Radiator with shielding function for PCB (Printed Circuit Board) and preparation process thereof

Abstract

The invention relates to the technical field of PCB heat dissipation, in particular to a preparation process of a radiator with a shielding function for a PCB, and the process comprises the steps: S101, raw material cutting: cutting a 1070 / 1060 aluminum plate with the thickness of h into a preset size and shape; s102, punch forming is conducted, specifically, the 1070 / 1060 aluminum plate is punched multiple times through a punching die, and a plate type radiator with a plurality of shielding cavities is formed; saturated pressing is carried out after each time of punching; s103, trimming is carried out; s104, nano carbon heat dissipation spraying is carried out; and S105, conductive adhesive is uniformly arranged on the arched ribs. Wherein a plurality of shielding cover forming areas are arranged on the lower die base, a plurality of rib protrusions are arranged on the edge of each shielding cover forming area in a surrounding mode, and punching grooves capable of being matched with the rib protrusions are formed in the positions, corresponding to the rib protrusions, of the bottom of the upper die base, so that the rib protrusions are used for forming a shielding frame through multiple times of punching.

Description

Technical Field

[0001] The present invention relates to the technical field of heat dissipation devices for PCB boards, and in particular to a heat sink with a shielding function for PCB boards and a preparation process thereof. Background Art

[0002] The operation of the chip will generate electromagnetic waves and heat, and the electromagnetic waves will damage other electronic components. In order to avoid and reduce this situation, a shielding cover will be added to the chip to shield the electromagnetic waves and reduce the damage. The heat generated by the operation of the chip will affect the function and life of the chip. In this case, a radiator is needed to dissipate heat. The shielding cover and radiator on the existing electronic equipment are separated separately. Not only must they be produced separately, but they must also be installed separately. When the shielding cover and the radiator are installed separately, the combination of the shielding cover and the radiator is inconvenient, which can easily lead to interference between the structures, resulting in poor contact between the shielding cover and the radiator, affecting the use of the radiator and the shielding cover. At the same time, there is a certain contact area between the shielding cover and the radiator, and the amount of material used increases. Based on this, the prior art proposes a structure that combines the shielding cover and the radiator. However, it still needs to produce the shielding cover and the radiator separately, and then assemble the two together.

[0003] For example, the Chinese utility model patent with announcement number CN 209489103U discloses a heat sink combining a multifunctional shielding cover and heat dissipation, including a first shielding plate, a second shielding plate, a heat dissipation plate, a mounting hole, a heat dissipation hole, a first chip, a heat dissipation slot, a second chip, a first chip cover and a second chip cover. The first chip cover is fixedly installed on the top of the first chip, and the second chip cover is fixedly installed on the top of the second chip, so as to reduce the electromagnetic waves received by the first chip and the second chip, and complete the protection of the first chip and the second chip. The first shielding plate and the second shielding plate are both fixedly installed on the heat dissipation plate, which reduces the assembly time of the first shielding plate and the second shielding plate. Heat dissipation holes are opened on the heat dissipation plate to complete the heat dissipation of the heat dissipation plate. When too much heat accumulates, the heat is discharged through the heat dissipation slot on one side of the heat dissipation hole. The heat sink combines the shielding cover and the heat sink by welding, which reduces the thermal resistance generated by the assembly and saves the time cost of assembly.

[0004] The above-mentioned discrete design not only has a cumbersome production process, but also requires mold molding for the chip cover, shielding plate, and heat sink, which has high mold costs and material costs. Secondly, the back-end assembly production is also relatively complicated, from the welding of the flat frame to the heat conduction between the chip and the shielding cover, and then to the heat sink, the entire production process is complicated and cumbersome. Based on this, the prior art has proposed the use of die-casting technology to process the integrated structure of the heat sink and shielding cover.

[0005] For example, the Chinese utility model patent with announcement number CN218941644U discloses a heat sink shielding cover integrated structure, PCBA board and 5G terminal equipment, which includes a heat sink and a shielding cover; one side of the heat sink forms the shielding cover by die casting; the heat sink and the shielding cover are an integrated structure; the shielding cover cooperates with the heat source and is arranged around the heat source; and a plurality of heat dissipation fins are arranged on the heat sink. The shielding cover is formed by die casting one side of the heat sink, so that the heat sink and the shielding cover are formed in one piece, avoiding structural interference caused by the separation of the heat sink and the shielding cover, which affects the heat dissipation effect, and improving the heat dissipation effect of the heat sink through the tight setting characteristics of the integrated structure.

[0006] However, the cost of die-casting heat sinks is very high, mainly because the aluminum alloy is melted and then formed using a mold, but the production mold costs and the back-end processing costs (such as molding, demolding and stamping, drilling and tapping, grinding and polishing, etc.) Secondly, the thermal conductivity of die-cast aluminum alloy or die-cast aluminum is not high (90-120w / mk), and the heat dissipation performance is average.

[0007] In view of this, there is an urgent need for a process with a simpler processing procedure to prepare a heat sink with higher heat dissipation performance and integrating shielding and heat dissipation functions. Summary of the invention

[0008] The purpose of the present invention is to provide a heat sink with a shielding function for a PCB board and a preparation process thereof, so as to partially solve or alleviate the above-mentioned deficiencies in the prior art. By simplifying the traditional complicated preparation process, not only the production process is simple and the cost is lower, but also the prepared heat sink has a simple structure and better heat dissipation performance.

[0009] In order to solve the above-mentioned technical problems, the present invention specifically adopts the following technical solutions: A first aspect of the present invention is to provide a process for preparing a heat sink with a shielding function for a PCB board, comprising the steps of: S101, raw material cutting: cutting 1070 / 1060 aluminum plate with thickness h into preset size and shape; S102, stamping forming: using a stamping die to stamp the 1070 / 1060 aluminum plate multiple times to form a plate-type heat sink with multiple shielding cavities; wherein the stamping speed v is 20-30 times / min; the stamping force is 200 tons; and each stamping is performed so that the upper die seat and the lower die seat of the stamping die are fully closed, and the next stamping is performed until the preset saturation time threshold is reached; the preset saturation time threshold is 2-3s; S103, trimming: remove excess burrs to ensure smooth edges of products; S104, nano-carbon heat dissipation spraying: spraying a nano-carbon heat dissipation coating on the outer side of the radiator; S105, uniformly arranging nickel-carbon rubber strips on the arched ribs for contacting and conducting with the exposed copper surface reserved on the bottom surface of the PCB board, and then heating to solidify it, so that when the plate-type heat sink is mounted on the PCB board, a closed shielding cavity is formed between the shielding cavity and the bottom plate of the PCB board; wherein the heating is performed so that the highest temperature zone during the curing process of the nickel-carbon rubber strips is 150° C., and the heating is performed in the highest temperature zone for 30 minutes; Wherein, the lower die base is provided with a plurality of shielding cover forming areas, the edge of each shielding cover forming area is surrounded by a plurality of rib protrusions, and the bottom of the upper die base is provided with a punching groove corresponding to each rib protrusion that can cooperate with the rib protrusion; After the upper die base performs the first stamping on the lower die base, a plurality of arched ribs of a first height are formed on the aluminum plate under the action of the rib protrusions; After the upper die base is stamped toward the lower die base for the second time, under the action of the rib protrusion, the height of the arched rib changes from the first height to the second height; the second height is greater than the first height, and the stamping is repeated multiple times until the height of the arched rib reaches a preset height, so that the plurality of arched ribs are enclosed to form a shielding frame integrally formed with the aluminum plate, and a shielding cover corresponding to the shielding cover molding area is formed integrally with the shielding frame.

[0010] In some embodiments, the thickness h of the aluminum plate is 2.0 MM-2.5 MM.

[0011] In some embodiments, step S102 is performed by stamping three times, and the stamping is performed by gradient deceleration during the three stamping processes, specifically, the steps include: S1021, during the first punching, punching is performed at the first punching speed V1, and saturation is performed for 2-3 seconds after punching; wherein V1=200 mm / s; S1022, during the second punching, punching is performed at a second punching speed V2, and saturation pressing is performed for 2-3 seconds after punching; wherein V2=150 mm / s; S1023, during the third stamping, stamping is performed at a third stamping speed V3, and after saturation for 2-3 seconds after stamping, the upper die seat is controlled to leave the lower die seat at a preset return speed; wherein V3=100 mm / s.

[0012] In some embodiments, during multiple stamping in step S102, stamping is performed in a gradient deceleration manner, and the deceleration gradient α can be determined by the following formula: ; Where N is the number of stamping times, t is the actual material thickness of the 1070 / 1060 aluminum plate; t 0 is the reference material thickness of 1070 / 1060 aluminum plate, which is 2mm; 0 is the initial deceleration gradient, which is an empirical value; k N is the attenuation coefficient of 1070 / 1060 aluminum plate and mold; k t The sensitivity of 1070 / 1060 aluminum plate thickness to the deceleration gradient.

[0013] In some embodiments, before step S102, the following steps are further included: S201, scanning the lower die base by using a scanning device to obtain a scanned image of the lower die base; S202, performing image analysis on the scanned image to obtain a deformation grade of each rib protrusion on the lower die base and a proportion of the deformed rib protrusions; If any rib protrusion undergoes grade III deformation, notify the replacement of the lower die seat; If only level II deformation occurs, and the proportion K1 of rib protrusions with level II deformation is less than or equal to the first preset proportion threshold K01, notify maintenance; if it is greater than the first preset proportion threshold K01 and less than the second preset proportion threshold K02, notify to replace the lower mold base; If only level I deformation occurs, and the proportion K2 of rib protrusions with level I deformation is less than the third preset proportion threshold K03, execute step S102; if it is greater than the third preset proportion threshold K03, notify maintenance; If both level I and level II deformation occur at the same time, and the proportion K1 of the rib protrusions that undergo level II deformation is less than or equal to the fourth preset proportion threshold K04; wherein, If the ratio K3 between the rib protrusions with grade I deformation and the rib protrusions with grade II deformation is greater than the first preset ratio threshold, step S102 is executed; If the ratio K3 between the rib protrusion with level I deformation and the rib protrusion with level II deformation is equal to the first preset ratio threshold, notify maintenance; If the ratio K3 between the rib protrusions with level I deformation and the rib protrusions with level II deformation is less than the first preset ratio threshold, a notification is given to replace the lower die base.

[0014] In some embodiments, before performing the second stamping in step S102, the following steps are further included: Scanning the aluminum plate with a scanning device to obtain a scanned image of the aluminum plate after the first stamping; Performing image analysis on the scanned image to obtain the actual height of each of the arched ribs; Determining whether the actual height of each of the arched ribs reaches the preset first height; If the proportion P1 of the arched ribs whose actual height does not reach the first height is less than a first preset threshold value, controlling the die to perform a second stamping; If the proportion P1 of the arched ribs whose actual height does not reach the first height is greater than or equal to a first preset threshold value, triggering the scanning device to scan the lower die base to obtain a scanned image of the lower die base; Performing image analysis based on the scanned image to identify whether the rib protrusion on the lower die seat is deformed, If no deformation occurs, or only level I deformation occurs, and the proportion K2 of rib protrusions with level I deformation is less than the third preset proportion threshold K03, the mold is controlled to perform a second stamping, and the deceleration gradient is reduced; If any rib protrusion undergoes grade III deformation, notify the replacement of the lower die seat; If only level II deformation occurs, and the proportion K1 of rib protrusions with level II deformation is less than or equal to the first preset proportion threshold K01, stamping is stopped and maintenance is notified; If level I deformation and level II deformation occur at the same time, and the proportion K1 of the rib protrusions with level II deformation is less than or equal to the fourth preset proportion threshold K04, where the proportion K3 of the sum of the rib protrusions with level I deformation and the rib protrusions with level II deformation is less than the third preset proportion threshold, stop stamping and notify maintenance; if it is greater than the third preset proportion threshold, notify to replace the lower die base.

[0015] The second aspect of the present invention is to provide a heat sink with shielding function for a PCB board, which is formed by stamping a 1070 / 1060 aluminum plate multiple times using the above-mentioned preparation process. The heat sink comprises: a heat sink body, at least one shielding cover arranged on the heat sink body and a shielding frame around it, The shielding frame is formed by enclosing at least one arched rib formed by stamping, and each of the arched ribs is evenly provided with a nickel-carbon adhesive strip that can contact and conduct with the exposed copper surface reserved on the bottom surface of the PCB board, and the nickel-carbon adhesive strip is cured; A nano-carbon heat dissipation coating is arranged on the outer side of the radiator.

[0016] In some embodiments, three shielding frames are respectively provided on the heat sink corresponding to the three areas to be shielded of the PCB board.

[0017] In some embodiments, the three shielding frames are independent of each other; or, the three shielding frames share one arched rib.

[0018] In some embodiments, it is characterized in that the shielding frame is surrounded by four arched ribs to form a quadrilateral frame.

[0019] In some embodiments, the shielding frame is enclosed by six of the arched ribs to form a hexagonal frame; wherein the length of the arched rib I corresponding to the top edge of the hexagonal frame is L31; the lengths of the arched rib II and the arched rib III respectively connected to the two ends of the arched rib I in the hexagonal frame are L32 and L33 respectively; the length of the arched rib IV connected to the arched rib II in the hexagonal frame is L34; the length of the arched rib V connected to the arched rib III is L35; the length of the arched rib VI whose two ends in the hexagonal frame are respectively connected to the arched rib II and the arched rib III is L36 L32≤L31<L33≤L35<L34<L36.

[0020] Beneficial effects: Aluminum is a non-magnetic material with a magnetic permeability close to that of a vacuum (μr≈1). Although aluminum has a good shielding effect for high-frequency electromagnetic waves, it has limited shielding effect for low-frequency magnetic fields (such as 50Hz power frequency interference). 1070 or 1060 aluminum plates have very good heat dissipation performance, but their elastic modulus is low, that is, they are relatively soft, and are not easy to form by die-casting process. Moreover, they are used alone as shielding cover materials, and cannot form and meet the actual shielding requirements. Even the stamping process is not easy to form, because of its low strength (tensile strength of about 60-95 MPa) and low hardness, which makes it easy to deform or tear locally during stamping, and it is difficult to maintain shape stability. However, it has good ductility (elongation of about 30-40%), and it is easy to wrinkle, dent or partially thinned when overstretched during stamping. That is, it is very easy to break and / or deform during processing. Therefore, 1070 or 1060 aluminum is usually not used in the art to make radiators or shielding covers, but aluminum alloys are more often used to make them. For example, in the prior art CN218941644U, in the process of preparing the shielding cover and the shielding cover with a heat dissipation integrated structure by die casting, the aluminum alloy is heated and melted, and then the molten aluminum alloy is injected into the mold cavity under high pressure, and then the aluminum alloy strips are extruded and solidified in the mold, and then a heat sink with heat dissipation fins is formed through post-processing. However, the heat dissipation performance of the heat sink prepared by the die casting process is low, and the cost of the die casting heat sink is high.

[0021] In view of this, the present application proposes a process for preparing a heat sink with shielding function using 1070 or 1060 aluminum. Specifically, multiple stamping methods are used, and the stamping speed is gradually reduced to gradually form arched ribs on the 1070 or 1060 aluminum plate, and a shielding frame is formed by enclosing multiple arched ribs, and a conductive glue, such as a nickel-carbon glue strip, is coated on the arched ribs, thereby preparing a heat sink that can be used to shield signals. Through multiple stamping progressive forming, the single deformation amount is reduced, thereby ensuring the forming.

[0022] Furthermore, in order to ensure the shielding performance, the mold is scanned before stamping, so as to identify whether the rib protrusions on the mold are deformed based on the scanned image. If serious deformation occurs, the mold is notified to be replaced, so as to avoid the failure to form a shielding cover with a shielding effect due to serious deformation of the rib protrusions. Furthermore, before and / or after each stamping, the arched ribs are scanned to determine whether the arched ribs formed on the aluminum plate are deformed. If deformation occurs, timely adjustments are made or the aluminum plate is prompted to be replaced (that is, the forming fails).

[0023] The heat sink of the present application can achieve a heat dissipation performance of 220W / mk in the horizontal direction and 270W / Mk in the vertical direction, which is much higher than the thermal conductivity of 90-120w / mk of the heat sink with heat dissipation fins prepared by traditional die casting. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings required for use in the embodiments or the prior art descriptions are briefly introduced below. In all the drawings, similar elements or parts are generally identified by similar reference numerals. In the drawings, each element or part is not necessarily drawn according to the actual scale. Obviously, the drawings described below are some embodiments of the present invention. For those of ordinary skill in the art, other drawings can also be obtained based on these drawings without paying creative labor.

[0025] Figure 1 A flow chart of an embodiment of a process for preparing a heat sink with shielding function for a PBC board of the present invention; Figure 2 A flow chart of an embodiment of the present invention for identifying whether the rib protrusion on the lower die base is deformed; Figure 3 A flow chart of an embodiment of the present invention for identifying whether the arched ribs formed by stamping on an aluminum plate are deformed; Figure 4 A flow chart of another embodiment of the present invention for identifying whether the arched ribs formed by stamping on the aluminum plate are deformed; Figure 5A schematic diagram of the distribution of rib protrusions on the lower die base used in the preparation process of the present invention; Figure 6 A top view of a radiator prepared by the preparation process of the present invention; Figure 7 To reflect Figure 6 A connection relationship diagram between six sides of a hexagonal shielding frame in the heat sink shown; Figure 8 To reflect Figure 6 Schematic diagram of the side of the radiator; Fig. 9 This is a photo of a heat sink prepared by the preparation process of the present invention, in which the arrows indicate the arched ribs (the surface of which is coated with conductive glue) formed by the stamping process; Fig.10 A model diagram of another radiator prepared using the preparation process of the present invention.

[0026] Summary of reference numerals: 100, lower die base, 101, shielding cover molding area, 102, rib protrusion, 200, aluminum plate, 201, shielding frame, 202, shielding cover, 201-1, arched rib. DETAILED DESCRIPTION

[0027] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0028] Herein, suffixes such as "module", "component" or "unit" used to represent elements are only used to facilitate the description of the present invention, and have no specific meanings by themselves. Therefore, "module", "component" or "unit" can be used mixedly.

[0029] In this document, the terms "upper", "lower", "inner", "outer", "front", "back", "one end", "the other end" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0030] In this document, unless otherwise clearly specified and limited, the terms "installed", "provided with", "connected", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, a direct connection, or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0031] Herein "and / or" includes any and all combinations of one or more of the associated listed items.

[0032] Herein, "plurality" means two or more than two, ie, it includes two, three, four, five, etc.

[0033] As used in this specification, the term "about" typically means + / - 5% of the stated value, more typically + / - 4% of the stated value, more typically + / - 3% of the stated value, more typically + / - 2% of the stated value, even more typically + / - 1% of the stated value, and even more typically + / - 0.5% of the stated value.

[0034] In this specification, some embodiments may be disclosed in a format of being in a range. It should be understood that this description of "being in a range" is only for convenience and brevity, and should not be interpreted as a rigid limitation on the disclosed range. Therefore, the description of the range should be considered to have specifically disclosed all possible sub-ranges and independent numerical values ​​within this range. For example, the description of the range 1-6 should be considered to have specifically disclosed sub-ranges such as from 1 to 3, from 1 to 4, from 1 to 5, from 2 to 4, from 2 to 6, from 3 to 6, etc., as well as individual numbers within this range, such as 1, 2, 3, 4, 5 and 6. Regardless of the breadth of the range, the above rules apply.

[0035] Example 1: See Figure 1 , is a flow chart of a preparation process of a heat sink with shielding function for a PCB board according to an embodiment of the present invention. Specifically, the preparation process of this embodiment includes the following steps: S101, Raw material cutting: Cut 1070 / 1060 aluminum sheet with thickness h into preset size and shape.

[0036] In some embodiments, the thickness h of the 1070 / 1060 aluminum plate is 2.0 MM-2.5 MM.

[0037] In some embodiments, the aluminum plate may also be an aluminum strip.

[0038] S102, stamping: using a stamping die to stamp the cut 1070 / 1060 aluminum plate multiple times to form a plate-type heat sink with multiple shielding cavities.

[0039] In some embodiments, each time the stamping is performed, the upper die seat and the lower die seat of the stamping die are completely closed, and the next stamping is performed after the preset saturation time threshold is reached; the preset saturation time threshold is 2-3s. Saturation is used to prevent the aluminum plate from rebounding and causing deformation after high-speed stamping.

[0040] In some embodiments, the die gap H=8%-12%h, preferably 8%; the punching speed v is 20-30 times / min; and the punching force is 200 tons-220 tons, preferably 200 tons.

[0041] In some embodiments, a plurality of shielding cover molding areas 101 are provided on the lower mold base 100, and the edge of each shielding cover molding area 101 is surrounded by a plurality of rib protrusions 102, and a punching groove that can cooperate with the rib protrusion 102 is provided at the bottom of the upper mold base corresponding to each of the rib protrusions 102; After the upper die base performs the first stamping on the lower die base, a plurality of arched ribs of a first height are formed on the aluminum plate 200 under the action of the rib protrusions 102; After the upper die base performs the second stamping toward the lower die base, under the action of the rib protrusion 102, the height of the arched rib changes from the first height to the second height; the second height is greater than the first height, and the stamping is repeated multiple times until the height of the arched rib reaches the target height, so that the plurality of arched ribs enclose a shielding frame 201 integrally formed with the aluminum plate 200, and a shielding cover 202 corresponding to the shielding cover molding area is integrally formed in the shielding frame 201.

[0042] Due to the low strength (tensile strength of about 60-95 MPa) and low hardness of 1070 aluminum, it is easy to deform or tear locally during stamping, and it is difficult to maintain shape stability; and its high plasticity will cause the material to be overstretched during stamping, and it is easy to become thinner and cause tearing or breaking. Therefore, in this embodiment, multiple stamping methods are used to gradually form, that is, by controlling the stamping speed to control the amount of arching formed each time to avoid or reduce the risk of fracture, thereby ensuring the forming of the arched ribs.

[0043] Preferably, step S102 is performed by stamping three times, and the stamping is performed by a gradient deceleration method during the three stamping processes, specifically, the steps include: S1021, during the first punching, punching is performed at the first punching speed V1, and saturation pressing is performed for 2-3s after punching; wherein V1=200 mm / s.

[0044] S1022, during the second stamping, stamping is performed at a second stamping speed V2, and saturation pressing is performed for 2-3 seconds after stamping; wherein V2=150 mm / s.

[0045] S1023, during the third stamping, stamping is performed at a third stamping speed V3, and after saturation for 2-3 seconds after stamping, the upper die base is controlled to leave the lower die base at a preset return speed; wherein V3=100 mm / s.

[0046] In other embodiments, when the number of stamping times is greater than 3, stamping is performed in a gradient deceleration manner, and the deceleration gradient α of each stamping can be determined by the following formula: ; Wherein, N is the number of stamping times, t is the actual material thickness of 1070 / 1060 aluminum plate; t0 is the reference material thickness of 1070 / 1060 aluminum plate, which is 2mm; α0 is the initial deceleration gradient, which is an empirical value; kN is the attenuation coefficient of 1070 / 1060 aluminum plate and mold; kt is the sensitivity of 1070 / 1060 aluminum plate thickness to the deceleration gradient.

[0047] S103, Trimming: Remove excess burrs to ensure smooth edges of products.

[0048] S104, nano-carbon heat dissipation spraying: spraying a nano-carbon heat dissipation coating on the outer side of the radiator.

[0049] S105, uniformly arranging nickel-carbon adhesive strips on the arched ribs for contacting and conducting with the exposed copper surface reserved on the bottom surface of the PCB board, and then heating and curing the strips, so that when the heat sink is mounted on the PCB board, a closed shielding cavity is formed between the shielding cover and the bottom plate of the PCB board.

[0050] In some embodiments, in addition to the nickel-carbon rubber strips, other conductive rubber strips may also be provided on the arched ribs.

[0051] Preferably, the highest temperature zone during the gradual heating process of the nickel-carbon rubber strip is 150° C., and heating is carried out in the highest temperature zone for 30 min.

[0052] In this embodiment, the aluminum plate is stamped by multiple stamping processes, and full stamping is performed after each stamping, while a gradient decreasing method is adopted to avoid the problem that the arched ribs formed during the stamping process are easy to break due to the soft aluminum plate, or the rebound after stamping causes difficulty in forming or deformation.

[0053] Embodiment 2: Since 1070 aluminum and 1060 aluminum are very soft, the rib protrusions are mainly used to stamp on the aluminum plate multiple times during the stamping process to form slender arched ribs with an N-shaped cross section. Therefore, whether the rib protrusions are deformed is the key to whether the arched ribs are successfully formed. Therefore, in order to ensure that the arched ribs do not break or deform during the forming process (for example, the length or thickness deviation of the two sides of the arch is large), the rib protrusions on the lower die base are also identified before stamping to determine whether they are deformed.

[0054] Usually, if a large deformation occurs, such as a break or a large defect, or the axial direction of the rib protrusion is tilted (that is, the axial direction of the protrusion is not perpendicular to the upper surface of the lower die seat) at a large angle, it can be identified by the naked eye. In this case, the mold will be replaced or maintenance will be performed before stamping. However, maintenance is not real-time, but periodic, and manual operations are always overlooked. In addition, since the height of the arched ribs formed on the aluminum plate is not high, the rib protrusion on the mold is not high accordingly. Therefore, if there is no large tilt in the axial direction, for example, the angle between the axial direction of the protrusion and the direction perpendicular to the upper surface of the lower die seat is less than 10° (that is, compared with the direction perpendicular to the upper surface of the lower die seat, the axis of the rib protrusion has a slight tilt), then this deformation is usually difficult for the naked eye to quickly and at a glance identify. In addition, since the shielding frame is formed by multiple arched ribs, if a single arched rib is deformed, it may affect the two arched ribs connected to it. Therefore, in order to ensure the molding of a single arched rib and at the same time to ensure the molding of the shielding frame formed by multiple arched ribs connected and enclosed, the present invention also provides another preparation process, which scans the lower die base with the help of a scanning device before stamping, so as to obtain a scanned image including the protrusions of each rib on the lower die base, and then quickly identify whether the rib protrusion on the lower die base is deformed based on the scanned image.

[0055] Specifically, this embodiment includes the steps in the above-mentioned embodiment 1, except that the preparation process of this embodiment further includes the following steps before step S102: S201, scanning the lower die base by using a scanning device to obtain a scanned image of the lower die base; S202, performing image analysis on the scanned image to obtain a deformation grade of each rib protrusion on the lower die base and a proportion of the deformed rib protrusions; If any rib protrusion undergoes grade III deformation, notify the replacement of the lower die seat; If only level II deformation occurs, and the proportion K1 of rib protrusions with level II deformation is less than or equal to the first preset proportion threshold K01, notify maintenance; if it is greater than the first preset proportion threshold K01 and less than the second preset proportion threshold K02, notify to replace the lower mold base; If only level I deformation occurs, and the proportion K2 of rib protrusions with level I deformation is less than the third preset proportion threshold K03, execute step S102; if it is greater than the third preset proportion threshold K03, notify maintenance; If both level I and level II deformation occur at the same time, and the proportion K1 of the rib protrusions that undergo level II deformation is less than or equal to the fourth preset proportion threshold K04, K04<K01; wherein, If the ratio K3 between the rib protrusions with grade I deformation and the rib protrusions with grade II deformation is greater than the first preset ratio threshold, step S102 is executed; If the ratio K3 between the rib protrusion with level I deformation and the rib protrusion with level II deformation is equal to the first preset ratio threshold, notify maintenance; If the ratio K3 between the rib protrusions with level I deformation and the rib protrusions with level II deformation is less than the first preset ratio threshold, a notification is given to replace the lower die base.

[0056] In some embodiments, the control module in the stamping process control system can scan the device for data communication, and the control module can perform image analysis on the scanned image to obtain the analysis results, and display the corresponding notifications through a display screen, etc., or send the above-mentioned various notifications to a user terminal of a pre-associated user, such as a mobile terminal.

[0057] In this embodiment, the deformation of the rib protrusion refers to the axial deviation of the rib protrusion, or the occurrence of fractures, defects, etc. Among them, the occurrence of fractures or defects, or the axial deviation angle of the rib protrusion is greater than 10° (that is, the angle between the axial direction of the rib protrusion and the direction perpendicular to the upper surface of the lower die seat is greater than 10°) is a level III deformation, which is also the most serious deformation. Once the level III deformation occurs, the arched ribs formed during the stamping process are prone to fracture or defects, etc., resulting in the failure to form a shielding frame with a shielding effect. Therefore, once this situation is detected, it is necessary to remind the mold to be replaced. If the axial deviation angle of the rib protrusion is greater than 2°, but less than 10°, it is a level II deformation. During the stamping process, even if a small part of the level II deformation occurs, since the arched ribs are not formed alone, but require multiple arched ribs to enclose to form a shielding frame, therefore, as long as one has a level II deformation, it may cause the shielding frame to fail to form, or fail to fit well with the PCB board, and thus fail to perform shielding well. However, if only a small number of grade II deformations occur, maintenance can be performed to immediately correct the rib protrusions. If a large number of grade II deformations occur, the maintenance cost is high, and even if maintenance is performed, it cannot be guaranteed that all rib protrusions can be well reset. Therefore, if only a small number of rib protrusions occur (for example, only one grade II deformation occurs around each shielding cover molding area, or only one grade II deformation occurs around some shielding cover molding areas, and the others do not; or a rib protrusion shared by two shielding cover molding areas has grade II deformation), maintenance is notified, and once a large proportion of rib protrusions with grade II deformation are found (for example, at least two grade II deformations occur around each shielding cover molding area, or two connected / adjacent grade II deformations occur around some shielding cover molding areas; or a rib protrusion shared by two shielding cover molding areas has grade II deformation), replacement is notified. If the axial offset angle of the rib protrusion is greater than 0° but less than 2°, it is a grade I deformation. During the stamping process, if a small amount of level I deformation occurs (for example, only one level I deformation occurs around one or part of the shielding cover molding area), it can be corrected under the combined effect of the gradient decreasing stamping method and the notching, as well as the subsequent process (such as trimming and positioning at the same time). Therefore, stamping can be carried out directly. However, if a large number of level I deformation occurs (for example, at least two level I deformations occur around each shielding cover molding area, or there are two connected / adjacent level I deformations around part of the shielding cover molding area; or a rib protrusion shared by two shielding cover molding areas has a level I deformation), it is necessary to notify maintenance or even directly replace the mold.

[0058] Of course, in this embodiment, monitoring is not only performed a few minutes before stamping, but also periodic detection can be performed to predict the deformation trend based on the monitoring results, and then maintenance can be performed in advance to extend the service life of the mold. For example, by periodically monitoring and analyzing the monitoring results (such as scanned images), for example, a circumferential offset angle change trend curve of the rib protrusion is drawn with the monitoring time as the horizontal coordinate and the offset angle as the vertical coordinate. If it is found that the offset angle has a tendency to increase (for example, when the offset is large and is about to reach 2°), a maintenance notice is issued.

[0059] Embodiment 3: The present invention also provides another preparation process, which uses a scanning device to scan the lower mold before stamping, so as to obtain a scanned image including each rib protrusion on the lower mold, and then quickly identify whether the rib protrusion on the lower mold is deformed according to the scanned image. Specifically, it includes the steps in the above embodiment 1, except that Figure 2 The preparation process of this embodiment further includes the following steps before step S102: S201, scanning the lower die base by using a scanning device to obtain a scanned image of the lower die base.

[0060] In some embodiments, the scanning device may be a high-definition camera device. Of course, other scanning devices may also be used, such as an infrared scanning device or a laser scanning device. Of course, in order to reduce costs, a high-definition camera or an infrared scanning device is preferred.

[0061] S202, performing image analysis on the scanned image to obtain the deformation level of each rib protrusion on the lower die base, if any rib protrusion has a level III deformation, executing step S203; if no rib protrusion has a level III deformation, but at least one rib protrusion around any shielding cover molding area has a deformation, executing step S204 or S205. Of course, if no rib protrusion has a deformation, executing step S102.

[0062] In this embodiment, the deformation of the rib protrusion refers to the axial displacement of the rib protrusion, or the occurrence of fractures, defects, etc. Among them, the occurrence of fractures or defects, and the axial displacement angle of the rib protrusion is greater than 10° (that is, the angle between the axial direction of the rib protrusion and the direction perpendicular to the upper surface of the lower die seat is greater than 10°) is a grade III deformation, which is the most serious deformation. If the axial displacement angle of the rib protrusion is greater than 2° but less than 10°, it is a grade II deformation. If the axial displacement angle of the rib protrusion is greater than 0° but less than 2°, it is a grade I deformation.

[0063] S203, notify to replace the lower die base.

[0064] If the rib protrusion is broken or defective, then part of the final arched rib will not reach the required height, so when the shielding frame is installed on the PCB, there will be a leakage window, that is, the arched rib is also defective and does not meet the requirements. Therefore, the mold must be replaced in this case.

[0065] If the rib protrusion axial offset angle is greater than 10°, there will be cracks or disconnections between the two adjacent rib protrusions, making it impossible to form a closed shielding frame with multiple arched ribs connected end to end. In addition, the arched ribs formed by the modified rib protrusions will make the length and thickness of the two sides of the n-shaped arched ribs uneven after multiple stampings, and even one side or the part between the two sides may be broken due to being too thin or insufficient aluminum supplementation during the stamping process.

[0066] S204: If two connected rib protrusions are deformed, and one of the rib protrusions is a grade II deformation, or both are grade I deformations, notify maintenance or mold replacement.

[0067] Since each shielding frame is formed by a plurality of arched ribs enclosed around the shielding cover, if two rib protrusions connected around any shielding cover molding area are deformed, and one of them is a grade II deformation, then during the stamping process, not only the corresponding arched ribs will be deformed accordingly, but the arched ribs connected to these two connected arched ribs may also be slightly deformed, such as grade I deformation, so that the finally formed shielding frame may not be able to fit the PCB board very well, thereby reducing the shielding effect. Therefore, it is necessary to notify the mold to be replaced. Similarly, if two connected rib protrusions are deformed to grade I, then during the stamping process, not only the corresponding arched ribs will be deformed accordingly, but the arched ribs connected to these two connected arched ribs may also be slightly deformed. Therefore, it is necessary to notify for maintenance.

[0068] Of course, if none of the rib protrusions undergo Level III deformation, but at least two rib protrusions around any shielding cover molding area undergo deformation, and the two are not connected, although the two deformed ones are detected to be not connected, as mentioned above, since multiple arched ribs are connected, even if the two deformed rib protrusions have not been deformed, during the stamping process, in addition to the arched ribs corresponding to the two rib protrusions, the ribs connected to the two arched ribs will also be deformed. Therefore, when at least two unconnected rib protrusions are detected to be deformed, the mold replacement will be directly notified.

[0069] S205, if only one rib protrusion undergoes I deformation, the rib protrusion is recorded so that when the conductive adhesive is subsequently applied, the amount of conductive adhesive on the corresponding arched rib is adjusted, and step S102 is executed.

[0070] If only one of the multiple rib protrusions in the same shielding cover molding area has an axial offset angle of less than 2°, the length and thickness of the two sides of the n-shaped arched rib formed after multiple stamping may also be uneven, but since the height of the arched rib is not high, the difference between the two sides is not large, so it will not break, and the formed arched rib has sufficient strength. However, it will affect other arched ribs, especially the two arched ribs connected to it, so it is necessary to mark them, so that in the subsequent step of applying conductive glue, more conductive glue can be applied to the corresponding arched rib and the arched ribs connected to it, so as to easily compensate for the error caused by the axial offset of the arched rib.

[0071] However, if there are multiple rib protrusions that are deformed in the same shielding cover molding area, and one of them is a level II deformation, although it can be compensated to a certain extent by coating conductive glue, this will increase the workload. In addition, once multiple rib protrusions are deformed at the same time (especially at least two connected rib protrusions are deformed), the probability of the arched ribs breaking or deforming will greatly increase during multiple stamping processes, and the stability and shielding performance of the shielding frame finally formed will not be guaranteed. Therefore, either the mold must be replaced or maintenance must be performed (to reduce the axial offset angle).

[0072] Embodiment 4: The present invention also provides another preparation process, which includes the steps in Embodiment 2, except that, in this embodiment, when stamping three times, before the second stamping in step S102, it also includes the following steps: Scanning the aluminum plate with a scanning device to obtain a scanned image of the aluminum plate after the first stamping; Performing image analysis on the scanned image to obtain the actual height of each of the arched ribs; Determine whether the actual height of each of the arched ribs reaches the preset first height; (preferably, the actual height reaching the first height means that the difference between the two is less than a preset difference threshold) If the proportion P1 of the arched ribs whose actual height does not reach the first height is less than a first preset threshold value, controlling the die to perform a second stamping; If the proportion P1 of the arched ribs whose actual height does not reach the first height is greater than or equal to a first preset threshold value, triggering the scanning device to scan the lower die base to obtain a scanned image of the lower die base; Performing image analysis based on the scanned image to identify whether the rib protrusion on the lower die seat is deformed, If no deformation occurs, or only level I deformation occurs, and the proportion K2 of rib protrusions with level I deformation is less than the third preset proportion threshold K03, the mold is controlled to perform a second stamping, and the deceleration gradient is reduced; If any rib protrusion undergoes grade III deformation, notify the replacement of the lower die seat; If only level II deformation occurs, and the proportion K1 of rib protrusions with level II deformation is less than or equal to the first preset proportion threshold K01, stamping is stopped and maintenance is notified; If level I deformation and level II deformation occur at the same time, and the proportion K1 of the rib protrusions with level II deformation is less than or equal to the fourth preset proportion threshold K04, where the proportion K3 of the sum of the rib protrusions with level I deformation and the rib protrusions with level II deformation is less than the third preset proportion threshold, stop stamping and notify maintenance; if it is greater than the third preset proportion threshold, notify to replace the lower die base.

[0073] Since three stampings are used and the speed of the first stamping is the highest, the height of the arched ribs formed by the first stamping is the most obvious. Therefore, once it is monitored that the arched ribs obtained after the first stamping do not meet expectations (for example, the proportion P1 of the arched ribs whose actual height does not reach the first height is greater than or equal to the first preset non-standard threshold), it means that the rib protrusions on the lower die seat may have been deformed, resulting in failure to meet expectations. Therefore, if the lower die is not inspected before stamping, the lower die seat can be inspected after the first stamping. This is suitable for scenarios where daily maintenance of the lower die is in place. Of course, inspections can also be performed before and after the first stamping. After the first stamping, the aluminum plate can be removed using a flat plate tool, and then scanned and inspected.

[0074] Embodiment 5: The present invention also provides another preparation process, which includes the steps in Embodiment 2, except that, in this embodiment, when stamping three times, after the first stamping in step S102, it also includes the following steps: S301, scanning the aluminum plate with a scanning device to obtain a scanned image of the aluminum plate after the first stamping.

[0075] As mentioned above, since the cost of replacing the mold is very high, even if some rib protrusions are deformed, maintenance or subsequent processes can be used to compensate or correct them, rather than directly replacing the mold. Therefore, in order to ensure the molding of the shielding frame (for example, multiple arched ribs are connected end to end and will not be disconnected from each other, and can play a shielding role when installed on the PCB board), in this embodiment, it is necessary to determine whether the arched ribs after stamping are deformed.

[0076] Since 1070 aluminum or 1060 aluminum is relatively soft, and some rib protrusions may have level I or level II deformation, each stamping may cause the currently formed arched ribs to be deformed. Therefore, a scan can be performed after each stamping to determine whether the arched ribs are deformed. Once it is determined that a deformation has occurred, a corresponding prompt or notification will be immediately given. However, if a judgment is made every time, the data processing volume of the system will inevitably increase, thereby increasing the power consumption and cost of the system. In addition, since the height of the arched ribs is not high, the speed of the subsequent two stampings is gradually reduced. Therefore, only after the first stamping, the change of the arched ribs is obvious, and the change of the arched ribs after the next two stampings is not obvious. Therefore, preferably, the detection is only performed after the initial shape is obtained after the first stamping. Of course, it can also be detected after the last stamping, but the detection after the first stamping can find problems earlier. Of course, it is also possible to perform detection after the first stamping and the last stamping, so that the product grade or defective product screening can be performed on the final product.

[0077] S302, performing image analysis on the scanned image to determine whether the arched ribs on the aluminum plate are deformed. If no deformation occurs, execute step S303; if only level I deformation occurs, execute step S304; if any arched rib undergoes level III deformation, execute step S305; if only level II deformation occurs, and the proportion K1 of the arched ribs undergoing level II deformation is greater than the first preset proportion threshold K01, execute step S306; if level I deformation and level II deformation occur at the same time, wherein the proportion K3 of the sum of the arched ribs undergoing level I deformation and the arched ribs undergoing level II deformation is less than the third preset proportion threshold, execute step S306; if it is greater than the third preset proportion threshold, execute step S305.

[0078] S303, perform the next stamping. Of course, if no deformation occurs, the next stamping can be performed directly.

[0079] S304, reduce the deceleration gradient, and execute step S303.

[0080] S305, stop stamping and notify to replace the aluminum plate. If any arched rib has a grade III deformation, the deformation will inevitably be further increased in the subsequent stamping process. Therefore, the aluminum plate is directly replaced, that is, defective product screening is performed in advance.

[0081] S306, stop stamping and perform manual inspection.

[0082] In this embodiment, if the scanning image analysis shows that the rib protrusions on the lower die base have not been deformed before stamping, or if the scanning image analysis shows that the arched ribs obtained by the first stamping have been deformed after maintenance or after replacing the die, then it is very likely that the stamping speed is inappropriate, resulting in the deformation of the arched ribs. Therefore, image scanning is used to identify whether deformation has occurred. If slight deformation occurs, it can be adjusted by adjusting the stamping speed. If the deformation is more serious, the aluminum plate needs to be discarded, that is, defective product screening is performed in advance.

[0083] Embodiment 4: The present invention also provides another preparation process, which includes the steps in each embodiment, except that, in this embodiment, if the number of stamping times is greater than 3, before the last two stampings are performed in step S102, the following steps are further included: S401, scanning the aluminum plate with a scanning device to obtain a scanned image of the aluminum plate after the last stamping.

[0084] S402: Perform image analysis on the scanned image to obtain an actual height of each of the arched ribs.

[0085] S403, determine whether the actual height of each of the arched ribs reaches the preset height threshold corresponding to the current stamping; if the proportion P1 of the arched ribs whose actual height reaches the corresponding preset height threshold is greater than or equal to the first preset threshold, execute step S404; if the proportion P1 of the arched ribs whose actual height reaches the corresponding preset height threshold is less than the first preset threshold, and step S205 determines that the rib protrusion in the lower die base undergoes level I deformation or level II deformation, execute step S405.

[0086] S404, controlling the mold to perform the next stamping; S405, performing image analysis based on the scanned image in step S401 to identify whether the arched ribs on the aluminum plate are deformed. If no deformation occurs, execute step S404; if only level I deformation occurs, execute step S406; if any arched rib undergoes level III deformation, execute step S407; if only level II deformation occurs, and the proportion K1 of rib protrusions with level II deformation is greater than the first preset proportion threshold K01, execute step S408; if level I deformation and level II deformation occur at the same time, wherein the proportion K3 of the sum of the arched ribs with level I deformation and the arched ribs with level II deformation is less than the third preset proportion threshold, execute step S408; if it is greater than the third preset proportion threshold, execute step S407.

[0087] S406, reduce the deceleration gradient and execute step S404.

[0088] S407, stop stamping and notify to replace the aluminum plate.

[0089] S408, stop stamping and notify manual inspection.

[0090] Since 1070 aluminum or 1060 aluminum is relatively soft, and some rib protrusions in the lower die seat are slightly deformed, if scanning and identification are performed each time, the data processing volume of the system will increase, thereby increasing the system power consumption. In addition, since the stamping is performed more than three times, the actual change after each stamping is very small, so that after each stamping, the currently formed arched ribs may be deformed. Therefore, scanning is performed before each stamping, and corresponding identification and judgment are performed to ensure the forming of the arched ribs.

[0091] Of course, in other embodiments, before performing deformation identification, it is determined whether the actual height reaches the expected height. If the proportion P1 of the arched ribs whose actual height does not reach the first height is less than the first preset non-standard threshold, then identification of whether the arched ribs are deformed is performed.

[0092] Embodiment 6: Based on the preparation process in any of the above embodiments, the present invention also provides a heat sink with shielding function for a PCB board, which is described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0093] See also Figure 6 The heat sink of this embodiment includes: a heat sink body 200, at least one shielding cover 202 arranged on the heat sink body 200 and a shielding frame 201 around it, and a nano-carbon heat dissipation coating is arranged on the outer side of the heat sink body 200 (the side away from the PCB and the chip on the PCB board).

[0094] In some embodiments, the shielding frame 201 is formed by enclosing at least one arched rib 201-1 formed by stamping, and each arched rib 201-1 is evenly provided with a nickel-carbon adhesive strip that can contact and conduct with the exposed copper surface reserved on the bottom surface of the PCB board, and the nickel-carbon adhesive strip is cured.

[0095] Preferably, see Figure 6 , three shielding frames 201 are respectively arranged on the heat sink body 200 corresponding to three areas to be shielded of the circuit board, such as the PCB board. Among them, two shielding frames 201 are enclosed by four arched ribs 201-1 to form a quadrilateral frame, for example, a rectangular shielding frame. Another shielding frame 201 is enclosed by six arched ribs 201-1 to form a hexagonal frame.

[0096] like Figure 6-Figure 9 As shown, corresponding to chips of different sizes, the sizes of the two quadrilateral frames are also different. Similarly, corresponding to irregular chips or irregularly shaped areas to be cooled, the lengths of the six sides of the hexagonal frame are also different. Figure 2, the length of the arched rib I corresponding to the top side in the hexagonal frame is L31; the lengths of the arched ribs II and III respectively connected to the two ends of the arched rib I in the hexagonal frame are L32 and L33 respectively; the length of the arched rib IV connected to the arched rib II in the hexagonal frame is L34; the length of the arched rib V connected to the arched rib III is L35; the length of the arched rib VI whose two ends are respectively connected to the arched rib II and the arched rib III in the hexagonal frame is L36; L32≤L31<L33≤L35<L34<L36, see Figure 7 and Fig. 9 .

[0097] In other embodiments, see Fig.10 , three shielding frames 201 are respectively arranged on the heat sink body 200 corresponding to the three shielding areas of the circuit board, such as the PCB board, and the three shielding frames 201 are all surrounded by four arched ribs 201-1 to form a quadrilateral frame. Two of them are rectangular shielding frames; the other is a special-shaped quadrilateral frame. In addition, the three shielding frames 201 share one arched rib.

[0098] It should be noted that, in this article, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "comprises a ..." does not exclude the existence of other identical elements in the process, method, article or device including the element.

[0099] Through the description of the above implementation methods, those skilled in the art can clearly understand that the above-mentioned embodiment methods can be implemented by means of software plus a necessary general hardware platform, and of course by hardware, but in many cases the former is a better implementation method. Based on such an understanding, the technical solution of the present invention, in essence, or the part that contributes to the prior art, can be embodied in the form of a software product, which is stored in a storage medium (such as ROM / RAM, a magnetic disk, or an optical disk), and includes a number of instructions for a computer terminal (which can be a mobile phone, a computer, a server, or a network device, etc.) to execute the methods described in each embodiment of the present invention.

[0100] The embodiments of the present invention are described above in conjunction with the accompanying drawings, but the present invention is not limited to the above-mentioned specific implementation modes, which are merely illustrative rather than restrictive. Under the guidance of the present invention, ordinary technicians in this field can also make many forms without departing from the scope of protection of the present invention and the claims, all of which are within the protection of the present invention.

Claims

1. A process for preparing a heat sink with shielding function for a PCB board, characterized in that: Includes steps: S101, raw material cutting: cutting 1070 / 1060 aluminum plate with thickness h into preset size and shape; S102, stamping forming: using a stamping die to stamp the 1070 / 1060 aluminum plate multiple times to form a plate-type heat sink with multiple shielding cavities; wherein the stamping speed v is 20-30 times / min; the stamping force is 200 tons; and each stamping is performed so that the upper die seat and the lower die seat of the stamping die are fully closed, and the next stamping is performed until the preset saturation time threshold is reached; the preset saturation time threshold is 2-3s; S103, trimming: remove excess burrs to ensure smooth edges of products; S104, nano-carbon heat dissipation spraying: spraying a nano-carbon heat dissipation coating on the outer side of the heat sink; S105, uniformly arranging nickel-carbon rubber strips on the arched ribs for contacting and conducting with the exposed copper surface reserved on the bottom surface of the PCB board, and then heating to solidify the strips, so that when the plate-type heat sink is mounted on the PCB board, a closed shielding cavity is formed between the shielding cavity and the bottom surface of the PCB board; wherein the heating is performed so that the highest temperature zone during the curing process of the nickel-carbon rubber strips is 150° C., and the strips are heated in the highest temperature zone for 30 minutes; Wherein, the lower die base is provided with a plurality of shielding cover forming areas, the edge of each shielding cover forming area is surrounded by a plurality of rib protrusions, and the bottom of the upper die base is provided with a punching groove corresponding to each rib protrusion that can cooperate with the rib protrusion; After the upper die base performs the first stamping on the lower die base, a plurality of arched ribs of a first height are formed on the aluminum plate under the action of the rib protrusions; After the upper die base is stamped toward the lower die base for the second time, under the action of the rib protrusion, the height of the arched rib changes from the first height to the second height; the second height is greater than the first height, and the stamping is repeated multiple times until the height of the arched rib reaches a preset height, so that a shielding cover is formed integrally at the position corresponding to each shielding cover molding area on the aluminum plate, and the multiple arched ribs enclosed around the shielding cover form a shielding frame integrally formed with the aluminum plate.

2. The process for preparing a heat sink with shielding function for a PCB board according to claim 1, characterized in that: The thickness h of the aluminum plate is 2.0 MM-2.5 MM.

3. The process for preparing a heat sink with shielding function for a PCB board according to claim 1, characterized in that: In step S102, stamping is performed three times, and stamping is performed in a gradient deceleration manner during the three stamping processes. Specifically, the steps include: S1021, during the first punching, punching is performed at a first punching speed V1, and saturation is performed for 2 s -3 s after punching; wherein V1=200 mm / s; S1022, during the second punching, punching is performed at a second punching speed V2, and saturation pressing is performed for 2 s -3 s after punching; wherein V2 = 150 mm / s; S1023, during the third stamping, stamping is performed at a third stamping speed V3, and after saturation for 2 s to 3 s after stamping, the upper die seat is controlled to leave the lower die seat at a preset return speed; wherein V3=100 mm / s.

4. The process for preparing a heat sink with shielding function for a PCB board according to claim 1, characterized in that: When stamping is performed multiple times in step S102, stamping is performed in a gradient deceleration manner, and the deceleration gradient α can be determined by the following formula: ； Where N is the number of stamping times, t is the actual material thickness of 1070 / 1060 aluminum plate; t0 is the reference material thickness of 1070 / 1060 aluminum plate, which is 2 mm; α0 is the initial deceleration gradient, which is an empirical value; k N is the attenuation coefficient of 1070 / 1060 aluminum plate and mold; k t The sensitivity of 1070 / 1060 aluminum plate thickness to the deceleration gradient.

5. A process for preparing a heat sink with shielding function for a PCB board according to any one of claims 1 to 4, characterized in that: Before step S102, the method further includes the following steps: S201, scanning the lower die base by using a scanning device to obtain a scanned image of the lower die base; S202, performing image analysis on the scanned image to obtain a deformation grade of each rib protrusion on the lower die base and a proportion of the deformed rib protrusions; If any rib protrusion undergoes grade III deformation, notify the replacement of the lower die seat; If only level II deformation occurs, and the proportion K1 of rib protrusions with level II deformation is less than or equal to the first preset proportion threshold K01, notify maintenance; if it is greater than the first preset proportion threshold K01 and less than the second preset proportion threshold K02, notify to replace the lower mold base; If only level I deformation occurs, and the proportion K2 of rib protrusions with level I deformation is less than the third preset proportion threshold K03, execute step S102; if it is greater than the third preset proportion threshold K03, notify maintenance; If both level I and level II deformation occur at the same time, and the proportion K1 of the rib protrusions that undergo level II deformation is less than or equal to the fourth preset proportion threshold K04, K04<K01; wherein, If the ratio K3 between the rib protrusions with level I deformation and the rib protrusions with level II deformation is greater than the first preset ratio threshold, step S102 is executed; If the ratio K3 between the rib protrusion with level I deformation and the rib protrusion with level II deformation is equal to the first preset ratio threshold, notify maintenance; If the ratio K3 between the rib protrusions with level I deformation and the rib protrusions with level II deformation is less than the first preset ratio threshold, a notification is given to replace the lower die base.

6. The process for preparing a shielding cover with heat dissipation function for a PCB board according to claim 4 or 5, characterized in that: Before the second stamping in step S102, the following steps are also included: Scanning the aluminum plate with a scanning device to obtain a scanned image of the aluminum plate after the first stamping; Performing image analysis on the scanned image to obtain the actual height of each of the arched ribs; Determining whether the actual height of each of the arched ribs reaches the preset first height; If the proportion P1 of the arched ribs whose actual height does not reach the first height is less than a first preset threshold value, controlling the die to perform a second stamping; If the proportion P1 of the arched ribs whose actual height does not reach the first height is greater than or equal to a first preset threshold value, triggering the scanning device to scan the lower die base to obtain a scanned image of the lower die base; Performing image analysis based on the scanned image to identify whether the rib protrusion on the lower die seat is deformed, If no deformation occurs, or only level I deformation occurs, and the proportion K2 of rib protrusions with level I deformation is less than the third preset proportion threshold K03, the mold is controlled to perform a second stamping, and the deceleration gradient is reduced; If any rib protrusion undergoes grade III deformation, notify the replacement of the lower die seat; If only level II deformation occurs, and the proportion K1 of rib protrusions with level II deformation is less than or equal to the first preset proportion threshold K01, stamping is stopped and maintenance is notified; If level I deformation and level II deformation occur at the same time, and the proportion K1 of the rib protrusions with level II deformation is less than or equal to the fourth preset proportion threshold K04, where the proportion K3 of the sum of the rib protrusions with level I deformation and the rib protrusions with level II deformation is less than the third preset proportion threshold, stop stamping and notify maintenance; if it is greater than the third preset proportion threshold, notify to replace the lower die base.

7. A heat sink with shielding function for a PCB board, characterized in that: The heat sink is formed by stamping 1070 / 1060 aluminum plate multiple times using any preparation process in claims 1 to 6, and the heat sink comprises: a heat sink body, at least one shielding cover arranged on the heat sink body and a shielding frame around it, The shielding frame is formed by enclosing at least one arched rib formed by stamping, and each of the arched ribs is evenly provided with a nickel-carbon adhesive strip that can contact and conduct with the exposed copper surface reserved on the bottom surface of the PCB board, and the nickel-carbon adhesive strip is cured; A nano-carbon heat dissipation coating is arranged on the outer side of the radiator.

8. The heat sink with shielding function for PCB board according to claim 7, characterized in that: The three shielding frames are respectively arranged on the heat sink corresponding to the three areas to be shielded of the PCB board.

9. The heat sink with shielding function for PCB board according to claim 7, characterized in that: The shielding frame is surrounded by four arched ribs to form a quadrilateral frame.

10. The heat sink with shielding function for PCB board according to claim 7, characterized in that: The shielding frame is surrounded by six arched ribs to form a hexagonal frame; wherein, the length of the arched rib I corresponding to the top edge of the hexagonal frame is L31; the lengths of the arched rib II and the arched rib III respectively connected to the two ends of the arched rib I in the hexagonal frame are L32 and L33 respectively; the length of the arched rib IV connected to the arched rib II in the hexagonal frame is L34; the length of the arched rib V connected to the arched rib III is L35; the length of the arched rib VI whose two ends in the hexagonal frame are respectively connected to the arched rib II and the arched rib III is L36 L32≤L31<L33≤L35<L34<L36.

Images