Electrode structure of IBC battery, IBC battery, photovoltaic module and packaging method

Abstract

The invention relates to the technical field of solar cells, in particular to an electrode structure of an IBC battery, which comprises an electrode assembly and an insulating assembly, the electrode assembly comprises a plurality of first main gate electrodes, a plurality of second main gate electrodes, a plurality of first auxiliary gate electrodes and a plurality of second auxiliary gate electrodes, and the first main gate electrodes and the second main gate electrodes are alternately arranged in parallel at intervals; the first auxiliary gate electrodes are connected to the first main gate electrode and are not connected to the second main gate electrode, the second auxiliary gate electrodes are connected to the second main gate electrode and are not connected to the first main gate electrode, and the first auxiliary gate electrodes and the second auxiliary gate electrodes are arranged in an interdigital mode. The insulation assembly comprises a plurality of insulation films which are located on the two sides of the first main gate electrodes and / or the two sides of the second main gate electrodes respectively, and the first auxiliary gate electrodes and / or the second auxiliary gate electrodes passing through the insulation films are covered with the insulation films. The invention further provides the IBC battery comprising the electrode structure of the IBC battery, a photovoltaic module comprising the IBC battery and a packaging method.

Description

Technical Field

[0001] The present invention relates to the technical field of solar cells, and particularly to an electrode structure of an IBC cell, an IBC cell, a photovoltaic module and a packaging method. Background Art

[0002] The IBC cell, that is, an interdigitated back contact cell. Both the positive and negative electrodes of the IBC cell are arranged on the back surface, and the front surface is completely unobstructed, greatly increasing the current of the cell. At the same time, the positive and negative electrodes on the back surface are arranged in a dense interdigitated pattern, reducing the carrier transport distance, so the fill factor of the cell is relatively high. During the component packaging process of the IBC cell, a number of IBC cells need to be connected in series and parallel to obtain a photovoltaic module with an ideal power output. However, due to the electrode design on the back surface of the IBC cell, the positive and negative electrodes are in an interdigitated shape and are closely arranged together, and it is very easy to have a short-circuit problem during the welding process.

[0003] Therefore, there is an urgent need for an electrode structure of an IBC cell, an IBC cell, a photovoltaic module and a packaging method to solve the above problems. Summary of the Invention

[0004] One object of the present invention is to provide an electrode structure of an IBC cell, which can prevent short-circuit welding during the packaging process.

[0005] To achieve this purpose, the present invention adopts the following technical solutions:

[0006] Provide an electrode structure of an IBC cell, including:

[0007] An electrode assembly, including a plurality of first main grid electrodes and a plurality of second main grid electrodes extending along a first direction, and a first sub-grid electrode and a second sub-grid electrode extending along a second direction, the first direction and the second direction are not parallel, the plurality of first main grid electrodes and the plurality of second main grid electrodes are arranged in parallel at intervals and alternately, the plurality of first sub-grid electrodes are all connected to the first main grid electrodes and not connected to the second main grid electrodes, the plurality of second sub-grid electrodes are all connected to the second main grid electrodes and not connected to the first main grid electrodes, and the first sub-grid electrode and the second sub-grid electrode are arranged in an interdigitated pattern;

[0008] An insulating assembly, including a plurality of insulating films extending along the first direction, the plurality of insulating films are respectively arranged on both sides of the plurality of first main grid electrodes and / or both sides of the plurality of second main grid electrodes, and the plurality of insulating films cover the passing first sub-grid electrodes and / or the second sub-grid electrodes.

[0009] As a preferred solution of the electrode structure of the IBC cell, the first main grid electrode and the first sub-grid electrode are formed by screen printing aluminum paste;

[0010] And / or, the second main grid electrode and the second auxiliary grid electrode are formed by silver paste printing.

[0011] As a preferred solution of the electrode structure of the IBC cell, the thickness of the insulating film ranges from 8 μm to 15 μm;

[0012] And / or, the width of the insulating film ranges from 350 μm to 2000 μm.

[0013] As a preferred solution of the electrode structure of the IBC cell, the widths of the first main grid electrode and the second main grid electrode both range from 300 μm to 500 μm;

[0014] And / or, the widths of the first auxiliary grid electrode and the second auxiliary grid electrode both range from 50 μm to 150 μm.

[0015] Another object of the present invention is to provide an IBC cell capable of preventing welding short circuit during the encapsulation process.

[0016] To achieve this object, the present invention adopts the following technical solutions:

[0017] Provide an IBC cell, including a cell panel and the electrode structure of the above-mentioned IBC cell, and the electrode structure of the IBC cell is arranged on the back surface of the cell panel.

[0018] Another object of the present invention is to provide a photovoltaic module capable of preventing welding short circuit during the encapsulation process.

[0019] To achieve this object, the present invention adopts the following technical solutions:

[0020] Provide a photovoltaic module, including a bus bar, a pad, and a plurality of the above-mentioned IBC cells, and the IBC cells are melt-welded to the bus bar through the pads.

[0021] As a preferred solution of the photovoltaic module, a plurality of pads are provided, and the plurality of pads are respectively arranged on the first main grid electrode and the second main grid electrode.

[0022] As a preferred solution of the photovoltaic module, the pad is formed by printing conductive paste, and the conductive paste is solder paste or resin conductive glue containing tin powder and nickel powder.

[0023] Another object of the present invention is to provide a packaging method capable of preventing welding short circuit during the encapsulation process.

[0024] To achieve this object, the present invention adopts the following technical solutions:

[0025] Provide a packaging method applied to the above-mentioned photovoltaic module, and the packaging method includes the following steps:

[0026] Printing and drying pads: Printing conductive paste on the first main grid electrode and the second main grid electrode of the IBC cell, and drying the IBC cell.

[0027] Layout and dispensing: Laying the first encapsulation layer, the second encapsulation layer and the IBC cell in sequence, coating adhesive on the first main grid electrode and the second main grid electrode, laying a bus bar, curing the adhesive, the bus bar being bonded to the IBC cell through the adhesive, and then laying the third encapsulation layer and the fourth encapsulation layer on the IBC cell.

[0028] Laminating and welding: Laminating the overall structure, and melting the conductive paste so that the bus bar is welded to the IBC cell.

[0029] As a preferred solution of the encapsulation method, in the laminating and welding stage, the laminating temperature range is 200°C - 240°C.

[0030] Advantages of the present invention:

[0031] The present invention provides an electrode structure for an IBC cell, including an electrode assembly and an insulating assembly. The electrode assembly includes a plurality of first main grid electrodes and a plurality of second main grid electrodes extending along a first direction, and a first sub-grid electrode and a second sub-grid electrode extending along a second direction. The first direction is not parallel to the second direction. The plurality of first main grid electrodes and the plurality of second main grid electrodes are arranged in parallel at intervals and alternately. The plurality of first sub-grid electrodes are all connected to the first main grid electrodes and not connected to the second main grid electrodes. The plurality of second sub-grid electrodes are all connected to the second main grid electrodes and not connected to the first main grid electrodes. The first sub-grid electrode and the second sub-grid electrode are arranged in a finger-like pattern. The insulating assembly includes a plurality of insulating films extending along the first direction. By arranging the plurality of insulating films on both sides of the plurality of first main grid electrodes and / or on both sides of the plurality of second main grid electrodes, and the plurality of insulating films covering the passing first sub-grid electrode and / or second sub-grid electrode, it can prevent the subsequent welding process from electrically connecting the first main grid electrode to the second sub-grid electrode by mistake, or electrically connecting the second main grid electrode to the first sub-grid electrode by mistake. That is, while ensuring the dense finger-like arrangement of the first sub-grid electrode and the second sub-grid electrode, thus ensuring the superior performance of short carrier transport distance and high cell fill factor, covering the insulating film can achieve the risk of preventing welding short circuit in the subsequent encapsulation process and improve the quality of the IBC cell.

[0032] The present invention also provides an IBC cell, including a cell panel and the electrode structure of the IBC cell as described above, and the electrode structure of the IBC cell is arranged on the back of the cell panel.

[0033] The present invention also provides a photovoltaic module, including a bus bar, pads and a plurality of the above-mentioned IBC cells, and the IBC cells are melt-welded to the bus bar through the pads.

[0034] The present invention also provides a packaging method, which is applied to the above-mentioned photovoltaic module. The packaging method includes the following steps: printing and drying pads: printing conductive paste on the first main grid electrode and the second main grid electrode of the IBC cell, and drying the IBC cell; arranging and dispensing glue: laying the first packaging layer, the second packaging layer and the IBC cell in sequence, coating adhesive on the first main grid electrode and the second main grid electrode, laying the bus bar, curing the adhesive, and the bus bar is bonded to the IBC cell through the adhesive, and then laying the third packaging layer and the fourth packaging layer on the IBC cell; laminating and welding: laminating the overall structure, melting the conductive paste to weld the bus bar to the IBC cell. The photovoltaic module obtained by the above packaging method can prevent welding short circuit during the packaging process and ensure the quality of the photovoltaic module. Description of the Drawings

[0035] Figure 1 is a schematic structural diagram of the IBC cell (uncut state) provided by an embodiment of the present invention;

[0036] Figure 2 is a partial schematic structural diagram of the photovoltaic module provided by an embodiment of the present invention;

[0037] Figure 3 is a schematic diagram of the packaging process of the photovoltaic module provided by an embodiment of the present invention;

[0038] Figure 4 is a schematic flow chart of the packaging method provided by an embodiment of the present invention.

[0039] In the figure:

[0040] 1. IBC cell; 11. First main grid electrode; 12. Second main grid electrode; 13. First sub-grid electrode; 14. Second sub-grid electrode; 15. Insulating film;

[0041] 2. Pad; 3. First packaging layer; 4. Second packaging layer; 5. Adhesive; 6. Bus bar; 7. Third packaging layer; 8. Fourth packaging layer. Detailed Embodiments

[0042] The technical solutions of the present invention will be further described below in conjunction with the drawings and embodiments. It can be understood that the specific embodiments described herein are only used to explain the present invention, rather than limiting the present invention. In addition, it should be noted that for the sake of description, only parts related to the present invention are shown in the drawings, not all of them.

[0043] In the description of the present invention, it should be noted that, unless otherwise clearly specified and defined, the terms "mounted", "connected" and "coupled" should be understood in a broad sense. For example, it may be a fixed connection or a detachable connection; it may be a mechanical connection or an electrical connection; it may be a direct connection or an indirect connection through an intermediate medium, and it may be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

[0044] In the present invention, unless otherwise clearly specified and defined, the first feature being "on" or "under" the second feature may include the direct contact between the first and second features, or may include the situation where the first and second features are not in direct contact but in contact through other features therebetween. Moreover, the first feature being "above", "over" and "on top of" the second feature includes that the first feature is directly above and obliquely above the second feature, or merely indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature being "under", "below" and "beneath" the second feature includes that the first feature is directly below and obliquely below the second feature, or merely indicates that the horizontal height of the first feature is lower than that of the second feature.

[0045] As Figure 1 shown, the electrode structure of the IBC cell in this embodiment includes an electrode assembly and an insulating assembly. Among them, the electrode assembly includes a plurality of first main grid electrodes 11 and a plurality of second main grid electrodes 12 extending along a first direction, and a first sub-grid electrode 13 and a second sub-grid electrode 14 extending along a second direction, and the first direction is not parallel to the second direction. In this embodiment, the first direction is perpendicular to the second direction. The plurality of first main grid electrodes 11 and the plurality of second main grid electrodes 12 are arranged in parallel at intervals and alternately. The plurality of first sub-grid electrodes 13 are all connected to the first main grid electrodes 11 and not connected to the second main grid electrodes 12. The plurality of second sub-grid electrodes 14 are all connected to the second main grid electrodes 12 and not connected to the first main grid electrodes 11. The first sub-grid electrode 13 and the second sub-grid electrode 14 are arranged in an interdigitated manner. This setting method can effectively ensure a short carrier transmission distance and a high cell fill factor.

[0046] The insulating component includes multiple insulating films 15 extending along the first direction, and the multiple insulating films 15 are respectively arranged on both sides of multiple first main grid electrodes 11 and / or both sides of multiple second main grid electrodes 12. Preferably, insulating films 15 are arranged on both sides of each first main grid electrode 11, and insulating films 15 are also arranged on both sides of each second main grid electrode 12. And the multiple insulating films 15 cover the passing first sub-grid electrode 13 and / or second sub-grid electrode 14, that is, the metal objects arranged on the insulating films 15 are not electrically connected to the first sub-grid electrode 13 and / or second sub-grid electrode 14 below the insulating films 15. In the subsequent process of series-parallel packaging multiple IBC cells 1 to form a photovoltaic module, the first main grid electrode 11 and the second main grid electrode 12 need to be electrically connected to the bus bars 6 of the positive electrode and the negative electrode respectively. Due to the covering and isolation of the insulating films 15, the welding material is not easily miscontacted with the first sub-grid electrode 13 and the second sub-grid electrode 14 to cause a short circuit. That is, the above setting can prevent the subsequent welding process from electrically connecting the first main grid electrode 11 to the second sub-grid electrode 14 by mistake, or electrically connecting the second main grid electrode 12 to the first sub-grid electrode 13 by mistake. That is, while ensuring the dense interdigitated arrangement of the first sub-grid electrode 13 and the second sub-grid electrode 14, thus ensuring the superior performance of short carrier transmission distance and high cell fill factor, the risk of welding short circuit in the subsequent packaging process can be prevented by covering the insulating films 15, and the quality of the IBC cell 1 can be improved.

[0047] Preferably, the first main grid electrode 11 and the first sub-grid electrode 13 are formed by screen printing aluminum paste, and / or the second main grid electrode 12 and the second sub-grid electrode 14 are formed by screen printing silver paste. Preferably, the width of both the first main grid electrode 11 and the second main grid electrode 12 ranges from 300 μm to 500 μm. And / or, the width of both the first sub-grid electrode 13 and the second sub-grid electrode 14 ranges from 50 μm to 150 μm.

[0048] Preferably, the thickness of the insulating film 15 ranges from 8 μm to 15 μm to ensure the insulating effect. Preferably, the width of the insulating film 15 ranges from 350 μm to 2000 μm. The width of the insulating film 15 needs to consider the gap between the first main grid electrode 11 and the second main grid electrode 12 and the requirements of the subsequent packaging and welding process to ensure the short-circuit prevention effect of the insulating film 15 covering. Optionally, the material of the insulating film 15 is insulating ink or insulating resin, and the insulating film 15 is also printed onto the cell panel by a printing process.

[0049] As Figure 1 shown, this embodiment also provides an IBC cell 1, including a cell panel and the electrode structure of the above IBC cell, and the electrode structure of the IBC cell is arranged on the back of the cell panel.

[0050] The manufacturing steps of the IBC battery 1 include: using a P-type silicon wafer with a resistivity range of 1 ohm / cm-2 ohm / cm. After double-sided polishing, using LPCVD equipment to deposit SiO 2 And polysilicon layer, make a uniform contact passivation structure. Then do phosphorus diffusion process on the back, dope phosphorus atoms in the poly layer, and form an N-poly passivation contact structure.

[0051] After the silicon wafer with back passivation structure is made, it is patterned on the back using a picosecond laser. At the first main gate electrode 11 and the first auxiliary gate electrode 13, the high temperature of the picosecond laser is used to remove the N-poly structure to expose the P-type substrate at the bottom. The silicon wafer after laser patterning is placed in a texturing machine for texturing. The industry-standard trough texturing machine is used for texturing, using NaOH / KOH alkaline solution and adding auxiliary additives to achieve etching of the laser area and the front side. After texturing, the silicon wafer is made into double-sided AlOx and SiNx passivation structures, and nanosecond laser ablation technology is used to make several uniform ablation holes.

[0052] In the screen printing process, aluminum paste is printed on the P-type substrate, with an aluminum main grid width of 400 μm and an aluminum secondary grid width of 120 μm. In other N-poly areas, symmetrical patterns are designed and silver paste is printed, with a silver main grid width of 300 μm and a silver secondary grid width of 90 μm. The screen printing machine is continued to be used to print insulating ink on both sides of the first main grid electrode 11 and the second main grid electrode 12 to form an insulating film 15, with a single insulating ink width of 500 μm and an ink height of 9 μm. Thus, the above-mentioned IBC battery 1 is obtained.

[0053] like Figure 2 and Figure 3 As shown, this embodiment also provides a photovoltaic module, including a busbar 6, a soldering pad 2 and a plurality of the above-mentioned IBC batteries 1, wherein the IBC batteries 1 are melt-welded to the busbar 6 through the soldering pad 2 to realize the series-parallel connection of the plurality of IBC batteries 1. Optionally, the busbar 6 is an ultra-thin metal solder strip such as copper-aluminum foil, tin-coated copper, etc.

[0054] Preferably, a plurality of solder pads 2 are provided, and the plurality of solder pads 2 are respectively provided on the first main gate electrode 11 and the second main gate electrode 12, and the solder pad 2 connected to the first main gate electrode 11 is located in the area where the first main gate electrode 11 and the insulating films 15 on both sides are located when being provided and after being melted, and the solder pad 2 connected to the second main gate electrode 12 is located in the area where the second main gate electrode 12 and the insulating films 15 on both sides are located when being provided and after being melted, so as to prevent short circuit.

[0055] Preferably, the pad 2 is printed with conductive paste. Optionally, the conductive paste is printed onto the first main grid electrode 11 and the second main grid electrode 12 by screen printing, which can ensure the accurate printing position. The conductive paste is solder paste or resin conductive glue containing tin powder and nickel powder. The pad 2 printed with the conductive paste can not only ensure the conductive performance, but also has advantages such as low cost compared with a silver pad 2.

[0056] The pad 2 can be set as a dot shape, and multiple pads 2 are evenly spaced along the length direction of the main grid electrode to ensure the stability of welding.

[0057] As Figures 2 - 4 shown, this embodiment also provides a packaging method applied to the above photovoltaic module. The packaging method includes the following steps:

[0058] Printing and drying the pad 2 stage: Print conductive paste on the first main grid electrode 11 and the second main grid electrode 12 of the IBC cell 1, and dry the IBC cell 1.

[0059] Specifically, the conductive paste is printed onto the first main grid electrode 11 and the second main grid electrode 12 by screen printing. The width range of the conductive paste is 150μm - 300μm. The printed conductive paste serves as the pad 2 for connecting the bus bar 6 and the main grid of the cell. The conductive paste is dried by a drying oven or a drying furnace. The drying temperature is controlled at 120°C - 150°C, and the drying duration is 70s - 120s. In this embodiment, the drying temperature is controlled below 150°C, and the drying duration is 90s.

[0060] Optionally, in this embodiment, the IBC cell 1 is laser scribed and divided into two half cells. Of course, in other embodiments, it can also be set as one cell or multiple cells.

[0061] Layout and dispensing stage: Lay the first encapsulation layer 3, the second encapsulation layer 4 and the IBC cell 1 in sequence. Optionally, the first encapsulation layer 3 is high-transparency glass, and the second encapsulation layer 4 is made of materials such as EVA or POE. By using the dispensing method, apply adhesive 5 on the first main grid electrode 11 and the second main grid electrode 12, lay the bus bar 6, cure the adhesive 5. The bus bar 6 is bonded to the IBC cell 1 through the adhesive 5, and then lay the third encapsulation layer 7 and the fourth encapsulation layer 8 on the IBC cell 1. Optionally, the third encapsulation layer 7 is also made of materials such as EVA or POE, and the fourth encapsulation layer 8 is high-transparency glass or a module backplane.

[0062] Optionally, in this embodiment, apply adhesive 5 at both ends of each main grid electrode to ensure the relative position of the bus bar 6 with respect to the IBC cell 1 remains unchanged, preparing for the subsequent fusion welding step.

[0063] Optionally, the adhesive 5 is cured by irradiating with a UV ultraviolet lamp, and the irradiation duration is 60s.

[0064] Laminating and welding stage: After the lamination is completed, the overall structure is laminated, and the conductive paste melts to weld the bus bar 6 to the IBC cell 1.

[0065] Preferably, the laminated component is placed in a laminator. The lamination temperature range is 200°C - 240°C, and the lamination duration is 1200s - 2000s. In this embodiment, the lamination temperature is set at 210°C, and the lamination duration is 1200s.

[0066] The above-mentioned melting and welding method can effectively avoid problems such as too high temperature in the existing thermal infrared welding process, the bending of the cell affected by the stress generated by high-temperature welding, cell microcracks or the existence of debris. It also does not require the use of laser hot melt welding, saving equipment costs. The pad 2 printed with low-temperature conductive paste has a melting temperature between 200°C and 220°C. This temperature is within the process temperature range of the laminator, and the inside of the laminator chamber is in a vacuum state. The pad 2 made of low-temperature conductive paste spreads more evenly after melting, which can better achieve the connection between the bus bar 6 and the main grid electrode of the IBC cell 1, thus helping to reduce the power loss caused by the welding resistance in the component packaging.

[0067] The photovoltaic module obtained by the above packaging method not only saves the silver paste consumption at the cell end and matches the cost of the component packaging connection scheme, but also avoids the microcrack risk brought by high-temperature thermal infrared welding. At the same time, the pad 2 made of low-temperature conductive paste melts and spreads in the evacuated chamber of the laminator, better realizing the ohmic connection between the bus bar 6 and the grid line of the IBC cell 1, greatly reducing the power loss caused by the welding resistance. In addition, this process is compatible with the conventional component production line and does not require the addition of laser equipment, which is more conducive to large-scale promotion.

[0068] Obviously, the above embodiments of the present invention are only examples for clearly explaining the present invention, rather than limiting the implementation manners of the present invention. For those of ordinary skill in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation manners here. Any modifications, equivalent replacements, and improvements made within the spirit and principle of the present invention shall be included in the protection scope of the claims of the present invention.

Claims

1. Electrode structure of an IBC cell, characterized in that, it includes: An electrode assembly, including a plurality of first main grid electrodes (11) extending along a first direction, a plurality of second main grid electrodes (12), a first sub-grid electrode (13) and a second sub-grid electrode (14) extending along a second direction. The first direction is not parallel to the second direction. The plurality of first main grid electrodes (11) and the plurality of second main grid electrodes (12) are arranged in parallel at intervals and alternately. The plurality of first sub-grid electrodes (13) are all connected to the first main grid electrodes (11) and not connected to the second main grid electrodes (12). The plurality of second sub-grid electrodes (14) are all connected to the second main grid electrodes (12) and not connected to the first main grid electrodes (11). The first sub-grid electrode (13) and the second sub-grid electrode (14) are arranged in a finger-like pattern; An insulating assembly, including a plurality of insulating films (15) extending along the first direction. The plurality of insulating films (15) are respectively arranged on both sides of the plurality of first main grid electrodes (11) and / or both sides of the plurality of second main grid electrodes (12), and the plurality of insulating films (15) cover the passing first sub-grid electrode (13) and / or the second sub-grid electrode (14).

2. The electrode structure of an IBC cell according to claim 1, characterized in that, The first main grid electrode (11) and the first sub-grid electrode (13) are formed by screen printing with aluminum paste; and / or, the second main grid electrode (12) and the second sub-grid electrode (14) are formed by screen printing with silver paste.

3. The electrode structure of an IBC cell according to claim 1, characterized in that, The thickness of the insulating film (15) ranges from 8μm to 15μm; and / or, the width of the insulating film (15) ranges from 350μm to 2000μm.

4. The electrode structure of an IBC cell according to claim 1, characterized in that, The widths of the first main grid electrode (11) and the second main grid electrode (12) both range from 300μm to 500μm; and / or, the widths of the first sub-grid electrode (13) and the second sub-grid electrode (14) both range from 50μm to 150μm.

5. An IBC cell, characterized in that, it includes a cell panel and the electrode structure of an IBC cell according to any one of claims 1-4. The electrode structure of the IBC cell is arranged on the back of the cell panel.

6. A photovoltaic module, characterized in that, it includes a bus bar (6), pads (2) and a plurality of IBC cells according to claim 5. The IBC cells (1) are fusion welded to the bus bar (6) through the pads (2).

7. The photovoltaic module according to claim 6, characterized in that, A plurality of pads (2) are provided. The plurality of pads (2) are respectively arranged on the first main grid electrode (11) and the second main grid electrode (12).

8. The photovoltaic module according to claim 6, characterized in that, The pad (2) is printed with a conductive paste, and the conductive paste is solder paste or a resin conductive adhesive containing tin powder and nickel powder.

9. Encapsulation method, characterized in that applied to the photovoltaic module according to any one of claims 6-8, the encapsulation method comprising the following steps: Printing and drying the pad (2): Printing a conductive paste on the first main grid electrode (11) and the second main grid electrode (12) of the IBC cell (1), and drying the IBC cell (1); Layout and dispensing: Laying the first encapsulation layer (3), the second encapsulation layer (4) and the IBC cell (1) in sequence, applying an adhesive (5) on the first main grid electrode (11) and the second main grid electrode (12), laying a bus bar (6), curing the adhesive (5), the bus bar (6) being bonded to the IBC cell (1) through the adhesive (5), and then laying a third encapsulation layer (7) and a fourth encapsulation layer (8) on the IBC cell (1); Laminating and welding: Laminating the overall structure, and the conductive paste melts to weld the bus bar (6) to the IBC cell (1).

10. The encapsulation method according to claim 9, characterized in that in the laminating and welding stage, the laminating temperature range is 200°C - 240°C.

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