Method for improving efficiency of panhandle polishing process and related equipment

Abstract

The invention relates to the field of panhandle polishing processes, in particular to a method for improving panhandle polishing process efficiency and related equipment. The method comprises the steps that a starting instruction is received, and a first tray is moved to a first target station of a first machining path; the target machining type of the panhandle is obtained, the first target polishing parameter is matched with the first target station based on the target machining type, and the first position of the panhandle is polished; whether the first target station is the last polishing station of the first machining path or not is detected; if not, the first tray is moved to support the panhandle to a second target station of the first machining path; a second target polishing parameter is matched based on the second target station to polish the second position of the panhandle; and whether the second target station is the last polishing station of the first machining path or not is detected, if yes, polishing of the panhandle is completed, and discharging operation is executed. The panhandle polishing device has high flexibility in panhandle polishing, and can efficiently guarantee a good machining effect.

Description

Technical Field

[0001] The present application relates to the field of pot handle polishing technology, and in particular to a method for improving the efficiency of pot handle polishing technology and related equipment. Background Art

[0002] As an important part of modern manufacturing, pot handle polishing occupies a key position in the field of kitchenware production. The level of its technical level directly affects the appearance quality and actual service life of the product. In recent years, with the continuous upgrading of market demand and the increasingly stringent requirements of consumers on the surface fineness of products, the traditional manual polishing process has shown many disadvantages and cannot meet the high standards of large-scale industrial production. Therefore, automated polishing technology has gradually emerged and become one of the mainstream development directions in the industry. By combining the application of advanced mechanical equipment with scientific methods, the production efficiency has been effectively improved, and the high consistency of product quality has been ensured, which has greatly promoted the overall progress of the industry.

[0003] In the existing practice of pot handle polishing, the two main methods widely used in the industry are fixed multi-station polishing and single-station repetitive positioning polishing. Fixed multi-station polishing systems are generally designed with multiple specialized functional areas, the so-called "polishing stations". Each station has a specific task. For example, some complex machines can use a mechanical arm to grab the object to be processed and pass through each polishing node along a predetermined route to complete the entire process; in addition, some production lines use manual or semi-automatic conveyors to achieve the purpose of material flow. In contrast, single-station repetitive positioning polishing focuses on precise control, using precision instruments at a fixed point to repeatedly adjust until all designated areas are covered before continuing to the next stage of work.

[0004] However, regardless of the type of existing technology, the main challenge they face is poor adaptability and efficiency. Especially when it comes to pot handles with special structures, traditional methods often expose the problem of low efficiency due to the need to accurately apply different degrees of pressure to different parts and maintain the appropriate angle. At the same time, its scope of application is also strictly limited, and it is difficult to quickly switch to adapt to different types of product models. This limitation not only slows down the speed of the overall production process, but also increases additional operating difficulty and human resource investment, which in turn affects the quality stability of the final product. In order to solve these problems, it is urgent to develop a technical solution for pot handle polishing that is highly flexible, efficient and guarantees good processing results. Summary of the invention

[0005] The purpose of this application is to overcome the above-mentioned technical problems and provide a method and related equipment for improving the efficiency of the pot handle polishing process.

[0006] In a first aspect, an embodiment of the present application discloses a method for improving the efficiency of a pot handle polishing process, using the following scheme: A method for improving the efficiency of a pot handle polishing process, comprising: receiving a start instruction, moving a first tray to a first target station of a first processing path, the first tray being used to support a pot handle; obtaining a target processing type of the pot handle, and matching a first target polishing parameter to the first target station based on the target processing type, so as to adjust a position parameter of the first tray relative to a first polishing machine and a polishing pressure parameter of the first polishing machine, so as to polish a first position of the pot handle; detecting whether the first target station is the last polishing station of the first processing path; if not, moving the first tray to support the pot handle to a second target station of the first processing path, the second target station being the next station of the first target station; matching a second target polishing parameter based on the second target station, adjusting a position parameter of the first tray relative to a second polishing machine and a polishing pressure parameter of the second polishing machine, so as to polish a second position of the pot handle; detecting whether the second target station is the last polishing station of the first processing path, and if so, completing the polishing of the pot handle and performing a material unloading operation.

[0007] By adopting the above technical solution, the movement and processing of the pot handle between different polishing stations can be automatically controlled, which improves the efficiency and accuracy of the pot handle polishing process. Specific effects include: by receiving the start command and automatically moving the first tray to the designated station, manual intervention is reduced and the convenience of operation is improved. The corresponding polishing parameters are matched according to the target processing type of the pot handle to ensure the pertinence and effectiveness of the polishing process, thereby improving product quality. After polishing at each station, it is checked whether it is the last station operation, which avoids unnecessary process flow and ensures the orderliness and integrity of the process. Precise polishing treatment is performed on different positions of the pot handle, which significantly improves the consistency and uniformity of the surface treatment.

[0008] Optionally, before receiving the start instruction and moving the first pallet to the first target station of the first processing path, it also includes: based on different processing types of the pot handle, receiving the position parameters of the moving pallet set for each station and the polishing pressure parameters of each polishing machine, generating polishing parameters for different positions of the pot handle relative to the station, and the polishing parameters include the first target polishing parameters and the second target polishing parameters.

[0009] By adopting the above technical solution, the polishing parameters of each station can be pre-set before the polishing process begins, including the position parameters of the mobile tray and the pressure parameters of the polishing machine. This measure makes the entire polishing process more standardized and precise, avoiding the errors that may be caused by real-time parameter adjustment, thereby improving the consistency and quality stability of the pot handle polishing. Specifically, this solution can ensure that pot handles of different processing types receive appropriate polishing treatment at each station, further improving production efficiency and product qualification rate.

[0010] Optionally, the performing of the unloading operation includes: moving the first tray to a first unloading position, adjusting the position of the clamping member relative to the pot handle to clamp the pot handle for unloading; based on a preset cycle instruction, adjusting the clamping member to clamp the pot handle to be processed from the target position to the first tray, moving the first tray from the first unloading position to multiple polishing stations of the second processing path in sequence, polishing different positions of the pot handle, and after polishing is completed, moving the first tray to the second unloading position for unloading, wherein the second unloading position is also the loading position of the first processing path, and the first unloading position is also the loading position of the second processing path.

[0011] By adopting the above technical solution, the automated unloading and reprocessing process in the pot handle polishing process is realized. The specific effects are as follows: by moving the first tray to the first unloading position and using the clamping piece to clamp the polished pot handle for unloading, the automation degree and work efficiency of the unloading process are improved. Based on the preset cycle instructions, the pot handle to be processed can be clamped from the target position to the first tray in an orderly manner to ensure the continuity of the production process. The first tray is moved to multiple polishing stations of the second processing path in turn to polish different positions of the pot handle, which improves equipment utilization and processing flexibility. After polishing is completed, the moving path of the first tray is reasonably planned, and it is moved to the second unloading position for unloading, while taking into account the loading requirements of the first processing path and the second processing path, optimizing the overall process layout, and reducing unnecessary material handling links.

[0012] Optionally, the first processing path and the second processing path are both provided with five polishing stations, wherein in the first processing path, the first target station and the second target station are two consecutive ones of the five polishing stations.

[0013] By adopting the above technical solution, the specific structures of the first processing path and the second processing path can be clearly defined, that is, both of them include 5 polishing stations, and the first target station and the second target station are further determined to be two consecutive stations in the first processing path. This design makes the movement of the pot handle between different stations more orderly and efficient, avoiding unnecessary repetition or cross movement, thereby improving the time utilization rate and spatial layout rationality of the entire polishing process.

[0014] Optionally, it also includes: determining whether the first station of the first processing path has completed polishing a position of the pot handle supported by the first tray; if so, moving the first tray to the second station of the first processing path, and moving the second tray supporting the pot handle to the first station of the first processing path.

[0015] By adopting the above technical solution, it is possible to automatically switch the tray to the next station and release the current station to a new pot handle to be processed after polishing one position of the pot handle is completed, thereby improving production efficiency and reducing equipment idle time. Specifically, the solution enables the first station to start processing the new pot handle immediately after polishing the first position of the previous pot handle is completed, avoiding waiting time and waste of resources.

[0016] Optionally, the method further includes: receiving modification instructions of position parameters of the polishing station and polishing pressure parameters to update the polishing parameters.

[0017] By adopting the above technical solution, the position parameters and polishing pressure parameters of the polishing station can be dynamically adjusted during the actual production process. This function enables the system to adapt to different processing requirements or correct the original parameter deviation, thereby improving the flexibility and accuracy of the pot handle polishing process and ensuring stable product quality. Specifically, the solution allows operators to modify parameters in a timely manner according to actual conditions, avoiding processing errors caused by fixed parameters, and further improving the intelligence and practicality of the system.

[0018] In a second aspect, an embodiment of the present application discloses a remote monitoring system based on an OBD vehicle diagnostic system, which adopts the following scheme: A system for improving the efficiency of a pot handle polishing process, comprising: a first receiving module, for moving a first tray to a first target station of a first processing path, the first tray being used to support a pot handle; a first matching module, for acquiring a pot handle processing type, and matching a first target polishing parameter to the first target station based on the processing type, so as to adjust a position parameter of the first tray relative to a first polishing machine and a polishing pressure parameter of the first polishing machine, so as to polish a first position of the pot handle; a first detection module, for detecting whether the first target station is the last polishing station of the first processing path; if not, moving the first tray to support the pot handle to a second target station of the first processing path, the second target station being the next station of the first target station; a second matching module, for matching a second target polishing parameter based on the second target station, adjusting a position parameter of the first tray relative to a second polishing machine and a polishing pressure parameter of the second polishing machine, so as to polish a second position of the pot handle; a second detection module, for detecting whether the second target station is the last polishing station of the first processing path, and if so, completing the polishing of the pot handle and performing a material unloading operation.

[0019] By adopting the above technical solution, the orderly transfer and precise polishing of the pot handle between multiple stations are automatically controlled. Specific effects are as follows: the first receiving module can automatically move the first tray to the designated first target station to ensure that the initial position of the pot handle is accurate. The first matching module accurately matches the polishing parameters according to the processing type of the pot handle, improving the quality and adaptability of the polishing. The first detection module monitors in real time whether the current station is the last polishing station, effectively avoiding unnecessary process flow, and timely adjusts the tray position to the next target station in the case of non-final stations, ensuring process continuity. The second matching module optimizes the polishing parameter configuration again for the new target station, further improving the polishing accuracy. The second detection module repeatedly confirms the final station status and triggers the unloading action when the conditions are met, ensuring the smooth completion of the entire process.

[0020] Optionally, it also includes: a second receiving module, which is used to receive the position parameters of the moving pallet set for each workstation and the polishing pressure parameters of each polishing machine based on different processing types of the pot handle, and generate polishing parameters for different positions of the pot handle relative to the workstation, wherein the polishing parameters include the first target polishing parameters and the second target polishing parameters.

[0021] By adopting the above technical solution, the mobile pallet position parameters and polishing pressure parameters of the polishing machine corresponding to each workstation can be set in advance according to different processing types, and accurate polishing parameters for different positions of the pot handle can be generated. This makes the entire polishing process more flexible and accurate, and effectively improves the consistency and efficiency of the pot handle polishing process. The specific effects are as follows: The parameter configuration function introduced by the second receiving module ensures that the system can adapt to the processing requirements of various pot handle types, and improves the versatility and scalability of the system. The pre-set position parameters and polishing pressure parameters reduce the need for real-time adjustment, thereby reducing the probability of error and further ensuring the stability of product quality.

[0022] In a third aspect, an embodiment of the present application discloses an electronic device, which adopts the following solution: An electronic device comprises: a memory and a processor, wherein the memory is used to store a computer program; and the processor is used to implement the steps of any of the above methods when executing the computer program.

[0023] In a fourth aspect, an embodiment of the present application discloses a computer-readable storage medium, which adopts the following scheme: A computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the steps of any of the above methods are implemented.

[0024] In summary, the present application includes at least one of the following beneficial technical effects: 1. For different types of pot handles, the polishing parameters corresponding to each station are set in advance to dynamically match the target station, realizing adaptive processing of different types of pot handles, significantly improving the flexibility and efficiency of the production line; 2. During the polishing process, the status of each workstation is detected and judged in real time, thus avoiding unnecessary repeated operations, greatly shortening the processing cycle and improving process efficiency; 3. The introduction of multi-station collaborative operation mode enables the same pallet to flow in an orderly manner between different stations, making full use of equipment resources while ensuring the quality requirements of all-round polishing of complex-shaped pot handles. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 An equipment process architecture used in a method for improving the efficiency of a pot handle polishing process disclosed in an embodiment of the present application; Figure 2 A schematic flow chart of a method for improving the efficiency of a pot handle polishing process disclosed in one embodiment of the present application; Figure 3 Schematic diagram of the interface for selecting different workstations for setting; Figure 4A schematic diagram of the interface for setting the position of the workstation and the conveying speed of the conveyor chain; Figure 5 A schematic diagram of an interface for setting the position coordinates and position moving speed of a position adjustment mechanism of a target station; Figure 6 A schematic structural diagram of a system for improving the efficiency of a pot handle polishing process disclosed in another embodiment of the present application; Figure 7 This is a schematic diagram of the structure of an electronic device disclosed in yet another embodiment of the present application. DETAILED DESCRIPTION

[0026] The present application is further described in detail below in conjunction with the accompanying drawings.

[0027] The embodiments of the present application will be described in more detail below with reference to the accompanying drawings. Although the embodiments of the present application are shown in the accompanying drawings, it should be understood that the present application can be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided to make the present application more thorough and complete, and to fully convey the scope of the present application to those skilled in the art.

[0028] The terms used in this application are for the purpose of describing specific embodiments only and are not intended to limit this application. The singular forms of "a", "an" and "the" used in this application and the appended claims are also intended to include plural forms unless the context clearly indicates other meanings. It should also be understood that the term "and / or" used herein refers to and includes any or all possible combinations of one or more associated listed items.

[0029] It should be understood that although the terms "first", "second", etc. may be used in the present application to describe various information, such information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other. For example, without departing from the scope of the present application, the first information may also be referred to as the second information, and similarly, the second information may also be referred to as the first information. Thus, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0030] The technical solution of the embodiments of the present application is described in detail below with reference to the accompanying drawings.

[0031] [First embodiment] See also Figure 1, which is an equipment process architecture used in a method for improving the efficiency of a pot handle polishing process disclosed in an embodiment of the present application. The equipment process architecture involves two processing paths, with 5 polishing stations of a first processing path at the top and 5 polishing stations of a second processing path at the bottom. The two side ends are loading and unloading stations for trays and pot handles, to take into account the loading and unloading requirements of the first processing path and the second processing path.

[0032] Among them, each polishing station is provided with a driving mechanism, a polishing machine and a position adjustment mechanism. The driving mechanism drives the tray to move to each polishing station along a predetermined trajectory. The polishing machine processes the area to be processed of the handle according to the matching polishing parameters. The position adjustment mechanism includes an X-axis motor and a Y-axis motor, and the corresponding matching parameters of the X-axis movement and the Y-axis movement parameters are used to drive the tray to move in the X-axis and Y-axis directions to adjust the position of the pot handle on the tray relative to the polishing machine to ensure that each operation can be accurately positioned. The loading and unloading stations on both sides are provided with a clamping mechanism, including a clamping member, an X-axis motor, a Y-axis motor and a Z-axis lifting motor (not shown in the figure). The clamping member can flexibly clamp the pot handle for loading or unloading under the action of the X-axis motor, the Y-axis motor and the Z-axis lifting motor. In this way, the polishing station and the loading and unloading station through the two processing paths can realize efficient processing of the pot handle.

[0033] See also Figure 2 , a method for improving the efficiency of a pot handle polishing process, comprising the following steps: S10, receiving a start instruction, and moving the first pallet to the first target station of the first processing path; The first tray is used to support the pot handle, and in step S10, it is assumed that the first tray supports the pot handle. It is noted that the first target station is not limited to the first processing station of the first processing path, and can be any processing station.

[0034] S20, obtaining a target processing type of the pot handle, and matching a first target polishing parameter to a first target station based on the target processing type, so as to adjust a position parameter of the first tray relative to the first polishing machine and a polishing pressure parameter of the first polishing machine, so as to polish the first position of the pot handle; Among them, the processing type of the pot handle is determined based on the shape of the pot handle and the processing requirements, so as to increase the flexibility and applicability of the equipment process.

[0035] In this embodiment, each processing type corresponds to different target polishing parameters, the target polishing parameters include the position parameters of the tray movement and the polishing pressure parameters of the polishing machine, and the position parameters include the X-axis coordinates and Y-axis coordinates of the tray movement, so that the operator can adjust the position parameters based on the coordinates. It is explained here that in the equipment process, multiple positions of the pot handle can be polished in sequence, such as 5 polishing stations polishing 5 positions on the pot handle in sequence.

[0036] It is worth mentioning here that before step S10, the following steps are also included: S01, based on different processing types of the pot handle, receiving the position parameters of the movable tray set for each work station and the polishing pressure parameters of each polishing machine, and generating polishing parameters of different positions of the pot handle relative to the work station; See also Figure 3 , which is an interface for operators to select different workstations and set relevant parameters based on different processing types of pot handles. Figure 4 , which is a schematic diagram of the interface for operators to set the conveyor chain conveying speed based on the actual position of the workstation; see Figure 5 , which is an interface for the operator to set the position coordinates and position moving speed of the position adjustment mechanism after selecting the target station. In this way, the operator can set the processing parameters of the pot handle through the operation interface based on the type of pot handle and actual needs.

[0037] In this embodiment, the polishing parameters include a first target polishing parameter and a second target polishing parameter, and the second target polishing parameter corresponds to the second target polishing parameter described in step S40 below. Of course, in this embodiment, the polishing parameters are not limited to only including the first target polishing parameter and the second target polishing parameter. In addition, the position parameters and polishing pressure parameters of each polishing station may be the same or different, which is not limited here.

[0038] S30, detecting whether the first target station is the last polishing station of the first processing path; if not, moving the first tray to support the pot handle to the second target station of the first processing path; Among them, the second target station is the next station of the first target station, that is, the first target station and the second target station are two consecutive stations among the five polishing stations. Through this step S30, it is possible to monitor in real time whether the current station is the last polishing station, which can effectively avoid unnecessary process flow, and in the case of a non-final station, timely adjust the tray position to the next target station, ensuring process continuity.

[0039] S40, adjusting the position parameter of the first tray relative to the second polishing machine and the polishing pressure parameter of the second polishing machine based on matching the second target polishing parameter at the second target station, so as to polish the second position of the pot handle; In this step S40, the polishing parameters corresponding to the new target position are matched, and the polishing accuracy of different positions of the pot handle can be further improved. Here, the description of the matching of the target polishing parameters in this step can be referred to the above step S20, which will not be described here.

[0040] S50, detecting whether the second target station is the last polishing station of the first processing path, and if so, completing the polishing of the pot handle and performing the unloading operation; Among them, step S50 is used to repeatedly confirm the final workstation status and trigger the unloading action when the conditions are met, which can ensure the smooth completion of the entire process.

[0041] Furthermore, in step S50, a material unloading operation is performed, which specifically includes: S51, moving the first tray to the first unloading position, adjusting the position of the clamping member relative to the pot handle, and clamping the pot handle for unloading; Among them, adjusting the position of the clamping member can be understood as achieving free movement of the clamping member in space by adjusting the coordinate position of the clamping member relative to the X-axis, the Y-axis, and the Z-axis.

[0042] S52, based on the preset cycle instruction, adjusting the clamping member to clamp the pot handle to be processed from the target position to the first tray, moving the first tray from the first unloading position to the plurality of polishing stations of the second processing path in sequence, performing polishing on different positions of the pot handle, and after polishing, moving the first tray to the second unloading position for unloading; Here, it is explained that the second unloading position is also the loading position of the first processing path, and the first unloading position is also the loading position of the second processing path. In this way, the first processing path and the second processing path form a circulation path.

[0043] Furthermore, during the execution of the equipment process, it also includes: S60, determining whether the first station of the first processing path has completed polishing a position of the pot handle supported by the first tray, and if so, moving the first tray to the second station of the first processing path, and moving the second tray supporting the pot handle to the first station of the first processing path.

[0044] Among them, step S60 can realize that after polishing of one position of the pot handle is completed, the tray is automatically switched to the next station and the current station is released to a new pot handle to be processed, thereby improving production efficiency and reducing equipment idle time. Specifically, this solution enables the first station to start processing the new pot handle immediately after polishing of the first position of the previous pot handle is completed, avoiding waiting time and waste of resources.

[0045] Furthermore, in this embodiment, it also includes: S70, receiving a modification instruction of a position parameter of a polishing station and a polishing pressure parameter to update the polishing parameters.

[0046] The setting of step S70 can dynamically adjust the position parameters and polishing pressure parameters of the polishing station during the actual production process, so as to adapt to different processing requirements or correct the original parameter deviation, thereby improving the flexibility and accuracy of the pot handle polishing process and ensuring stable product quality.

[0047] To summarize, the first embodiment of the present invention discloses a method for improving the efficiency of the pot handle polishing process. By matching corresponding polishing parameters according to the target processing type of the pot handle and dynamically adjusting the tray position and polishing pressure, adaptive processing of different types of pot handles is achieved, significantly improving the flexibility and efficiency of the production line. Polishing operations are performed in sequence based on the workstation sequence and real-time detection of whether the current workstation is the last workstation ensures a high degree of automation of the polishing process and the accuracy of process control. Combined with the cycle design of unloading and loading, the production rhythm is optimized, manual intervention is reduced, and the operating efficiency and stability of the overall system are improved.

[0048] [Second embodiment] See also Figure 6 In the second embodiment of the present application, a remote monitoring system based on an OBD vehicle diagnostic system is disclosed, and the system includes: a first receiving module 210, a first matching module 220, a first detection module 230, a second matching module 240 and a second detection module 250.

[0049] Among them, the first receiving module 210 is used to move the first pallet to the first target station of the first processing path, and the first pallet is used to support the pot handle; the first matching module 220 is used to obtain the processing type of the pot handle, and match the first target polishing parameter to the first target station based on the processing type, so as to adjust the position parameter of the first pallet relative to the first polishing machine and the polishing pressure parameter of the first polishing machine to polish the first position of the pot handle; the first detection module 230 is used to detect whether the first target station is the last polishing station of the first processing path; if not, the first pallet is moved to support the pot handle to the second target station of the first processing path, and the second target station is the next station of the first target station; the second matching module 240 is used to match the second target polishing parameter based on the second target station, adjust the position parameter of the first pallet relative to the second polishing machine and the polishing pressure parameter of the second polishing machine to polish the second position of the pot handle; the second detection module 250 is used to detect whether the second target station is the last polishing station of the first processing path. If so, the polishing of the pot handle is completed and the unloading operation is performed.

[0050] Furthermore, in this embodiment, a second receiving module 260 is also included, which is used to receive the position parameters of the moving pallet set for each workstation and the polishing pressure parameters of each polishing machine based on different processing types of the pot handle, and generate polishing parameters for different positions of the pot handle relative to the workstation, wherein the polishing parameters include the first target polishing parameters and the second target polishing parameters.

[0051] It should be noted that the method for improving the efficiency of the pot handle polishing process implemented by the system for improving the efficiency of the pot handle polishing process disclosed in the second embodiment of the present application is the same as the first embodiment, so it will not be described in detail here. Optionally, each module in this embodiment and the above-mentioned other operations or functions are respectively for implementing the methods in the aforementioned embodiments.

[0052] [Third embodiment] See also Figure 7 In the third embodiment of the present application, an electronic device is disclosed, which includes: a memory 310 and a processor 320, the memory 310 is used to store computer programs; the processor 320 is used to implement the steps of a method for improving the efficiency of the pot handle polishing process described in the first embodiment when executing the computer program. For details, please refer to the above, so it will not be described in detail here.

[0053] The technical effect of an electronic device provided by this embodiment in actual application is the same as the technical effect of a method for improving the efficiency of a pot handle polishing process in the first embodiment.

[0054] [Fourth embodiment] In the fourth embodiment of the present application, a computer-readable storage medium is disclosed. The computer-readable storage medium is, for example, a non-volatile memory, such as: magnetic media (such as hard disks, floppy disks, and tapes), optical media (such as CDROM disks and DVDs), magneto-optical media (such as optical disks), and hardware devices specially constructed to store and execute computer-executable instructions (such as read-only memory (ROM), random access memory (RAM), flash memory, etc.). A computer program is stored on the computer-readable storage medium. The computer-readable storage medium can be executed by one or more processors or processing devices to implement a method for improving the efficiency of the pot handle polishing process in the aforementioned embodiment.

[0055] In addition, it can be understood that the aforementioned embodiments are only exemplary descriptions of the present invention. Under the premise that the technical features do not conflict, the structures do not contradict, and the purpose of the present invention is not violated, the technical solutions of the various embodiments can be arbitrarily combined and used in combination.

[0056] In the several embodiments provided by the present invention, it should be understood that the disclosed methods, systems and devices can be implemented in other ways. For example, the modules included in the system described above are only schematic, and the division of modules is only a logical function division. There may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be an indirect coupling or communication connection through some interfaces, devices or units, which can be electrical, mechanical or other forms.

[0057] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the present embodiment.

[0058] In addition, each functional unit / module in each embodiment of the present invention may be integrated into one processing unit / module, or each unit / module may exist physically separately, or two or more units / modules may be integrated into one unit / module. The above-mentioned integrated unit / module may be implemented in the form of hardware or in the form of hardware plus software functional units / modules.

[0059] The above-mentioned integrated unit / module implemented in the form of a software functional unit / module can be stored in a computer-readable storage medium. The above-mentioned software functional unit is stored in a storage medium, including a number of instructions for enabling one or more processors of a computer device (which can be a personal computer, a server, or a network device, etc.) to perform some steps of the method described in each embodiment of the present application. The aforementioned storage medium includes: U disk, mobile hard disk, read-only memory (Read-Only Memory, referred to as ROM), random access memory (Random Access Memory, referred to as RAM), disk or optical disk and other media that can store program codes.

[0060] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A method for improving the efficiency of a pot handle polishing process, characterized in that: include: receiving a start instruction, and moving a first tray to a first target station of a first processing path, wherein the first tray is used to support a pot handle; Acquire a target processing type of the pot handle, and match a first target polishing parameter to the first target position based on the target processing type, so as to adjust a position parameter of the first tray relative to the first polishing machine and a polishing pressure parameter of the first polishing machine, so as to polish the first position of the pot handle; Detecting whether the first target station is the last polishing station of the first processing path, if not, moving the first tray to support the pot handle to the second target station of the first processing path, the second target station being the next station of the first target station; Based on matching the second target polishing parameter with the second target station, adjusting the position parameter of the first tray relative to the second polishing machine and the polishing pressure parameter of the second polishing machine to polish the second position of the pot handle; Detect whether the second target station is the last polishing station of the first processing path. If so, complete the polishing of the pot handle and perform the unloading operation.

2. The method according to claim 1, characterized in that Before receiving the start instruction and moving the first pallet to the first target station of the first processing path, the method further includes: Based on different processing types of pot handles, the position parameters of the moving tray set for each workstation and the polishing pressure parameters of each polishing machine are received to generate polishing parameters for different positions of the pot handle relative to the workstation, wherein the polishing parameters include the first target polishing parameters and the second target polishing parameters.

3. The method according to claim 1, characterized in that The performing of the blanking operation comprises: Moving the first tray to a first unloading position, adjusting the position of the clamping member relative to the pot handle to clamp the pot handle for unloading; Based on the preset cycle instructions, the clamping member is adjusted to clamp the pot handle to be processed from the target position to the first pallet, and the first pallet is moved from the first unloading position to the multiple polishing stations of the second processing path in sequence, and different positions of the pot handle are polished. After polishing is completed, the first pallet is moved to the second unloading position for unloading, wherein the second unloading position is also the loading position of the first processing path, and the first unloading position is also the loading position of the second processing path.

4. The method according to claim 1, characterized in that The first processing path and the second processing path are both provided with five polishing stations, wherein in the first processing path, the first target station and the second target station are two consecutive ones of the five polishing stations.

5. The method according to claim 1, characterized in that Also includes: Determine whether the first station of the first processing path has completed polishing a position of the pot handle supported by the first tray. If so, move the first tray to the second station of the first processing path, and move the second tray supporting the pot handle to the first station of the first processing path.

6. The method according to claim 2, characterized in that Also includes: A modification instruction of a position parameter of a polishing station and a polishing pressure parameter is received to update the polishing parameter.

7. A system for improving the efficiency of a pot handle polishing process, characterized in that: include: A first receiving module, used for moving a first tray to a first target station of a first processing path, wherein the first tray is used for supporting a pot handle; a first matching module, configured to obtain a processing type of the pot handle, and match a first target polishing parameter to the first target position based on the processing type, so as to adjust a position parameter of the first tray relative to the first polishing machine and a polishing pressure parameter of the first polishing machine, so as to polish the first position of the pot handle; a first detection module, used to detect whether the first target station is the last polishing station of the first processing path; if not, move the first tray to support the pot handle to the second target station of the first processing path, the second target station being the next station of the first target station; A second matching module is used to match a second target polishing parameter based on the second target station, and adjust a position parameter of the first tray relative to the second polishing machine and a polishing pressure parameter of the second polishing machine to polish a second position of the pot handle; The second detection module is used to detect whether the second target station is the last polishing station of the first processing path. If so, the polishing of the pot handle is completed and the unloading operation is performed.

8. The system according to claim 7, characterized in that Also includes: The second receiving module is used to receive the position parameters of the movable pallet set for each workstation and the polishing pressure parameters of each polishing machine based on different processing types of the pot handle, and generate polishing parameters for different positions of the pot handle relative to the workstation, wherein the polishing parameters include the first target polishing parameters and the second target polishing parameters.

9. An electronic device, characterized in that: include: A memory and a processor, wherein the memory is used to store a computer program; The processor is configured to implement the steps of the method according to any one of claims 1 to 5 when executing the computer program.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the steps of the method according to any one of claims 1 to 5 are implemented.

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