. The width of the welding rod placement grooves can only accommodate one welding rod. The four welding rod placement grooves correspond to the four welding rod storage grooves one by one. Quantitative lowering mechanisms are provided on both sides of the welding rod lowering base. The quantitative lowering mechanisms include a first support piece and a second support piece. Both the first support piece and the second support piece are slidably connected to the welding rod lowering base. Both the first support piece and the second support piece can extend into the welding rod placement grooves to support the welding rods. The first support piece and the second support piece are spaced apart along the height direction of the welding rod lowering base.

[0008] Furthermore, a first rack is connected to one end of the first support piece away from the welding rod lowering base. A second rack is connected to one end of the second support piece away from the welding rod lowering base. The second rack is disposed opposite to the first rack. An intermittent gear is provided between the first rack and the second rack. The mounting shaft of the intermittent gear is drivingly connected to the output shaft of a steering gear. The housing of the steering gear is installed on the welding rod lowering base. The intermittent gear alternately meshes with the first rack and the second rack.

[0009] Furthermore, a lead screw groove is formed in the welding workbench at the position where the moving column is provided. The lead screw groove extends along the length direction of the welding workbench. An adjusting lead screw is rotatably disposed in the lead screw groove. A lead screw slider is threadedly sleeved on the adjusting lead screw. The moving column is fixed to the lead screw slider. A lead screw motor is installed on the side wall of the welding workbench. The output shaft of the lead screw motor is drivingly connected to the adjusting lead screw. An adjusting top plate is provided at the top of the moving column. The adjusting top plate has a degree of freedom to move along the height direction of the moving column. A third cylinder is horizontally installed on the adjusting top plate. The telescopic shaft of the third cylinder is connected to the moving plate.

[0010] Furthermore, an adjusting cavity is provided in the moving column. An electromagnet is disposed in the adjusting cavity. An adjusting shaft is fixed to the bottom of the adjusting top plate. The adjusting shaft slidably penetrates into the adjusting cavity and is connected to a permanent magnet. The electromagnet is energized to generate a magnetic pole with the same magnetism as the permanent magnet. A spring is disposed in the adjusting cavity. Two ends of the spring are respectively connected to the permanent magnet and the moving column. When the adjusting top plate contacts the top surface of the moving column, the spring is in a stretched state.

[0011] Further, the gantry conveying mechanism includes a transverse lifting beam, a longitudinal sliding beam, and a sliding substrate. Two of the transverse lifting beams are arranged at intervals along the length direction of the welding workbench. At both ends of the bottom of the transverse lifting beam, a fourth cylinder is provided, and the telescopic shaft of the fourth cylinder is connected to the transverse lifting beam. The two ends of the longitudinal sliding beam are respectively slidably installed on the two transverse lifting beams, the sliding substrate is slidably installed on the longitudinal sliding beam, the moving direction of the sliding substrate is perpendicular to the moving direction of the longitudinal sliding beam, and the negative pressure feeding pipe is installed on the sliding substrate.

[0012] Further, a first lead screw groove is formed on the top surface of the transverse lifting beam. A first lead screw is rotatably arranged in the first lead screw groove. A first lead screw slider is threadedly sleeved on the first lead screw. The two ends of the longitudinal sliding beam are respectively connected to the two first lead screw sliders. A first motor is installed at one end of the transverse lifting beam, and the output shaft of the first motor is drivingly connected to the first lead screw. A second lead screw groove is formed at the bottom of the longitudinal sliding beam. A second lead screw is rotatably arranged in the second lead screw groove. A second lead screw slider is threadedly sleeved on the second lead screw. The second lead screw slider is slidably fitted in the second lead screw groove. The sliding substrate is fixedly installed on the second lead screw slider. A second motor is installed at one end of the longitudinal sliding beam, and the output shaft of the second motor is drivingly connected to the second lead screw.

[0013] Further, a transverse positioning plate and a longitudinal positioning plate are slidably arranged in the rectangular tooling groove. The moving direction of the transverse positioning plate is perpendicular to the moving direction of the longitudinal positioning plate. A fifth cylinder and a sixth cylinder are installed on the outer side wall of the welding workbench. The telescopic shaft of the fifth cylinder penetrates into the rectangular tooling groove and is connected to the transverse positioning plate, and the telescopic shaft of the sixth cylinder penetrates into the rectangular tooling groove and is connected to the longitudinal positioning plate.

[0014] The beneficial effects of the present invention are:

[0015] The welding wire is made into welding rods of corresponding lengths according to the welding lengths of the pins on one side of the chip, and the welding rods are stored in the welding rod storage grooves. The negative pressure feeding pipe grabs the chip under negative pressure, places the pins of the chip on the electric heating sheet, heats the pins of the chip through the electric heating sheet, so that the pins of the chip can locally melt the welding rod, and the welding rod adheres to the pins of the chip. Then, the chip carrying the welding rod is placed on the chip mounting position of the circuit board, and the negative pressure feeding pipe maintains the placement state of the chip, so that the welding position of the chip is stable and there will be no problem of deviation. Then, two hot welding rods contact the pins on both sides of the chip for heating, melting the welding rod, thereby welding the chip on the circuit board. The traditional welding method of the welding torch is discarded, and the welding of the chip can be completed in a narrow space. At the same time, there will be no interference with the negative pressure feeding pipe during the welding process, and the position of the chip will not shift during the welding process, improving the welding efficiency and welding accuracy. Description of the Drawings

[0016] Figure 1 Structural schematic diagram of an automatic welding device for a circuit board chip according to the present invention Figure 1 ;

[0017] Figure 2 Structural schematic diagram of an automatic welding device for a circuit board chip according to the present invention Figure 2 ;

[0018] Figure 3 is Figure 2 the enlarged view at A in

[0019] Figure 4 Structural schematic diagram of an automatic welding device for a circuit board chip according to the present invention Figure 3 ;

[0020] Figure 5 is Figure 4 the enlarged view at B in

[0021] Figure 6 Internal structural schematic diagram of the hot welding mechanism in an automatic welding device for a circuit board chip according to the present invention;

[0022] Figure 7 Internal structural schematic diagram of the welding rod storage seat in an automatic welding device for a circuit board chip according to the present invention;

[0023] Figure 8 Structural schematic diagram of an automatic welding device for a circuit board chip according to the present invention Figure 4 ;

[0024] In the figure, 1 - welding workbench, 2 - rectangular tooling groove, 3 - heating base, 4 - electrode storage base, 5 - rectangular groove, 6 - electric heating sheet, 7 - through hole, 8 - electrode storage groove, 9 - chip storage base, 10 - chip storage groove, 11 - negative pressure feeding pipe, 12 - moving column, 13 - moving plate, 14 - hot welding electrode, 15 - lifting column, 16 - lifting bar, 17 - vertical groove, 18 - driving base, 19 - driving cavity, 20 - lead screw, 21 - support block, 22 - first wedge surface, 23 - lifting block, 24 - second wedge surface, 25 - reduction motor, 26 - electrode lowering base, 27 - base, 28 - first cylinder, 29 - top plate, 30 - second cylinder, 31 - electrode placement groove, 32 - first support piece, 33 - second support piece, 34 - first rack, 35 - second rack, 36 - intermittent gear, 37 - servo motor, 38 - lead screw groove, 39 - adjusting lead screw, 40 - lead screw slider, 41 - lead screw motor, 42 - adjusting top plate, 43 - third cylinder, 44 - adjusting cavity, 45 - electromagnet, 46 - adjusting shaft, 47 - permanent magnet, 48 - spring, 49 - horizontal lifting beam, 50 - longitudinal sliding beam, 51 - sliding substrate, 52 - fourth cylinder, 53 - first lead screw, 54 - first motor, 55 - second lead screw groove, 56 - second lead screw, 57 - horizontal positioning plate, 58 - longitudinal positioning plate, 59 - fifth cylinder, 60 - sixth cylinder, 61 - first lead screw groove, 62 - second motor, 63 - avoidance groove. Specific embodiments

[0025] The technical solution of the present invention will be further described in detail below with reference to the accompanying drawings, but the protection scope of the present invention is not limited to the following.

[0026] Embodiment 1:

[0027] As Figures 1 to 8As shown in the figure, an automatic soldering device for a circuit board chip includes a soldering workbench 1. A rectangular tooling slot 2 is opened on the top surface of the soldering workbench 1. One end of the soldering workbench 1 is provided with a welding rod feeding mechanism. The welding rod feeding mechanism includes a chip storage seat 9, a heating seat 3, and a welding rod storage seat 4 arranged in sequence along the length direction of the soldering workbench 1. A rectangular slot 5 is opened at the top of the heating seat 3. Electric heating sheets 6 are arranged on both sides of the rectangular slot 5 on the top surface of the heating seat 3. A through hole 7 is opened at the top of the welding rod storage seat 4. Two welding rod storage slots 8 are opened on both sides of the rectangular slot 5 on the top surface of the welding rod storage seat 4. The width of the welding rod storage slot 8 can only accommodate one welding rod. At the same time, a plurality of avoidance slots 63 communicating with the welding rod storage slots 8 are opened at the top of the welding rod storage seat 4. The plurality of avoidance slots 63 correspond one by one to a plurality of pins on one side of the chip. A chip storage slot 10 is opened on the top surface of the chip storage seat 9. Above the soldering workbench 1, a gantry conveying mechanism and a negative pressure feeding pipe 11 arranged on the gantry conveying mechanism are provided. The gantry conveying mechanism has three degrees of freedom of movement in three perpendicular directions in the space coordinate system. On the soldering workbench 1, a thermal soldering mechanism is arranged on one side of the rectangular tooling slot 2. The thermal soldering mechanism includes a moving column 12, a moving plate 13, and a thermal welding rod 14. The moving column 12 is slidably arranged on the soldering workbench 1. The moving column 12 has a degree of freedom of moving along the length direction of the soldering workbench 1. The moving plate 13 is slidably installed on the moving column 12. The moving plate 13 has a degree of freedom of moving along the width direction of the soldering workbench 1. Two thermal welding rods 14 are connected to one end of the moving plate 13 close to the rectangular tooling slot 2. An electric heating wire is arranged inside the thermal welding rod 14. The electric heating wire makes the thermal welding rod 14 generate high heat, so that the thermal welding rod 14 can contact the pins of the chip to melt the welding rod. A transverse positioning plate 57 and a longitudinal positioning plate 58 are slidably arranged in the rectangular tooling slot 2. The moving direction of the transverse positioning plate 57 is perpendicular to the moving direction of the longitudinal positioning plate 58. A fifth cylinder 59 and a sixth cylinder 60 are installed on the outer side wall of the soldering workbench 1. The telescopic shaft of the fifth cylinder 59 penetrates into the rectangular tooling slot 2 and is connected to the transverse positioning plate 57. The telescopic shaft of the sixth cylinder 60 penetrates into the rectangular tooling slot 2 and is connected to the longitudinal positioning plate 58. The circuit board is loaded into the rectangular tooling slot 2. Then, the fifth cylinder 59 and the sixth cylinder 60 act. The fifth cylinder 59 drives the transverse positioning plate 57 to push the circuit board to move. The sixth cylinder 60 drives the longitudinal positioning plate 58 to push the circuit board to move, so that the two right-angle side walls of the circuit board contact the two right-angle inner side walls of the rectangular tooling slot 2, thereby completing the positioning of the circuit board, and the circuit board is tooled by the transverse positioning plate 57 and the longitudinal positioning plate 58 to ensure that the circuit board will not shift during the chip soldering process. The welding rod is made into a welding rod with a corresponding length according to the welding length of the pins on one side of the chip. The welding rod is stored in the welding rod storage slot 8. The length of the welding rod storage slot 8 matches the length of the welding rod, so that the welding rod can be positioned and stored in the welding rod storage slot 8. Since the width of the welding rod storage slot 8 can only accommodate one welding rod,Stack a number of welding rods along the height direction of the welding rod storage base 4. Drive the negative pressure feeding pipe 11 to move in three directions through the gantry conveying mechanism, namely the three axial directions of X, Y, and Z. Similarly, the size of the chip storage groove 10 matches the size of the chip, and a number of chips are stacked along the height direction of the chip storage base 9. The negative pressure feeding pipe 11 adsorbs the chips in a negative pressure manner, so as to take out the chips from the chip storage base 9. Then the chips move to the heating station of the heating base 3, place the pins of the chips on the electric heating sheet 6, and heat the pins of the chips through the electric heating sheet 6, so that the pins of the chips can locally melt the welding rods, and the welding rods adhere to the pins of the chips. Then the negative pressure feeding pipe 11 carries the chips into the rectangular groove 5, and the pins of the chips enter the welding rod storage groove 8 through the avoidance groove 63, and the pins heat the topmost welding rod, so that the upper welding rod is fixed on the pins of the chips, enabling the chips to carry the welding rods and move. To ensure stable welding, each side of the chip is welded by two welding rods. Then place the chips carrying the welding rods on the chip installation positions of the circuit board. The negative pressure feeding pipe 11 maintains the placement state of the chips, making the welding positions of the chips stable and not prone to deviation problems. Then drive the hot welding rods 14 to move to the pins of the chips through the movement of the moving column 12 and the moving plate 13. The distance between the two hot welding rods 14 matches the width of the chip, so that the two hot welding rods 14 respectively correspond to the pins on both sides of the chip. The two hot welding rods 14 contact the pins on both sides of the chip for heating, melting the welding rods. The contact negative pressure feeding pipe 11 drives the chips to move downward, so that the pins of the chips contact the chip holes on the circuit board. Under the extrusion effect, the melted solder diffuses around the pins. After the hot welding rods 14 are separated from the pins of the chips, the solder solidifies, thus welding the chips on the circuit board. Abandoning the traditional welding method of a welding torch, it can complete the welding of chips in a narrow space, and at the same time will not interfere with the negative pressure feeding pipe during the welding process, enabling the position of the chips not to shift during the welding process, improving the welding efficiency and welding precision; specifically in implementation, the hot welding mechanism is installed according to the installation position of the chips, so that the hot welding rods 14 can smoothly correspond to the pins of the chips for hot welding.,

[0028] Embodiment 2:

[0029] On the basis of Embodiment 1, as Figure 8 、 Figures 1 to 4As shown in the figure, a lead screw groove 38 is provided at the position of the moving column 12 on the welding workbench 1. The lead screw groove 38 extends along the length direction of the welding workbench 1. An adjusting lead screw 39 is rotatably arranged in the lead screw groove 38. A lead screw slider 40 is threadedly sleeved on the adjusting lead screw 39. The moving column 12 is fixed on the lead screw slider 40. A lead screw motor 41 is installed on the side wall of the welding workbench 1. The output shaft of the lead screw motor 41 is drivingly connected to the adjusting lead screw 39. An adjusting top plate 42 is arranged at the top of the moving column 12. The adjusting top plate 42 has the freedom to move along the height direction of the moving column 12. A third air cylinder 43 is horizontally installed on the adjusting top plate 42. The telescopic shaft of the third air cylinder 43 is connected to the moving plate 13. The lead screw motor 41 drives the adjusting lead screw 39 to rotate, so that the lead screw slider 40 moves along the axial direction of the adjusting lead screw 39 to adjust the position of the hot welding strip 14. The third air cylinder 43 drives the hot welding strip 14 to approach the pins of the chip, so that the two hot welding strips 14 can be accurately moved to directly above the pins on both sides of the chip. During specific implementation, the position of the hot welding mechanism is installed corresponding to the installation position of the circuit board chip, so that the axial direction of the adjusting lead screw 39 is parallel to the length direction of the chip, and the hot welding strip 14 can smoothly contact the pins of the chip to melt the welding rod.

[0030] Embodiment 3:

[0031] Based on Embodiment 2, as Figures 1 to 6 shown, the moving column 12 is provided with an adjusting cavity 44. An electromagnet 45 is arranged in the adjusting cavity 44. An adjusting shaft 46 is fixed to the bottom of the adjusting top plate 42. The adjusting shaft 46 slidably penetrates into the adjusting cavity 44 and is connected to a permanent magnet 47. The electromagnet 45 is energized to generate a magnetic pole with the same magnetism as the permanent magnet 47. A spring 48 is arranged in the adjusting cavity 44. The two ends of the spring 48 are respectively connected to the permanent magnet 47 and the moving column 12. When the adjusting top plate 42 contacts the top surface of the moving column 12, the spring 48 is in a stretched state. Before welding, the electromagnet 45 is first energized to repel the permanent magnet 47, so that the permanent magnet 47 drives the adjusting shaft 46 to move upward, so that the adjusting top plate 42 drives the hot welding strip 14 to move upward, so that the hot welding strip 14 is located above the pins of the chip. Then, the hot welding strip 14 is moved to directly above the pins of the chip by the movement of the moving column 12 and the moving plate 13. Then the electromagnet 45 is powered off. Under the reaction force of the spring 48 and the gravity of the adjusting shaft 46, the hot welding strip 14 contacts the pins of the chip to complete the welding operation. After welding is completed, the electromagnet 45 is energized to separate the hot welding strip 14 from the pins of the chip. Then the moving plate 13 drives the hot welding strip 14 to move away from the circuit board, so that the circuit board will not interfere with the hot welding mechanism during feeding and discharging. The feeding and discharging of the circuit board can be completed by a robotic arm.

[0032] Embodiment 4:

[0033] Based on Embodiment 3, as Figures 1 to 8As shown in the figure, the gantry conveying mechanism includes a transverse lifting beam 49, a longitudinal sliding beam 50 and a sliding substrate 51. Two transverse lifting beams 49 are arranged at intervals along the length direction of the welding workbench 1. At both ends of the bottom of the transverse lifting beam 49, fourth cylinders 52 are provided. The telescopic shafts of the fourth cylinders 52 are connected to the transverse lifting beam 49. The two ends of the longitudinal sliding beam 50 are respectively slidably installed on the two transverse lifting beams 49. The sliding substrate 51 is slidably installed on the longitudinal sliding beam 50. The moving direction of the sliding substrate 51 is perpendicular to the moving direction of the longitudinal sliding beam 50. The negative pressure feeding pipe 11 is installed on the sliding substrate 51. A first lead screw groove 61 is formed on the top surface of the transverse lifting beam 49. A first lead screw 53 is rotatably arranged in the first lead screw groove 61. A first lead screw slider is threadedly sleeved on the first lead screw 53. The two ends of the longitudinal sliding beam 50 are respectively connected to the two first lead screw sliders. A first motor 54 is installed at one end of the transverse lifting beam 49. The output shaft of the first motor 54 is drivingly connected to the first lead screw 53. By driving the first lead screw 53 to rotate through the first motor 54, the first lead screw slider drives the longitudinal sliding beam 50 to move along the axial direction of the first lead screw 53. A second lead screw groove 55 is formed at the bottom of the longitudinal sliding beam 50. A second lead screw 56 is rotatably arranged in the second lead screw groove 55. A second lead screw slider is threadedly sleeved on the second lead screw 56. The second lead screw slider is slidably adapted to the second lead screw groove 55. The sliding substrate 51 is fixedly installed on the second lead screw slider. A second motor 62 is installed at one end of the longitudinal sliding beam 50. The output shaft of the second motor 62 is drivingly connected to the second lead screw 56. By driving the second lead screw 56 to rotate through the second motor 62, the second lead screw slider drives the sliding substrate 51 to move along the axial direction of the second lead screw 56. By driving the transverse lifting beam 49 to move up and down through the telescopic movement of the fourth cylinder 52, the negative pressure feeding pipe 11 has three degrees of freedom with mutually perpendicular moving directions, and the feeding and conveying of the chip can be realized.

[0034] Embodiment 5:

[0035] On the basis of Embodiment 4, as Figures 1 to 5As shown in the figure, a jacking column 15 is slidably arranged in the through hole 7. The jacking column 15 has the freedom to move along the height direction of the electrode storage seat 4. A plurality of jacking bars 16 are fixed on both sides of the jacking column 15. The plurality of jacking bars 16 are arranged at intervals along the length direction of the electrode storage groove 8. The electrode storage seat 4 is provided with a vertical groove 17 at the position corresponding to the jacking bar 16. The vertical groove 17 runs through in the width direction of the electrode storage groove 8. The jacking bar 16 extends into the vertical groove 17 to support the electrode. During the chip soldering process, the jacking column 15 moves upward, so that the jacking column 15 drives the electrode in the electrode storage groove 8 to move upward through the jacking bar 16. The moving distance of the jacking column 15 each time is the thickness of the electrode, so as to ensure that the feeding height of the electrode remains unchanged, so that the chip carried by the negative pressure feeding pipe 11 can accurately melt and adhere to the electrode on the lead, which is convenient for subsequent thermal soldering operation of the chip. Similarly, a lifting mechanism is arranged on one side of the chip storage seat 9. The lifting mechanism includes a linearly driving module arranged vertically. A lifting rod is connected to the sliding seat of the linearly driving module. A lifting plate is arranged in the chip storage groove 10. The chips are stacked on the lifting plate. The lifting plate is connected to the lifting rod. The side wall of the chip storage seat 9 is provided with a lifting chute for the lifting rod to move. The lifting plate moves a thickness of one chip each time to ensure that the feeding position of the chip remains unchanged, so that the negative pressure feeding pipe 11 can accurately adsorb and feed the chip. The negative pressure feeding pipe 11 is connected to a negative pressure pump through a pipeline, and the feeding and discharging of the chip are completed by negative pressure. This belongs to the prior art and will not be elaborated here.

[0036] Embodiment Six:

[0037] Since the thickness dimension of the electrode is very small, the conventional moving methods such as cylinders and lead screws cannot meet this moving accuracy requirement. Therefore, on the basis of Embodiment Five, as Figures 1 to 7As shown, a driving seat 18 is connected to the bottom of the electrode storage seat 4. A driving cavity 19 is arranged inside the driving seat 18. A lead screw 20 is rotatably arranged inside the driving cavity 19. A support block 21 is threadedly sleeved on the lead screw 20. The support block 21 is threadedly sleeved on the lead screw 20. A first wedge surface 22 is provided on the top surface of the support block 21. The bottom of the lifting column 15 slides into the driving cavity 19 and is fixed with a lifting block 23. A second wedge surface 24 is provided on the bottom of the lifting block 23. The second wedge surface is in contact and cooperation with the first wedge surface 22. A reduction motor 25 is installed on the side wall of the driving seat 18. The output shaft of the reduction motor 25 is drivingly connected to the lead screw 20. The reduction motor 25 drives the lead screw 20 to rotate, so that the support block 21 makes a linear movement along the axial direction of the lead screw 20. The support block 21 makes the lifting column 15 move up and down through the cooperation of the first wedge surface 22 and the second wedge surface 24. The movement accuracy of the lifting column 15 is related to the inclination angle of the first wedge surface 22. The smaller the angle between the cooperation surface of the first wedge surface 22 and the second wedge surface 24 and the horizontal plane, the higher the movement accuracy. Thus, the movement accuracy of the lifting column 15 is further improved by the cooperation of the lead screw and the wedge surface, so that the lifting column 15 can move the thickness of one electrode each time. A high-precision displacement sensor is embedded in the inner bottom wall of the rectangular groove 5 of the electrode storage seat 4. The movement distance of the lifting column 15 is detected by the high-precision displacement sensor, so that it can be ensured that the lifting column 15 moves the thickness of one electrode each time, realizing the high-precision feeding of the electrode.

[0038] Embodiment Seven:

[0039] On the basis of Embodiment Six, as Figures 1 to 5As shown in the figure, a welding rod lowering mechanism is arranged above the welding rod storage seat 4. The welding rod lowering mechanism includes a welding rod lowering seat 26 and a base 27. A first cylinder 28 is vertically installed on the top of the base 27. The telescopic shaft of the first cylinder 28 is connected to a top plate 29. A second cylinder 30 is horizontally installed on the top plate 29. The telescopic shaft of the second cylinder 30 is connected to the welding rod lowering seat 26. Four welding rod placement grooves 31 are formed through the welding rod lowering seat 26. The width of the welding rod placement grooves 31 can only accommodate one welding rod. The four welding rod placement grooves 31 correspond to the four welding rod storage grooves 8 one by one. Quantitative lowering mechanisms are arranged on both sides of the welding rod lowering seat 26. The quantitative lowering mechanism includes a first support piece 32 and a second support piece 33. Both the first support piece 32 and the second support piece 33 are slidably connected to the welding rod lowering seat 26. Both the first support piece 32 and the second support piece 33 can extend into the welding rod placement grooves 31 to support the welding rods. The first support piece 32 and the second support piece 33 are arranged at intervals along the height direction of the welding rod lowering seat 26. One end of the first support piece 32 away from the welding rod lowering seat 26 is connected to a first rack 34. One end of the second support piece 33 away from the welding rod lowering seat 26 is connected to a second rack 35. The second rack 35 is arranged opposite to the first rack 34. An intermittent gear 36 is arranged between the first rack 34 and the second rack 35. The mounting shaft of the intermittent gear 36 is drivingly connected to the output shaft of a steering gear 37. The housing of the steering gear 37 is installed on the welding rod lowering seat 26. The intermittent gear 36 alternately meshes with the first rack 34 and the second rack 35. Since the lifting of the welding rod is realized by the cooperation of the wedge surface and the lead screw, the moving range of the jacking column 15 is small. Since the arrangement height of the welding rod storage grooves 8 is determined by the moving height range of the jacking column 15, the number of welding rods stored in the welding rod storage grooves 8 is small. To avoid workers frequently stacking welding rods into the welding rod storage grooves 8, a welding rod lowering mechanism is provided. The welding rod lowering mechanism automatically places welding rods into the welding rod storage grooves 8. The height of the welding rod lowering seat 26 is large, and a large number of welding rods can be stored in the welding rod placement grooves 31, so that the welding rod lowering seat 26 can add welding rods to the welding rod storage grooves 8 multiple times. Taking the first support piece 32 being above the second support piece 33 as an example, when the welding rod lowering seat 26 is not performing the welding rod adding operation, the second support piece 33 is inserted into the welding rod placement groove 31, and the first support piece 32 is not inserted into the welding rod placement groove 31, so that the welding rods are stacked on the second support piece 33. When adding welding rods to the welding rod storage grooves 8, the second cylinder 30 drives the welding rod lowering seat 26 to move close to the welding rod storage seat 4, so that the welding rod lowering seat 26 moves to directly above the welding rod storage seat 4. Then the first cylinder 28 drives the welding rod lowering seat 26 to move downward to contact the welding rod storage seat 4. Then the steering gear 37 drives the intermittent gear 36 to move. At this time, the toothed area of the intermittent gear 36 meshes with the first rack 34. The intermittent gear 36 rotates to drive the first rack 34 to move, so that the first rack 34 drives the first support piece 32 to be inserted into the welding rod placement groove 31. At this time, the welding rods between the first support piece 32 and the second support piece 33 need to be added to the welding rod storage grooves 8.Thus, the amount of electrode added each time is shifted, realizing the quantitative addition of the electrode. The intermittent gear 36 continues to rotate, causing the toothed area of the intermittent gear 36 to engage with the second rack 35. Since the first rack 34 and the second rack 35 are oppositely arranged, the moving directions of the first rack 34 and the second rack 35 are opposite, causing the second rack 35 to drive the second support piece 33 to move out of the electrode placement groove 31. Thus, the electrode between the first support piece 32 and the second support piece 33 can smoothly fall into the electrode storage groove 8, realizing the addition of the electrode. After the intermittent gear 36 rotates one circle, the servo motor 37 drives the intermittent gear 36 to rotate in the reverse direction, causing the intermittent gear 36 to drive the second rack 35 to move in the reverse direction, causing the second rack 35 to drive the second support piece 33 to move into the electrode placement groove 31. Then, the intermittent gear 36 engages with the first rack 34, causing the first rack 34 to drive the first support piece 32 to move in the reverse direction, causing the first support piece 32 to move out of the electrode placement groove 31. Thus, the electrode in the electrode placement groove 31 falls back onto the second support piece 33 and is supported by the second support piece 33. Finally, the first cylinder 28 and the second cylinder 30 are reset, causing the electrode lowering seat 26 to be reset and wait for the next electrode addition operation. Repeating the above operations can realize the quantitative addition of the electrode.

Claims

1. An automatic soldering device for a circuit board chip, comprising a soldering workbench (1), characterized in that, The top surface of the welding workbench (1) is provided with a rectangular tooling groove (2). One end of the welding workbench (1) is provided with a welding rod feeding mechanism. The welding rod feeding mechanism includes a chip storage seat (9), a heating seat (3), and a welding rod storage seat (4) arranged in sequence along the length direction of the welding workbench (1). The top of the heating seat (3) is provided with a rectangular groove (5). Electric heating sheets (6) are arranged on both sides of the rectangular groove (5) on the top surface of the heating seat (3). The top of the welding rod storage seat (4) is provided with a through hole (7). Two welding rod storage grooves (8) are arranged on both sides of the rectangular groove (5) on the top surface of the welding rod storage seat (4). The width of the welding rod storage groove (8) can only accommodate one welding rod. The top of the welding rod storage seat (4) is provided with a plurality of avoidance grooves (63) communicating with the welding rod storage grooves (8). The plurality of avoidance grooves (63) correspond one by one to a plurality of pins on one side of the chip. The top surface of the chip storage seat (9) is provided with a chip storage groove (10). A gantry conveying mechanism and a negative pressure feeding pipe (11) arranged on the gantry conveying mechanism are provided above the welding workbench (1). The gantry conveying mechanism has three degrees of freedom of movement in three perpendicular directions in the space coordinate system. A thermal welding mechanism is arranged on one side of the rectangular tooling groove (2) on the welding workbench (1). The thermal welding mechanism includes a moving column (12), a moving plate (13), and a thermal welding rod (14). The moving column (12) is slidably arranged on the welding workbench (1). The moving column (12) has a degree of freedom of movement along the length direction of the welding workbench (1). The moving plate (13) is slidably installed on the moving column (12). The moving plate (13) has a degree of freedom of movement along the width direction of the welding workbench (1). Two of the thermal welding rods (14) are connected to one end of the moving plate (13) close to the rectangular tooling groove (2); The negative pressure feeding pipe (11) takes out the chip from the chip storage seat (9), and then the chip moves to the heating station of the heating seat (3). The pins of the chip are placed on the electric heating sheet (6). The pins of the chip are heated by the electric heating sheet (6) so that the pins of the chip can locally melt the welding rod, and the welding rod adheres to the pins of the chip. The pins of the chip enter the welding rod storage groove (8) through the avoidance groove (63). The welding rod at the top of the pin heating is used to fix the upper welding rod on the pins of the chip, so that the chip can carry the welding rod to move. Then the chip carrying the welding rod is placed on the chip mounting position of the circuit board. The moving column (12) and the moving plate (13) drive the hot welding rod (14) to move to the pins of the chip. The two hot welding rods (14) contact the pins on both sides of the chip for heating to melt the welding rod. Then the negative pressure feeding pipe (11) drives the chip to move downward so that the pins of the chip contact the chip holes on the circuit board. Under the extrusion action, the melted solder spreads around the pins. After the hot welding rod (14) separates from the pins of the chip, the solder solidifies, thereby welding the chip on the circuit board.

2. The automated soldering device for a circuit board chip according to claim 1, characterized in that, A jacking column (15) is slidably arranged in the through hole (7). The jacking column (15) has the freedom to move along the height direction of the welding rod storage seat (4). A plurality of jacking bars (16) are fixed on both sides of the jacking column (15). The plurality of jacking bars (16) are arranged at intervals along the length direction of the welding rod storage groove (8). The welding rod storage seat (4) is provided with a vertical groove (17) at a position corresponding to the jacking bar (16). The vertical groove (17) runs through in the width direction of the welding rod storage groove (8). The jacking bar (16) extends into the vertical groove (17) to support the welding rod.

3. The automatic soldering device for a circuit board chip according to claim 2, characterized in that, The bottom of the welding rod storage seat (4) is connected with a driving seat (18). A driving cavity (19) is arranged in the driving seat (18). A lead screw (20) is rotatably arranged in the driving cavity (19). A support block (21) is threadedly sleeved on the lead screw (20). The support block (21) is threadedly sleeved on the lead screw (20). A first wedge surface (22) is arranged on the top surface of the support block (21). The bottom of the jacking column (15) slides into the driving cavity (19) and is fixed with a lifting block (23). A second wedge surface (24) is arranged at the bottom of the lifting block (23). The second wedge surface is in contact and cooperation with the first wedge surface (22). A reduction motor (25) is installed on the side wall of the driving seat (18). The output shaft of the reduction motor (25) is in transmission connection with the lead screw (20).

4. An automatic soldering device for a circuit board chip according to claim 1, characterized in that, Above the electrode storage seat (4), there is an electrode lowering mechanism, which includes an electrode lowering seat (26) and a base (27). At the top of the base (27), a first cylinder (28) is vertically installed. The telescopic shaft of the first cylinder (28) is connected to a top plate (29). Horizontally installed on the top plate (29) is a second cylinder (30). The telescopic shaft of the second cylinder (30) is connected to the electrode lowering seat (26). Four electrode placement grooves (31) are penetrated through the electrode lowering seat (26). The width of the electrode placement groove (31) can only accommodate one electrode. The four electrode placement grooves (31) correspond to the four electrode storage grooves (8) one by one. On both sides of the electrode lowering seat (26), a quantitative lowering mechanism is provided. The quantitative lowering mechanism includes a first support piece (32) and a second support piece (33). Both the first support piece (32) and the second support piece (33) are slidably connected to the electrode lowering seat (26). Both the first support piece (32) and the second support piece (33) can extend into the electrode placement groove (31) to support the electrode. The first support piece (32) and the second support piece (33) are arranged at intervals along the height direction of the electrode lowering seat (26).

5. The automatic soldering device for a circuit board chip according to claim 4, characterized in that, One end of the first support piece (32) away from the electrode lowering seat (26) is connected to a first rack (34). One end of the second support piece (33) away from the electrode lowering seat (26) is connected to a second rack (35). The second rack (35) is arranged opposite to the first rack (34). An intermittent gear (36) is arranged between the first rack (34) and the second rack (35). The installation shaft of the intermittent gear (36) is drivingly connected to the output shaft of a steering gear (37). The housing of the steering gear (37) is installed on the electrode lowering seat (26). The intermittent gear (36) alternately meshes with the first rack (34) and the second rack (35).

6. The automatic soldering device for a circuit board chip according to claim 1, characterized in that, At the position where the moving column (12) is provided on the welding workbench (1), a lead screw groove (38) is opened. The lead screw groove (38) extends along the length direction of the welding workbench (1). A regulating lead screw (39) is rotatably arranged in the lead screw groove (38). A lead screw slider (40) is threadedly sleeved on the regulating lead screw (39). The moving column (12) is fixed on the lead screw slider (40). A lead screw motor (41) is installed on the side wall of the welding workbench (1). The output shaft of the lead screw motor (41) is drivingly connected to the regulating lead screw (39). At the top of the moving column (12), an adjusting top plate (42) is provided. The adjusting top plate (42) has the freedom to move along the height direction of the moving column (12). Horizontally installed on the adjusting top plate (42) is a third cylinder (43). The telescopic shaft of the third cylinder (43) is connected to the moving plate (13).

7. The automatic soldering device for a circuit board chip according to claim 6, characterized in that, The moving column (12) is provided with an adjusting cavity (44). An electromagnet (45) is arranged in the adjusting cavity (44). An adjusting shaft (46) is fixed to the bottom of the adjusting top plate (42). The adjusting shaft (46) slidably penetrates into the adjusting cavity (44) and is connected with a permanent magnet (47). The electromagnet (45) is energized to generate a magnetic pole with the same magnetism as the permanent magnet (47). A spring (48) is arranged in the adjusting cavity (44). Two ends of the spring (48) are respectively connected with the permanent magnet (47) and the moving column (12). When the adjusting top plate (42) contacts the top surface of the moving column (12), the spring (48) is in a stretched state.

8. An automatic soldering device for a circuit board chip according to claim 1, characterized in that, The gantry conveying mechanism includes a transverse lifting beam (49), a longitudinal sliding beam (50) and a sliding substrate (51). Two transverse lifting beams (49) are arranged at intervals along the length direction of the welding workbench (1). Fourth cylinders (52) are arranged at both ends of the bottom of the transverse lifting beam (49). The telescopic shafts of the fourth cylinders (52) are connected with the transverse lifting beam (49). Two ends of the longitudinal sliding beam (50) are respectively slidably mounted on the two transverse lifting beams (49). The sliding substrate (51) is slidably mounted on the longitudinal sliding beam (50). The moving direction of the sliding substrate (51) is perpendicular to the moving direction of the longitudinal sliding beam (50). The negative pressure feeding pipe (11) is mounted on the sliding substrate (51).

9. The automated soldering device for a circuit board chip according to claim 8, characterized in that, A first lead screw groove (61) is formed in the top surface of the transverse lifting beam (49). A first lead screw (53) is rotatably arranged in the first lead screw groove (61). A first lead screw slider is threadedly sleeved on the first lead screw (53). Two ends of the longitudinal sliding beam (50) are respectively connected with the two first lead screw sliders. A first motor (54) is mounted at one end of the transverse lifting beam (49). The output shaft of the first motor (54) is drivingly connected with the first lead screw (53). A second lead screw groove (55) is formed in the bottom of the longitudinal sliding beam (50). A second lead screw (56) is rotatably arranged in the second lead screw groove (55). A second lead screw slider is threadedly sleeved on the second lead screw (56). The second lead screw slider is slidably fitted in the second lead screw groove (55). The sliding substrate (51) is fixedly mounted on the second lead screw slider. A second motor (62) is mounted at one end of the longitudinal sliding beam (50). The output shaft of the second motor (62) is drivingly connected with the second lead screw (56).

10. The automated soldering device for a circuit board chip according to claim 1, characterized in that, A transverse positioning plate (57) and a longitudinal positioning plate (58) are slidably arranged in the rectangular tooling groove (2). The moving direction of the transverse positioning plate (57) is perpendicular to the moving direction of the longitudinal positioning plate (58). A fifth cylinder (59) and a sixth cylinder (60) are installed on the outer side wall of the welding workbench (1). The telescopic shaft of the fifth cylinder (59) movably penetrates into the rectangular tooling groove (2) to connect the transverse positioning plate (57), and the telescopic shaft of the sixth cylinder (60) movably penetrates into the rectangular tooling groove (2) to connect the longitudinal positioning plate (58).

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