Chip testing device and system

Abstract

The invention relates to the technical field of chip testing, and discloses a chip testing device and system.The pickup unit of the chip testing device comprises a plate body which is connected to a driving unit and corresponds to each testing seat, an adsorption part connected to one side of the plate body and a first laser transmitter connected with the plate body; the test seat is provided with a photoresistor which is located outside the chip placing area and corresponds to the first laser emitter, and a photomask which covers the photoresistor. After the controller controls the driving unit to move the pickup unit to the position above the test seat, if the photosensitive resistor is acted by the first laser transmitter and feeds back a trigger signal to the test seat within preset time, the test seat transmits a photosensitive result to the controller, the controller controls the driving unit to enable the pickup unit to descend towards the test seat, and the pickup unit moves to the position above the test seat. And the adsorption piece correspondingly places the chip to be tested in the chip placement area of the test seat. The reliability of chip testing is improved.

Description

Technical Field

[0001] The present application relates to the field of chip testing technology, and in particular to a chip testing device and system. Background Art

[0002] In the application scenarios of automated chip testing equipment, efficient and accurate detection and testing of chips is one of the key links to ensure product quality and production efficiency. Several picking devices of automated chip testing equipment pick up several chips from the material tray and move them to the top of the corresponding test sockets respectively, and place several chips on the corresponding test sockets respectively. At present, the driving mode of the picking device adopts motor drive. Although the motor drive has the characteristics of fast response speed and high-precision control, with long-term chip testing, the motor drive will have errors during displacement, resulting in the picking device being unable to accurately place the chip into the chip placement area of ​​the test socket. When the chip in the chip placement area is pressed and tested, the chip that is not fully placed in the chip placement area will be crushed. This situation needs to be corrected. Summary of the invention

[0003] In view of this, the present application provides a chip testing device and system to solve the above-mentioned technical problems.

[0004] To achieve the above objectives, according to the first aspect, the technical solution adopted is:

[0005] A chip testing device, comprising:

[0006] A controller, a driving unit, a pickup unit and a plurality of test sockets, wherein the controller is electrically connected to the driving unit, the pickup unit and the plurality of test sockets respectively;

[0007] The driving unit carries the pickup unit to transport the chip to be tested to the chip placement area of ​​the test seat, the pickup unit includes a plate body corresponding to each of the test seats, an adsorbent connected to one side of the plate body, and a first laser emitter connected to the plate body, wherein the test seat is provided with a photoresistor corresponding to the first laser emitter, and a light mask covering the photoresistor;

[0008] When the controller controls the driving unit to move the pickup unit above the test socket, if within a preset time, the photoresistor is acted upon by the first laser emitter and feeds back a trigger signal to the test socket, and the test socket transmits the photosensitivity result to the controller, the controller controls the driving unit to lower the pickup unit toward the test socket, and the adsorbent places the chip to be tested in the chip placement area of ​​the test socket.

[0009] The present application is further configured as follows: the first laser emitter acts on the photoresistor, and after the photoresistor reaches a preset resistance threshold, the photoresistor feeds back the trigger signal to the test socket, wherein the trigger signal includes a preset terminal voltage of the photoresistor.

[0010] The present application is further configured as follows: the photoresistor is connected in series with a variable resistor, the resistance of the variable resistor is adjustable, and is used to adjust the real-time terminal voltage of the photoresistor.

[0011] The present application is further configured as follows: the photomask is provided with a through slot structure located above the photoresistor, the vertical projection of the through slot structure relative to the photoresistor is within the coverage area of ​​the photoresistor, and the opening size of the through slot structure is less than 1.5 mm, and the alignment deviation range between the pickup unit and the test socket is less than 1.5 mm.

[0012] The present application is further configured as follows: the adsorption component includes a pneumatic part and a picking part connected to the plate body, one end of the picking part is connected and communicated with the pneumatic part, and the other end of the picking part is vertically facing the chip placement area for adsorbing and releasing the chip to be tested.

[0013] The present application is further configured to include an ambient light sensor electrically connected to the test socket, wherein the ambient light sensor monitors the real-time terminal voltage of the photoresistor and adjusts the resistance value of the variable resistor according to the real-time terminal voltage.

[0014] The present application is further configured as follows: at least one chip calibration area with a limited area is provided on the test seat, the chip calibration area is arranged on the side of the chip placement area, and the photoresistor is matched in the chip calibration area.

[0015] The present application is further configured as follows: further comprising a carrier plate, wherein at least one first distance measuring sensor is disposed on a first surface of the driving unit, and the first distance measuring sensor faces the carrier plate; and

[0016] A plurality of the test seats are arranged on the carrier, and at least one second distance measuring sensor is arranged on the carrier, and the second distance measuring sensor faces the driving unit;

[0017] When the controller controls the driving unit to lower the picking unit toward the test seat and after it has descended a preset stroke, if the distance value sensed by the first ranging sensor or the distance value sensed by the second ranging sensor is less than a preset error threshold, the adsorbent places the chip to be tested in the chip placement area of ​​the test seat.

[0018] The present application is further configured as follows: the driving unit is electrically connected to an automatic calibration unit;

[0019] If the difference between the distance value sensed by the first ranging sensor or the distance value sensed by the second ranging sensor and the preset stroke is greater than the preset error threshold, the automatic calibration unit adjusts the preset stroke of the driving unit until the difference between the distance value sensed by the first ranging sensor or the distance value sensed by the second ranging sensor and the preset stroke is less than the preset error threshold.

[0020] According to the second aspect, the technical solution adopted is:

[0021] A chip testing system comprises the chip testing device described in any one of the above embodiments.

[0022] In summary, compared with the prior art, the present application discloses a chip testing device and system, wherein the controller of the chip testing device is electrically connected to a driving unit, a pickup unit and a plurality of test sockets respectively, the plate body of the pickup unit is connected to an adsorbent and a first laser emitter, a photoresistor corresponding to the first laser emitter and a light mask covered above the photoresistor are provided on the test socket, when the controller controls the driving unit to move the pickup unit above the test socket, if within a preset time, the photoresistor is acted upon by the first laser emitter and feeds back a trigger signal to the test socket, and the test socket transmits the photosensitivity result to the controller, then the controller controls the driving unit to lower the pickup unit toward the test socket, and the adsorbent places the chip to be tested in the chip placement area of ​​the test socket accordingly, thereby, the first laser emitter and the photoresistor are aligned and calibrated to ensure that the chip to be tested is accurately and efficiently transported to the test socket, thereby improving the chip testing quality, efficiency and reliability. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0024] Figure 1 It is a structural schematic diagram of the first chip testing device of the present application;

[0025] Figure 2 is a structural schematic diagram of a second chip testing device of the present application;

[0026] Figure 3 is a structural schematic diagram of a third chip testing device of the present application;

[0027] Figure 4 It is a schematic diagram of the top view structure of the test socket of the present application;

[0028] Figure 5 It is a structural block diagram of the chip testing system of the present application. DETAILED DESCRIPTION

[0029] Here, exemplary embodiments will be described in detail, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The implementations described in the following exemplary embodiments do not represent all implementations consistent with the present application. Instead, they are only examples of devices and methods consistent with some aspects of the present application as detailed in the attached claims.

[0030] It should be noted that, in this article, the terms "include", "comprises" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "includes a ..." does not exclude the existence of other identical elements in the process, method, article or device including the element. In addition, components, features, and elements with the same name in different embodiments of the present application may have the same meaning or different meanings, and their specific meanings need to be determined by their explanation in the specific embodiment or further combined with the context of the specific embodiment.

[0031] It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0032] In the subsequent description, the suffixes such as "module", "component" or "unit" used to represent elements are only used to facilitate the description of the present application, and have no specific meanings. Therefore, "module", "component" or "unit" can be used in a mixed manner.

[0033] In the description of the present application, it should be noted that the terms "upper", "lower", "left", "right", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0034] The technical solutions shown in this application will be described in detail below through specific embodiments. It should be noted that the description order of the following embodiments is not intended to limit the priority order of the embodiments.

[0035] Please refer to Figures 1 to 4 The chip testing device of the embodiment of the present application includes a controller 50, a driving unit 10, a pickup unit 20 and a plurality of test sockets 30, wherein the controller 50 is electrically connected to the driving unit 10, the pickup unit 20 and the plurality of test sockets 30 respectively.

[0036] During the specific implementation process, the driving unit 10 carries the picking unit 20 to transport the chip to be tested to the chip placement area 32 of the test socket 30, wherein the picking unit 20 includes a plate body 21 corresponding to each test socket 30, an adsorption member 22 connected to one side of the plate body 21, and a first laser emitter 23 connected to the plate body 21, and the test socket 30 is provided with a photoresistor 31 corresponding to the first laser emitter 23, and a light mask 33 covering the photoresistor 31.

[0037] During the operation of the chip testing device, the drive unit 10 can be driven by a motor and controlled by the controller 50 to perform periodic displacement along a set trajectory. For example, the pick-up unit 20 is carried in the initial position and moved to a material tray containing several chips to be tested. After the adsorption part 22 of the pick-up unit 20 obtains the chip to be tested, the controller 50 controls the drive unit 10 to carry the pick-up unit 20 and the chip to be tested obtained by the pick-up unit 20 to move toward the test seat 30, so that the pick-up unit 20 can transport the chip to be tested to the chip placement area 32 of the test seat 30 under the carrying of the drive unit 10.

[0038] Based on the corresponding design of the first laser emitter 23 and the photoresistor 31, when the controller 50 drives the driving unit 10 to move the pickup unit 20 to the top of the test socket 30, in order to ensure the accurate coordination between the driving unit 10, the pickup unit 20 and the test socket 30, the first laser emitter 23 and the photoresistor 31 perform spatial calibration on the chip testing device. Specifically, if within a preset time, the photoresistor 31 is acted upon by the first laser emitter 23 and feeds back a trigger signal to the test socket 30, and the test socket 30 transmits the photosensitivity result to the controller 50, then the controller 50 drives the driving unit 10 to lower the pickup unit 20 toward the test socket 30, and the adsorbent 22 places the chip to be tested in the chip placement area 32 of the test socket 30. Therefore, the driving unit 10, the pickup unit 20 and the test socket 30 are aligned and calibrated by the first laser emitter 23 and the photoresistor 31, so as to ensure that the chip to be tested is accurately and efficiently transported to the test socket 30, thereby improving the chip testing quality, efficiency and reliability.

[0039] In an application scenario, when the controller 50 drives the driving unit 10 to move the pickup unit 20 above the test socket 30, if the photoresistor 31 is affected by the first laser emitter 23 outside the preset time and feeds back a trigger signal to the test socket 30, the test socket 30 transmits the photosensitivity result to the controller 50, and the controller 50 controls the driving unit 10 to stop moving and feeds back an abnormal signal to the chip testing device, or issues an abnormal alarm.

[0040] Furthermore, when the controller 50 drives the driving unit 10 to move the pickup unit 20 to the top of the test socket 30, if within a preset time, the photoresistor 31 is acted upon by the first laser emitter 23 but does not feed back a trigger signal to the test socket 30, that is, the test socket 30 also does not transmit the photosensitivity result to the controller 50, then the controller 50 controls the driving unit 10 to stop moving and feed back an abnormal signal to the chip testing device, or issues an abnormal alarm.

[0041] Furthermore, when the controller 50 drives the driving unit 10 to move the pickup unit 20 to the top of the test seat 30, if the photoresistor 31 is not acted upon by the first laser emitter 23 within a preset time, the controller 50 controls the driving unit 10 to stop moving and feeds back an abnormal signal to the chip testing device, or issues an abnormal alarm, thereby ensuring that the chip to be tested is accurately and efficiently transported to the test seat 30, thereby improving the chip testing quality, efficiency and reliability.

[0042] That is, when the controller 50 drives the driving unit 10 to move the pickup unit 20 to the top of the test socket 30, the light beam of the first laser emitter 23 should point to the photoresistor 31. If the driving unit 10, the pickup unit 20 and the test socket 30 are accurately aligned, the driving unit 10 and the pickup unit 20 are in the correct position above the test socket 30, each plate 21 corresponds to each test socket 30 one by one, and the light beam of the first laser emitter 23 will accurately pass through the mask 33 and fall on the photoresistor 31 to trigger signal feedback. Then the controller 50 drives the driving unit 10 to lower the pickup unit 20 toward the test socket 30, and the adsorbent 22 places the chip to be tested in the chip placement area 32 of the test socket 30.

[0043] In one embodiment, in order to ensure the precise spatial alignment of the first laser emitter 23 and the photoresistor 31, a protruding structure 211 is provided on the other side of the plate body 21. The vertical projection of the protruding structure 211 toward the photoresistor 31 covers the photoresistor 31 after the controller 50 drives the driving unit 10 to move the pickup unit 20 above the test seat 30, and the first laser emitter 23 is connected to the protruding structure 211, ensuring that the light beam of the first laser emitter 23 can stably act on the photoresistor 31.

[0044] The protruding structure 211 can be integrally connected to the plate body 21 to improve the stability of the overall structure, and the protruding structure 211 can be a rectangular support body protruding from the side of the plate body 21 to facilitate adjustment of the installation position of the laser emitter 23.

[0045] Furthermore, the chip placement area 32 can be designed with a groove structure on the upper surface of the test seat 30 to stably support the chip to be tested and prevent accidental sliding or deviation, so that the test seat 30 can perform performance testing on the chip to be tested. Here, the groove contour of the chip placement area 32 matches the side contour of the chip to be tested.

[0046] The photoresistor 31 is connected to the upper surface of the test socket 30 and is located outside the chip placement area 32 to avoid interfering with the test space of the test socket 30 for the chip to be tested, ensuring that the chip testing process is not affected and ensuring the stability of the alignment detection.

[0047] In one embodiment, the chip testing device also includes a carrier 60 for carrying and fixing a plurality of test sockets 30. The plurality of test sockets 30 can be evenly arranged on the carrier 60 to ensure the stability and consistency of the chip testing process. The evenly arranged test sockets 30 can be arranged in a matrix or a ring to adapt to different chip testing requirements and the spatial layout of the testing device.

[0048] The test socket 30 can be installed on the carrier board 60 by screw fixing, magnetic connection or slot embedding, so as to replace the test sockets of different specifications to adapt to different types of chip tests.

[0049] Furthermore, the carrier board 60 may be provided with a temperature control unit or an electrostatic elimination unit to optimize the test environment and improve the consistency of chip testing.

[0050] In a specific implementation process, the optical signal of the first laser emitter 23 is received by the photoresistor 31 , and the position detection of the driving unit 10 and the pickup unit 20 is realized according to the change of the resistance value of the photoresistor 31 .

[0051] Specifically, after the controller 50 drives the driving unit 10 to move the pickup unit 20 to the top of the test socket 30, if within a preset time, the first laser emitter 23 acts on the photoresistor 31, and after the photoresistor 31 reaches a preset resistance threshold, the photoresistor 31 feeds back a trigger signal to the test socket 30, and the test socket 30 transmits the photosensitivity result to the controller 50, then the controller 50 drives the driving unit 10 to lower the pickup unit 20 toward the test socket 30, and the adsorbent 22 places the chip to be tested in the chip placement area 32 of the test socket 30.

[0052] The trigger signal includes a preset terminal voltage of the photoresistor 31 .

[0053] Then, during the operation of the chip testing device, the alignment status among the driving unit 10, the pickup unit 20 and the test socket 30 is detected by the first laser emitter 23 and the photoresistor, that is, after the controller 50 drives the driving unit 10 to move the pickup unit 20 to the top of the test socket 30, if within the preset time, the light beam of the first laser emitter 23 irradiates the photoresistor 31, the resistance of the photoresistor 31 decreases, and after decreasing to the preset resistance threshold, the terminal voltage of the photoresistor 31 reaches the preset terminal voltage, then this preset terminal voltage signal is fed back to the test socket 30 as a trigger signal, and the test socket 30 transmits the photosensitivity result to the controller 50, then the controller 50 drives the driving unit 10 to lower the pickup unit 20 toward the test socket 30, and the adsorbent 22 places the chip to be tested in the chip placement area 32 of the test socket 30.

[0054] In an application scenario, when the controller 50 drives the driving unit 10 to move the pickup unit 20 to above the test socket 30, if the photoresistor 31 reaches the preset resistance threshold outside the preset time, then the controller 50 may drive the driving unit 10 to delay the pickup unit 20 from being in place. In this case, the controller 50 controls the driving unit 10 to stop moving and feeds back an abnormal signal to the chip testing device, or issues an abnormal alarm.

[0055] Furthermore, when the controller 50 drives the driving unit 10 to move the pickup unit 20 to the top of the test socket 30, if the photoresistor 31 does not reach the preset resistance threshold or the resistance value of the photoresistor 31 does not change within the preset time, then the driving unit 10 and the pickup unit 20 may not be properly aligned with the test socket 30. The controller 50 controls the driving unit 10 to stop moving and feeds back an abnormal signal to the chip testing device, or issues an abnormal alarm, thereby ensuring that the chip to be tested is accurately and efficiently transported to the test socket 30, thereby improving the chip testing quality, efficiency and reliability.

[0056] In the specific implementation process, in order to ensure that the photoresistor 31 is not affected by the environment and to improve the operation stability of the photoresistor 31 , the light mask 33 is disposed on the test socket 30 and covers the photoresistor 31 .

[0057] Furthermore, the light mask 33 is provided with a through slot structure 34 located above the photoresistor 31 , and a vertical projection of the through slot structure 34 relative to the photoresistor 31 is within the coverage area of ​​the photoresistor 31 .

[0058] Therefore, the light shield 33 is designed to avoid interference of ambient light on the photoresistor 31, and under the action of the through-slot structure 34, it is ensured that the photoresistor 31 only receives the light beam emitted by the first laser emitter 23, thereby preventing the photoresistor 31 from being falsely triggered due to ambient light, improving signal accuracy, and reducing the impact of environmental changes (such as changes in workshop lighting, external light fluctuations) on the operation of the photoresistor 31.

[0059] The light cover 33 may be made of black or dark optical plastic (such as ABS+black coating).

[0060] Furthermore, the opening center of the through-slot structure 34 corresponds to the light beam of the first laser emitter 23, the diameter of the photoresistor is ≥3mm, and the light beam of the laser emitter 23 does not exceed 1mm, so that the pickup unit 20 can have an error of ≥3mm in the diameter of the photoresistor, and the chip is usually small, allowing the pickup unit 20 to have an error of less than 1.5mm in diameter in the standard position (no error occurs when the pickup device is displaced to the test seat). If it exceeds 1.5mm, the pickup unit 20 will not be able to place the chip in the chip placement area 32. Therefore, the opening size of the through-slot structure 34 is less than 1.5mm, that is, when the alignment deviation between the first laser emitter 23 and the through-slot structure 34 exceeds 1.5mm, the light beam of the first laser emitter 23 will act on the mask 33, and the photoresistor will not receive the light beam of the first laser emitter 23, that is, the alignment deviation range of the driving unit 10 and the pickup unit 20 and the test seat 30 is less than 1.5mm.

[0061] Preferably, the diameter of the photoresistor is 3 mm.

[0062] In one embodiment, at least one chip proofreading area 321 with a limited area is provided on the test socket 30, the chip proofreading area 321 is arranged on the side of the chip placement area 32, and the photoresistor 31 is matched in the chip proofreading area 321 to avoid interfering with the test space of the test socket 30 for the chip to be tested, ensuring that the chip testing process is not affected, while ensuring the stability of the alignment detection.

[0063] Optionally, the limited area of ​​the chip calibration area 321 is ≥ 3 mm×3 mm.

[0064] Optionally, a plurality of photoresistors 31 may be arranged in the chip calibration area 321 to correspond to the plurality of first laser emitters 23 respectively, thereby improving the alignment detection accuracy.

[0065] In one embodiment, considering that the resistance value of the photoresistor 31 itself is not adjustable, and on the automated production line of the chip testing device, the photoresistor is prone to inaccurate triggering due to environmental changes (lighting inside the equipment, lighting in the workshop) or component parameter deviations, the photoresistor 31 can be connected in series with a variable resistor, wherein the resistance value of the variable resistor is adjustable, and is used to adjust the real-time terminal voltage of the photoresistor 31.

[0066] Specifically, during the operation of the chip testing device, when the photoresistor 31 is affected by the ambient light and its own resistance value changes, the variable resistor and the photoresistor 31 can be used to divide the voltage together. Then, by adjusting the resistance value of the variable resistor, the real-time terminal voltage of the photoresistor 31 can be changed, thereby preventing the photoresistor 31 from being affected by the ambient light and causing its real-time terminal voltage to reach a preset terminal voltage, thereby erroneously triggering a signal to the test socket 30.

[0067] In an application scenario, the photoresistor 31 is affected by ambient light and its own resistance value is reduced. In order to prevent the photoresistor 31 from feeding back a trigger signal to the test socket 30 due to ambient light exposure, the test socket 30 transmits the photosensitivity result to the controller 50, and the resistance value of the variable resistor can be increased, thereby dividing the real-time terminal voltage of the photoresistor 31, so that the real-time terminal voltage of the photoresistor 31 is insufficient to reach the preset terminal voltage. Then, when the controller 50 drives the driving unit 10 to move the pickup unit 20 above the test socket 30, the first laser emitter 23 acts on the photoresistor 31 within a preset time to further reduce the resistance value of the photoresistor 31. Only then can the real-time terminal voltage of the photoresistor 31 reach the preset terminal voltage, thereby feeding back a trigger signal to the test socket 30, and the test socket 30 transmits the photosensitivity result to the controller 50, thereby preventing the photoresistor 31 from being falsely triggered by the ambient light, thereby improving the reliability of chip testing.

[0068] In one embodiment, the chip testing device also includes an ambient light sensor 35 electrically connected to the test socket 30. The ambient light sensor 35 monitors the real-time terminal voltage of the photoresistor 31 and adjusts the resistance value of the variable resistor according to the real-time terminal voltage. The ambient light sensor 35 ensures that the photoresistor 31 can accurately trigger signal feedback under different lighting conditions, thereby improving the stability of the photoresistor 31 under different lighting conditions and ensuring that the terminal voltage of the photoresistor 31 is always in the correct trigger range.

[0069] Specifically, during the operation of the chip test device, the photoresistor 31 is connected in series with the variable resistor to prevent the photoresistor 31 from being affected by the ambient light and erroneously triggering a signal to the test socket 30. At the same time, considering that the photoresistor 31 is affected by different light conditions and its own resistance value fluctuates greatly, the ambient light sensor 35 monitors the real-time terminal voltage of the photoresistor 31, and thus adjusts the resistance value of the variable resistor according to the real-time terminal voltage. For example, after the photoresistor 31 is affected by the ambient light and its own resistance value decreases, the real-time terminal voltage of the photoresistor 31 increases, and the ambient light sensor 35 that monitors the real-time terminal voltage of the photoresistor 31 correspondingly increases the resistance value of the variable resistor, thereby synchronously adjusting the real-time terminal voltage of the photoresistor 31. The voltage is divided so that the real-time terminal voltage of the photoresistor 31 is insufficient to reach the preset terminal voltage. Then, when the controller 50 drives the driving unit 10 to move the pickup unit 20 above the test socket 30, the first laser emitter 23 acts on the photoresistor 31 within a preset time to further reduce the resistance of the photoresistor 31. Only then can the real-time terminal voltage of the photoresistor 31 reach the preset terminal voltage, thereby feeding back a trigger signal to the test socket 30, and the test socket 30 transmits the photosensitivity result to the controller 50. Then, the controller 50 drives the driving unit 10 to lower the pickup unit 20 toward the test socket 30, and the adsorbent 22 places the chip to be tested in the chip placement area 32 of the test socket 30, thereby improving the reliability of chip testing.

[0070] The ambient light sensor 35 may be built in the test socket 30 or the carrier board 60 .

[0071] In one embodiment, the adsorption member 22 includes a pneumatic part 24 and a picking part 25 connected to the plate body 21, one end of the picking part 25 is connected and communicated with the pneumatic part 24, and the other end of the picking part 25 is vertically facing the chip placement area 32 for adsorbing and releasing the chip to be tested.

[0072] The pneumatic part 24 is used to provide negative pressure adsorption capability, and one end thereof away from the picking part 25 may be connected to a pressure pipe, which is externally connected to a vacuum generator or a negative pressure pump, and the picking part 25 directly contacts and adsorbs the chip to be tested or releases the chip to be tested.

[0073] Furthermore, the other end of the pickup portion 25 may be connected to a flexible suction cup for stably adsorbing the chip to be tested to prevent damage to the chip surface.

[0074] In one embodiment, in order to ensure the precise alignment between the driving unit 10 and the pickup unit 20 and the test socket 30, based on the aforementioned embodiment, a second laser emitter 11 and a receiver 12 maintaining a preset interval are provided on the side of the driving unit 10 facing the test socket 30, and an alignment reflector plate 36 is connected to the side of the test socket 30.

[0075] Based on the second laser emitter 11 and the receiver 12, when the controller 50 drives the driving unit 10 to move the pickup unit 20 to the top of the test seat 30, if the receiver 12 receives the signal of the second laser emitter 11 reflected by the alignment reflector 36, the controller 50 drives the driving unit 10 to lower the pickup unit 20 toward the test seat 30, and the suction part 22 places the chip to be tested in the chip placement area 32 of the test seat 30, thereby improving the chip testing quality, efficiency and reliability.

[0076] Then, during the operation of the chip testing device, after the controller 50 drives the driving unit 10 to move the pickup unit 20 to the top of the test socket 30, in order to ensure the accurate alignment between the driving unit 10, the pickup unit 20 and the test socket 30, if within a preset time, the photoresistor 31 is acted upon by the first laser emitter 23 and feeds back a trigger signal to the test socket 30, the test socket 30 transmits the photosensitivity result to the controller 50, and the receiver 12 receives the signal of the second laser emitter 11 reflected by the alignment reflector 36, then the controller 50 drives the driving unit 10 to lower the pickup unit 20 toward the test socket 30, and the suction member 22 places the chip to be tested in the chip placement area 32 of the test socket 30. Thus, the spatial positions of the driving unit 10, the pickup unit 20 and the test socket 30 are aligned and calibrated by the first laser emitter 23 and the photoresistor 31, and the second laser emitter 11 and the receiver 12, thereby ensuring that the chip to be tested is accurately and efficiently transported to the test socket 30, thereby improving the chip testing quality, efficiency and reliability.

[0077] Among them, the alignment reflector 36 is made of a high-reflectivity material, and the width of the alignment reflector 36 is less than 1.5 mm, that is, when the alignment deviation between the second laser emitter 11 and the receiver 12 exceeds 1.5 mm, the receiver 12 cannot receive the signal of the second laser emitter 11 reflected by the alignment reflector 36, that is, the alignment deviation range of the drive unit 10 and the pickup unit 20 and the test seat 30 is less than 1.5 mm.

[0078] It is understandable that the alignment reflector 36 is connected to the side of the test socket 30 to avoid interfering with the test space of the test socket 30 for the chip to be tested, ensuring that the chip testing process is not affected and ensuring the stability of the alignment detection.

[0079] In one embodiment, to ensure that the driving unit 10 drives the pickup unit 20 to descend accurately toward the test seat 30, the first surface 10a of the driving unit 10 is provided with at least one first ranging sensor 13, the first ranging sensor 13 faces the carrier 60, and at least one second ranging sensor 37 is provided on the carrier 60, the second ranging sensor 37 faces the driving unit 10.

[0080] When the controller 50 drives the driving unit 10 to lower the picking unit 20 toward the test seat 30, and after it has descended a preset distance, if the difference between the distance value sensed by the first ranging sensor 13 or the distance value sensed by the second ranging sensor 37 and the preset distance is less than the preset error threshold, the adsorption component 22 will place the chip to be tested in the chip placement area 32 of the test seat 30.

[0081] The first surface 10 a of the driving unit 10 is a side surface of the driving unit 10 facing the test socket 30 .

[0082] Furthermore, the second distance measuring sensor 37 may be located between adjacent test sockets 30 .

[0083] That is, the first distance measuring sensor 13 and the second distance measuring sensor 37 sense the distance between the drive unit 10 and the test seat 30 in real time. Then, after the controller 50 drives the drive unit 10 to lower the pickup unit 20 toward the test seat 30 by a preset stroke, the travel accuracy of the drive unit 10 is checked by comparing the difference between the distance value sensed by the first distance measuring sensor 13 or the distance value sensed by the second distance measuring sensor 37 and the preset stroke with the preset error threshold, so as to prevent the actual descending distance of the drive unit 10 from being significantly different from the preset stroke, or the drive unit 10 from being positionally offset, thereby causing deviation when the adsorption member 22 places the chip to be tested in the chip placement area 32 of the test seat 30.

[0084] Then, during the operation of the chip testing device, after the controller 50 drives the driving unit 10 to move the pickup unit 20 to the top of the test seat 30, in order to ensure the accurate alignment between the driving unit 10 and the pickup unit 20 and the test seat 30, if within a preset time, the photoresistor 31 is acted upon by the first laser emitter 23 and feeds back a trigger signal to the test seat 30, the test seat 30 transmits the photosensitivity result to the controller 50, and the receiver 12 receives the signal of the second laser emitter 11 reflected by the alignment reflector 36, then the controller 50 drives the driving unit 10 to lower the pickup unit 20 toward the test seat 30, and after the preset stroke is lowered, if the first distance measuring sensor 1 3 or the difference between the distance value sensed by the second distance measuring sensor 37 and the preset stroke is less than the preset error threshold, the adsorbent 22 places the chip to be tested in the chip placement area 32 of the test seat 30. Thus, the spatial positions of the driving unit 10, the picking unit 20 and the test seat 30 are aligned and calibrated by the first laser emitter 23 and the photoresistor 31, and the second laser emitter 11 and the receiver 12. The descending displacement of the driving unit 10 is checked by the first distance measuring sensor 13 and the second distance measuring sensor 37, so as to ensure that the chip to be tested is accurately and efficiently transported to the chip placement area 32 of the test seat 30, thereby improving the chip test quality, efficiency and reliability.

[0085] Furthermore, the driving unit 10 is electrically connected to an automatic calibration unit 40. If the difference between the distance value sensed by the first ranging sensor 13 or the distance value sensed by the second ranging sensor 37 and a preset stroke is greater than a preset error threshold, the automatic calibration unit 40 adjusts the preset stroke of the driving unit 10 until the difference between the distance value sensed by the first ranging sensor 13 and the distance value sensed by the second ranging sensor 37 and the preset stroke is less than the preset error threshold, thereby greatly reducing manual error correction intervention and improving the automation level and stability of chip testing.

[0086] Optionally, the driving unit 10 further has a second surface 10 b opposite to the first surface 10 a , and the automatic calibration unit 40 is connected to the second surface 10 b .

[0087] The automatic calibration unit 40 can adjust the preset stroke of the driving unit 10 by smooth automatic adjustment using a PID control method to avoid error fluctuations.

[0088] refer to Figure 5 The embodiment of the present application also discloses a chip testing system, and the chip testing system 100 includes the chip testing device of any of the above embodiments.

[0089] During the operation of the chip testing system 100, the controller 50 drives the driving unit 10 to move the pickup unit 20 to the top of the test seat 30. If within a preset time, the photoresistor 31 is acted upon by the first laser emitter 23 and feeds back a trigger signal to the test seat 30, and the test seat 30 transmits the photosensitivity result to the controller 50, the controller 50 drives the driving unit 10 to lower the pickup unit 20 toward the test seat 30, and the controller 50 controls the adsorption component 22 to place the chip to be tested in the chip placement area 32 of the test seat 30.

[0090] In one embodiment, the controller 50 drives the driving unit 10 to move the pickup unit 20 to above the test seat 30. If the receiver 12 receives the signal of the second laser emitter 11 reflected by the alignment reflector 36, the controller 50 drives the driving unit 10 to lower the pickup unit 20 toward the test seat 30, and the controller 50 controls the adsorption component 22 to place the chip to be tested in the chip placement area 32 of the test seat 30.

[0091] In one embodiment, the controller 50 drives the driving unit 10 to lower the picking unit 20 toward the test seat 30, and after descending a preset stroke, if the difference between the distance value sensed by the first ranging sensor 13 or the distance value sensed by the second ranging sensor 37 and the preset stroke is less than a preset error threshold, the controller 50 controls the adsorption component 22 to place the chip to be tested in the chip placement area 32 of the test seat 30, thereby ensuring that the chip to be tested is accurately and efficiently transported to the test seat 30, thereby improving the chip testing quality, efficiency and reliability.

[0092] Among them, the chip testing system 100 also includes an automatic calibration unit 40. If the difference between the distance value sensed by the first ranging sensor 13 or the distance value sensed by the second ranging sensor 37 and the preset stroke is greater than the preset error threshold, the controller 50 controls the automatic calibration unit 40 to adjust the preset stroke of the driving unit 10 until the difference between the distance value sensed by the first ranging sensor 13 or the distance value sensed by the second ranging sensor 37 and the preset stroke is less than the preset error threshold.

[0093] For other working principles and processes of the chip testing system of this embodiment, please refer to the description of the chip testing device of the above embodiment, which will not be repeated here.

[0094] The chip testing device and system provided by the present application are described in detail above. The principle and implementation method of the present application are described in detail using specific examples. It should be noted that in the present application, the description of each embodiment has its own emphasis. For parts that are not described or recorded in detail in a certain embodiment, please refer to the relevant description of other embodiments.

[0095] The above are only preferred embodiments of the present application, and the patent scope of the present application is not limited thereto. The various technical features of the technical solution of the present application can be arbitrarily combined. In order to make the description concise, not all possible combinations of the various technical features in the above embodiments are described. Any equivalent structure or equivalent process transformation made using the contents of the specification and drawings of this application, or directly or indirectly used in other related technical fields, as long as there is no contradiction in the combination of these technical features, are equally included in the patent protection scope of the present application.

Claims

1. A chip testing device, characterized in that: include: A controller, a driving unit, a pickup unit and a plurality of test sockets, wherein the controller is electrically connected to the driving unit, the pickup unit and the plurality of test sockets respectively; The driving unit carries the pickup unit to transport the chip to be tested to the chip placement area of ​​the test seat, the pickup unit includes a plate body corresponding to each of the test seats, an adsorbent connected to one side of the plate body, and a first laser emitter connected to the plate body, wherein the test seat is provided with a photoresistor corresponding to the first laser emitter, and a light mask covering the photoresistor; When the controller controls the driving unit to move the pickup unit above the test socket, if within a preset time, the photoresistor is acted upon by the first laser emitter and feeds back a trigger signal to the test socket, and the test socket transmits the photosensitivity result to the controller, the controller controls the driving unit to lower the pickup unit toward the test socket, and the adsorbent places the chip to be tested in the chip placement area of ​​the test socket.

2. The chip testing device according to claim 1, characterized in that: The first laser emitter acts on the photoresistor, and after the photoresistor reaches a preset resistance threshold, the photoresistor feeds back the trigger signal to the test socket, wherein the trigger signal includes a preset terminal voltage of the photoresistor.

3. The chip testing device according to claim 2, characterized in that: The photoresistor is connected in series with a variable resistor, and the resistance of the variable resistor is adjustable, so as to adjust the real-time terminal voltage of the photoresistor.

4. The chip testing device according to claim 1, characterized in that: The photomask is provided with a through slot structure located above the photoresistor, the vertical projection of the through slot structure relative to the photoresistor is within the coverage area of ​​the photoresistor, and the opening size of the through slot structure is less than 1.5 mm, and the alignment deviation range between the pickup unit and the test socket is less than 1.5 mm.

5. The chip testing device according to claim 1, characterized in that: The adsorbent includes a pneumatic part and a pick-up part connected to the plate body, one end of the pick-up part is connected and communicated with the pneumatic part, and the other end of the pick-up part is vertically oriented toward the chip placement area for adsorbing and releasing the chip to be tested.

6. The chip testing device according to claim 3, characterized in that: An ambient light sensor is included which is electrically connected to the test socket. The ambient light sensor monitors the real-time terminal voltage of the photoresistor and adjusts the resistance value of the variable resistor according to the real-time terminal voltage.

7. The chip testing device according to claim 1, characterized in that: At least one chip calibration area with a limited area is provided on the test seat, the chip calibration area is arranged on the side of the chip placement area, and the photoresistor is matched in the chip calibration area.

8. The chip testing device according to claim 1, characterized in that: It also includes a carrier board, wherein at least one first distance measuring sensor is disposed on a first surface of the driving unit, and the first distance measuring sensor faces the carrier board; and A plurality of the test seats are arranged on the carrier, and at least one second distance measuring sensor is arranged on the carrier, and the second distance measuring sensor faces the driving unit; When the controller controls the driving unit to lower the picking unit toward the test seat and after it has descended a preset stroke, if the distance value sensed by the first ranging sensor or the distance value sensed by the second ranging sensor is less than a preset error threshold, the adsorbent places the chip to be tested in the chip placement area of ​​the test seat.

9. The chip testing device according to claim 8, characterized in that: The driving unit is electrically connected to an automatic calibration unit; If the difference between the distance value sensed by the first ranging sensor or the distance value sensed by the second ranging sensor and the preset stroke is greater than the preset error threshold, the automatic calibration unit adjusts the preset stroke of the driving unit until the difference between the distance value sensed by the first ranging sensor or the distance value sensed by the second ranging sensor and the preset stroke is less than the preset error threshold.

10. A chip testing system, characterized in that: The chip testing system comprises the chip testing device according to any one of claims 1 to 9.

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