Pump valve integrated module for thermal management system

Abstract

The invention relates to a pump valve integration module for a thermal management system, which comprises a shell, a pump assembly, a valve assembly and a control circuit board, the control circuit board is electrically connected with the pump assembly and a driving part of the valve assembly, the shell comprises a lower shell, an upper shell and a middle assembly plate, the middle assembly plate is arranged between the lower shell and the upper shell, and the pump assembly is arranged in the middle assembly plate. The lower shell, the upper shell and the middle assembly plate are fixedly connected, a liquid inlet is formed in one side of the lower shell, a plurality of liquid outlets are formed in the other side of the lower shell, the pump assembly and the valve assembly are arranged in the lower shell, the pump assembly is arranged on one side of the liquid inlet, and the valve assembly is arranged on one side of the liquid outlets. A driving assembly used for driving a valve element of the valve assembly to rotate is arranged on the middle assembly plate, and the control circuit board is arranged in the upper shell. According to the pump and valve integrated module, the pump assembly and the valve assembly are integrated into a whole module, installation is easy and convenient, liquid leakage can be prevented, liquid can flow smoothly, corners and dead zones do not exist, and liquid flow resistance is greatly reduced.

Description

Technical Field

[0001] The present invention relates to the technical field, and in particular to a pump-valve integrated module for a thermal management system. Background Art

[0002] A car is a highly integrated complex industrial product, which is made up of thousands of parts and assemblies. Each component has unique operating temperature and material temperature tolerance requirements. Ensuring that they operate within a suitable temperature range is the key to ensuring the safe, efficient and stable operation of the car. The automotive thermal management system starts from the perspective of the entire vehicle and finely controls the heat exchange between the vehicle and the environment to maintain the optimal operating temperature range of each component and the comfort of the people in the passenger compartment.

[0003] Taking new energy vehicles as an example, the thermal management system mainly includes the refrigerant circuit and the coolant circuit. The components of the refrigerant circuit include the compressor, condenser, evaporator, expansion valve, etc., and the components of the coolant circuit include the electronic water pump, multi-way valve, water tank, heater, etc. With the development of the thermal management system of new energy electric vehicles, the thermal management system has a trend of integration, such as integrating the heater and the water tank, or integrating the evaporator and the heater. The concept of component integration greatly saves the number of parts and the length of the fluid channel, and also reduces the risk of leakage in the pipes connecting the components.

[0004] Multi-way valves and pumps are essential components in automotive thermal management systems. Multi-way valves are used to adjust the flow direction of liquids, while pumps have the function of driving the flow of liquids. In traditional solutions, the two are usually connected through liquid pipelines and need to be controlled by their respective controllers. The disadvantages of this solution are that the structure is complex, the pump and multi-way valve need to be assembled separately and connected through liquid pipelines, which takes up a large volume, and there is a risk of leakage in the pipelines. In addition, two controllers are required, which also increases the number and cost of controllers. Summary of the invention

[0005] The purpose of the present invention is to solve the problem that the multi-way valve and pump in the automotive thermal management system in the prior art are separately arranged, connected by a liquid pipeline, and need to be controlled by two controllers respectively, which has a complex structure, a risk of leakage and high cost, and provide a pump-valve integrated module for a thermal management system.

[0006] To achieve the above objectives, the present invention is implemented through the following technical solutions: A pump-valve integrated module for a thermal management system comprises a housing, a pump assembly, a valve assembly and a control circuit board, wherein the control circuit board is electrically connected to driving parts of the pump assembly and the valve assembly respectively, the housing comprises a lower housing, an upper housing and an intermediate assembly plate, the intermediate assembly plate is arranged between the lower housing and the upper housing, and the lower housing, the upper housing and the intermediate assembly plate are fixedly connected, a liquid inlet is arranged on one side of the lower housing, and a plurality of liquid outlets are arranged on the other side of the lower housing, the pump assembly and the valve assembly are respectively arranged in the lower housing, the pump assembly is arranged on one side of the liquid inlet, and the valve assembly is arranged on one side of the liquid outlet, a driving assembly for driving a valve core of the valve assembly to rotate is arranged on the intermediate assembly plate, and the control circuit board is arranged in the upper housing.

[0007] In the above scheme, a pump accommodating chamber for accommodating a pump assembly and a valve accommodating chamber for accommodating a valve assembly are provided in the inner cavity of the lower shell, an isolation plate is formed between the pump accommodating chamber and the valve accommodating chamber, and a liquid flow channel is provided between the pump accommodating chamber and the valve accommodating chamber. Through this arrangement, the pump assembly and the valve assembly can be respectively arranged in the corresponding accommodating chambers, and the two chambers are separated by the isolation plate. After the liquid pumped into the pump accommodating chamber from the liquid inlet by the pump assembly enters the pump accommodating chamber, it is transported to the liquid flow channel under the action of the pump assembly, enters the valve accommodating chamber through the liquid flow channel, and selects the liquid outlet in the valve accommodating chamber under the action of the valve assembly to output the liquid.

[0008] In the above scheme, a liquid vortex groove is provided in the pump accommodating chamber, and the liquid vortex groove is arranged on the bottom surface of the pump accommodating chamber, and the end of the liquid vortex groove corresponds to the liquid flow channel. Through this arrangement, the liquid can flow along the liquid vortex groove in the pump accommodating chamber under the action of the pump assembly, and the liquid can flow smoothly between the pump accommodating chamber and the valve accommodating chamber without corners and dead zones, greatly reducing the liquid flow resistance.

[0009] In the above scheme, a spherical groove corresponding to the valve core is provided at the bottom of the valve accommodating chamber, the outlet of the liquid flow channel is on the side wall of the spherical groove, and a liquid outlet flow channel corresponding to each liquid outlet is provided at the upper part of the spherical groove. Through this arrangement, the valve core of the valve assembly is installed in the valve accommodating chamber, the shape of the valve core and the valve accommodating chamber can be better matched, the liquid flowing in from the outlet of the liquid flow channel will enter the valve core from the liquid inlet at the bottom of the valve core, and flow out from the liquid outlet on the side of the valve core under the liquid pressure, and the position of the liquid outlet of the valve core corresponds to the position of each liquid outlet flow channel on the spherical groove, and through the rotation of the valve core, when the liquid outlet on the valve core corresponds to part or all of the liquid outlet flow channel on the side wall of the spherical groove, the liquid can flow out from the corresponding liquid outlet flow channel.

[0010] In the above scheme, the control circuit board includes an MCU, an input interface, a pump drive circuit and a valve control circuit. The input interface is used to input power and external control signals. The signal end and the power end of the input interface are respectively connected to the corresponding signal ports and power ports on the MCU, the pump drive circuit and the valve control circuit. The output end of the MCU is provided with a high-side drive signal output end and a low-side drive signal output end connected to the pump drive circuit. A first sampling resistor is also connected to the pump drive circuit, and the first sampling resistor is connected to the current sampling port on the MCU. The output end of the MCU is provided with a forward control signal output end and a reverse control signal output end connected to the valve control circuit. A second sampling resistor is connected to the valve control circuit, and the second sampling resistor is connected to the current sampling port on the MCU. An overcurrent detector is also provided on the valve control circuit, and the overcurrent detector is connected to the stall signal end on the MCU. Through this setting, the MCU can control the pump assembly and the valve assembly respectively through the pump drive circuit and the valve control circuit. The pump drive circuit is set with two drive modes, high-side drive and low-side drive. The MCU can control the working mode of the pump assembly according to application needs. The valve control circuit is set with two drive modes, forward drive and reverse drive. The MCU can control the rotation of the valve core in the valve assembly according to application needs to control the flow direction of the liquid. By setting the sampling resistor, the current of the pump drive circuit and the valve control circuit can be sampled, overcurrent protection can be performed, and the working status of the pump assembly and the valve assembly can be monitored, so as to timely detect the failure of the pump assembly and the valve assembly. The overcurrent detector set on the valve assembly can further detect the stall fault on the valve assembly, so as to timely detect the equipment failure.

[0011] In the above scheme, the pump driving circuit includes a high-side driving circuit and a low-side driving circuit, and the high-side driving circuit and the low-side driving circuit respectively include three MOS tubes, the drains of the three MOS tubes of the high-side driving circuit are respectively connected to the positive electrode of the power supply end, the gates are respectively connected to the high-side driving signal output end on the MCU, and the sources are respectively connected to the three electrodes of the pump, the drains of the three MOS tubes of the low-side driving circuit are respectively connected to the three electrodes of the pump, the gates are respectively connected to the low-side driving signal output end on the MCU, and the three drains are respectively connected to the negative electrode of the power supply end, and a first capacitor is connected between the positive and negative electrodes of the power supply end of the pump driving circuit.

[0012] In the above scheme, the valve control circuit includes a forward drive circuit and a reverse drive circuit, and the forward drive circuit and the reverse drive circuit respectively include two MOS tubes, the drains of the two MOS tubes of the forward drive circuit are respectively connected to the positive electrode of the power supply end, the gates are respectively connected to the forward control signal output end on the MCU, and the sources are respectively connected to the power supply end of the valve control motor, the drains of the MOS tubes of the reverse drive circuit are respectively connected to the power supply end of the valve control motor, the gates are respectively connected to the reverse control signal output end on the MCU, and the sources are respectively connected to the negative electrode of the power supply end, and a second capacitor is connected between the positive and negative electrodes of the power supply end of the valve control circuit.

[0013] In the above solution, the pump assembly is a pump assembly driven by an axial flux motor. This arrangement can reduce the axial height of the pump assembly, make the pump assembly flatter, and reduce the volume of the pump-valve integrated module for the thermal management system.

[0014] In the above scheme, the valve assembly is a single ball valve, and a driving mechanism for driving the valve core to rotate is provided on the middle assembly plate.

[0015] In the above scheme, the driving mechanism includes a motor, a worm gear transmission mechanism, a first reduction gear set and a second reduction gear set, the motor is fixedly arranged on the middle assembly plate, the output shaft of the motor is fixedly connected to the worm, the worm wheel is meshed with the worm, a pinion of the first reduction gear set is arranged on the worm wheel shaft, a large gear of the first reduction gear set is meshed with the pinion, and a pinion of the second reduction gear set is arranged on the rotating shaft of the large gear of the first reduction gear set, and the large gear of the second reduction gear set is fixedly connected to the rotating shaft on the valve core of the valve assembly. Through this arrangement, the motor drives the worm of the worm gear transmission mechanism to rotate, and then drives the worm wheel to rotate, and then drives through the first reduction gear set and the second reduction gear set, so that the rotation speed of the rotating shaft of the driving valve core meets the application requirements, and the worm gear transmission mechanism and the two-stage gear reduction mechanism are used to drive the rotation of the valve core, so that the axial height of the driving mechanism can be reduced, the valve assembly can be flatter, and the volume of the pump valve integrated module for the thermal management system can be reduced.

[0016] The present invention has positive effects: 1) The pump-valve integrated module of the present invention integrates the pump assembly and the valve assembly into an integral module, which can save the liquid pipeline between the pump assembly and the valve assembly, ensure the smooth flow of the liquid delivery channel between the pump assembly and the valve assembly, and prevent liquid leakage; 2) In the pump-valve integrated module of the present invention, the pump assembly and the valve assembly can share a controller, reducing the complexity and cost of the equipment; 3) The pump-valve integrated module of the present invention can be installed as a whole during installation, which is easier to install and can save installation space; 4) The pump-valve integrated module of the present invention is designed with a dedicated pump assembly control circuit and a valve assembly control circuit, which can accurately control the pump assembly and the valve assembly, and the heating elements in the control circuit, such as The MOS tube can be arranged on the upper shell, and the heat is dissipated through the upper shell to extend its service life and ensure the stability of the control circuit; 5) The pump-valve integrated module of the present invention is not a simple splicing of the pump assembly and the valve assembly, but a pump accommodating chamber and a valve accommodating chamber are designed in the shell, and the pump accommodating chamber and the valve accommodating chamber are respectively used for the assembly of the pump assembly and the valve assembly. At the same time, an isolation plate is formed between the pump accommodating chamber and the valve accommodating chamber, and a liquid flow channel is provided between the pump accommodating chamber and the valve accommodating chamber. By providing a liquid vortex groove, the end of the liquid vortex groove corresponds to the liquid flow channel, so that the liquid can flow smoothly between the pump accommodating chamber and the valve accommodating chamber without corners and dead zones, thereby greatly reducing the liquid flow resistance. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the top structure of the pump-valve integrated module for the thermal management system of the present invention.

[0018] Figure 2 It is a schematic diagram of the side structure of the pump-valve integrated module for the thermal management system of the present invention.

[0019] Figure 3 It is a bottom view structural schematic diagram of the pump-valve integrated module for the thermal management system of the present invention.

[0020] Figure 4 Based Figure 3 Schematic diagram of the cross-sectional structure in the AA direction.

[0021] Figure 5 It is a schematic diagram of the internal structure of the pump-valve integrated module for the thermal management system of the present invention.

[0022] Figure 6 Schematic diagram of the internal structure of the pump-valve integrated module for the thermal management system of the present invention (excluding the middle assembly plate).

[0023] Figure 7 Schematic diagram of the internal structure of the lower shell.

[0024] Figure 8This is a schematic diagram of the structure of the control circuit board.

[0025] The reference numerals in the figure are: housing 1, lower housing 11, pump accommodating chamber 111, valve accommodating chamber 112, isolation plate 113, liquid flow channel 114, liquid vortex groove 115, spherical groove 116, upper housing 12, heat dissipation rib 121, intermediate assembly plate 13, liquid inlet 14, liquid outlet 15, pump assembly 2, stator 21, stator magnet 22, permanent magnet 23, rotor magnet 24, impeller 25, rotating shaft 26, sleeve 27, valve assembly 3, valve core 31, sealing ring 32, Rotating shaft 33, liquid inlet 34, liquid outlet 35, sealing ring 36, control circuit board 4, MCU41, input interface 42, pump drive circuit 43, high-side drive circuit 431, low-side drive circuit 432, valve control circuit 44, forward drive circuit 441, reverse drive circuit 442, first capacitor 45, second capacitor 46, sealing ring 5, drive mechanism 6, motor 61, worm gear transmission mechanism 62, first reduction gear set 63, second reduction gear set 64. DETAILED DESCRIPTION

[0026] The technical scheme of the present invention is clearly and completely described below through embodiments. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0027] like Figure 1-6 As shown, the pump-valve integrated module for a thermal management system of the present invention comprises a housing 1 , a pump assembly 2 , a valve assembly 3 and a control circuit board 4 .

[0028] The housing 1 includes a lower housing 11 , an upper housing 12 and a middle assembly plate 13 . The middle assembly plate 13 is disposed between the lower housing 11 and the upper housing 12 , and the lower housing 11 , the upper housing 12 and the middle assembly plate 13 are fixedly connected.

[0029] like Figure 7 As shown, the lower shell 11 can be an integral injection molded part, and a pump accommodating chamber 111 for accommodating the pump assembly 2 and a valve accommodating chamber 112 for accommodating the valve assembly 3 are provided in the inner cavity of the lower shell 11. The pump assembly 2 and the valve assembly 3 are respectively arranged in the corresponding accommodating chambers, and an isolation plate 113 is formed between the pump accommodating chamber 111 and the valve accommodating chamber 112. The two chambers are separated by the isolation plate 113, and a liquid flow channel 114 is provided between the pump accommodating chamber 111 and the valve accommodating chamber 112.

[0030] A liquid inlet 14 is provided at the bottom of the lower housing 11 at a position corresponding to the pump accommodating chamber 111, and the liquid inlet 14 is connected to the pump accommodating chamber 111. A liquid outlet 15 is provided on the side wall of the lower housing 11, and the position of the liquid outlet 15 is connected to the valve accommodating chamber 112. The number of liquid outlets 15 can be set as needed, for example, Figure 1-3 In the embodiment shown, three liquid outlets are provided.

[0031] After the liquid pumped in from the liquid inlet 14 enters the pump accommodating chamber 111, it is transported to the liquid flow channel 114 under the action of the pump assembly 2, enters the valve accommodating chamber 112 through the liquid flow channel 114, and selects the liquid outlet 15 under the action of the valve assembly 3 to output the liquid.

[0032] A liquid vortex groove 115 is provided in the pump accommodating chamber 111. The liquid vortex groove 115 is provided on the bottom surface of the pump accommodating chamber 111, and the end of the liquid vortex groove 115 corresponds to the liquid flow channel 114. Through this arrangement, the liquid can flow along the liquid vortex groove 115 in the pump accommodating chamber 111 under the action of the pump assembly 2, and the liquid can flow smoothly between the pump accommodating chamber 111 and the valve accommodating chamber 112 without corners and dead zones, thereby greatly reducing the liquid flow resistance.

[0033] Through the above-mentioned improvements, the integration of the pump assembly 2 and the valve assembly 3 can produce better effects and enhance the liquid circulation performance of the vehicle's thermal management system.

[0034] The bottom of the valve accommodating chamber 112 is provided with a spherical groove 116 corresponding to the valve core 31, the outlet of the liquid flow channel 114 is on the side wall of the spherical groove 116, and the upper part of the spherical groove 116 is provided with liquid outlet channels corresponding to each liquid outlet 15. Through this arrangement, the valve core 31 of the valve assembly 3 is installed in the valve accommodating chamber 112, and the shape of the valve core 31 can better match the valve accommodating chamber 112. The liquid flowing in from the outlet of the liquid flow channel 114 will enter the valve core from the liquid inlet 34 at the bottom of the valve core 31, and flow out from the liquid outlet 35 on the side of the valve core 31 under the liquid pressure, and the position of the liquid outlet 35 of the valve core 31 corresponds to the position of each liquid outlet channel on the spherical groove 116. Through the rotation of the valve core 31, when the liquid outlet 35 on the valve core 31 partially or completely corresponds to the liquid outlet channel on the side wall of the spherical groove 116, the liquid can flow out from the corresponding liquid outlet channel.

[0035] The intermediate assembly plate 13 can be an integral injection molded part, and the shape of the intermediate assembly plate 13 matches the top profile of the lower shell 11. In order to prevent leakage of liquid, a sealing ring 5 is provided between the intermediate assembly plate 13 and the upper edge of the lower shell 11. After the intermediate assembly plate 13 is fixedly connected to the lower shell 11, the internal cavity of the lower shell 11 can be closed, and the driving mechanism 6 of the valve assembly 3 can be easily assembled on the intermediate assembly plate 13.

[0036] The upper housing 12 can be made of an alloy integrally formed part that is easy to dissipate heat. The upper housing 12 is made of aluminum alloy material with excellent thermal conductivity. There are multiple raised heat dissipation ribs 121 on the upper housing 12, which mainly dissipate heat for components on the PCB board of the control circuit board 4.

[0037] The upper shell 12, the middle assembly plate 13 and the lower shell 11 are fixedly connected, and the connection method can be bolt connection. The bolts pass through the upper shell 12, the middle assembly plate 13 and the lower shell 11 in sequence and are fixedly connected through threaded fit. Sealing rings can be provided between the upper shell 12 and the middle assembly plate 13, and between the middle assembly plate 13 and the lower shell 11 to ensure the sealing of the shell. The fixed connection method between the upper shell 12, the middle assembly plate 13 and the lower shell 11 can also be ultrasonic welding. This connection method can also ensure the firmness and sealing of the connection between the upper shell, the middle assembly plate and the lower shell, but the disadvantage is that it is difficult to disassemble for maintenance.

[0038] like Figure 8 As shown, the control circuit board 4 includes an MCU 41 , an input interface 42 , a pump driving circuit 43 and a valve control circuit 44 .

[0039] The input interface 41 can be set at a position as required, for example, it can be set on the top or side wall of the upper housing 12. The input interface 41 is used to input power and external control signals, and the signal end and power end of the input interface 41 are respectively connected to the corresponding signal port and power port on the MCU 41, the pump drive circuit 43 and the valve control circuit 44.

[0040] The output end of MCU41 is provided with high-side drive signal output ends HS_U, HS_V, HS_W and low-side drive signal output ends LS_U, LS_V, LS_W connected to the pump drive circuit 43. A first sampling resistor is also connected to the pump drive circuit 43, and the first sampling resistor is connected to the current sampling port on MCU41. The output end of MCU41 is provided with a forward control signal output end and a reverse control signal output end connected to the valve control circuit 44. A second sampling resistor is connected to the valve control circuit 44, and the second sampling resistor is connected to the current sampling port on MCU41. An overcurrent detector is also provided on the valve control circuit 44, and the overcurrent detector is connected to the stall signal end on MCU41.

[0041] The pump driving circuit 43 includes a high-side driving circuit 431 and a low-side driving circuit 432. The high-side driving circuit and the low-side driving circuit respectively include three MOS tubes. The drains of the three MOS tubes of the high-side driving circuit 431 are respectively connected to the positive electrode of the power supply end, the gates are respectively connected to the high-side driving signal output end on the MCU, and the sources are respectively connected to the three electrodes of the pump. The drains of the three MOS tubes of the low-side driving circuit 432 are respectively connected to the three electrodes of the pump, the gates are respectively connected to the low-side driving signal output end on the MCU, and the three drains are respectively connected to the negative electrode of the power supply end. A first capacitor 45 is connected between the positive and negative electrodes of the power supply end of the pump driving circuit 43.

[0042] The valve control circuit 44 includes a forward drive circuit 441 and a reverse drive circuit 442. The forward drive circuit 441 and the reverse drive circuit 442 respectively include two MOS tubes. The drains of the two MOS tubes of the forward drive circuit 441 are respectively connected to the positive electrode of the power supply end, the gates are respectively connected to the forward control signal output end on the MCU41, and the sources are respectively connected to the power supply end of the valve control motor. The drains of the MOS tubes of the reverse drive circuit 442 are respectively connected to the power supply end of the valve control motor, the gates are respectively connected to the reverse control signal output end on the MCU41, and the sources are respectively connected to the negative electrode of the power supply end. A second capacitor 46 is connected between the positive and negative electrodes of the power supply end of the valve control circuit 44.

[0043] The MCU 41, input interface 42, pump drive circuit 43 and valve control circuit 44 of the control circuit board 4 are arranged on a PCB circuit board, and the control circuit board 4 can be fixedly mounted on the upper housing 12 by screws. Among them, circuit components that are easy to heat up, such as MCU 41, MOS tubes and other components, can be set to contact the inner wall of the upper housing 12 to enhance the heat dissipation effect. In order to further enhance the heat dissipation effect, heat dissipation ribs 121 can also be set on the outer wall of the upper housing.

[0044] Through this configuration, MCU41 can control pump assembly 2 and valve assembly 3 respectively through pump drive circuit 43 and valve control circuit 44. Two drive modes, high-side drive and low-side drive, are set in pump drive circuit 43. MCU41 can control the working mode of pump assembly according to application needs. Two drive modes, forward drive and reverse drive, are set in valve control circuit 44. MCU41 can control the rotation of valve core 31 in valve assembly 3 according to application needs to control the flow direction of liquid. By setting sampling resistor, the current of pump drive circuit and valve control circuit can be sampled, overcurrent protection can be performed, and the working status of pump assembly 2 and valve assembly 3 can be monitored, so as to timely detect the failure of pump assembly 2 and valve assembly 3. The overcurrent detector set on valve assembly 3 can further detect the stall failure on valve assembly, so as to timely detect the equipment failure.

[0045] The pump assembly 2 can use the assembly in the housing of an existing liquid pump. For example, the pump assembly can use an axial flux motor driven pump assembly, which can reduce the axial height of the pump assembly, make the pump assembly flatter, and reduce the volume of the pump-valve integrated module for the thermal management system. If needed, the pump assembly can also use a radial flux motor driven pump assembly.

[0046] like Figure 4 As shown, taking the pump assembly driven by the axial flux motor as an example, it includes a stator 21, a stator magnetic steel 22, a permanent magnet 23, a rotor magnetic steel 24, an impeller 25, a rotating shaft 26 and a sliding sleeve 27. The assembly method thereof can refer to the figure, and a magnetic steel assembly groove and a rotating shaft assembly seat for assembling the stator magnetic steel 22 are provided on the intermediate assembly plate 13. The stator magnetic steel 22 is fixedly arranged in the magnetic steel assembly groove, and the stator magnetic steel 22 is fixedly connected to the stator 21. The rotating shaft assembly seat is arranged at a position corresponding to the middle through hole of the stator 21. The stator 21 is sleeved on the rotating shaft assembly seat through the middle through hole. The upper part of the rotating shaft 26 is fixedly connected to the rotating shaft assembly seat. A sliding sleeve 27 is sleeved on the rotating shaft 26, and the sliding sleeve 27 is rotatably matched with the rotating shaft 26. The rotor magnetic steel 24 and the impeller 25 are sleeved on the sliding sleeve 27. The permanent magnet 23 is fixedly arranged on the rotor magnetic steel 24, and the impeller 25 is fixedly connected to the sliding sleeve 27. The position of the impeller 25 is opposite to the position of the liquid inlet 14 , and the position of the rotating shaft 26 is corresponding to the middle position of the liquid inlet 24 .

[0047] The valve assembly 3 can be a component in the housing of an existing liquid pump, for example, a single ball valve can be selected. Figure 4 As shown, the valve core 31 of the single ball valve is spherical, and is provided with flat portions at the top and bottom respectively. A sealing ring 32 is provided between the flat portion at the top of the valve core 31 and the middle assembly plate 13. A gap is left between the flat portion at the bottom of the valve core 31 and the spherical groove 116 at the bottom of the valve accommodating chamber 112. The liquid entering the valve accommodating chamber 112 through the liquid flow channel 114 enters the interior of the valve core 31 through the gap and the liquid inlet 34 at the bottom of the valve core 31.

[0048] A rotating shaft 33 is provided on the valve core 31 , and the rotating shaft 33 is fixedly connected to the valve core 31 . The lower end of the rotating shaft 33 is rotatably matched with the shaft mounting groove at the bottom of the valve accommodating chamber 112 , and the upper end of the rotating shaft 33 passes through the middle assembly plate 13 and extends into the upper shell 12 .

[0049] The valve core 31 is provided with a cavity for liquid to pass through, a liquid inlet 34 is provided at the bottom of the valve core 31, and a liquid outlet 35 is provided on the side wall of the valve core 31. The liquid inlet 34 and the liquid outlet 35 are respectively connected to the cavity inside the valve core 31. A sealing ring 36 is also provided in the valve accommodating chamber 111. The sealing ring 36 is arranged at the inner side of each liquid outlet 15. The sealing ring 36 is coaxially arranged with the liquid outlet 15, and the end face of the sealing ring 36 presses against the spherical surface of the outer wall of the valve core 31.

[0050] A driving mechanism 6 for driving the valve core 31 to rotate is provided on the intermediate assembly plate 13. The structure of the driving mechanism 6 can be designed as required. For example, Figure 5-6 The driving mechanism 6 shown in the figure includes a motor 61, a worm gear transmission mechanism 62, a first reduction gear group 63 and a second reduction gear group 64. The motor 61 is fixedly arranged on the intermediate assembly plate 13. The output shaft of the motor 61 is fixedly connected to the worm, and the worm wheel is meshed with the worm. A small gear of the first reduction gear group 63 is provided on the worm wheel shaft, and a large gear of the first reduction gear group 63 is meshed with the small gear. Moreover, a small gear of the second reduction gear group 64 is provided on the rotating shaft of the large gear of the first reduction gear group 63, and the large gear of the second reduction gear group 64 is fixedly connected to the rotating shaft 33 on the valve core 31 of the valve assembly 3. Through this arrangement, the motor 61 drives the worm of the worm gear transmission mechanism 62 to rotate, and then drives the worm gear to rotate, and then transmits the power through the first reduction gear group 63 and the second reduction gear group 64, so that the rotation speed of the rotating shaft 33 of the driving valve core 31 meets the application requirements. The rotation of the valve core 31 is driven by the worm gear transmission mechanism 62 and the two-stage gear reduction mechanism, which can reduce the axial height of the driving mechanism 6, make the valve assembly 3 flatter, and reduce the volume of the pump-valve integrated module for the thermal management system.

[0051] The pump-valve integrated module for the thermal management system of the present invention is directly assembled in the car when in use, the liquid inlet on the shell is connected to the working fluid of the thermal management system through a conduit, and the liquid outlet is respectively connected to each output path of the working fluid through the conduit. The power supply and external control signal are connected through the input interface on the shell.

[0052] The pump-valve integrated module for a thermal management system of the present invention integrates the pump assembly and the valve assembly into an integral module, which can save the liquid pipeline between the pump assembly and the valve assembly, ensure the smooth flow of the liquid delivery channel between the pump assembly and the valve assembly, and prevent liquid leakage. In the pump-valve integrated module of the present invention, the pump assembly and the valve assembly can share a controller, reducing the complexity and cost of the equipment. The pump-valve integrated module of the present invention can be installed as a whole during installation, which is easier to install.

[0053] The pump-valve integrated module of the present invention is designed with a dedicated pump assembly control circuit and a valve assembly control circuit, which can accurately control the pump assembly and the valve assembly. In addition, the heating elements in the control circuit, such as MOS tubes, can be arranged on the upper shell body to dissipate heat through the upper shell body, thereby extending their service life and ensuring the stability of the control circuit.

[0054] The pump-valve integrated module of the present invention does not simply splice the pump assembly and the valve assembly, but designs a pump accommodating chamber and a valve accommodating chamber in the shell, the pump accommodating chamber and the valve accommodating chamber are respectively used for assembling the pump assembly and the valve assembly, and an isolation plate is formed between the pump accommodating chamber and the valve accommodating chamber, and a liquid flow channel is provided between the pump accommodating chamber and the valve accommodating chamber. By setting a liquid vortex groove, the end of the liquid vortex groove corresponds to the liquid flow channel, so that the liquid can flow smoothly between the pump accommodating chamber and the valve accommodating chamber without corners and dead zones, thereby greatly reducing the liquid flow resistance.

[0055] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A pump-valve integrated module for a thermal management system, characterized in that: It includes a shell, a pump assembly, a valve assembly and a control circuit board. The control circuit board is electrically connected to the driving parts of the pump assembly and the valve assembly respectively. The shell includes a lower shell, an upper shell and an intermediate assembly plate. The intermediate assembly plate is arranged between the lower shell and the upper shell, and the lower shell, the upper shell and the intermediate assembly plate are fixedly connected. A liquid inlet is arranged on one side of the lower shell, and a plurality of liquid outlets are arranged on the other side of the lower shell. The pump assembly and the valve assembly are respectively arranged in the lower shell, the pump assembly is arranged on the side of the liquid inlet, and the valve assembly is arranged on the side of the liquid outlet. A driving assembly for driving the valve core of the valve assembly to rotate is provided on the intermediate assembly plate, and the control circuit board is arranged in the upper shell.

2. The pump-valve integrated module for a thermal management system according to claim 1, characterized in that: The inner cavity of the lower shell is provided with a pump accommodating chamber for accommodating a pump assembly and a valve accommodating chamber for accommodating a valve assembly, an isolation plate is formed between the pump accommodating chamber and the valve accommodating chamber, and a liquid flow channel is provided between the pump accommodating chamber and the valve accommodating chamber.

3. The pump-valve integrated module for a thermal management system according to claim 2, characterized in that: A liquid vortex groove is provided in the pump accommodating chamber. The liquid vortex groove is arranged on the bottom surface of the pump accommodating chamber, and the end of the liquid vortex groove corresponds to the liquid flow channel.

4. The pump-valve integrated module for a thermal management system according to claim 2, characterized in that: A spherical groove corresponding to the valve core is provided at the bottom of the valve accommodating chamber, the outlet of the liquid flow channel is on the side wall of the spherical groove, and a liquid outlet flow channel corresponding to each liquid outlet is provided on the upper part of the spherical groove.

5. The pump-valve integrated module for a thermal management system according to claim 1, characterized in that: The control circuit board includes an MCU, an input interface, a pump drive circuit and a valve control circuit. The input interface is used to input power and external control signals. The signal end and the power end of the input interface are respectively connected to the corresponding signal ports and power ports on the MCU, the pump drive circuit and the valve control circuit. The output end of the MCU is provided with a high-side drive signal output end and a low-side drive signal output end connected to the pump drive circuit. A first sampling resistor is also connected to the pump drive circuit, and the first sampling resistor is connected to the current sampling port on the MCU. The output end of the MCU is provided with a forward control signal output end and a reverse control signal output end connected to the valve control circuit. A second sampling resistor is connected to the valve control circuit, and the second sampling resistor is connected to the current sampling port on the MCU. An overcurrent detector is also provided on the valve control circuit, and the overcurrent detector is connected to the stall signal end on the MCU.

6. The pump-valve integrated module for a thermal management system according to claim 5, characterized in that: The pump driving circuit comprises a high-side driving circuit and a low-side driving circuit, wherein the high-side driving circuit and the low-side driving circuit respectively comprise three MOS tubes, wherein the drains of the three MOS tubes of the high-side driving circuit are respectively connected to the positive electrode of the power supply end, the gates are respectively connected to the high-side driving signal output end on the MCU, and the sources are respectively connected to the three electrodes of the pump, wherein the drains of the three MOS tubes of the low-side driving circuit are respectively connected to the three electrodes of the pump, the gates are respectively connected to the low-side driving signal output end on the MCU, and the three drains are respectively connected to the negative electrode of the power supply end, and a first capacitor is connected between the positive electrode and the negative electrode of the power supply end of the pump driving circuit.

7. The pump-valve integrated module for a thermal management system according to claim 5, characterized in that: The valve control circuit includes a forward drive circuit and a reverse drive circuit, and the forward drive circuit and the reverse drive circuit respectively include two MOS tubes. The drains of the two MOS tubes of the forward drive circuit are respectively connected to the positive electrode of the power supply end, the gates are respectively connected to the forward control signal output end on the MCU, and the sources are respectively connected to the power supply end of the valve control motor. The drains of the MOS tubes of the reverse drive circuit are respectively connected to the power supply end of the valve control motor, the gates are respectively connected to the reverse control signal output end on the MCU, and the sources are respectively connected to the negative electrode of the power supply end. A second capacitor is connected between the positive and negative electrodes of the power supply end of the valve control circuit.

8. The pump-valve integrated module for a thermal management system according to claim 1, characterized in that: The pump assembly is an axial flux motor driven pump assembly.

9. The pump-valve integrated module for a thermal management system according to claim 1, characterized in that: The valve assembly is a single ball valve, and a driving mechanism for driving the valve core to rotate is arranged on the middle assembly plate.

10. The pump-valve integrated module for a thermal management system according to claim 9, characterized in that: The driving mechanism includes a motor, a worm gear transmission mechanism, a first reduction gear group and a second reduction gear group. The motor is fixedly arranged on the middle assembly plate, the output shaft of the motor is fixedly connected to the worm, the worm wheel is meshed with the worm, a pinion of the first reduction gear group is arranged on the worm wheel shaft, a large gear of the first reduction gear group is meshed with the pinion, and a pinion of the second reduction gear group is arranged on the rotating shaft of the large gear of the first reduction gear group, and the large gear of the second reduction gear group is fixedly connected to the rotating shaft on the valve core of the valve assembly.

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