Laser processing apparatus and laser processing system

Abstract

The invention discloses a laser processing device and a laser processing system, and the laser processing device comprises a laser device which is used for emitting a single laser beam; and the electro-optical modulator is arranged on an emergent light path of the laser, the electro-optical modulator is used for splitting the single laser beam to form M split light beams with different energies, and M is greater than 1. According to the method, the single laser beam can be split through the electro-optical modulator, the diffraction efficiency of the electro-optical modulator is high, the uniformity of the split light beam is high, the situation that the machining quality of the hole pattern is affected due to the fact that the split light beam is large is avoided, the electro-optical modulator is low in cost and high in light splitting efficiency, and waste energy of the laser beam is little.

Description

Technical Field

[0001] The present invention relates to the technical field of laser processing systems, and in particular to a laser processing device and a laser processing system. Background Art

[0002] In the related art, the existing laser processing device splits a single laser beam into multiple light paths by using the switching characteristics of an acousto-optic modulator. However, the switching speed and insertion loss of the acousto-optic modulator affect each other. A faster switching speed will bring about a greater loss. Especially in the field of laser drilling, the elliptical diffraction light generated by the acousto-optic modulator is large, which affects the processing quality of the hole shape. In addition, the cost of the acousto-optic modulator is very high. Alternatively, the laser beam is spatially dispersed and phase-modulated by the diffraction principle of the diffraction optical element to split the single laser beam into multiple light paths. However, due to the diffraction optical element, the laser beam is phase-modulated in the space. Due to the limitation of the principle, the efficiency of a dual-beam splitting element can generally reach 80%, which results in a large amount of laser energy being wasted, and the cost of diffraction optical elements is expensive; alternatively, a single laser beam can be split into multiple light paths through a spatial light modulator. However, the spatial light modulator is regulated by changing the voltage to change the morphology of liquid crystal molecules, which requires a certain transition time and software calculation time, so its splitting speed is extremely slow, and the price of a high diffraction efficiency spatial light modulator is extremely expensive, and the algorithm for changing the light intensity distribution is also quite complicated, making it difficult to achieve both high-efficiency splitting and high uniformity of the split beam at the same time. Summary of the invention

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, one object of the present invention is to provide a laser processing device, which can split a single laser beam through an electro-optical modulator, and the electro-optical modulator has high diffraction efficiency and high uniformity of the split beam, thereby avoiding the split beam being large and affecting the processing quality of the hole type, and the electro-optical modulator has low cost, high splitting efficiency, and less waste of energy for the laser beam.

[0004] A second objective of the present invention is to provide a laser processing system.

[0005] In order to solve the above problems, a first aspect of an embodiment of the present invention provides a laser processing device, comprising: a laser, which is used to emit a single laser beam; an electro-optical modulator, which is arranged on the output light path of the laser, and is used to split the single laser beam to form M split beams with different energies, where M is greater than 1.

[0006] According to the laser processing device of the embodiment of the present invention, a single laser beam emitted by a laser is split by an electro-optic modulator. Therefore, compared with the existing laser processing system that splits the beam by an acousto-optic modulator, a spatial light modulator or a diffraction optical element, the single laser beam is split by an electro-optic modulator in the present application. The electro-optic modulator wastes less energy for the laser beam, has high diffraction efficiency and high uniformity of the split beam, thereby avoiding the split beam being too large to affect the processing quality of the hole type, and the electro-optic modulator has low cost and high splitting efficiency.

[0007] In some embodiments, the laser processing device also includes: M splitter components, each splitter component is correspondingly arranged on the propagation path of each splitter beam to divide each splitter beam into N sub-beams with the same energy, N is greater than or equal to 1; M×N scanning modules, each scanning module is correspondingly arranged on the propagation path of each sub-beam, and each scanning module is used to scan the sub-beam to form a scanning beam; M×N objective lenses, each objective lens is correspondingly arranged on the output light path of each scanning module, and the objective lens is used to focus the scanning beam onto the material to be processed.

[0008] In some embodiments, each spectroscopic component includes: a first reflector, which is arranged on the propagation path of the spectroscopic light beam to perform a first reflection on the spectroscopic light beam; a second reflector, which is arranged on the output light path of the first reflector to perform a second reflection on the spectroscopic light beam reflected by the first reflector; and a first spectrometer, which is arranged on the output light path of the second reflector to split the spectroscopic light beam reflected by the second reflector into N sub-beams with the same energy.

[0009] In some embodiments, the laser processing device further includes: M×N reflective phase retarders, each reflective phase retarder being disposed correspondingly on the propagation path of each sub-beam, and being used to convert the sub-beam from linearly polarized light to circularly polarized light.

[0010] In some embodiments, a second beam splitter is provided on the output optical path of the laser, and the second beam splitter is used to split the single laser beam into two laser beams with the same energy, and propagate one of the two laser beams with the same energy to the electro-optical modulator.

[0011] In some embodiments, the laser processing apparatus further comprises: an absorbing film reflector, wherein the absorbing film reflector is used to reflect one of the laser beams into the electro-optical modulator.

[0012] In some embodiments, the laser processing device further includes: a beam adjustment component, the beam adjustment component is located on the outgoing light path of the absorbing film reflector, and the beam adjustment component is used to optimize the beam of one of the laser beams.

[0013] In some embodiments, the beam adjustment component includes: a diffractive optical element, which is located on the exit light path of the absorbing film reflector and is used to shape one of the laser beams into a flat-top beam; a laser beam expander, which is located on the exit light path of the diffractive optical element and is used to expand the flat-top beam; an aperture, which is located on the exit light path of the laser beam expander and is used to filter the flat-top beam expanded by the laser beam expander and transmit the filtered flat-top beam to the electro-optical modulator.

[0014] In some embodiments, the laser processing device also includes: a third reflector, which is used to reflect the other laser beam of the two laser beams with the same energy; an attenuation plate, which is located on the output light path of the third reflector and is used to attenuate the energy of the other laser beam; and a photoelectric detector, which is located on the output light path of the attenuation plate and is used to convert the attenuated other laser beam into a laser monitoring electrical signal.

[0015] A second aspect of the present invention provides a laser processing system, comprising: the laser processing device described in the above embodiment; a controller, the controller is connected to the electro-optical modulator of the laser processing device, and is used to provide a radio frequency signal to the electro-optical modulator, and the radio frequency signal is used to adjust the energy ratio of M split light beams when the electro-optical modulator performs beam splitting.

[0016] According to the laser processing system of the embodiment of the present invention, a single laser beam can be split by an electro-optical modulator. The electro-optical modulator has high diffraction efficiency and high uniformity of the split beam, thereby avoiding the split beam being too large and affecting the processing quality of the hole type. In addition, the electro-optical modulator has low cost, high splitting efficiency, and less energy wasted on the laser beam.

[0017] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which: Figure 1 is a schematic diagram of a laser processing device according to an embodiment of the present invention; Figure 2is a schematic diagram of a laser processing device according to another embodiment of the present invention; Figure 3 is a schematic diagram of the operation of an electro-optic modulator according to an embodiment of the present invention; Figure 4 is a structural block diagram of a laser processing system according to an embodiment of the present invention.

[0019] Reference numerals: Laser processing system 100; Laser processing device 90; Laser 1; electro-optic modulator 2; spectroscopic component 3; scanning module 4; objective lens 5; first reflector 31; second reflector 32; first spectrometer 33; reflective phase retarder 6; second spectrometer 7; absorbing film reflector 8; beam adjustment component 12; diffractive optical element 9; laser beam expander 10; aperture 11; third reflector 13; attenuation plate 14; photodetector 15; controller 19; host computer 21; material to be processed 22. DETAILED DESCRIPTION

[0020] Embodiments of the present invention are described in detail below. The embodiments described with reference to the accompanying drawings are exemplary. Embodiments of the present invention are described in detail below.

[0021] At present, laser drilling has been widely used in the PCB (Printed Circuit Board) industry. However, with the increase in the single pulse energy of the laser and the increasing demand for large-size and high-resolution components, the existing laser drilling devices are facing the dual constraints of low processing efficiency and energy utilization. At the same time, the cost of CO2 (carbon dioxide) lasers is very high. In order to solve these problems, a single laser beam is split into multiple beams, and multiple laser beams are parallel to improve processing efficiency and energy utilization. At the same time, dynamic regulation of beam energy and spacing is more flexible to ensure high-speed parallel processing.

[0022] In order to solve the above problems, the first embodiment of the present invention provides a laser processing device. According to the method, a single laser beam can be split by an electro-optical modulator. The electro-optical modulator has high diffraction efficiency and high uniformity of the split beam, thereby avoiding the split beam being too large and affecting the processing quality of the hole type. In addition, the electro-optical modulator has low cost, high splitting efficiency, and less energy waste on the laser beam.

[0023] Reference below Figure 1 The laser processing system 100 according to an embodiment of the present invention is described as follows. Figure 1 As shown, it includes: a laser 1 and an electro-optic modulator 2 (electro-optic modulators, EOM).

[0024] Among them, laser 1 is used to emit a single laser beam, the wavelength of the single laser beam can be 9.4um, the typical power value can be 283W, and the single pulse frequency can be 200kHz; the electro-optical modulator 2 is arranged on the output light path of the laser 1, and the electro-optical modulator 2 is used to split the single laser beam to form M split beams with different energies, M is greater than 1, and M can be 2.

[0025] The electro-optic modulator 2 uses the electro-optic effect to modulate the laser beam. That is, the electro-optic modulator applies voltage to the electro-optic crystal, and the refractive index n of the electro-optic crystal changes accordingly, thereby changing the light wave characteristics of the electro-optic crystal, thereby modulating the phase, amplitude, polarization, etc. of the laser beam.

[0026] Specifically, in order to solve the above problems, in the present application, the single laser beam emitted by the laser 1 is split by the electro-optic modulator 2, that is, the radio frequency signal provided by the controller 19 is used to make the electro-optic modulator 2 split the single laser beam emitted by the laser 1 under the action of diffraction to form M split beams with different energies, thereby realizing dynamic regulation of the energy of the split beams on different axes. Therefore, compared with the existing laser processing system that splits the beam by an acousto-optic modulator, a spatial light modulator or a diffractive optical element, in the present application, the single laser beam is split by the electro-optic modulator 2. The electro-optic modulator 2 splits the laser beam, and wastes less energy for the laser beam, has high diffraction efficiency and high uniformity of the split beam, thereby avoiding the split beam being too large to affect the processing quality of the hole type, and the electro-optic modulator 2 has low cost, high splitting efficiency, and it is relatively simple to change the light intensity distribution method, thereby achieving efficient splitting. The electro-optic modulator 2 has the advantage of a fast rise time pulse, thereby minimizing the heat affected area during drilling. The electro-optic modulator 2 will not deviate the laser beam, thereby improving the optical performance and making the laser processing system 100 simple.

[0027] According to the laser processing device 90 of the embodiment of the present invention, the single laser beam emitted by the laser 1 is split by the electro-optic modulator 2. Therefore, compared with the existing laser processing system 100 that splits the beam by an acousto-optic modulator, a spatial light modulator or a diffraction optical element 9, the single laser beam is split by the electro-optic modulator 2 in the present application. The electro-optic modulator 2 wastes less energy for the laser beam, has high diffraction efficiency and high uniformity of the split beam, thereby avoiding the split beam being too large to affect the processing quality of the hole type, and the electro-optic modulator 2 has low cost and high splitting efficiency.

[0028] In some embodiments, Figure 2 As shown, the laser processing device 90 further includes: M light splitting components 3 , M×N scanning modules 4 and M×N objective lenses 5 .

[0029] Among them, each splitting component 3 is correspondingly arranged on the propagation path of each splitting light beam to divide each splitting light beam into N sub-beams with the same energy, N is greater than or equal to 1, and N can be 2; each scanning module 4 is correspondingly arranged on the propagation path of each sub-beam, and each scanning module 4 is used to scan the sub-beam to form a scanning beam; each objective lens 5 is correspondingly arranged on the output light path of each scanning module 4, and the objective lens 5 is used to focus the scanning beam onto the material to be processed 22.

[0030] Specifically, because different processing materials require different laser beam energies, it is necessary to obtain scanning beams with different energies to act on the materials 22 to be processed with different materials. In this regard, in the present application, the single laser beam emitted by the laser 1 is split by the electro-optical modulator 2 to form M split beams with different energies. M spectral beams with different energies pass through the corresponding spectral components 3 to divide each spectral beam into N sub-beams with the same energy. Each sub-beam is scanned by the corresponding scanning module 4 to form a scanning beam. Each scanning beam is projected into each objective lens 5. Each objective lens 5 focuses the corresponding scanning beam onto the material to be processed 22. At the same time, the direction of each scanning component with respect to the sub-beam is changed according to the position information of the prepared hole on each material to be processed 22 to form scanning beams at different positions, so that the scanning beams converge at different coordinates of the objective lens 5, thereby forming holes at corresponding positions on each material to be processed 22. Thus, parallel processing of N×M materials to be processed 22 is realized, thereby greatly improving the material processing efficiency. At the same time, since each spectral component 3 divides each spectral beam into N sub-beams with the same energy, each sub-beam with the same energy acts on the same type of processing material.

[0031] For example, if the number of split beams is 2, two split beams with different energies pass through the corresponding splitting component 3 to split each split beam into two sub-beams with the same energy, that is, two split beams can obtain four sub-beams, such as Figure 2 As shown, the four sub-beams can be expressed as Z 1-1 , Z 1-2 , Z 0-1 and Z 0-2 , the four sub-beams are scanned by the corresponding scanning modules 4 to form scanning beams, and the four scanning beams are incident on the corresponding objective lenses 5. Each objective lens 5 focuses the corresponding scanning beams onto the four materials 22 to be processed. Thus, the four materials 22 to be processed are processed in parallel, thereby greatly improving the material processing efficiency. In addition, it should be noted that each split beam corresponds to processing materials of the same material.

[0032] In some embodiments, Figure 2 As shown, each light splitting component 3 includes: a first reflector 31 , a second reflector 32 and a first light splitter 33 .

[0033] Among them, the first reflector 31 is arranged on the propagation path of the split light beam to perform a first reflection on the split light beam; the second reflector 32 is arranged on the output light path of the first reflector 31 to perform a second reflection on the split light beam reflected by the first reflector 31; the first beam splitter 33 is arranged on the output light path of the second reflector 32 to split the split light beam reflected by the second reflector 32 into N sub-beams with the same energy.

[0034] In some embodiments, Figure 2 As shown, the laser processing device 90 further includes: M×N reflective phase retarders (RPR) 6 .

[0035] Among them, each reflective phase retarder 6 is correspondingly arranged on the propagation path of each sub-beam, and is used to convert the sub-beam from linearly polarized light to circularly polarized light. That is to say, each reflective phase retarder 6 introduces a phase of λ / 4 to convert each sub-beam from linearly polarized light to circularly polarized light, so that the drilling slit change can be eliminated when a hole is formed in the material 22 to be processed by the sub-beam.

[0036] For example, Figure 2 As shown, the laser processing device 90 also includes: four reflective phase retarders 6.

[0037] In some embodiments, Figure 2 As shown, a second beam splitter 7 is provided on the outgoing light path of the laser 1 .

[0038] The second beam splitter 7 is used to split a single laser beam into two laser beams with the same energy, and propagate one of the two laser beams with the same energy to the electro-optic modulator 2. The second beam splitter 7 may be a beam splitter. That is, the laser beam emitted from the laser 1 is split into two light paths by the second beam splitter 7, and one of the two laser beams with the same energy is propagated to the electro-optic modulator 2, so that the electro-optic modulator 2 can split the single laser beam.

[0039] In the embodiment, the laser beam emitted from the laser 1 is split into two light paths by the second beam splitter 7 (99% reflection, 1% transmission).

[0040] In some embodiments, Figure 2 As shown, the laser processing device 90 further includes an absorbing thin film reflector 8 (ATFR).

[0041] The absorption film reflector 8 is used to reflect one of the laser beams into the electro-optic modulator 2, that is, after the laser beam emitted from the laser 1 is split into two laser beams by the second beam splitter 7, one of the laser beams is then reflected into the electro-optic modulator 2 by the absorption film reflector 8, so that the electro-optic modulator 2 can split the single laser beam. It can also prevent the reflected light from the material to be processed 22 from being transported back to the laser 1 cavity through the laser processing device 90, causing damage to the laser 1.

[0042] In some embodiments, Figure 2 As shown, the laser processing device 90 also includes: a beam adjustment component 12.

[0043] The beam adjustment component 12 is located on the outgoing light path of the absorbing film reflector 8, and the beam adjustment component 12 is used to optimize one of the laser beams.

[0044] Specifically, after the laser beam emitted from the laser 1 is split into two laser beams by the second beam splitter 7, one of the laser beams is reflected into the beam adjustment component 12 by the absorption film reflector 8, and one of the laser beams is optimized by the beam adjustment component 12, so that the optimized laser beam passes through the electro-optical modulator 2 to split the single laser beam.

[0045] In some embodiments, Figure 2 As shown, the beam adjustment component 12 includes: a diffractive optical element 9 (DOE), a laser beam expander 10 and an aperture 11.

[0046] Among them, the diffractive optical element 9 is located on the exit optical path of the absorbing film reflector 8, and is used to shape one of the laser beams into a flat-top beam so that the energy distribution of the beam is uniform; the laser beam expander 10 is located on the exit optical path of the diffractive optical element 9, and is used to expand the flat-top beam and reduce the divergence angle of the flat-top beam, to achieve stray light filtering and beam optimization, so that the laser beam is more stable during transmission; the aperture 11 is located on the exit optical path of the laser beam expander 10, and is used to filter the flat-top beam expanded by the laser beam expander 10, and transmit the filtered flat-top beam to the electro-optical modulator 2, that is, the aperture 11 can limit the aperture size of the flat-top beam to shape the flat-top beam to filter stray light, and the aperture is also used to limit the energy of the flat-top beam to make the energy of the flat-top beam more uniform.

[0047] In addition, it should be noted that there can be multiple apertures, so that a corresponding aperture can be selected from the multiple apertures according to the size of the laser beam.

[0048] In the embodiment, the laser processing device 90 can optimize the laser beam by using one or more of the diffractive optical element 9, the laser beam expander 10 and the aperture 11, which is not limited.

[0049] In some embodiments, Figure 2 As shown, the laser processing device 90 further includes: a third reflecting mirror 13 , an attenuation plate 14 and a photodetector 15 .

[0050] Among them, the third reflector 13 is used to reflect the other laser beam of the two laser beams with the same energy; the attenuation plate 14 is located on the output light path of the third reflector 13, and is used to attenuate the energy of the other laser beam; the photodetector 15 is located on the output light path of the attenuation plate 14, and is used to photoelectrically convert the attenuated other laser beam into a laser monitoring electrical signal, wherein the laser monitoring electrical signal is used to monitor the laser state, and the laser state includes the laser energy and the size of the laser pulse.

[0051] Specifically, the second beam splitter 7 splits the single laser beam emitted by the laser 1 into two laser beams with the same energy, and transmits the other laser beam of the two laser beams with the same energy to the third reflector 13. The third reflector 13 reflects the other laser beam to reflect the other laser beam to the attenuation plate 14 to weaken the energy of the other laser beam so that the weakened laser beam can enter the photodetector 15, thereby avoiding damage to the photodetector 15. The photodetector 15 photoelectrically converts the weakened other laser beam into a laser monitoring electrical signal, and then sends the laser monitoring electrical signal to the host computer 21. The host computer 21 can be a PC (Personal Computer) so that the host computer 21 can monitor the laser status in real time through the laser monitoring electrical signal.

[0052] In an embodiment, Figure 3 As shown, it is a schematic diagram of the operation of the electro-optic modulator 2 of the present application. Figure 3 As shown, the laser beam is a linearly polarized light. The linearly polarized light beam is incident on the electro-optical adjuster 2 from the polarization direction A. The polarization direction A is the polarization direction of the initial light beam. The electro-optical adjuster 2 processes the linearly polarized light to output the linearly polarized light beam to the bias direction B. The electro-optical adjuster 2 can control the linearly polarized light beam to be transmitted or not transmitted. Figure 3 It can be seen that the change in the amplitude and energy of the laser beam projection is achieved by changing the polarization state.

[0053] The transmittance of this device is:

[0054] Where T is the transmittance, V π is the half-wave voltage. And this equation does not take into account the loss caused by reflection, absorption, scattering (or diffraction).

[0055] A second aspect of the present invention provides a laser processing system 100, such as Figure 4 As shown, it includes: the laser processing device 90 and the controller 19 of the above embodiment.

[0056] The controller 19 is connected to the electro-optic modulator 2 of the laser processing device 90, and is used to provide a radio frequency signal to the electro-optic modulator 2, and the radio frequency signal is used to adjust the energy ratio of the M split light beams when the electro-optic modulator 2 performs beam splitting. In other words, the frequency of the radio frequency signal is artificially changed to adjust the energy ratio of the M split light beams when the electro-optic modulator 2 performs beam splitting. It should be noted that when the energy ratio of one of the M split light beams is zero, the split light beam is closed, thereby realizing independent, fast and efficient material processing. The laser processing system 100 can be a laser drilling system.

[0057] According to the laser processing system 100 of the embodiment of the present invention, a single laser beam can be split by the electro-optical modulator 2. The electro-optical modulator 2 has high diffraction efficiency and high uniformity of the split beam, thereby avoiding the split beam being too large and affecting the processing quality of the hole type. In addition, the electro-optical modulator 2 has low cost, high splitting efficiency, and less energy waste for the laser beam.

[0058] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example.

[0059] Although the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. A laser processing device, characterized in that: include: A laser, the laser being used to emit a single laser beam; An electro-optic modulator is arranged on the output light path of the laser, and is used to split the single laser beam to form M split beams with different energies, where M is greater than 1.

2. The laser processing device according to claim 1, characterized in that: The laser processing device also includes: M light splitting components, each light splitting component is correspondingly arranged on the propagation path of each split light beam, so as to split each split light beam into N sub-beams with the same energy, where N is greater than or equal to 1; M×N scanning modules, each scanning module is correspondingly arranged on a propagation path of each sub-beam, and each scanning module is used to correspondingly scan the sub-beam to form a scanning beam; M×N objective lenses, each objective lens is correspondingly arranged on the output light path of each scanning module, and the objective lens is used to focus the scanning light beam onto the material to be processed.

3. The laser processing device according to claim 2, characterized in that: Each beam splitter assembly includes: A first reflector, the first reflector is arranged on the propagation path of the split light beam to perform a first reflection on the split light beam; a second reflector, the second reflector being arranged on an outgoing light path of the first reflector to perform a second reflection on the split light beam reflected by the first reflector; A first beam splitter is arranged on an outgoing light path of the second reflector to split the split light beam reflected by the second reflector into N sub-beams with the same energy.

4. The laser processing device according to claim 2, characterized in that: The laser processing device also includes: ‌M×N reflective phase retarders, each of which is correspondingly arranged on the propagation path of each sub-beam, and is used to convert the sub-beam from linearly polarized light to circularly polarized light.

5. The laser processing device according to any one of claims 1 to 4, characterized in that: A second beam splitter is provided on the output optical path of the laser, and the second beam splitter is used to split the single laser beam into two laser beams with the same energy, and transmit one of the two laser beams with the same energy to the electro-optical modulator.

6. The laser processing device according to claim 4, characterized in that: The laser processing device also includes: An absorbing film reflector is used to reflect one of the laser beams into the electro-optic modulator.

7. The laser processing device according to claim 6, characterized in that: The laser processing device also includes: A beam adjustment component is located on the outgoing light path of the absorbing film reflector, and is used to optimize the beam of one of the laser beams.

8. The laser processing device according to claim 7, characterized in that: The beam adjustment assembly comprises: a diffractive optical element, the diffractive optical element being located on an outgoing light path of the absorbing film reflector and being used for shaping one of the laser beams into a flat-top beam; A laser beam expander, which is located on the output light path of the diffractive optical element and is used to expand the flat-top beam; An aperture is located on the output light path of the laser beam expander, and is used to filter the flat-top beam expanded by the laser beam expander, and transmit the filtered flat-top beam to the electro-optic modulator.

9. The laser processing device according to claim 5, characterized in that: The laser processing device also includes: a third reflecting mirror, wherein the third reflecting mirror is used to reflect the other laser beam of the two laser beams with the same energy; an attenuation plate, the attenuation plate being located on the outgoing light path of the third reflector and being used to attenuate the energy of the other laser beam; A photoelectric detector is located on the outgoing light path of the attenuation plate and is used for photoelectrically converting another attenuated laser beam into a laser monitoring electrical signal.

10. A laser processing system, characterized in that: include: The laser processing device according to any one of claims 1 to 9; A controller is connected to the electro-optic modulator of the laser processing device and is used to provide a radio frequency signal to the electro-optic modulator, wherein the radio frequency signal is used to adjust the energy ratio of the M split light beams when the electro-optic modulator performs beam splitting.

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