Method and system for monitoring high temperature resistance of narrow grooves in ceramic composite material processing

Abstract

The present invention discloses a method and system for monitoring the high temperature resistance performance of narrow slots in a ceramic composite material processing process, and relates to the technical field of monitoring the high temperature resistance performance of narrow slots. The method for monitoring the high temperature resistance performance of narrow slots in a ceramic composite material processing process comprises the following steps: S1, performance evaluation after drilling; S2, first instability adjustment; S3, performance evaluation after milling; S4, second instability adjustment. The present invention adjusts the first ceramic processing parameter by the first ceramic performance parameter, then adjusts the first processing feedback according to the first vibration parameter standard deviation, then adjusts the second ceramic processing parameter according to the second ceramic performance parameter, and finally adjusts the second processing feedback according to the second vibration parameter standard deviation, thereby improving the accuracy of monitoring the high temperature resistance performance of narrow slots of ceramic composite materials, and solving the problem of inaccurate monitoring of the high temperature resistance performance of narrow slots caused by differences in the selection of ultrasonic vibration parameters in the ceramic composite material processing process in the prior art.

Description

Technical Field

[0001] The present invention relates to the technical field of narrow slot high temperature resistance performance monitoring, and in particular to a method and system for monitoring the high temperature resistance performance of narrow slots in a ceramic composite material processing process. Background Art

[0002] With the continuous development and advancement of ceramic matrix composite (CMC) preparation technology, the densification of materials has been significantly improved. Ceramic matrix composites (CMCs) are a type of hard, brittle, high-temperature-resistant composite material reinforced by rigid fibers that have been developed in recent years. While retaining the high-temperature resistance, oxidation resistance, wear resistance, and low density of ceramic materials, the presence of rigid reinforcing fibers enhances the material's toughness and significantly improves its impact load resistance. However, due to their high hardness, CMCs face a series of challenges when machining small holes with large aspect ratios or narrow grooves with large aspect ratios, making cutting difficult.

[0003] Existing technologies integrate thermal imagers, acoustic emission sensors, ultrasonic probes and electrical sensors to perform multi-parameter synchronous monitoring of temperature, stress, deformation and damage, comprehensively analyze the information of various physical fields, and realize comprehensive performance evaluation of narrow slots at high temperatures.

[0004] For example, the patent application with publication number CN117538325A discloses a method and system for evaluating the surface quality of fiber-reinforced ceramic-based composite materials, which includes: milling or grinding a sample to obtain a processed surface of the fiber-reinforced ceramic-based composite material; ultrasonically cleaning the processed surface with alcohol to obtain a cleaned processed surface; observing a microscopic morphology image of the cleaned processed surface using a laser confocal microscope; calculating characterization parameters based on the microscopic morphology image; and evaluating the surface quality of the fiber-reinforced ceramic-based composite material according to the characterization parameters.

[0005] For example, patent application CN119437970A discloses ultrasonic straight-edge tool wear testing equipment and methods, including a cutting system, a positioning system, a holding system, a tool system, and a testing system. The cutting system outputs linear reciprocating motion to simulate the low-frequency contact cycle between the grid and the tool; the positioning system enables precise tool alignment, ensuring precise contact between the tool and the sample; the holding system secures and tensions the sample to maintain stable cutting conditions; the tool system applies high-frequency vibrations to the ultrasonic straight-edge tool, simulating the high-frequency vibration cycles experienced in actual ultrasonic machining; and the testing system monitors the contact between the tool and the sample in real time, recording wear behavior.

[0006] However, in the process of implementing the technical solutions of the invention in the embodiments of the present application, the present application found that the above technology has at least the following technical problems:

[0007] In existing technology, ceramic composites have high hardness and brittleness. Therefore, during ultrasonic vibration-assisted machining, the frequency and amplitude of the vibrations can cause significant local temperature variations, resulting in large temperature gradients. Excessively large temperature gradients can lead to excessive thermal stress in the material, potentially causing microcracks or pore wall shedding. Especially in areas of high thermal stress, cracks can gradually expand, affecting the final machining quality. This can also lead to inaccurate monitoring of the high-temperature resistance of narrow slots due to differences in the selection of ultrasonic vibration parameters during ceramic composite machining. Summary of the Invention

[0008] The embodiments of the present application solve the problem of inaccurate monitoring of the high-temperature resistance performance of narrow slots caused by differences in the selection of ultrasonic vibration parameters during the processing of ceramic composite materials in the prior art by providing a method and system for monitoring the high-temperature resistance performance of narrow slots during the processing of ceramic composite materials, thereby improving the accuracy of monitoring the high-temperature resistance performance of narrow slots caused by differences in the selection of ultrasonic vibration parameters during the processing of ceramic composite materials.

[0009] The embodiment of the present application provides a method for monitoring the high-temperature resistance performance of narrow grooves in a ceramic composite material processing process, comprising the following steps: S1, performing an abnormal evaluation of the high-temperature resistance performance of the ceramic according to the first ceramic performance parameter obtained after drilling the workpiece to be processed, and judging whether to adjust the first ceramic processing parameter, wherein the adjustment of the first ceramic processing parameter is used to improve the processing success rate of the workpiece to be processed; S2, if the first ceramic processing parameter adjustment is not performed, directly executing S3, and if the first ceramic processing parameter adjustment is performed, after the first ceramic processing parameter adjustment is performed, performing an instability judgment according to the first vibration frequency standard deviation and the first vibration amplitude standard deviation within a preset adjustment period, and based on The result of the instability judgment is used to determine whether to perform the first processing feedback adjustment, which is used to improve the processing stability of the workpiece to be processed; S3, an abnormal evaluation of the high-temperature resistance of the ceramic is performed based on the second ceramic performance parameters obtained after milling the workpiece to be processed, to determine whether to perform the second ceramic processing parameter adjustment; S4, if the second ceramic processing parameter adjustment is not performed, continue the detection; if the second ceramic processing parameter adjustment is performed, after the second ceramic processing parameter adjustment is performed, an instability judgment is performed based on the second vibration frequency standard deviation and the second vibration amplitude standard deviation within the preset adjustment period, and based on the result of the instability judgment, it is determined whether to perform the second processing feedback adjustment.

[0010] An embodiment of the present application provides a narrow groove high-temperature resistance performance monitoring system for a ceramic composite material processing process, comprising: a post-drilling performance evaluation module, a first instability adjustment module, a post-milling performance evaluation module, and a second instability adjustment module; wherein the post-drilling performance evaluation module is used to perform abnormal evaluation of the high-temperature resistance performance of the ceramic according to the first ceramic performance parameter obtained after drilling the workpiece to be processed, and to determine whether to perform a first ceramic processing parameter adjustment, the first ceramic processing parameter adjustment being used to improve the processing success rate of the workpiece to be processed; the first instability adjustment module is used to directly execute the function of the post-milling performance evaluation module if the first ceramic processing parameter adjustment is not performed, and if the first ceramic processing parameter adjustment is performed, then after the first ceramic processing parameter adjustment is performed, according to the first vibration frequency within the preset adjustment period The first vibration amplitude standard deviation is used to make an instability judgment, and the first processing feedback adjustment is judged based on the result of the instability judgment. The first processing feedback adjustment is used to improve the processing stability of the workpiece to be processed; the post-milling performance evaluation module is used to perform abnormal evaluation of the high-temperature performance of the ceramic according to the second ceramic performance parameters obtained after milling the workpiece to be processed, and judge whether to adjust the second ceramic processing parameters; the second instability adjustment module is used to continue the detection if the second ceramic processing parameter adjustment is not performed. If the second ceramic processing parameter adjustment is performed, after the second ceramic processing parameter adjustment is performed, the instability judgment is made according to the second vibration frequency standard deviation and the second vibration amplitude standard deviation within the preset adjustment period, and the second processing feedback adjustment is judged based on the result of the instability judgment.

[0011] One or more technical solutions provided in the embodiments of this application have at least the following technical effects or advantages:

[0012] 1. The first ceramic processing parameter is adjusted by the first ceramic performance parameter, and then the first processing feedback is adjusted according to the standard deviation of the first vibration parameter. Then, the second ceramic processing parameter is adjusted according to the second ceramic performance parameter. Finally, the second processing feedback is adjusted according to the standard deviation of the second vibration parameter, thereby improving the processing success rate, thereby achieving the improvement of the accuracy of the narrow slot high temperature resistance performance monitoring caused by the difference in the selection of ultrasonic vibration parameters during the processing of ceramic composite materials, and effectively solving the problem of inaccurate narrow slot high temperature resistance performance monitoring caused by the difference in the selection of ultrasonic vibration parameters during the processing of ceramic composite materials in the prior art.

[0013] 2. The corresponding drill cutting force comparison coefficient, drilling workpiece temperature comparison coefficient, drilling crack density comparison coefficient, and drilling thermal stress comparison coefficient of the workpiece to be processed are obtained through the drill cutting force, drilling workpiece temperature comparison coefficient, drilling crack density comparison coefficient, and drilling thermal stress comparison coefficient. Finally, the ceramic abnormality compensation value is introduced to process the drill cutting force comparison coefficient, drilling workpiece temperature comparison coefficient, drilling crack density comparison coefficient, and drilling thermal stress comparison coefficient to obtain the ceramic abnormality index, thereby quantitatively evaluating the abnormal high-temperature resistance performance of the workpiece to be processed during the processing, thereby achieving improved processing quality during the processing of the workpiece to be processed.

[0014] 3. The vibration sampling frequency coefficient is obtained by processing the vibration parameter sampling frequency. Finally, the feedback delay compensation value is introduced to assign and couple the vibration sampling frequency coefficient, the de-unitized vibration adjustment instruction execution time, and the de-unitized instability recovery time to obtain the feedback delay evaluation index, thereby quantitatively evaluating the delay degree of vibration control and instability state recovery during the vibration parameter adjustment process, thereby achieving improved processing stability during the processing of the workpiece to be processed. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 A flow chart of a method for monitoring the high temperature resistance of narrow grooves in a ceramic composite material processing process provided in an embodiment of the present application;

[0016] Figure 2 Schematic diagram of processing narrow grooves with a large aspect ratio in a ceramic matrix composite material provided in an embodiment of the present application;

[0017] Figure 3 This is a schematic structural diagram of a narrow groove high temperature resistance performance monitoring system for a ceramic composite material processing process provided in an embodiment of the present application. DETAILED DESCRIPTION

[0018] The embodiments of the present application solve the problem of inaccurate monitoring of the high-temperature resistance of narrow grooves caused by differences in the selection of ultrasonic vibration parameters in the processing of ceramic composite materials in the prior art by providing a method and system for monitoring the high-temperature resistance of narrow grooves in a ceramic composite material processing process. The method evaluates the abnormality of the high-temperature resistance of ceramics based on the first ceramic performance parameter after drilling the workpiece to be processed to determine whether to adjust the first ceramic processing parameter. The method then determines instability based on the first vibration frequency standard deviation and the first vibration amplitude standard deviation within a preset adjustment period to determine whether to adjust the first processing feedback. The method then determines the abnormality of the high-temperature resistance of ceramics based on the second ceramic performance parameter after milling the workpiece to be processed to determine whether to adjust the second ceramic processing parameter. The method finally determines instability based on the second vibration frequency standard deviation and the second vibration amplitude standard deviation within the preset adjustment period to determine whether to adjust the second processing feedback. This improves the accuracy of monitoring the high-temperature resistance of narrow grooves caused by differences in the selection of ultrasonic vibration parameters in the processing of ceramic composite materials.

[0019] The technical solution in the embodiment of the present application is to solve the problem of inaccurate monitoring of the high temperature resistance performance of narrow slots caused by differences in the selection of ultrasonic vibration parameters during the processing of the above-mentioned ceramic composite materials. The overall idea is as follows:

[0020] The ceramic processing parameters are adjusted respectively by the first ceramic performance parameters and the second ceramic performance parameters. Finally, the processing feedback adjustment is performed according to the first vibration parameter standard deviation and the second vibration parameter standard deviation, thereby improving the accuracy of monitoring the high-temperature resistance of narrow grooves caused by the differences in the selection of ultrasonic vibration parameters during the processing of ceramic composite materials.

[0021] In order to better understand the above technical solution, the above technical solution will be described in detail below with reference to the accompanying drawings and specific implementation methods.

[0022] like Figure 1 As shown, it is a flow chart of a method for monitoring the high-temperature resistance performance of narrow grooves in a ceramic composite material processing process provided by an embodiment of the present application, the method comprising the following steps: S1, performance evaluation after drilling: performing abnormal evaluation of the high-temperature resistance performance of the ceramic according to the first ceramic performance parameter obtained after drilling the workpiece to be processed, and judging whether to adjust the first ceramic processing parameter, the adjustment of the first ceramic processing parameter is used to improve the processing success rate of the workpiece to be processed; the drilling of the workpiece to be processed is processed by an ultrasonic vibration assisted drilling method, for example, Figure 2 As shown, this is a schematic diagram of the processing of narrow grooves with a large aspect ratio of the ceramic-based composite material provided in an embodiment of the present application. The processing requirements are a groove width of 0.5 mm, a groove depth of 5 mm, an open blind groove type, and a groove length ≥ 40 mm. A Φ0.48 mm drill bit is used with a spacing of 0.3 mm to process a tiny hole with a depth of 5 mm.

[0023] S2, first instability adjustment: If the first ceramic processing parameter adjustment is not performed, S3 is executed directly. If the first ceramic processing parameter adjustment is performed, after the first ceramic processing parameter adjustment is performed, an instability judgment is performed based on the first vibration frequency standard deviation and the first vibration amplitude standard deviation within the preset adjustment period, and based on the result of the instability judgment, it is determined whether to perform the first processing feedback adjustment. The first processing feedback adjustment is used to improve the processing stability of the workpiece to be processed.

[0024] S3, performance evaluation after milling: perform abnormal evaluation of the high temperature resistance of the ceramic according to the second ceramic performance parameter obtained after the workpiece to be processed is milled, and determine whether to adjust the second ceramic processing parameter; the workpiece to be processed is processed by ultrasonic vibration assisted milling method, for example Figure 2As shown, it is a schematic diagram of the processing of narrow grooves with a large aspect ratio of ceramic-based composite materials provided in an embodiment of the present application. A Φ0.5mm milling cutter is used to connect all the holes obtained by drilling through milling to complete the processing of the groove; the second ceramic performance parameters include milling cutting force, milling workpiece temperature, milling crack density and milling thermal stress. The corresponding parameters and corresponding ceramic anomaly compensation values are used to obtain the milling ceramic anomaly index through the processing method in the ceramic anomaly index. Drilling and milling both rely on vibration parameters (frequency, amplitude). Improper parameter settings may cause the ceramic anomaly index of the two processes to rise synchronously. The hardness, brittleness and other characteristics of ceramic composite materials have similar effects on drilling and milling. The larger the ceramic anomaly index after drilling, the larger the milling ceramic anomaly index may be after milling. The cutting force is measured by a piezoelectric sensor installed between the milling cutter and the workpiece; the milling workpiece temperature is measured by a thermocouple sensor installed on the workpiece surface; the milling crack density is obtained by counting the number of cracks on the workpiece surface after milling in a preset area using an edge detection algorithm (such as the Canny algorithm) in image processing software (such as ImageJ); the milling thermal stress is measured by a thermal stress sensor installed in the milling area; the preset milling cutting force is set according to the preset personnel, for example, it can be set by the cutting force under different milling cutter and workpiece conditions in the historical database; the workpiece temperature after drilling represents the workpiece temperature obtained before milling; the milling crack density after drilling represents the crack density obtained before milling; and the milling thermal stress after drilling represents the thermal stress obtained before milling.

[0025] S4, second instability adjustment: if the second ceramic processing parameter adjustment is not performed, continue the detection; if the second ceramic processing parameter adjustment is performed, after the second ceramic processing parameter adjustment is performed, an instability judgment is performed based on the second vibration frequency standard deviation and the second vibration amplitude standard deviation within the preset adjustment period, and whether to perform the second processing feedback adjustment is determined based on the result of the instability judgment; the first vibration frequency standard deviation and the first vibration amplitude standard deviation in the specific formula of the vibration instability coefficient are replaced with the second vibration frequency standard deviation and the second vibration amplitude standard deviation to obtain the vibration instability coefficient during the milling process; the second vibration frequency standard deviation is obtained by calculating the standard deviation of the vibration frequency obtained after the second ceramic processing parameter adjustment within the preset adjustment period; the second vibration amplitude standard deviation is obtained by calculating the standard deviation of the vibration amplitude obtained after the second ceramic processing parameter adjustment within the preset adjustment period.

[0026] In this embodiment, the ceramic composite material has high hardness and brittleness. Therefore, during ultrasonic vibration-assisted machining, the frequency and amplitude of the vibration may cause large local temperature changes, forming a large temperature gradient. Excessive temperature gradients can lead to excessive thermal stress in the material, which may cause microcracks or detachment of the hole wall. Especially in areas with high thermal stress, the cracks may gradually expand, affecting the final machining quality. Due to the high hardness of ceramic-based composite materials, which is higher than the hardness of commonly used cutting tools and has strong wear resistance, ceramic-based composite materials face a series of difficulties when machining small holes with large aspect ratios and narrow grooves with large aspect ratios, such as poor material machinability, severe tool wear, and even difficulty in cutting the material.

[0027] In the present application, by evaluating the first ceramic performance parameter and the second ceramic performance parameter in the drilling processing stage and the milling processing stage respectively, and adjusting the ceramic processing parameters in time, failures caused by inappropriate processing parameters can be avoided, thereby improving the processing success rate, and ensuring that the high temperature resistance of the ceramic composite material is not affected during the processing, thereby improving the high temperature resistance of the ceramic workpiece; by adjusting the first ceramic processing parameter and the second ceramic processing parameter in real time, and judging whether the vibration is unstable, and making timely feedback adjustments to the processing process, processing problems caused by vibration are reduced, ensuring the improvement of processing quality and processing stability, and solving the problem that narrow blind grooves with large aspect ratios of ceramic-based composite materials are difficult or even impossible to process. Under optimized process parameters, narrow grooves can be stably processed; thereby achieving improved accuracy in monitoring the high temperature resistance of narrow grooves during the processing of ceramic composite materials.

[0028] Furthermore, the first ceramic performance parameters include drill bit cutting force, drilling workpiece temperature, drilling crack density, and drilling thermal stress; based on the first ceramic performance parameters obtained after drilling the workpiece to be processed, an abnormal high-temperature resistance performance of the ceramic is evaluated to determine whether the first ceramic processing parameters need to be adjusted. The specific steps are as follows:

[0029] In the first step, the relative deviation between the drill cutting force of the workpiece to be processed and the preset drill cutting force obtained from the preset database is processed to obtain the drill cutting force comparison coefficient, that is, , where QXF represents the cutting force of the drill bit on the workpiece to be processed, which is measured by a piezoelectric sensor installed between the drill bit and the workpiece; Indicates the preset drill cutting force, which is set according to the preset personnel, for example, it can be set by the cutting force under different workpiece conditions in the historical database.

[0030] In the second step, the drilling workpiece temperature comparison coefficient is obtained by performing deviation comparison processing based on the drilling workpiece temperature of the workpiece to be processed and the initial workpiece temperature obtained from the preset database, that is, , where GJT represents the drilling workpiece temperature of the workpiece to be processed, which is measured by a thermocouple sensor installed on the surface of the workpiece; Indicates the initial workpiece temperature, which is the temperature of the workpiece surface before drilling.

[0031] In the third step, the drilling crack density comparison coefficient is obtained by performing deviation comparison processing based on the drilling crack density of the workpiece to be processed and the initial drilling crack density obtained from the preset database, that is, , where LWM represents the drilling crack density of the workpiece to be processed, which is obtained by calculating the ratio of the number of cracks on the workpiece surface after drilling and the workpiece surface area by edge detection algorithms (such as Canny algorithm) in image processing software (such as ImageJ); It represents the initial drilling crack density, which indicates the drilling crack density of the workpiece before drilling.

[0032] The fourth step is to perform deviation comparison processing based on the drilling thermal stress of the workpiece to be processed and the initial drilling thermal stress obtained from the preset database to obtain the drilling thermal stress comparison coefficient, that is, , where RYF represents the drilling thermal stress of the workpiece to be processed, which is measured by the thermal stress sensor installed in the drilling area; It represents the initial drilling thermal stress, which represents the drilling thermal stress of the workpiece before drilling.

[0033] The fifth step is to introduce the ceramic abnormality compensation value to assign the drill bit cutting force comparison coefficient, the drilling workpiece temperature comparison coefficient, the drilling crack density comparison coefficient, and the drilling thermal stress comparison coefficient. The results of the assignment processing are coupled to obtain the ceramic abnormality index. The ceramic abnormality compensation value includes the first ceramic abnormality compensation value, the second ceramic abnormality compensation value, the third ceramic abnormality compensation value and the fourth ceramic abnormality compensation value. The ceramic abnormality index is used to quantitatively evaluate the abnormal conditions of the high temperature resistance performance during the processing of the workpiece to be processed.

[0034] Among them, the specific limiting expression of the ceramic anomaly index is:

[0035] ;

[0036] Where TC represents the ceramic anomaly index of the workpiece to be processed, Indicates the first ceramic abnormality compensation value, Indicates the second ceramic abnormality compensation value, Indicates the third ceramic abnormality compensation value, Indicates the fourth ceramic abnormality compensation value.

[0037] The ceramic anomaly compensation values involved are obtained from a preset database, wherein the first ceramic anomaly compensation value indicates the degree of influence of the drill bit cutting force on the ceramic anomaly index, the second ceramic anomaly compensation value indicates the degree of influence of the drilling workpiece temperature on the ceramic anomaly index, the third ceramic anomaly compensation value indicates the degree of influence of the drilling crack density on the ceramic anomaly index, and the fourth ceramic anomaly compensation value indicates the degree of influence of the drilling thermal stress on the ceramic anomaly index; the sum of the four is 1, for example, the drill bit cutting force and the preset first ceramic anomaly compensation value form a drill bit cutting force mapping set, and the real-time drill bit cutting force is input into the drill bit cutting force mapping set to obtain the corresponding first ceramic anomaly compensation value; the drilling workpiece The workpiece temperature and the preset second ceramic abnormality compensation value form a drilling workpiece temperature mapping set, and the real-time drilling workpiece temperature is input into the drilling workpiece temperature mapping set to obtain the corresponding second ceramic abnormality compensation value; the drilling crack density and the preset third ceramic abnormality compensation value form a drilling crack density mapping set, and the real-time drilling crack density is input into the drilling crack density mapping set to obtain the corresponding third ceramic abnormality compensation value; the drilling thermal stress and the preset fourth ceramic abnormality compensation value form a drilling thermal stress mapping set, and the real-time drilling thermal stress is input into the drilling thermal stress mapping set to obtain the corresponding fourth ceramic abnormality compensation value; the mapping relationship can be one-to-one or many-to-one.

[0038] The specific process involved in determining whether to adjust the first ceramic processing parameters is as follows:

[0039] A1, determines whether the ceramic abnormality index is greater than the preset ceramic abnormality threshold obtained from the preset database. If the ceramic abnormality index is greater than the preset ceramic abnormality threshold obtained from the preset database, vibration parameter optimization is performed, otherwise the first ceramic processing parameter adjustment is not performed; the preset ceramic abnormality threshold is represented by the average value of the ceramic abnormality index obtained from the historical database.

[0040] A2, determine whether the ceramic abnormality index after the vibration parameter optimization is greater than the preset ceramic abnormality threshold obtained from the preset database. If the ceramic abnormality index after the vibration parameter optimization is greater than the preset ceramic abnormality threshold obtained from the preset database, perform coolant flow optimization, otherwise end the first ceramic processing parameter adjustment.

[0041] Coolant flow optimization means adjusting the coolant flow according to the coolant flow adjustment amount to obtain the adjusted coolant flow. The coolant flow adjustment amount is obtained by inputting the ceramic abnormality index deviation coefficient, the workpiece temperature deviation coefficient and the coolant flow into the coolant flow adjustment amount mapping set. The coolant flow adjustment amount mapping set is a set obtained from a preset database that represents the mapping relationship between the ceramic abnormality index deviation coefficient, the workpiece temperature deviation coefficient and the coolant flow and the coolant flow adjustment amount. The ceramic abnormality index deviation coefficient is obtained by taking the difference between the ceramic abnormality index and the preset ceramic abnormality threshold value. The workpiece temperature deviation coefficient is obtained by taking the difference between the drilling workpiece temperature and the initial workpiece temperature. The coolant flow is set according to the preset personnel.

[0042] A3, determine whether the ceramic abnormality index after the coolant flow is optimized is greater than the preset ceramic abnormality threshold obtained from the preset database. If the ceramic abnormality index after the coolant flow is optimized is greater than the preset ceramic abnormality threshold obtained from the preset database, perform cooling cycle optimization, otherwise end the first ceramic processing parameter adjustment.

[0043] A4, determines whether the ceramic abnormality index after the cooling cycle is optimized is greater than the preset ceramic abnormality threshold obtained from the preset database. If the ceramic abnormality index after the cooling cycle is optimized is greater than the preset ceramic abnormality threshold obtained from the preset database, feedback is given; otherwise, the first ceramic processing parameter adjustment is terminated.

[0044] The vibration parameter optimization involved includes vibration amplitude adjustment and vibration frequency adjustment. The specific process is as follows:

[0045] B1. Input the ceramic abnormality index deviation coefficient, workpiece temperature deviation coefficient, cutting force deviation coefficient and vibration amplitude into the amplitude adjustment amount mapping set to obtain the amplitude adjustment amount. Adjust the vibration amplitude according to the amplitude adjustment amount to obtain the adjusted vibration amplitude. The amplitude adjustment amount mapping set is a set obtained from a preset database that represents the mapping relationship between the ceramic abnormality index deviation coefficient, workpiece temperature deviation coefficient, cutting force deviation coefficient and vibration amplitude and the amplitude adjustment amount. The cutting force deviation coefficient is obtained by taking the difference between the drill cutting force and the preset drill cutting force.

[0046] B2, determine whether the adjusted vibration amplitude is greater than the preset maximum amplitude obtained from the preset database. If the adjusted vibration amplitude is greater than the preset maximum amplitude obtained from the preset database, adjust it according to the preset maximum amplitude; otherwise, adjust it according to the adjusted vibration amplitude; the preset maximum amplitude is set according to the preset personnel, for example, it is represented by the maximum value of the vibration amplitude in the historical time period.

[0047] B3, input the ceramic abnormality index deviation coefficient, workpiece temperature deviation coefficient, cutting force deviation coefficient and vibration frequency into the vibration frequency adjustment amount mapping set to obtain the vibration frequency adjustment amount, and adjust the vibration frequency according to the vibration frequency adjustment amount to obtain the adjusted vibration frequency. The vibration frequency adjustment amount mapping set is a set obtained from a preset database that represents the mapping relationship between the ceramic abnormality index deviation coefficient, workpiece temperature deviation coefficient, cutting force deviation coefficient and vibration frequency and the vibration frequency adjustment amount.

[0048] B4, determine whether the adjusted vibration frequency is greater than the preset maximum vibration frequency obtained from the preset database. If the adjusted vibration frequency is greater than the preset maximum vibration frequency obtained from the preset database, adjust it according to the preset maximum vibration frequency; otherwise, adjust it according to the adjusted vibration frequency. The preset maximum vibration frequency is set according to the preset personnel, for example, represented by the maximum value of the vibration frequency in a historical time period.

[0049] The specific process involved in cooling cycle optimization is as follows:

[0050] C1, the ceramic abnormality index deviation coefficient, the workpiece restart temperature deviation coefficient, and the adjusted coolant flow are input into the cooling cycle mapping set to obtain the cooling cycle. The cooling cycle mapping set is a set obtained from a preset database that represents the mapping relationship between the ceramic abnormality index deviation coefficient, the workpiece restart temperature deviation coefficient, the adjusted coolant flow and the cooling cycle. The workpiece restart temperature deviation coefficient is obtained by taking the difference between the drilling workpiece temperature and the preset restart temperature obtained from the preset database; the preset restart temperature is set according to the preset personnel.

[0051] C2, during the cooling cycle, determines whether the temperature of the drilled workpiece is greater than the preset restart temperature. If the temperature of the drilled workpiece is not greater than the preset restart temperature, the cooling cycle is ended and the cooling cycle of the next workpiece to be processed is adjusted. Otherwise, the execution continues and C3 is executed; adjusting the cooling cycle of the next workpiece to be processed means adjusting the cooling cycle according to the cooling time factor and the actual workpiece restart temperature deviation coefficient. The cooling time factor is obtained by performing a ratio operation based on the actual cooling time and the temperature cooling coefficient. The cooling cycle of the next workpiece to be processed is obtained by performing a ratio operation based on the cooling time factor and the actual workpiece restart temperature deviation coefficient. The actual workpiece restart temperature deviation coefficient is obtained by performing a difference operation between the drilling workpiece temperature of the next workpiece to be processed and the preset restart temperature. The temperature cooling coefficient is obtained by performing a difference operation between the drilling workpiece temperature and the drilling workpiece temperature after cooling. The actual cooling time represents the time elapsed from the start of cooling to the current moment.

[0052] C3, when the cooling cycle ends, judge whether the drilling workpiece temperature is greater than the preset restart temperature. If the drilling workpiece temperature is greater than the preset restart temperature, extend the cooling cycle, otherwise continue to run; extend the cooling cycle by extending the cooling period. The cooling extension period is obtained by performing a ratio operation between the cooling period factor and the restart temperature deviation coefficient of the workpiece after cooling. The restart temperature deviation coefficient of the workpiece after cooling is obtained by performing a difference operation between the drilling workpiece temperature after cooling and the preset restart temperature.

[0053] In this embodiment, when the drill cutting force increases, it usually leads to increased friction between the drill bit and the workpiece, thereby generating more heat and causing the temperature of the drilled workpiece to rise. Conversely, the higher the temperature of the drilled workpiece, the more severe the wear of the drill bit may be, resulting in changes in the cutting force; the higher the temperature of the drilled workpiece, the more brittle the ceramic composite material may be, thereby increasing the drilling crack density; the increase in the drill cutting force may lead to increased deformation of the ceramic composite material, thereby increasing the drilling thermal stress; the increase in the temperature of the drilled workpiece during the drilling process will increase the drilling thermal stress; the closer the drill cutting force is to the preset cutting force, the greater the drilling workpiece temperature, drilling crack density, and drilling thermal stress, indicating that the high temperature resistance of the workpiece to be processed is more abnormal during processing, and the greater the ceramic abnormality index.

[0054] By comparing ceramic performance parameters with the corresponding initial values, the high-temperature resistance of ceramic composite materials during processing is quantitatively evaluated, and abnormal conditions during the processing of ceramic workpieces are discovered in a timely manner, providing a basis for the subsequent adjustment of processing parameters, thereby improving the processing stability of ceramic composite workpieces during processing, thereby avoiding material damage caused by high temperature, and optimizing the processing quality of ceramic composite materials.

[0055] By gradually optimizing the vibration parameters, coolant flow rate, and cooling cycle, the high-temperature resistance of ceramic materials during processing is ensured not to be excessively affected, thereby improving processing stability. By fine-tuning the coolant flow rate and cooling cycle, the thermal stress generated during processing can be effectively reduced, thereby enhancing the high-temperature resistance of ceramic composite materials, avoiding problems such as thermal cracks, and thus achieving improved processing stability of ceramic composite materials during processing.

[0056] By optimizing the vibration parameters, the vibration effects that may occur during the processing are reduced, thereby reducing the risk of damage to ceramic composites and improving the stability of ceramic composite processing; by dynamically adjusting the vibration amplitude and frequency through real-time changes in the ceramic abnormality index, workpiece temperature and cutting force, it is possible to respond more accurately to changes in the processing process, avoid excessive vibration or inappropriate frequency problems, and maintain the continuous stability of the processing process; by limiting the vibration amplitude and vibration frequency, it is ensured that the processing process will not cause equipment damage or processing failure due to vibration parameters exceeding the set range, thereby improving the processing quality of ceramic workpieces and avoiding the impact of differences in vibration parameter selection on the accuracy of monitoring the high-temperature resistance performance of narrow slots during the processing of ceramic composites.

[0057] By determining the appropriate cooling cycle through the cooling cycle mapping set, blind cooling or overcooling is avoided, cooling efficiency is improved, and unnecessary energy consumption is reduced; by timely adjusting the cooling time, the ceramic workpiece is ensured to be processed at the appropriate temperature, avoiding the deterioration of workpiece quality due to excessive temperature.

[0058] Furthermore, an instability determination is performed based on the first vibration frequency standard deviation and the first vibration amplitude standard deviation within a preset adjustment period, and whether to perform the first processing feedback adjustment is determined based on the result of the instability determination. The specific process is as follows:

[0059] E1, introduce the instability compensation value to assign and couple the first vibration frequency standard deviation and the first vibration amplitude standard deviation within the preset adjustment period to obtain the vibration instability coefficient. The vibration instability coefficient is used to quantitatively evaluate the instability degree of ultrasonic vibration. The specific formula of the vibration instability coefficient is: , where sw represents the vibration instability coefficient, plb represents the standard deviation of the first vibration frequency within the preset adjustment period, and fdb represents the standard deviation of the first vibration amplitude within the preset adjustment period. Indicates the instability compensation value; the first vibration frequency standard deviation is obtained by calculating the standard deviation of the vibration frequency within a preset adjustment period, and the vibration frequency is obtained by performing a spectrum analysis on the acceleration signal measured by a vibration sensor (such as an accelerometer); the first vibration amplitude standard deviation is obtained by calculating the standard deviation of the vibration amplitude within a preset adjustment period, and the vibration amplitude is obtained by performing two integrations on the acceleration signal measured by the vibration sensor (such as an accelerometer); the preset period is set according to the preset person.

[0060] The instability compensation value involved is obtained from a preset database. The instability compensation value indicates the degree of influence of the vibration frequency standard deviation on the vibration instability coefficient; the instability compensation value is between 0-1; for example, the vibration frequency standard deviation and the preset first ceramic abnormality compensation value form a vibration frequency standard deviation mapping set, and the real-time vibration frequency standard deviation is input into the vibration frequency standard deviation mapping set to obtain the corresponding instability compensation value.

[0061] E2, determines whether the vibration instability coefficient is greater than the preset vibration instability threshold obtained from the preset database. If the vibration instability coefficient is greater than the preset vibration instability threshold obtained from the preset database, feedback delay evaluation is performed according to the feedback delay parameter, and based on the result of the feedback delay evaluation, it is determined whether to perform feedback performance optimization. Otherwise, the first processing feedback adjustment is not performed; the preset vibration instability threshold is represented by the average value of the vibration instability coefficient in the historical time period.

[0062] E3, determine whether the vibration instability coefficient after the feedback performance optimization is greater than the preset vibration instability threshold obtained from the preset database. If the vibration instability coefficient after the feedback performance optimization is greater than the preset vibration instability threshold obtained from the preset database, gradually adjust the vibration parameters; otherwise, end the first processing feedback adjustment. The vibration parameters include vibration amplitude and vibration frequency. Gradually adjusting the vibration parameters is used to avoid the resonance problem between the ultrasonic vibration and the natural frequency of the workpiece to be processed.

[0063] The feedback delay parameters involved include the vibration parameter sampling frequency, the vibration adjustment instruction execution time, and the instability recovery time. The specific method for evaluating feedback delay based on the feedback delay parameters is as follows:

[0064] E4. If the vibration parameter sampling frequency is greater than the preset vibration parameter sampling frequency obtained from the preset database, a vibration sampling frequency coefficient is obtained by performing a deviation comparison process based on the vibration parameter sampling frequency and the preset vibration parameter sampling frequency obtained from the preset database. Otherwise, a vibration sampling frequency coefficient is obtained by performing a comparison process based on the vibration parameter sampling frequency and the preset vibration parameter sampling frequency obtained from the preset database. The specific limiting expression of the vibration sampling frequency coefficient is:

[0065] ;

[0066] Where CYG represents the vibration parameter sampling frequency, Indicates the preset vibration parameter sampling frequency. The vibration parameter sampling frequency captures the vibration signal through a vibration sensor (such as an accelerometer) and calculates the number of data points collected per second. The preset vibration parameter sampling frequency is represented by the maximum value of the vibration parameter sampling frequency within a historical time period.

[0067] E5, introduces a feedback delay compensation value to assign and couple the vibration sampling frequency coefficient, the de-unitized vibration adjustment instruction execution time, and the de-unitized instability recovery time to obtain a feedback delay evaluation index. The feedback delay compensation value includes a first feedback delay compensation value, a second feedback delay compensation value, and a third feedback delay compensation value. The feedback delay evaluation index is used to quantitatively evaluate the degree of delay in vibration control and instability recovery during the vibration parameter adjustment process; the vibration adjustment instruction execution time represents the recorded time from the issuance of the adjustment instruction to the actual control system responding and starting vibration adjustment; the instability recovery time represents the recorded time required to recover from an unstable state (such as out-of-control vibration or excessive oscillation) to a stable state.

[0068] The specific limiting expression of the feedback delay evaluation index is:

[0069] ;

[0070] Where FK represents the feedback delay evaluation index, CY represents the vibration sampling frequency coefficient, ZTS represents the execution time of the vibration adjustment instruction, and SHT represents the instability recovery time. represents the first feedback delay compensation value, represents the second feedback delay compensation value, represents the third feedback delay compensation value.

[0071] The feedback delay compensation values involved are obtained from a preset database, the first feedback delay compensation value indicates the degree of influence of the vibration parameter sampling frequency on the feedback delay evaluation index, the second feedback delay compensation value indicates the degree of influence of the vibration adjustment instruction execution time on the feedback delay evaluation index, and the third feedback delay compensation value indicates the degree of influence of the instability recovery time on the feedback delay evaluation index; the sum of the three is 1, for example, the vibration parameter sampling frequency and the preset first feedback delay compensation value form a vibration parameter sampling frequency mapping set, and the real-time vibration parameter sampling frequency is input into the vibration parameter sampling frequency mapping set to obtain the corresponding first feedback delay compensation value; the vibration adjustment instruction execution time and the preset second feedback delay compensation value form a vibration adjustment instruction execution time mapping set, and the real-time vibration adjustment instruction execution time is input into the vibration adjustment instruction execution time mapping set to obtain the corresponding second feedback delay compensation value; the instability recovery time and the preset third feedback delay compensation value form an instability recovery time mapping set, and the real-time instability recovery time is input into the instability recovery time mapping set to obtain the corresponding third feedback delay compensation value; the mapping relationship can be one-to-one or many-to-one.

[0072] The specific process involved in determining whether to perform feedback performance optimization based on the feedback delay evaluation results is as follows:

[0073] D1, determines whether the feedback delay evaluation index is greater than the preset feedback delay threshold obtained from the preset database. If the feedback delay evaluation index is greater than the preset feedback delay threshold obtained from the preset database, the sampling frequency is adjusted. Otherwise, feedback performance optimization is not performed. Feedback performance optimization means optimizing the stable recovery performance during the vibration parameter adjustment process to improve vibration stability. The preset feedback delay threshold is represented by the average value of the feedback delay evaluation index in the historical time period.

[0074] D2, determining whether the feedback delay evaluation index after the sampling frequency adjustment is greater than a preset feedback delay threshold obtained from a preset database. If the feedback delay evaluation index after the sampling frequency adjustment is greater than the preset feedback delay threshold obtained from the preset database, instruction output optimization is performed; otherwise, feedback performance optimization is terminated.

[0075] D3, determine whether the feedback delay evaluation index after the instruction output optimization is greater than the preset feedback delay threshold obtained from the preset database. If the feedback delay evaluation index after the instruction output optimization is greater than the preset feedback delay threshold obtained from the preset database, perform a correction cycle adjustment; otherwise, terminate the feedback performance optimization.

[0076] The feedback performance optimization involved includes sampling frequency adjustment, instruction output optimization and correction period adjustment; sampling frequency adjustment means setting the sampling frequency to the adjusted sampling frequency, and the adjusted sampling frequency is obtained by inputting the vibration frequency and feedback delay evaluation index into the sampling frequency mapping set. The sampling frequency mapping set is a collection of mapping relationships between the vibration frequency and feedback delay evaluation index obtained from the preset database and the adjusted sampling frequency.

[0077] Instruction output optimization is achieved by setting up two buffers through double buffering technology, which are used for data acquisition and filtering processing respectively.

[0078] The correction cycle adjustment is achieved by setting the correction cycle. The correction cycle is obtained by inputting the feedback delay evaluation index and the vibration adjustment instruction execution time into the correction cycle mapping set. The correction cycle mapping set is a set of mapping relationships between the feedback delay evaluation index and the vibration adjustment instruction execution time obtained from the preset database and the correction cycle.

[0079] In this embodiment, by calculating the vibration instability coefficient and introducing the instability compensation value, the current vibration state can be accurately evaluated to ensure timely adjustment of the vibration amplitude and frequency during the processing process, thereby preventing damage to the workpiece due to the instability of ultrasonic vibration; by gradually adjusting the vibration frequency and vibration amplitude, the resonance phenomenon during the processing process can be avoided, thereby avoiding damage to the workpiece, reduced processing accuracy, and even equipment damage, thereby improving the stability of the ceramic composite material processing process, reducing the negative impact caused by vibration, and thereby improving the accuracy of monitoring the high-temperature resistance performance of narrow slots caused by differences in the selection of ultrasonic vibration parameters during the processing of ceramic composite materials.

[0080] When the vibration parameter sampling frequency is not greater than the preset vibration parameter sampling frequency, the vibration parameter sampling frequency determines the timeliness of data capture. When the vibration parameter sampling frequency is lower, high-frequency vibration signals may be missed, resulting in an increase in the execution time of the vibration adjustment instruction; the higher the vibration parameter sampling frequency, the more accurately it can capture subtle changes in vibration and promptly detect signs of instability, thereby shortening the instability recovery time; the execution time of the vibration adjustment instruction directly affects the instability recovery time. If the adjustment instruction execution time is longer, it may not be able to respond to the instability state in time, resulting in an increase in the instability recovery time; when the vibration parameter sampling frequency is greater than the preset vibration parameter sampling frequency, the higher the vibration parameter sampling frequency, the larger the amount of data collected, which may lead to increased data transmission delay, thereby increasing the execution time of the adjustment instruction.

[0081] When the vibration parameter sampling frequency is not greater than the preset vibration parameter sampling frequency, the smaller the vibration parameter sampling frequency, the longer the vibration adjustment instruction execution time and the instability recovery time, indicating that the delay in vibration control and instability recovery during the vibration parameter adjustment process is greater, and the feedback delay evaluation index is greater; when the vibration parameter sampling frequency is greater than the preset vibration parameter sampling frequency, the greater the vibration parameter sampling frequency, the longer the vibration adjustment instruction execution time and the instability recovery time, indicating that the delay in vibration control and instability recovery during the vibration parameter adjustment process is greater, and the feedback delay evaluation index is greater.

[0082] Through the above steps, the delay degree of vibration control and recovery from unstable state during the vibration parameter adjustment process was quantitatively evaluated, and abnormal problems such as vibration instability were identified in a timely manner, thereby reducing the processing errors caused by delays. The accuracy of monitoring the high-temperature resistance performance of narrow slots caused by the delay in ultrasonic vibration parameter adjustment during the processing of ceramic composite materials was improved.

[0083] By adjusting feedback control parameters such as sampling frequency, command output and correction period, the stability of the recovery processing process is improved when vibration instability occurs, ensuring that the delay in the vibration adjustment process is effectively compensated, avoiding the processing instability problem caused by excessive delay, and improving the control accuracy of ultrasonic vibration on processing, thereby achieving stability and efficiency in the ceramic matrix composite material processing process.

[0084] The sampling frequency is adjusted by the vibration frequency and feedback delay evaluation index to avoid data loss due to too low sampling frequency or data redundancy due to too high sampling frequency; the double buffering technology realizes the parallel processing of data acquisition and filtering processing, avoids data loss and processing delay, ensures timely acquisition and processing of data, and improves the real-time performance of vibration adjustment instruction execution; the correction period is adjusted by the feedback delay evaluation index and the execution time of the vibration adjustment instruction to ensure that over-adjustment or under-adjustment can be avoided, maintain the stable operation of the ceramic matrix composite material processing process, reduce oscillation and fluctuation, and thus achieve the improvement of the accuracy of narrow slot high temperature resistance performance monitoring.

[0085] like Figure 3 As shown, it is a structural diagram of the narrow groove high temperature performance monitoring system for the ceramic composite material processing process provided by the embodiment of the present application. The narrow groove high temperature performance monitoring system for the ceramic composite material processing process provided by the embodiment of the present application includes: a post-drilling performance evaluation module, a first instability adjustment module, a post-milling performance evaluation module and a post-milling performance evaluation module; wherein the post-drilling performance evaluation module is used to perform abnormal evaluation of the ceramic high temperature performance according to the first ceramic performance parameter obtained after drilling the workpiece to be processed, and judge whether to adjust the first ceramic processing parameter, and the first ceramic processing parameter adjustment is used to improve the processing success rate of the workpiece to be processed; the first instability adjustment module is used to directly execute the function of the post-milling performance evaluation module if the first ceramic processing parameter adjustment is not performed, and if the first ceramic processing parameter adjustment is performed, After the number is adjusted, an instability judgment is made according to the first vibration frequency standard deviation and the first vibration amplitude standard deviation within a preset adjustment period, and whether a first processing feedback adjustment is performed is judged based on the result of the instability judgment, and the first processing feedback adjustment is used to improve the processing stability of the workpiece to be processed; the post-milling performance evaluation module is used to perform an abnormal evaluation of the high-temperature resistance of the ceramic according to the second ceramic performance parameters obtained after milling the workpiece to be processed, and to judge whether a second ceramic processing parameter adjustment is performed; the second instability adjustment module is used to continue testing if the second ceramic processing parameter adjustment is not performed, and if the second ceramic processing parameter adjustment is performed, then after the second ceramic processing parameter adjustment is performed, an instability judgment is made according to the second vibration frequency standard deviation and the second vibration amplitude standard deviation within the preset adjustment period, and whether a second processing feedback adjustment is performed is judged based on the result of the instability judgment.

[0086] In this embodiment, the post-drilling performance evaluation module is used to detect the ceramic performance after drilling in real time, and possible problems with the processing performance during the drilling process are discovered in advance, thereby avoiding more serious problems in subsequent processing; the first instability adjustment module is used to adjust the vibration parameters during the drilling process in real time to reduce vibration problems during the processing, thereby improving the stability of the workpiece processing and avoiding adverse effects on the processing performance of the ceramic composite material; the post-milling performance evaluation module is used to detect the ceramic performance after milling in real time, and performance problems caused by improper processing during the milling process can be identified in time, thereby avoiding unqualified workpieces from entering subsequent process flows; the second instability adjustment module is used to adjust the vibration parameters during the milling process in real time, effectively reducing performance instability caused by instability during the milling process, ensuring the durability and precision of the ceramic workpiece in a high-temperature environment, and achieving improved accuracy in monitoring the high-temperature resistance of narrow slots caused by differences in the selection of ultrasonic vibration parameters during the processing of ceramic composite materials.

[0087] To sum up, the embodiment of the present application adjusts the first ceramic processing parameter through the first ceramic performance parameter, then adjusts the first processing feedback according to the first vibration parameter standard deviation, then adjusts the second ceramic processing parameter according to the second ceramic performance parameter, and finally adjusts the second processing feedback according to the second vibration parameter standard deviation, thereby improving the processing success rate, and further achieving the improvement of the accuracy of narrow groove high temperature resistance performance monitoring caused by the difference in ultrasonic vibration parameter selection during the processing of ceramic composite materials, effectively solving the problem of inaccurate narrow groove high temperature resistance performance monitoring caused by the difference in ultrasonic vibration parameter selection during the processing of ceramic composite materials in the prior art.

[0088] Those skilled in the art will appreciate that embodiments of the present invention may be provided as methods, systems, or computer program products. Thus, the present invention may take the form of an entirely hardware embodiment, an entirely software embodiment, or an embodiment combining software and hardware aspects. Furthermore, the present invention may take the form of a computer program product implemented on one or more computer-usable storage media (including but not limited to magnetic disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

[0089] The present invention is described with reference to flowcharts and / or block diagrams of methods, devices (systems), and computer program products according to embodiments of the present invention. It should be understood that each process and / or block in the flowcharts and / or block diagrams, as well as combinations of processes and / or blocks in the flowcharts and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing device to produce a machine, so that the instructions executed by the processor of the computer or other programmable data processing device generate instructions for implementing the processes in the flowcharts and / or block diagrams. Figure 1 a process or multiple processes and / or boxes Figure 1A device that provides the functions specified in a block or multiple blocks.

[0090] These computer program instructions may also be stored in a computer readable memory that can direct a computer or other programmable data processing device to work in a specific manner, so that the instructions stored in the computer readable memory produce an article of manufacture comprising an instruction device, which implements the process Figure 1 a process or multiple processes and / or boxes Figure 1 The function specified in one or more boxes.

[0091] These computer program instructions can also be loaded onto a computer or other programmable data processing device so that a series of operational steps are executed on the computer or other programmable device to produce a computer-implemented process, thereby providing the instructions executed on the computer or other programmable device for implementing the process. Figure 1 a process or multiple processes and / or boxes Figure 1 A step that specifies a function in one or more boxes.

[0092] Although the preferred embodiments of the present invention have been described, those skilled in the art may make additional changes and modifications to these embodiments once they have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of the present invention.

[0093] Obviously, those skilled in the art may make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if such changes and modifications fall within the scope of the claims and their equivalents, the present invention is intended to include such changes and modifications.

Claims

1. A method for monitoring the high temperature resistance of narrow grooves in the processing of ceramic composite materials, characterized in that: The following steps are involved: S1, evaluating abnormal high-temperature resistance of the ceramic based on first ceramic performance parameters obtained after drilling the workpiece to be processed, and determining whether to adjust first ceramic processing parameters, wherein the first ceramic processing parameter adjustment is used to improve the processing success rate of the workpiece to be processed; S2: If the first ceramic processing parameter adjustment is not performed, directly executing S3; if the first ceramic processing parameter adjustment is performed, after the first ceramic processing parameter adjustment is performed, performing an instability determination based on the first vibration frequency standard deviation and the first vibration amplitude standard deviation within a preset adjustment period, and determining whether to perform a first processing feedback adjustment based on the result of the instability determination, wherein the first processing feedback adjustment is used to improve the processing stability of the workpiece to be processed; S3, evaluating abnormal high-temperature resistance of the ceramic based on the second ceramic performance parameters obtained after milling the workpiece to be processed, and determining whether to adjust the second ceramic processing parameters; S4: If the second ceramic processing parameter adjustment is not performed, continue the detection; if the second ceramic processing parameter adjustment is performed, after the second ceramic processing parameter adjustment is performed, perform an instability judgment based on the second vibration frequency standard deviation and the second vibration amplitude standard deviation within the preset adjustment period, and determine whether to perform the second processing feedback adjustment based on the result of the instability judgment.

2. The method for monitoring the high temperature resistance of narrow grooves in a ceramic composite material processing process according to claim 1, wherein: The first ceramic performance parameters include drill bit cutting force, drilling workpiece temperature, drilling crack density and drilling thermal stress; The specific steps of evaluating the abnormal high-temperature resistance of the ceramic according to the first ceramic performance parameter obtained after drilling the workpiece to be processed are as follows: A drill cutting force comparison coefficient is obtained by performing relative deviation processing on the drill cutting force of the workpiece to be processed and the preset drill cutting force obtained from the preset database; Performing deviation comparison processing on the drilling workpiece temperature of the workpiece to be processed and the initial workpiece temperature obtained from a preset database to obtain a drilling workpiece temperature comparison coefficient; Performing deviation comparison processing on the drilling crack density of the workpiece to be processed and the initial drilling crack density obtained from a preset database to obtain a drilling crack density comparison coefficient; A drilling thermal stress comparison coefficient is obtained by performing deviation comparison processing on the drilling thermal stress of the workpiece to be processed and the initial drilling thermal stress obtained from a preset database; Ceramic anomaly compensation values are introduced to perform assignment processing on the drill bit cutting force comparison coefficient, the drilling workpiece temperature comparison coefficient, the drilling crack density comparison coefficient, and the drilling thermal stress comparison coefficient. The results of the assignment processing are coupled to obtain a ceramic anomaly index. The ceramic anomaly compensation values include a first ceramic anomaly compensation value, a second ceramic anomaly compensation value, a third ceramic anomaly compensation value, and a fourth ceramic anomaly compensation value. The ceramic anomaly index is used to quantitatively evaluate the abnormal conditions of the high-temperature resistance performance during the processing of the workpiece to be processed.

3. The method for monitoring the high temperature resistance of narrow grooves in a ceramic composite material processing process according to claim 2, wherein: The specific process of determining whether to adjust the first ceramic processing parameter is as follows: A1, if the ceramic abnormality index is greater than a preset ceramic abnormality threshold obtained from a preset database, then the vibration parameter optimization is performed, otherwise the first ceramic processing parameter adjustment is not performed; A2: If the ceramic abnormality index after the vibration parameter optimization is greater than the preset ceramic abnormality threshold obtained from the preset database, the coolant flow rate is optimized; otherwise, the first ceramic processing parameter adjustment is terminated; The coolant flow optimization represents adjusting the coolant flow according to the coolant flow adjustment amount to obtain an adjusted coolant flow, the coolant flow adjustment amount being obtained by inputting a ceramic anomaly index deviation coefficient, a workpiece temperature deviation coefficient, and a coolant flow into a coolant flow adjustment amount mapping set, the coolant flow adjustment amount mapping set being a set obtained from a preset database representing mapping relationships between the ceramic anomaly index deviation coefficient, the workpiece temperature deviation coefficient, and the coolant flow and the coolant flow adjustment amount, the ceramic anomaly index deviation coefficient being obtained by performing deviation processing on the ceramic anomaly index and a preset ceramic anomaly threshold, and the workpiece temperature deviation coefficient being obtained by performing deviation processing on the drilling workpiece temperature and the initial workpiece temperature; A3, if the ceramic abnormality index after the coolant flow rate optimization is greater than the preset ceramic abnormality threshold obtained from the preset database, then the cooling cycle optimization is performed, otherwise the first ceramic processing parameter adjustment is terminated; A4. If the ceramic abnormality index after cooling cycle optimization is greater than the preset ceramic abnormality threshold obtained from the preset database, feedback is performed; otherwise, the first ceramic processing parameter adjustment is terminated. The first ceramic processing parameter adjustment includes vibration parameter optimization, coolant flow optimization, and cooling cycle optimization.

4. The method for monitoring the high temperature resistance of narrow grooves in a ceramic composite material processing process according to claim 3, wherein: The vibration parameter optimization includes vibration amplitude adjustment and vibration frequency adjustment, and the specific process is as follows: B1, inputting the ceramic abnormality index deviation coefficient, workpiece temperature deviation coefficient, cutting force deviation coefficient, and vibration amplitude into an amplitude adjustment amount mapping set to obtain an amplitude adjustment amount, and adjusting the vibration amplitude according to the amplitude adjustment amount to obtain an adjusted vibration amplitude. The amplitude adjustment amount mapping set is a set obtained from a preset database that represents mapping relationships between the ceramic abnormality index deviation coefficient, workpiece temperature deviation coefficient, cutting force deviation coefficient, vibration amplitude, and amplitude adjustment amount. The cutting force deviation coefficient is obtained by performing deviation processing on the drill cutting force and a preset drill cutting force. B2, if the adjusted vibration amplitude is greater than the preset maximum amplitude obtained from the preset database, then the adjustment is performed according to the preset maximum amplitude; otherwise, the adjustment is performed according to the adjusted vibration amplitude; B3, inputting the ceramic abnormality index deviation coefficient, the workpiece temperature deviation coefficient, the cutting force deviation coefficient, and the vibration frequency into a vibration frequency adjustment amount mapping set to obtain a vibration frequency adjustment amount, and adjusting the vibration frequency according to the vibration frequency adjustment amount to obtain an adjusted vibration frequency, wherein the vibration frequency adjustment amount mapping set is a set obtained from a preset database and represents mapping relationships between the ceramic abnormality index deviation coefficient, the workpiece temperature deviation coefficient, the cutting force deviation coefficient, the vibration frequency, and the vibration frequency adjustment amount; B4: If the adjusted vibration frequency is greater than the preset maximum vibration frequency obtained from the preset database, the adjustment is performed according to the preset maximum vibration frequency; otherwise, the adjustment is performed according to the adjusted vibration frequency.

5. The method for monitoring the high temperature resistance of narrow grooves in a ceramic composite material processing process according to claim 3, wherein: The specific process of cooling cycle optimization is as follows: C1, inputting the ceramic abnormality index deviation coefficient, the workpiece restart temperature deviation coefficient, and the adjusted coolant flow rate into a cooling cycle mapping set to obtain a cooling cycle, wherein the cooling cycle mapping set is a set of mapping relationships between the ceramic abnormality index deviation coefficient, the workpiece restart temperature deviation coefficient, the adjusted coolant flow rate, and the cooling cycle obtained from a preset database; C2, during the cooling cycle, determine whether the temperature of the drilled workpiece is greater than the preset restart temperature. If the temperature of the drilled workpiece is not greater than the preset restart temperature, end the cooling cycle and adjust the cooling cycle of the next workpiece to be processed. Otherwise, continue to execute and execute C3; The adjusting of the cooling cycle of the next workpiece to be processed indicates adjusting the cooling cycle according to the cooling time factor and the actual workpiece restart temperature deviation coefficient, wherein the cooling time factor is obtained by comparing the actual cooling time and the temperature cooling coefficient, and the cooling cycle of the next workpiece to be processed is obtained by comparing the cooling time factor and the actual workpiece restart temperature deviation coefficient; C3, when the cooling cycle ends, determine whether the temperature of the drilling workpiece is greater than the preset restart temperature. If the temperature of the drilling workpiece is greater than the preset restart temperature, extend the cooling cycle; otherwise, continue to run; The extended cooling cycle is obtained by extending the cooling cycle by a cooling extension time, and the cooling extension time is obtained by comparing a cooling time factor with a restart temperature deviation coefficient of the workpiece after cooling.

6. The method for monitoring the high temperature resistance of narrow grooves in a ceramic composite material processing process according to claim 1, wherein: The instability determination is performed based on the first vibration frequency standard deviation and the first vibration amplitude standard deviation within the preset adjustment period, and whether to perform the first processing feedback adjustment is determined based on the result of the instability determination. The specific process is as follows: Introducing an instability compensation value to perform assignment coupling processing on the first vibration frequency standard deviation and the first vibration amplitude standard deviation within a preset adjustment period to obtain a vibration instability coefficient, wherein the vibration instability coefficient is used to quantitatively evaluate the instability degree of the ultrasonic vibration; If the vibration instability coefficient is greater than a preset vibration instability threshold obtained from a preset database, a feedback delay evaluation is performed according to the feedback delay parameter, and based on the result of the feedback delay evaluation, it is determined whether to perform feedback performance optimization; otherwise, the first processing feedback adjustment is not performed; If the vibration instability coefficient after feedback performance optimization is greater than a preset vibration instability threshold obtained from a preset database, the vibration parameters are gradually adjusted; otherwise, the first processing feedback adjustment is terminated. The first processing feedback adjustment includes feedback performance optimization and gradual adjustment of vibration parameters. The vibration parameters include vibration amplitude and vibration frequency. The gradual adjustment of vibration parameters is used to avoid resonance problems between ultrasonic vibration and the natural frequency of the workpiece to be processed.

7. The method for monitoring the high temperature resistance of narrow grooves in a ceramic composite material processing process according to claim 6, characterized in that: The feedback delay parameters include vibration parameter sampling frequency, vibration adjustment instruction execution time and instability recovery time; The specific method for evaluating the feedback delay according to the feedback delay parameter is as follows: If the vibration parameter sampling frequency is greater than the preset vibration parameter sampling frequency obtained from the preset database, a vibration sampling frequency coefficient is obtained by performing a deviation comparison process based on the vibration parameter sampling frequency and the preset vibration parameter sampling frequency obtained from the preset database; otherwise, a vibration sampling frequency coefficient is obtained by performing a comparison process based on the vibration parameter sampling frequency and the preset vibration parameter sampling frequency obtained from the preset database; A feedback delay compensation value is introduced to perform assignment coupling processing on the vibration sampling frequency coefficient, the deunitized vibration adjustment instruction execution time, and the deunitized instability recovery time to obtain a feedback delay evaluation index. The feedback delay compensation value includes a first feedback delay compensation value, a second feedback delay compensation value, and a third feedback delay compensation value. The feedback delay evaluation index is used to quantitatively evaluate the degree of delay in vibration control and instability recovery during the vibration parameter adjustment process.

8. The method for monitoring the high temperature resistance of narrow grooves in a ceramic composite material processing process according to claim 6, wherein: The specific process of determining whether to perform feedback performance optimization based on the feedback delay evaluation result is as follows: D1: If the feedback delay evaluation index is greater than a preset feedback delay threshold obtained from a preset database, the sampling frequency is adjusted; otherwise, feedback performance optimization is not performed. The feedback performance optimization means optimizing the stable recovery performance during the vibration parameter adjustment process to improve vibration stability. D2: If the feedback delay evaluation index after the sampling frequency adjustment is greater than the preset feedback delay threshold obtained from the preset database, instruction output optimization is performed; otherwise, feedback performance optimization is terminated. D3: If the feedback delay evaluation index after instruction output optimization is greater than the preset feedback delay threshold obtained from the preset database, a correction cycle adjustment is performed; otherwise, the feedback performance optimization is terminated.

9. The method for monitoring the high temperature resistance of narrow grooves in a ceramic composite material processing process according to claim 8, characterized in that: The feedback performance optimization includes sampling frequency adjustment, instruction output optimization and correction period adjustment; The sampling frequency adjustment means setting the sampling frequency to an adjusted sampling frequency, wherein the adjusted sampling frequency is obtained by inputting the vibration frequency and the feedback delay evaluation index into a sampling frequency mapping set, wherein the sampling frequency mapping set is a set of mapping relationships between the vibration frequency and the feedback delay evaluation index obtained from a preset database and the adjusted sampling frequency; The instruction output optimization is achieved by setting two buffers through double buffering technology, and the buffers are used for data collection and filtering processing respectively; The correction period adjustment is achieved by setting a correction period, and the correction period is obtained by inputting the feedback delay evaluation index and the vibration adjustment instruction execution duration into a correction period mapping set, and the correction period mapping set is a set of mapping relationships between the feedback delay evaluation index and the vibration adjustment instruction execution duration obtained from a preset database and the correction period.

10. A system using the method for monitoring the high temperature resistance of narrow grooves in a ceramic composite material processing process according to any one of claims 1 to 9, characterized in that: include: a post-drilling performance evaluation module, a first instability adjustment module, a post-milling performance evaluation module, and a second instability adjustment module; The post-drilling performance evaluation module is used to evaluate abnormal high-temperature resistance of the ceramic based on the first ceramic performance parameter obtained after drilling the workpiece to be processed, and determine whether to adjust the first ceramic processing parameter, wherein the adjustment of the first ceramic processing parameter is used to improve the processing success rate of the workpiece to be processed; The first instability adjustment module is configured to directly execute the functions of the post-milling performance evaluation module if the first ceramic processing parameter adjustment is not performed, and if the first ceramic processing parameter adjustment is performed, perform an instability determination based on the first vibration frequency standard deviation and the first vibration amplitude standard deviation within a preset adjustment period after the first ceramic processing parameter adjustment, and determine whether to perform a first processing feedback adjustment based on the result of the instability determination, wherein the first processing feedback adjustment is used to improve the processing stability of the workpiece to be processed; The post-milling performance evaluation module is used to evaluate abnormal high-temperature resistance of the ceramic based on the second ceramic performance parameter obtained after the workpiece is milled, and determine whether to adjust the second ceramic processing parameter; The second instability adjustment module is used to continue detection if the second ceramic processing parameter adjustment is not performed, and if the second ceramic processing parameter adjustment is performed, then after the second ceramic processing parameter adjustment is performed, instability judgment is performed according to the second vibration frequency standard deviation and the second vibration amplitude standard deviation within a preset adjustment period, and whether to perform the second processing feedback adjustment is determined based on the result of the instability judgment.

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