Precuring glue injection molding method

Abstract

The invention relates to the technical field of glue injection of electronic equipment, and discloses a pre-curing glue injection molding method capable of improving the problems of surface collapse and lack of glue of glue and improving the air tightness of the connecting part of a cover plate and a functional module, which comprises the following steps: assembling the cover plate and the functional module and then putting the cover plate and the functional module into a mold for glue injection, so that the surface of the cover plate and the surface of the functional module are covered with glue; pre-curing at least one part of the surface of the glue; curing the whole pre-cured glue; and demolding and taking out a product subjected to glue injection molding. According to the pre-curing glue injection molding method, overall curing is conducted after pre-curing, the glue shortage risk caused by the complex structure of a product or insufficient glue fluidity is eliminated through plugging pressure, the glue injection glue shortage problem is effectively solved, and the strength problem and the insufficient air tightness problem caused by glue shortage are effectively solved; the mechanical strength of a product after glue injection molding and the air tightness of the connecting part of the cover plate and the functional module are improved, and the glue injection plugging effect is improved.

Description

Technical Field

[0001] The invention relates to the technical field of electronic equipment glue injection, in particular to a pre-curing glue injection molding method. Background Art

[0002] During the assembly process of electronic equipment, after the product cover is connected to the functional module, it is often necessary to use glue to cover and wrap the product cover and functional module to achieve the effect of improving product strength and enhancing waterproof performance. At the same time, by protecting the bent cable, the black edge of the display can be made narrower. The glue used in the industry to cover the cover and functional module of electronic equipment usually includes thermosetting glue and UV curing glue. After the product is injected with glue, the glue needs to be cured to fix the shape. Since there are inlets and outlets during the injection process, the inlets and outlets need to be pressed into the residual glue in advance to facilitate subsequent demolding. When demolding, first remove the residual glue of the plug and the glue port connected to it, and then the mold can be opened smoothly for demolding. During the whole process, after the glue is poured and pressed into the plug, the glue begins to cure. After curing, demolding is completed, and finally, subsequent processing or secondary curing is performed depending on the properties and state of the glue, thereby completing the injection molding of the glue. Since the thermosetting glue and UV curing glue used for glue injection need to be used in electronic equipment, the curing conditions of the glue, such as temperature and energy, are subject to certain restrictions (to prevent electronic products from being deformed or damaged due to excessive temperature or heating energy), which makes the physical and chemical properties of the glue have certain limitations. For example, the glue has high viscosity and poor fluidity. In addition, for products with complex structural designs, too deep flow channels, or gaps and pores, after the glue injection is cured, the glue surface will collapse, lack of glue, and other appearance defects, and even cause the airtightness of the connection between the cover plate and the functional module to be insufficient due to the existence of gaps, resulting in poor product injection. Summary of the invention

[0003] Based on this, it is necessary to provide a pre-curing glue injection molding method that can improve the problems of glue surface collapse and glue deficiency and improve the air tightness of the connection between the cover plate and the functional module in order to address the above-mentioned shortcomings.

[0004] A pre-curing glue injection molding method comprises the following steps:

[0005] S1. Assemble the cover plate and the functional module, place them in a mold and inject glue so that the surface of the cover plate and the functional module are covered with glue;

[0006] S2, pre-curing at least a portion of the glue surface;

[0007] S3, curing the pre-cured glue as a whole;

[0008] S4, demoulding and taking out the product after injection molding.

[0009] In one embodiment, the mold includes a lower mold base and an upper mold base covered on the lower mold base, and a glue injection chamber for accommodating a cover plate and a functional module is formed between the upper mold base and the lower mold base. The upper mold base is provided with a glue inlet and a glue outlet that pass through the upper and lower surfaces of the upper mold base and are connected to the glue injection chamber.

[0010] In one of the embodiments, in step S1, when injecting glue, there is overflowing residual glue at the glue inlet and the glue outlet.

[0011] In one embodiment, in step S2, the glue surface corresponding to the glue inlet or the corresponding glue outlet is pre-cured, or the glue surface or upper layer is pre-cured.

[0012] In one of the embodiments, in step S2, before pre-curing the glue, the step further includes replenishing glue into the glue injection chamber through the glue inlet and the glue outlet.

[0013] In one of the embodiments, in step S2, before pre-curing the glue, it also includes pressing glue plugs into the glue inlet and the glue outlet; or after filling the glue in the glue injection chamber, pressing glue plugs into the glue inlet and the glue outlet.

[0014] In one embodiment, in step S4, demoulding and taking out the product after injection molding includes:

[0015] Pull out the rubber plugs at the rubber inlet and outlet;

[0016] Separate the upper mold base and the lower mold base so that the product after injection molding is separated from the upper mold base and the lower mold base.

[0017] In one of the embodiments, during the pre-curing operation of the glue, when the glue is a thermosetting glue, a convection heat transfer device, a radiation heat transfer device, or a heat conduction device is used to locally heat the surface of the glue; when the glue is a UV-curing glue, a UV lamp is used to locally heat the surface of the glue.

[0018] In one of the embodiments, after step S4, when the product after the injection molding is taken out, the glue on the surface of the product is further cured.

[0019] In one of the embodiments, in the curing operation of the glue, when the glue is a thermosetting glue, the glue is heated and cured; when the glue is a UV curing glue, the glue is cured using a UV lamp; in the secondary curing operation of the glue, the glue is cured using one or more of heating, UV curing, and standing at room temperature.

[0020] The pre-curing glue injection molding method of the present invention is implemented by pre-curing the glue on the surface of the cover plate and the functional module and then curing it as a whole, thereby blocking the path of defects such as collapse and glue deficiency appearing on the product appearance surface. The pre-curing of the glue surface limits the air pressure inside the glue, so that the defects generated during the glue curing process are all located in the inner layer or lower layer of the glue. The risk of glue deficiency caused by the complex structure of the product or insufficient glue fluidity is eliminated by the sealing pressure, effectively improving the glue deficiency problem of glue injection, as well as the strength problem and insufficient airtightness problem caused by glue deficiency, improving the mechanical strength of the product after glue injection molding and the airtightness of the connection between the cover plate and the functional module, and improving the glue injection sealing effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 A flowchart of a pre-curing glue injection molding method according to an embodiment of the present invention;

[0022] Figure 2 A schematic diagram of the first stage of the pre-curing injection molding method in one embodiment of the present invention;

[0023] Figure 3 A schematic diagram of the second stage of the pre-curing glue injection molding method in one embodiment of the present invention;

[0024] Figure 4 A schematic diagram of the third stage of the pre-curing glue injection molding method in one embodiment of the present invention;

[0025] Figure 5 A schematic diagram of the fourth stage of the pre-curing glue injection molding method in one embodiment of the present invention;

[0026] Figure 6 It is a schematic diagram of the fifth stage of the pre-curing glue injection molding method in one embodiment of the present invention;

[0027] Figure 7 This is a partial appearance diagram of the product obtained by using the existing injection molding method;

[0028] Figure 8 This is a partial appearance diagram of a product obtained by the pre-curing glue injection molding method of Example 1. DETAILED DESCRIPTION

[0029] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present invention, so the present invention is not limited by the specific embodiments disclosed below.

[0030] Please combine Figure 1-6 The present invention discloses a pre-curing glue injection molding method which can improve the problems of glue surface collapse and glue shortage and improve the air tightness of the connection part between the cover plate and the functional module. The pre-curing glue injection molding method comprises the following steps:

[0031] S1. Assemble the cover plate and the functional module and put them into the mold to inject glue so that the surface of the cover plate and the functional module are covered with glue. When the cover plate and the functional module are assembled, the two can be connected by glue and tape; the cover plate is the display screen of the electronic product, and the functional module is used to control the display screen to display images when the current is turned on. Furthermore, the mold includes a lower mold base 100 and an upper mold base 200 covered on the lower mold base 100, and a glue injection chamber for accommodating the cover plate 300 and the functional module 400 is formed between the upper mold base 200 and the lower mold base 100. The upper mold base 200 is provided with a glue inlet 500 and a glue outlet (not shown in the figure) that pass through the upper and lower surfaces of the upper mold base 200 and communicate with the glue injection chamber. In this embodiment, the upper surface of the lower mold base 100 is provided with a first groove for accommodating the cover plate 300, and the lower surface of the upper mold base 200 is provided with a second groove connected with the glue inlet 500 and the glue outlet. When the assembled cover plate 300 and the functional module 400 are placed on the lower mold base 100, the cover plate 300 is located in the first groove of the lower mold base 100, and at least a part of the functional module 400 is located in the second groove. In this way, when injecting glue, glue is only injected into the area enclosed by the second groove and the upper surface of the cover plate 300 and the surface of the functional module 400, as well as the glue inlet 500 and the glue outlet. According to the size and shape of the area to be injected on the product, the mold can be a closed structure or an open structure. In other words, the product (the assembly of the functional module and the cover plate 300) can be completely contained in the area between the upper mold base 200 and the lower mold base 100 (the mold is a closed structure), or only the part to be injected on the product can be contained in the area between the upper mold base 200 and the lower mold base 100 (the mold is an open structure). In this case, it is only necessary to ensure that the parts of the product that match the upper mold base 200 and the lower mold base 100 are sealed to prevent glue leakage. Of course, in order to ensure the stability of the structure after the upper mold base 200 and the lower mold base 100 are molded together, a positioning groove can be opened on the lower surface of the upper mold base 200, and a positioning column can be set on the upper surface of the lower mold base 100, so that the upper mold base 200 and the lower mold base 100 can be quickly aligned when the mold is closed, and the upper mold base 200 and the lower mold base 100 can be prevented from having relative displacement after the mold is closed.

[0032] In this embodiment, the glue added is a thermosetting glue or a UV curing glue. Preferably, the thermosetting glue is one of the commercially available AVENTK1009 series thermosetting glue, AVENTK1118 series thermosetting glue, and HKW1020F thermosetting glue. In addition, in step S1, when injecting glue, there is overflow residual glue at the glue inlet 500 and the glue outlet. In other words, when injecting glue into the product in the mold, the amount of glue injected must be greater than the amount of glue that can be injected into the mold containing the product, so that the glue overflows from the glue outlet and the glue inlet 500 overflows due to the glue injection chamber being filled with glue. In this way, when the glue plug 600 is pressed into the glue inlet 500 and the glue outlet, the existence of the overflowing glue can make the glue and the plug of the glue plug 600 combine together. Since the necks of the glue inlet 500 and the glue outlet (the junction between the glue inlet 500 and the second groove and the junction between the glue outlet and the second groove) are relatively thin, when the glue plug 600 is pulled out, the glue plug 600 pulls off the solidified glue in the glue inlet 500 from the junction between the glue inlet 500 and the second groove, and pulls off the solidified glue in the glue outlet from the junction between the glue outlet and the second groove. In addition, the above-mentioned residual glue can also be cured in the subsequent pre-curing operation, and does not affect the appearance of the final glue injection product.

[0033] S2, pre-curing at least a portion of the glue surface. Specifically, in step S2, pre-curing is performed on the glue surface corresponding to the glue inlet 500 or the corresponding glue outlet, or the glue surface or upper layer is pre-cured. Of course, other special characteristic structural parts on the glue surface can also be pre-cured. When pre-curing the glue surface corresponding to the glue inlet 500 or the corresponding glue outlet, the heating part of the heating equipment can be directly aligned with the glue inlet 500 and the glue outlet for heating to achieve local heating of the glue on the product surface; when pre-curing the glue surface or upper layer, the entire upper surface of the upper mold base 200 or a portion of the upper surface of the upper mold base 200 can be heated. In this way, the upper mold base 200 heats the entire or partial surface or upper layer of the glue while heating to achieve pre-curing of the glue. It should be noted that when the glue is UV-curable glue and the surface or outer layer of the glue needs to be pre-cured, the upper mold base 200 should be made of a high-temperature resistant transparent material so that the ultraviolet light emitted by the UV lamp used to cure the UV-curable glue can pass through the upper mold base 200 and reach the surface of the UV-curable glue to cure the surface or outer layer of the UV-curable glue. Preferably, in this embodiment, the glue at the glue inlet 500 and the glue outlet is partially pre-cured.

[0034] When the glue is cured as a whole at the same time or from bottom to top, since the top of the glue is in a flowable state and there is no pressure restriction, the defects will continue to move up until the glue surface, causing the glue surface to be concave and local glue shortages, and eventually causing the product to be scrapped. In this embodiment, the reason why the surface of the glue is pre-cured is to block the path of the defects appearing on the surface of the appearance of the injection product, that is, to achieve the blocking of atmospheric pressure and the inside of the glue through pre-curing. When the glue inlet 500, the glue outlet, the outer layer or the upper layer of the glue are pre-cured, the above-mentioned parts can play a role in blocking the atmospheric pressure in different product structures, so that during the curing process of the inner layer of glue, the defects and the reduction of the volume of the internal glue are all limited to the inside of the glue, so that the good surface appearance of the glue layer on the surface of the product can be guaranteed, so that collapse, pores, etc. cannot appear on the glue surface after pre-curing, but are in the original complex structure, thereby preventing the pores from gradually floating from the complex structure to the glue surface. For example, for the functional module and cover plate 300 assembly of the present solution, when only the glue inlet 500 and the glue outlet are pre-cured, the glue inlet 500 and the glue outlet can be blocked to limit the internal air pressure of the glue. Since the complex structural parts are concentrated in the lower part of the glue, the upward movement of the lower defects can be limited; similarly, the upper part of the entire glue can be cured to limit the upward movement of the lower defects of the glue; in addition, pre-curing the appearance surface (upper part, left side and right side) after subsequent demolding can also block the defects inside the glue, thereby avoiding the collapse or lack of glue defects on the glue surface. In other words, the key to "pre-curing" in this embodiment is to first cure locally (surface layer or part of the surface layer) in sequence, and limit the defects such as bubbles and collapse inside the glue by blocking the principle of floating defects, so as to achieve the effect of no defects on the glue surface.

[0035] In this embodiment, in step S2, before the glue is pre-cured, it also includes replenishing glue into the glue injection chamber through the glue inlet 500 and the glue outlet. Specifically, when the amount of glue overflow is insufficient during the glue filling process, the glue puller plug cannot be inserted into the glue inlet and the glue outlet and effectively contact the glue. By replenishing glue at the glue inlet and the glue outlet, the glue puller plug can be smoothly inserted and tightly combined with the glue after curing. In one embodiment, in step S2, before the glue is pre-cured, it also includes pressing the glue puller plug 600 into the glue inlet 500 and the glue outlet; or after replenishing glue in the glue injection chamber, pressing the glue puller plug 600 into the glue inlet 500 and the glue outlet. That is to say, the glue puller plug 600 can be pressed into the glue inlet 500 and the glue outlet before the pre-curing operation, or it can be pressed into the glue inlet 500 and the glue outlet after the glue filling operation is completed. In other words, before the overall glue curing of the product, the glue puller plug 600 can be pressed into the glue inlet 500 and the glue outlet to facilitate subsequent smooth demolding.

[0036] In addition, in the pre-curing operation of the glue, when the glue is a thermosetting glue, a convection heat transfer device, a radiation heat transfer device, or a heat conduction device is used to locally heat the surface of the glue. The convection heat transfer device can be a hot air gun (heated by hot air circulation), the radiation heat transfer device can be a laser heater (cured by laser heating), and the heat conduction device can be a heating plate; in particular, when the glue inlet 500 and the glue outlet are pre-cured, a laser heater can be used to locally heat the glue, which takes a fast time to cure and can avoid a too large curing range. When the upper layer of the glue is thermally cured, a hot air gun or a heating plate can be used to heat the glue. Specifically, since the hot air gun uses hot air circulation heating, the heating accuracy is not easy to control, and it can only ensure that the curing rate of the outer layer is faster than that of the inner side, so as to complete the pre-curing. It requires that the thermal conductivity of the glue is low and the volume is large, and it is necessary to continuously verify the optimal pre-curing parameters. When using a heating plate for pre-curing, it is necessary to ensure that the thermal conductivity of the glue is low, the volume of the glue is large, and the heating plate is placed above the glue (or above the mold) to achieve pre-curing of the upper layer of the glue. For the case where the final appearance is small or the injection molding appearance is not on the top of the product, the pre-curing range can be reduced as appropriate or the non-top appearance surfaces can be pre-cured at the same time. When the glue is UV-curable glue, use a UV lamp to partially cure the glue surface.

[0037] In this embodiment, when the product glue injection condition meets one of the following conditions, the pre-curing operation is judged to be completed:

[0038] 1) For the case where the required pre-curing surface is exposed (such as the glue inlet 500 and the glue outlet), visually or using a tool to touch the exposed surface, when it is confirmed that it has been cured, or when a linear elastic deformation or no deformation is produced by light touch (as opposed to the case where the liquid will directly immerse or produce ripples), the pre-curing is considered to be completed.

[0039] 2) If the pre-cured surface is not completely visible, the pre-curing and curing time can be adjusted to ensure that the final product has no surface defects.

[0040] 3) If the pre-cured surface is not completely visible, you can also remove the mold after pre-curing, wipe off the uncured glue, and directly check whether the cured part completely covers the required pre-curing range to determine.

[0041] In the present embodiment, when the glue at the glue inlet 500 and the glue outlet is locally pre-cured, the depth of the pre-curing is greater than the depth of the glue inlet 500 and the depth of the glue outlet. Since the pre-cured portion is often connected to the atmosphere, this portion is not prone to collapse and glue shortage due to insufficient air pressure. In this way, when the glue puller plug 600 is taken out and the solidified glue in the glue inlet 500 and the glue outlet is pulled apart, the fracture site of the solidified glue is smooth.

[0042] S3, curing the pre-cured glue as a whole.

[0043] S4, demoulding and taking out the product after injection molding. In step S4, demoulding and taking out the product after injection molding include: pulling out the glue plug 600 at the glue inlet 500 and the glue outlet; separating the upper mold base 200 and the lower mold base 100, so that the product after injection molding is separated from the upper mold base 200 and the lower mold base 100. After step S4, when taking out the product after injection molding, it also includes secondary curing of the glue on the surface of the product. It should be noted that in this scheme, not all glues need secondary curing. Specifically, it can be determined whether secondary curing is required by measuring whether the curing rate of the glue reaches 100%. Common measuring equipment includes FTIR (infrared spectrometer) or a dedicated glue curing rate detector for measurement; it can also be determined whether secondary curing is required according to the performance of the glue through the glue material instruction manual to avoid the problem of low strength of the glue after curing caused by insufficient curing rate of the glue. During secondary curing, the product after injection molding can be directly cured (without having to be put into the mold for finalization) to ensure the strength of the glue on the product after curing.

[0044] In the curing operation of the glue, when the glue is a thermosetting glue, the glue is heated and cured, for example, an oven or a furnace is used to heat the glue; when the glue is a UV curing glue, a UV lamp is used to cure the glue. In the secondary curing operation of the glue, one or more methods of heating, UV curing and standing at room temperature are used to cure the glue. For example, for thermosetting glue, heating or standing at room temperature or a combination of heating and standing at room temperature can be used to cure the glue for the secondary curing. For UV curing glue, UV curing, standing at room temperature or a combination of UV curing and standing at room temperature can be used to cure the glue for the secondary curing. In one embodiment, AVENTK1009 series thermosetting glue is used to inject glue on the surface of the product. It does not require multi-stage curing. When the glue is pre-cured, the surface of the glue is pre-cured at 80°C for 3-7 minutes. When the glue is cured as a whole, the glue is cured as a whole at 80°C for 8-12 minutes to complete the injection and shaping of the product surface. For glues that require multi-stage curing, such as UV-curing glue, the first stage curing conditions are usually used for pre-curing. For example, after the surface of the glue is irradiated with UV light, a second stage of standing at room temperature for 24 hours is required to complete deep curing. Since deep curing is only for increasing strength, pre-curing only requires UV irradiation.

[0045] The operation process of the pre-curing glue injection molding method of this scheme is explained below with reference to specific examples.

[0046] Example 1

[0047] a. Place the product (assembled cover plate 300 and functional module 400) into the mold, use HKW1020F thermosetting adhesive to inject glue, and leave residual glue (i.e. overflow glue) at the glue inlet 500 and the glue outlet.

[0048] b. Use a hot air gun to heat and cure the residual glue at the glue inlet 500 and the glue outlet. The curing temperature is 60°C and the curing time is 6 minutes.

[0049] c. Fill the glue at the glue inlet 500 and the glue outlet, and press the glue plug 600 into the glue inlet 500 and the glue outlet respectively.

[0050] d. Place the product in an oven for curing, set the curing temperature to 60°C and the curing time to 50 minutes.

[0051] e. After curing, the rubber blocks at the rubber inlet 500 and the rubber outlet are removed by pulling out the rubber plug 600, and the product is demoulded and obtained. There is no glue defect on the surface of the product.

[0052] In other embodiments, other commercially available thermosetting adhesives may be used, and the curing temperature and curing time may be adjusted accordingly, which will not be described in detail herein.

[0053] Example 2

[0054] a. Place the product (assembled cover plate 300 and functional module 400) into a mold (the upper mold base 200 of the mold is made of high-temperature resistant transparent material), inject glue using UV curing glue, and leave residual glue (i.e. overflow glue) at the glue inlet 500 and the glue outlet.

[0055] b. Use black tape to cover the areas that do not need to be cured, and use a UV lamp to cure the residual glue at the glue inlet 500 and the glue outlet.

[0056] c. Fill the glue at the glue inlet 500 and the glue outlet, and press the glue plug 600 into the glue inlet 500 and the glue outlet respectively.

[0057] d. Tear off the black tape and use UV lamp to cure the glue as a whole.

[0058] e. After curing, remove the rubber blocks at the rubber inlet 500 and the rubber outlet by pulling out the rubber plug 600 to demould.

[0059] f. After demoulding, use UV lamp to perform UV secondary curing on the product. After secondary curing, the product is obtained, and there is no glue defect on the surface of the product.

[0060] Combination Figure 7 and Figure 8It can be seen that the product obtained by the existing overall curing injection molding method has depressions on the surface, while the product molded after pre-curing and overall curing in this solution has a smooth surface, which significantly improves the injection molding effect and quality of the product.

[0061] The pre-curing glue injection molding method of the present invention is implemented by pre-curing the glue on the surface of the cover plate 300 and the functional module 400 and then curing the whole, thereby blocking the path of defects such as collapse and glue deficiency appearing on the product appearance surface. The pre-curing of the glue surface limits the air pressure inside the glue, so that the defects generated during the glue curing process are all located in the inner layer or lower layer of the glue. The risk of glue deficiency caused by the complex structure of the product or insufficient glue fluidity is eliminated by the sealing pressure, which effectively improves the glue deficiency problem during glue injection, as well as the strength problem and insufficient airtightness problem caused by glue deficiency, improves the mechanical strength of the product after glue injection molding and the airtightness of the connection between the cover plate 300 and the functional module 400, and improves the glue injection sealing effect.

[0062] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0063] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A pre-curing glue injection molding method, characterized in that: The following steps are involved: S1. Assemble the cover plate and the functional module, place them in a mold and inject glue so that the surface of the cover plate and the functional module are covered with glue; S2, pre-curing at least a portion of the glue surface; S3, curing the pre-cured glue as a whole; S4, demoulding and taking out the product after injection molding.

2. The pre-curing glue injection molding method according to claim 1, characterized in that: The mold includes a lower mold base and an upper mold base covered on the lower mold base, a glue injection chamber for accommodating a cover plate and a functional module is formed between the upper mold base and the lower mold base, and the upper mold base is provided with a glue inlet and a glue outlet that penetrate the upper and lower surfaces of the upper mold base and are connected to the glue injection chamber.

3. The pre-curing glue injection molding method according to claim 2, characterized in that: In step S1, when injecting glue, there is overflowing residual glue at the glue inlet and the glue outlet.

4. The pre-curing glue injection molding method according to claim 2, characterized in that: In step S2, pre-curing is performed on the surface of the glue corresponding to the glue inlet or the corresponding glue outlet, or the surface layer or upper layer of the glue is pre-cured.

5. The pre-curing glue injection molding method according to claim 2, characterized in that: In step S2, before pre-curing the glue, it also includes replenishing glue into the glue injection chamber through the glue inlet and the glue outlet.

6. The pre-curing glue injection molding method according to claim 5, characterized in that: In step S2, before pre-curing the glue, it also includes pressing glue plugs into the glue inlet and the glue outlet; or after filling the glue in the glue injection chamber, pressing glue plugs into the glue inlet and the glue outlet.

7. The pre-curing glue injection molding method according to claim 6, characterized in that: In step S4, demoulding and taking out the product after injection molding includes: Pull out the rubber plugs at the rubber inlet and outlet; Separate the upper mold base and the lower mold base so that the product after injection molding is separated from the upper mold base and the lower mold base.

8. The pre-curing glue injection molding method according to claim 1, characterized in that: In the pre-curing operation of the glue, when the glue is a thermosetting glue, a convection heat transfer device, a radiation heat transfer device, or a heat conduction device is used to locally heat the surface of the glue; when the glue is a UV curing glue, a UV lamp is used to locally heat the surface of the glue.

9. The pre-curing glue injection molding method according to claim 1, characterized in that: After step S4, when the product after the injection molding is taken out, the glue on the surface of the product is further cured.

10. The pre-curing glue injection molding method according to claim 9, characterized in that: In the curing operation of the glue, when the glue is a thermosetting glue, the glue is heated and cured; when the glue is a UV curing glue, the glue is cured by a UV lamp; in the secondary curing operation of the glue, the glue is cured by one or more methods of heating, UV curing and standing at room temperature.

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