Probe Card Mounting Platform, Wafer Detection Equipment and Design Method

Abstract

The present invention discloses a probe card mounting platform, a wafer detection device and a design method, which include a device platform board, a connecting board, an insulating board, a probe card mounting board, a first cylindrical pin and a second cylindrical pin. The connecting board is connected to the device platform board. In the height direction, the insulating board is located below the connecting board, and the probe card mounting board is located below the insulating board. The connecting board is provided with a first round hole and a first waist-shaped hole, and the probe card mounting board is provided with a second waist-shaped hole and a fourth round hole. The connecting board and the insulating board are connected by the first cylindrical pin, and the opposite ends of the first cylindrical pin are respectively inserted into the first waist-shaped hole and the second round hole. The insulating board and the probe card mounting board are connected by the second cylindrical pin, and the opposite ends of the second cylindrical pin are respectively inserted into the second waist-shaped hole and the third round hole. When the probe card mounting platform is heated, both the connecting board and the probe card mounting board can move relative to the insulating board, and the moving directions of the connecting board and the probe card mounting board are opposite to each other.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer detection, and particularly to a probe card mounting platform, a wafer detection device, and a design method. Background Art

[0002] During the test process of wafer mass production, a wafer detection device is usually required as a test device. With the rapid development of chip technology and the market demand for chip products, the wafer detection device needs to be able to perform reliable tests on the quality of wafers under different temperature conditions.

[0003] Since chip manufacturing has extremely high requirements for the fineness of processing technology, as a link in the chip manufacturing process, the detection of wafers also needs to ensure high precision, that is, it is necessary to ensure that the wafer detection device for testing chips maintains a high-precision detection effect during operation to ensure the reliability and stability of the final chip products. Summary of the Invention

[0004] In view of this, in response to the above technical problems, the present application provides a probe card mounting platform, a wafer detection device, and a design method.

[0005] In the first aspect of the embodiments of the present application, a probe card mounting platform is provided, which includes an equipment platform board, a connecting board, an insulating board, a probe card mounting board, a first cylindrical pin, and a second cylindrical pin. Among them, the connecting board is connected to the equipment platform board. In the height direction of the probe card mounting platform, the insulating board is located below the connecting board, and the probe card mounting board is located below the insulating board;

[0006] The connecting board is provided with a first round hole and a first waist-shaped hole, the insulating board is provided with a second round hole and a third round hole, and the probe card mounting board is provided with a second waist-shaped hole and a fourth round hole. The connecting board and the insulating board are connected by the first cylindrical pin, and the opposite ends of the first cylindrical pin are respectively inserted into the first waist-shaped hole and the second round hole; the insulating board and the probe card mounting board are connected by the second cylindrical pin, and the opposite ends of the second cylindrical pin are respectively inserted into the second waist-shaped hole and the third round hole;

[0007] In the length direction of the probe card mounting platform, the first waist-shaped hole and the second waist-shaped hole are relatively distributed on the opposite sides of the insulating board. On the opposite sides of the first waist-shaped hole and the second waist-shaped hole, there is a first gap between the first cylindrical pin and the hole wall of the first waist-shaped hole, and a second gap between the second cylindrical pin and the hole wall of the second waist-shaped hole. When the probe card mounting platform is heated, the connecting board moves relative to the insulating board along the hole body direction of the first waist-shaped hole in the first direction, and the probe card mounting board moves relative to the insulating board along the hole body direction of the second waist-shaped hole in the second direction, where the hole body direction of the first waist-shaped hole is parallel to the hole body direction of the second waist-shaped hole, and the first direction and the second direction are arranged in opposite directions.

[0008] In this application, through the structural design of the main operation board group in the above embodiments, the deformation influence of temperature change on the main operation board group can be effectively resisted, especially the deformation influence on the probe card mounting board. Thus, the probes mounted on the probe card mounting board can maintain a good alignment with the target area of the wafer to be measured, enabling the wafer detection device to resist the influence of temperature change on its own detection data and effectively improving the detection performance of the wafer detection device.

[0009] In the second aspect of the embodiments of this application, a wafer detection device is provided. The wafer detection device includes the probe card mounting platform in the first aspect of the embodiments of this application. Since the beneficial effects of the embodiments in the second aspect of this application are derived from the embodiments in the first aspect of this application, for the main beneficial effects of the embodiments in the second aspect of this application, please specifically refer to the beneficial effects of the embodiments in the first aspect of this application and will not be elaborated here.

[0010] In the third aspect of this application, a method for designing a probe card mounting platform is provided. The method includes:

[0011] Provide a connecting plate and form a first kidney-shaped hole and a first round hole on the connecting plate;

[0012] Provide an insulating plate and form a second round hole and a third round hole on opposite sides of the insulating plate body;

[0013] Provide a probe card mounting board and form a second kidney-shaped hole and a fourth round hole on the probe card mounting board;

[0014] Stack the connecting plate, the insulating plate, and the probe card mounting board in sequence, and make the first kidney-shaped hole correspond to the second round hole and the second kidney-shaped hole correspond to the third round hole;

[0015] Provide a first cylindrical pin and a second cylindrical pin. Pass the first cylindrical pin through the second round hole, and insert the opposite ends of the first cylindrical pin into the first kidney-shaped hole and the fourth round hole respectively. Pass the second cylindrical pin through the third round hole, and insert the opposite ends of the second cylindrical pin into the first round hole and the second kidney-shaped hole respectively, so as to position and connect the connecting plate, the insulating plate, and the probe card mounting board with pins;

[0016] When the temperature of the probe card mounting platform rises, the probe card mounting board moves relative to the insulating plate in a first direction, and the connecting plate moves relative to the insulating plate in a second direction, where the first direction is opposite to the second direction, so as to reduce the relative movement distance between the connecting plate and the probe card mounting board.

[0017] The third aspect of the embodiments of the present application provides a design method for a wafer detection device. This design method aims to implement the probe card mounting platform mentioned in the first aspect of the embodiments of the present application. Therefore, the design method in the third aspect of the embodiments of the present application corresponds to the method item of the probe card mounting platform in the first aspect of the embodiments of the present application, and its beneficial effects will not be elaborated here.

[0018] To make the above objects, features, and advantages of the present application more obvious and understandable, specific embodiments of the present application will be described below in detail in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] To more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0020] Figure 1 It is a schematic diagram of the composition of the wafer detection device in the present application;

[0021] Figure 2 It is a structural diagram of a probe card mounting platform from the first perspective;

[0022] Figure 3 For Figure 2 It is an exploded view of the shown structure from the second perspective;

[0023] Figure 4 For Figure 2 It is a top view of

[0024] Figure 5 For Figure 4 It is a sectional view taken along line A-A in

[0025] Figure 6 For Figure 5 It is an enlarged view of part A in

[0026] Figure 7 For Figure 5 It is an enlarged view of part B in

[0027] Figure 8 For Figure 5 It is an enlarged view of part C in

[0028] Figure 9 For Figure 4 It is a sectional view taken along line B-B in

[0029] Figure 10 For Figure 9 It is an enlarged view of part D in

[0030] Figure 11 is Figure 9 an enlarged view of the E position in

[0031] Figure 12 is Figure 2 the bottom view of the connecting plate in

[0032] Figure 13 is Figure 2 the top view of the insulating plate in

[0033] Figure 14 is Figure 2 the top view of the probe card mounting plate in

[0034] Figure 15 a flowchart illustration of a design method for a probe card mounting platform.

[0035] Reference numerals:

[0036] 1000 - wafer detection device, 1 - probe card mounting platform, 10 - device platform plate, 20 - connecting plate, 21 - first round hole, 22 - first waist-shaped hole, 23 - first screw hole, 24 - abutting convex part, 30 - insulating plate, 31 - second round hole, 32 - third round hole, 33 - first threaded through hole, 34 - second threaded through hole, 40 - probe card mounting plate, 41 - second waist-shaped hole, 42 - fourth round hole, 43 - second screw hole, 50 - first cylindrical pin, 60 - second cylindrical pin, 70 - first threaded assembly, 71 - first screw, 72 - first disc spring, 80 - second threaded assembly, 81 - second screw, 82 - second disc spring, d1 - first gap, d2 - second gap, d3 - third gap;

[0037] L - length direction, W - width direction, H - height direction. Detailed implementation manners

[0038] In order to make the objectives, technical solutions, and advantages of the embodiments of the present application clearer, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the scope of protection of the present application.

[0039] Unless otherwise defined, technical terms or scientific terms used herein shall have the ordinary meanings as understood by those of ordinary skill in the art to which this application pertains. Similar terms such as "a", "an", or "the" used in this application do not denote a limitation of quantity, but merely indicate the presence of at least one. Words such as "comprising" or "including" mean that the elements or items appearing before such words cover the elements or items listed after such words and their equivalents, without excluding other elements or items. Words such as "connected" or "coupled" do not limit to physical or mechanical connections, but may include electrical connections, whether direct or indirect.

[0040] Reference to "embodiments" in this text means that the specific features, structures, or characteristics described in connection with the embodiments may be included in at least one embodiment of this application. The phrase appears in various places in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment mutually exclusive with other embodiments. Those skilled in the art will explicitly and implicitly understand that the embodiments described herein may be combined with other embodiments.

[0041] It is necessary to understand in advance that the chip, as an essential key component in modern electronic devices, undertakes important functions such as computing, storing, and controlling, and is widely used in fields such as computers, mobile phones, automobiles, and industrial automation. With the rapid development of technology, the performance requirements of chips are constantly increasing. Therefore, the precision of the manufacturing process for chips is becoming increasingly stringent.

[0042] The wafer is mainly made of high-purity silicon and is the core material for manufacturing chips. In a sense, it is the starting point of chip manufacturing. The surface of the wafer is smooth and flat, providing an ideal substrate for the subsequent etching and formation of chip patterns. In industrial production, the size of wafers is usually large, and there are usually two common specifications: 8 inches and 12 inches. In this way, more chips can be integrated on a single wafer, thereby improving the production efficiency of chip manufacturing and reducing the manufacturing cost of chips.

[0043] When the wafer enters the manufacturing process, it will go through numerous complex and delicate process steps. Among them, the high-temperature environment is a crucial link in the wafer manufacturing process. Under high-temperature conditions, the wafer can undergo a series of key physical and chemical changes, gradually forming a chip with a complex circuit structure. For example, in the crystal growth process, it is necessary to melt and crystallize the silicon material in a high-temperature environment to form a high-quality single-crystalline silicon wafer; and in the doping process, high temperature helps introduce impurity atoms into the silicon crystal, changing its electrical properties, and then realizing specific functions of the chip; in addition, high temperature is also used to activate the doped impurity atoms to ensure that they occupy the correct positions in the lattice, thus providing a basis for the normal operation of the chip.

[0044] Due to the extremely high precision requirements in chip manufacturing, tiny dimensional deviations or complex pattern defects can affect the performance and functionality of the chip. Therefore, after the wafer has gone through various manufacturing and processing steps, high-precision detection is required. By detecting and screening defects at an early stage, defective wafers can be prevented from being used in subsequent expensive manufacturing processes. In this way, the yield of the chip can be improved, and the performance and functionality of the subsequently processed and formed chip products can meet the product expectations.

[0045] Since chip products will face different temperature environments during actual use, and temperature changes can affect the physical and electrical properties of the wafer, multiple temperatures need to be set for the detection of the wafer to detect the wafer at different temperatures. Thus, defects that may occur in the wafer under high or low temperature conditions (such as stress caused by differences in thermal expansion coefficients, increased leakage, etc.) can be detected in advance, and the thermal stability and reliability of the wafer can be more accurately evaluated, thereby ensuring the stable operation of the chip in various actual working environments. Correspondingly, the wafer detection equipment required for wafer detection also needs to face multiple different temperature environments to participate in the wafer detection process.

[0046] Since the ambient temperature faced by wafer detection is different, and the wafer detection equipment also needs to enter different ambient temperatures accordingly, each component structure of the wafer detection equipment will be interfered by the ambient temperature, that is, thermal expansion and contraction will occur, which will affect the wafer detection data. Therefore, in this application, a wafer detection equipment is provided, which can to a certain extent reduce the influence of the ambient temperature on its own detection performance, so as to improve the accuracy of its own wafer detection.

[0047] First, refer to Figure 1 , this embodiment of the application provides a wafer detection equipment, which includes a probe card mounting platform for detecting a target wafer to obtain performance data of the target wafer in various temperature environments.

[0048] To better understand the technical content of this solution, the following will combine the attached Figures 1 to 15 in this embodiment of the application to clearly and completely describe each technical solution in this embodiment of the application. It should be noted that the length direction L marked in each drawing is marked with reference to the height direction of the probe card mounting platform 1, the width direction W marked in each drawing is marked with reference to the width direction of the probe card mounting platform 1, the height direction H marked in each drawing is marked with reference to the height direction of the probe card mounting platform 1, and the directions marked in each drawing are kept unified for easy reference and understanding.

[0049] It should be noted in advance that since the probe reciprocates along the height direction H of the probe card mounting platform 1 with the probe card mounting plate 40, therefore, this application focuses on the influence of the change of the probe card mounting plate 40 in the length direction L of the probe card mounting platform 1 on the probe position when the temperature changes. In the following embodiments, the description of each embodiment of the probe card mounting platform 1 also focuses on the deformation of each component in the length direction L of the probe card mounting platform 1.

[0050] Please continue to refer to Figures 1 to 14 , wherein, the aforementioned probe card mounting platform 1 includes a device platform board 10, a connecting board 20, an insulating board 30, a probe card mounting plate 40, a first cylindrical pin 50 and a second cylindrical pin 60. Among them, the connecting board 20 is connected to the device platform board 10. Along the height direction H of the probe card mounting platform 1, the insulating board 30 is located below the connecting board 20, and the probe card mounting plate 40 is located below the insulating board 30.

[0051] Specifically, the probe card mounting plate 40 is used to connect the probe, and the probe is used to contact the wafer to obtain the detection data of the wafer (such as leakage current data). The insulating board 30 is used to insulate and isolate the probe card mounting plate 40 from other board bodies and devices to prevent a current loop from being formed between the probe card mounting plate 40 and other board bodies, which affects the accuracy of the leakage current data. The connecting board 20 is used to connect the insulating board 30 and indirectly connect the connecting board 20 to the device platform board 10 so that each board body forms a connection relationship to form a complete main operation board group. Among them, the wafer detection device 1000 is provided with a mounting part, and the device platform board 10 is connected to the mounting part so that the above-mentioned main operation board group is integrally connected to the mounting part to perform the subsequent detection operation of the wafer detection device 1000.

[0052] Since the connecting board 20, the insulating board 30 and the probe card mounting plate 40 are the main detection operation board bodies, for the sake of simplicity of subsequent description, the connecting board 20, the insulating board 30 and the probe card mounting plate 40 and their associated connectors (such as the first cylindrical pin 50 and the second cylindrical pin 60) are collectively referred to as the main operation board group to avoid redundancy in subsequent descriptions.

[0053] The connecting board 20 is provided with a first round hole 21 and a first waist-shaped hole 22 (also refer to Figure 12), the insulating plate 30 is provided with a second round hole 31 and a third round hole 32, the probe card mounting plate 40 is provided with a second waist-shaped hole 41 and a fourth round hole 42, the connecting plate 20 and the insulating plate 30 are connected by a first cylindrical pin 50, and opposite ends of the first cylindrical pin 50 are respectively inserted into the first waist-shaped hole 22 and the second round hole 31; the insulating plate 30 and the probe card mounting plate 40 are connected by a second cylindrical pin 60, and opposite ends of the second cylindrical pin 60 are respectively inserted into the second waist-shaped hole 41 and the third round hole 32. Among them, the first cylindrical pin 50 and the second cylindrical pin 60 are used to connect the connecting plate 20, the insulating plate 30 and the probe card mounting plate 40 to form a connection relationship among the three plates.

[0054] It should be noted that, for further reference, Figures 4 to 14 , since the first round hole 21, the second round hole 31, the third round hole 32 and the fourth round hole 42 are all adaptively connected to the first cylindrical pin 50 and the second cylindrical pin 60, therefore, the first cylindrical pin 50, the second cylindrical pin 60 and the insulating plate 30 are adaptively connected. One end of the first cylindrical pin 50 far from the probe card mounting plate 40 is adaptively connected to the first round hole 21, one end of the second cylindrical pin 60 far from the connecting plate 20 is adaptively connected to the second round hole 31, one end of the first cylindrical pin 50 close to the probe card mounting plate 40 is inserted into the second waist-shaped hole 41, and one end of the second cylindrical pin 60 close to the probe card mounting plate 40 is inserted into the first waist-shaped hole 22.

[0055] In other words, along Figure 2 and Figure 3 in the length direction L shown in, since there is a first gap d1 between the first waist-shaped hole 22 and the first cylindrical pin 50 (as shown in Figure 6 ), and there is a second gap d2 between the second waist-shaped hole 41 and the second cylindrical pin 60 (as shown in Figure 8 ), therefore, when the connecting plate 20 undergoes physical deformation due to the change of the ambient temperature, its deformation (expansion or contraction of the plate body) will move along the hole body direction of the first waist-shaped hole 22 until the hole wall of the first waist-shaped hole 22 abuts against the first cylindrical pin 50. Similarly, when the probe card mounting plate 40 undergoes physical deformation due to the change of the ambient temperature, its deformation (expansion or contraction of the plate body) will move along the hole body direction of the second waist-shaped hole 41 until the hole wall of the second waist-shaped hole 41 abuts against the second cylindrical pin 60.

[0056] Specifically, along the length direction L of the probe card mounting platform 1, the first waist-shaped hole 22 and the second waist-shaped hole 41 are relatively distributed on opposite sides of the insulating plate 30. On the opposite sides of the first waist-shaped hole 22 and the second waist-shaped hole 41, there is a first gap d1 between the first cylindrical pin 50 and the hole wall of the first waist-shaped hole 22 (for reference, see Figure 6 ), and there is a second gap d2 between the second cylindrical pin 60 and the hole wall of the second waist-shaped hole 41 (for reference, see Figure 8), when the probe card mounting platform 1 is heated, the connecting plate 20 moves relative to the insulating plate 30 along the hole body direction of the first kidney-shaped hole 22 in the first direction (which can be understood as the negative direction of the length direction L in the figure), and the probe card mounting plate 40 moves relative to the insulating plate 30 along the hole body direction of the second kidney-shaped hole 41 in the second direction (which can be understood as the positive direction of the length direction L in the figure). Among them, the hole body direction of the first kidney-shaped hole 22 is parallel to the hole body direction of the second kidney-shaped hole 41, and the first direction and the second direction are arranged in opposite directions.

[0057] In other words, due to the connection and restriction effects of the first cylindrical pin 50 and the second cylindrical pin 60, the insulating plate 30 can be regarded as a reference object during the deformation process, that is, the plate body deformation of the insulating plate 30 can be ignored to better illustrate the movement effects of the connecting plate 20 and the probe card mounting plate 40. Among them, the first kidney-shaped hole 22 and the second kidney-shaped hole 41 are arranged at intervals and oppositely along the length direction L, (which can be referred to Figure 2 In the disk symmetric structure shown, the first kidney-shaped hole 22 and the second kidney-shaped hole 41 are distributed on the opposite sides of the axis of symmetry of the disk symmetric structure). Thus, when the main operation plate group undergoes physical deformation due to temperature change, the connecting plate 20 is restricted by the second cylindrical pin 60, and the probe card mounting plate 40 is restricted by the first cylindrical pin 50. Therefore, the connecting plate 20 and the probe card mounting plate 40 move relative to the insulating plate 30 in opposite directions.

[0058] From the overall perspective of the main operation plate group, since the probe card mounting plate 40 is closer to the wafer detection environment, the probe card mounting plate 40 will move along the second direction due to first sensing the temperature change, and drive the insulating plate 30 to move along the second direction under the connection action of the first cylindrical pin 50. After that, with the heat transfer between the plate bodies, the connecting plate 20 will move along the first direction after sensing the temperature change, and drive the insulating plate 30 and the probe card mounting plate 40 to move along the first direction under the limiting action of the second cylindrical pin 60, thereby offsetting to a certain extent the distance moved along the second direction due to the deformation of the probe card mounting plate 40 before. That is, in the above embodiment, the probe card mounting plate 40 can ultimately be reset to the target position to a certain extent or close to the target position. Thus, the probes mounted on the probe card mounting plate 40 can align with the target area of the wafer to be detected, reducing the influence of temperature change on the data accuracy of the wafer detection device 1000.

[0059] In this application, through the structural design of the main operation board group in the above embodiments, the deformation influence of temperature change on the main operation board group can be effectively resisted, especially the deformation influence on the probe card mounting board 40. Thus, the probes mounted on the probe card mounting board 40 can maintain a good alignment with the target area of the wafer to be tested, enabling the wafer testing device 1000 to resist the influence of temperature change on its own detection data and effectively improving the detection performance of the wafer testing device 1000.

[0060] In some embodiments, when the probe card mounting platform 1 is heated, along the length direction L of the probe card mounting platform 1, the probe card mounting board 40 forms a first deformation amount in the first direction relative to the insulating board 30, and the connecting board 20 forms a second deformation amount in the second direction relative to the insulating board 30. The first deformation amount is equal to the second deformation amount, and the first direction is opposite to the second direction.

[0061] It should be understood in advance that the reason for the temperature change in the environment where the probe card mounting platform 1 is located is that when testing the wafer to be tested, the wafer to be tested needs to be in environments with different temperatures to obtain the detection data of the wafer to be tested in different temperature environments, and then judge the comprehensive performance of the wafer to be tested. Therefore, as the main structure when testing the wafer to be tested, the main operation board group can more sensitively sense the temperature change in the environment where the wafer to be tested is located. Therefore, the structure of the main operation board group can be designed emphatically to resist the influence of environmental temperature change on the detection accuracy of the probe card mounting platform 1.

[0062] The probe card mounting platform 1 is a carrier board for probe installation. During the detection operation of the probe card mounting platform, it will move with the probe to a position closer to the wafer to be tested. This position is closer to the wafer to be tested than the insulating board 30 and the connecting board 20. And the probe needs to contact the wafer to be tested during the detection process. Therefore, in addition to the influence of the environmental temperature of the wafer to be tested on the main operation board group, a heat transfer channel will be formed between the wafer to be tested and the probe card mounting board 40 through the probe, and there will also be a certain heat radiation effect between the wafer to be tested and the probe card mounting board 40. Therefore, the probe card mounting board 40 can sense the change of environmental temperature faster than the insulating board 30 and the connecting board 20, and thus form a physical deformation faster than the insulating board 30 and the connecting board 20.

[0063] And because the connecting board 20, the insulating board 30 and the probe card mounting board 40 are along Figure 2 and Figure 3They are sequentially connected and arranged in the negative direction of the height direction H shown in the figure. Therefore, heat can also be transferred between the three plates. In other words, after the probe card mounting plate 40 undergoes a temperature change, heat exchange will first occur between it and the insulating plate 30, and then heat exchange will occur with the connecting plate 20 through the distance state of the connection position. During the heat transfer process, a certain amount of heat loss will occur. Therefore, the amount of temperature change sensed by the connecting plate 20 relative to the probe card mounting plate 40 is smaller. When the connecting plate 20 and the probe card mounting plate 40 are of the same specification and material, the physical deformation value of the connecting plate 20 due to temperature change is smaller than the physical deformation value of the probe card mounting plate 40 due to dimensional change.

[0064] Therefore, in the above embodiment, by setting the first deformation amount equal to the second deformation amount, that is, the physical deformation value of the connecting plate 20 is greater than the physical deformation value of the probe card mounting plate 40. In this way, the influence on the deformation performance of the connecting plate 20 and the probe card mounting plate 40 due to heat loss during the heat transfer process is overcome, and the probe card mounting plate 40 can drive the probe to reset to the original position after the main working plate group undergoes physical deformation, so as to keep it aligned with the target area of the wafer under test.

[0065] To ensure the movement effect of the connecting plate 20 and the probe card mounting plate 40 relative to the insulating plate 30, it is set that the length of the first gap d1 is greater than or equal to the first deformation amount, and the length of the second gap d2 is greater than or equal to the second deformation amount, so as to reduce the influence of the limit between the cylindrical pin and the corresponding waist-shaped hole wall on the relative movement effect between the plates.

[0066] Furthermore, the plate materials of the probe card mounting plate 40 and the connecting plate 20 are the same, and the heat-bearing area of the probe card mounting plate 40 is smaller than that of the connecting plate 20. In this way, the probe card mounting plate 40 generates less heat exchange with the detection environment relative to the connecting plate 20, making the heat change value of the connecting plate 20 tend to be similar to that of the connecting plate 20. Thus, the first deformation amount is equal to the second deformation amount to ensure that after the main working plate group deforms, the probe remains aligned with the target area of the wafer under test.

[0067] Optionally, the thermal expansion coefficient of the probe card mounting plate 40 is smaller than that of the connecting plate 20, that is, the physical deformation ability of the probe card mounting plate 40 is smaller than that of the connecting plate 20. Therefore, although there is heat loss when the heat of the probe card mounting plate 40 is transferred to the connecting plate 20 during the heat transfer process, when only considering the heat factor, the physical deformation ability of the probe card mounting plate 40 is greater than that of the connecting plate 20. Considering the factor of the thermal expansion coefficient, at this time, the physical deformation abilities of the probe card mounting plate 40 and the connecting plate 20 tend to be similar. Therefore, after each structure of the main working plate group undergoes physical deformation, the probe still remains aligned with the target area of the wafer under test.

[0068] Since the coefficient of thermal expansion of the probe card mounting plate 40 is less than that of the connection plate 20, there may be a situation where the first deformation amount (the physical deformation amount of the probe card mounting plate) is less than the second deformation amount (the physical deformation amount of the connection plate 20). Therefore, the length of the first gap d1 is set to be greater than or equal to the length of the second gap d2, so as to reduce the influence on the deformation size of the connection plate 20 when the connection plate 20 undergoes physical deformation due to temperature change by the constraint of the first cylindrical pin 50.

[0069] Optionally, the coefficient of thermal expansion of the probe card mounting plate 40 is ε1, the plate thickness of the probe card mounting plate 40 is h1, and the first deformation amount is x1. The coefficient of thermal expansion of the connection plate 20 is ε2, the plate thickness of the connection plate 20 is h2, and the second deformation amount is x2. Since the heat transfer effect between the probe card mounting plate 40 and the connection plate 20 may also be affected by some objective environmental factors, such as the contact between the main working plate group and other components, the electrical connection formed between the probe card mounting plate 40 and other structures, etc., the probe card mounting platform 1 also has a thermal expansion compensation coefficient ε3 to make up for the influence of this part of objective environmental factors on the physical deformation amount of the connection plate 20. When the probe card mounting platform 1 expands due to heat, .

[0070] Furthermore, the thermal expansion compensation coefficient ε3 can be determined according to the coefficients of thermal expansion ε1, ε2 and the volumes of the probe card mounting plate 40 and the connection plate 20, and can be obtained by the user through statistics after collecting experimental data.

[0071] Optionally, the coefficient of thermal expansion of the probe card mounting plate 40 is less than that of the connection plate 20, and the length of the first gap d1 is equal to the length of the second gap d2. In this way, the physical deformation amount of the probe card mounting plate 40 is less than that of the connection plate 20. Although there will be a certain loss when the heat of the probe card mounting plate 40 is transferred to the connection plate 20, due to the difference in the coefficients of thermal expansion, even if the connection plate 20 lacks the physical deformation amount of the connection plate 20 corresponding to this part of the loss, in the final deformation result, the physical deformation amounts of the probe card mounting plate 40 and the connection plate 20 can still be kept in a balanced state. Therefore, the length of the first gap d1 can be set to be equal to the length of the second gap d2.

[0072] Furthermore, the lengths of the first gap d1 and the second gap d2 can be set to be greater than the first physical deformation amount and the second physical deformation amount to avoid the above-mentioned excessive physical deformation amounts, which may cause mutual constraint between the cylindrical pin and the side wall of the waist-shaped hole and interfere with the stability of the main working plate group structure.

[0073] Please also refer to Figures 4 to 13 , optionally, the connection plate 20 is provided with a first screw hole 23 (such as Figure 11As shown, the probe card mounting plate 40 is provided with a second screw hole 43, which can be referred to Figure 13 , the insulating plate 30 is provided with a first threaded through hole 33 and a second threaded through hole 34. Along the length direction L of the probe card mounting platform 1, the first threaded through hole 33 and the second threaded through hole 34 are spaced apart on opposite sides of the insulating plate 30, and the first screw hole 23 corresponds to the first threaded through hole 33, and the second screw hole 43 corresponds to the second threaded through hole 34. In this way, the connection relationship between the connecting plate 20, the insulating plate 30 and the probe card mounting plate 40 can be realized through the connecting piece.

[0074] The probe card mounting platform 1 further includes a first threaded component 70 and a second threaded component 80. The first threaded component 70 sequentially connects the first threaded through hole 33 and the first screw hole 23, and the second threaded component 80 sequentially connects the second threaded through hole 34 and the second screw hole 43. Along the height direction H of the probe card mounting platform 1, the installation direction of the first threaded component 70 is opposite to the installation direction of the second threaded component 80. In this way, in the illustrated height direction H, since the connecting pieces between the connecting plate 20 and the insulating plate 30 and between the insulating plate 30 and the probe card mounting plate 40 are different, therefore, compared with the three plates being connected into one body by the same connecting piece, such a setting can reduce the extrusion stress received by each of the first threaded component 70 and the second threaded component 80, and can also disperse the extrusion stress received by the insulating plate 30 at the threaded through holes, that is, disperse the extrusion stress that should originally converge at one place on the insulating plate 30 to multiple positions of the insulating plate 30 to reduce the physical loss of the insulating plate 30 and the threaded component during the operation of the main working plate group.

[0075] Please continue to refer to Figures 9 to 14 , further, the first threaded component 70 includes a first screw 71 and a first disc spring 72 (such as Figure 10 shown), the second threaded component 80 includes a second screw 81 and a second disc spring 82. The head of the first screw 7 is abutted against the first disc spring 72 on the hole wall of the first threaded through hole 33 by a first preset torque, and the head of the second screw 81 is abutted against the second disc spring 82 on the hole wall of the second threaded through hole 34 by a second preset torque. Among them, the first screw 71 and the second screw 81 are used to realize the connection relationship between the corresponding plates. The first disc spring 72 and the second disc spring 82 are correspondingly abutted against the insulating plate 30 by the first screw 71 and the second screw 81, and can, through their own deformation, increase the extrusion force applied by the first threaded component 70 and the second threaded component 80 to the insulating plate 30, thereby correspondingly increasing the connection strength between the corresponding plates.

[0076] Among them, the minimum threshold of the first preset torque and / or the second preset torque is 1 N·m, and the maximum threshold of the first preset torque and / or the second preset torque is 10 N·m. In this way, most of the disc springs on the market can be adaptively applied to the probe card mounting plate 40 in the present application, and will not cause great physical damage to the insulating plate 30.

[0077] Optionally, please continue to refer to Figure 5 , Figure 7 , Figure 9 , Figure 10 and Figure 11 , the equipment platform plate 10 and the connecting plate 20 are in clearance fit, that is, there is a third gap d3 between the equipment platform plate 10 and the connecting plate 20. In this way, when the connecting plate 20 expands due to heat, the third gap d3 can accommodate the increased plate volume when the connecting plate 20 expands, thus avoiding mutual extrusion and damage between the connecting plate 20 and the equipment platform plate 10.

[0078] Optionally, the surface of the probe card mounting plate 40 is coated with a silver ion heat insulation coating. Since the anion coating can effectively reflect infrared rays, the silver ion heat insulation coating can reduce the heat exchange between the probe card mounting plate 40 and the detection environment to a certain extent, thereby reducing the deformation of the probe card mounting plate 40 and the influence of the thermal expansion of the probe card mounting plate 40 on the connecting plate 20.

[0079] Optionally, the surface of the probe card mounting plate 40 is coated with a mixed coating of silver ions and Teflon. Among them, the coating materials can include but are not limited to one or a combination of two of silver ions and Teflon. The silver ion coating can effectively reflect infrared rays, and Teflon has the characteristics of high temperature resistance, insulation, and corrosion prevention. Therefore, the mixed coating of silver ions and Teflon can reduce the heat exchange between the probe card mounting plate 40 and the detection environment to a certain extent, reduce the thermal expansion of the main operation plate group, and can also provide a certain degree of insulation and anti-corrosion ability for the probe card mounting plate 40, extending the service life of the probe card mounting plate 40.

[0080] Optionally, please refer to Figures 3 to 14 , along the height direction H of the probe card mounting platform 1, both the connecting plate 20 and the probe card mounting plate 40 are provided with abutting convex portions 24, and the abutting convex portions 24 abut against the surface of the insulating plate 30; or, both opposite side surfaces of the insulating plate 30 are provided with abutting convex portions 24, and the abutting convex portions 24 abut against the surface of the connecting plate 20 or the probe card mounting plate 40. In this way, the contact area between each plate can be reduced, so that the heat transfer between the plates is limited, and generally the expansion effect of each plate is reduced.

[0081] The present application also provides a design method of a probe card mounting platform 1 as shown in Figure 15 , and this design method includes:

[0082] S1: Provide a connecting plate 20 and form a first kidney-shaped hole 22 and a first round hole 21 on the connecting plate 20.

[0083] S2: Provide an insulating plate 30 and form a second round hole 31 and a third round hole 32 on opposite sides of the plate body of the insulating plate 30.

[0084] S3: Provide a probe card mounting plate 40 and form a second kidney-shaped hole 41 and a fourth round hole 42 on the probe card mounting plate 40.

[0085] S4: Stack the connecting plate 20, the insulating plate 30, and the probe card mounting plate 40 in sequence, and make the first kidney-shaped hole 22 correspond to the second round hole 31, and the second kidney-shaped hole 41 correspond to the third round hole 32.

[0086] S5: Provide a first cylindrical pin 50 and a second cylindrical pin 60. Pass the first cylindrical pin 50 through the second round hole 31, and insert opposite ends of the first cylindrical pin 50 into the first kidney-shaped hole 22 and the fourth round hole 42 respectively. Pass the second cylindrical pin 60 through the third round hole 32, and insert opposite ends of the second cylindrical pin 60 into the first round hole 21 and the second kidney-shaped hole 41 respectively, so as to position and connect the connecting plate 20, the insulating plate 30, and the probe card mounting plate 40 with pins.

[0087] S6: When the temperature of the probe card mounting platform 1 rises, the probe card mounting plate 40 moves relative to the insulating plate 30 in a first direction, and the connecting plate 20 moves relative to the insulating plate 30 in a second direction, where the first direction is opposite to the second direction, so as to reduce the relative movement distance between the connecting plate 20 and the probe card mounting plate 40.

[0088] Through the design method of the probe card mounting platform 1, the user can fabricate the aforementioned probe card mounting platform 1. Thus, the probe card mounting platform 1 fabricated by this design method can achieve the aforementioned effects to improve the aforementioned technical problems.

[0089] It should be noted that in the above embodiments, the descriptions of each embodiment have their own emphases. For parts not detailed in a certain embodiment, reference can be made to the relevant descriptions of other embodiments. Secondly, those skilled in the art should also be aware that the embodiments described in the specification are all preferred embodiments, and the actions and modules involved are not necessarily essential to this application.

[0090] The above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A probe card mounting platform, characterized in that, Including: A device platform board, a connecting board, an insulating board, a probe card mounting board, a first cylindrical pin and a second cylindrical pin. Among them, the connecting board connects the device platform board. Along the height direction of the probe card mounting platform, the insulating board is located below the connecting board, and the probe card mounting board is located below the insulating board; The connecting board is provided with a first round hole and a first waist-shaped hole. The insulating board is provided with a second round hole and a third round hole. The probe card mounting board is provided with a second waist-shaped hole and a fourth round hole. The connecting board and the insulating board are connected by the first cylindrical pin, and the opposite ends of the first cylindrical pin are respectively inserted into the first waist-shaped hole and the second round hole; the insulating board and the probe card mounting board are connected by the second cylindrical pin, and the opposite ends of the second cylindrical pin are respectively inserted into the second waist-shaped hole and the third round hole; Along the length direction of the probe card mounting platform, the first waist-shaped hole and the second waist-shaped hole are relatively distributed on the opposite sides of the insulating board. On the opposite side of the first waist-shaped hole and the second waist-shaped hole, there is a first gap between the first cylindrical pin and the hole wall of the first waist-shaped hole, and there is a second gap between the second cylindrical pin and the hole wall of the second waist-shaped hole. When the probe card mounting platform is heated, the connecting board moves relative to the insulating board along the hole body direction of the first waist-shaped hole in a first direction, and the probe card mounting board moves relative to the insulating board along the hole body direction of the second waist-shaped hole in a second direction. Among them, the hole body direction of the first waist-shaped hole is parallel to the hole body direction of the second waist-shaped hole, and the first direction and the second direction are arranged in opposite directions.

2. The probe card mounting platform according to claim 1, wherein, When the probe card mounting platform is heated, along the length direction of the probe card mounting platform, the probe card mounting board forms a first deformation amount in the first direction relative to the insulating board, and the connecting board forms a second deformation amount in the second direction relative to the insulating board. The first deformation amount is equal to the second deformation amount, and the first direction and the second direction are opposite; Among them, the length of the first gap is greater than or equal to the first deformation amount, and the length of the second gap is greater than or equal to the second deformation amount.

3. The probe card mounting platform according to claim 2, wherein The plate body materials of the probe card mounting board and the connecting board are the same, and the heat-bearing area of the probe card mounting board is smaller than that of the connecting board.

4. The probe card mounting platform according to claim 1, characterized in that The coefficient of thermal expansion of the probe card mounting board is smaller than that of the connecting board, and the length of the first gap is equal to the length of the second gap.

5. The probe card mounting platform according to claim 1, characterized in that, The connecting board is provided with a first screw hole, and the probe card mounting board is provided with a second screw hole; The insulating board is provided with a first threaded through hole and a second threaded through hole. Along the length direction of the probe card mounting platform, the first threaded through hole and the second threaded through hole are spaced apart and distributed on the opposite sides of the insulating board, and the first screw hole corresponds to the first threaded through hole, and the second screw hole corresponds to the second threaded through hole; The probe card mounting platform further includes a first threaded component and a second threaded component. The first threaded component is sequentially connected to the first threaded through-hole and the first screwed hole, and the second threaded component is sequentially connected to the second threaded through-hole and the second screwed hole. Along the height direction of the probe card mounting platform, the installation direction of the first threaded component is opposite to the installation direction of the second threaded component.

6. The probe card mounting platform according to claim 5, wherein The first threaded component includes a first screw and a first disc spring, and the second threaded component includes a second screw and a second disc spring. The head of the first screw presses against the first disc spring against the hole wall of the first threaded through-hole with a first preset torque, and the head of the second screw presses against the second disc spring against the hole wall of the second threaded through-hole with a second preset torque. Wherein, the minimum threshold of the first preset torque and / or the second preset torque is 1 N·m, and the maximum threshold of the first preset torque and / or the second preset torque is 10 N·m.

7. The probe card mounting platform according to any one of claims 1 to 6, characterized in that, The equipment platform plate and the connecting plate are in clearance fit; and / or, The surface of the probe card mounting plate is coated with a silver ion heat insulation coating.

8. The probe card mounting platform according to any one of claims 1 to 6, characterized in that, Along the height direction of the probe card mounting platform, the connecting plate and the probe card mounting plate are both provided with abutting convex parts, and the abutting convex parts abut against the surface of the insulating plate; or, the opposite two side surfaces of the insulating plate are both provided with abutting convex parts, and the abutting convex parts abut against the surface of the connecting plate or the probe card mounting plate.

9. A wafer inspection device, characterized in that, Including the probe card mounting platform according to any one of claims 1-8.

10. A design method for a probe card mounting platform, characterized in that, Including: Provide a connecting plate and form a first kidney-shaped hole and a first circular hole on the connecting plate; Provide an insulating plate and form a second circular hole and a third circular hole on the opposite two sides of the insulating plate body; Provide a probe card mounting plate and form a second kidney-shaped hole and a fourth circular hole on the probe card mounting plate; Stack the connecting plate, the insulating plate and the probe card mounting plate in sequence, with the insulating plate located below the connecting plate and the probe card mounting plate located below the insulating plate, and make the first kidney-shaped hole correspond to the second circular hole and the second kidney-shaped hole correspond to the third circular hole; Provide a first cylindrical pin and a second cylindrical pin, make the first cylindrical pin pass through the second circular hole, and make the opposite two ends of the first cylindrical pin respectively insert into the first kidney-shaped hole and the fourth circular hole, make the second cylindrical pin pass through the third circular hole, and make the opposite two ends of the second cylindrical pin respectively insert into the first circular hole and the second kidney-shaped hole, so that the connecting plate, the insulating plate and the probe card mounting plate are connected by pin positioning; When the temperature of the probe card mounting platform rises, the probe card mounting plate moves relative to the insulating plate in a first direction, and the connecting plate moves relative to the insulating plate in a second direction, wherein the first direction is opposite to the second direction, so as to reduce the relative movement distance between the connecting plate and the probe card mounting plate.

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