Multi-lens laser processing equipment and laser processing method

By designing adjustment components and moving components in multi-lens laser processing equipment, adjusting the incident angle of the laser head and achieving precise movement, the problem of reflected laser beam damaging the laser when cutting high-reflective materials is solved, and the processing quality and equipment life are improved.

CN120095372AActive Publication Date: 2025-06-06CYBRIGHT IR LED TECH CO LTD

Patent Information

Application Number
CN202510532652.8
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-04-25
Publication Date
2025-06-06
Estimated Expiration
2045-04-25

AI Technical Summary

Technical Problem

When existing multi-lens laser processing equipment cuts highly reflective materials, the reflected laser beam is easily returned to the laser, damaging the internal optical components of the laser and shortening the equipment life.

Method used

A multi-lens laser processing device is designed, including a laser processing assembly, an adjustment assembly, a first mobile assembly and a second mobile assembly. The position of the exit end of the laser head is adjusted by the adjustment assembly, the incident angle is adjusted, and the precise movement of the laser head is achieved by the first and second moving components to reduce the feedback of the reflected laser beam.

Benefits of technology

It effectively reduces the feedback of the reflected laser beam, improves processing quality, extends the service life of the equipment, and optimizes the spatial layout and automation level of the equipment.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention provides multi-lens laser processing equipment and a laser processing method. The multi-lens laser processing equipment specifically comprises a laser processing assembly, an adjusting assembly, a first moving assembly and a second moving assembly. Through the arrangement of the adjusting assembly, the incident angle of the laser head can be effectively adjusted, feedback of reflected laser beams is reduced, the machining quality is improved, and the service life of equipment is prolonged. Due to the design that the first direction, the second direction and the third direction are perpendicular to one another, the space layout of the equipment is optimized, and the space utilization efficiency of the equipment is effectively improved. Through cooperative work of the first moving assembly and the second moving assembly, the precise position of the laser head can be adjusted, the difficulty of manual operation is reduced, and the automation level of equipment is improved. The method can be widely applied to laser processing of various materials, and has good universality and adaptability. Therefore, the technical problem that the laser is easily damaged due to the reflected laser beam generated by cutting the high-reflection material is solved.
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Description

Technical Field

[0001] The present invention relates to the field of laser processing technology, and in particular to a multi-lens laser processing device and a laser processing method. Background Art

[0002] Multi-lens laser processing equipment is a precision system that achieves laser beam guidance, shaping and focusing through a combination of multiple optical lenses. It is widely used in high-precision fields such as automobile manufacturing and aerospace. Multi-lens laser processing equipment achieves high energy density and multi-station flexible processing through the coordination of precision optical elements (reflectors, lenses, beam splitters, etc.) and CNC systems.

[0003] In the prior art, when multi-lens laser processing equipment performs laser cutting on highly reflective materials (such as copper, aluminum mirror stainless steel), the reflected laser beam may return to the laser, especially the fiber laser or solid-state laser, because the highly reflective material will reflect part of the incident laser energy. This reflection will damage the internal optical components of the laser, such as the laser resonator, lens and reflector, shortening the life of the equipment. Summary of the invention

[0004] The purpose of the present invention is to provide a multi-lens laser processing device and a laser processing method, which solves the technical problem in the prior art that the laser is easily damaged by the reflected laser beam generated by cutting highly reflective materials.

[0005] To achieve this object, the present invention adopts the following technical solutions: According to a first aspect, the present invention discloses a multi-lens laser processing device, comprising: a laser processing component, an adjustment component, a first moving component and a second moving component; the laser processing component comprises a laser head for outputting a laser beam and laser cutting a processed object, the laser head is arranged along a first direction, and a light input end of the laser head is movably connected to the first moving component; Among them, the adjustment component is used to move and adjust the light output end position of the laser head; the first moving component is used to drive the laser head and the adjustment component to move along the second direction, and the two second moving components arranged side by side are used to synchronously drive the first moving component to move along the third direction; the first direction, the second direction and the third direction are arranged perpendicular to each other.

[0006] Optionally, the first moving assembly includes a first moving platform and a first moving frame connected to the second moving assembly, and the first moving frame is equipped with a first moving motor for driving the first moving platform to move along the second direction; The first moving platform comprises a first sliding block slidably connected to the first moving frame, a first mounting plate is fixedly mounted on the first sliding block, and a second mounting plate is fixedly connected to the first mounting plate.

[0007] Optionally, the adjustment assembly includes an adjustment member and an adjustment cylinder, one end of the adjustment member is in contact with the laser head, and the other end of the adjustment member is slidably connected to the first slider; The adjusting cylinder is used to drive the adjusting member to move so that the light emitting end of the laser head is away from the first sliding block.

[0008] Optionally, the adjustment assembly further comprises an adjustment block, the adjustment cylinder is mounted on the second mounting plate, and the telescopic rod of the adjustment cylinder is fixedly connected to the adjustment block; Among them, a T-shaped slide groove is provided in the first sliding block, and the end of the adjusting block away from the adjusting cylinder passes through the first mounting plate and abuts against the adjusting member, and a return spring is installed in the slide groove; one end of the return spring is fixedly connected to the slide groove, and the other end of the return spring is connected to the adjusting member.

[0009] Optionally, the adjusting member comprises a first adjusting portion and a second adjusting portion connected to each other, the first adjusting portion is arranged in an arc-shaped block and abuts against the light-emitting end of the laser head, and the second adjusting portion is arranged in a square block and is slidably connected in the slide groove; Wherein, the return spring is connected to the second adjusting portion, the adjusting block is provided with a first inclined surface, and the second adjusting portion is provided with a second inclined surface in contact with the first inclined surface.

[0010] Optionally, the light inlet end of the laser head is sleeved with a sleeve rotatably connected to the second mounting plate, and the light inlet end of the laser head is provided with a light inlet port; The sleeve is provided with a light hole corresponding to the light inlet, the outer wall of the laser head is provided with an abutment groove abutting against the first adjustment part, and the thickness of the abutment groove in the first direction is greater than the thickness of the first adjustment part in the first direction.

[0011] Optionally, the second moving assembly includes a second moving frame, the second moving frame is slidably connected to a second moving platform fixedly connected to the first moving assembly, and the second moving frame is equipped with a second moving motor for driving the second moving platform to move along a third direction; One end of the first mobile component is fixedly connected to one of the second mobile stations, and the other end of the first mobile component is fixedly connected to another of the second mobile stations.

[0012] Optionally, the laser processing assembly further comprises a laser generator, a first reflector and a second reflector, wherein the first reflector is disposed adjacent to the laser generator; The second reflector is installed on the first moving component, and the first reflector and the second reflector are used to reflect the laser beam generated by the laser generator into the laser head.

[0013] Optionally, it further comprises a casing and a workbench installed in the casing, wherein the workbench is used to place the object to be processed; Wherein, the laser processing assembly, the adjustment assembly, the first moving assembly and the second moving assembly are all installed in the housing, and two of the second moving assemblies are distributed on opposite sides of the workbench; The workbench comprises a plurality of support bases fixedly connected to the housing, and the support bases are provided with a first substrate, a second substrate and a partition net in sequence along a first direction.

[0014] According to a second aspect, the present invention discloses a laser processing method, which is applied to the multi-lens laser processing device as described in the first aspect, comprising: Step S1, determining a preset incident angle of the laser head according to the type of the object to be processed; the type of the object to be processed includes reflective materials and non-reflective materials; Step S2, obtaining a moving path of the laser head according to the processing requirements of the object to be processed; the processing requirements include a cutting shape; Step S3, adjusting the position of the light output end of the laser head by moving the adjustment component to obtain the laser head at a preset incident angle; Step S4, according to the moving path of the laser head, the laser head is driven to move correspondingly by the first moving component and the second moving component, so that the laser beam output by the laser head performs laser cutting on the object to be processed.

[0015] Compared with the prior art, the present invention has the following beneficial effects: The present invention provides a multi-lens laser processing equipment and a laser processing method, which specifically include a laser processing component, an adjustment component, a first movable component and a second movable component. Through the setting of the adjustment component, the light output end position of the laser head can be adjusted quickly and conveniently, thereby effectively adjusting the incident angle of the laser head, reducing the feedback of the reflected laser beam, improving the processing quality, and extending the service life of the equipment. Due to the design that the first direction, the second direction and the third direction are perpendicular to each other, the spatial layout of the equipment is optimized, so that the equipment can achieve a wider processing range in a limited space, and effectively improve the space utilization efficiency of the equipment. Through the coordinated work of the first movable component and the second movable component, the precise position of the laser head can be adjusted, the difficulty of manual operation is reduced, and the automation level of the equipment is improved. The present invention can be widely used in laser processing of various materials, meet the requirements of different industries for laser cutting, have good versatility and adaptability, and are suitable for large-scale production and personalized customized processing needs. Therefore, the present invention solves the technical problem that the laser is easily damaged by the reflected laser beam generated by cutting highly reflective materials. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0017] The structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification so as to facilitate understanding and reading by persons familiar with the technology. They are not used to limit the conditions under which the present invention can be implemented, and therefore have no substantive technical significance. Any structural modification, change in proportion or adjustment of size shall still fall within the scope of the technical contents disclosed in the present invention without affecting the effects and purposes that can be achieved by the present invention.

[0018] Figure 1 It is a schematic diagram of the three-dimensional structure of a multi-lens laser processing device disclosed in the first embodiment of the present invention; Figure 2 This is one of the partial structural schematic diagrams of a multi-lens laser processing device disclosed in the first embodiment of the present invention; Figure 3 This is a second partial structural schematic diagram of a multi-lens laser processing device disclosed in the first embodiment of the present invention; Figure 4 This is a schematic diagram of the connection structure of a first moving platform, an adjustment component and a laser head in a multi-lens laser processing device disclosed in Embodiment 1 of the present invention; Figure 5 for Figure 4 AA cross-sectional structural diagram; Figure 6 for Figure 4 Schematic diagram of the explosion structure; Figure 7 It is a schematic diagram of the three-dimensional structure of an adjustment block in a multi-lens laser processing device disclosed in the first embodiment of the present invention; Figure 8 It is a schematic diagram of the three-dimensional structure of an adjusting component in a multi-lens laser processing device disclosed in the first embodiment of the present invention; Fig. 9 It is a schematic diagram of the exploded structure of a workbench in a multi-lens laser processing device disclosed in the first embodiment of the present invention; Fig.10 It is a schematic flow chart of a laser processing method disclosed in the second embodiment of the present invention.

[0019] Illustration Description: 10. Laser processing assembly; 11. Laser head; 111. Light inlet; 112. Abutment groove; 113. Boss; 12. Laser generator; 13. First reflector; 14. Second reflector; 20. Adjustment assembly; 21. Adjustment member; 211. First adjustment part; 212. Second adjustment part; 2121. Second inclined surface; 213. Third adjustment part; 2131. Abutment surface; 214. Fourth adjustment part; 22. Adjustment cylinder; 23. Adjustment block; 231. First inclined surface; 24. Return spring; 30. first moving assembly; 31. first moving platform; 311. first slider; 3111. slideway; 312. first mounting plate; 3121. perforation; 313. second mounting plate; 314. sleeve; 3141. light-through hole; 315. mounting cover; 316. mounting frame; 32. first moving frame; 33. first belt; 40. second moving assembly; 41. second moving frame; 42. second moving platform; 43. second moving motor; 44. second belt; 50, housing; 51, partition; 511, through hole; 52, first cavity; 53, second cavity; 60. Workbench; 61. Support seat; 62. First substrate; 63. Second substrate; 64. Partition net. DETAILED DESCRIPTION

[0020] In order to make the purpose, features and advantages of the present invention more obvious and easy to understand, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the embodiments described below are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0021] In the description of the present invention, it should be understood that the terms "upper", "lower", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention. It should be noted that when a component is considered to be "connected" to another component, it may be directly connected to the other component or there may be a centrally arranged component at the same time.

[0022] The technical solution of the present invention is further described below with reference to the accompanying drawings and through specific implementation methods.

[0023] Embodiment 1: The embodiment of the present invention provides a multi-lens laser processing device, such as Figures 1 to 10 As shown, it includes: a laser processing component 10, an adjustment component 20, a first moving component 30 and a second moving component 40; the laser processing component 10 includes a laser head 11 for outputting a laser beam and laser cutting the object to be processed, the laser head 11 is arranged along a first direction, and a light input end of the laser head 11 is movably connected to the first moving component 30; Among them, the adjustment component 20 is used to move and adjust the light-emitting end position of the laser head 11; the first moving component 30 is used to drive the laser head 11 and the adjustment component 20 to move along the second direction, and the two second moving components 40 arranged side by side are used to synchronously drive the first moving component 30 to move along the third direction; the first direction, the second direction and the third direction are arranged perpendicular to each other.

[0024] It should be noted that the multi-lens laser processing equipment provided by the present invention specifically includes a laser processing component 10, an adjustment component 20, a first movable component 30 and a second movable component 40. Through the setting of the adjustment component 20, the light output end position of the laser head 11 can be adjusted quickly and conveniently, thereby effectively adjusting the incident angle of the laser head 11, and reducing the feedback of the reflected laser beam, improving the processing quality, and extending the service life of the equipment. Since the first direction, the second direction and the third direction are perpendicular to each other, the spatial layout of the equipment is optimized, so that the equipment can achieve a wider processing range in a limited space, and effectively improve the space utilization efficiency of the equipment. Through the coordinated work of the first movable component 30 and the second movable component 40, the precise position of the laser head 11 can be adjusted, the difficulty of manual operation is reduced, and the automation level of the equipment is improved. The present invention can be widely used in laser processing of various materials, meet the requirements of different industries for laser cutting, have good versatility and adaptability, and are suitable for large-scale production and personalized customized processing needs. Therefore, the present invention solves the technical problem that the laser is easily damaged by the reflected laser beam generated by cutting highly reflective materials.

[0025] like Figures 1 to 3 As shown, the first moving assembly 30 includes a first moving platform 31 and a first moving frame 32 connected to the second moving assembly 40, and a first moving motor (not shown) for driving the first moving platform 31 to move along the second direction is installed on the first moving frame 32; The first movable platform 31 includes a first slider 311 slidably connected to the first movable frame 32, a first mounting plate 312 is fixedly mounted on the first slider 311, and a second mounting plate 313 is fixedly connected to the first mounting plate 312. In this embodiment, the sliding of the first movable platform 31 is pulled by the first belt 33, and a mounting cover 315 is fixedly mounted on the first mounting plate 312. A mounting frame 316 is provided between the first slider 311 and the first mounting plate 312. By setting the mounting frame 316, the height of the first mounting plate 312 in the first direction can be raised, and the installation stability of the first mounting plate 312 can be improved, thereby reducing vibration and ensuring the smooth movement of the laser head 11 during the processing.

[0026] It should be noted that by adjusting the speed and direction of the first mobile motor, the moving range and position of the first mobile platform 31 can be accurately controlled to adapt to different processing requirements and meet a variety of laser cutting tasks. The drive of the first mobile motor is transmitted by using the first belt 33, which not only realizes efficient power transmission, but also simplifies the maintenance and replacement process of the system. Due to the relatively simple replacement and maintenance method of the first belt 33, the downtime of the equipment can be reduced, ensuring the reliability and availability of the equipment during long-term operation.

[0027] like Figures 4 to 8 As shown, the adjustment assembly 20 includes an adjustment member 21 and an adjustment cylinder 22. One end of the adjustment member 21 contacts the laser head 11, and the other end of the adjustment member 21 is slidably connected to the first slider 311. The adjusting cylinder 22 is used to drive the adjusting member 21 to move so that the light emitting end of the laser head 11 is away from the first sliding block 311 .

[0028] It should be noted that by driving the adjusting member 21 to move through the adjusting cylinder 22, the light-emitting end of the laser head 11 can be flexibly moved away from or close to the first slider 311. This structure enables the position of the laser head 11 to be adjusted quickly and accurately during the processing, thereby meeting the requirements of different processing materials and thicknesses and improving cutting efficiency and quality. By controlling the movement of the adjusting cylinder 22 to achieve real-time movement of the adjusting member 21, the displacement of the laser head 11 can be precisely controlled. Due to the fast response speed of the adjusting cylinder 22 drive, the adjustment of the laser head 11 is highly coordinated with the overall processing process of the equipment, which reduces failures and downtime and improves work efficiency.

[0029] like Figures 4 to 8 As shown, the adjustment assembly 20 further includes an adjustment block 23, the adjustment cylinder 22 is mounted on the second mounting plate 313, and the telescopic rod of the adjustment cylinder 22 is fixedly connected to the adjustment block 23; The first slider 311 is provided with a T-shaped slide groove 3111, and the end of the adjustment block 23 away from the adjustment cylinder 22 passes through the first mounting plate 312 and abuts against the adjustment member 21. A return spring 24 is installed in the slide groove 3111; one end of the return spring 24 is fixedly connected to the slide groove 3111, and the other end of the return spring 24 is connected to the adjustment member 21. In the specific implementation process, the first mounting plate 312 is provided with a through hole 3121 for accommodating the passage of the adjustment block 23.

[0030] It should be noted that the adjusting cylinder 22 is fixedly connected to the adjusting block 23 through a telescopic rod, so that the driving of the adjusting cylinder 22 can directly affect the movement of the adjusting block 23, thereby realizing the precise force transmission to the adjusting member 21. This transmission mechanism can ensure that the laser head 11 is stable and reliable each time it is adjusted, and avoid processing errors caused by uneven force transmission. By setting the reset spring 24, the adjusting member 21 can automatically return to the default position when the adjusting cylinder 22 does not apply power. It provides good adaptive capabilities for the equipment and effectively ensures the safety and stability of the equipment in an idle state. Due to the rapid telescopic capability of the adjusting cylinder 22 and the self-recovery characteristics of the reset spring 24, the adjusting component 20 can achieve a faster and more efficient adjustment process, greatly improving the working efficiency of the equipment. In high-intensity practical applications, it can complete precise laser cutting tasks in a shorter time to meet the needs of modern production.

[0031] like Figures 4 to 8 As shown, the adjusting member 21 includes a first adjusting portion 211 and a second adjusting portion 212 connected to each other, the first adjusting portion 211 is arranged in an arc-shaped block and abuts against the light-emitting end of the laser head 11, and the second adjusting portion 212 is arranged in a square block and slidably connected in the slide groove 3111; in this embodiment, the first adjusting portion 211 and the second adjusting portion 212 are an integrally formed structure; The return spring 24 is connected to the second adjusting portion 212, the adjusting block 23 is provided with a first inclined surface 231, and the second adjusting portion 212 is provided with a second inclined surface 2121 in contact with the first inclined surface 231. In this embodiment, when the incident angle of the laser head 11 is 0 degrees, the angle between the laser beam output by the laser head 11 and the normal line of the surface of the processed object is 0 degrees.

[0032] It should be noted that when the incident angle of the laser head 11 needs to be adjusted, the adjusting block 23 is driven to move by the adjusting cylinder 22. Since the first inclined surface 231 is in contact with the second inclined surface 2121, the adjusting block 23 squeezes the second adjusting portion 212, and then the first adjusting portion 211 drives the light output end of the laser head 11 away from the first slider 311, thereby changing the incident angle of the laser head 11 and reducing the feedback of the reflected laser beam. Through the optimized design of the adjusting member 21, the precise control of the adjustment angle makes the energy transfer in the laser cutting process more efficient and the focusing of the laser beam clearer. This greatly improves the efficiency of laser processing, ensures high standards of cutting quality, reduces the workload of post-processing, and improves overall production efficiency.

[0033] like Figures 4 to 8 As shown, the light inlet end of the laser head 11 is sleeved with a sleeve 314 rotatably connected to the second mounting plate 313, and the light inlet end of the laser head 11 is provided with a light inlet port 111; in the specific implementation process, the outer wall of the laser head 11 is provided with an arc-shaped boss 113, and the boss 113 is overlapped on the sleeve 314; The sleeve 314 is provided with a light hole 3141 corresponding to the light inlet 111, and the outer wall of the laser head 11 is provided with an abutment groove 112 abutting against the first adjustment part 211, and the thickness of the abutment groove 112 in the first direction is greater than the thickness of the first adjustment part 211 in the first direction.

[0034] It should be noted that, since the light inlet end of the laser head 11 is sleeved with a sleeve 314 rotatably connected to the second mounting plate 313, the light inlet end of the laser head 11 can be rotated; since the sleeve 314 is provided with a light through hole 3141 corresponding to the light inlet port 111, the laser beam can be smoothly transmitted through the light through hole 3141, thereby minimizing the energy loss caused by interruption or blockage of the beam transmission path. Since the thickness of the abutment groove 112 in the first direction is greater than the thickness of the first adjustment portion 211 in the first direction, when the first adjustment portion 211 extends outward along the third direction, the laser head 11 can be smoothly swung to prevent motion interference.

[0035] In addition, the rotation axis of the sleeve 314 is in the same straight line as the laser beam reflected by the second reflector 14. When the laser head 11 is rotated to adjust the angle, the laser beam can smoothly enter the laser head 11, ensuring that the laser head 11 can smoothly perform laser cutting.

[0036] Specifically, the first adjusting portion 211 is threadedly connected with a third adjusting portion 213, the number of the third adjusting portions 213 is set to two, and the two third adjusting portions 213 are used to press against the laser head 11; the third adjusting portion 213 is provided with a pressing surface 2131 arranged in an arc surface, and the setting of the pressing surface 2131 facilitates the third adjusting portion 213 to press against the laser head 11; one end of the second adjusting portion 212 is provided with a fourth adjusting portion 214 arranged in a semi-circular shape, and the first adjusting portion 211, the second adjusting portion 212, the third adjusting portion 213 and the fourth adjusting portion 214 are all integrally formed structures. The first adjusting portion 211 and the second adjusting portion 212 are both built with cooling liquid, and the light output end of the laser head 11 can be locally cooled by the setting of the cooling liquid.

[0037] It should be noted that, through the setting of the third adjustment part 213, when the laser head 11 needs to maintain the corresponding incident angle to work or after the angle is adjusted, the third adjustment part 213 can be rotated to make the third adjustment part 213 tightly abut against the abutment groove 112, and then the light output end of the laser head 11 can be locked, so that the laser head 11 is more stable during the movement, thereby ensuring the processing quality.

[0038] like Figures 1 to 3 As shown, the second moving assembly 40 includes a second moving frame 41, on which a second moving platform 42 fixedly connected to the first moving assembly 30 is slidably connected, and a second moving motor 43 for driving the second moving platform 42 to move along the third direction is installed on the second moving frame 41; in this embodiment, the drive of the second moving motor 43 is transmitted through a second belt 44, so that the second belt 44 drives the second moving platform 42 and the first moving assembly 30 to move synchronously; Among them, one end of the first moving assembly 30 is fixedly connected to one of the second moving platforms 42, and the other end of the first moving assembly 30 is fixedly connected to another second moving platform 42. In this embodiment, one end of the first moving frame 32 is fixedly connected to one of the second moving platforms 42, and the other end of the first moving frame 32 is fixedly connected to another second moving platform 42.

[0039] It should be noted that the drive of the second mobile motor 43 is transmitted to the second mobile table 42 through the second belt 44, so that the first mobile assembly 30 and the two second mobile tables 42 can move synchronously. This coordinated motion mechanism greatly improves the processing efficiency, allowing the equipment to quickly cover a larger range during laser cutting, effectively meeting the cutting requirements of large-area materials.

[0040] like Figures 1 to 3 As shown, the laser processing assembly 10 further includes a laser generator 12, a first reflector 13 and a second reflector 14, wherein the first reflector 13 is disposed adjacent to the laser generator 12; Among them, the second reflector 14 is installed on the first moving component 30, and the first reflector 13 and the second reflector 14 are used to reflect the laser beam generated by the laser generator 12 into the laser head 11. In this embodiment, the laser generator 12 is a common device in the field, and its working principle is not repeated here. The laser generator 12 and the first reflector 13 are arranged along the second direction, the first reflector 13 and the second reflector 14 are arranged along the third direction, and the second reflector 14 and the laser head 11 are arranged along the second direction. The first reflector 13 and the laser generator 12 are both installed in the housing 50, and the second reflector 14 is located in the second moving platform 42 and is fixedly connected to the first moving frame 32.

[0041] In this embodiment, the laser beam is output by the laser generator 12, and the laser beam moves along the second direction to the first reflector 13. After the first reflection, the direction of the laser beam changes to the third direction. The first reflector 13 reflects the laser beam to the second reflector 14, and the laser beam is reflected to the laser head 11 through the second reflector 14. After the second reflection, the direction of the laser beam changes to the second direction. At this time, the laser head 11 irradiates the laser beam that has been reflected twice onto the object to be processed, thereby realizing laser cutting.

[0042] It should be noted that due to the compact layout of the laser generator 12, the first reflector 13 and the second reflector 14, the efficient transmission of the laser beam inside the laser processing assembly 10 is ensured, the path of the laser is optimized, and the loss in the optical path is reduced, thereby maximizing the effective energy utilization of the laser and improving the processing efficiency. Through the arrangement of the first reflector 13 and the second reflector 14, the reflection path of the laser beam is adjustable, and the laser can be accurately guided into the laser head 11 as needed; at the same time, the incident angle of the laser beam can be effectively controlled to ensure that the laser can act on the processed material in the best position and direction, thereby improving the processing accuracy. Due to the modular arrangement of the laser generator 12, the reflector and the laser head 11, the equipment can be flexibly combined and adjusted according to different laser processing requirements; it is convenient for the application of different types of laser technology, and can adapt to the diverse needs of cutting, welding and other laser processing processes, thereby improving the market adaptability of the equipment.

[0043] like Figures 1 to 9 As shown, it also includes a housing 50 and a workbench 60 installed in the housing 50, and the workbench 60 is used to place the object to be processed; The laser processing assembly 10, the adjustment assembly 20, the first moving assembly 30 and the second moving assembly 40 are all installed in the housing 50, and the two second moving assemblies 40 are distributed on opposite sides of the workbench 60; The workbench 60 includes a plurality of support bases 61 fixedly connected to the housing 50, and the support bases 61 are provided with a first substrate 62, a second substrate 63 and a partition net 64 in sequence along a first direction. In the specific implementation process, the first substrate 62 is overlapped on the support base 61, and the second substrate 63 is spaced apart from the first substrate 62 and fixedly connected to the support base 61; the partition net 64 is overlapped on the second substrate 63, and the second substrate 63 is provided with a plurality of circular holes distributed in a matrix, and the object to be processed is overlapped on the partition net 64.

[0044] Specifically, a partition 51 is provided in the housing 50, and the partition 51 divides the internal space of the housing 50 into a first cavity 52 and a second cavity 53. The first reflector 13 and the laser generator 12 are both located in the first cavity 52, and the adjustment assembly 20, the first moving assembly 30, the second moving assembly 40 and the workbench 60 are all located in the second cavity 53. The partition 51 is provided with a through hole 511 for accommodating the reflected laser beam of the first reflector 13 to pass through.

[0045] It should be noted that, through the setting of the housing 50, the laser processing assembly 10, the adjustment assembly 20, the first movable assembly 30 and the second movable assembly 40 are effectively isolated to ensure that during the laser processing, the laser radiation will not cause safety hazards to the operator or the surrounding environment. The internal space of the housing 50 is divided into a first cavity 52 and a second cavity 53 by the partition 51, thereby enhancing the safety of the operating environment. Since the workbench 60 includes a support seat 61, a first substrate 62, a second substrate 63 and a partition net 64, the internal space of the housing 50 is reasonably utilized. Through this structural design, the workbench 60 can remain stable when carrying the object to be processed, thereby improving the efficiency and adaptability of the entire equipment. Through the setting of the partition net 64, dust and waste are allowed to be discharged during the processing process without interfering with subsequent processing.

[0046] Embodiment 2: The present invention provides a laser processing method, which is applied to the multi-lens laser processing equipment as described in the first embodiment. Fig.10 As shown, including: Step S1, determining a preset incident angle of the laser head 11 according to the type of the object to be processed; the types of the object to be processed include reflective materials and non-reflective materials; Step S2, obtaining a moving path of the laser head 11 according to the processing requirements of the object to be processed; the processing requirements include a cutting shape; Step S3, adjusting the position of the light-emitting end of the laser head 11 by moving the adjusting component 20 to obtain the laser head 11 at a preset incident angle; Step S4, according to the moving path of the laser head 11, the first moving assembly 30 and the second moving assembly 40 drive the laser head 11 to move accordingly, so that the laser beam output by the laser head 11 performs laser cutting on the object to be processed.

[0047] It should be noted that by determining the preset incident angle of the laser head 11 according to the type of the object to be processed (reflective material and non-reflective material), the reflection and scattering of the laser beam can be effectively reduced, thereby optimizing the absorption of the laser on the material and improving the cutting effect and cutting quality. The moving path of the laser head 11 obtained according to the processing requirements of the object to be processed (such as the cutting shape) makes the method highly flexible and adaptable, can meet the cutting requirements of different shapes and complexities, and broaden the application scope of laser processing. The position of the light output end of the laser head 11 is adjusted by adjusting the component 20 to achieve the preset incident angle, ensure the stability and accuracy of the laser head 11 during the cutting process, ensure that the cutting process will not reduce the cutting accuracy due to the position deviation of the laser head 11, and reduce the error rate in the production process. Through the coordinated driving of the first moving component 30 and the second moving component 40, the efficient and precise movement of the laser head 11 can be achieved, which can maximize the processing speed and efficiency, thereby improving the overall production capacity and shortening the processing cycle.

[0048] As described above, the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features thereof may be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A multi-lens laser processing equipment, characterized in that: include: A laser processing assembly (10), an adjustment assembly (20), a first movable assembly (30), and a second movable assembly (40); the laser processing assembly (10) comprises a laser head (11) for outputting a laser beam and laser cutting an object to be processed, the laser head (11) being arranged along a first direction, and a light input end of the laser head (11) being movably connected to the first movable assembly (30); The adjusting component (20) is used to move and adjust the position of the light emitting end of the laser head (11); the first moving component (30) is used to drive the laser head (11) and the adjusting component (20) to move along a second direction; and the two second moving components (40) arranged side by side are used to synchronously drive the first moving component (30) to move along a third direction; the first direction, the second direction and the third direction are arranged perpendicular to each other.

2. The multi-lens laser processing equipment according to claim 1, characterized in that: The first moving assembly (30) comprises a first moving platform (31) and a first moving frame (32) connected to the second moving assembly (40), wherein the first moving frame (32) is mounted with a first moving motor for driving the first moving platform (31) to move along a second direction; The first mobile platform (31) comprises a first sliding block (311) slidably connected to the first mobile frame (32); a first mounting plate (312) is fixedly mounted on the first sliding block (311); and a second mounting plate (313) is fixedly connected to the first mounting plate (312).

3. The multi-lens laser processing equipment according to claim 2, characterized in that: The adjustment component (20) comprises an adjustment member (21) and an adjustment cylinder (22); one end of the adjustment member (21) is in contact with the laser head (11), and the other end of the adjustment member (21) is slidably connected to the first sliding block (311); The adjusting cylinder (22) is used to drive the adjusting member (21) to move so that the light emitting end of the laser head (11) is away from the first sliding block (311).

4. The multi-lens laser processing equipment according to claim 3, characterized in that: The adjusting assembly (20) further comprises an adjusting block (23), the adjusting cylinder (22) being mounted on the second mounting plate (313), and the telescopic rod of the adjusting cylinder (22) being fixedly connected to the adjusting block (23); A T-shaped slide groove (3111) is provided in the first sliding block (311); one end of the adjusting block (23) away from the adjusting cylinder (22) passes through the first mounting plate (312) and abuts against the adjusting member (21); a return spring (24) is installed in the slide groove (3111); one end of the return spring (24) is fixedly connected to the slide groove (3111), and the other end of the return spring (24) is connected to the adjusting member (21).

5. The multi-lens laser processing equipment according to claim 4, characterized in that: The adjusting member (21) comprises a first adjusting portion (211) and a second adjusting portion (212) which are connected to each other, the first adjusting portion (211) being arranged in an arc-shaped block and abutting against the light-emitting end of the laser head (11), and the second adjusting portion (212) being arranged in a square block and slidably connected in the slide groove (3111); The return spring (24) is connected to the second adjustment portion (212), the adjustment block (23) is provided with a first inclined surface (231), and the second adjustment portion (212) is provided with a second inclined surface (2121) in contact with the first inclined surface (231).

6. The multi-lens laser processing equipment according to claim 5, characterized in that: The light inlet end of the laser head (11) is sleeved with a sleeve (314) rotatably connected to the second mounting plate (313), and the light inlet end of the laser head (11) is provided with a light inlet port (111); The sleeve (314) is provided with a light hole (3141) corresponding to the light inlet (111), and the outer wall of the laser head (11) is provided with an abutment groove (112) abutting against the first adjustment portion (211), and the thickness of the abutment groove (112) in the first direction is greater than the thickness of the first adjustment portion (211) in the first direction.

7. The multi-lens laser processing equipment according to any one of claims 1 to 6, characterized in that: The second moving assembly (40) comprises a second moving frame (41), a second moving platform (42) fixedly connected to the first moving assembly (30) being slidably connected to the second moving frame (41), and a second moving motor (43) for driving the second moving platform (42) to move along a third direction being mounted on the second moving frame (41); One end of the first movable component (30) is fixedly connected to one of the second movable platforms (42), and the other end of the first movable component (30) is fixedly connected to another of the second movable platforms (42).

8. The multi-lens laser processing equipment according to any one of claims 1 to 6, characterized in that: The laser processing assembly (10) further comprises a laser generator (12), a first reflector (13) and a second reflector (14), wherein the first reflector (13) is arranged adjacent to the laser generator (12); The second reflector (14) is mounted on the first moving component (30), and the first reflector (13) and the second reflector (14) are used to reflect the laser beam generated by the laser generator (12) into the laser head (11).

9. The multi-lens laser processing equipment according to claim 1, characterized in that: It also includes a casing (50) and a workbench (60) installed in the casing (50), wherein the workbench (60) is used to place an object to be processed; The laser processing assembly (10), the adjustment assembly (20), the first movable assembly (30), and the second movable assembly (40) are all installed in the housing (50), and the two second movable assemblies (40) are distributed on opposite sides of the workbench (60); The workbench (60) comprises a plurality of support seats (61) fixedly connected to the housing (50), wherein the support seats (61) are provided with a first base plate (62), a second base plate (63) and a partition net (64) in sequence along a first direction.

10. A laser processing method, applied to the multi-lens laser processing equipment as claimed in any one of claims 1 to 9, characterized in that: include: Step S1, determining a preset incident angle of a laser head (11) according to the type of the object to be processed; the type of the object to be processed includes reflective materials and non-reflective materials; Step S2, obtaining a moving path of the laser head (11) according to a processing requirement of the object to be processed; the processing requirement includes a cutting shape; Step S3, moving and adjusting the light output end position of the laser head (11) by means of the adjustment component (20) to obtain the laser head (11) at a preset incident angle; Step S4, according to the moving path of the laser head (11), the laser head (11) is driven to move correspondingly by the first moving component (30) and the second moving component (40), so that the laser beam output by the laser head (11) performs laser cutting on the object to be processed.

Citation Information

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