Device and method for in-situ repair of metal micro-nano damage defect by electromagnetic impact energy

Abstract

The invention relates to a device and a method for in-situ repair of metal micro-nano damage defects by electromagnetic impact energy, and belongs to the technical field of internal atom rearrangement of metal materials, the device comprises a power supply used for providing current or voltage required in an electromagnetic impact process; the voltage stabilizer is used for stabilizing the voltage in the electromagnetic impact process; the frequency converter is used for adjusting the change frequency of the electromagnetic impact energy; the current waveform controller is used for controlling the excitation waveform of the electromagnetic impact energy; the hydraulic electromagnetic valve is used for controlling the contact force between the copper electrode and the metal component; the sealing cover is used for providing a preset working environment; and the high-performance work station is used for carrying out electromagnetic impact energy excitation on the weak performance area of the metal component through the power supply, the voltage stabilizer, the frequency converter and the current waveform controller. According to the device provided by the invention, instantaneous electromagnetic impact energy with specific energy density is applied to a metal material, so that micro-nano damage defects in the material can be effectively repaired, and the service performance of a workpiece is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of atomic rearrangement inside metal materials, and in particular to a device and method for in-situ repairing metal micro-nano damage defects using electromagnetic impact energy. Background Art

[0002] High-end equipment in the aerospace and other fields needs to withstand extremely harsh service conditions, which places extremely high demands on the quality of key metal components. However, metal materials are affected by material / structural properties and process fluctuations during manufacturing and processing, resulting in uneven material deformation and phase change, and micro-nanoscale damage defects, which greatly reduce the performance of materials under extreme service conditions. At present, these micro-nano damage defects are difficult to monitor with conventional detection equipment due to their extremely small scale, and cannot be effectively eliminated using conventional thermal coupling methods, which makes them prone to cracks during service, leading to premature failure of metal components.

[0003] Although the existing thermal-mechanical coupling methods can eliminate micro-nano damage defects to a certain extent, they can easily introduce new thermal stresses and structural stresses at defects (such as grain boundaries, phase boundaries, dislocations and precipitates), resulting in limited improvement or even reduction in the mechanical properties of the material. Summary of the invention

[0004] In view of this, it is necessary to provide a device and method for in-situ repair of metal micro-nano damage defects using electromagnetic impact energy, so as to solve the problem of how to effectively repair micro-nano damage defects inside metal materials to improve the ultimate service performance of metal materials.

[0005] In order to solve the above problems, the present invention provides a device for in-situ repairing metal micro-nano damage defects using electromagnetic impact energy, comprising: Power supplies, voltage stabilizers, frequency converters, current waveform controllers, hydraulic solenoid valves, sealed enclosures and high-performance workstations; The power supply is used to provide the current or voltage required during the electromagnetic impact process; The voltage stabilizer is used to stabilize the voltage during the electromagnetic impact process; The frequency converter is used to adjust the frequency of change of electromagnetic impact energy; The current waveform controller is used to control the excitation waveform of the electromagnetic impact energy; The hydraulic solenoid valve is used to control the contact force between the copper electrode and the metal component; The sealing cover is used to provide a preset working environment; The high-performance workstation is used to perform electromagnetic impact energy excitation on the performance weak area of ​​the metal component through the power supply, the voltage stabilizer, the frequency converter and the current waveform controller.

[0006] In a possible implementation, the method further includes: An infrared thermometer, used to monitor the surface temperature change of the metal component; The infrared camera of the infrared thermometer is located directly above the sealing cover.

[0007] In a possible implementation, the excitation waveform of the electromagnetic impact energy is a sine wave or a square wave.

[0008] In a possible implementation, the method further includes: A water cooling device is used to reduce the temperature rise of the copper electrode.

[0009] In a possible implementation, the water cooling device is connected to the copper electrode via a water cooling pipe; The water cooling tube is embedded in the copper electrode; The cooling medium in the water cooling tube is pure water or distilled water; The flow rate of the cooling medium is 0.5L / min~3.0L / min.

[0010] In a possible implementation, the left end of the sealing cover is connected to the gas cylinder through a gas delivery pipe; The right end of the sealing cover is connected to the vacuum pump through an air pipe; The sealing cover is used to contain liquid nitrogen; The vacuum pump is used for vacuuming; The gas type in the gas cylinder includes at least one of the following: Ar, He, O 2 and CO 2 .

[0011] In a possible implementation, the performance weak areas of the metal component include: Dislocation entanglement, dislocation pile-up, microvoids, microcracks and disordered atoms in micro-areas.

[0012] In a possible implementation, the electromagnetic impact force of the electromagnetic impact energy acting on the atoms inside the metal component is expressed as follows:

[0013] in, Represents the electromagnetic impact force, represents the effective valence, represents the electron charge, j represents the current density, Represents resistivity.

[0014] In a possible implementation, the expression of the current density is as follows:

[0015] in, j represents the current density, A represents the peak current density, T represents the period, It means the built-in rectangular wave function in Matlab. Indicates the built-in sine trigonometric function of Matlab. Indicates phase.

[0016] The present invention also provides a method for in-situ repairing metal micro-nano damage defects using electromagnetic impact energy, which is applied to the device for in-situ repairing metal micro-nano damage defects using electromagnetic impact energy described in any of the above implementations, comprising: Place the polished metal component in the middle of the copper electrode; Fixing the metal component by applying a set pressure through a hydraulic solenoid valve; The sealing cover is fixed, and a preset working environment is provided through the sealing cover; A high-performance workstation is used to control a power supply, a voltage stabilizer, a frequency converter and a current waveform controller to perform electromagnetic impact energy excitation on the weak performance area of ​​the metal component.

[0017] The beneficial effects of the present invention are as follows: the device and method for in-situ repair of metal micro-nano damage defects by electromagnetic impact energy provided by the present invention include: a power supply, a voltage stabilizer, a frequency converter, a current waveform controller, a hydraulic solenoid valve, a sealing cover, a water cooling device and a high-performance workstation, the power supply provides the current / voltage required in the electromagnetic impact process, the voltage stabilizer is used to stabilize the voltage during the operation process, the frequency converter is mainly used to adjust the frequency of electromagnetic impact energy changes, the current waveform controller can realize output current waveform control, the hydraulic solenoid valve is mainly used to control the size of the contact force between the electrode and the workpiece, the sealing cover can realize a vacuum environment and a specific atmosphere working environment, the water cooling device is mainly used to cool the electrode, and the high-performance workstation collects monitoring data in real time for data analysis and reinforcement learning, providing a reference for process design. The present invention uses an electromagnetic impact device to apply specific energy density and instantaneous electromagnetic impact energy to metal materials, which can effectively repair micro-nano damage defects inside the material, and can promote the rearrangement and ordering of microscopic disordered atoms, reduce system energy, ensure the reliability and stability of component operation, and improve the service performance of the workpiece. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0019] Figure 1A schematic diagram of the structure of a device for in-situ repairing metal micro-nano damage defects using electromagnetic impact energy provided by the present invention; Figure 2 One of the method flow charts of an embodiment of the method for in-situ repairing metal micro-nano damage defects using electromagnetic impact energy provided by the present invention; Figure 3 A second method flow chart of an embodiment of the method for in-situ repairing metal micro-nano damage defects using electromagnetic impact energy provided by the present invention; Figure 4 A statistical diagram of the internal crystal structure content of the iron alloy with a pre-strain of 15.5% provided by the present invention; Figure 5 The present invention provides a statistical diagram of the internal crystal structure content of an iron alloy with a pre-strain of 15.5% after being excited by electromagnetic impact energy.

[0020] Reference numerals: 1: power supply; 2: voltage stabilizer; 3: frequency converter; 4: current waveform controller; 5: hydraulic solenoid valve; 6: sealing cover; 7: high-performance workstation; 8: copper electrode; 9: metal component; 10: infrared thermometer; 11: water cooling device; 12: water cooling pipe; 13: fixing device; 14: gas pipeline; 15: gas cylinder; 16: vacuum pump; 17: display interactive interface; 18: power cord; 19: data transmission line. DETAILED DESCRIPTION

[0021] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present invention.

[0022] In the description of the embodiments of the present invention, unless otherwise specified, "multiple" means two or more than two. "And / or" describes the association relationship of associated objects, indicating that three relationships may exist. For example, "A and / or B" may mean: A exists alone, A and B exist at the same time, and B exists alone.

[0023] The descriptions of "first", "second", etc. involved in the embodiments of the present invention are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the technical features defined as "first" or "second" may explicitly or implicitly include at least one of the features.

[0024] Figure 1 The schematic diagram of the structure of the device for in-situ repair of metal micro-nano damage defects using electromagnetic impact energy provided by the present invention is as follows: Figure 1 As shown, the device for in-situ repairing metal micro-nano damage defects using electromagnetic impact energy includes: Power supply 1, voltage stabilizer 2, frequency converter 3, current waveform controller 4, hydraulic solenoid valve 5, sealing cover 6 and high-performance workstation 7; The power supply 1 is used to provide the current or voltage required during the electromagnetic impact process; The voltage stabilizer 2 is used to stabilize the voltage during the electromagnetic impact process; The frequency converter 3 is used to adjust the frequency of change of electromagnetic impact energy; The current waveform controller 4 is used to control the excitation waveform of the electromagnetic impact energy; The hydraulic solenoid valve 5 is used to control the contact force between the copper electrode 8 and the metal component 9; The sealing cover 6 is used to provide a preset working environment; The high-performance workstation 7 is used to perform electromagnetic impact energy excitation on the performance weak area of ​​the metal component 9 through the power supply 1, the voltage stabilizer 2, the frequency converter 3 and the current waveform controller 4.

[0025] The power supply is used to provide the current or voltage required during the electromagnetic impact process. It can output unidirectional DC power or variable AC power. The output current value range is 0~1200A.

[0026] The voltage stabilizer is used to stabilize the voltage during the electromagnetic shock process. It can be used to keep the voltage during the electromagnetic shock process at a set value of ±0.3%~1.5%. The voltage value range during the electromagnetic shock process is 0~380V.

[0027] The frequency converter is used to adjust the frequency of the electromagnetic impact energy within the range of 1Hz~1kHz, and can be used to control the continuous or intermittent output of the electromagnetic impact energy.

[0028] The current waveform controller is used to control the excitation waveform of the electromagnetic impact energy. The electromagnetic impact energy excitation waveform can be a sine wave or a square wave.

[0029] The output current waveform of the current waveform controller can be programmed through a display interactive interface and a high-performance computing workstation or set by reading an expert system database to achieve customized electromagnetic impact energy excitation parameters for specific materials and specific properties.

[0030] The hydraulic solenoid valve is connected to the copper electrode and is used to control the contact force between the copper electrode and the metal component. The loading and unloading of the copper electrode is achieved by regulating the current switch, and the quantitative application of the loading force to the metal component is achieved by controlling the power-on time. The solenoid valve has an integrated pressure sensor that can measure the load condition of the solenoid valve in real time.

[0031] The sealed cover is used to provide a preset working environment, such as a vacuum environment or a specific atmosphere working environment.

[0032] The water cooling device can be connected to the copper electrode through a water cooling pipe, which can reduce the temperature rise of the copper electrode during the electromagnetic energy excitation process.

[0033] The high-performance computing workstation is connected to the display interactive interface through a data transmission line. It can be used to summarize the various electromagnetic signals measured during the electromagnetic impact energy excitation process, and to regulate the control units of each part through calculation and analysis to ensure the normal operation of the electromagnetic impact energy excitation.

[0034] The high-performance workstation can receive the electromagnetic signals transmitted by each sensor module, and automatically call its internal reinforcement learning parameter prediction value for comparison, so as to realize positive feedback or negative feedback control of the corresponding system module, and can automatically store the experimental parameters into the neural network big data learning model embedded in the system for model training, and feed back to the expert system.

[0035] Compared with the prior art, the device for in-situ repairing metal micro-nano damage defects by electromagnetic impact energy provided by the embodiment of the present invention includes: a power supply, a voltage stabilizer, a frequency converter, a current waveform controller, a hydraulic solenoid valve, a sealing cover, a water cooling device and a high-performance workstation, the power supply provides the current / voltage required in the electromagnetic impact process, the voltage stabilizer is used to stabilize the voltage during the operation process, the frequency converter is mainly used to adjust the frequency of electromagnetic impact energy change, the current waveform controller can realize output current waveform control, the hydraulic solenoid valve is mainly used to control the size of the contact force between the electrode and the workpiece, the sealing cover can realize a vacuum environment and a specific atmosphere working environment, the water cooling device is mainly used to cool the electrode, and the high-performance workstation collects monitoring data in real time for data analysis and reinforcement learning, so as to provide a reference for process design. The present invention uses an electromagnetic impact device to apply specific energy density and instantaneous electromagnetic impact energy to metal materials, which can effectively repair micro-nano damage defects inside the material, and can promote the rearrangement and ordering of microscopic disordered atoms, reduce system energy, ensure the reliability and stability of component operation, and improve the service performance of the workpiece.

[0036] In some embodiments of the present invention, it further comprises: An infrared thermometer 10, used to monitor the surface temperature change of the metal component 9; The infrared camera of the infrared thermometer 10 is located directly above the sealing cover 6 .

[0037] Infrared thermometers can be used to measure the surface temperature changes of samples (i.e. metal components) during electromagnetic impact energy excitation.

[0038] like Figure 1As shown, the device for in-situ repairing metal micro-nano damage defects using electromagnetic impact energy also includes a display interaction interface 17 and a data transmission line 19.

[0039] The infrared thermometer is connected to the high-performance computing workstation via a data transmission line and can be controlled through a display interactive interface.

[0040] The infrared thermometer has a temperature measurement range of -80℃~1200℃, a shooting frequency of up to 20,000 frames / s, and can automatically correct the emissivity.

[0041] When the infrared thermometer monitors the surface temperature of a component or workpiece, the infrared camera is located directly above the sealing cover. It can automatically retrieve expert database data for data correction based on the room temperature environment and the experimental environment inside the sealing cover to reduce experimental errors.

[0042] In some embodiments of the present invention, the excitation waveform of the electromagnetic impact energy is a sine wave or a square wave.

[0043] In some embodiments of the present invention, it further comprises: The water cooling device 11 is used to reduce the temperature rise of the copper electrode 8 .

[0044] In some embodiments of the present invention, the water cooling device 11 is connected to the copper electrode 8 via a water cooling pipe 12; The water cooling tube 12 is embedded in the copper electrode 8; The cooling medium in the water cooling tube 12 is pure water or distilled water; The flow rate of the cooling medium is 0.5L / min~3.0L / min.

[0045] The water cooling device is connected to the copper electrode through a water cooling pipe, which can reduce the temperature rise of the copper electrode during the electromagnetic energy excitation process, and is connected to the high-performance computing workstation and display interactive interface through a data transmission line.

[0046] The flow rate of the water cooling device is 0.5L / min~3.0L / min, the cooling medium is pure water or distilled water, and the water cooling tube is embedded in the copper electrode.

[0047] In some embodiments of the present invention, the left end of the sealing cover 6 is connected to the gas cylinder 15 through the gas delivery pipe 14; The right end of the sealing cover 6 is connected to the vacuum pump 16 through the air pipe 14; The sealing cover 6 is used to contain liquid nitrogen; The vacuum pump 16 is used for vacuuming; The gas type in the gas cylinder 15 includes at least one of the following: Ar, He, O 2 and CO 2 .

[0048] The left end of the sealing cover is connected to the gas cylinder through the gas pipe, and the right end is connected to the vacuum pump through the gas pipe. The vacuum pump is connected to the high-performance computing workstation and the display interaction interface through a data transmission line.

[0049] like Figure 1 As shown, the device for in-situ repairing metal micro-nano damage defects using electromagnetic impact energy also includes a fixing device 13.

[0050] The sealing cover is fixed by a fixing device. The sealing cover is equipped with an air valve which can control the entry or discharge of gas by switching the air valve. The upper part of the sealing cover can be opened to facilitate the installation and fixation of the workpiece. The upper and lower edges of the sealing cover are sealed with rubber to produce good air tightness.

[0051] The material of the fixing device is aluminum alloy.

[0052] The sealing cover is made of transparent material and can withstand -196℃~500℃. Liquid nitrogen can be placed in the sealing cover, and electromagnetic shock energy excitation and deep freezing can be performed simultaneously, that is, the temperature field and electromagnetic excitation can be applied simultaneously.

[0053] The gas types in the gas cylinder are Ar, He, O 2 and CO 2 One or a mixture of two or more gases in any proportion.

[0054] The vacuum pump can be used for vacuuming, and the vacuum range is 10 -6 ~10 -3 Pa.

[0055] For example, Figure 1 As shown, the device for in-situ repairing metal micro-nano damage defects using electromagnetic impact energy also includes a power line 18, and the power supply, voltage stabilizer, frequency converter, and current waveform controller are connected to the copper electrode and the component or workpiece through the power line.

[0056] In some embodiments of the present invention, the performance weak areas of the metal component 9 include: Dislocation entanglement, dislocation pile-up, microvoids, microcracks and disordered atoms in micro-areas.

[0057] The device for in-situ repairing metal micro-nano damage defects by electromagnetic impact energy provided in an embodiment of the present invention is mainly used for post-processing of metal material components, that is, electromagnetic impact energy excitation is performed on weak areas of component performance to repair micro-nano defects inside the material in situ, reduce system energy, and improve the service performance of the workpiece.

[0058] Weak performance areas include: dislocation entanglement, dislocation accumulation, micro-voids, micro-cracks and disordered atoms in micro-areas. When post-processing metal components, the surface temperature rise of the material is ≤350℃.

[0059] In some embodiments of the present invention, the electromagnetic impact force of the electromagnetic impact energy acting on the atoms inside the metal component 9 is expressed as follows:

[0060] in, Represents the electromagnetic impact force, represents the effective valence, represents the electron charge, j represents the current density, Represents resistivity.

[0061] In some embodiments of the present invention, the expression of the current density is as follows:

[0062] in, j represents the current density, A represents the peak current density, T represents the period, It means the built-in rectangular wave function in Matlab. Indicates the built-in sine trigonometric function of Matlab. Indicates phase.

[0063] Electromagnetic impact energy acts on the electromagnetic impact force of atoms inside metal materials The expression is as follows:

[0064] in, Indicates the effective valence, which is closely related to metal materials and is generally 1 to 12. is the electron charge, equal to 1.602x10 19 coulomb, is the current density, is the resistivity, the electromagnetic impact energy excitation time is 50ps~5s, and the number of electromagnetic energy excitations is 2~8 times.

[0065] The expression for current density is as follows:

[0066] in, j Indicates current density, A indicates current density peak value, and the range is 50A / mm 2 ~10 5 A / mm 2 , , T represents the period, , is the frequency, ranging from 0.2Hz to 300Hz, It means the built-in rectangular wave function in Matlab. Indicates the built-in sine trigonometric function of Matlab. Indicates phase.

[0067] During the entire cycle, it can be a rectangular waveform current density, a sinusoidal waveform current density, or a combination of both.

[0068] The approximate relationship between the resistivity and temperature of metal materials is: ρ=ρ 0 ( 1+αt ), ρ 0 is the resistivity at 0°C, α is the temperature coefficient of resistance, t It measures temperature in real time.

[0069] The metal material is an iron single crystal or an iron alloy, wherein the number of iron atoms in the iron alloy accounts for ≥20%, and the iron lattice structure can be one of BCC, FCC or HCP, and a mixture of 2 or more of them in any proportion.

[0070] When electromagnetic impact energy acts on the metal matrix, the interaction force between atoms is:

[0071]

[0072] in, is the total energy of the system, is the embedding energy as a function of the electron density, is the electron density function, There are two atoms i and j Distance The potential function of Represents two atoms i and j Distance The electron density distribution as a function of .

[0073] The interaction force between dissimilar atoms in iron alloys can be calculated by the Lennard-Jones potential function, which is expressed by the Lennard-Jones 10-4-3 potential function:

[0074] represents the potential well depth, represents the equilibrium distance of the atomic pair, Represents the distance between atoms.

[0075] Figure 2A method flow chart of an embodiment of the method for in-situ repairing metal micro-nano damage defects with electromagnetic impact energy provided by the present invention, as shown in FIG. Figure 2 As shown, the method of in-situ repairing metal micro-nano damage defects with electromagnetic impact energy includes: S201, placing the polished metal component 9 in the middle of the copper electrode 8; S202, applying a set pressure through the hydraulic solenoid valve 5 to fix the metal component 9; S203, fixing the sealing cover 6, and providing a preset working environment through the sealing cover 6; S204, using the high-performance workstation 7 to control the power supply 1, the voltage stabilizer 2, the frequency converter 3 and the current waveform controller 4, to perform electromagnetic impact energy excitation on the performance weak area of ​​the metal component 9.

[0076] The execution body of the method for in-situ repairing metal micro-nano damage defects by using electromagnetic impact energy provided by the present invention may be the device for in-situ repairing metal micro-nano damage defects by using electromagnetic impact energy described in any of the above implementations.

[0077] Compared with the prior art, the electromagnetic impact energy in-situ repair method of metal micro-nano damage defects provided by the embodiment of the present invention places the polished metal component in the middle of the copper electrode, applies a set pressure through the hydraulic solenoid valve to fix the metal component, and fixes the sealing cover, provides a preset working environment through the sealing cover, uses a high-performance computing workstation to control the power supply, voltage stabilizer, frequency converter and current waveform controller, and performs electromagnetic impact energy excitation on the performance weak area of ​​the metal component, which can promote the transformation of disordered atoms to the original matrix structure of the matrix, which is beneficial to improve the problem of excessive interface energy caused by disordered atoms or crystal structure differences in the microscopic region, is beneficial to reduce the system energy, and is beneficial to promote the transformation of the atomic interface in the microscopic region from the non-coherent / semi-coherent relationship to the coherent relationship, and alleviates the lattice distortion caused by strain energy and chemical energy in the microscopic region. By quickly applying a specific form of electromagnetic energy to the inside of the workpiece, compared with the traditional thermal coupling treatment, the present invention can complete the treatment of the component at the millisecond level, target the repair of micro-nano damage defects inside the material, and has the characteristics of low operation difficulty and high efficiency.

[0078] Exemplarily, an embodiment of the present invention provides a device for in-situ repair of metal micro-nano damage defects using electromagnetic impact energy, comprising: a power supply 1, a voltage stabilizer 2, a frequency converter 3, a current waveform controller 4, a hydraulic solenoid valve 5, a sealing cover 6, a high-performance workstation 7, a copper electrode 8, a metal component 9, an infrared thermometer 10, a water cooling device 11, a water cooling pipe 12, a fixing device 13, a gas pipe 14, a gas cylinder 15, a vacuum pump 16, a display interactive interface 17, a power cord 18, and a transmission line 19.

[0079] The present invention also provides a method for electromagnetic impact energy excitation of a metal material component using the above device, such as Figure 3 As shown, Figure 3 A second method flow chart of an embodiment of a method for in-situ repairing metal micro-nano damage defects using electromagnetic impact energy provided by the present invention comprises: S301, mechanically grinding and polishing the surface of the metal component; S302, placing the metal component between the two copper electrodes, and then applying a set pressure through the hydraulic solenoid valve to make the upper copper electrode close to the workpiece to fix the metal component, and fix the sealing cover; S303, turn on the infrared thermometer, adjust the experimental parameters, and wait; S304, evacuate or fill with liquid nitrogen or introduce gas of specific composition; S305, turning on the water cooling device to cool the copper electrode; S306. Using a high-performance computing workstation to program and display an interactive interface, power supplies, voltage stabilizers, frequency converters, current waveform controllers, and infrared thermometers are turned on to perform specific forms of electromagnetic impact energy excitation on weak areas of fixed metal components. S307, turn off the power supply, voltage stabilizer, frequency converter, infrared thermometer, water cooling device, current waveform controller, and save the data; S308, remove vacuum or discharge liquid nitrogen or discharge specific component gas; S309, start the hydraulic solenoid valve, move the copper electrode, and remove the metal component.

[0080] The present invention uses a high-performance computer to perform molecular dynamics simulation on the designed electromagnetic impact process parameters, and uses theory to guide the process, and the two complement each other. At the same time, the present invention also realizes real-time monitoring of the internal physicochemical parameters of the material during the electromagnetic impact process through each structural unit, and can realize the integrated design of structure-process-performance by combining with a high-performance computer reinforcement learning model.

[0081] The device and method provided by the present invention utilize the electromagnetic impact force generated by electromagnetic impact energy excitation to excite the atoms inside the material, which can promote the transformation of disordered atoms to the original matrix structure of the matrix, which is beneficial to improving the problem of excessive interface energy caused by disordered atoms or crystal structure differences in the microscopic region, is beneficial to reducing the system energy, and is beneficial to promoting the transformation of the atomic interface in the microscopic region from an incoherent / semi-coherent relationship to a coherent relationship, thereby alleviating the lattice distortion caused by strain energy and chemical energy in the microscopic region.

[0082] The device and method provided by the present invention can quickly apply a specific form of electromagnetic energy to the interior of a workpiece. Compared with traditional thermal-mechanical coupling processing, the present invention can complete the processing of components in milliseconds, target the repair of micro-nano damage defects inside the material, and has the characteristics of low operating difficulty and high efficiency.

[0083] That is, the present invention provides a device and method for in-situ repair of metal micro-nano damage defects using electromagnetic impact energy, which can effectively repair micro-nano damage defects inside the material, promote the rearrangement and ordering of microscopic disordered atoms, reduce system energy, and ensure the reliability and stability of component operation.

[0084] The following is a detailed description of the device and method for in-situ repair of metal micro-nano damage defects by electromagnetic impact energy provided by the present invention in combination with specific application scenarios. Taking FeNiCrCoCu alloy as an example, the atomic content percentage of the five elements is 1:1:1:1:1, and the basic crystal structure of the matrix is ​​FCC. Before electromagnetic impact energy excitation, a sample with a size of 18nm×200nm×18nm is pre-stretched and deformed at a strain rate of 1×109s -1 , the deformation is 15.5%.

[0085] Figure 4 The statistical diagram of the internal crystal structure content of the ferroalloy with a pre-strain of 15.5% provided by the present invention, Figure 4 It shows the crystal structure and content of the material before electromagnetic shock excitation. Figure 4 It can be seen that plastic deformation significantly increases the content of disordered atoms in the material to 40.393%, and the FCC content of the original crystal structure of the matrix significantly decreases to 18.702%, and HCP (19.536%) and BCC (21.369%) structures appear. Among them, although the HCP and BCC crystal structures are also ordered structures, they are still different from the matrix FCC crystal structure. The interface strain energy at the junction of the two crystal structures will still increase due to the mismatch, which is not conducive to reducing the energy of the system.

[0086] Figure 5 The statistical diagram of the internal crystal structure content of the iron alloy with a pre-strain of 15.5% after electromagnetic impact energy excitation provided by the present invention, Figure 5 The statistical results of the atomic type and crystal structure content of the pre-deformed 15.5% FeNiCrCoCu alloy after electromagnetic shock energy excitation are shown. Figure 5 It can be seen that after electromagnetic shock energy excitation, the FCC crystal structure content of the material matrix increased significantly from 18.702% to 33.19%, an increase of 77.5%. The disordered atomic type crystal structure decreased from 40.393% to 34.429%, a decrease of about 14.8%. Among them, the HCP atomic structure type content increased slightly from 19.536% to 21.762%, an increase of about 11.4%, while the BCC crystal structure type decreased significantly from 21.369% to 10.619%, a decrease of about 50.3%.

[0087] from Figure 4 to Figure 5The statistical results show that after the electromagnetic shock energy excitation of the iron alloy with a pre-deformation of 15.5%, the electromagnetic shock force promotes the transformation of disordered atoms (Other) and BCC crystal structure into FCC and HCP crystal structure. This shows that under the action of electromagnetic shock, the electromagnetic shock energy promotes the atomic rearrangement and ordering of atoms in the micro-area, which is beneficial to promote the transformation of the non-matrix atomic crystal configuration to the original matrix configuration, and is beneficial to reduce the problem of excessive internal interface of the material caused by the difference in crystal structure, which can improve the stability and reliability of the material during service. The above experimental results show that electromagnetic shock energy excitation has great development potential as a post-processing transformative technology, which can repair micro-nano damage defects inside metal materials through electromagnetic shock energy excitation.

[0088] Those skilled in the art will appreciate that all or part of the processes of the above-mentioned embodiments can be implemented by instructing related hardware (such as a processor, a controller, etc.) through a computer program, and the computer program can be stored in a computer-readable storage medium, wherein the computer-readable storage medium is a disk, an optical disk, a read-only storage memory, or a random access memory, etc.

[0089] The above is a detailed introduction to the device and method for in-situ repair of metal micro-nano damage defects by electromagnetic impact energy provided by the present invention. Specific examples are used in this article to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the method of the present invention and its core idea; at the same time, for technical personnel in this field, according to the idea of ​​the present invention, there will be changes in the specific implementation method and application scope. In summary, the content of this specification should not be understood as a limitation on the present invention.

Claims

1. A device for in-situ repair of metal micro-nano damage defects using electromagnetic impact energy, characterized in that: include: Power supplies, voltage stabilizers, frequency converters, current waveform controllers, hydraulic solenoid valves, sealed enclosures and high-performance workstations; The power supply is used to provide the current or voltage required during the electromagnetic impact process; The voltage stabilizer is used to stabilize the voltage during the electromagnetic impact process; The frequency converter is used to adjust the frequency of change of electromagnetic impact energy; The current waveform controller is used to control the excitation waveform of the electromagnetic impact energy; The hydraulic solenoid valve is used to control the contact force between the copper electrode and the metal component; The sealing cover is used to provide a preset working environment; The high-performance workstation is used to perform electromagnetic impact energy excitation on the performance weak area of ​​the metal component through the power supply, the voltage stabilizer, the frequency converter and the current waveform controller.

2. The device for in-situ repairing metal micro-nano damage defects by electromagnetic impact energy according to claim 1, characterized in that: Also includes: An infrared thermometer, used to monitor the surface temperature change of the metal component; The infrared camera of the infrared thermometer is located directly above the sealing cover.

3. The device for in-situ repairing metal micro-nano damage defects by electromagnetic impact energy according to claim 1, characterized in that: The excitation waveform of the electromagnetic impact energy is a sine wave or a square wave.

4. The device for in-situ repairing metal micro-nano damage defects by electromagnetic impact energy according to claim 1, characterized in that: Also includes: A water cooling device is used to reduce the temperature rise of the copper electrode.

5. The device for in-situ repairing metal micro-nano damage defects by electromagnetic impact energy according to claim 4, characterized in that: The water cooling device is connected to the copper electrode through a water cooling pipe; The water cooling tube is embedded in the copper electrode; The cooling medium in the water cooling tube is pure water or distilled water; The flow rate of the cooling medium is 0.5L / min~3.0L / min.

6. The device for in-situ repairing metal micro-nano damage defects by electromagnetic impact energy according to claim 1, characterized in that: The left end of the sealing cover is connected to the gas cylinder through a gas delivery pipe; The right end of the sealing cover is connected to the vacuum pump through an air pipe; The sealing cover is used to contain liquid nitrogen; The vacuum pump is used for vacuuming; The gas type in the gas cylinder includes at least one of the following: Ar, He, O2 and CO2.

7. The device for in-situ repairing metal micro-nano damage defects by electromagnetic impact energy according to claim 1, characterized in that: The performance weak areas of the metal component include: Dislocation entanglement, dislocation pile-up, microvoids, microcracks and disordered atoms in micro-areas.

8. The device for in-situ repairing metal micro-nano damage defects by electromagnetic impact energy according to claim 1, characterized in that: The electromagnetic impact force of the electromagnetic impact energy acting on the atoms inside the metal component is expressed as follows: in, Represents the electromagnetic impact force, represents the effective valence, represents the electron charge, j represents the current density, Represents resistivity.

9. The device for in-situ repairing metal micro-nano damage defects by electromagnetic impact energy according to claim 8, characterized in that: The expression of the current density is as follows: in, j represents the current density, A represents the peak current density, T represents the period, It means the built-in rectangular wave function in Matlab. Indicates the built-in sine trigonometric function of Matlab. Indicates phase.

10. A method for in-situ repair of metal micro-nano damage defects using electromagnetic impact energy, characterized in that: The device for in-situ repairing metal micro-nano damage defects using electromagnetic impact energy as claimed in any one of claims 1 to 9 comprises: Place the polished metal component in the middle of the copper electrode; Fixing the metal component by applying a set pressure through a hydraulic solenoid valve; The sealing cover is fixed, and a preset working environment is provided through the sealing cover; A high-performance workstation is used to control a power supply, a voltage stabilizer, a frequency converter and a current waveform controller to perform electromagnetic impact energy excitation on the weak performance area of ​​the metal component.

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